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2010 – 2019
- 2017
[j3]Thomas Sednaoui, Eric Vezzoli, Brygida Maria Dzidek, Betty Lemaire-Semail
, Cédrick Chappaz, Michael Adams:
Friction Reduction through Ultrasonic Vibration Part 2: Experimental Evaluation of Intermittent Contact and Squeeze Film Levitation. IEEE Trans. Haptics 10(2): 208-216 (2017)- 2016
- [c4]Thomas Sednaoui, Eric Vezzoli, David Gueorguiev, Michel Amberg, Cédrick Chappaz, Betty Lemaire-Semail:
Psychophysical Power Optimization of Friction Modulation for Tactile Interfaces. EuroHaptics (2) 2016: 354-362 - 2015
- [c3]Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas:
Stress management strategy to limit die curvature during silicon interposer integration. 3DIC 2015: TS11.4.1-TS11.4.7 - [c2]Thomas Sednaoui, Eric Vezzoli, Brygida Maria Dzidek, Betty Lemaire-Semail, Cédrick Chappaz, Michael Adams:
Experimental evaluation of friction reduction in ultrasonic devices. World Haptics 2015: 37-42 - 2013
- [j2]Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon:
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53(1): 17-29 (2013) - 2011
- [c1]Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4
2000 – 2009
- 2007
- [j1]Jean-Christophe Giraudin, Franck Badets, Jean-Pierre Blanc, Emmanuel Chataigner, Cédrick Chappaz, Jorge Luis Regolini, Philippe Delpech:
Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization. IEEE J. Solid State Circuits 42(9): 1842-1850 (2007)
Coauthor Index
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