Taos TCS3472 Datasheet
Taos TCS3472 Datasheet
Taos TCS3472 Datasheet
6 SDA 5 INT 4 NC
D D
Applications D RGB LED Backlight Control D Light Color Temperature Measurement D Ambient Light Sensing for Display D D
Backlight Control Fluid and Gas Analysis Product Color Verification and Sorting
D D
End Products and Market Segments D TVs, Mobile Handsets, Tablets, Computers, D D D D
and Monitors Consumer and Commercial Printing Medical and Health Fitness Solid State Lighting (SSL) and Digital Signage Industrial Automation
Description
The TCS3472 device provides a digital return of red, green, blue (RGB), and clear light sensing values. An IR blocking filter, integrated on-chip and localized to the color sensing photodiodes, minimizes the IR spectral component of the incoming light and allows color measurements to be made accurately. The high sensitivity, wide dynamic range, and IR blocking filter make the TCS3472 an ideal color sensor solution for use under varying lighting conditions and through attenuating materials. The TCS3472 color sensor has a wide range of applications including RGB LED backlight control, solid-state lighting, health/fitness products, industrial process controls and medical diagnostic equipment. In addition, the IR blocking filter enables the TCS3472 to perform ambient light sensing (ALS). Ambient light sensing is widely used in display-based products such as cell phones, notebooks, and TVs to sense the lighting environment and enable automatic display brightness for optimal viewing and power savings. The TCS3472, itself, can enter a lower-power wait state between light sensing measurements to further reduce the average power consumption.
INT
RGBC Control Clear Red Green GND Blue Clear ADC Red ADC Green ADC Blue ADC Clear Data Red Data Green Data Blue Data
SCL
Lower Limit
SDA
Detailed Description
The TCS3472 light-to-digital converter contains a 3 4 photodiode array, four analog-to-digital converters (ADC) that integrate the photodiode current, data registers, a state machine, and an I2C interface. The 3 4 photodiode array is composed of red-filtered, green-filtered, blue-filtered, and clear (unfiltered) photodiodes. In addition, the photodiodes are coated with an IR-blocking filter. The four integrating ADCs simultaneously convert the amplified photodiode currents to a 16-bit digital value. Upon completion of a conversion cycle, the results are transferred to the data registers, which are double-buffered to ensure the integrity of the data. All of the internal timing, as well as the low-power wait state, is controlled by the state machine. Communication of the TCS3472 data is accomplished over a fast, up to 400 kHz, two-wire I2C serial bus. The industry standard I2C bus facilitates easy, direct connection to microcontrollers and embedded processors. In addition to the I2C bus, the TCS3472 provides a separate interrupt signal output. When interrupts are enabled, and user-defined thresholds are exceeded, the active-low interrupt is asserted and remains asserted until it is cleared by the controller. This interrupt feature simplifies and improves the efficiency of the system software by eliminating the need to poll the TCS3472. The user can define the upper and lower interrupt thresholds and apply an interrupt persistence filter. The interrupt persistence filter allows the user to define the number of consecutive out-of-threshold events necessary before generating an interrupt. The interrupt output is open-drain, so it can be wire-ORed with other devices.
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Terminal Functions
TERMINAL NAME GND INT NC SCL SDA VDD NO. 3 5 4 2 6 1 O O I I/O TYPE DESCRIPTION Power supply ground. All voltages are referenced to GND. Interrupt open drain (active low). No connect do not connect. I2C serial clock input terminal clock signal for I2C serial data. I2C serial data I/O terminal serial data I/O for I2C . Supply voltage.
