Huawei Ascend D2 Maintenance Manual

V1.0

Prepared by

Pan Linghan

Date

Reviewed by

Date

Approved by

Date

Huawei Technologies Co., Ltd.

All rights reserved

2012-12-25

D2 Maintenance Manual

INTERNAL

Revision Record
Date

2013-04-09

Revision
Version

Revision
Cause

Section
Number

Change
Description

Huawei confidential. No spreading without permission.

Author

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Contents
1 Product Overview ......................................................................................................................... 7
1.1 Appearance ....................................................................................................................................................... 7
1.2 Specifications ................................................................................................................................................. 10

2 Applicable Scope and Precautions .......................................................................................... 11

2.1 Applicable Scope ............................................................................................................................................ 11
2.2 Precautions ..................................................................................................................................................... 11
2.3 How to Obtain Product and Repair Information ............................................................................................ 12

3 Exploded View............................................................................................................................. 12
3.1 Exploded View ............................................................................................................................................... 12
3.2 Product BOM ................................................................................................................................................. 13

4 Components on the PCBA ......................................................................................................... 19

4.1 Components on the PCBA ............................................................................................................................. 19
4.2 PCBA Component List ................................................................................................................................... 21

5 Software Upgrade ....................................................................................................................... 95

5.1 Preparing for the Upgrade .............................................................................................................................. 95
5.2 Installing the Driver ....................................................................................................................................... 95
5.3 Installing the Driver ....................................................................................................................................... 95
5.4 Login Tool ...................................................................................................................................................... 96
5.5 Configuration Tools........................................................................................................................................ 96
5.6 Start Upgrade ................................................................................................................................................. 98
5.7 Other Upgrade Modes .................................................................................................................................... 98

6 Repair Tools ................................................................................................................................. 99

7 Disassembly Procedure ............................................................................................................ 100
7.1 Disassembly Preparation .............................................................................................................................. 100
7.2 Disassembly Procedure (Read the Notes to Save Workload) ....................................................................... 101
7.2.1 Removing the Battery Cover ............................................................................................................... 101
7.2.2 Removing the SIM Card Component .................................................................................................. 102
7.2.3 Removing Screws of Cover C ............................................................................................................. 103
7.2.4 Removing Motor Support Insulation Mylar. ....................................................................................... 103
7.2.5 Removing Cover C Components ........................................................................................................ 103
7.2.6 Removing Motor Support Screws ....................................................................................................... 105
7.2.7 Removing the Fixed Speaker Box Screw ............................................................................................ 106
7.2.8 Removing the Primary Camera ........................................................................................................... 107
7.2.9 Removing the Secondary Microphone Cover ..................................................................................... 107
7.2.10 Removing Main Board Screws ......................................................................................................... 108
7.2.11 Removing the Main Board Graphite Sheet ....................................................................................... 108
7.2.12 Removing the conductive fabric of the LCD Connector ................................................................... 109
7.2.13 Removing the Side Button Connector Mylar .................................................................................... 109

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7.2.14 Removing the Motor Support Component ........................................................................................ 110

7.2.15 Removing Speaker Box .................................................................................................................... 110
7.2.16 Removing the Main Board Component ............................................................................................ 111
7.2.17 Removing Screws at the Left of the Earphone .................................................................................. 113
7.2.18 Removing the Coaxial Connector at the Antenna PCB Side ............................................................. 113
7.2.19 Removing the TP-LCD Component .................................................................................................. 113
7.2.20 Removing the Main FPC ................................................................................................................... 115
7.2.21 Removing the Antenna PCB and Its Screws ..................................................................................... 116
7.2.22 Removing the Receiver Ornament .................................................................................................... 117
7.2.23 Removing the Silicon Pad of the Potoreceptor ................................................................................. 117
7.2.24 Remove the Magnesium Support of the Middle Cover ..................................................................... 117
7.2.25 Remove REC-FPC and Receiver ...................................................................................................... 118
7.2.26 Remove the USB-FPC ...................................................................................................................... 119
7.2.27 Removing Side Key FPC and Side Keys .......................................................................................... 120
7.2.28 Remove the Battery. .......................................................................................................................... 121
7.2.29 Removing the Antenna Coaxial Cable .............................................................................................. 122
7.2.30 Removing the Main Microphone FPC .............................................................................................. 123
7.2.31 Removing the Motor ......................................................................................................................... 123
7.2.32 Removing the Earphone Sealing Ring .............................................................................................. 124
7.2.33 Removing the Speaker Sealing Ring ................................................................................................. 124
7.3 Disassembly Panoroma ................................................................................................................................ 125

8 Assembly Procedure ................................................................................................................. 125

8.1 Assembly Preparation................................................................................................................................... 125
8.2 Assembly Procedure (Read the Notes to Save Workload) ............................................................................ 126
8.2.1 Installing the Front Cover Components .............................................................................................. 126
8.2.2 Installing the TP-LCD Assemblies ...................................................................................................... 129
8.2.3 Installing the Shielding Cover of the Main Board .............................................................................. 130
8.2.4 Installing the Camera .......................................................................................................................... 130
8.2.5 Installing the Secondary Microphone Sheath ...................................................................................... 130
8.2.6 Installing the Main Board ................................................................................................................... 131
8.2.7 Installing the Antenna Board ............................................................................................................... 131
8.2.8 Installing the Battery ........................................................................................................................... 132
8.2.9 Installing the Main Microphone .......................................................................................................... 132
8.2.10 Installing the Motor, Main FPC, and the Speaker Box ..................................................................... 133
8.2.11 Connecting the ZIF Connector of the Main FPC with the Side Key FPC ......................................... 134
8.2.12 Sticking the Conductive Fabric and Graphite Sheet to the Main Board ........................................... 135
8.2.13 Installing Cover C ............................................................................................................................. 135
8.2.14 Installing the Battery Cover .............................................................................................................. 136

9 Troubleshooting Common Faults .......................................................................................... 136

9.1 Working Principles of the Phone .................................................................................................................. 137
9.2 Startup Failure .............................................................................................................................................. 142

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9.2.2 Excessive Current (DC Power Supply) ............................................................................................... 143

9.2.3 Weak Current (DC Power Supply) ...................................................................................................... 144
9.2.4 No Current (DC Power Supply) .......................................................................................................... 147
9.3 Charging Failure ........................................................................................................................................... 149
9.4 Display Failure ............................................................................................................................................. 150
9.5 Vibration Failure .......................................................................................................................................... 151
9.6 SIM Card Identification Failure ................................................................................................................... 152
9.7 Touchscreen Failure ..................................................................................................................................... 153
9.8 Proximity Sensor and Automatic Light Sensor Failure ................................................................................ 155
9.8.2 9.10 Accelerometer Failure ................................................................................................................. 155
9.9 Compass Sensor Failure ............................................................................................................................... 156
9.9.2 9.12 Gyroscope Failure ....................................................................................................................... 157
9.10 Camera Failure ........................................................................................................................................... 157
9.11 Audio Failure .............................................................................................................................................. 158
9.11.1 Ringtone Failure ................................................................................................................................ 158
9.11.2 Call Transmitting Failure .................................................................................................................. 159
9.11.3 Call Receiving Failure ....................................................................................................................... 160
9.12 Headphone Audio Failure........................................................................................................................... 161
9.12.1 Headphone Silence Failure ............................................................................................................... 161
9.12.2 Headphone Transmitting Failure ....................................................................................................... 162
9.13 Speaker Noise Failure ................................................................................................................................ 162
9.14 Wi-Fi and Bluetooth Failure ....................................................................................................................... 164
9.14.1 2.4 GHz WIFI ................................................................................................................................... 164
9.14.2 5 GHz Wi-Fi ...................................................................................................................................... 165
9.15 FM Failure (D2 Is Not Equipped with the FM Function.) ......................................................................... 168
9.15.1 9.19 GPS Failure ............................................................................................................................... 168
9.16 Mobile High-Definition Link (MHL) Failure ............................................................................................ 170
9.17 UIM1 Card Detection Failure..................................................................................................................... 171
9.18 UIM2 Card Detection Failure..................................................................................................................... 172
9.19 RF Reception Failure-CDMA (D2-2010)................................................................................................... 173
9.20 RF Sending Failure-CDMA (D2-2010) ...................................................................................................... 174
9.21 RF Signal Receiving Failure-GSM (D2-2010)........................................................................................... 175
9.22 RF Signal Sending Failure-GSM (D2-2010) .............................................................................................. 176
9.23 RF Reception Failure-WCDMA (D2-5000) ............................................................................................... 177
9.24 RF Sending Failure-CDMA (D2-5000) ...................................................................................................... 178
9.25 RF Signal Receiving Failure-GSM (D2-5000)........................................................................................... 179
9.26 RF Signal Sending Failure-GSM (D2-5000) .............................................................................................. 180

10 Chapter Ten Function Tests .................................................................................................. 181

10.1 Keys ........................................................................................................................................................... 181
10.2 MMI Tests .................................................................................................................................................. 181
10.3 Wi-Fi Test ................................................................................................................................................... 181

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10.4 Voice Call Test............................................................................................................................................ 182

11 Solder Points on the PCB and the BGA Chip .................................................................... 182
12 PCBA Layout ............................................................................................................................ 184

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D2 Maintenance Manual

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1 Product Overview
1.1 Appearance
Figure 1-1 Appearance
HUAWEI D2-5000

HUAWEI D2-2010

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D2 Maintenance Manual

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INTERNAL

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D2 Maintenance Manual

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HUAWEI D2-0082

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D2 Maintenance Manual

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1.2 Specifications
Table 1-1 D2 Specifications
Item

Description

Type

Bar-type touchscreen smartphone

Dimensions (H x W x D)

140.0 mm *71.1 mm *10.2 mm (Recommended depth for promotion is 9.9

mm)

Frequency bands

D2-5000
TD-SCDMA A band(2010 to 2025 MHz)/F band(1880 to 1920 MHz)/E
band(2320-2370 MHz)GSM 850/900/1800/1900 MHz
TDD LTE Band 38/38/40, FDD Band7, WCDMA850/900/1900/2100
D2-0082
GSM 850/900/1800/1900 MHz WCDMA850/900/2100
FDD LTE Band1/3/7
D2-2010
GSM 900/1800/1900 MHz
CDMA 2000 EVDO Rev.A/1x 800 MHz

Weight

About 168 g

Network mode

D2-5000 and D2-0082 are single SIM phones. D2-2010 are dual-SIM
phones.

System platform

D2-5000 & D2-0082:K3V20 + Balong; OS: Android 4.1

D2-2010: K3V200 + MTK6252 + QSC6085; OS: Android 4.1

Memory

D2-5000& D2-0082:
Application processor (AP) side:16 Gb DDR2 DRAM;MCP-32GB
(32Gbx8) EMMC
Modem side: flashless,1G DDR
D2-2010:
Application processor (AP) side:16 Gb DDR2 DRAM;MCP-32GB
(32Gbx8) EMMC
Modem side: MCP-1Gb(64M x 16) NAND FLASH

Ports

Micro USB for charging and data connection, 3.5 mm headset jack, MHL
port

Battery

2.9 mAh lithium ion battery (minimum)/

(typical)

300 mAh lithium ion battery

Standy time: up to 140 hours. Talk time: at least 1000 minutes. Charging
time: 2.5 hours.
Display

5'' FHD screen. Resolution 1920 x 1080.

MicroSD card slot

Not supported

Antenna

Includes main antenna, GPS antenna, Wi-Fi/Bluetooth antenna, 5.0 Wi-Fi

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D2 Maintenance Manual

Item

INTERNAL

Description
antenna, diversity antenna

Camera

Primary camera: 13 MP CMOS camera, with flash. Secondary camera: 1.3

MP HD

Bluetooth

TI WL1873 with Bluetooth 4.0

WIFI

WL1873 Wi-Fi module (802.11 a/b/g/n, supporting 2.4/5 GHz bands)

GPS

WL1873 GPS module, supporting GPS/GLONASS/AGPS

FM

Not supported

Feature

Android 4.1(Jelly Bean)

Quad-core 1.5 GHz CPU K3V2
5 inch TFT IPS + touch screen, supporting auto-rotation
D2-2010:2 GB RAM+32 GB ROM;D2-0082/D2-5000: 2 GB RAM+16
GB ROM
Wi-Fi 802.11 a/b/g/n
Supports MHL to HDMI video output (1080 P/30 FPS).
13 megapixel primary camera + 1.3 megapixel secondary camera
Dolby surround sound, Digital Plus decoding technology
DLNA
BT4.0, supporting connecting to a keyboard and a mouse through
Bluetooth.
Proximity sensor
Light sensor
Accelerator
Compass
Gyroscope
USB OTG Host, supporting connecting to a keyboard, mouse or USB
drive through USB ports.

2 Applicable Scope and Precautions

2.1 Applicable Scope
This document provides maintenance instructions for technical support at the authorized service centers.
Being Huawei proprietary, this document is accessible only for authorized service centers and companies.
Although every effort was made to ensure the accuracy of this document, errors may still exist. If you find
any errors or have any suggestions, contact Huawei's customer service.

2.2 Precautions

Only qualified technicians are allowed to perform maintenance and calibration.

Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps throughout
the operations.

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Ensure that all the components, screws, and insulators are properly installed after maintenance and
calibration, and that all cables and wires are installed and connected correctly.

Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
ESD is the main cause of damage to electrostatic-sensitive components. Each ASC
must exercise caution to avoid ESD damage and comply with the ESD protection
requirements in this manual.

2.3 How to Obtain Product and Repair Information

To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do
The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.

3 Exploded View
3.1 Exploded View
NOTE

The components listed in Figure 3-1 are structural parts of the phone, and cannot be used as reference when requesting
spare parts.

Figure 3-1 Exploded View

RCV
ornament

Proximity and
illuminance sensor
sealing sheath

USB conductive
fabric

Graphite
sheet

Primary
camera

Battery
assembly

Graphite
sheet

Graphite
sheet

Antenna support
assembly

Battery cover
assembly

Secondary
camera

SIM card tray

assembly
Motor

TP protective
film

2013-04-09

TP-LCD
assembly

Front cover
assembly

Motor
support

Co-axial
cable

Antenna
mini-board

Main microphone
FPC

Huawei confidential. No spreading without permission.

SPK
assembly

Main FPC
assembly

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3.2 Product BOM

Table 3-1 Product BOM
D2-5000:
No.

Code

Name

Quantity

51151628

WCDMA Handset-D2-0082-32G ROM/GSM Quad-core,

W2100/W1900/W1700/W900/W850 Handset-White

1.0 PCS

03021YX
M

Manufactured Board,D2-5000,HL1D25000M,Ascend D2 Handset

Main Board,Terminal used,2*2

1.0 PCS

03021UQN

Manufactured Board,D2-0082,HD1U9800DL,D2-0082 Main

FPC-1*1

1.0 PCS

03021USK

Manufactured Board,D2-0082,HD1U9800DMIC,D2-0082 MIC

FPC,1*1

1.0 PCS

03021WQ
X

Manufactured Board,D2-5000,HT1T9800LA,D2-5000 Antenna

Board,6*6

1.0 PCS

02230VBS

Front Housing Assy(Silver)

1.0 PCS

51623849

RECEIVER-ASSY-C9800D

1.0 PCS

51660AKN

Sim Card Housing Assy-T9800L

1.0 PCS

51660AHK

Sim Card Housing Assy-T9800L

1.0 PCS

10

51634067

Submic Gasket Assy-C9800D

1.0 PCS

11

51634068

MOTOR Frame Assy-C9800D

1.0 PCS

12

51660AH
M

Sub Camera Frame Assy-C9800D

1.0 PCS

13

51634070

Sensor Rubber Assy-C9800D

1.0 PCS

14

51634242

DKBA80932335,A-COVER-TP-ADHENSIVE,C9800D

1.0 PCS

15

51634071

O-Ring-Earjack-C9800D

1.0 PCS

16

51634073

O-Ring-SPK-C9800D

1.0 PCS

17

51634075

Mainboard Conductive Copper-C9800D

1.0 PCS

18

51634074

Main Fpczif-Mylar-C9800D

1.0 PCS

19

51634244

DKBA80933187,MOTOR-zif-mylar,C9800D

1.0 PCS

20

51634245

DKBA80932887,Main-cam-electic-fabric,C9800D

1.0 PCS

21

51634246

DKBA80933311,SUB-mic-dustproof,C9800D

1.0 PCS

22

51622215

M 1.4*3*2.5*0.5(T5)-NY

6.0 PCS

23

51622228

M1.4*2.0*2.5*0.5

3.0 PCS

24

51623361

DKBA89000766,Screw-T5

3.0 PCS

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No.

Code

Name

Quantity

25

51621198

DKBA8.900.0504,T5 pan head mechanical

screw,M1.4*4.0*D2.6*0.8,Plated with black
zinc,NY,Unitary(non-priority)

2.0 PCS

26

51650888

DKBA8.817.7194,warranty label,2.5mm,General

1.0 PCS

27

51623896

TOP-SHIELD COVER-1-YD-T9800L

1.0 PCS

28

51623895

TOP-SHIELD COVER-2-YD-T9800L

1.0 PCS

29

51623892

BOT-SHIELD COVER-1-YD-T9800L

1.0 PCS

30

51623886

BOT-SHIELD COVER-2-YD-T9800L

1.0 PCS

31

51634118

GRAPHITE L-FILM_TOP_YD_T9800L

1.0 PCS

32

51634119

GRAPHITE FILM_BTM_T9800L

1.0 PCS

33

23040290

LCD Indication
Module,SIGNAL,TFT,4.97,1920*1080,16.7M,16:9,2.29TYP,with
touch panel,BTB

1.0 PCS

34

23060094

Camera Module Group,1/3'',CMOS RGBW BI sensor,13M,Terminal

Dedicated

1.0 PCS

35

23060099

Camera Module Group,1/6",CMOS 1M HD FSI

sensor,FF,MIPI,6.0*6.0*3.3,Terminal

1.0 PCS

36

32050039

Vibrating Motor,Cylindrical,2.0V,0.080A,0rpm,D10*3mm,Spring
Contact Terminals,23ohm,Terminal Dedicated

1.0 PCS

37

22020107

Speaker,8ohm,1W,D2 box,40*16.5*6.7

1.0 PCS

38

24021174

Rechargeable Battery,Li-polymer
Battery,HB5U1V,3.8V,2.9Ah,Single Cell,Max 5.5*56.0*71.0mm,
Embedded,4.35V High Voltage,Chinese & English,Screen
Printing,Terminal Dedicated

1.0 PCS

39

4050532

Out Sourcing Cable,RF Coaxing Cable,87mm,fit

14240433,0.087,Terminal Dedicated

1.0 PCS

40

51624192

DKBA80359900,Volume-box-grounding-contact,C9800D

1.0 PCS

41

51634303

Thermal-Pad,T0.76mm,D2,Terminal Dedicated

1.0 PCS

42

27161242

Terminal
Antenna,1.565GHz-1.605GHz,2.4GHz-2.5GHz,5GHz-6GHz,1880M
Hz-1920MHz,2.01GHz-2.025GHz,2300MHz-2400MHz,2570MHz-2
620MHz,larger than -3dBi,isotropic,linear polarization,smaller than
3,4W,D2-5000 antenna on C cover,LDS antenna ,Skycross

1.0 PCS

43

27161241

Terminal
Antenna,824MHz-960MHz,1710MHz-2170MHz,2.3GHz-2.4GHz,2.
5GHz-2.7GHz,larger than -3dBi,isotropic,smaller than
3,4W,D2-2010 main antenna,FPC antenna,Skycross

1.0 PCS

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D2-0082:
No.

