"Optimal die placement for interposer-based 3D ICs."

Sergii Osmolovskyi et al. (2018)

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DOI: 10.1109/ASPDAC.2018.8297375

access: closed

type: Conference or Workshop Paper

metadata version: 2018-04-09

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Sergii Osmolovskyi, Johann Knechtel, Igor L. Markov, Jens Lienig:
Optimal die placement for interposer-based 3D ICs. ASP-DAC 2018: 513-520

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