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2020 – today
- 2023
[c29]Haeyeon Kim, Minsu Kim, Federico Berto, Joungho Kim, Jinkyoo Park:
DevFormer: A Symmetric Transformer for Context-Aware Device Placement. ICML 2023: 16541-16566- [c28]Jiwon Yoon, Hyunwoo Kim, Boogyo Sim, Hyunwook Park, Yi-Gyeong Kim, Sujin Park, Youngsu Kwon, Joungho Kim:
Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect. ISOCC 2023: 247-248 - [i4]Federico Berto, Chuanbo Hua
, Junyoung Park, Minsu Kim, Hyeonah Kim, Jiwoo Son, Haeyeon Kim, Joungho Kim, Jinkyoo Park:
RL4CO: an Extensive Reinforcement Learning for Combinatorial Optimization Benchmark. CoRR abs/2306.17100 (2023) - 2022
- [i3]HyunWook Park, Minsu Kim, Seongguk Kim, Keunwoo Kim, Haeyeon Kim, Taein Shin, Keeyoung Son, Boogyo Sim, Subin Kim, Seungtaek Jeong, Chulsoon Hwang, Joungho Kim:
Transformer Network-based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM). CoRR abs/2203.15722 (2022) - [i2]Haeyeon Kim, Minsu Kim, Joungho Kim, Jinkyoo Park:
Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design. CoRR abs/2205.13225 (2022) - 2021
- [c27]Minsu Kim, Jinkyoo Park, Joungho Kim:
Learning Collaborative Policies to Solve NP-hard Routing Problems. NeurIPS 2021: 10418-10430 - [i1]Minsu Kim, Jinkyoo Park, Joungho Kim:
Learning Collaborative Policies to Solve NP-hard Routing Problems. CoRR abs/2110.13987 (2021)
2010 – 2019
- 2019
- [j19]Seungtaek Jeong, Donghyun Kim, Jinwook Song, Hongseok Kim, Seongsoo Lee, Chiuk Song, Jaehak Lee, Junyeop Song, Joungho Kim:
Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material. IEEE Trans. Ind. Electron. 66(5): 4054-4064 (2019) - [j18]Seongsoo Lee, Donghyun Kim, Yeonje Cho, Hongseok Kim, Chiuk Song, Seungtaek Jeong, Jinwook Song, Gyeyoung Park, Seokwoo Hong, Junyong Park, Kyungjun Cho, Hyunsuk Lee, Chulhun Seo, Seungyoung Ahn, Joungho Kim:
Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System. IEEE Trans. Ind. Electron. 66(6): 4356-4367 (2019) - 2018
- [j17]Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala:
Miniaturized and high-performance RF packages with ultra-thin glass substrates. Microelectron. J. 77: 66-72 (2018) - [j16]Yeseul Jeon, Heegon Kim, Joungho Kim, Minkyu Je:
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s. IEEE Trans. Circuits Syst. I Regul. Pap. 65-I(7): 2293-2303 (2018) - [j15]Min-Woo Kim, Ji H. Kim, Yeonje Cho, Minsik Kim, Bo H. Choi, Kwyro Lee, Joungho Kim, Gyu-Hyeong Cho, Chun T. Rim:
High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications. IEEE Trans. Ind. Electron. 65(1): 597-607 (2018) - [j14]Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, Yeonje Cho, Seongsoo Lee, Seungyoung Ahn, Joungho Kim:
EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field. IEEE Trans. Ind. Electron. 65(9): 6839-6849 (2018) - 2017
- [j13]Sung Joo Park, Bumhee Bae, Joungho Kim, Madhavan Swaminathan:
Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems. IEEE Trans. Very Large Scale Integr. Syst. 25(6): 1856-1865 (2017) - 2016
- [j12]Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim:
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33(2): 17-29 (2016) - [c26]Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Joungho Kim:
Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC. 3DIC 2016: 1-5 - 2015
- [j11]Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64(1): 112-125 (2015) - [c25]Joungho Kim:
Active Si interposer for 3D IC integrations. 3DIC 2015: TS11.1.1-TS11.1.3 - [c24]Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim:
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC 2015: TS2.2.1-TS2.2.4 - [c23]Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim:
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC 2015: TS8.25.1-TS8.25.5 - [c22]Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC 2015: TS8.29.1-TS8.29.4 - [c21]Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim:
Noise coupling modeling and analysis of through glass via(TGV). 3DIC 2015: TS8.34.1-TS8.34.5 - [c20]Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim:
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo 2015: 212-215 - [c19]Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim:
