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EEE 498/598 Overview of Electrical Engineering

This document provides an overview of the EEE 498/598 course. The objective of Lecture 0 is to familiarize students with how the class will be conducted. The course is part of a microelectronics packaging program and aims to provide a rapid coverage of broad electrical engineering knowledge to students with other engineering backgrounds. It was developed in collaboration between Arizona State University and Intel Corporation to educate engineers on packaging principles and analysis tools based on current industry challenges. Students will complete weekly homework assignments and exams throughout the semester and will learn to use software like MATLAB, Simulink, Agilent ADS, and Ansoft HFSS.

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Tanuj Anand
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68 views6 pages

EEE 498/598 Overview of Electrical Engineering

This document provides an overview of the EEE 498/598 course. The objective of Lecture 0 is to familiarize students with how the class will be conducted. The course is part of a microelectronics packaging program and aims to provide a rapid coverage of broad electrical engineering knowledge to students with other engineering backgrounds. It was developed in collaboration between Arizona State University and Intel Corporation to educate engineers on packaging principles and analysis tools based on current industry challenges. Students will complete weekly homework assignments and exams throughout the semester and will learn to use software like MATLAB, Simulink, Agilent ADS, and Ansoft HFSS.

Uploaded by

Tanuj Anand
Copyright
© Attribution Non-Commercial (BY-NC)
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
Download as ppt, pdf, or txt
Download as ppt, pdf, or txt
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EEE 498/598

Overview of Electrical
Engineering
Lecture 0:
Course Overview

1
Lecture 0 Objective
 To familiarize students with the purpose
of the class, and how the class will be
run.

Lecture 0
2
Leveling Class
 Part of microelectronics packaging
program.
 Many students have degrees in
engineering disciplines other than EE.
 Rapid coverage of broad knowledge base
in EE.
 Preparation for taking advanced class in
EE.
Lecture 0
3
Microelectronics Collaboration between ASU and Intel

 “Microelectronic package design and assembly are critical components of high-quality


computing, communication, and consumer electronic products.  Packaging engineers today must
solve complex, coupled problems that require fundamental understanding of electrical, thermal,
mechanical, material science, and manufacturing principles.  To address these challenges, the
Arizona State University (ASU) Fulton School of Engineering has worked with Intel Corporation
to develop fundamental and advanced courses to educate both novice and experienced engineers
on these topics.  Students will learn packaging principles and analysis tools based upon the latest
technology and challenges from the perspective of industry experts.  The Microelectronics
Programs at ASU provide a wide range of options from the single-class introductory certificate up
to an online Masters of Engineering degree.  Programs are offered conveniently over the Internet. 
I welcome the ASU initiative and strongly believe this program will help engineers to become
more aware of--and capable of solving--multi-disciplinary problems."

Dr. Nasser Grayeli, Intel Corporation


Director, Assembly Technology Development (ATD)
Vice President, Technology & Manufacturing Group (TMG)

Lecture 0
4
Highlights from Syllabus
 No official textbook.
 Weekly homework assignments of
varying difficulty (reflected in the
grading thereof).
 Two midterm exams and final.

Lecture 0
5
Software
 MATLAB – general purpose technical
computing and visualization.
 Simulink – block diagram environment
for model-based simulation and design.
 Agilent ADS – circuit analysis (lumped
and distributed); 2.5D full-wave solver;
data flow analysis; PCB layout; etc.
 Ansoft HFSS – 3D full-wave solver.

Lecture 0
6

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