Available Options
DEVICE TCS34721 TCS34723 TCS34725 TCS34727
INTERFACE DESCRIPTION I2C Vbus = VDD Interface I2C Vbus = 1.8 V Interface I2C Vbus = VDD Interface I2C Vbus = 1.8 V Interface
Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VDD (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V Input terminal voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 3.8 V Output terminal voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 3.8 V Output terminal current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA to 20 mA Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40C to 85C ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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Optical Characteristics, VDD = 3 V, TA = 255C, AGAIN = 16y, ATIME = 0xF6 (unless otherwise noted) (Note 1)
PARAMETER TEST CONDITIONS D = 465 nm Note 2 Re Irradiance responsivity D = 525 nm Note 3 D = 615 nm Note 4 Red Channel MIN 0% 4% 80% TYP MAX 15% 25% 110% Green Channel MIN 10% 60% 0% TYP MAX 42% 85% 14% Blue Channel MIN 65% 10% 5% TYP MAX 88% 45% 24% Clear Channel MIN 11.0 13.2 15.6 TYP 13.8 16.6 19.5 MAX 16.6 20.0 23.4 counts/ W/ cm2 UNIT
NOTES: 1. The percentage shown represents the ratio of the respective red, green, or blue channel value to the clear channel value. 2. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength D = 465 nm, spectral halfwidth = 22 nm. 3. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength D = 525 nm, spectral halfwidth = 35 nm. 4. The 615 nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics: dominant wavelength D = 615 nm, spectral halfwidth = 15 nm.
RGBC Characteristics, VDD = 3 V, TA = 255C, AGAIN = 16y, AEN = 1 (unless otherwise noted)
PARAMETER Dark ADC count value ADC integration time step size ADC number of integration steps (Note 5) ADC counts per step (Note 5) ADC count value (Note 5) G i scaling, Gain li relative l ti to t 1 gain i setting ATIME = 0xC0 (153.6 ms) 4 16 60 ATIME = 0xFF TEST CONDITIONS Ee = 0, AGAIN = 60, ATIME = 0xD6 (100 ms) MIN 0 2.27 1 0 0 3.8 15 58 4 16 60 TYP 1 2.4 MAX 5 2.56 256 1024 65535 4.2 16.8 16 8 63 UNIT counts ms steps counts counts
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TEST CONDITIONS
TYP
MAX 400
UNIT kHz s s s s s ns s s
Clock frequency
(I2C
only)
Bus free time between start and stop condition Hold time after (repeated) start condition. After this period, the first clock is generated. Repeated start condition setup time Stop condition setup time Data hold time Data setup time SCL clock low period SCL clock high period Clock/data fall time Clock/data rise time Input pin capacitance
300 300 10
ns ns pF
SCL
VIH VIL t(HDSTA) t(BUF) t(HDDAT) VIH VIL t(HIGH) t(SUSTA) t(SUDAT) t(SUSTO)
SDA
P
Stop Condition
S
Start Condition
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TYPICAL CHARACTERISTICS
NORMALIZED RESPONSIVITY vs. ANGULAR DISPLACEMENT
1.0 Normalized to Clear @ 755 nm 0.8 Normalized Responsivity TA = 25C
Red
0.9 0.8 Relative Responsivity 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300
Blue Green
0.6
0.4
0.2
500
1100
0 90
-Q
Optical Axis
+Q 90
60 30 0 30 60 Q Angular Displacement
Figure 2
Figure 3
110% 108% IDD Normalized @ 3 V, 255C 106% 104% 102% 100% 98% 96% 94% 92% 2.7
1000
2.8
2.9
3 VDD V
3.1
100 400
500
600
700
800
900
1000
Wavelength nm
Figure 4
Figure 5
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Wait
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RGBC Operation
The RGBC engine contains RGBC gain control (AGAIN) and four integrating analog-to-digital converters (ADC) for the RGBC photodiodes. The RGBC integration time (ATIME) impacts both the resolution and the sensitivity of the RGBC reading. Integration of all four channels occurs simultaneously and upon completion of the conversion cycle, the results are transferred to the color data registers. This data is also referred to as channel count. The transfers are double-buffered to ensure that invalid data is not read during the transfer. After the transfer, the device automatically moves to the next state in accordance with the configured state machine.
