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Chapter 2 MOS Transistor Theory

2.1 Introduction
Examine the characteristics of MOS transistors to lay the foundation for predicting the performance of the MOS circuits. Circuit symbol for MOS transistors

A MOS transistor is called a majority carrier device, in which the current in a conducting channel (the region immediately under the gate) between the source and the drain is modulated by a voltage applied to the gate.

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The majority carriers of an nMOS transistor: Electrons. The majority carriers of a pMOS transistor: Holes. Symbol Definitions Vt: the threshold voltage of an nMOS or a pMOS transistor. Vtn: the threshold voltage of an nMOS transistor. Vtp: the threshold voltage of a pMOS transistor. Vds: the voltage difference between the drain and the source for an nMOS or a pMOS transistor. Vdsn: the voltage difference between the drain and the source for an nMOS transistor. Vdsp: the voltage difference between the drain and the source for a pMOS transistor. Vgs: the voltage difference between the gate and the source for an nMOS or a pMOS transistor. Vgsn: the voltage difference between the gate and the source for an nMOS transistor. Vgsp: the voltage difference between the gate and the source for a pMOS transistor. Ids: the current between the drain and the source for an nMOS or a pMOS transistor. Idsn: the current between the drain and the source for an nMOS transistor. Idsp: the current between the drain and the source for a pMOS transistor. Vin: the input voltage. Vinp: the input voltage for a pMOS transistor. Vinn: the input voltage for an nMOS transistor. Vout: the output voltage. Vdd: power supply. Vss: ground.

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Four modes of transistors Enhancement mode nMOS transistor: Vtn > 0 If Vgs > Vtn, the transistor starts to conduct. The number of electrons in the channel increases so that Idsn increases accordingly. If Vgs < Vtn, the transistor is cut off and Ids is almost zero.

Depletion mode nMOS transistor: Vtn < 0 (in the textbook it is referred as -Vtn and Vtn > 0) Even if Vgs = 0 > Vtn, the transistor is on. If Vgs < Vtn < 0, the transistor is cut off.

Enhancement mode pMOS transistor: Vtp < 0 (in the textbook it is referred as -Vtp and Vtp > 0) If Vgs < Vtp < 0, the transistor starts to conduct. The number of holes in the channel increases so that Idsp increases accordingly. If Vgs > Vtp, the transistor is cut off.

Depletion mode pMOS transistor: Vtp > 0 Even if Vgs = 0 < Vtp, the transistor is on. If Vgs > Vtp > 0, the transistor is cut off.

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Conduction characteristics of MOS transistors

Note that the minus sign attached to Vtp and Vtn in Figure 2.2 should be deleted. The n-channel transistors and p-channel transistors are the duals of each other; that is , the voltage polarities required for correct operation are the opposite.

Most CMOS integrated circuits at present use enhancement mode transistors.

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2.1.1 nMOS Enhancement Transistor

Structure of an n-channel enhancement-type transistor. (Figure 2.3) Moderately doped p-type silicon substrate. Heavily doped n+ regions (the source and the drain). A channel sandwiched between a thin insulating layer of silicon dioxide (SiO2) and p-substrate. A polysilicon gate over the gate oxide (the SiO2 over the channel). No DC current flows from gate to channel due to insulating of gate oxide.

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Operation of nMOS transistor With zero gate bias, i.e. Vgs = 0, Ids = 0 because the source and the drain are effectively insulated from each other by the two reversed-bias pn junctions (indicated as the diode symbol in Figure 2.3). Accumulation mode: With positive gate bias with respect to the source and substrate (generally denoted by Vgs > 0), an electric field E across the substrate is established such that electrons are attracted to the gate and holes are repelled from the gate.(See Figure 2.4 (a)) Depletion mode: If Vg Vtn, a depletion channel under the gate free of charges is established.(See Figure 2.4 (b)) Inversion mode: If Vgs > Vtn, an inversion channel (region) consisting of electrons is established just under the gate oxide and a depletion channel (region) is also established just under the inversion region.(See Figure 2.4 (c)) Hence the term n-channel is applied to the nMOS structure.

