"Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device ..."

Miled Ben Salah et al. (2013)

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DOI: 10.1109/RWS.2013.6486722

access: closed

type: Conference or Workshop Paper

metadata version: 2018-05-29

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Miled Ben Salah, Daniel Pasquet, Frederic Voiron, Philippe Descamps, Jean Luc Lefebvre, Dominique Lesenechal:
Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings. RWS 2013: 304-306

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