"Investigation of the heel crack mechanism in Al connections for power ..."

Y. Celnikier et al. (2011)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2011.01.001

access: closed

type: Journal Article

metadata version: 2024-01-25

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/CelnikierBDC11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/CelnikierBDC11
Y. Celnikier, Lahouari Benabou, Laurent Dupont, Gerard Coquery:
Investigation of the heel crack mechanism in Al connections for power electronics modules. Microelectron. Reliab. 51(5): 965-974 (2011)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.