Part Number

Name

Quantity

51130066

TD-SCDMA Phone,D2-5000,TD-SCDMA/GSM
Handset,White,China,China Mobile

1.0 PCS

03021YFH

Manufactured Board,D2-5000,HL1D25000M,D2-5000 Handset

Main Board(16G ROM/GSM),Terminal Dedicated,2*2

1.0 PCS

03021UQN

Manufactured Board,D2-0082,HD1U9800DL,D2-0082 Main

FPC-1*1

1.0 PCS

03021USK

Manufactured Board,D2-0082,HD1U9800DMIC,D2-0082 MIC

FPC,1*1

1.0 PCS

03021WQX

Manufactured Board,D2-5000,HT1T9800LA,D2-5000 Antenna

Board,6*6

1.0 PCS

02230VBS

Front Housing Assy(Silver)

1.0 PCS

51623849

RECEIVER-ASSY-C9800D

1.0 PCS

51660AKM

BATTERY COVER-ASSY-WHITE-T9800L

1.0 PCS

51660AHK

Sim Card Housing Assy-T9800L

1.0 PCS

10

51634067

Submic Gasket Assy-C9800D

1.0 PCS

11

51634068

MOTOR Frame Assy-C9800D

1.0 PCS

12

51660AHM

Sub Camera Frame Assy-C9800D

1.0 PCS

13

51634070

Sensor Rubber Assy-C9800D

1.0 PCS

14

51634242

DKBA80932335,A-COVER-TP-ADHENSIVE,C9800D

1.0 PCS

15

51634071

O-Ring-Earjack-C9800D

1.0 PCS

16

51634073

O-Ring-SPK-C9800D

1.0 PCS

17

51634075

Mainboard Conductive Copper-C9800D

1.0 PCS

18

51634074

Main Fpczif-Mylar-C9800D

1.0 PCS

19

51634244

DKBA80933187,MOTOR-zif-mylar,C9800D

1.0 PCS

20

51634245

DKBA80932887,Main-cam-electic-fabric,C9800D

1.0 PCS

21

51634246

DKBA80933311,SUB-mic-dustproof,C9800D

1.0 PCS

22

51622215

M 1.4*3*2.5*0.5(T5)-NY

6.0 PCS

23

51622228

M1.4*2.0*2.5*0.5

3.0 PCS

24

51623361

DKBA89000766,Screw-T5

3.0 PCS

25

51621198

DKBA8.900.0504,T5 pan head mechanical

screw,M1.4*4.0*D2.6*0.8,Plated with black
zinc,NY,Unitary(non-priority)

2.0 PCS

26

51650888

DKBA8.817.7194,warranty label,2.5mm,General

1.0 PCS

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D2 Maintenance Manual

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No.

Part Number

Name

Quantity

27

51623896

TOP-SHIELD COVER-1-YD-T9800L

1.0 PCS

28

51623895

TOP-SHIELD COVER-2-YD-T9800L

1.0 PCS

29

51623892

BOT-SHIELD COVER-1-YD-T9800L

1.0 PCS

30

51623886

BOT-SHIELD COVER-2-YD-T9800L

1.0 PCS

31

51634118

GRAPHITE L-FILM_TOP_YD_T9800L

1.0 PCS

32

51634119

GRAPHITE FILM_BTM_T9800L

1.0 PCS

33

23040290

LCD Indication
Module,SIGNAL,TFT,4.97,1920*1080,16.7M,16:9,2.29TYP,wit
h touch panel,BTB

1.0 PCS

34

23060094

Camera Module Group,1/3'',CMOS RGBW BI

sensor,13M,Terminal Dedicated

1.0 PCS

35

23060099

Camera Module Group,1/6",CMOS 1M HD FSI

sensor,FF,MIPI,6.0*6.0*3.3,Terminal

1.0 PCS

36

32050039

Vibrating
Motor,Cylindrical,2.0V,0.080A,0rpm,D10*3mm,Spring Contact
Terminals,23ohm,Terminal Dedicated

1.0 PCS

37

22020107

Speaker,8ohm,1W,D2 box,40*16.5*6.7

1.0 PCS

38

24021174

Rechargeable Battery,Li-polymer
Battery,HB5U1V,3.8V,2.9Ah,Single Cell,Max
5.5*56.0*71.0mm, Embedded,4.35V High Voltage,Chinese &
English,Screen Printing,Terminal Dedicated

1.0 PCS

39

4050532

Out Sourcing Cable,RF Coaxing Cable,87mm,fit

14240433,0.087,Terminal Dedicated

1.0 PCS

40

51624192

DKBA80359900,Volume-box-grounding-contact,C9800D

1.0 PCS

41

27161241

Terminal
Antenna,824MHz-960MHz,1710MHz-2170MHz,2.3GHz-2.4GH
z,2.5GHz-2.7GHz,larger than -3dBi,isotropic,smaller than
3,4W,D2-2010 main antenna,FPC antenna,Skycross

1.0 PCS

42

27161242

Terminal
Antenna,1.565GHz-1.605GHz,2.4GHz-2.5GHz,5GHz-6GHz,188
0MHz-1920MHz,2.01GHz-2.025GHz,2300MHz-2400MHz,2570
MHz-2620MHz,larger than -3dBi,isotropic,linear
polarization,smaller than 3,4W,D2-5000 antenna on C cover,LDS
antenna ,Skycross

1.0 PCS

43

51634303

Thermal-Pad,T0.76mm,D2,Terminal Dedicated

1.0 PCS

D2-2010:

2013-04-09

Huawei confidential. No spreading without permission.

Page 16 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

51141791

CDMA Mobile Phone,D2-2010,Chinese-English Version,5.0

FHD 16M Color LCD,Android,Double R-UIM,BT,WLAN,GPS

1.0 PCS

03021UPQ

Manufactured Board-CDMA D2-2010-HC1C9800DM-D2-2010

Handset Main Board -2*2

1.0 PCS

03021UQN

Manufactured Board,D2-0082,HD1U9800DL,D2-0082 Main

FPC-1*1

1.0 PCS

03021USK

Manufactured Board,D2-0082,HD1U9800DMIC,D2-0082 MIC

FPC,1*1

1.0 PCS

03021UQV

Manufactured Board-D2-2010-HC1C9800DA-D2-2010 Antenna

Board-6*6

1.0 PCS

02230THS

ASSEMBLE,D2-2010/5000/0082 FRONT ASSEMBLE HOUSE

1.0 PCS

23040290

LCD Indication
Module,SIGNAL,TFT,4.97,1920*1080,16.7M,16:9,2.29TYP,wit
h touch panel,BTB

1.0 PCS

23060094

Camera Module Group,1/3'',CMOS RGBW BI

sensor,13M,Terminal Dedicated

1.0 PCS

23060099

Camera Module Group,1/6",CMOS 1M HD FSI

sensor,FF,MIPI,6.0*6.0*3.3,Terminal

1.0 PCS

10

32050039

Vibrating
Motor,Cylindrical,2.0V,0.080A,0rpm,D10*3mm,Spring Contact
Terminals,23ohm,Terminal Dedicated

1.0 PCS

11

22020107

Speaker,8ohm,1W,D2 box,40*16.5*6.7

1.0 PCS

12

24021174

Rechargeable Battery,Li-polymer
Battery,HB5U1V,3.8V,2.9Ah,Single Cell,Max
5.5*56.0*71.0mm, Embedded,4.35V High Voltage,Chinese &
English,Screen Printing,Terminal Dedicated

1.0 PCS

13

51623849

RECEIVER-ASSY-C9800D

1.0 PCS

14

51660AHL

BATTERY COVER ASSY-C9800D

1.0 PCS

15

51660AHJ

SIM CARD HOUSING ASSY-CN-C9800D

1.0 PCS

16

51634067

Submic Gasket Assy-C9800D

1.0 PCS

17

51634068

MOTOR Frame Assy-C9800D

1.0 PCS

18

51660AHM

Sub Camera Frame Assy-C9800D

1.0 PCS

19

51634070

Sensor Rubber Assy-C9800D

1.0 PCS

20

51634242

DKBA80932335,A-COVER-TP-ADHENSIVE,C9800D

1.0 PCS

21

51634071

O-Ring-Earjack-C9800D

1.0 PCS

22

51634073

O-Ring-SPK-C9800D

1.0 PCS

23

51634075

Mainboard Conductive Copper-C9800D

1.0 PCS

2013-04-09

Huawei confidential. No spreading without permission.

Page 17 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

24

51634074

Main Fpczif-Mylar-C9800D

1.0 PCS

25

51624192

DKBA80359900,Volume-box-grounding-contact,C9800D

1.0 PCS

26

51634243

DKBA80933901,USB electric fabric,C9800D

1.0 PCS

27

51634244

DKBA80933187,MOTOR-zif-mylar,C9800D

1.0 PCS

28

51634245

DKBA80932887,Main-cam-electic-fabric,C9800D

1.0 PCS

29

51634246

DKBA80933311,SUB-mic-dustproof,C9800D

1.0 PCS

30

04050532

Out Sourcing Cable,RF Coaxing Cable,87mm,fit

14240433,0.087,Terminal Dedicated

1.0 PCS

31

51634117

DKBA80932409,C9800D-GRAPHITE-FILM-BOTTOM,C9800
D

1.0 PCS

32

51634118

GRAPHITE L-FILM_TOP_YD_T9800L

1.0 PCS

33

51622215

M 1.4*3*2.5*0.5(T5)-NY

6.0 PCS

34

51622228

M1.4*2.0*2.5*0.5

3.0 PCS

35

51623361

DKBA89000766,Screw-T5

3.0 PCS

36

51621198

DKBA8.900.0504,T5 pan head mechanical

screw,M1.4*4.0*D2.6*0.8,Plated with black
zinc,NY,Unitary(non-priority)

2.0 PCS

37

51650888

DKBA8.817.7194,warranty label,2.5mm,General

1.0 PCS

38

51623870

BOT-SHIELD-COVER-1-CN-C9800D

1.0 PCS

39

51623871

TOP-SHIELD-COVER-1-CN-C9800D

1.0 PCS

40

51623873

TOP-SHIELD-COVER-2-CN-C9800D

1.0 PCS

41

51623876

BOT-SHIELD-COVER-2-CN-C9800D

1.0 PCS

42

51634303

Thermal-Pad,T0.76mm,D2,Terminal Dedicated

1.0 PCS

43

05011FCF

Terminal Software,D2-2010,HDD2-2010M01,D2-2010 Update

Software,Program,China(K3V2 +QSC6085 + MTK6252D)

1.0 PCS

44

27161240

Terminal
Antenna,1.565GHz-1.605GHz,2.4GHz-2.5GHz,5GHz-6GHz,880
MHz-960MHz,1710MHz-1880MHz,1880MHz-1990MHz,larger
than -3dBi,isotropic,smaller than 3,4W,D2-2010 antenna on C
cover,LDS antenna ,Skycross

1.0 PCS

45

27161241

Terminal
Antenna,824MHz-960MHz,1710MHz-2170MHz,2.3GHz-2.4GH
z,2.5GHz-2.7GHz,larger than -3dBi,isotropic,smaller than
3,4W,D2-2010 main antenna,FPC antenna,Skycross

1.0 PCS

2013-04-09

Huawei confidential. No spreading without permission.

Page 18 of 187

D2 Maintenance Manual

INTERNAL

The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.

4 Components on the PCBA

4.1 Components on the PCBA
Figure 4-1 PCBA's front and back components (excluding the shielding cover and frame)
D2-5000/D2-0082:

U1800 flashlight control chip

Fault caused if damaged:
flashlight fault

U3105 1.2V LDO

Fault caused if
damaged: MHL fault

U3201 DC/DC buck-single

output primary camera
DVDD power supply
Fault caused if damaged:
camera fault

U3203 Load switch

Secondary camera
DVDD power supply
Fault caused if
damaged: camera fault

TCXO5601 26M
2.4/5GHz WLAN/Bluetooth 4.0/
FM/GPS four-in-one chip clock
Fault caused if damaged:
wifi,BT,FM,GPS faults

J1801 secondary camera

connector
Fault caused if damaged:
Secondary camera fault

U1102 EMMC
Fault caused if damaged:
power on failure

U2005 COMPASS chip

Fault caused if damaged:
Compass fault

U3104 level-conversion chip

Fault caused if damaged:
MHL fault

U2203 operational amplifier-2.5 to 5.5

V-motor power supply
Fault caused if damaged: motor fault

U3101MHL conversion chip

Fault caused if damaged: MHL fault
U300 /U300_POP AP+DDR2
Fault caused if damaged: power
on failure

U1201 audio power amplifier

Fault caused if damaged: Speaker failure

X1000 crystal32 K
Fault caused if damaged: power
on failure

U5603
2.4/5GHz WLAN/Bluetooth 4.0/FM/GPS
four-in-one chip
Fault caused if damaged: WiFi,BT,FM,GPS faults

TCXO1001(26M) main crystal oscilliator

Fault caused if damaged: power on failure
U4102 GSM four-band PA
Fault caused if damaged: Calling fault

U3000: double denoising chips

Fault caused if damaged: No sound
during calling

U4204 RF power module

GSM four-band PA
Fault caused if damaged: TD-SCDMA Band
40 has no or low power to send signals.

U1301 battery fuel gauge

Fault caused if damaged: power
on failure and charging failure

U900 power management chip

Fault caused if damaged:
power on failure
U4401 RF gain module
Fault caused if damaged:
calling failure

2013-04-09

U4001,U4201 RF power module

Fault caused if damaged: UMTS Band
1 has no or low power to send signals.

U4203RF power module

Fault caused if damaged:
TDD-LTE Band 38 has no or low
power to send signals.

Huawei confidential. No spreading without permission.

U4402: RF power module

Fault caused if damaged: LTE Band 7
has no or low power to send signals.

Page 19 of 187

D2 Maintenance Manual

U2501 MODEM Hi6920 BB IC

Fault caused if damaged: 2G
and 3G faults

INTERNAL

U2004 Accelerometer chip

Fault caused if damaged:
Accelerometer fault

U2003 Gyroscope chip

Fault caused if damaged:
Gyroscope fault

J2202 Receiver FPC connector

Fault caused if damaged: No
sound from the receiver, tri-color
indicator3-in-1 light, and
proximity and infrared sensor faults

J1802 Camera connector

Fault caused if damaged: Failure
of the main camera
U1901 charging chip
Fault casused if damaged:
Charging and Wi-Fi/BT faults

TCX100 19.2M
Fault caused if damaged:

Calling failure

J1900 tail plug

Fault caused if damaged: USB/
MHL/charging malfucnction

Z5505 SAW filter

Fault caused if damaged:

Wi-Fi failure

J1601 LCD connector

Fault caused if damaged: LCD
display failure

U5504 RF switch

U1905MHL conversion chip

Fault caused if damaged: MHL
fault

Fault caused if damaged:

Wi-Fi/BT failure

U1600 LCD backlight chip

Fault caused if damaged: LCD
backlight failure
U3901MODEM Hi6360 RF
receiving and sending chip
Fault caused if damaged: 2G
and 3G faults

U800under the shielding

coverGPU Power
Fault caused if damaged: GPU fault

U4301 RF switch
Fault caused if damaged:
Calling failure

U2001 Temperature sensor IC

Fault caused if damaged:
Temperature sensor failure

U4003U4005U4006U44
03U4404 RF duplexer
Fault caused if damaged:
Calling failure

U1601 LCD Voltage driverIC

Fault caused if damaged: LCD
display failure

U4101 RF switch
Fault caused if damaged:
Calling failure

U4302U3903 RF switch
Fault caused if damaged:
Calling failure

U1501 headphone PA
Fault caused if
damaged: No sound
from the headphone and
power on failure

U2900: PMU Hi6451

MODEM PMU
Fault caused if damaged:
2G and 3G faults

J2201 Main FPC connector

Fault caused if damaged:
Power on failure, volume/
speaker/microphone key
malfunction, motor failure

J1301 battery
connectorFault caused if
damaged: power on failure

D2-2010:
U1905MHL conversion chip
Fault caused if damaged: MHL
fault

U1902Analog switch
Fault caused if damaged:
MHL fault

U3101MHL conversion chip

Fault caused if damaged: MHL
fault

U3104 level
conversion chip
Fault caused if
damaged: MHL fault

U3000: Double denoising chips

Fault caused if damaged: No
sound during the call, Bluetooth/
Wi-Fi fault
U3105 1.2V LDO
Fault caused if damaged:
MHL fault

U1101 EMMC
Fault caused if damaged:
Power on failure

U1601 LCD voltage driver IC

Fault caused if damaged: LCD
display failure

U800 GPU Power

Fault caused if damaged:
GPU fault

J1801 secondary camera connector

Fault caused if damaged: Secondary
camera failure

U300 /U300_POP
AP+DDR2
Fault caused if damaged:
Power on failure

U2005 Compass chip

Fault caused if damaged:
Compass failure
U2003 gyroscope chip
Fault caused if damaged:
Gyroscope fault

U900 power management chip

Fault caused if damaged:
Power on failure

U2101U2109 analog switch

and anti-burning card
Fault caused if damaged:
Calling failure

U1501 headphone PA
Fault caused if damaged: No
sound from the headphone and
power-on failure

U4201MCP-1Gb(64M x 16)
NAND FLASH
Fault caused if damaged:
Calling failure

U1201 audio power amplifier

Fault caused if damaged: No
sound from the speaker

TCXO1001(26M) main
crystal oscilliator
Fault caused if damaged:
Power on failure

2013-04-09

X1000 crystal32 K
Fault caused if damaged:
Power on failure

U6501LVCMOS-4BIT automatic
direction identification and level
conversion chip
Fault caused if damaged: MTK6252
modem fault and calling fault

Huawei confidential. No spreading without permission.

U2203 differential operational

amplifier -2.5 to 5.5 V- power
supply for the motor
Fault caused if damaged:
Motor failure

Page 20 of 187

D2 Maintenance Manual
TCXO5601 26M
2.4/5 GHz WLAN/Bluetooth 4.0/FM/
GPS four-in-one chip clock
Fault caused if damaged: WiFi,BT,FM,GPS faults

INTERNAL

U2004 Accelerometer chip

Fault caused if damaged:
Accelerometer fault

U3203 Load switch

Secondary camera DVDD
power supply
Fault caused if damaged:
Camera fault

U3204 DC/DC buck-single output

Primary camera DVDD power supply
Fault caused if damaged: Camera
fault

U2005 COMPASS chip

Fault caused if damaged:
Compass failure

J2202 Receiver FPC connector

Fault caused if damaged: No sound from
the receiver, tri-color indicator3-in-1 light,
and proximity and infrared sensor faults

Z5801 : GPS SAW filter

Fault caused if damaged:
GPS fault

J1901tail plug
Fault caused if damaged: USB/MHL/
charging failure

U5400 : WIFI,GPS duplexor

Fault caused if damaged:
Wi-Fi and GPS faults

J1802 Camera connector

Fault caused if damaged: Primary
camera failure
U5504,U5502 : RF switch
Fault caused if damaged:
Wi-Fi 2.4 GHz fault

J1601 LCD connector

Fault caused if damaged: LCD display failure
U1901 charging chip
Fault caused if damaged: Charging/
WIFI/BT failure

U5501 : RF switch
Fault caused if damaged:
Wi-Fi 5 GHz fault

U5000GSM/GPRS baseband
processing chip MT6252D
Fault caused if damaged: 2G fault

U4302: Temperature
compensated oscillator19.2 MHz, for QSC6085
Fault caused if damaged:
2G and 3G faults

U5301: RF multi-functional
componentFault caused if damaged: 2G fault

U2001 Temperature
sensor IC
Fault caused if damaged:
Temperature sensor fault

U1301 voltameter
Fault caused if damaged: Power on
and charging failure

Z4501SAW filter
Fault caused if damaged:
Calling fault

U700: Baseband
Processor(QSC6085-1)
Fault caused if damaged:
2G and 3 G faults

X5301:26M crystal (for

GSM/GPRS baseband
processing chip
Fault caused if damaged:
2G fault

J2201 Main FPC connector

Fault caused if damaged:
Power on failure, volume/
speaker/microphone key
malfunction, motor failure

J1301 battery
connectorFault caused if
damaged: Power one failure

4.2 PCBA Component List

Table 4-1 D2 Component List
D2-5000:
No.