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Electrically, a MOS device acts as a voltage-controlled switch. It conducts initially when Vgs = Vt. Vgs establishes a conducting channel, while Vds is responsible for sweeping the electrons from the source to the drain. Thus, establish a current flow between the drain and the source. The electric field established by Vgs is orthogonal to the electric field established by Vds. When Vgs Vt and Vds = 0, the width of the n-type channel at the source end is equal to that at the drain end. This is due to Vgs = Vgd (See Figure 2.5 (a)). Nonsaturated (resistive or linear) mode: when Vgs - Vt > Vds > 0, the width of the n-type channel at the source end is larger than that at the drain end. This is due to Vgs Vgd > Vt. (See Figure 2.5 (b)) Saturated mode: When Vds > Vgs - Vt > 0, the n-type channel no longer reaches the drain. That is, the channel is pinched off. This is due to Vgs > Vt and Vgd < Vt. (See Figure 2.5 (c)) In non-saturated mode, Ids is a function of gate and drain voltage, while in saturated mode, Ids is a function of gate voltage. In saturated mode, the movement of electrons in the channel is brought about under the influence of positive drain voltage. After the electrons leave the channel and inject into the drain depletion region, they are accelerated toward the drain. Because the voltage across the pinched-off channel tends to remain fixed at Vgs - Vt, the drifting speed of electrons in the channel is controlled by Vgs Vt, but almost independent of Vds. This is what saturation means.

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Normal conduction characteristics of a MOS transistor: Cut-off region: Ids 0 Non-saturated region: The channel is weakly inverted. Ids is dependent on the gate and drain voltage with respect to the substrate. Saturated region: The channel is strongly inverted. Ids is ideally independent of Vds.

For a fixed Vds and Vgs, the factors that influence Ids: The distance between source and drain. The channel width Vt The thickness of gate oxide. The dielectric constant of the gate oxide. The carrier mobility g .

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2.1.2 pMOS Enhancement Transistor

A reversal of n-type and p-type regions yields a p-channel channel transistor. (See Figure 2.6)

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2.1.3 Threshold Voltage

Vt: the threshold voltage for a MOS transistor can be defined as the voltage applied between the gate and the source of a MOS device below which the drain-to-source current Ids effectively drops to zero. In general, Vt is a function of the following parameters. Gate conduction material Gate insulation material Gate insulator thickness Channel doping Impurities at the silicon-insulator interface Voltage between the source and the substrate, Vsb.

Threshold voltage equations

E Vt = Vt - mos + Vfb E Vt -mos = 2 b + E b = Qb C ox (2.1) (2.2)

kT N A ln( ) q Ni Q fc C ox

E Q b = 2 Si qN A 2b Vfb = ms (2.3)

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Vt-mos is the ideal threshold voltage for an ideal MOS capacitor Vfb is the flat-band voltage k: Boltzmanns constant = 1.38 * 10-23 J/oK. q: electronic charge = 1.602 * 10-19 Coulomb. T: Temperature (oK). NA: the density of carriers in the doped substrate. Ni: the density of carriers in the undoped substrate. -12 (F/cm) ` si: the permittivity of silicon = 1.06 * 10 Cox: the gate-oxide capacitance, which is inversely proportional to the gate oxide thickness (tox). Qfc: the fixed charge due to surface states that arise due to imperfections in the silicon-oxide interface and doping. ms: the work function difference between the gate material and the silicon substrate.

More details can be found in the text book by Weste. Two common techniques for the adjustment of Vt. Affecting Qfc by varying the doping concentration at the silicon-insulator interface through ion implantation. Affecting Cox by using different insulating material for the gate. A layer of silicon nitride (Si3N4) combined with a layer of silicon oxide can effectively increase the relative permittivity of gate insulator from 3.9 to 6.

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2.1.4 Body Effect

When connecting several devices in series as shown in Figure 2.7, the source-to-substrate of each individual devices may be different. For example, Vsb2 > Vsb1 = 0. As Vsb (Vsource - Vsubstrate) is increased, the density of the trapped carriers in the depletion layer also increases. The overall effect is an increase in the threshold voltage, Vt (Vt2 > Vt1).

