"Analysis and Test of PCB via Hole Heat Dissipation Performance in Circuit ..."

Min Wang et al. (2021)

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DOI: 10.1145/3456146.3456171

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-22

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Min Wang, Mengrou Feng, Xikun Lu, Ran Wei:
Analysis and Test of PCB via Hole Heat Dissipation Performance in Circuit Practice Course. DSDE 2021: 161-165

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