Part Number

Name

Quantity

Position

-1

03021YFH

Manufactured
Board,D2-5000,HL1D25000M,
D2-5000 Handset Main
Board(16G
ROM/GSM),Terminal
Dedicated,2*2

10

03010TAB

Manufactured
Board-D2-5000-HL1D25000M
-Ascend D2 Handset Main
Board -Terminal
Dedicated-2*2

1.0 PCS

20

8071128

SMD Ceramic
Capacitor-6.3V-1000nF-+/-20
%-X5R-0201-Terminal
Dedicated

92.0 PCS

C1004, C1005, C1026,

C1416, C2261, C2800,
C2802, C2803, C2833,
C3808, C500, C501, C502,

2013-04-09

Huawei confidential. No spreading without permission.

Page 21 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C503, C504, C505, C506,
C507, C508, C509, C510,
C511, C5620, C5621, C5622,
C5623, C5624, C5625,
C5626, C605, C606, C607,
C608, C609, C612, C614,
C615, C616, C617, C618,
C619, C620, C621, C622,
C623, C624, C625, C626,
C627, C628, C629, C630,
C633, C645, C650, C651,
C652, C653, C655, C656,
C657, C658, C659, C660,
C661, C662, C663, C665,
C666, C669, C670, C686,
C687, C707, C708, C709,
C710, C711, C712, C713,
C714, C715, C723, C724,
C725, C726, C727, C734,
C735, C738, C739, C740

30

8070667

SMD Ceramic
Capacitor-6.3V-2200nF-+/-20
%-X5R-0402-TS16949

70.0 PCS

C1001, C1002, C1003,

C1132, C1505, C1526,
C1527, C1814, C1816,
C1818, C2000, C2001,
C2500, C2808, C2809,
C2810, C2811, C2812,
C2813, C2900, C2901,
C2902, C2903, C2905,
C2906, C3101, C3102,
C3116, C3197, C3915,
C3916, C4093, C4095,
C4235, C4236, C600, C602,
C603, C647, C648, C664,
C685, C688, C700, C701,
C733, C901, C902, C903,
C904, C905, C906, C907,
C908, C909, C911, C912,
C913, C914, C915, C916,
C917, C918, C919, C920,
C921, C922, C923, C924,
C925

40

8070783

SMD Ceramic
Capacitor-6.3V-22000nF-+/-20
%-X5R-0603-Terminal
Dedicated

31.0 PCS

C1118, C1119, C1238,

C1908, C1910, C2908,
C2909, C2910, C2948,
C3121, C3202, C4106,
C4125, C601, C636, C642,
C643, C644, C649, C802,
C803, C939, C940, C941,
C942, C944, C946, C948,
C950, C952, C959

50

8070819

SMD Ceramic

26.0 PCS

C1513, C1514, C1515,

2013-04-09

Huawei confidential. No spreading without permission.

Page 22 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Capacitor-6.3V-4700nF-+/-20
%-X5R-0402-Terminal
Dedicated-Terminal Dedicated

Position
C1516, C1611, C1811,
C2012, C2260, C2924,
C2925, C2926, C2950,
C5639, C5640, C604, C610,
C611, C613, C667, C668,
C683, C684, C728, C736,
C737, C910

60

8070692

SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-TS16949

16.0 PCS

C2503, C2930, C2931,

C2932, C2944, C3003,
C3004, C3005, C3122,
C3802, C5646, C632, C635,
C638, C646, C947

70

8070704

SMD Ceramic
Capacitor-6.3V-100nF-+/-10%X5R-0201-TS16949

156.0 PCS

C1021, C1023, C1105,

C1106, C1110, C1111,
C1112, C1113, C1133,
C1236, C1307, C1309,
C1310, C1311, C1312,
C1315, C1319, C1406,
C1407, C1418, C1501,
C1502, C1506, C1602,
C1603, C1633, C1635,
C1636, C1805, C1806,
C1808, C1809, C1815,
C1817, C1819, C1821,
C1822, C1824, C1827,
C1920, C2002, C2003,
C2004, C2005, C2006,
C2015, C2016, C2021,
C2143, C2144, C2145,
C2146, C2216, C2217,
C2241, C2242, C2243,
C2262, C2266, C2401,
C2402, C2419, C2420,
C2421, C2501, C2502,
C2510, C2605, C2814,
C2815, C2816, C2817,
C2818, C2819, C2820,
C2821, C2822, C2823,
C2824, C2825, C2826,
C2827, C2828, C2829,
C2830, C2831, C2832,
C2834, C2835, C2836,
C2838, C2839, C2840,
C2907, C2951, C3105,
C3106, C3107, C3108,
C3110, C3111, C3112,
C3113, C3114, C3115,
C3189, C3905, C4115,
C4123, C4327, C4436,
C5503, C5504, C5605,
C5606, C5607, C5610,
C5611, C5613, C5614,

2013-04-09

Huawei confidential. No spreading without permission.

Page 23 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C5615, C5616, C5632,
C5642, C5643, C634, C639,
C641, C654, C689, C690,
C691, C702, C703, C704,
C705, C706, C716, C717,
C718, C719, C720, C721,
C722, C729, C730, C731,
C732, C800, C801, C804,
C926, C927, C928, C929,
C933

80

8070449

SMD Ceramic
Capacitor-16V-10nF-+/-10%-X
7R-0402-BT,TS16949

1.0 PCS

C637

90

8070676

SMD Ceramic
Capacitor-25V-0.01nF-+/-5%NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

12.0 PCS

C1503, C5505, C5506,

C5507, C5515, C5516,
C5520, C5526, C5527,
C5528, C640, C934

100

8070564

SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0603-BT,TS16949

1.0 PCS

C930

110

8070612

SMD Ceramic
Capacitor-10V-1000nF-+/-10%
-X5R-0402-BT,TS16949

11.0 PCS

C1303, C1904, C1905,

C1909, C3000, C3001,
C3002, C935, C936, C937,
C938

120

8070649

SMD Ceramic
Capacitor-6.3V-10000nF-+/-20
%-X5R-0603-BT,TS16949

18.0 PCS

C1124, C1125, C1632,

C1823, C1903, C2934,
C2936, C2945, C3103,
C3118, C3201, C5635,
C5636, C5637, C5648,
C5649, C949, C951

130

8070703

SMD Ceramic
Capacitor-25V-1nF-+/-10%-X7
R-0201-TS16949

17.0 PCS

C1024, C1104, C1134,

C1301, C2801, C2804,
C2805, C2806, C2807,
C2911, C3804, C3805,
C3806, C3901, C4103,
C5502, C958

140

8070695

SMD Ceramic
Capacitor-25V-0.022nF-+/-5%NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

12.0 PCS

C1010, C1011, C3909,

C3910, C3912, C3913,
C3914, C3917, C3918,
C3919, C3920, L4010

150

8070720

SMD Ceramic
Capacitor-6.3V-1000nF-+/-10
%-X5R-0402-Terminal
Dedicated,TS16949-Terminal
Dedicated

21.0 PCS

C1020, C1025, C1114,

C1528, C1529, C1616,
C1820, C1825, C1826,
C2913, C2914, C2915,
C2916, C2917, C2918,

2013-04-09

Huawei confidential. No spreading without permission.

Page 24 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C2920, C2922, C2923,
C2949, C3117, C5647

160

8070531

SMD Ceramic
Capacitor-50V-1nF-+/-10%-X7
R-0402-BT

1.0 PCS

C1022

170

8070752

SMD Ceramic
Capacitor-6.3V-220nF-+/-20%X5R-0201-Terminal Dedicated

3.0 PCS

C1103, C1601, C5601

180

8070625

SMD Ceramic
Capacitor-6.3V-470nF-+/-10%X5R-0402

3.0 PCS

C1131, C1308, C2103

190

8070817

SMD Ceramic
Capacitor-6.3V-47nF-+/-10%X5R-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1234, C1245

200

8071388

SMD Ceramic
Capacitor-10V-22000nF-+/-20
%-X5R-0805(2.0*1.25*0.95m
m)-Terminal Dedicated

1.0 PCS

C1237

210

8070696

SMD Ceramic
Capacitor-25V-0.1nF-+/-5%-N
PO-0201-TS16949

21.0 PCS

C1243, C1313, C1907,

C3911, C4001, C4003,
C4011, C4012, C4028,
C4029, C4204, C4205,
C4212, C4213, C4223,
C4225, C4406, C4407,
C4415, C4419, C5511

220

8070716

SMD Ceramic
Capacitor-6.3V-33nF-+/-10%X5R-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1306, C3803

230

8070760

SMD Ceramic
Capacitor-25V-0.047nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1314, C1504

240

8020142

Solid SMD Tantalum

Capacitor-6.3V-47uF-+/-20%-0
805-2.0*1.25*1.0mm-200moh
m-Terminal Dedicated

1.0 PCS

C1316

250

8070689

SMD Ceramic
Capacitor-25V-0.033nF-+/-5%NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

147.0 PCS

C1412, C1413, C1414,

C1417, C1508, C1509,
C1531, C1604, C1605,
C1606, C1620, C1621,
C1623, C2022, C2023,
C2024, C2025, C2028,
C2029, C2106, C2122,
C2124, C2142, C2201,

2013-04-09

Huawei confidential. No spreading without permission.

Page 25 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C2202, C2203, C2205,
C2206, C2207, C2208,
C2209, C2210, C2211,
C2212, C2213, C2214,
C2244, C2245, C2246,
C2265, C2403, C2405,
C2406, C2407, C2408,
C2409, C2411, C2412,
C2413, C2414, C2415,
C2416, C2417, C2418,
C2927, C2943, C3807,
C3925, C3926, C3927,
C3931, C3932, C3951,
C4004, C4006, C4007,
C4008, C4025, C4026,
C4027, C4038, C4039,
C4072, C4089, C4094,
C4096, C4097, C4107,
C4108, C4110, C4111,
C4112, C4113, C4114,
C4116, C4117, C4118,
C4119, C4120, C4121,
C4127, C4128, C4129,
C4130, C4135, C4201,
C4202, C4203, C4210,
C4217, C4221, C4222,
C4224, C4226, C4227,
C4232, C4233, C4234,
C4292, C4293, C4294,
C4295, C4304, C4305,
C4306, C4307, C4309,
C4319, C4320, C4322,
C4328, C4329, C4330,
C4331, C4332, C4333,
C4334, C4335, C4336,
C4342, C4401, C4402,
C4403, C4404, C4410,
C4413, C4414, C4417,
C4425, C4426, C4433,
C4434, C4437, C4438,
C5523, L4225, L4226

260

8070450

SMD Ceramic
Capacitor-50V-0.1nF-+/-5%-N
PO-0402-BT

1.0 PCS

C1525

270

8070713

SMD Ceramic
Capacitor-6.3V-22nF-+/-10%X5R-0201

1.0 PCS

C1530

280

8070735

SMD Ceramic
Capacitor-50V-1000nF-+/-10%
-X5R-0805-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C1610

2013-04-09

Huawei confidential. No spreading without permission.

Page 26 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

290

8070780

SMD Ceramic
Capacitor-10V-10000nF-+/-10
%-X5R-0805-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

C1628, C1629, C1812

300

8070547

SMD Ceramic
Capacitor-50V-0.033nF-+/-5%NP0-0402-BT

1.0 PCS

C1634

310

8070789

SMD Ceramic
Capacitor-25V-0.0056nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated

22.0 PCS

C1801, C1802, C1803,

C1804, C1807, C1810,
C1846, C1847, C1848,
C1849, C1850, C1851,
C1852, C1853, C1864,
C1865, C1866, C1867,
C1868, C1869, C1872,
C1873

320

8070583

SMD Ceramic
Capacitor-10V-47nF-+/-10%-X
7R-0402

1.0 PCS

C1901

330

8070785

SMD Ceramic
Capacitor-10V-4700nF-+/-10%
-X5R-0603-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

C1906, C2837, C2933

340

8071463

SMD Ceramic
Capacitor-16V-2200nF-+/-20%
-X5R-0402(1.0*0.5*0.6mm)-H
max=0.6mm-Terminal
Dedicated

1.0 PCS

C1911

350

8070970

SMD Ceramic
Capacitor-50V-10nF-10%-X7R
-0402-Terminal Dedicated

1.0 PCS

C2011

360

8070711

SMD Ceramic
Capacitor-16V-2.2nF-+/-10%X7R-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C2504

370

8070746

SMD Ceramic
Capacitor-25V-0.003nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

4.0 PCS

C3902, C3903, C3935,

C3936

380

8070966

SMD Ceramic
Capacitor-4V-470nF-+/-20%-X
5R-0201-Terminal Dedicated

5.0 PCS

C3906, C3907, C3908,

C3921, C3922

390

10100118

Mobile Dedicated,Chip
Inductor-0.0056uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

C3928, C4104

2013-04-09

Huawei confidential. No spreading without permission.

Page 27 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

400

8070743

SMD Ceramic
Capacitor-25V-0.0015nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

3.0 PCS

C3933, C3934, C4301

410

10100110

Mobile Dedicated,Chip
Inductor-0.0027uH-+/-0.3nH-0.
2A-0.25ohm-201

1.0 PCS

C4030

420

10100105

Mobile Dedicated,Chip
Inductor-0.0015uH-+/-0.3nH-0.
23A-0.18ohm-201-Terminal
Dedicated

2.0 PCS

C4079, L4132

430

10100103

Mobile Dedicated,Chip
Inductor-0.001uH-+/-0.3nH-0.2
5A-0.14ohm-201-TS16949-Ter
minal Dedicated

3.0 PCS

C4098, C4105, C4215

440

8070740

SMD Ceramic
Capacitor-25V-0.0005nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

3.0 PCS

C4102, L4296, L5401

450

8070707

SMD Ceramic
Capacitor-25V-0.68nF-+/-10%X7R-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C4109

460

10100124

Mobile Dedicated,Chip
Inductor-0.01uH-+/-5%-0.15A0.63ohm-201-TS16949-Termin
al Dedicated

6.0 PCS

C4220, L3901, L4303,

L4304, L4404, L4405

470

8070712

SMD Ceramic
Capacitor-25V-0.015nF-+/-5%NP0-0201

4.0 PCS

C4286, C4287, L4411,

L4412

480

8070950

SMD Ceramic
Capacitor-25V-0.018nF-+/-5%C0G-0.6mm*0.3mm*0.3mm-T
erminal Dedicated

8.0 PCS

C4289, C4291, C5402,

C5403, C5404, C5512,
C5522, C5529

490

8070741

SMD Ceramic
Capacitor-25V-0.001nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C4298, C5641

500

10100126

Mobile Dedicated,Chip
Inductor,
0.015uH,+/-5%,0.10A,0.70ohm
,0201,Chip Inductor,Mobile
Dedicated

2.0 PCS

C4299, L4131

2013-04-09

Huawei confidential. No spreading without permission.

Page 28 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

510

8070753

SMD Ceramic
Capacitor-25V-0.0082nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated

3.0 PCS

C4317, C4408, C4422

520

10100117

Mobile Dedicated,Chip
Inductor-0.0051uH-+/-0.3nH-0.
15A-0.4ohm-201

7.0 PCS

C4325, L4023, L4222,

L4223, L4310, L4311, L4406

530

10100116

Mobile Dedicated,Chip
Inductor-0.0047uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated

3.0 PCS

C4337, L4129, L5506

540

10100125

Mobile Dedicated,Chip
Inductor-0.012uH-+/-5%-0.1A0.7ohm-201-TS16949-Termina
l Dedicated

1.0 PCS

C4412

550

10100115

Mobile Dedicated,Chip
Inductor-0.0043uH-+/-0.3nH-0.
15A-0.4ohm-201

3.0 PCS

C4439, L4004, L4005

560

8070754

SMD Ceramic
Capacitor-25V-0.039nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5501

570

7090911

Chip Thick Film

Resistor-0.05W-0ohm-< 50m
ohm-0201-ELOM,TS16949

84.0 PCS

C5530, R1007, R1013,

R1014, R1223, R1301,
R1313, R1314, R1402,
R1403, R1408, R1409,
R1502, R1622, R1811,
R1814, R1817, R1821,
R1823, R1825, R1828,
R1830, R1831, R1832,
R1932, R1934, R1937,
R2002, R2003, R2006,
R2014, R2015, R2016,
R2017, R2018, R2131,
R2409, R2516, R2518,
R2519, R2742, R2743,
R2744, R2745, R2804,
R2805, R2906, R2911,
R2912, R2913, R2914,
R2915, R2916, R2917,
R2918, R3003, R3009,
R3010, R3012, R3013,
R3018, R306, R3113, R3126,
R3130, R3131, R4301, R524,
R525, R5402, R5403, R5501,
R5507, R5508, R5514,
R5609, R5621, R5629,
R5642, R5650, R5651,

2013-04-09

Huawei confidential. No spreading without permission.

Page 29 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
R5655, R5657, R911

580

8070700

SMD Ceramic
Capacitor-25V-0.068nF-+/-5%NP0-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5603

590

8070751

SMD Ceramic
Capacitor-25V-0.027nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5619

600

15040311

Transient Suppression
Diode-6V-12V-50W-5A-SOD9
23-Terminal Dedicated

3.0 PCS

D1301, D1302, D1903

610

15040339

Transient Suppression
Diode-6V-12V-30W-3A-0201Terminal Dedicated

11.0 PCS

D1406, D1601, D1602,

D2101, D2102, D2104,
D2201, D2202, D2240,
D2241, D2242

620

15010262

Switching
Diode-75V-200mA-1V-SOD-5
23

1.0 PCS

D1600

630

15010248

Schottky
diode-30V-0.2A-0.5V-SOD-52
3-1A

1.0 PCS

D2901

640

15010365

Schottky
Diode,30V,0.3A,0.3V,SOD882
,Automotive Grade,Terminal
Dedicated

1.0 PCS

D2902

650

19040169

Protection Tube,Fast Blowout

Fuse,24V,3A,IEC
Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal
Dedicated

1.0 PCS

F1900

660

51623884

BOT-SHIELD-COVER-3-YDT9800L

1.0 PCS

F2401

670

51623897

BOT-SHIELD-COVER-1-YDT9800L

1.0 PCS

F2402

680

51623898

BOT-SHIELD-COVER-2-YDT9800L

1.0 PCS

F2403

690

51623900

Sim-rail2-T9800L

1.0 PCS

F2405

700

51623877

BOT-SHIEDLING-FRAME-2YD-T9800L

1.0 PCS

F2406

710

51623899

TOP-SHIELD
FRAME-1-YD-T9800L

1.0 PCS

F2407

2013-04-09

Huawei confidential. No spreading without permission.