ATIME(r0x0 1) 2.4 ms to 614 ms AGAIN(r 0x0F, b1:0) 1y, 4y, 16y, 60y Gain
RGBC Control Clear Red Green Blue Clear ADC Red ADC Green ADC Blue ADC Clear Data Red Data Green Data Blue Data CDATAH(r 0x15), CDATA(r 0x14) RDATAH(r 0x17), RDATA(r 0x16) GDATAH(r 0x19), GDATA(r 0x18) BDATAH(r 0x1B), BDATA(r 0x1A)
Figure 7. RGBC Operation NOTE: In this document, the nomenclature uses the bit field name in italics followed by the register address and bit number to allow the user to easily identify the register and bit that controls the function. For example, the power on (PON) is in register 0x00, bit 0. This is represented as PON (r0x00:b0). The registers for programming the integration and wait times are a 2s compliment values. The actual time can be calculated as follows: ATIME = 256 Integration Time / 2.4 ms Inversely, the time can be calculated from the register value as follows: Integration Time = 2.4 ms (256 ATIME) For example, if a 100-ms integration time is needed, the device needs to be programmed to: 256 (100 / 2.4) = 256 42 = 214 = 0xD6 Conversely, the programmed value of 0xC0 would correspond to: (256 0xC0) 2.4 = 64 2.4 = 154 ms.
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Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for light intensity values outside of a user-defined range. While the interrupt function is always enabled and its status is available in the status register (0x13), the output of the interrupt state can be enabled using the RGBC interrupt enable (AIEN) field in the enable register (0x00). Two 16-bit interrupt threshold registers allow the user to set limits below and above a desired light level. An interrupt can be generated when the Clear data (CDATA) is less than the Clear interrupt low threshold (AILTx) or is greater than the Clear interrupt high threshold (AIHTx). It is important to note that the thresholds are evaluated in sequence, first the low threshold, then the high threshold. As a result, if the low threshold is set above the high threshold, the high threshold is ignored and only the low threshold is evaluated. To further control when an interrupt occurs, the device provides a persistence filter. The persistence filter allows the user to specify the number of consecutive out-of-range Clear occurrences before an interrupt is generated. The persistence filter register (0x0C) allows the user to set the Clear persistence filter (APERS) value. See the persistence filter register for details on the persistence filter value. Once the persistence filter generates an interrupt, it will continue until a special function interrupt clear command is received (see command register).
AIHTH(r0x 07), AIHTL(r0x 06) APERS(r 0x0C, b3:0)
Upper Limit Clear ADC Clear Data Lower Limit Clear AILTH(r 0x05), AILTL(r0x 04)
Clear Persistence
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System Timing
The system state machine shown in Figure 5 provides an overview of the states and state transitions that provide system control of the device. This section highlights the programmable features, which affect the state machine cycle time, and provides details to determine system level timing. When the power management feature is enabled (WEN), the state machine will transition to the Wait state. The wait time is determined by WLONG, which extends normal operation by 12 when asserted, and WTIME. The formula to determine the wait time is given in the box associated with the Wait state in Figure 9. When the RGBC feature is enabled (AEN), the state machine will transition through the RGBC Init and RGBC ADC states. The RGBC Init state takes 2.4 ms, while the RGBC ADC time is dependent on the integration time (ATIME). The formula to determine RGBC ADC time is given in the associated box in Figure 9. If an interrupt is generated as a result of the RGBC cycle, it will be asserted at the end of the RGBC ADC.
Sleep
Idle
RGBC
RGBC ADC
ATIME: 1 ~ 256 steps Time: 2.4 ms/step Range: 2.4 ms ~ 614 ms
Wait
RGBC Init
Time: 2.4 ms
Time: Range:
WTIME: 1 ~ 256 steps WLONG = 0 WLONG = 1 2.4 ms/step 28.8 ms/step 2.4 ms ~ 614 ms 28.8 ms ~ 7.37s
Notes: 1. There is a 2.4 ms warm-up delay if PON is enabled. If PON is not enabled, the device will return to the Sleep state as shown. 2. PON, WEN, and AEN are fields in the Enable register (0x00).
