Vocational Training ITI LTD., 16-06-2008 To 14-07-2008
Vocational Training ITI LTD., 16-06-2008 To 14-07-2008
Vocational Training ITI LTD., 16-06-2008 To 14-07-2008
Manager (HREDC)
Submitted by:-
Saurabh Chatterjee
VSTR No.-439
CERTIFICATE
It’s further certified that during the summer training period the
candidate attended the lectures and plant visits regularly and
punctually.
S.S Bisht
Manager (HREDC)
ITI Ltd., Mankapur
Gonda (U.P.)
ACKNOWLEDGEMENT
Saurabh Chatterjee
UCER, Naini
Allahabad (U.P.)
PREFACE
INDEX
Acknowledgement
Preface
Overview of ITI Ltd., Mankapur
Lectures: -
→ ISO Standards
→ Six Sigma
→ Global System for Mobile(GSM)
→ Base Transciever System(BTS)
→ Enterprise Resource Planning(ERP)
→ Networking
Plant Visit: -
→ Circuit Division
PCB Plant
Hybrid Plant
→ Component Division
→ Switching Exchange Plant(SEA)
→ Quality Control
→ Quality Assurance
Overview of ITI Ltd.
I.T.I. Ltd. was the first public sector undertaking of the free
INDIA. It was established in year 1948. The first manufacturing
unit was established at the Bangalore complex in Karnataka
under the name of Indian Telephone Industry Limited (I.T.I.). As
time progressed the full name of I.T.I. become a misnomer as
the industry began to manufacture several other electronic
hardware than those required in the field of telephony. Now this
public sector enterprise is only known as ITI Ltd.
Mission
ISO 9000
What is accreditation?
What is quality?
Advantages:
C) Reduce audits
D) Enhance marketing
G) Increases profit
IMPLANTATION METHODOLOGIES
(1) DMAIC
(2) DMADV
GSM
No mobility
Delay in new connection
Prone to failure
No security
Very less Value Added Services
Xchg. A Xchg. B
Subscriber X Subscriber Y
Call Through
OBJECTIVES OF GSM:-
● Spectral Efficiency
● ISDN compatibility
i. France
ii. Italy
iii. U.K.
iv.Germany
Tele-Service: - Telephony.
Data Service: -
- S.M.S.
Supplementary Services:-
This means that multiple users will use the same channel
frequency but not at the same instance.
Each user will be given a time slot of fixed time period. Hence
more users can use the same channel of FDMA by time division
multiplexing. This method of increasing the capacity is called
Time Division Multiple Access (TDMA).
Hence from 125 channels including TDMA no. of time slots used
for traffic=124*8=992.
Hence 992 persons can talk from one frame. In this way it
increases the capacity of traffic.
H
BS Xchg. A Xchg. B
S
Subscriber Y
Subscriber X
Call Through
HLR
VLR
AUC
MSC
M BT BC ST
EIR
S S F F
SMSSC
BC
VMSC
OMC
MS - Mobile Station
● Mobile Equipment
Functions of MS:-
BSS:- The B.T.S., BCF and STF together from the BSS via Air
link connection is mode between the BSS & the mobile station.
BCF:- The BCF takes part in signalling part of data. It has two
types of services COWS & CEWS are meant for common
channel signaling to other parts like STF etc. CEWS do
signalling related to the BCF. The signals coming at 16Kbps
where speech is not touched in the BCF.
The MSC perform the switching function for all mobile station
located in its geography area covered by its BSS. Function of
MSC is:-
AUC:-
HLR:-
* MSISDN
* Present VLR
OTHER ELEMENTS:-
BURST TYPES:-
● Normal Burst
- Carry Data
● F Burst
-Used in FCCH (Frequency Correction Channel)
● S Burst
- Used in SCH (Synchronization Channel)
●Access Burst
- Used in RACH (Random Access Channel)
●Dummy Burst
TRAFFIC CHANNEL:-
● TCH / F:-
- @13 Kbps
● TCH / H
- @6.5 Kbps
● EFR
- @13 Kbps
BROADCAST CHANNEL DOWNLINK:-
● BCCH
● FCCH
● SCH
-Synchronization Channel.
● CBCH
● DOWNLINK
- PCH
* Paging Channel.
● UPLINK
-RACH
● Slow
-SACCH
● Fast
-SDCCH
-FACCH
FREQUENCY HOPPING:-
VOICE PROCESSING
SPEEC CHANN INTER- MODU
H EL LEAVIN CIPHERIN LATIO
Speech
CODIN CODIN G G N
G G
2. Racks
1. INDOOR BTS
2. OUTDOOR BTS
- Omni Configuration,
5. RT (Transceivers)
TREPA, TREPS & TEPA are the types of RT card. One BTS rack
has three sectors named: ALFA, BETA and GAMA sectors.
One sector can contain one ANC card and maximum four RT
cards. In one BTS 12RTcards are connected. RT cards are
connected to the ANC cards and ANC connected to BSC and
then MSC.
BTS RACK
XIBM-EXTERNAL ALARM INPUT MULTISTANADARD
1. Digital transmission
2. Timing and clock generation
3. Management of internal digital interface
4. Operation and maintenance function
5. Remote inventory
6. Control DC-DC converter & check in of battery
1. Calibration Test
2. ABIS Test
1. Setting the LNA Game for the assigned for TREA receiver
2. LNA Alarm Supervision
3. Measuring Alarm VSWR
4. Selection of Antenna Sector
5. Reporting VSWR Alarm
6. RF cabling status Detection
7. Remote Power ON/OFF via the BCB Interface
8. Status Display via front panel LED’S
9. RI via the BCB Interface
FEATURES OF ERP
• Plan
• Source
• Make
• Deliver
• Return
SIMPLE MODEL
The simple manufacturing enterprise buys item from external
supplier& internally produces items for direct sale & shipment
to customers. The ERP sys must handle buy & make items at a
single site operations.