Page 30 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

720

51623879

B-Camera-nut-C9800D

1.0 PCS

F2408

730

51623883

PCB-Steel-C9800D

1.0 PCS

F2409

740

14240576

Card Block Connector,BTF

Connector,3*2,Female,1.3mm,
Terminal Dedicated

2.0 PCS

J1301, J1900

750

14240375

BTB
Connector,female,40Pin,0.4m
m,0.8mm,SMT,Terminal
Dedicated

1.0 PCS

J1601

760

14240496

BTB
Connector,Female,24Pin,0.4m
m,SMT,Mating Height
0.8mm,Terminal Dedicated

2.0 PCS

J1801, J2201

770

14240579

BTB
Connector,BTBconnector,34PI
N,0.4mm,0.8mm,SMT,female,
Terminal Dedicated

1.0 PCS

J1802

780

14240155

Card Socket Connector,SIM

Card
Socket,6pin,Horizontal,2.54m
m,Without Lock,Without Hold
Peg,Height 0.95mm,Terminal
Dedicated

1.0 PCS

J2102

790

14240460

BTB
Connector,female,10Pin,0.4m
m,0.9mm,SMT,Terminal
Dedicated

1.0 PCS

J2202

800

14240655

RF Connector,RF
Switch,Straight,female,SMT,S
plit from 14240432,Terminal
Dedicated

4.0 PCS

J4101, J4301, J5501, J5502

810

14240433

RF Connector,Coaxial
Connector,50ohm,Straight,mal
e,SMT,W.FL2,PCN
Control,Terminal Dedicated

1.0 PCS

J4102

820

51623882

Antenna-contact-C9800D

6.0 PCS

J4302, J4304, J5401, J5503,

J5506, J5507

830

51621023

108-5785,Ground
Spring,U1250

2.0 PCS

J5504, J5509

840

51621024

WN9149-N83-7F-W,Antenna
Spring,U1250

1.0 PCS

J5508

850

10100051

Mobile Dedicated,EMI beads,

600ohm+/-25%,0.2A,0.65ohm,

12.0 PCS

L1502, L1910, L2801,

L3101, L3102, L3105, L600,

2013-04-09

Huawei confidential. No spreading without permission.

Page 31 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

0402,BT,Terminal Dedicated

Position
L601, L602, L603, L604,
L605

860

10100541

Terminal Power
Inductor,0.47uH,+/-30%,3.4A,
0.039ohm,2.5*2.0*1.2mm,100
8,3.8A,High Current
Inductor,Terminal Dedicated

1.0 PCS

L800

870

10100175

Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-2A-0.1
15ohm-2.5*2.0*1.2mm

2.0 PCS

L900, L901

880

10100473

Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-1.9A-0
.117ohm-2.5*2.0*1.2mm-Term
inal Dedicated

11.0 PCS

L1210, L1601, L1803,

L2900, L2902, L2903,
L2904, L2905, L903, L904,
L905

890

10100147

SMT Power
Inductors,22uH,20%,0.42A,0.7
56ohm,3*3*1.2mm,Terminal
Dedicated

1.0 PCS

L1600

900

7090800

Chip Thick Film

Resistor-0.0625W-0ohm-<
50mohm-0402-1A-BT

17.0 PCS

L1804, L1805, L1806,

R1102, R1105, R1605,
R1634, R1919, R1943,
R2101, R2102, R2268,
R2269, R3112, R5632,
R5658, R702

910

10100539

Terminal Chip
Inductor,1uH,+/-30%,2.7A,0.0
59ohm,2.5*2.0*1.2mm,3A,PM
IC,Apart from
10100353,Inductor,Terminal
Dedicated

1.0 PCS

L1901

920

10100168

Special Inductor and

Bead,Power
Inductor,4.7uH,-+/-20%,0.8A,0
.18ohm,2.5*2.0*1.2mm,25MH
z,Terminal Dedicated

1.0 PCS

L2901

930

10100328

Terminal Chip
Inductor,1uH,+/-30%,1.58A,0.
102ohm,2.5*2.0*1.2mm(comp
atible with
2.4*2.4*1.2mm),Terminal
Dedicated

4.0 PCS

L2906, L3103, L3201, L5608

940

10100119

Terminal Chip Inductor,

0.0062uH,+/-5%,0.15A,0.44oh
m,0201,EAR99.Chip Inductor

2.0 PCS

L4011, L4012

950

10100128

Mobile Dedicated,Chip
Inductor-0.022uH-+/-5%-0.1A-

2.0 PCS

L4013, L4014

2013-04-09

Huawei confidential. No spreading without permission.

Page 32 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

1.2ohm-201-TS16949-Termina
l Dedicated
960

8070744

SMD Ceramic
Capacitor-25V-0.0018nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated

1.0 PCS

L4022

970

10100121

Mobile Dedicated,Chip
Inductor-0.0075uH-+/-5%-0.15
A-0.53ohm-201-TS16949-Ter
minal Dedicated

1.0 PCS

L4024

980

10100122

Mobile Dedicated,Chip
Inductor-0.0082uH-+/-5%-0.15
A-0.55ohm-201-TS16949-Ter
minal Dedicated

13.0 PCS

L4025, L4026, L4201,

L4228, L4230, L4287,
L4288, L4291, L4292,
L4299, L4402, L4408, L5607

990

10100113

Mobile Dedicated,Chip
Inductor,
0.0036uH,+/-0.3nH,0.17A,0.30
ohm,0201,Chip
Inductor,Mobile Dedicated

1.0 PCS

L4102

1000

10100134

Mobile Dedicated,Chip
Inductor,
0.068uH,+/-5%,0.05A,3.00ohm
,0201,Chip Inductor,Mobile
Dedicated

2.0 PCS

L4107, L4113

1010

10100107

Mobile Dedicated,Chip
Inductor-0.002uH-+/-0.3nH-0.2
A-0.2ohm-201-TS16949-Termi
nal Dedicated

2.0 PCS

L4127, L4128

1020

10100120

Mobile Dedicated,Chip
Inductor-0.0068uH-+/-5%-0.15
A-0.48ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

L4133, R4102

1030

10100106

Mobile Dedicated,Chip
Inductor-0.0018uH-+/-0.3nH-0.
2A-0.19ohm-201-TS16949-Ter
minal Dedicated

4.0 PCS

L4204, L4224, L4231, L4413

1040

10100108

Mobile Dedicated,Chip
Inductor-0.0022uH-+/-0.3nH-0.
2A-0.22ohm-201

1.0 PCS

L4295

1050

10100112

Mobile Dedicated,Chip
Inductor-0.0033uH-+/-0.3nH-0.
18A-0.3ohm-201-TS16949-Ter
minal Dedicated

3.0 PCS

L4297, L4312, L4313

1060

10100111

Mobile Dedicated,Chip
Inductor,

2.0 PCS

L4305, L4306

2013-04-09

Huawei confidential. No spreading without permission.

Page 33 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

0.003uH,+/-0.3nH,0.18A,0.28o
hm,0201,Chip Inductor,Mobile
Dedicat
1070

10100123

Mobile Dedicated,Chip
Inductor-0.0091uH-+/-5%-0.15
A-0.62ohm-201

1.0 PCS

L4410

1080

10100127

Mobile Dedicated,Chip
Inductor-0.018uH-+/-5%-0.1A0.9ohm-201

1.0 PCS

L4415

1090

10100153

Mobile Dedicated,Chip
Inductor-0.003uH-+/-0.3nH-0.3
A-0.17ohm-0402

1.0 PCS

L5504

1100

10100280

Mobile Dedicated,Chip
Inductor-0.18uH-+/-5%-0.1A-3
.8ohm-1.0*0.5*0.55mm-0402500000000Hz-Terminal
Dedicated

1.0 PCS

L5603

1110

10100185

Mobile Dedicated,Chip
Inductor-2.2uH-+/-20%-0.97A0.19ohm-2.5*2.0*1.0mm

1.0 PCS

L5604

1120

10100350

Mobile Dedicated,Chip
Inductor-0.47uH-+/-30%-1.6A0.075ohm-2.0*1.6*1.0mm-Ter
minal Dedicated

1.0 PCS

L5606

1130

10100150

ZD Dedicated Inductor and

Bead,EMI
Bead,330ohm@100MHZ,25%,
1.5A,0.08ohm,0603,Terminal
Dedicated

1.0 PCS

LB1201

1140

10070019

EMI
beads,+/-25%,1000ohm,1.25oh
m,0.25A,0402

7.0 PCS

LB1601, LB1602, LB1603,

LB1604, LB1605, LB2204,
LB2205

1150

10100507

Terminal EMI
beads,220ohm,25%,3A,0.04oh
m,0805,@30~500M
Impedance>120ohm,Terminal
Dedicated

1.0 PCS

LB1900

1160

10100184

Terminal EMI
beads-1800ohm-25%-0.2A-2.2
ohm-0402-Terminal Dedicated

3.0 PCS

LB2206, LB2207, LB2208

1170

10100100

Terminal EMI
beads-80ohm-25%-0.2A-0.4oh
m-0201-110ohm
tpy@1GHz,murata
70ohm@100MHz-Terminal

1.0 PCS

LB2802

2013-04-09

Huawei confidential. No spreading without permission.

Page 34 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Dedicated
1180

10100075

Mobile Dedicated,Chip
Inductor-0.0062uH-+/-0.2nH-0.
7A-0.09ohm-1.19*0.7*0.66
max
mm-4800000000Hz-Terminal
Dedicated

1.0 PCS

LB5501

1190

15020235

LED,240cd,white,500mA,Ter
minal Dedicated,Flash LED

1.0 PCS

LED1801

1200

22050075

Microphone,-42dB.,3.76*2.95*
1.1mm,silicon

1.0 PCS

MIC1402

1210

15060238

MOSFET,N
Channel,20V,0.7A,530mohm,6
V,SC,75

1.0 PCS

Q2901

1220

7092269

Chip Thick Film

Resistor-0.05W-1800ohm-+/-1
%-0201(0.6*0.3*0.23mm)-Ter
minal Dedicated

1.0 PCS

R300

1230

7092050

Chip Thick Film

Resistor-0.05W-200ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated

2.0 PCS

R2700, R301

1240

7091300

Chip Thick Film

Resistor-0.05W-6040ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

3.0 PCS

R302, R303, R304

1250

7091298

Chip Thick Film

Resistor-0.05W-4700ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated

9.0 PCS

R1104, R2113, R2140,

R3011, R3014, R3198,
R3199, R400, R5661

1260

7091150

Chip Thick Film

Resistor-0.05W-22ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R405

1270

7091161

Chip Thick Film

Resistor-0.05W-2000ohm-+/-5
%-0201-Terminal
Dedicated-Terminal Dedicated

4.0 PCS

R1812, R1813, R406, R407

1280

7091172

Chip Thick Film

Resistor-0.05W-22000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

14.0 PCS

R2603, R2604, R500, R501,

R502, R503, R504, R505,
R506, R507, R508, R509,
R510, R511

2013-04-09

Huawei confidential. No spreading without permission.

Page 35 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1290

7092051

Chip Thick Film

Resistor-0.05W-240ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated

5.0 PCS

R2602, R512, R513, R514,

R515

1300

7091159

Chip Thick Film

Resistor-0.05W-1000ohm-+/-5
%-0201-ELOM,TS16949

26.0 PCS

R1311, R2141, R2142,

R2143, R2401, R2510,
R2511, R2521, R2706,
R2707, R2708, R2710,
R2720, R2722, R2733,
R2734, R2909, R3802,
R4107, R4108, R4109,
R4110, R516, R517, R518,
R519

1310

7091408

Chip Thick Film

Resistor-0.05W-68000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

R1008, R900

1320

7090875

Chip Thick Film

Resistor-0.0625W-100000ohm+/-1%-0402

1.0 PCS

R901

1330

7092053

Chip Thick Film

Resistor-0.05W-1000000ohm+/-1%-0.6mm*0.3mm*0.23mm
-Terminal Dedicated-Terminal
Dedicated

1.0 PCS

R902

1340

7090823

Chip Thick Film

Resistor-0.0625W-180000ohm+/-1%-0402

1.0 PCS

R903

1350

7091256

Chip Thick Film

Resistor-0.05W-33ohm-+/-5%0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

R5626, R907, R908

1360

7091246

Chip Thick Film

Resistor-0.05W-100000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated

12.0 PCS

R1000, R1101, R1633,

R1637, R1929, R1933,
R1935, R2138, R2264,
R2933, R3201, R3230

1370

7091405

Chip Thick Film

Resistor-0.05W-56000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

R1001, R1002, R3901

1380

7091016

Chip Thick Film

Resistor-0.05W-7320ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R1004

1390

7091169

Chip Thick Film

Resistor-0.05W-10000ohm-+/-

18.0 PCS

R1010, R1011, R1514,

R1639, R1640, R1808,

2013-04-09

Huawei confidential. No spreading without permission.

Page 36 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

Position
R1809, R1910, R2012,
R2514, R2926, R3104,
R3121, R3132, R3195,
R3197, R3902, R5647

1400

7091301

Chip Thick Film

Resistor-0.05W-10000ohm-+/1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

11.0 PCS

R1103, R1939, R1940,

R2112, R2605, R2732,
R2747, R2904, R2905,
R2910, R3008

1410

7091175

Chip Thick Film

Resistor-0.05W-100000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated

6.0 PCS

R1226, R1231, R1505,

R1512, R1901, R1947

1420

7091380

Chip Thick Film

Resistor-0.0625W-39200ohm+/-1%-0402

1.0 PCS

R1232

1430

7090858

Chip Thick Film

Resistor-0.0625W-2000000oh
m-+/-1%-0402

1.0 PCS

R1302

1440

7091783

Chip Thick Film

Resistor-0.2W-0.01ohm-+/-1%
-0603

1.0 PCS

R1303

1450

7091155

Chip Thick Film

Resistor-0.05W-100ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

5.0 PCS

R1309, R1310, R2418,

R2419, R2902

1460

7090796

Chip Thick Film

Resistor-0.0625W-18000ohm+/-5%-0402

1.0 PCS

R1312

1470

7091162

Chip Thick Film

Resistor-0.05W-2200ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R1501

1480

7091393

Chip Thick Film

Resistor-0.0625W-301000ohm+/-1%-0402

1.0 PCS

R1603

1490

7091389

Chip Thick Film

Resistor-0.0625W-91000ohm+/-1%-0402

1.0 PCS

R1604

1500

7091395

Chip Thick Film

Resistor-0.0625W-392000ohm+/-1%-0402

1.0 PCS

R1611

1510

7091148

Chip Thick Film

Resistor-0.05W-10ohm-+/-5%-

2.0 PCS

R1638, R3801

2013-04-09

Huawei confidential. No spreading without permission.

Page 37 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

0201-Terminal
Dedicated,TS16949-Terminal
Dedicated
1520

7092272

Chip Thick Film

Resistor-0.05W-180ohm-1%-0
201(0.6*0.3*0.23mm)-Termina
l Dedicated

1.0 PCS

R1907

1530

7091174

Chip Thick Film

Resistor-0.05W-51000ohm-+/5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R2005

1540

7090867

Chip Thick Film

Resistor-0.0625W-10000ohm+/-1%-0402-BT

1.0 PCS

R2013

1550

7091153

Chip Thick Film

Resistor-0.05W-51ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

5.0 PCS

R2240, R2241, R2242,

R4007, R5401

1560

7091350

Chip Thick Film

Resistor-0.0625W-1500ohm-+/
-1%-0402-BT

1.0 PCS

R2266

1570

7091378

Chip Thick Film

Resistor-0.0625W-27400ohm+/-1%-0402

1.0 PCS

R2267

1580

7090798

Chip Thick Film

Resistor-0.0625W-22000ohm+/-1%-0402

2.0 PCS

R2508, R3203

1590

7091409

Chip Thick Film

Resistor-0.05W-150000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

R2520, R4105

1600

7090857

Chip Thick Film

Resistor-0.0625W-1000000oh
m-+/-1%-0402

2.0 PCS

R2900, R3109

1610

7091250

Chip Thick Film

Resistor-0.05W-12000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R2903

1620

7091302

Chip Thick Film

Resistor-0.05W-51000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R2922

2013-04-09

Huawei confidential. No spreading without permission.

Page 38 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1630

7091176

Chip Thick Film

Resistor-0.05W-121000ohm-+/
-1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R2923

1640

7091177

Chip Thick Film

Resistor-0.05W-180000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R2934

1650

7091384

Chip Thick Film

Resistor-0.0625W-51000ohm+/-1%-0402

1.0 PCS

R3128

1660

7090892

Chip Thick Film

Resistor-0.0625W-30000ohm+/-1%-0402

2.0 PCS

R3129, R3202

1670

7091152

Chip Thick Film

Resistor-0.05W-47ohm-+/-5%0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4004

1680

7091253

Chip Thick Film

Resistor-0.05W-120ohm-+/-5%
-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

R4005, R4006

1690

7091158

Chip Thick Film

Resistor-0.05W-390ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4101

1700

8070749

SMD Ceramic
Capacitor-25V-0.0047nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R5513

1710

7050106

NTC-220000ohm-NTC-0402-1
.0*0.5*0.5mm-Terminal
Dedicated

1.0 PCS

RT1801

1720

7050063

NTC-150000ohm-SMT-0402Terminal Dedicated

2.0 PCS

RT2501, RT4101

1730

7040075

Varistor-18V-14V-10A-40V-S
MT-0402-Terminal Dedicated

1.0 PCS

RV1900

1740

16100067

Tact
Switch,SPDT,DC,SMT,0.4mm,
5.65*3.5*0.9,5000,Terminal
Dedicated

1.0 PCS

S2101

1750

10100527

Terminal Common Mode

8.0 PCS

T1801, T1802, T1803,

2013-04-09

Huawei confidential. No spreading without permission.

Page 39 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Inductor,28ohm,+/-20%,5V,0.1
A,
2.5ohm,03025,0.85*0.65*0.45(
mm),TAIYO YUDEN
12ohm@100M;TDK
35ohm@100M,Terminal
Dedicated

Position
T1804, T1805, T1806,
T1807, T1808

1760

10100331

Terminal Common Mode

Inductor,40ohm,+/-25%,5V,0.1
A,1.625ohm,1.25*1.0*0.5(mm)
,Terminal Dedicated

1.0 PCS

T1901

1770

10100564

Terminal Com-mode
Inductor,45ohm,+/-25%,5V,0.1
A,2.5ohm,0504,1.25mm*1.0m
m*0.65mm,USB D+/DApplication

1.0 PCS

T1902

1780

12070055

Temperature Compensated
Oscillator,19.2MHz,+/-2.5ppm,
2.8V,+/-2.0ppm,-30degC,85de
gC,Terminal Dedicated

1.0 PCS

TCXO100

1790

12070038

Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(
max),+1.8V,+/-0.5ppm(max),-4
0degC,85degC,Terminal
Dedicated

2.0 PCS

TCXO1001, TCXO5601

1800

35020171

Consumption
Chip,Hi3620GFCV111G15,FC
CSP
576,1.1/1.2/1.8/2.6/3.3V,Appli
cation processor

1.0 PCS

U300

1810

40020168

DDR2 DRAM-16Gb
LPDDR2-533MHz-32bit-1.8V/
1.2V-216BALL
FBGA(POP)-Terminal
Dedicated

1.0 PCS

U300_POP

1820

39110780

Switching Regulators-DC/DC
buck for
GPU-2.5V-5.5V-4000mA-2.5
MHz-CSP16-Terminal
Dedicated

1.0 PCS

U800

1830

35020158

Consumer
Chips-Hi6421GFCV231-FCCS
P189-1.8/3.3/4.2V-K3 PMU
and Codec chip

1.0 PCS

U900

1840

40060418

MCP-32GB(32Gbx8)
EMMC-52MHz-3.3/1.8V-FBG
A169-1Gb(32Mbx32)

1.0 PCS

U1102

2013-04-09

Huawei confidential. No spreading without permission.