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2.2 MOS Device Design Equations 2.2.1 Basic DC Equations

Cutoff region: Ids = 0, Vgs Vt (2.5a)

Nonsaturation, linear or resistive region:

2 Vds I ds = (Vgs - Vt )Vds 2

0 < Vds < Vgs - Vt (2.5b)

Saturation region:
I ds = (Vgs - Vt ) 2 , 0 < Vgs - Vt < Vds (2.5c)

W ( ) is the MOS transistor gain factor, where t ox L

g : the effective surface mobility of the carriers in the channel. : the permittivity of the gate insulator. tox: the thickness of the gate insulator. L: the length of the channel W: the width of the channel
= Cox is a process dependent term. t ox

W/L is a geometry dependent term. (See Figure 2.8)

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Figure 2.9 shows the voltage-current characteristics of pMOS and nMOS transistor. The boundary between the linear and saturation regions is defined by the condition |Vds| = |Vgs - Vt|.

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2.2.2 Second Order Effects

The circuit simulation program such as SPICE generally use a parameter called LEVEL to specify which model equations are used for circuit simulation. LEVEL 1: Use the EQ. (2.5) and include some important second order effects. LEVEL 2: Calculate the currents based on device physics. LEVEL 3: Is a semiempirical approach that relies on parameters selected on the basis of matching the equations to real circuits. Process gain factor:
KP = = Cox : the process gain factor may vary from 10 ~ 100 g A/V2, depending on the t ox

characteristics of a process and the type of transistor. Threshold voltage change due to body effect: the increase in threshold voltage leads to lower device currents, which in turn leads to slower circuits. Vt = Vt0 + [ (2 b + | Vsb | 2 b ]. Vt0: the threshold voltage for Vsb = 0 (SMP VTO) SMP: SPICE Model Parameter. Vsb: the substrate bias, i.e., the voltage difference between source and substrate. b : defined in Eq. 2.2. (s=2b, SMP of s is PHI ) ^ : the constant describing the substrate bias effect: (SMP GAMMA) t 1 . = ox 2q N = 2q N

si A ox

C ox

si

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` ox: the dielectric constant of SiO2. ` si: the dielectric constant of the silicon substrate. NA: doping density of the substrate. (SMP NSUB) Example

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Subthreshold Region (Cutoff region): Although Ids is very small (Ids 0) in this region, it increase exponentially with Vds and Vgs. The finite value of Ids may be used to construct very low power circuits. LEVEL 1 SPICE models set the subthreshold current to 0. Channel-length Modulation: The variation of channel length is due to the changes in drain-to-source voltage, Vds. When an MOS device is in saturation, the effective channel length (channel pinched-off) is actually decreased such that Leff = L - Lshort, where Lshort = increases. Take this behavior into account, I ds =
2 si (Vds (Vgs Vt )) qN A

Reduction in channel length increases the (W/L) ratio, there by increasing ]as the drain voltage kW (Vgs Vt ) 2 (1 + Vds ) 2 L (2,10)

k = t : process gain factor. ox : empirical channel-modulation factor. (SMP LAMBDA) Mobility variation: Mobility decreases with increasing doping-concentration and increasing temperature. Mobility (SMPg )=
average carrier drift velocity (V) Electric Field (E)

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Fower-Nordheim Tunneling: When the gate oxide is very thin, a current can flow from gate to source or drain by electron tunneling through gate oxide. IFN = C1WLE ox 2 e E
Eox Vgs tox
E0
ox

is the electric field across the gate oxide.

E0 and C1 are constants This effect limits the gate oxide thickness. However, it is of great use in electrically alterable programmable logic devices. Drain Punchthrough: When the drain is at a high enough voltage with respect to the source, the depletion region around the drain may extend to the source, thus causing current to flow irrespective of the gate voltage. Can be used for I/O protection Limit the power supply voltage when process is scaling. Impact Ionization - Hot Electrons: As the gate length of an MOS transistor is reduced, the electric field at the drain of a transistor in saturation increases. The field can become so high that electrons have enough energy to become what is termed hot. These hot electrons impact the drain, dislodging holes that are then swept toward the negatively charged substrate and appear as a substrate current. Moreover the elections can penetrate the gate oxide, causing a gate current. This cause reliability problem.

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2.2.3 MOS Models

Most CMOS digital foundry operations have been standardized on the LEVEL 3 models in SPICE as the level of circuit modeling that is required for CMOS digital system design. Table 2.1 is a summary of the main SPICE DC parameters that are used in LEVELS 1, 2, and 3 with representative values for a 1 n-well CMOS process.

