"The intelligent design of reflow soldering based on an improved ..."

Fan Ye et al. (2022)

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DOI: 10.1016/J.PROCS.2022.11.178

access: open

type: Conference or Workshop Paper

metadata version: 2023-05-13

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Fan Ye, Dayuan Jin, Yun Wan, Xin Xie:
The intelligent design of reflow soldering based on an improved high-dimensional surrogate assisted optimization method. ITQM 2022: 295-303

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