Page 40 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

LPDDR-Terminal Dedicated
1850

38020077

Analog Switch,one input one

output Load
switch,1.1V~3.6V-1.8Vinput,<
55mohm;1.2Vinput,<90mohm,
WLCSP4,Terminal Dedicated

2.0 PCS

U1103, U3203

1860

39080180

Operation Amplifier,Audio
Power
Amplifier,2.5V~5.5V,Differenc
ial,Micro SMD
16pin(WLCSP),Terminal
Dedicated

1.0 PCS

U1201

1870

39070073

-0.3~2.75V,Battery
Gauge,SON,Terminal
Dedicated

1.0 PCS

U1301

1880

39080124

Operation
Amplifier,Headphone Audio
Power Amplifier,2.3 V to 5.5
V,differential AB
Amplifier,QFN,Terminal
Dedicated

1.0 PCS

U1501

1890

39110626

Switching
Regulators-Vin~38V-0.02A-Q
FN-2*2-SMT-2*2-10 LED
Driver, Terminal Dedicated

1.0 PCS

U1600

1900

39110636

Switching
Regulators-ThinQFN-LCD
Driver-Terminal Dedicated

1.0 PCS

U1601

1910

39110620

Power Driver,1.5A LED flash

driver IC,CSP,Terminal
Dedicated

1.0 PCS

U1800

1920

39070149

Battery Management IC-charge

IC-buck-3A input
ability-3.9V-6.5V-QFN-24-OT
G-Terminal Dedicated

1.0 PCS

U1901

1930

38020071

Analog Switch,double-pole,
triple throw (DP3T)
multiplexer,2.5V-4.5V,<6.6oh
m,1470MHz,QFN12,Terminal
Dedicated

1.0 PCS

U1905

1940

33030026

Temperature
Sensor,-40~+125degC,1.4V~2.
75V,Digital
Output,+/-1degC,DFN,60000us
,NA,12bit,IIC,Terminal
Dedicated

1.0 PCS

U2001

2013-04-09

Huawei confidential. No spreading without permission.

Page 41 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1950

38140103

Semiconductor Sensor,three
axis
gyroscope,LGA-16,Terminal
Dedicated

1.0 PCS

U2003

1960

38140098

Semiconductor
Sensor,Accelerometer,LGA,3a
xis,Terminal Dedicated

1.0 PCS

U2004

1970

38140069

Semiconductor
Sensor,E-Compass,WLCSP(Pb
-free),3axis,Terminal
Dedicated

1.0 PCS

U2005

1980

38020072

Bi-directional,4PDT,
1.65-4.3V ,Rond(max)<12ohm
;Ronv<0.7ohm-160MHz-UML
P, Terminal Dedicated

1.0 PCS

U2101

1990

36020419

CMOS,Dual
Reverse,QFN,33.6ns,20mA,C
MOS,CMOS, Terminal
Dedicated

1.0 PCS

U2103

2000

39080185

Operation Amplifier, Linear

Motor
Driver,2.5~5.5V,Differential, 9
Ball 0.5mm Pitch
WCSP,Terminal Dedicated

1.0 PCS

U2203

2010

35020149

Consumption
Chip,Hi6920GFCV100,FBGA
520,1.1/1.8/2.5,LTE,WCDMA/
GSM

1.0 PCS

U2501

2020

35020150

Chip,Hi6451GBCV110,BGA1
04,5V,Power management unit

1.0 PCS

U2900

2030

39110756

Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,D
FN/QFN

3.0 PCS

U2901, U3105, U3201

2040

43110067

AUDIO Chip,2 digital

microphones/4 Digital Audio
Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal
Dedicated

1.0 PCS

U3000

2050

43090148

VIDEO Chip,49
VFBGA,1.2V/1.8V/3.3V,HDM
I&USB 2in1,1080p/60Hz,
Terminal Dedicated

1.0 PCS

U3101

2060

39110548

LDO-3.3V-2%-0.15A-SC70-5Terminal Dedicated-Terminal
Dedicated

1.0 PCS

U3104

2013-04-09

Huawei confidential. No spreading without permission.

Page 42 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

2070

35020147

Consumer-Hi6360RBCV210-V
FBGA-2.2V/1.8V/1.2V-2G/3G
/4G multi mode multi band RF
Transceiver

1.0 PCS

U3901

2080

47140042

0.5~3GHz,SPDT,0.46,22,TSS
ON,Terminal Dedicated

2.0 PCS

U3902, U3905

2090

47140068

RF
Switch,400~3000MHz,DPDT,0
.25~0.7dB,1.5:1,26dB,QFN,10
00V

2.0 PCS

U3903, U4302

2100

47100500

RF Power Amplifying
Module,1920MHz~1980MHz,2
9.5dB
max.,28.25dBm,QFN,Terminal
Dedicated

2.0 PCS

U4001, U4201

2110

47100375

RF Power Amplifying
Module,1850~1910,28,27.5dB
m,QFN,1000v

1.0 PCS

U4002

2120

13080130

Duplexer,RX:1930-1990MHz/
TX:1850-1910MHz,2.7dB.,3.3
dB.,-45dB.,2520,Terminal
Dedicated

1.0 PCS

U4003

2130

47100387

RF Power Amplifying
Module,880MHz~915MHz,28/
18/11,QFN,1000V

1.0 PCS

U4004

2140

13080104

Duplexer,TX:880MHz~915M
Hz/RX:925MHz~960MHz,3dB
.,3dB.,55dB/50dB.,2520,Termi
nal Dedicated

1.0 PCS

U4005

2150

13080038

Duplexer,RX:2110~2170MHz/
TX:1920~1980MHz,1.9dB(ma
x),2.6dB(max),55dB/46dB(min
),2.5*2.0*0.9mm, Terminal
Dedicated

1.0 PCS

U4006

2160

47140112

RF
Switch,700M~2700MHz,SP14
T,0.5dB(900MHz)/0.8dB(2100
MHz)/1.0dB(2700MHz),25dB.,
LGA,Terminal Dedicated

1.0 PCS

U4101

2170

47100348

RF Power Amplifying
Module,824MHz~849MHz/88
0MHz~915MHz/1710MHz~17
85MHz/1850MHz~1910MHz,3
3.5,35dBm,LGA

1.0 PCS

U4102

2180

47100449

RF Power Amplifying

1.0 PCS

U4203

2013-04-09

Huawei confidential. No spreading without permission.

Page 43 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Module,2570MHz~2620MHz,2
8dB,28dBm,QFN,500V
2190

47100380

Power
Module,2300-2400MHz,28dB,
28dBm,QFN,1000V,Terminal
Dedicated

1.0 PCS

U4204

2200

47140045

RF
Switch-0.5~2.5GHz-SP4T-0.95
-15dB.-QFN

1.0 PCS

U4301

2210

47100305

Power Module,
824MHz~849MHz,27dB,28.5d
Bm,QFN,2000V,Terminal
Dedicated

1.0 PCS

U4401

2220

47100353

RF Power Amplifying
Module,2500-2570MHz,28,31d
Bm,QFN,1000V

1.0 PCS

U4402

2230

13080037

Duplexer,TX:824~849MHz;R
X:869~894MHz,1.7dB(typ),2.0
dB(typ),60dB/53dB(typ),2520,
Terminal Dedicated,TS16949

1.0 PCS

U4403

2240

13080162

Duplexer,TX:2500-2570MHz/
RX:2620-2690MHz,2.5dB.,2.5
dB.,-50dB.,-2016.,Terminal
Dedicated-Unbalance-FBAR

1.0 PCS

U4404

2250

47140111

RF
Switch-700~2700MHz-DP6T-0
.55dB max.-1.43
max.-19dB.-QFN-Terminal
Dedicated

1.0 PCS

U4405

2260

47990023

Balun,50:100Balun,2300MHz~
2700MHz,50:100,1.2,0.5,1608
SMD,Terminal Dedicated

1.0 PCS

U4406

2270

47140113

RF
Switch-100~3500MHz-SP3T-0
.65dB max. at
2400~2500MHz-1.29 at
2450MHz-32dB.-QFN-Termin
al Dedicated

2.0 PCS

U5401, U5504

2280

47140114

RF
Switch-20~6000MHz-SPDT-0.
65dB
max.-1.43-22dB.-QFN-Termin
al Dedicated

1.0 PCS

U5501

2290

47090053

RF LNA,1575MHz,14dB
min.,1.6dB

1.0 PCS

U5503

2013-04-09

Huawei confidential. No spreading without permission.

Page 44 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

max.,SOT886,Terminal
Dedicated
2300

39210059

Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949

1.0 PCS

U5603

2310

12020125

Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949

1.0 PCS

X1000

2320

15040385

Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN16-Terminal Dedicated

1.0 PCS

Z1601

2330

15040384

Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN10-Terminal Dedicated

1.0 PCS

Z1602

2340

13010212

SAW
Filter,1842.5MHz,1.6dB(typ),5
0V,SFLT5-0101,Terminal
Dedicated

1.0 PCS

Z4101

2350

13010329

SAW
Filter,2595MHz,2.3dB,1411,Te
rminal Dedicated

1.0 PCS

Z4201

2360

13030037

Ceramics
Filter,1900MHz/2017.5MHz,0.
71dB,1608,Terminal Dedicated

1.0 PCS

Z4202

2370

13010292

SAW
Filter-1900MHz/2017.5MHz-2.
3dB/2.6dB-1511-Terminal
Dedicated

1.0 PCS

Z4203

2380

13010319

SAW
Filter,2340MHz,2.7dB,2016,Te
rminal Dedicated, FBAR

1.0 PCS

Z4204

2390

13010315

SAW
Filter-2350MHz-3.8dB-1411

2.0 PCS

Z4205, Z4302

2400

13010327

SAW
Filter-2595MHz-3.8dB-1411-T
erminal Dedicated

2.0 PCS

Z4210, Z4304

2410

13010137

SAW
Filter-1900MHz-2.0dB(Max)-1
411-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

Z4301

2420

13010271

SAW
Filter-2655MHz-3.8dB-1411-T

1.0 PCS

Z4303

2013-04-09

Huawei confidential. No spreading without permission.

Page 45 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

erminal Dedicated
2430

13010274

SAW
Filter-2437MHz-3.5-500V-201
6-

2.0 PCS

Z5401, Z5505

2440

13080106

Duplexer,1565~1607MHz/240
0~2500MHz,0.8dB./0.9dB.,13d
B./18dB,1608,Terminal
Dedicated

1.0 PCS

Z5501

2450

13010264

SAW
Filter-1590.16MHz-1.8dB-50V
-1411-Terminal Dedicated

2.0 PCS

Z5502, Z5503

2460

13030061

Ceramic
Filter,5375MHz,1.7dB,SMD

1.0 PCS

Z5504

2470

8071219

SMD Ceramic
Capacitor-10V-100nF-+/-10%X5R-0201-Terminal Dedicated

2.0 PCS

C1246, C300

2480

05020XTY

Board
Software,HWD2-5000M,HWD
2-5000M01A,D2-5000
Handset
Software,Program,CMCC(Chin
a,K3V2,BALONG V7R1)

1.0 PCS

2490

10100017

Terminal EMI
beads-470ohm-+/-25%-0.5A-0.
21ohm-0603-BT,TS16949-Ter
minal Dedicated

2.0 PCS

LB1202, LB1204

2500

8070698

SMD Ceramic
Capacitor-16V-3.3nF-+/-10%X7R-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

C1241, C1247

No.

Part Number

Name

Quantity

Position

-1

03021YXM

Manufactured
Board,D2-5000,HL1D25000M,
Ascend D2 Handset Main
Board,Terminal used,2*2

10

03010TAB

Manufactured
Board,D2-5000,HL1D25000M,
Ascend D2 Handset Main
Board,Terminal used,2*2

1.0 PCS

U9800D:

2013-04-09

Huawei confidential. No spreading without permission.

Page 46 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

20

8071128

SMD Ceramic
Capacitor-6.3V-1000nF-+/-20
%-X5R-0201-Terminal
Dedicated

92.0 PCS

C1004, C1005, C1026,

C1416, C2261, C2800,
C2802, C2803, C2833,
C3808, C500, C501, C502,
C503, C504, C505, C506,
C507, C508, C509, C510,
C511, C5620, C5621, C5622,
C5623, C5624, C5625,
C5626, C605, C606, C607,
C608, C609, C612, C614,
C615, C616, C617, C618,
C619, C620, C621, C622,
C623, C624, C625, C626,
C627, C628, C629, C630,
C633, C645, C650, C651,
C652, C653, C655, C656,
C657, C658, C659, C660,
C661, C662, C663, C665,
C666, C669, C670, C686,
C687, C707, C708, C709,
C710, C711, C712, C713,
C714, C715, C723, C724,
C725, C726, C727, C734,
C735, C738, C739, C740

30

8070667

SMD Ceramic
Capacitor-6.3V-2200nF-+/-20
%-X5R-0402-TS16949

70.0 PCS

C1001, C1002, C1003,

C1132, C1505, C1526,
C1527, C1814, C1816,
C1818, C2000, C2001,
C2500, C2808, C2809,
C2810, C2811, C2812,
C2813, C2900, C2901,
C2902, C2903, C2905,
C2906, C3101, C3102,
C3116, C3197, C3915,
C3916, C4093, C4095,
C4235, C4236, C600, C602,
C603, C647, C648, C664,
C685, C688, C700, C701,
C733, C901, C902, C903,
C904, C905, C906, C907,
C908, C909, C911, C912,
C913, C914, C915, C916,
C917, C918, C919, C920,
C921, C922, C923, C924,
C925

40

8070783

SMD Ceramic
Capacitor-6.3V-22000nF-+/-20
%-X5R-0603-Terminal
Dedicated

31.0 PCS

C1118, C1119, C1238,

C1908, C1910, C2908,
C2909, C2910, C2948,
C3121, C3202, C4106,
C4125, C601, C636, C642,
C643, C644, C649, C802,

2013-04-09

Huawei confidential. No spreading without permission.

Page 47 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C803, C939, C940, C941,
C942, C944, C946, C948,
C950, C952, C959

50

8070819

SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0402-Terminal
Dedicated-Terminal Dedicated

26.0 PCS

C1513, C1514, C1515,

C1516, C1611, C1811,
C2012, C2260, C2924,
C2925, C2926, C2950,
C5639, C5640, C604, C610,
C611, C613, C667, C668,
C683, C684, C728, C736,
C737, C910

60

8070692

SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-TS16949

16.0 PCS

C2503, C2930, C2931,

C2932, C2944, C3003,
C3004, C3005, C3122,
C3802, C5646, C632, C635,
C638, C646, C947

70

8070704

SMD Ceramic
Capacitor-6.3V-100nF-+/-10%X5R-0201-TS16949

156.0 PCS

C1021, C1023, C1105,

C1106, C1110, C1111,
C1112, C1113, C1133,
C1236, C1307, C1309,
C1310, C1311, C1312,
C1315, C1319, C1406,
C1407, C1418, C1501,
C1502, C1506, C1602,
C1603, C1633, C1635,
C1636, C1805, C1806,
C1808, C1809, C1815,
C1817, C1819, C1821,
C1822, C1824, C1827,
C1920, C2002, C2003,
C2004, C2005, C2006,
C2015, C2016, C2021,
C2143, C2144, C2145,
C2146, C2216, C2217,
C2241, C2242, C2243,
C2262, C2266, C2401,
C2402, C2419, C2420,
C2421, C2501, C2502,
C2510, C2605, C2814,
C2815, C2816, C2817,
C2818, C2819, C2820,
C2821, C2822, C2823,
C2824, C2825, C2826,
C2827, C2828, C2829,
C2830, C2831, C2832,
C2834, C2835, C2836,
C2838, C2839, C2840,
C2907, C2951, C3105,
C3106, C3107, C3108,
C3110, C3111, C3112,
C3113, C3114, C3115,

2013-04-09

Huawei confidential. No spreading without permission.

Page 48 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C3189, C3905, C4115,
C4123, C4327, C4436,
C5503, C5504, C5605,
C5606, C5607, C5610,
C5611, C5613, C5614,
C5615, C5616, C5632,
C5642, C5643, C634, C639,
C641, C654, C689, C690,
C691, C702, C703, C704,
C705, C706, C716, C717,
C718, C719, C720, C721,
C722, C729, C730, C731,
C732, C800, C801, C804,
C926, C927, C928, C929,
C933

80

8070449

SMD Ceramic
Capacitor-16V-10nF-+/-10%-X
7R-0402-BT,TS16949

1.0 PCS

C637

90

8070676

SMD Ceramic
Capacitor-25V-0.01nF-+/-5%NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

12.0 PCS

C1503, C5505, C5506,

C5507, C5515, C5516,
C5520, C5526, C5527,
C5528, C640, C934

100

8070564

SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0603-BT,TS16949

1.0 PCS

C930

110

8070612

SMD Ceramic
Capacitor-10V-1000nF-+/-10%
-X5R-0402-BT,TS16949

11.0 PCS

C1303, C1904, C1905,

C1909, C3000, C3001,
C3002, C935, C936, C937,
C938

120

8070649

SMD Ceramic
Capacitor-6.3V-10000nF-+/-20
%-X5R-0603-BT,TS16949

18.0 PCS

C1124, C1125, C1632,

C1823, C1903, C2934,
C2936, C2945, C3103,
C3118, C3201, C5635,
C5636, C5637, C5648,
C5649, C949, C951

130

8070703

SMD Ceramic
Capacitor-25V-1nF-+/-10%-X7
R-0201-TS16949

17.0 PCS

C1024, C1104, C1134,

C1301, C2801, C2804,
C2805, C2806, C2807,
C2911, C3804, C3805,
C3806, C3901, C4103,
C5502, C958

140

8070695

SMD Ceramic
Capacitor-25V-0.022nF-+/-5%NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

12.0 PCS

C1010, C1011, C3909,

C3910, C3912, C3913,
C3914, C3917, C3918,
C3919, C3920, L4004

2013-04-09

Huawei confidential. No spreading without permission.

