"True constant temperature MTF test system for the characterization of ..."

Graziella Scandurra et al. (2002)

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DOI: 10.1016/S0026-2714(02)00147-6

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type: Journal Article

metadata version: 2020-09-05

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Graziella Scandurra, Carmine Ciofi, Calogero Pace, F. Speroni, F. Alagi:
True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. Microelectron. Reliab. 42(9-11): 1347-1351 (2002)

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