• BAAN.
• J. D. Edward.
• SAP.
• Ramco
• QaD
• Oracle
• People soft
• BOI
BaaN
SAP
BaaN SAP
• Very strong for discrete • Very strong for process
manufacturing industries &finance
industries. company.
• Long relationship with • CMC was
CMC for hardware implementation partner
maintenance. of SAP.
• License fee is • License key is
comparatively cheap. comparatively large.
Plant View
• CIRCUIT DIVISION
✔ PCB PLANT
✔ HYBRID PLANT
✔
• COMPONENT DIVISION
• SEA PLANT
• QUALITY CONTROL
• QUALITY ASSURANCE
CIRCUIT DIVISION
PCB Plant
FLOWCHART FOR PREPRATION OF PCB
BASE MATERIAL
CUTTING
DRILLING
ELECTROLESS PLATING
PUMICING
LAMINATION
EXPOSURE
DEVELOPMENT
ELECTROPLATING
STRIPPING
ETCHING
SCREEN MASKING/PRINTING
ROUTING
TESTING
QUALITY CONTROL
Straightening of
140 12 hr.
wrapped material
Straightening of
140 12 hr.
wrapped circuit
DRILLING:
DEBURRING:
After drilling holes, burrs left over the sheet & on the edges are
removed by deburring. Deburrring removes unwanted
materials & makes holes perfect. Also, the board surface gets
smoothened.
ELECTROLESS PLATING:
PUMICING:
LAMINATION:
EXPOSURE:
DEVELOPMENT:
ELECTROPLATING:
After development, card is fed to electroplating apparatus. Sn-
Pb plating is done on the Cu plate. Here current is passed on
the plate, so is called as electroplating. The thickness of Sn-Pb
to be applied is 12.5 micron. On open tracks, Cu plating of
about 25 micron is done. Current is passed through a mixture
of Sn-fluberate, Pb-fluberate and fluberic acid. DYNATRON F is
the machine used for electroplating. In PTH (Plated Through
Holes) lane, deposition of Cu is done inside the hole to establish
the continuity between two surfaces.
• Cleaning chemical.
• Acid cleaning.
• Cleaning through water.
• Electro etch cleaning.
STRIPPING:
ETCHING:
SOLDER STRIPPING:
In this process, ink is put over the developed board like dying.
Board is inserted from bottom & ink is poured from top & with
the help of leveler, it is leveled properly. Then it is cured at a
temperature of 800C for 30 minutes to make ink adhere
properly to the board. After curing, a photo tool is placed over
the sheet & UV Rays are passed through it. The points where
holes are to be formed remains soft as light can’t pass through
it. After exposure, passing through Na2CO3 solution due to
which we get an impression of the holes on the board. Then,
again it is baked at temperature 1200C for 4 hrs.
SRCEEN MASKING/PRINTING:
ROUTING:
TESTING:
This is done to detect any anomaly. Error detected is shown by
printer & it can be rectified if within limits, otherwise discarded.
Visual inspection is done to check any discrepancy crack or any
connection fault. Bare board testing (BBT) is done for very
sophisticated result.
QUALITY CONTROL:
2 15
10 14
15
1
61716
7 18
138
3 9
11
12 14
KEYS:
GATES
CANTEEN
OFFICES
NCM & RELAY
CM OFFICE(P.I.)
MANUFACTURING OF NCM PARTS
OFFICES
STORE
C&T
SHOE RACK
TOILET & WATER
U.P.S. SYSTEM
TOOL ROOM
PAINTING
PLATTING
WELDING
PUNCHING MACHINES
DIFFERENT TYPES OF PUNCHING MACHINES
ANUFACTURING UNIT:-
• Moulding
• Punching
• CNC
• Metal part
MOULDING:
• Injection unit
• Mould unit
• Control unit
PUNCHING:
FEATURES:
Capacity - 30 tones
Table travel - 1270 mm (Y-axis) on change
Carriage travel - 1830 mm(X-axis) adjusted X2
Stroke/min - 350
Maximum rate - 200
Maximum sheet size - 1270 × 3660
Relative humidity - 75%
FEATURES:
ASSEMBLY UNIT:-
• Connector Assembly
• Coil Winding and Transformer
• MDF (Main Distributed Frame)
• Relay Assembly
CONNECTOR ASSEMBLY:
• Tube transformer
• Pulse transformer
• Power transformer
• Converter transformer
• Switching transformer
• Number of turns
• Resistance
• Inductance
• Transformer ratio
• Insulation strength
• Dielectric test
• Thermal test
• Short circuit in winding
TRANSFORMER FORMATION:
(optional)
Winding Winding Winding
(optional)
• Marking machine
• Ultrasonic welding machine
RELAY ASSEMBLY:
• 2 BM (Break make)
• BM (Break make)
OPERATION OF RELAY:
CHARACTERISTIC 4 BM 2 BM
OF RELAYS
RATED SUPPLY 12V 12V
• FILTER: It has three air filter and an EMI filter paper filter
(transparent) for suction. Oil filter for diaphragm
assembly.EMI filter is an electronic device which protects
from the disturbance in 230V AC supply.
• DIAPHRAGM ASSEMBLY: It works on suction system. It
has a diaphragm and sensor which moves up and down.
Sensor senses the counting and displays it with the help of
mother board.