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2.3 The Complementary CMOS Inverter-DC Characteristics

A CMOS inverter is realized by the series connection of a p-device and an n-device as show in Figure 2.11. DC-transfer characteristics: the output voltage Vout is drawn as a function of the input voltage Vin.

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Table 2.2 outlines the various regions of operation for the n- and p-transistors of an inverter.

Find the DC-transfer characteristics of an inverter. Step1: obtain VI characteristics for p- and n-transistor respectively based on the equation (2.5). (see Figure 2.12(a)) Step2: reflect the VI characteristics for p-transistor about the x-axis (see Figure 2.12(b)) Step3: the input/output transfer curve may now be determined by the points of common Vgs intersection in Figure 2.12(c).

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Solving for Vinn=Vinp and Idsn=Idsp gives the desired transfer characteristics of the inverter. (see figure 2.13)

The switching point is typically designed to be at VDD/2. Operation regions of an inverter (see Figure 2.13 and Table 2.3)

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Region A: defined by 0 Vin Vtn , where the n-device is cutoff and the p-device is in the linear region. Vout=VDD because Idsn=-Idsp= 0 Region B: defined by V < V < VDD tn in 2 device is in saturation. Vdsp=Vout-VDD= 0 Vout=VDD , where the p-device is in the nonsaturated region while the n-

The equivalent circuit in this region can be represented by a resistor for the p-transistor and a current source for the n-transistor as shown in Figure 2.14(a). W 2 I = (Vin Vtn ) By setting Vgs = Vin , where n = n ( n ) dsn n tox Ln 2 (Vout VDD ) 2 I dsp = p [(Vin VDD Vtp )(Vout VDD ) ( )] by setting that Vgs=Vin-VDD and Vds=Vout-VDD, 2 p W p ( ) where p = tox L p

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Let Idsp=-Idsn, the output voltage Vout can be expressed as Vout = (Vin Vtp ) + (Vin Vtp ) 2 2(Vin Region C: defined by Vin VDD Vtp )VDD n (Vin Vtn ) 2 2 p

VDD , where the p- and n-devices are in saturation. 2 Its equivalent circuit is shown in Figure 2.14(b). I dsp = I dsn = p 2 (Vin VDD Vtp ) 2

n (Vin Vtn ) 2 2
VDD + Vtp + Vtn n p

Vin = 1+

n p

with Idsp=-Idsn . (2.24)

VDD by setting n = p and Vtn=-Vtp . 2 For n-transistor: Vin = Vout=Vdsn>Vin-Vtn Vin-Vout<Vtn Vout>Vin-Vtn For p-transistor: Vdsp<Vgs-Vtp Vout-VDD<Vin-VDD-Vtp Vout<Vin-Vtp Combining the two inequalities results in Vin-Vtn<Vout<Vin-Vtp

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In this region, we have two current sources in series, which is an unstable condition. Thus a small input voltage has a large effect at the output. The input equation shown in EQ. (2.24) can be used for defining the gate threshold Vinv , which corresponds to the state where Vout=Vin . Region D: defined by VDD < V < V + V , where the p-device is in saturation while the n-device is in in DD tp the nonstaturated region. 2 (see Figure 2.14(c) for its equivalent circuit) I dsp = I dsn p 2 (Vin VDD Vtp ) 2
2

V = n [(Vin Vtn )Vout out ] 2

V = (V V ) (V V ) 2 p (V V V ) 2 with Idsp=-Idsn . out in tn in tn in DD tp n Region E: defined by Vin>VDD+Vtp where the p-device is cutoff (Idsp=0) and the n-device is in the linear region. Because Vgsp = Vin VDD and Vin VDD + Vtp Vgsp + VDD VDD + Vtp Vgsp Vtp . the p-device is in cutoff region Vout=0

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2.3.1 n/p Ratio

=

The transfer curves of an inverter plotted as a function of n/p are shown in Figure 2.15(a). Vinv(gate threshold voltage) where Vin = Vout is dependent on n/p. As the ration n/p is decreased, as shown in Figure 2.15(a) the transition region shifts from left to right. For the CMOS invert a ratio of n/p = 1 may be desirable since it provides equal current-source and -sink capability. Change channel dimension W and L of the p and n devices would change the value and thus would change the ratio n/p for a given process.

