"Thermal layout optimization for 3D stacked multichip modules."

Yanning Chen et al. (2023)

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DOI: 10.1016/J.MEJO.2023.105882

access: closed

type: Journal Article

metadata version: 2023-09-24

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Yanning Chen, Dongyan Zhao, Fang Liu, Jie Gao, Hui Zhu:
Thermal layout optimization for 3D stacked multichip modules. Microelectron. J. 139: 105882 (2023)

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