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo 2015: 248-251 - 2014
- [j10]Yangbae Chun, Seongwook Park, Jonghoon J. Kim, Jiseong Kim, Hongseok Kim, Joungho Kim, Nam Kim, Seungyoung Ahn:
Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System. IEICE Trans. Commun. 97-B(2): 416-423 (2014) - [c18]Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC 2014: 1-5 - [c17]Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim:
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC 2014: 1-6 - [c16]Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala:
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer. 3DIC 2014: 1-4 - 2013
- [j9]Jiseong Kim, Jonghoon J. Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, Seungyoung Ahn:
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System. Proc. IEEE 101(6): 1332-1342 (2013) - [c15]Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala:
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC 2013: 1-5 - [c14]Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala:
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods. 3DIC 2013: 1-5 - [c13]Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC 2013: 1-4 - [c12]Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC 2013: 1-7 - [c11]Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC 2013: 1-4 - [c10]Joohee Kim, Joungho Kim:
Signal integrity modeling and measurement of TSV in 3D IC. ASP-DAC 2013: 13-16 - [c9]Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo 2013: 5-9 - [c8]Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo 2013: 158-162 - [c7]Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo 2013: 163-166 - [c6]Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim:
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. EMC Compo 2013: 238-242 - [c5]Jonghyun Cho, Joungho Kim:
Signal integrity design of TSV and interposer in 3D-IC. LASCAS 2013: 1-4 - 2012
- [c4]Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC 2012: 188-190 - 2011
- [c3]Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim:
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. DAC 2011: 783-788 - [c2]Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon:
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED 2011: 122-128 - 2010
- [j8]Jiseong Kim, Eakhwan Song, Jeonghyeon Cho, Yujeong Shim, Gawon Kim, Joungho Kim:
Frequency-Dependent Transmission Line Model of a Stranded Coaxial Cable. IEICE Trans. Electron. 93-C(1): 112-119 (2010)
2000 – 2009
- 2008
- [j7]Changwook Yoon, Junwoo Lee, Young-Jin Park, Hyunjeong Park, Jaemin Kim, Junso Pak, Joungho Kim:
Design of a Low-Noise UWB Transceiver SiP. IEEE Des. Test Comput. 25(1): 18-28 (2008) - [j6]Hyunjeong Park, Hyungsoo Kim, Junso Pak, Changwook Yoon, Kyoungchoul Koo, Joungho Kim:
Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network. IEICE Trans. Electron. 91-C(4): 595-606 (2008) - [j5]Chaeho Chung, Soobum Lee, Byung Man Kwak, Gawon Kim, Joungho Kim:
A Delay Line Circuit Design for Crosstalk Minimization Using Genetic Algorithm. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 27(3): 578-583 (2008) - 2006
- [j4]Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee:
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. IEEE Des. Test Comput. 23(3): 212-219 (2006) - [j3]Junso Pak, Masahiro Aoyagi, Katsuya Kikuchi, Joungho Kim:
Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB. IEICE Trans. Electron. 89-C(4): 551-559 (2006) - [j2]Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoi-Jun Yoo, Joungho Kim:
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery. IEEE J. Solid State Circuits 41(1): 274-286 (2006) - 2005
- [j1]Seungyong Baek, Jingook Kim, Joungho Kim:
Modeling and Measurement of Mode-Conversion and Frequency Dependent Loss in High-Speed Differential Interconnections on Multilayer PCB. IEICE Trans. Electron. 88-C(10): 1992-2000 (2005) - [c1]Joungho Kim, Junso Pak, Jongbae Park, Hyungsoo Kim:
Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB. ISCAS (6) 2005: 5766-5769
Coauthor Index
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