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2020 – today
- 2024
[c7]Zefu Zhao, Yu-Rui Chen, Yu-Tsung Liao, Yun-Wen Chen, Wan-Hsuan Hsieh, Jer-Fu Wang, Yu-An Chen, Hao-Yi Lu, Wei-Teng Hsu, Dai-Ying Lee, Ming-Hsiu Lee, C. W. Liu:
Engineering HZO by Flat Amorphous TiN with 0.3nm Roughness Achieving Uniform c-Axis Alignment, Record High Breakdown Field (~10nm HZO), and Record Final 2Pr of 56 μC/cm2 with Endurance > 4E12. VLSI Technology and Circuits 2024: 1-2- 2023
- [c6]Kuo-Yu Hsiang, Jia-Yang Lee, Z.-F. Lou, F.-S. Chang, Z.-X. Li, C. W. Liu, T.-H. Hou, P. Su, Min-Hung Lee
:
Cryogenic Endurance of Anti-ferroelectric and Ferroelectric Hf1-xZrXO2 for Quantum Computing Applications. IRPS 2023: 1-4 - [c5]Jih-Chao Chiu, Eknath Sarkar, Yuan-Ming Liu, Yu-Ciao Chen, Yu-Cheng Fan, C. W. Liu:
First Demonstration of a-IGZO GAA Nanosheet FETs Featuring Achievable SS=61mV/dec, Ioff<10-7 μA/μm, DIBL =44mV/V, Positive VT, and Process Temp. of 300 °C. VLSI Technology and Circuits 2023: 1-2 - [c4]Kuo-Yu Hsiang, J.-Y. Lee, F.-S. Chang, Z.-F. Lou, Z.-X. Li, Z.-H. Li, J.-H. Chen, C. W. Liu, T.-H. Hou, Min-Hung Lee:
FeRAM Recovery up to 200 Periods with Accumulated Endurance 1012 Cycles and an Applicable Array Circuit toward Unlimited eNVM Operations. VLSI Technology and Circuits 2023: 1-2 - [c3]J.-Y. Lee, F.-S. Chang, Kuo-Yu Hsiang, P.-H. Chen, Z.-F. Luo, Z.-X. Li, J.-H. Tsai, C. W. Liu, Min-Hung Lee:
3D Stackable Vertical Ferroelectric Tunneling Junction (V-FTJ) with on/off Ratio 1500x, Applicable Cell Current, Self-Rectifying Ratio 1000x, Robust Endurance of 10⁹ Cycles, Multilevel and Demonstrated Macro Operation Toward High-Density BEOL NVMs. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c2]H.-L. Chiang, J.-F. Wang, K.-H. Lin, C.-H. Nien, J.-J. Wu, Kuo-Yu Hsiang, C.-P. Chuu, Y.-W. Chen, X. W. Zhang, C. W. Liu, Tahui Wang, C. C. Wang, Min-Hung Lee, M.-F. Chang, C.-S. Chang, T. C. Chen:
Interfacial-Layer Design for Hf1-xZrxO2-Based FTJ Devices: From Atom to Array. VLSI Technology and Circuits 2022: 361-362 - 2020
- [c1]Chia-Chun Yen, An-Hung Tai, Yu-Chieh Liu, Chun-Hung Yeh, C. W. Liu:
Mobility Enhancement and Reliability Characterization of Back-Channel-Etch Amorphous InGaZnO TFT with Double Layers. DRC 2020: 1-2
2010 – 2019
- 2014
- [j1]C. W. Liu, X. X. Jin, Liansheng Li:
A web services-based multidisciplinary design optimization framework for complex engineering systems with uncertainties. Comput. Ind. 65(4): 585-597 (2014)
Coauthor Index
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