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Power Management
Power consumption can be managed with the Wait state, because the Wait state typically consumes only 65 A of IDD current. An example of the power management feature is given below. With the assumptions provided in the example, average IDD is estimated to be 152 A. Table 1. Power Management
SYSTEM STATE MACHINE STATE Wait RGBC Init RGBC ADC ATIME 0xEE PROGRAMMABLE PARAMETER WTIME WLONG PROGRAMMED VALUE 0xEE 0 43 2 ms 43.2 2.40 ms 43.2 ms 0 065 mA 0.065 0.235 mA 0.235 mA DURATION TYPICAL CURRENT
Average IDD Current = ((43.2 0.065) + (43.2 0.235) + (2.40 0.235)) / 89 152 A Keeping with the same programmed values as the example, Table 2 shows how the average IDD current is affected by the Wait state time, which is determined by WEN, WTIME, and WLONG. Note that the worst-case current occurs when the Wait state is not enabled. Table 2. Average IDD Current
WEN 0 1 1 1 1 WTIME n/a 0xFF 0xEE 0x00 0x00 WLONG n/a 0 0 0 1 WAIT STATE 0 ms 2.40 ms 43.2 ms 614 ms 7.37 s AVERAGE IDD CURRENT 291 A 280 A 152 A 82 A 67 A
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I2C Protocol
Interface and control are accomplished through an I2C serial compatible interface (standard or fast mode) to a set of registers that provide access to device control functions and output data. The devices support the 7-bit I2C addressing protocol. The I2C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 10). During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the register address from the previous command will be used for data access. Likewise, if the MSB of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. The command byte contains either control information or a 5-bit register address. The control commands can also be used to clear interrupts. The I2C bus protocol was developed by Philips (now NXP). For a complete description of the I2C protocol, please review the NXP I2C design specification at http://www.i2cbus.org/references/.
A N P R S Sr W Acknowledge (0) Not Acknowledged (1) Stop Condition Read (1) Start Condition Repeated Start Condition Write (0) Continuation of protocol Master-to-Slave Slave-to-Master 1 S 7 Slave Address 1 W 1 A 8 Command Code 1 A 8 Data Byte 1 A 1
...
...
1 S
7 Slave Address
1 R
1 A
8 Data
1 A
8 Data
1 A
...
8 Data
1 A
8 Data
1 A
...
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Register Set
The TCS3472 is controlled and monitored by data registers and a command register accessed through the serial interface. These registers provide for a variety of control functions and can be read to determine results of the ADC conversions. The register set is summarized in Table 3. Table 3. Register Address
ADDRESS 0x00 0x01 0x03 0x04 0x05 0x06 0x07 0x0C 0x0D 0x0F 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B RESISTER NAME COMMAND ENABLE ATIME WTIME AILTL AILTH AIHTL AIHTH PERS CONFIG CONTROL ID STATUS CDATAL CDATAH RDATAL RDATAH GDATAL GDATAH BDATAL BDATAH R/W W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R R R R R R R R R R REGISTER FUNCTION Specifies register address Enables states and interrupts RGBC time Wait time Clear interrupt low threshold low byte Clear interrupt low threshold high byte Clear interrupt high threshold low byte Clear interrupt high threshold high byte Interrupt persistence filter Configuration Control Device ID Device status Clear data low byte Clear data high byte Red data low byte Red data high byte Green data low byte Green data high byte Blue data low byte Blue data high byte RESET VALUE 0x00 0x00 0xFF 0xFF 0x00 0x00 0x00 0x00 0x00 0x00 0x00 ID 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
The mechanics of accessing a specific register depends on the specific protocol used. See the section on I2C protocols on the previous pages. In general, the COMMAND register is written first to specify the specific control-status-data register for subsequent read/write operations.
