"8Gb 3D DDR3 DRAM using through-silicon-via technology."

Uksong Kang et al. (2009)

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DOI: 10.1109/ISSCC.2009.4977342

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Uksong Kang, Hoeju Chung, Seongmoo Heo, Soon-Hong Ahn, Hoon Lee, Sooho Cha, Jaesung Ahn, Dukmin Kwon, Jin Ho Kim, Jaewook Lee, Han-Sung Joo, Woo-Seop Kim, Hyun-Kyung Kim, Eun-Mi Lee, So-Ra Kim, Keum-Hee Ma, Dong-Hyun Jang, Nam-Seog Kim, Man-Sik Choi, Sae-Jang Oh, Jung-Bae Lee, Tae-Kyung Jung, Jei-Hwan Yoo, Changhyun Kim:
8Gb 3D DDR3 DRAM using through-silicon-via technology. ISSCC 2009: 130-131

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