"Contact and junction engineering in bulk FinFET technology for improved ..."

Milova Paul et al. (2018)

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DOI: 10.1109/IRPS.2018.8353573

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Milova Paul, Boeila Sampath Kumar, Harald Gossner, Mayank Shrivastava:
Contact and junction engineering in bulk FinFET technology for improved ESD/latch-up performance with design trade-offs and its implications on hot carrier reliability. IRPS 2018: 3

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