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Command Register
The command register specifies the address of the target register for future write and read operations. Table 4. Command Register
7 COMMAND FIELD CMD TYPE CMD BITS 7 6:5 6 TYPE 5 4 3 2 ADDR/SF DESCRIPTION Select Command Register. Must write as 1 when addressing COMMAND register. Selects type of transaction to follow in subsequent data transfers: FIELD VALUE 00 01 10 11 INTEGRATION TIME Repeated byte protocol transaction Auto-increment protocol transaction Reserved Do not use Special function See description below 1 0
Byte protocol will repeatedly read the same register with each data access. Block protocol will provide auto-increment function to read successive bytes. ADDR/SF 4:0 Address field/special function field. Depending on the transaction type, see above, this field either specifies a special function command or selects the specific control-status-data register for subsequent read and write transactions. The field values listed below only apply to special function commands: FIELD VALUE 00110 other READ VALUE Clear channel interrupt clear Reserved Do not write
The Clear channel interrupt clear special function clears any pending interrupt and is self-clearing.
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DESCRIPTION
NOTES: 1. See Power Management section for more information. 2. A minimum interval of 2.4 ms must pass after PON is asserted before an RGBC can be initiated.
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ID Register (0x12)
The ID Register provides the value for the part number. The ID register is a read-only register. Table 12. ID Register
7 ID FIELD ID BITS 7:0 Part number identification 6 5 4 ID DESCRIPTION 0x44 = TCS34721 and TCS34725 0x4D = TCS34723 and TCS34727 3 2 1 0 Address 0x12
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NOTES: A. All linear dimensions are in micrometers. B. This drawing is subject to change without notice.
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PACKAGE INFORMATION
PACKAGE FN TOP VIEW
877 + 75 369
871 + 75
PIN 1
VDD 1
6 SDA
406 2400 + 75
SCL 2
5 INT
GND 3
4 NC
END VIEW
650 + 50 295 nominal
SIDE VIEW
BOTTOM VIEW
750 + 100
650 + 50
PIN 1
300 + 50
Pb
Lead Free
NOTES: A. B. C. D. E. F.
All linear dimensions are in micrometers. Dimension tolerance is 20 m unless otherwise noted. The die is centered within the package within a tolerance of 3 mils. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish. This package contains no lead (Pb). This drawing is subject to change without notice.
DETAIL A
DETAIL B
Ao
Ko
Bo
NOTES: A. B. C. D. E. F. G.
All linear dimensions are in millimeters. Dimension tolerance is 0.10 mm unless otherwise noted. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481B 2001. Each reel is 178 millimeters in diameter and contains 3500 parts. TAOS packaging tape and reel conform to the requirements of EIA Standard 481B. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. This drawing is subject to change without notice.
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SOLDERING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile.
Tpeak
T3 T2 T1
Temperature (5C) Time (sec) tsoak Figure 14. Solder Reflow Profile Graph
t3 t2 t1
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Rebaking of the reel will be required if the devices have been stored unopened for more than 12 months and the Humidity Indicator Card shows the parts to be out of the allowable moisture region. Opened reels should be used within 168 hours if exposed to the following conditions: Temperature Range Relative Humidity < 30C < 60%
If rebaking is required, it should be done at 50C for 12 hours. The FN package has been assigned a moisture sensitivity level of MSL 3.
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PRODUCTION DATA information in this document is current at publication date. Products conform to specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard warranty. Production processing does not necessarily include testing of all parameters.
NOTICE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reserves the right to make changes to the products contained in this document to improve performance or for any other purpose, or to discontinue them without notice. Customers are advised to contact TAOS to obtain the latest product information before placing orders or designing TAOS products into systems. TAOS assumes no responsibility for the use of any products or circuits described in this document or customer product design, conveys no license, either expressed or implied, under any patent or other right, and makes no representation that the circuits are free of patent infringement. TAOS further makes no claim as to the suitability of its products for any particular purpose, nor does TAOS assume any liability arising out of the use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, INC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR USE IN CRITICAL APPLICATIONS IN WHICH THE FAILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY UNAUTHORIZED AND ANY SUCH USE BY A CUSTOMER IS COMPLETELY AT THE CUSTOMERS RISK.
LUMENOLOGY, TAOS, the TAOS logo, and Texas Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced Optoelectronic Solutions Incorporated.
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