W ( ) t ox L

The inverter transfer curve is also plotted for Wn/ Wp as shown in Figure 2.15(b). n T-1.5 => Ids T-1.5. The effective carrier mobility decreases when temperature increases, but n/p ratio is relatively independent of temperature to a good approximation.

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2.3.2 Noise Margin

Noise margin allows us to determine the allowable noise voltage on the input of a gate so that the output will not be affected. It is closely related to the input-output voltage characteristics. The LOW noise margin NML = VIL max VOL max :defined as the difference in magnitude between the maximum LOW output voltage(VOLmax) of the driving gate and the maximum input LOW voltage(VILmax) recogniaed by the driven gate (Figure 2.16). The HIGH noise margin NM H = VOH min VIH min : defined as the difference in magnitude between the minimum HIGH output voltage (VOHmin) of the driving gate and minimum HIGH voltage (VHmin) recognized by the driven gate.(see Figure 2.16)

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VIH = VIL is desirable. This implies the transfer characteristic should switch abruptly. That is, there should be a high gain in the transition region.

For the purpose of calculating noise margins, the transfer characteristics of a typical inverter and the definition of voltage levels VIL, VOL, VIN, VOH are sown in Figure 2.17.

The noise margin defined for the inverter shown in Figure 2.17 is NML = 2.3V and NMH = 1.7V . Note that
VIH min = 3.3V, VOH min = 3.3V , VL max = 0 , and VIL max = 2.3V .

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2.4 Static Load MOS Inverters

A generic nMOS inverter that uses either a resistive load or a constant current source is shown in Figure 2.19(a). For the resistor case, VI characteristics of n-device and the resistor is shown in 2.19(b). The DC transfer characteristics is shown in 2.19(c) .

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If Rload increases, the VOL decreases (NML increases) and the ON current decreases; if Rload decreases, the VOL rises (NML decreases) and the ON current rises.

Selection of the resistor value would consider a compromise between VOL, the current drawn and the pullup speed.

Resistors can be implemented using highly resitive undoped polysilicon. When transistors are used as a current-source load, the inverter is called a saturated load inverter if the load transistor is operated in saturation; if the load transistor is biased for use as a resistor, it is called an unsaturated inverter.

The reason to use static load inverter is to reduce the number of transistors used for a gate to improve density and/or to lower dynamic power consumption

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2.4.1 The Pseudo-nMOS Inverter

An inverter that uses a p-device pull-up or load that has its gate permanently grounded is shown in Figure 2.20 (a). An n-device pull-down or driver is driven with the input signal. This circuit is called pseudonMOS inverter. Figure 2.20 (b) and (c) shows transfer characteristics in terms of n/ p . While Figure 2.20(d) shows the Ids in terms of Vin (note that there is a DC current flow when the output is in LOW state). Although pseudo-nMOS gates are not used for low power applications, they do find wide application in high-speed circuits and circuits that require large fan-in NOR gates.

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For the circuit shown in Figure 2.20 with Vin increasing from VSS to VDD, For the saturated n-device: Idsn =
n (Vin Vtn ) 2 for (Vout = Vdsn > Vin - Vtn) 2 (Vout VDD ) 2 For the non-saturated p-device (Vdsp = -VDD) : Idsp = p (VDD Vtp)(Vout VDD ) 2 2 Let Idsp = -Idsn, we obtain Vout = Vtp + (VDD + Vtp ) C

where C =

2 n + Vtp )2 (Vin Vtn )2 and n = (VDD + Vtp ) (Vout p p (Vin Vtn) 2

The noise margin of this kind of inverters is dependent on the ratio n/ p and generally is poor than that of the CMOS inverters.

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Figure 2.21(a) shows an example of noise margin and 2.21(b) shows the transfer curves in terms of n/ p .

The inverter shown in Figure 2.21(a) is typically used in static ROMs and PLAs. Figure 2.22(a) shows an inverter with a p-transistor biased to be a constant current source.

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2.4.3 More Saturated Load Inverters

Figure 2.24(a) shows another pseudo-nMOS inverter that has a p-device load with its gate connected to the output.