Page 49 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

150

8070720

SMD Ceramic
Capacitor-6.3V-1000nF-+/-10
%-X5R-0402-Terminal
Dedicated,TS16949-Terminal
Dedicated

21.0 PCS

C1020, C1025, C1114,

C1528, C1529, C1616,
C1820, C1825, C1826,
C2913, C2914, C2915,
C2916, C2917, C2918,
C2920, C2922, C2923,
C2949, C3117, C5647

160

8070531

SMD Ceramic
Capacitor-50V-1nF-+/-10%-X7
R-0402-BT

1.0 PCS

C1022

170

8070752

SMD Ceramic
Capacitor-6.3V-220nF-+/-20%X5R-0201-Terminal Dedicated

3.0 PCS

C1103, C1601, C5601

180

8070625

SMD Ceramic
Capacitor-6.3V-470nF-+/-10%X5R-0402

3.0 PCS

C1131, C1308, C2103

190

8070817

SMD Ceramic
Capacitor-6.3V-47nF-+/-10%X5R-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1234, C1245

200

8071388

SMD Ceramic
Capacitor-10V-22000nF-+/-20
%-X5R-0805(2.0*1.25*0.95m
m)-Terminal Dedicated

1.0 PCS

C1237

210

8070696

SMD Ceramic
Capacitor-25V-0.1nF-+/-5%-N
PO-0201-TS16949

19.0 PCS

C1243, C1313, C1907,

C3911, C4001, C4003,
C4011, C4012, C4028,
C4029, C4204, C4205,
C4218, C4406, C4407,
C4415, C4419, C5511,
L4205

220

8070716

SMD Ceramic
Capacitor-6.3V-33nF-+/-10%X5R-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1306, C3803

230

8070760

SMD Ceramic
Capacitor-25V-0.047nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1314, C1504

240

8020142

Solid SMD Tantalum

Capacitor-6.3V-47uF-+/-20%-0
805-2.0*1.25*1.0mm-200moh
m-Terminal Dedicated

1.0 PCS

C1316

250

8070689

SMD Ceramic
Capacitor-25V-0.033nF-+/-5%NPO-0201-Terminal

123.0 PCS

C1412, C1413, C1414,

C1417, C1508, C1509,
C1531, C1604, C1605,

2013-04-09

Huawei confidential. No spreading without permission.

Page 50 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Dedicated,TS16949-Terminal
Dedicated

Position
C1606, C1620, C1621,
C1623, C2022, C2023,
C2024, C2025, C2028,
C2029, C2106, C2122,
C2124, C2142, C2201,
C2202, C2203, C2205,
C2206, C2207, C2208,
C2209, C2210, C2211,
C2212, C2213, C2214,
C2244, C2245, C2246,
C2265, C2403, C2405,
C2406, C2407, C2408,
C2409, C2411, C2412,
C2413, C2414, C2415,
C2416, C2417, C2418,
C2927, C2943, C3807,
C3925, C3926, C3927,
C3951, C4004, C4006,
C4007, C4008, C4025,
C4026, C4027, C4039,
C4072, C4089, C4094,
C4096, C4097, C4107,
C4108, C4110, C4111,
C4112, C4113, C4114,
C4116, C4117, C4118,
C4119, C4120, C4121,
C4127, C4128, C4129,
C4130, C4135, C4304,
C4305, C4306, C4307,
C4309, C4322, C4328,
C4331, C4332, C4333,
C4334, C4335, C4336,
C4342, C4401, C4402,
C4403, C4404, C4410,
C4413, C4414, C4417,
C4425, C4426, C4433,
C4434, C4437, C4438,
C5523, L4010, L4011

260

8070450

SMD Ceramic
Capacitor-50V-0.1nF-+/-5%-N
PO-0402-BT

1.0 PCS

C1525

270

8070713

SMD Ceramic
Capacitor-6.3V-22nF-+/-10%X5R-0201

1.0 PCS

C1530

280

8070735

SMD Ceramic
Capacitor-50V-1000nF-+/-10%
-X5R-0805-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C1610

290

8070780

SMD Ceramic
Capacitor-10V-10000nF-+/-10

3.0 PCS

C1628, C1629, C1812

2013-04-09

Huawei confidential. No spreading without permission.

Page 51 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

%-X5R-0805-Terminal
Dedicated-Terminal Dedicated
300

8070547

SMD Ceramic
Capacitor-50V-0.033nF-+/-5%NP0-0402-BT

1.0 PCS

C1634

310

8070789

SMD Ceramic
Capacitor-25V-0.0056nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated

22.0 PCS

C1801, C1802, C1803,

C1804, C1807, C1810,
C1846, C1847, C1848,
C1849, C1850, C1851,
C1852, C1853, C1864,
C1865, C1866, C1867,
C1868, C1869, C1872,
C1873

320

8070583

SMD Ceramic
Capacitor-10V-47nF-+/-10%-X
7R-0402

1.0 PCS

C1901

330

8070785

SMD Ceramic
Capacitor-10V-4700nF-+/-10%
-X5R-0603-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

C1906, C2837, C2933

340

8071463

SMD Ceramic
Capacitor-16V-2200nF-+/-20%
-X5R-0402(1.0*0.5*0.6mm)-H
max=0.6mm-Terminal
Dedicated

1.0 PCS

C1911

350

8070970

SMD Ceramic
Capacitor-50V-10nF-10%-X7R
-0402-Terminal Dedicated

1.0 PCS

C2011

360

8070711

SMD Ceramic
Capacitor-16V-2.2nF-+/-10%X7R-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C2504

370

8070966

SMD Ceramic
Capacitor-4V-470nF-+/-20%-X
5R-0201-Terminal Dedicated

5.0 PCS

C3906, C3907, C3908,

C3921, C3922

380

10100110

Mobile Dedicated,Chip
Inductor-0.0027uH-+/-0.3nH-0.
2A-0.25ohm-201

1.0 PCS

C4030

390

10100104

Mobile Dedicated,Chip
Inductor,
0.0012uH,+/-0.3nH,0.25A,0.14
ohm,0201,Chip
Inductor,Mobile Dedicated

1.0 PCS

C4038

400

10100124

Mobile Dedicated,Chip
Inductor-0.01uH-+/-5%-0.15A-

3.0 PCS

C4070, L4404, L4405

2013-04-09

Huawei confidential. No spreading without permission.

Page 52 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

0.63ohm-201-TS16949-Termin
al Dedicated
410

8070747

SMD Ceramic
Capacitor-25V-0.0033nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated

1.0 PCS

C4079

420

10100125

Mobile Dedicated,Chip
Inductor-0.012uH-+/-5%-0.1A0.7ohm-201-TS16949-Termina
l Dedicated

2.0 PCS

C4092, C4412

430

10100103

Mobile Dedicated,Chip
Inductor-0.001uH-+/-0.3nH-0.2
5A-0.14ohm-201-TS16949-Ter
minal Dedicated

1.0 PCS

C4105

440

8070740

SMD Ceramic
Capacitor-25V-0.0005nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

C4102, L4007

450

10100118

Mobile Dedicated,Chip
Inductor-0.0056uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated

1.0 PCS

C4104

460

8070707

SMD Ceramic
Capacitor-25V-0.68nF-+/-10%X7R-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C4109

470

8070743

SMD Ceramic
Capacitor-25V-0.0015nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

C4301, L5401

480

10100117

Mobile Dedicated,Chip
Inductor-0.0051uH-+/-0.3nH-0.
15A-0.4ohm-201

4.0 PCS

C4325, L4023, L4311,

L4406

490

10100116

Mobile Dedicated,Chip
Inductor-0.0047uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

C4337, L5506

500

8070753

SMD Ceramic
Capacitor-25V-0.0082nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated

2.0 PCS

C4408, C4422

510

10100115

Mobile Dedicated,Chip
Inductor-0.0043uH-+/-0.3nH-0.

1.0 PCS

C4439

2013-04-09

Huawei confidential. No spreading without permission.

Page 53 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

15A-0.4ohm-201
520

8070950

SMD Ceramic
Capacitor-25V-0.018nF-+/-5%C0G-0.6mm*0.3mm*0.3mm-T
erminal Dedicated

6.0 PCS

C5402, C5403, C5404,

C5512, C5522, C5529

530

8070754

SMD Ceramic
Capacitor-25V-0.039nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5501

540

7090911

Chip Thick Film

Resistor-0.05W-0ohm-< 50m
ohm-0201-ELOM,TS16949

87.0 PCS

C5530, R1007, R1013,

R1014, R1223, R1301,
R1313, R1314, R1402,
R1403, R1408, R1409,
R1502, R1622, R1811,
R1814, R1817, R1821,
R1823, R1825, R1828,
R1830, R1831, R1832,
R1932, R1934, R1937,
R2002, R2003, R2006,
R2014, R2015, R2016,
R2017, R2018, R2131,
R2409, R2516, R2518,
R2519, R2742, R2743,
R2744, R2745, R2804,
R2805, R2906, R2911,
R2912, R2913, R2914,
R2915, R2916, R2917,
R2918, R3003, R3009,
R3010, R3012, R3013,
R3018, R306, R3113, R3126,
R3130, R3131, R4202,
R4205, R4206, R4301, R524,
R525, R5402, R5403, R5501,
R5507, R5508, R5514,
R5609, R5621, R5629,
R5642, R5650, R5651,
R5655, R5657, R911

550

8070700

SMD Ceramic
Capacitor-25V-0.068nF-+/-5%NP0-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5603

560

8070751

SMD Ceramic
Capacitor-25V-0.027nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5619

570

8070741

SMD Ceramic
Capacitor-25V-0.001nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C5641, L4003

2013-04-09

Huawei confidential. No spreading without permission.

Page 54 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

580

15040311

Transient Suppression
Diode-6V-12V-50W-5A-SOD9
23-Terminal Dedicated

3.0 PCS

D1301, D1302, D1903

590

15040339

Transient Suppression
Diode-6V-12V-30W-3A-0201Terminal Dedicated

11.0 PCS

D1406, D1601, D1602,

D2101, D2102, D2104,
D2201, D2202, D2240,
D2241, D2242

600

15010262

Switching
Diode-75V-200mA-1V-SOD-5
23

1.0 PCS

D1600

610

15010248

Schottky
diode-30V-0.2A-0.5V-SOD-52
3-1A

1.0 PCS

D2901

620

15010365

Schottky
Diode,30V,0.3A,0.3V,SOD882
,Automotive Grade,Terminal
Dedicated

1.0 PCS

D2902

630

19040169

Protection Tube,Fast Blowout

Fuse,24V,3A,IEC
Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal
Dedicated

1.0 PCS

F1900

640

51623884

BOT-SHIELD-COVER-3-YDT9800L

1.0 PCS

F2401

650

51623897

BOT-SHIELD-COVER-1-YDT9800L

1.0 PCS

F2402

660

51623898

BOT-SHIELD-COVER-2-YDT9800L

1.0 PCS

F2403

670

51623900

Sim-rail2-T9800L

1.0 PCS

F2405

680

51623877

BOT-SHIEDLING-FRAME-2YD-T9800L

1.0 PCS

F2406

690

51623899

TOP-SHIELD
FRAME-1-YD-T9800L

1.0 PCS

F2407

700

51623879

B-Camera-nut-C9800D

1.0 PCS

F2408

710

51623883

PCB-Steel-C9800D

1.0 PCS

F2409

720

14240576

Card Block Connector,BTF

Connector,3*2,Female,1.3mm,
Terminal Dedicated

2.0 PCS

J1301, J1900

730

14240375

BTB
Connector,female,40Pin,0.4m
m,0.8mm,SMT,Terminal
Dedicated

1.0 PCS

J1601

2013-04-09

Huawei confidential. No spreading without permission.

Page 55 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

740

14240496

BTB
Connector,Female,24Pin,0.4m
m,SMT,Mating Height
0.8mm,Terminal Dedicated

2.0 PCS

J1801, J2201

750

14240579

BTB
Connector,BTBconnector,34PI
N,0.4mm,0.8mm,SMT,female,
Terminal Dedicated

1.0 PCS

J1802

760

14240155

Card Socket Connector,SIM

Card
Socket,6pin,Horizontal,2.54m
m,Without Lock,Without Hold
Peg,Height 0.95mm,Terminal
Dedicated

1.0 PCS

J2102

770

14240460

BTB
Connector,female,10Pin,0.4m
m,0.9mm,SMT,Terminal
Dedicated

1.0 PCS

J2202

780

14240655

RF Connector,RF
Switch,Straight,female,SMT,S
plit from 14240432,Terminal
Dedicated

4.0 PCS

J4101, J4301, J5501, J5502

790

14240433

RF Connector,Coaxial
Connector,50ohm,Straight,mal
e,SMT,W.FL2,PCN
Control,Terminal Dedicated

1.0 PCS

J4102

800

51623882

Antenna-contact-C9800D

6.0 PCS

J4302, J4304, J5401, J5503,

J5506, J5507

810

51621023

108-5785,Ground
Spring,U1250

2.0 PCS

J5504, J5509

820

51621024

WN9149-N83-7F-W,Antenna
Spring,U1250

1.0 PCS

J5508

830

10100051

Mobile Dedicated,EMI beads,

600ohm+/-25%,0.2A,0.65ohm,
0402,BT,Terminal Dedicated

12.0 PCS

L1502, L1910, L2801,

L3101, L3102, L3105, L600,
L601, L602, L603, L604,
L605

840

10100541

Terminal Power
Inductor,0.47uH,+/-30%,3.4A,
0.039ohm,2.5*2.0*1.2mm,100
8,3.8A,High Current
Inductor,Terminal Dedicated

1.0 PCS

L800

850

10100175

Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-2A-0.1
15ohm-2.5*2.0*1.2mm

2.0 PCS

L900, L901

2013-04-09

Huawei confidential. No spreading without permission.

Page 56 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

860

10100473

Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-1.9A-0
.117ohm-2.5*2.0*1.2mm-Term
inal Dedicated

11.0 PCS

L1210, L1601, L1803,

L2900, L2902, L2903,
L2904, L2905, L903, L904,
L905

870

10100147

SMT Power
Inductors,22uH,20%,0.42A,0.7
56ohm,3*3*1.2mm,Terminal
Dedicated

1.0 PCS

L1600

880

7090800

Chip Thick Film

Resistor-0.0625W-0ohm-<
50mohm-0402-1A-BT

17.0 PCS

L1804, L1805, L1806,

R1102, R1105, R1605,
R1634, R1919, R1943,
R2101, R2102, R2268,
R2269, R3112, R5632,
R5658, R702

890

10100539

Terminal Chip
Inductor,1uH,+/-30%,2.7A,0.0
59ohm,2.5*2.0*1.2mm,3A,PM
IC,Apart from
10100353,Inductor,Terminal
Dedicated

1.0 PCS

L1901

900

10100168

Special Inductor and

Bead,Power
Inductor,4.7uH,-+/-20%,0.8A,0
.18ohm,2.5*2.0*1.2mm,25MH
z,Terminal Dedicated

1.0 PCS

L2901

910

10100328

Terminal Chip
Inductor,1uH,+/-30%,1.58A,0.
102ohm,2.5*2.0*1.2mm(comp
atible with
2.4*2.4*1.2mm),Terminal
Dedicated

4.0 PCS

L2906, L3103, L3201, L5608

920

10100113

Mobile Dedicated,Chip
Inductor,
0.0036uH,+/-0.3nH,0.17A,0.30
ohm,0201,Chip
Inductor,Mobile Dedicated

2.0 PCS

L4102, L4129

930

10100121

Mobile Dedicated,Chip
Inductor-0.0075uH-+/-5%-0.15
A-0.53ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

L4008, L4024

940

10100128

Mobile Dedicated,Chip
Inductor-0.022uH-+/-5%-0.1A1.2ohm-201-TS16949-Termina
l Dedicated

1.0 PCS

L4014

950

8070744

SMD Ceramic
Capacitor-25V-0.0018nF-+/-0.

1.0 PCS

L4022

2013-04-09

Huawei confidential. No spreading without permission.

Page 57 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

25pF-NPO-0201-Terminal
Dedicated
960

10100122

Mobile Dedicated,Chip
Inductor-0.0082uH-+/-5%-0.15
A-0.55ohm-201-TS16949-Ter
minal Dedicated

7.0 PCS

L4025, L4026, L4303,

L4304, L4402, L4408, L5607

970

10100134

Mobile Dedicated,Chip
Inductor,
0.068uH,+/-5%,0.05A,3.00ohm
,0201,Chip Inductor,Mobile
Dedicated

2.0 PCS

L4107, L4113

980

10100106

Mobile Dedicated,Chip
Inductor-0.0018uH-+/-0.3nH-0.
2A-0.19ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

L4127, L4413

990

10100109

Mobile Dedicated,Chip
Inductor-0.0024uH-+/-0.3nH-0.
2A-0.24ohm-201-Terminal
Dedicated

1.0 PCS

L4128

1000

10100105

Mobile Dedicated,Chip
Inductor-0.0015uH-+/-0.3nH-0.
23A-0.18ohm-201-Terminal
Dedicated

1.0 PCS

L4132

1010

10100120

Mobile Dedicated,Chip
Inductor-0.0068uH-+/-5%-0.15
A-0.48ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

L4133, R4102

1020

10100111

Mobile Dedicated,Chip
Inductor,
0.003uH,+/-0.3nH,0.18A,0.28o
hm,0201,Chip Inductor,Mobile
Dedicat

3.0 PCS

C4098, L4305, L4306

1030

10100112

Mobile Dedicated,Chip
Inductor-0.0033uH-+/-0.3nH-0.
18A-0.3ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

L4312, L4313

1040

10100123

Mobile Dedicated,Chip
Inductor-0.0091uH-+/-5%-0.15
A-0.62ohm-201

1.0 PCS

L4410

1050

8070712

SMD Ceramic
Capacitor-25V-0.015nF-+/-5%NP0-0201

2.0 PCS

L4411, L4412

1060

10100127

Mobile Dedicated,Chip
Inductor-0.018uH-+/-5%-0.1A0.9ohm-201

1.0 PCS

L4415

2013-04-09

Huawei confidential. No spreading without permission.

Page 58 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1070

10100153

Mobile Dedicated,Chip
Inductor-0.003uH-+/-0.3nH-0.3
A-0.17ohm-0402

1.0 PCS

L5504

1080

10100280

Mobile Dedicated,Chip
Inductor-0.18uH-+/-5%-0.1A-3
.8ohm-1.0*0.5*0.55mm-0402500000000Hz-Terminal
Dedicated

1.0 PCS

L5603

1090

10100185

Mobile Dedicated,Chip
Inductor-2.2uH-+/-20%-0.97A0.19ohm-2.5*2.0*1.0mm

1.0 PCS

L5604

1100

10100350

Mobile Dedicated,Chip
Inductor-0.47uH-+/-30%-1.6A0.075ohm-2.0*1.6*1.0mm-Ter
minal Dedicated

1.0 PCS

L5606

1110

10100150

ZD Dedicated Inductor and

Bead,EMI
Bead,330ohm@100MHZ,25%,
1.5A,0.08ohm,0603,Terminal
Dedicated

1.0 PCS

LB1201

1120

10070019

EMI
beads,+/-25%,1000ohm,1.25oh
m,0.25A,0402

7.0 PCS

LB1601, LB1602, LB1603,

LB1604, LB1605, LB2204,
LB2205

1130

10100507

Terminal EMI
beads,220ohm,25%,3A,0.04oh
m,0805,@30~500M
Impedance>120ohm,Terminal
Dedicated

1.0 PCS

LB1900

1140

10100184

Terminal EMI
beads-1800ohm-25%-0.2A-2.2
ohm-0402-Terminal Dedicated

3.0 PCS

LB2206, LB2207, LB2208

1150

10100100

Terminal EMI
beads-80ohm-25%-0.2A-0.4oh
m-0201-110ohm
tpy@1GHz,murata
70ohm@100MHz-Terminal
Dedicated

1.0 PCS

LB2802

1160

10100075

Mobile Dedicated,Chip
Inductor-0.0062uH-+/-0.2nH-0.
7A-0.09ohm-1.19*0.7*0.66
max
mm-4800000000Hz-Terminal
Dedicated

1.0 PCS

LB5501

1170

15020235

LED,240cd,white,500mA,Ter
minal Dedicated,Flash LED

1.0 PCS

LED1801

2013-04-09

Huawei confidential. No spreading without permission.

