"Inhomogeneous deformation and microstructure evolution of Sn-Ag-based ..."

Hongtao Chen et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.01.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hongtao Chen, Jing Han, Jue Li, Mingyu Li:
Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing. Microelectron. Reliab. 52(6): 1112-1120 (2012)

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