"Self-Assembly of Chip-Size Components with Cavity Structures: ..."

Takafumi Fukushima et al. (2011)

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DOI: 10.3390/MI2010049

access: open

type: Journal Article

metadata version: 2021-02-16

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  - https://dblp.org/rec/journals/micromachines/FukushimaKIKKMBLTK11
Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi:
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2(1): 49-68 (2011)

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