Page 59 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1180

22050075

Microphone,-42dB.,3.76*2.95*
1.1mm,silicon

1.0 PCS

MIC1402

1190

15060238

MOSFET,N
Channel,20V,0.7A,530mohm,6
V,SC,75

1.0 PCS

Q2901

1200

7092269

Chip Thick Film

Resistor-0.05W-1800ohm-+/-1
%-0201(0.6*0.3*0.23mm)-Ter
minal Dedicated

1.0 PCS

R300

1210

7092050

Chip Thick Film

Resistor-0.05W-200ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated

2.0 PCS

R2700, R301

1220

7091300

Chip Thick Film

Resistor-0.05W-6040ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

3.0 PCS

R302, R303, R304

1230

7091298

Chip Thick Film

Resistor-0.05W-4700ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated

9.0 PCS

R1104, R2113, R2140,

R3011, R3014, R3198,
R3199, R400, R5661

1240

7091150

Chip Thick Film

Resistor-0.05W-22ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R405

1250

7091161

Chip Thick Film

Resistor-0.05W-2000ohm-+/-5
%-0201-Terminal
Dedicated-Terminal Dedicated

4.0 PCS

R1812, R1813, R406, R407

1260

7091172

Chip Thick Film

Resistor-0.05W-22000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

14.0 PCS

R2603, R2604, R500, R501,

R502, R503, R504, R505,
R506, R507, R508, R509,
R510, R511

1270

7092051

Chip Thick Film

Resistor-0.05W-240ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated

5.0 PCS

R2602, R512, R513, R514,

R515

1280

7091159

Chip Thick Film

Resistor-0.05W-1000ohm-+/-5
%-0201-ELOM,TS16949

26.0 PCS

R1311, R2141, R2142,

R2143, R2401, R2510,
R2511, R2521, R2706,
R2707, R2708, R2710,
R2720, R2722, R2733,
R2734, R2909, R3802,
R4107, R4108, R4109,

2013-04-09

Huawei confidential. No spreading without permission.

Page 60 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
R4110, R516, R517, R518,
R519

1290

7091408

Chip Thick Film

Resistor-0.05W-68000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

R1008, R900

1300

7090875

Chip Thick Film

Resistor-0.0625W-100000ohm+/-1%-0402

1.0 PCS

R901

1310

7092053

Chip Thick Film

Resistor-0.05W-1000000ohm+/-1%-0.6mm*0.3mm*0.23mm
-Terminal Dedicated-Terminal
Dedicated

1.0 PCS

R902

1320

7090823

Chip Thick Film

Resistor-0.0625W-180000ohm+/-1%-0402

1.0 PCS

R903

1330

7091256

Chip Thick Film

Resistor-0.05W-33ohm-+/-5%0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

R5626, R907, R908

1340

7091246

Chip Thick Film

Resistor-0.05W-100000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated

13.0 PCS

R1000, R1002, R1101,

R1633, R1637, R1929,
R1933, R1935, R2138,
R2264, R2933, R3201,
R3230

1350

7091405

Chip Thick Film

Resistor-0.05W-56000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

R1001, R1004, R3901

1360

7091169

Chip Thick Film

Resistor-0.05W-10000ohm-+/5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

18.0 PCS

R1010, R1011, R1514,

R1639, R1640, R1808,
R1809, R1910, R2012,
R2514, R2926, R3104,
R3121, R3132, R3195,
R3197, R3902, R5647

1370

7091301

Chip Thick Film

Resistor-0.05W-10000ohm-+/1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

11.0 PCS

R1103, R1939, R1940,

R2112, R2605, R2732,
R2747, R2904, R2905,
R2910, R3008

1380

7091175

Chip Thick Film

Resistor-0.05W-100000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated

6.0 PCS

R1226, R1231, R1505,

R1512, R1901, R1947

2013-04-09

Huawei confidential. No spreading without permission.

Page 61 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1390

7091380

Chip Thick Film

Resistor-0.0625W-39200ohm+/-1%-0402

1.0 PCS

R1232

1400

7090858

Chip Thick Film

Resistor-0.0625W-2000000oh
m-+/-1%-0402

1.0 PCS

R1302

1410

7091783

Chip Thick Film

Resistor-0.2W-0.01ohm-+/-1%
-0603

1.0 PCS

R1303

1420

7091155

Chip Thick Film

Resistor-0.05W-100ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

5.0 PCS

R1309, R1310, R2418,

R2419, R2902

1430

7090796

Chip Thick Film

Resistor-0.0625W-18000ohm+/-5%-0402

1.0 PCS

R1312

1440

7091162

Chip Thick Film

Resistor-0.05W-2200ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R1501

1450

7091393

Chip Thick Film

Resistor-0.0625W-301000ohm+/-1%-0402

1.0 PCS

R1603

1460

7091389

Chip Thick Film

Resistor-0.0625W-91000ohm+/-1%-0402

1.0 PCS

R1604

1470

7091395

Chip Thick Film

Resistor-0.0625W-392000ohm+/-1%-0402

1.0 PCS

R1611

1480

7091148

Chip Thick Film

Resistor-0.05W-10ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

R1638, R3801

1490

7092272

Chip Thick Film

Resistor-0.05W-180ohm-1%-0
201(0.6*0.3*0.23mm)-Termina
l Dedicated

1.0 PCS

R1907

1500

7091174

Chip Thick Film

Resistor-0.05W-51000ohm-+/5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R2005

2013-04-09

Huawei confidential. No spreading without permission.

Page 62 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1510

7090867

Chip Thick Film

Resistor-0.0625W-10000ohm+/-1%-0402-BT

1.0 PCS

R2013

1520

7091153

Chip Thick Film

Resistor-0.05W-51ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

5.0 PCS

R2240, R2241, R2242,

R4007, R5401

1530

7091350

Chip Thick Film

Resistor-0.0625W-1500ohm-+/
-1%-0402-BT

1.0 PCS

R2266

1540

7091378

Chip Thick Film

Resistor-0.0625W-27400ohm+/-1%-0402

1.0 PCS

R2267

1550

7090798

Chip Thick Film

Resistor-0.0625W-22000ohm+/-1%-0402

2.0 PCS

R2508, R3203

1560

7091409

Chip Thick Film

Resistor-0.05W-150000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

R2520, R4105

1570

7090857

Chip Thick Film

Resistor-0.0625W-1000000oh
m-+/-1%-0402

2.0 PCS

R2900, R3109

1580

7091250

Chip Thick Film

Resistor-0.05W-12000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R2903

1590

7091302

Chip Thick Film

Resistor-0.05W-51000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R2922

1600

7091176

Chip Thick Film

Resistor-0.05W-121000ohm-+/
-1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R2923

1610

7091177

Chip Thick Film

Resistor-0.05W-180000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R2934

1620

7091384

Chip Thick Film

Resistor-0.0625W-51000ohm+/-1%-0402

1.0 PCS

R3128

2013-04-09

Huawei confidential. No spreading without permission.

Page 63 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1630

7090892

Chip Thick Film

Resistor-0.0625W-30000ohm+/-1%-0402

2.0 PCS

R3129, R3202

1640

7091152

Chip Thick Film

Resistor-0.05W-47ohm-+/-5%0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4004

1650

7091253

Chip Thick Film

Resistor-0.05W-120ohm-+/-5%
-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

R4005, R4006

1660

7091158

Chip Thick Film

Resistor-0.05W-390ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4101

1670

8070749

SMD Ceramic
Capacitor-25V-0.0047nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R5513

1680

7050106

NTC-220000ohm-NTC-0402-1
.0*0.5*0.5mm-Terminal
Dedicated

1.0 PCS

RT1801

1690

7050063

NTC-150000ohm-SMT-0402Terminal Dedicated

2.0 PCS

RT2501, RT4101

1700

7040075

Varistor-18V-14V-10A-40V-S
MT-0402-Terminal Dedicated

1.0 PCS

RV1900

1710

16100067

Tact
Switch,SPDT,DC,SMT,0.4mm,
5.65*3.5*0.9,5000,Terminal
Dedicated

1.0 PCS

S2101

1720

10100527

Terminal Common Mode

Inductor,28ohm,+/-20%,5V,0.1
A,
2.5ohm,03025,0.85*0.65*0.45(
mm),TAIYO YUDEN
12ohm@100M;TDK
35ohm@100M,Terminal
Dedicated

8.0 PCS

T1801, T1802, T1803,

T1804, T1805, T1806,
T1807, T1808

1730

10100331

Terminal Common Mode

Inductor,40ohm,+/-25%,5V,0.1
A,1.625ohm,1.25*1.0*0.5(mm)
,Terminal Dedicated

1.0 PCS

T1901

1740

10100564

Terminal Com-mode
Inductor,45ohm,+/-25%,5V,0.1

1.0 PCS

T1902

2013-04-09

Huawei confidential. No spreading without permission.

Page 64 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

A,2.5ohm,0504,1.25mm*1.0m
m*0.65mm,USB D+/DApplication
1750

12070055

Temperature Compensated
Oscillator,19.2MHz,+/-2.5ppm,
2.8V,+/-2.0ppm,-30degC,85de
gC,Terminal Dedicated

1.0 PCS

TCXO100

1760

12070038

Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(
max),+1.8V,+/-0.5ppm(max),-4
0degC,85degC,Terminal
Dedicated

2.0 PCS

TCXO1001, TCXO5601

1770

35020171

Consumption
Chip,Hi3620GFCV111G15,FC
CSP
576,1.1/1.2/1.8/2.6/3.3V,Appli
cation processor

1.0 PCS

U300

1780

40020168

DDR2 DRAM-16Gb
LPDDR2-533MHz-32bit-1.8V/
1.2V-216BALL
FBGA(POP)-Terminal
Dedicated

1.0 PCS

U300_POP

1790

39110780

Switching Regulators-DC/DC
buck for
GPU-2.5V-5.5V-4000mA-2.5
MHz-CSP16-Terminal
Dedicated

1.0 PCS

U800

1800

35020158

Consumer
Chips-Hi6421GFCV231-FCCS
P189-1.8/3.3/4.2V-K3 PMU
and Codec chip

1.0 PCS

U900

1810

40060418

MCP-32GB(32Gbx8)
EMMC-52MHz-3.3/1.8V-FBG
A169-1Gb(32Mbx32)
LPDDR-Terminal Dedicated

1.0 PCS

U1102

1820

38020077

Analog Switch,one input one

output Load
switch,1.1V~3.6V-1.8Vinput,<
55mohm;1.2Vinput,<90mohm,
WLCSP4,Terminal Dedicated

2.0 PCS

U1103, U3203

1830

39080180

Operation Amplifier,Audio
Power
Amplifier,2.5V~5.5V,Differenc
ial,Micro SMD
16pin(WLCSP),Terminal
Dedicated

1.0 PCS

U1201

2013-04-09

Huawei confidential. No spreading without permission.

Page 65 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1840

39070073

-0.3~2.75V,Battery
Gauge,SON,Terminal
Dedicated

1.0 PCS

U1301

1850

39080124

Operation
Amplifier,Headphone Audio
Power Amplifier,2.3 V to 5.5
V,differential AB
Amplifier,QFN,Terminal
Dedicated

1.0 PCS

U1501

1860

39110626

Switching
Regulators-Vin~38V-0.02A-Q
FN-2*2-SMT-2*2-10 LED
Driver, Terminal Dedicated

1.0 PCS

U1600

1870

39110636

Switching
Regulators-ThinQFN-LCD
Driver-Terminal Dedicated

1.0 PCS

U1601

1880

39110620

Power Driver,1.5A LED flash

driver IC,CSP,Terminal
Dedicated

1.0 PCS

U1800

1890

39070149

Battery Management IC-charge

IC-buck-3A input
ability-3.9V-6.5V-QFN-24-OT
G-Terminal Dedicated

1.0 PCS

U1901

1900

38020071

Analog Switch,double-pole,
triple throw (DP3T)
multiplexer,2.5V-4.5V,<6.6oh
m,1470MHz,QFN12,Terminal
Dedicated

1.0 PCS

U1905

1910

33030026

Temperature
Sensor,-40~+125degC,1.4V~2.
75V,Digital
Output,+/-1degC,DFN,60000us
,NA,12bit,IIC,Terminal
Dedicated

1.0 PCS

U2001

1920

38140103

Semiconductor Sensor,three
axis
gyroscope,LGA-16,Terminal
Dedicated

1.0 PCS

U2003

1930

38140098

Semiconductor
Sensor,Accelerometer,LGA,3a
xis,Terminal Dedicated

1.0 PCS

U2004

1940

38140069

Semiconductor
Sensor,E-Compass,WLCSP(Pb
-free),3axis,Terminal
Dedicated

1.0 PCS

U2005

2013-04-09

Huawei confidential. No spreading without permission.

Page 66 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

1950

38020072

Bi-directional,4PDT,
1.65-4.3V ,Rond(max)<12ohm
;Ronv<0.7ohm-160MHz-UML
P, Terminal Dedicated

1.0 PCS

U2101

1960

36020419

CMOS,Dual
Reverse,QFN,33.6ns,20mA,C
MOS,CMOS, Terminal
Dedicated

1.0 PCS

U2103

1970

39080185

Operation Amplifier, Linear

Motor
Driver,2.5~5.5V,Differential, 9
Ball 0.5mm Pitch
WCSP,Terminal Dedicated

1.0 PCS

U2203

1980

35020149

Consumption
Chip,Hi6920GFCV100,FBGA
520,1.1/1.8/2.5,LTE,WCDMA/
GSM

1.0 PCS

U2501

1990

35020150

Chip,Hi6451GBCV110,BGA1
04,5V,Power management unit

1.0 PCS

U2900

2000

39110756

Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,D
FN/QFN

3.0 PCS

U2901, U3105, U3201

2010

43110067

AUDIO Chip,2 digital

microphones/4 Digital Audio
Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal
Dedicated

1.0 PCS

U3000

2020

43090148

VIDEO Chip,49
VFBGA,1.2V/1.8V/3.3V,HDM
I&USB 2in1,1080p/60Hz,
Terminal Dedicated

1.0 PCS

U3101

2030

39110548

LDO-3.3V-2%-0.15A-SC70-5Terminal Dedicated-Terminal
Dedicated

1.0 PCS

U3104

2040

35020147

Consumer-Hi6360RBCV210-V
FBGA-2.2V/1.8V/1.2V-2G/3G
/4G multi mode multi band RF
Transceiver

1.0 PCS

U3901

2050

47140042

0.5~3GHz,SPDT,0.46,22,TSS
ON,Terminal Dedicated

2.0 PCS

U3902, U3905

2060

47100500

RF Power Amplifying
Module,1920MHz~1980MHz,2
9.5dB
max.,28.25dBm,QFN,Terminal
Dedicated

1.0 PCS

U4001

2013-04-09

Huawei confidential. No spreading without permission.

Page 67 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

2070

47100360

RF Power Amplifying
Module,1710-1785MHz,26.5d
B/18dB/12dB,28.6dBm,QFN,C
LASS1

1.0 PCS

U4002

2080

13080086

Duplexer-TX:1710~1785MHz/
RX:1805~1880MHz-3.5dB.-4d
B.-43dB./45dB.-2520-Terminal
Dedicated

1.0 PCS

U4003

2090

47100387

RF Power Amplifying
Module,880MHz~915MHz,28/
18/11,QFN,1000V

1.0 PCS

U4004

2100

13080104

Duplexer,TX:880MHz~915M
Hz/RX:925MHz~960MHz,3dB
.,3dB.,55dB/50dB.,2520,Termi
nal Dedicated

1.0 PCS

U4005

2110

13080094

Duplexer-TX:1920~
1980MHz/RX:2110~2170MHz
-5dB.-2.2dB.-48dB./52dB.-252
0-Terminal Dedicated

1.0 PCS

U4006

2120

47140112

RF
Switch,700M~2700MHz,SP14
T,0.5dB(900MHz)/0.8dB(2100
MHz)/1.0dB(2700MHz),25dB.,
LGA,Terminal Dedicated

1.0 PCS

U4101

2130

47100348

RF Power Amplifying
Module,824MHz~849MHz/88
0MHz~915MHz/1710MHz~17
85MHz/1850MHz~1910MHz,3
3.5,35dBm,LGA

1.0 PCS

U4102

2140

47140045

RF
Switch-0.5~2.5GHz-SP4T-0.95
-15dB.-QFN

1.0 PCS

U4301

2150

47140068

RF
Switch,400~3000MHz,DPDT,0
.25~0.7dB,1.5:1,26dB,QFN,10
00V

1.0 PCS

U4302

2160

47100305

Power Module,
824MHz~849MHz,27dB,28.5d
Bm,QFN,2000V,Terminal
Dedicated

1.0 PCS

U4401

2170

47100353

RF Power Amplifying
Module,2500-2570MHz,28,31d
Bm,QFN,1000V

1.0 PCS

U4402

2180

13080037

Duplexer,TX:824~849MHz;R
X:869~894MHz,1.7dB(typ),2.0

1.0 PCS

U4403

2013-04-09

Huawei confidential. No spreading without permission.

Page 68 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

dB(typ),60dB/53dB(typ),2520,
Terminal Dedicated,TS16949
2190

13080162

Duplexer,TX:2500-2570MHz/
RX:2620-2690MHz,2.5dB.,2.5
dB.,-50dB.,-2016.,Terminal
Dedicated-Unbalance-FBAR

1.0 PCS

U4404

2200

47140111

RF
Switch-700~2700MHz-DP6T-0
.55dB max.-1.43
max.-19dB.-QFN-Terminal
Dedicated

1.0 PCS

U4405

2210

47990023

Balun,50:100Balun,2300MHz~
2700MHz,50:100,1.2,0.5,1608
SMD,Terminal Dedicated

1.0 PCS

U4406

2220

47140113

RF
Switch-100~3500MHz-SP3T-0
.65dB max. at
2400~2500MHz-1.29 at
2450MHz-32dB.-QFN-Termin
al Dedicated

2.0 PCS

U5401, U5504

2230

47140114

RF
Switch-20~6000MHz-SPDT-0.
65dB
max.-1.43-22dB.-QFN-Termin
al Dedicated

1.0 PCS

U5501

2240

47090053

RF LNA,1575MHz,14dB
min.,1.6dB
max.,SOT886,Terminal
Dedicated

1.0 PCS

U5503

2250

39210059

Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949

1.0 PCS

U5603

2260

12020125

Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949

1.0 PCS

X1000

2270

15040385

Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN16-Terminal Dedicated

1.0 PCS

Z1601

2280

15040384

Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN10-Terminal Dedicated

1.0 PCS

Z1602

2290

13010177

SAW
Filter-1960MHz-2.7dB-1.4*1.1

1.0 PCS

Z4101

2013-04-09

Huawei confidential. No spreading without permission.

