"Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio ..."

Yun Chen et al. (2020)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2020.3037338

access: open

type: Journal Article

metadata version: 2023-09-30

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/ChenDLHCGHW20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/ChenDLHCGHW20
Yun Chen, Shuquan Ding, Junyu Long, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, Ching-Ping Wong:
Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging. IEEE Access 8: 206571-206580 (2020)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.