"Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed ..."

Mariappan Murugesan et al. (2016)

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DOI: 10.1109/3DIC.2016.7970017

access: closed

type: Conference or Workshop Paper

metadata version: 2019-12-27

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Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi:
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. 3DIC 2016: 1-4

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