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ORCIDYasuhiro Take
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- affiliation: Keio University, Japan
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2010 – 2019
- 2017
[c18]Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura
:
An image sensor/processor 3D stacked module featuring ThruChip interfaces. ASP-DAC 2017: 7-8- 2016
- [j9]Takahiro Kagami, Hiroki Matsutani, Michihiro Koibuchi, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano:
Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces. IEEE Trans. Very Large Scale Integr. Syst. 24(2): 493-506 (2016) - [c17]Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda:
Analytical thruchip inductive coupling channel design optimization. ASP-DAC 2016: 731-736 - [c16]Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Yasuhiro Take, Masayuki Ikebe, Tadahiro Kuroda, Masato Motomura:
Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces. ESSCIRC 2016: 105-108 - 2015
- [j8]Li-Chung Hsu, Masato Motomura, Yasuhiro Take, Tadahiro Kuroda:
Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration. IEICE Trans. Electron. 98-C(4): 288-297 (2015) - [j7]Yasuhiro Take, Tadahiro Kuroda:
Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network. IEICE Trans. Electron. 98-C(4): 322-332 (2015) - [j6]Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda:
A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 98-A(12): 2584-2591 (2015) - [c15]Akira Okada, Abdul Raziz Junaidi, Yasuhiro Take, Atsutake Kosuge, Tadahiro Kuroda:
Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface. ASP-DAC 2015: 44-45 - [c14]Li-Chung Hsu, Yasuhiro Take, Atsutake Kosuge, So Hasegawa, Junichiro Kadamoto, Tadahiro Kuroda:
Design and analysis for ThruChip design for manufacturing (DFM). ASP-DAC 2015: 46-47 - [c13]Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura:
Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer. VLSIC 2015: 82- - 2014
- [j5]Yasuhiro Take, Hiroki Matsutani, Daisuke Sasaki, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano:
3D NoC with Inductive-Coupling Links for Building-Block SiPs. IEEE Trans. Computers 63(3): 748-763 (2014) - [c12]Hiroki Matsutani, Michihiro Koibuchi, Ikki Fujiwara, Takahiro Kagami, Yasuhiro Take, Tadahiro Kuroda, Paul Bogdan, Radu Marculescu, Hideharu Amano:
Low-latency wireless 3D NoCs via randomized shortcut chips. DATE 2014: 1-6 - [c11]Abdul Raziz Junaidi, Yasuhiro Take, Tadahiro Kuroda:
A 352Gb/s inductive-coupling DRAM/SoC interface using overlapping coils with phase division multiplexing and ultra-thin fan-out wafer level package. VLSIC 2014: 1-2 - 2013
- [j4]Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano:
Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs. IEICE Trans. Inf. Syst. 96-D(12): 2753-2764 (2013) - [j3]Noriyuki Miura, Yusuke Koizumi, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura:
A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface. IEEE Micro 33(6): 6-15 (2013) - [c10]Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano:
A case for wireless 3D NoCs for CMPs. ASP-DAC 2013: 23-28 - [c9]Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura:
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. COOL Chips 2013: 1-3 - [c8]Yusuke Koizumi, Noriyuki Miura, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura:
Demonstration of a heterogeneous multi-core processor with 3-D inductive coupling links. FPL 2013: 1 - [c7]Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura:
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface. Hot Chips Symposium 2013: 1 - [c6]Yasuhiro Take, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda:
3D clock distribution using vertically/horizontally-coupled resonators. ISSCC 2013: 258-259 - 2012
- [j2]Andrzej Radecki, Yuxiang Yuan, Noriyuki Miura, Iori Aikawa, Yasuhiro Take, Hiroki Ishikuro, Tadahiro Kuroda:
Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card. IEEE J. Solid State Circuits 47(10): 2484-2495 (2012) - [c5]Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano:
Vertical Link On/Off Control Methods for Wireless 3-D NoCs. ARCS 2012: 212-224 - [c4]Yasuhiro Take, Hayun Chung, Noriyuki Miura, Tadahiro Kuroda:
Simultaneous data and power transmission using nested clover coils. ASP-DAC 2012: 555-556 - [c3]Yusuke Koizumi, Eiichi Sasaki, Hideharu Amano, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura:
CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect. FPL 2012: 543-546 - 2011
- [j1]Yasuhiro Take, Noriyuki Miura, Tadahiro Kuroda:
A 30 Gb/s/Link 2.2 Tb/s/mm 2 Inductively-Coupled Injection-Locking CDR for High-Speed DRAM Interface. IEEE J. Solid State Circuits 46(11): 2552-2559 (2011) - [c2]Noriyuki Miura, Yasuhiro Take, Mitsuko Saito, Yoichi Yoshida, Tadahiro Kuroda:
A 2.7Gb/s/mm2 0.9pJ/b/chip 1coil/channel ThruChip interface with coupled-resonator-based CDR for NAND Flash memory stacking. ISSCC 2011: 490-492 - [c1]Hiroki Matsutani, Yasuhiro Take, Daisuke Sasaki, Masayuki Kimura, Yuki Ono, Yukinori Nishiyama, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano:
A vertical bubble flow network using inductive-coupling for 3-D CMPs. NOCS 2011: 49-56
Coauthor Index
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