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ORCIDMarc G. D. Geers
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- affiliation: Materials Technology Institute, Eindhoven University of Technology, Eindhoven, The Netherlands
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2020 – today
- 2024
[i4]Fleur Hendriks, Vlado Menkovski, Martin Doskár, Marc G. D. Geers, Ondrej Rokos:
Similarity Equivariant Graph Neural Networks for Homogenization of Metamaterials. CoRR abs/2404.17365 (2024)- [i3]Theron Guo, Varvara G. Kouznetsova, Marc G. D. Geers, Karen Veroy, Ondrej Rokos:
Reduced-order modeling for second-order computational homogenization with applications to geometrically parameterized elastomeric metamaterials. CoRR abs/2405.00437 (2024) - 2022
- [j15]Bram J. A. Dorussen
, Marc G. D. Geers, Joris J. C. Remmers:
A discrete element framework for the numerical analysis of particle bed-based additive manufacturing processes. Eng. Comput. 38(6): 4753-4768 (2022) - [j14]Bram J. A. Dorussen, Marc G. D. Geers, Joris J. C. Remmers:
Correction to: A discrete element framework for the numerical analysis of particle bed-based additive manufacturing processes. Eng. Comput. 38(6): 4769 (2022) - 2020
- [j13]Abdullah Waseem, Thomas Heuzé, Laurent Stainier, Marc G. D. Geers, Varvara G. Kouznetsova:
Enriched continuum for multi-scale transient diffusion coupled to mechanics. Adv. Model. Simul. Eng. Sci. 7(1): 14 (2020) - [i2]P. Samantray, Ron H. J. Peerlings, E. Bosco, Marc G. D. Geers, T. J. Massart, Ondrej Rokos:
Level set based eXtended finite element modelling of the response of fibrous networks under hygroscopic swelling. CoRR abs/2006.14049 (2020) - [i1]S. E. H. M. van Bree, Ondrej Rokos, Ron H. J. Peerlings, Martin Doskár, Marc G. D. Geers:
A Newton Solver for Micromorphic Computational Homogenization Enabling Multiscale Buckling Analysis of Pattern-Transforming Metamaterials. CoRR abs/2008.12850 (2020)
2010 – 2019
- 2019
- [j12]Steyn Westbeek, J. A. W. van Dommelen, Joris Remmers, Marc G. D. Geers:
Influence of particle shape in the additive manufacturing process for ceramics. Comput. Math. Appl. 78(7): 2360-2376 (2019) - 2018
- [j11]Luv Sharma, Ron H. J. Peerlings, Pratheek Shanthraj, Franz Roters, Marc G. D. Geers:
FFT-based interface decohesion modelling by a nonlocal interphase. Adv. Model. Simul. Eng. Sci. 5(1): 7:1-7:17 (2018) - 2017
- [j10]Karel Matous, Marc G. D. Geers, Varvara G. Kouznetsova, Andrew Gillman:
A review of predictive nonlinear theories for multiscale modeling of heterogeneous materials. J. Comput. Phys. 330: 192-220 (2017) - 2016
- [j9]H. R. Javani, Ron H. J. Peerlings, Marc G. D. Geers:
Three-dimensional finite element modeling of ductile crack initiation and propagation. Adv. Model. Simul. Eng. Sci. 3(1): 19:1-19:25 (2016) - 2015
- [j8]Michael M. W. Dogge, Ron H. J. Peerlings, Marc G. D. Geers:
Extended modelling of dislocation transport-formulation and finite element implementation. Adv. Model. Simul. Eng. Sci. 2(1): 29:1-29:18 (2015) - 2011
- [j7]L. I. J. C. Bergers, J. P. M. Hoefnagels, N. K. R. Delhey, Marc G. D. Geers:
Measuring time-dependent deformations in metallic MEMS. Microelectron. Reliab. 51(6): 1054-1059 (2011) - 2010
- [j6]Marc G. D. Geers, Varvara G. Kouznetsova, W. A. M. Brekelmans:
Multi-scale computational homogenization: Trends and challenges. J. Comput. Appl. Math. 234(7): 2175-2182 (2010)
2000 – 2009
- 2008
- [j5]J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, Marc G. D. Geers:
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. Microelectron. Reliab. 48(3): 401-407 (2008) - 2007
- [j4]B. A. E. van Hal, Ron H. J. Peerlings, Marc G. D. Geers, Olaf van der Sluis:
Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectron. Reliab. 47(8): 1251-1261 (2007) - [j3]M. A. Matin, J. G. A. Theeven, W. P. Vellinga, Marc G. D. Geers:
Correlation between localized strain and damage in shear-loaded Pb-free solders. Microelectron. Reliab. 47(8): 1262-1272 (2007) - 2004
- [j2]Müge Erinc, Piet J. G. Schreurs, G. Q. Zhang, Marc G. D. Geers:
Characterization and fatigue damage simulation in SAC solder joints. Microelectron. Reliab. 44(9-11): 1287-1292 (2004) - [j1]Marcel H. H. Meuwissen, Hedzer A. de Boer, Henk L. A. H. Steijvers, Piet J. G. Schreurs, Marc G. D. Geers:
Residual stresses in microelectronics induced by thermoset packaging materials during cure. Microelectron. Reliab. 44(12): 1985-1994 (2004)
Coauthor Index
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