While Vout > Vin - Vtn, the driver transistor is in saturation,

I dsdriver =

I dsload transistor is permanently in the cutoff (Ids = 0) or saturated,

-Idsload , we obtain Vout = VDD + Vtp k (Vin Vtn ) , where k = driver load that is the maximum output is reached when Vin = Vtn.

driver (Vin Vtn )2 , and the load 2 load = (Vout VDD Vtp ) 2 . Let Idsdriver = 2

. If Vin = Vtn , Vout = VDD + Vtp < VDD;

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Figure 2.25 shows an nMOS depletion load inverter. The output of this inverter can rise to a full VDD level, because the depletion mode transistor is always ON.

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2.6 The Transmission gate

Transmission gates find used as a multiplexing element, a logic structure, a latch element and an analog switch. The transistor schematic of a transmission gate is reviewed in Figure 2.32. The operation of the transmission gate can be best explained by considering the n-device and p-device as pass transistors individually.

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nMos pass transistor Figure 2.33(a) shows an nMOS pass transistor. Initially, the load capacitor C load is discharged. Thus, V out = V ss With S = 0 Vgs = 0 Ids = 0 Vout = Vss = 0 independent of Vin. When S = 1 and Vin = 1, the pass transistor starts to conduct. When Vout = VDD - Vtn(Vdd), (ie., Vgs < Vtn(Vdd)) the n-device begins to turn off where Vtn(Vdd) is the body effected threshold with the source at VDD - Vtn(Vdd). (i.e., the n-device passes a poor 1). With Vin = 0, S = 1 and Vout = VDD - Vtn(Vdd), the n-device begins to discharge the Cload. Finally Vout = Vin = 0. (i.e., n-device passes a good 0)

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pMOS transistor Figure 2.33(b) shows a pMOS transistor. Initially Cload is discharged and Vout = Vss. With S = 0 (-S = 1), Vin = VDD, and Vout = Vss, Cload remains uncharged. With S = 1 (-S = 0), the p-device starts to charge the Cload toward VDD.(i.e., p-device passes a good 1 ) When Vin = Vss, Vout = VDD, and S = 1 (-S = 0), the Cload discharges until Vout = |Vtp(Vss)| (i.e., pdevice passes a poor 0). The resultant behavior of the n-device and p-device are shown in Table 2.4

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The overall behavior a transmission gate can be expressed as:

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Figure 2.34 (a) a typical circuit configuration for a transmission gate. Two cases of the operation have to be considered : The transmission gate acts as a resistor : when the control input changes rapidly, the inverter input has been low (Vss), the inverter output has been high (VDD), and the capacitor on the transmission gate output is initially discharged (Vss). Three regions of operation : Region A : n saturated , p saturated ( Vout < | Vtp| ) Region B : n saturated, p nonsaturated ( | Vtp| < Vout < VDD - Vtn ) Region C : n off, p nonsaturated ( VDD - Vtn < Vout) The currents of the n- device , p-device , and the n- and p-device are respectively shown in Figure 2.34 (c), where it can be see that the combined current is linear with respect to the Vout.
(R = VDD Vout ) I

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Another operation mode that the transmission gate encounters in lightly loaded circuits is where the output closely follows the input, such as shown in Figure 2.35 (c). That is the control input remains at the logice value that makes p- and n-devices ON and the input changes from 0 to 1 or 1 to 0. Three regions of operation: Region A : n nonsaturated, p off ( Vin < |Vtp| ) Region B : n nonsaturated, p nonsaturated ( |Vtp| < Vin < VDD- Vin ) Region C : n off, p nonsaturated ( Vin > VDD- Vtn) Figure 2.35 ( a ) shows the n- and p- pass transistor currents for Vout - Vin = -0.1V Figure 2.36 shows a plot of the effective ON resistance of the transimission gate for the test circuit shown in Figure 2.35 (c).

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2.7 The Tristate Inverter

A tristate inverter can be formed by cascading a transmission gate with an inverter as shown in Figure 2.37(a). When C = 0 and -C = 1, the output Z is in high impedance. When C =1 and -C = 0, the output Z is equal to the complement of the input A. The connection between the n- and p- driver transistor may be omitted as shown in Figure 2.37 (b) and the logic operation remains the same.

2.9 Summary
Examine the DC and AC characteristics of MOS transistors and COMS inverters. Study the operation of the CMOS transmission gate.