Page 69 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

mm-Terminal Dedicated
2300

13010212

SAW
Filter,1842.5MHz,1.6dB(typ),5
0V,SFLT5-0101,Terminal
Dedicated

1.0 PCS

Z4301

2310

13010271

SAW
Filter-2655MHz-3.8dB-1411-T
erminal Dedicated

1.0 PCS

Z4303

2320

13010262

SAW
Filter-2140MHz-3.0dB-50V-14
11-Terminal Dedicated

1.0 PCS

Z4304

2330

13010274

SAW
Filter-2437MHz-3.5-500V-201
6-

2.0 PCS

Z5401, Z5505

2340

13080106

Duplexer,1565~1607MHz/240
0~2500MHz,0.8dB./0.9dB.,13d
B./18dB,1608,Terminal
Dedicated

1.0 PCS

Z5501

2350

13010264

SAW
Filter-1590.16MHz-1.8dB-50V
-1411-Terminal Dedicated

2.0 PCS

Z5502, Z5503

2360

13030061

Ceramic
Filter,5375MHz,1.7dB,SMD

1.0 PCS

Z5504

2370

8071219

SMD Ceramic
Capacitor-10V-100nF-+/-10%X5R-0201-Terminal Dedicated

2.0 PCS

C1246, C300

2380

05021AXP

Board
Software,HDD2-0082M,HDD2
-0082M00,D2-0082 Handset
Software,Program,Universal

1.0 PCS

2390

10100119

Terminal Chip Inductor,

0.0062uH,+/-5%,0.15A,0.44oh
m,0201,EAR99.Chip Inductor

1.0 PCS

C4071

2400

10100017

Terminal EMI
beads-470ohm-+/-25%-0.5A-0.
21ohm-0603-BT,TS16949-Ter
minal Dedicated

2.0 PCS

LB1202, LB1204

2410

8070698

SMD Ceramic
Capacitor-16V-3.3nF-+/-10%X7R-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

C1241, C1247

2013-04-09

Huawei confidential. No spreading without permission.

Page 70 of 187

D2 Maintenance Manual

INTERNAL

D2-2010:
No.

Part Number

Name

Quantity

Position

-1

03021UPQ

Manufactured Board-CDMA
D2-2010-HC1C9800DM-D2-2
010 Handset Main Board -2*2

03010QMQ

Manufactured
Board-D2-2010-HC1C9800D
M-D2-2010 Handset Main
Board -2*2

1.0 PCS

8070704

SMD Ceramic
Capacitor-6.3V-100nF-+/-10%X5R-0201-TS16949

154.0 PCS

C1013, C1021, C1023,

C1102, C1104, C1107,
C1111, C1236, C1307,
C1309, C1310, C1311,
C1312, C1315, C1327,
C1406, C1407, C1418,
C1501, C1502, C1506,
C1602, C1603, C1633,
C1635, C1643, C1806,
C1808, C1809, C1815,
C1817, C1819, C1821,
C1822, C1824, C1827,
C1831, C1920, C2002,
C2003, C2004, C2005,
C2006, C2015, C2016,
C2102, C2104, C2105,
C2107, C2108, C2109,
C2155, C2156, C2158,
C2159, C2162, C2216,
C2217, C2241, C2242,
C2243, C2262, C2422,
C2424, C3105, C3106,
C3107, C3108, C3110,
C3111, C3112, C3113,
C3114, C3115, C3119, C401,
C4014, C4017, C4018,
C4019, C4020, C4021,
C4022, C4101, C4102,
C4103, C4104, C4105,
C4106, C4107, C4108,
C4109, C4110, C4111,
C4112, C4113, C4114,
C4115, C4201, C4202,
C4303, C4304, C4315,
C4316, C4611, C5028,
C5102, C5504, C5605,
C5606, C5607, C5610,
C5611, C5613, C5614,
C5615, C5616, C5632,
C5642, C5643, C5644, C607,
C608, C609, C639, C641,
C660, C681, C682, C702,
C703, C704, C705, C706,

2013-04-09

Huawei confidential. No spreading without permission.

Page 71 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C716, C717, C718, C719,
C720, C721, C722, C729,
C730, C731, C732, C801,
C802, C803, C805, C926,
C927, C928, C929, C933

8070689

SMD Ceramic
Capacitor-25V-0.033nF-+/-5%NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

72.0 PCS

C1412, C1413, C1414,

C1417, C1508, C1509,
C1531, C1604, C1605,
C1606, C1620, C1621,
C1623, C2007, C2008,
C2009, C2010, C2031,
C2032, C2101, C2106,
C2122, C2124, C2136,
C2139, C2140, C2201,
C2202, C2203, C2205,
C2206, C2207, C2208,
C2209, C2210, C2211,
C2212, C2213, C2214,
C2227, C2244, C2245,
C2246, C2263, C2264,
C2425, C2427, C2428,
C2429, C2430, C2431,
C2443, C2444, C2445,
C2446, C2447, C2448,
C2449, C2450, C410, C411,
C4314, C4714, C514, C515,
C5302, C5323, C5326,
C5336, C5501, C5505,
C5506

8071128

SMD Ceramic
Capacitor-6.3V-1000nF-+/-20
%-X5R-0201-Terminal
Dedicated

93.0 PCS

C1004, C1005, C1020,

C1026, C1416, C1825,
C2261, C3006, C3007,
C4126, C500, C5000, C5005,
C5006, C5008, C501, C5018,
C502, C503, C504, C505,
C506, C507, C508, C509,
C510, C5108, C5109, C511,
C5620, C5621, C5622,
C5623, C5624, C5625,
C5626, C605, C606, C611,
C612, C614, C615, C616,
C617, C618, C619, C620,
C621, C622, C623, C624,
C625, C626, C627, C628,
C629, C630, C633, C6417,
C645, C650, C651, C652,
C653, C6549, C655, C656,
C661, C670, C671, C672,
C673, C674, C675, C679,
C707, C708, C710, C711,
C712, C713, C714, C715,
C723, C724, C725, C726,

2013-04-09

Huawei confidential. No spreading without permission.

Page 72 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
C727, C728, C750, C753,
C754, C755

8070667

SMD Ceramic
Capacitor-6.3V-2200nF-+/-20
%-X5R-0402-TS16949

52.0 PCS

C1001, C1002, C1003,

C1105, C1505, C1526,
C1527, C1814, C1818,
C2000, C2001, C3101,
C3102, C3116, C3197,
C4006, C4007, C4008,
C4009, C4010, C4011,
C5001, C600, C602, C603,
C676, C700, C733, C901,
C902, C903, C904, C905,
C906, C907, C908, C909,
C911, C912, C913, C914,
C915, C916, C917, C918,
C919, C920, C921, C922,
C923, C924, C925

8070783

SMD Ceramic
Capacitor-6.3V-22000nF-+/-20
%-X5R-0603-Terminal
Dedicated

22.0 PCS

C1109, C1110, C1238,

C1317, C1908, C1910,
C3121, C3231, C601, C642,
C649, C804, C939, C941,
C942, C943, C944, C945,
C946, C948, C950, C952

8070819

SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0402-Terminal
Dedicated-Terminal Dedicated

26.0 PCS

C1513, C1514, C1515,

C1516, C1611, C1811,
C2012, C2260, C4717,
C5015, C5016, C5118,
C5637, C5638, C5639, C604,
C610, C613, C677, C678,
C685, C686, C701, C751,
C752, C910

10

8070692

SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-TS16949

19.0 PCS

C3003, C3004, C3005,

C3008, C3009, C3122,
C4311, C4312, C4313,
C5112, C5113, C5114, C632,
C635, C637, C638, C646,
C6515, C947

11

8070676

SMD Ceramic
Capacitor-25V-0.01nF-+/-5%NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

12.0 PCS

C1503, C2231, C4309,

C4310, C4402, C5515,
C5516, C5518, C5519,
C5520, C640, C934

12

8070649

SMD Ceramic
Capacitor-6.3V-10000nF-+/-20
%-X5R-0603-BT,TS16949

19.0 PCS

C1103, C1632, C1823,

C1902, C1903, C3103,
C3118, C3230, C4030,
C4031, C5332, C5333,
C5633, C5634, C5635,
C5636, C643, C949, C951

2013-04-09

Huawei confidential. No spreading without permission.

Page 73 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

13

8071542

SMD Ceramic
Capacitor-50V-1000nF-+/-10%
-X5R-0805(2.0*1.25*0.95mm)
-Hmax=0.95mm-Terminal
Dedicated

2.0 PCS

C1610, C699

17

8070564

SMD Ceramic
Capacitor-6.3V-4700nF-+/-20
%-X5R-0603-BT,TS16949

7.0 PCS

C4005, C4032, C4033,

C4034, C4035, C4036, C930

18

8070612

SMD Ceramic
Capacitor-10V-1000nF-+/-10%
-X5R-0402-BT,TS16949

35.0 PCS

C1303, C1904, C1905,

C1909, C3000, C3001,
C3002, C4024, C4025,
C4026, C4027, C4116,
C4117, C4118, C4119,
C4120, C4121, C4122,
C4123, C4124, C4125,
C4127, C4128, C4129,
C4130, C4131, C4132,
C4133, C4305, C5110,
C6511, C935, C936, C937,
C938

19

8070703

SMD Ceramic
Capacitor-25V-1nF-+/-10%-X7
R-0201-TS16949

14.0 PCS

C1024, C1301, C4001,

C4002, C4003, C4004,
C4203, C4301, C4705,
C4706, C4713, C5100,
C65101, C958

20

8070695

SMD Ceramic
Capacitor-25V-0.022nF-+/-5%NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

9.0 PCS

C1010, C1011, C4204,

C4602, C5318, C5319,
C5320, C5321, C5334

21

8070531

SMD Ceramic
Capacitor-50V-1nF-+/-10%-X7
R-0402-BT

1.0 PCS

C1022

22

8070720

SMD Ceramic
Capacitor-6.3V-1000nF-+/-10
%-X5R-0402-Terminal
Dedicated,TS16949-Terminal
Dedicated

14.0 PCS

C1025, C1101, C1528,

C1529, C1616, C1820,
C1826, C1900, C3117,
C5007, C5009, C5027,
C5309, C5310

25

8070625

SMD Ceramic
Capacitor-6.3V-470nF-+/-10%X5R-0402

3.0 PCS

C1108, C2103, C2141

26

8070817

SMD Ceramic
Capacitor-6.3V-47nF-+/-10%X5R-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1234, C1245

27

8071388

SMD Ceramic

1.0 PCS

C1237

2013-04-09

Huawei confidential. No spreading without permission.

Page 74 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Capacitor-10V-22000nF-+/-20
%-X5R-0805(2.0*1.25*0.95m
m)-Terminal Dedicated
28

8070696

SMD Ceramic
Capacitor-25V-0.1nF-+/-5%-N
PO-0201-TS16949

10.0 PCS

C1243, C1313, C1907,

C4508, C4612, C4613,
C4701, C4707, C5513,
C5812

30

8070716

SMD Ceramic
Capacitor-6.3V-33nF-+/-10%X5R-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C1306, C4308

31

8070966

SMD Ceramic
Capacitor-4V-470nF-+/-20%-X
5R-0201-Terminal Dedicated

1.0 PCS

C1308

32

8070760

SMD Ceramic
Capacitor-25V-0.047nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

C1314, C1504, C2230

36

8070450

SMD Ceramic
Capacitor-50V-0.1nF-+/-5%-N
PO-0402-BT

1.0 PCS

C1525

37

8070713

SMD Ceramic
Capacitor-6.3V-22nF-+/-10%X5R-0201

1.0 PCS

C1530

38

8070752

SMD Ceramic
Capacitor-6.3V-220nF-+/-20%X5R-0201-Terminal Dedicated

3.0 PCS

C1601, C4709, C5601

40

8070780

SMD Ceramic
Capacitor-10V-10000nF-+/-10
%-X5R-0805-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

C1628, C1629, C1812

41

8070547

SMD Ceramic
Capacitor-50V-0.033nF-+/-5%NP0-0402-BT

1.0 PCS

C1634

42

8070753

SMD Ceramic
Capacitor-25V-0.0082nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated

3.0 PCS

C1640, C1641, C1642

43

8070789

SMD Ceramic
Capacitor-25V-0.0056nF-+/-0.
1pF-NPO-0201-Terminal
Dedicated

21.0 PCS

C1801, C1802, C1803,

C1804, C1807, C1810,
C1830, C1846, C1847,
C1849, C1850, C1851,
C1852, C1853, C1864,
C1866, C1868, C1869,
C1872, C1873, C5301

2013-04-09

Huawei confidential. No spreading without permission.

Page 75 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

47

8070573

SMD Ceramic
Capacitor-10V-2200nF-+/-10%
-X5R-0603

1.0 PCS

C1816

50

8070583

SMD Ceramic
Capacitor-10V-47nF-+/-10%-X
7R-0402

1.0 PCS

C1901

53

8070785

SMD Ceramic
Capacitor-10V-4700nF-+/-10%
-X5R-0603-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C1906

55

8071463

SMD Ceramic
Capacitor-16V-2200nF-+/-20%
-X5R-0402(1.0*0.5*0.6mm)-H
max=0.6mm-Terminal
Dedicated

1.0 PCS

C1911

56

8070970

SMD Ceramic
Capacitor-50V-10nF-10%-X7R
-0402-Terminal Dedicated

1.0 PCS

C2011

57

8070561

SMD Ceramic
Capacitor-10V-100nF-+/-10%X5R-0402

1.0 PCS

C2021

67

8071109

SMD Ceramic
Capacitor-10V-10nF-+/-10%-X
5R-0201-Terminal Dedicated

1.0 PCS

C4205

68

8070717

SMD Ceramic
Capacitor-25V-0.056nF-+/-5%NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

C4307, C5311

70

8070701

SMD Ceramic
Capacitor-25V-0.082nF-+/-5%NP0-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

C4501, C4502

71

8070742

SMD Ceramic
Capacitor-25V-0.0012nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

C4503

72

8070810

SMD Ceramic
Capacitor-16V-0.22nF-+/-10%X7R-0201-Terminal Dedicated

1.0 PCS

C4510

73

8070698

SMD Ceramic
Capacitor-16V-3.3nF-+/-10%X7R-0201-Terminal
Dedicated,TS16949-Terminal

3.0 PCS

C1241, C1247, C4511

2013-04-09

Huawei confidential. No spreading without permission.

Page 76 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Dedicated
76

8070809

SMD Ceramic
Capacitor-6.3V-4.7nF-+/-10%X7R-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C4616

77

8070683

SMD Ceramic
Capacitor-16V-82nF-+/-10%-X
7R-0402-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C4617

81

8070700

SMD Ceramic
Capacitor-25V-0.068nF-+/-5%NP0-0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

C4711, C5602, C5603

82

8070950

SMD Ceramic
Capacitor-25V-0.018nF-+/-5%C0G-0.6mm*0.3mm*0.3mm-T
erminal Dedicated

4.0 PCS

C5013, C5014, C5322,

C5514

84

8070748

SMD Ceramic
Capacitor-25V-0.0039nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

C5304, C5305

85

8070614

SMD Ceramic
Capacitor-16V-100nF-+/-10%X7R-0402-BT

1.0 PCS

C5306

86

8070750

SMD Ceramic
Capacitor-25V-0.0068nF-+/-0.
5pF-NPO-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

4.0 PCS

C5307, C5308, C5312,

C5313

88

10100112

Mobile Dedicated,Chip
Inductor-0.0033uH-+/-0.3nH-0.
18A-0.3ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

C5314, L5302

91

8070697

SMD Ceramic
Capacitor-25V-0.012nF-+/-5%NP0-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

C5325

92

7090911

Chip Thick Film

Resistor-0.05W-0ohm-< 50m
ohm-0201-ELOM,TS16949

97.0 PCS

C5330, C5335, C5508,

C5509, C5510, L5319,
R1007, R1013, R1014,
R1223, R1301, R1313,
R1314, R1402, R1403,
R1408, R1409, R1605,
R1622, R1634, R1699,

2013-04-09

Huawei confidential. No spreading without permission.

Page 77 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position
R1811, R1814, R1816,
R1817, R1819, R1821,
R1823, R1825, R1827,
R1830, R1850, R1851,
R1912, R1922, R1937,
R2001, R2003, R2004,
R2107, R3001, R3003,
R3006, R3007, R3009,
R3010, R3016, R306, R3112,
R3113, R3126, R3130,
R3131, R4018, R4104,
R4105, R4201, R4202,
R4204, R4302, R4314,
R4704, R5017, R5020,
R5021, R5022, R5103,
R5104, R5106, R5107,
R5128, R5129, R5130,
R5132, R5133, R5148,
R5155, R5161, R522, R523,
R5304, R5305, R5307,
R5308, R5310, R5401,
R5402, R5405, R5501,
R5502, R5503, R5507,
R5521, R5609, R5621,
R5629, R5805

99

8070751

SMD Ceramic
Capacitor-25V-0.027nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5619

100

8070741

SMD Ceramic
Capacitor-25V-0.001nF-+/-0.2
5pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5641

101

8070754

SMD Ceramic
Capacitor-25V-0.039nF-+/-5%NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

C5810

102

15040311

Transient Suppression
Diode-6V-12V-50W-5A-SOD9
23-Terminal Dedicated

2.0 PCS

D1301, D1302

103

15040339

Transient Suppression
Diode-6V-12V-30W-3A-0201Terminal Dedicated

15.0 PCS

D1406, D1601, D1602,

D1903, D2101, D2102,
D2104, D2105, D2106,
D2108, D2201, D2202,
D2240, D2241, D2242

104

15010262

Switching
Diode-75V-200mA-1V-SOD-5
23

1.0 PCS

D1600

2013-04-09

Huawei confidential. No spreading without permission.

Page 78 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

105

15040264

Transient Suppression
Diode-7V-15V-1A-SOD882/04
02-Terminal Dedicated

2.0 PCS

D1901, D1902

106

15010251

Schottky
diode-30V-0.2A-0.5V-SOD523

2.0 PCS

D1905, D4301

108

15040278

Zener,5.1V,0.2W,SOD323

1.0 PCS

D5001

109

19040169

Protection Tube,Fast Blowout

Fuse,24V,3A,IEC
Spec,0.03ohm,0.100
A*A*Sec,UL,Terminal
Dedicated

1.0 PCS

F1900

110

51623866

TOP-HIELD-COVER-3-CN-C
9800D

1.0 PCS

F2401

111

51623862

TOP-SHIELD-PRAME-2-CNC9800D

1.0 PCS

F2402

112

51623861

TOP-SHIELD-PRAME-1-CN

1.0 PCS

F2403

113

51623880

SIM-Rail-C9800D

1.0 PCS

F2404

114

51623881

SIM-Rail2-C9800D

1.0 PCS

F2405

115

51623878

BOT-SHIELD-FRAME-2-CNC9800D

1.0 PCS

F2406

116

51623864

BOT-SHIELD-PRAME-1-CNC9800D

1.0 PCS

F2407

117

51623879

B-Camera-nut-C9800D

1.0 PCS

F2408

118

51623883

PCB-Steel-C9800D

1.0 PCS

F2409

122

14240576

Card Block Connector,BTF

Connector,3*2,Female,1.3mm,
Terminal Dedicated

2.0 PCS

J1301, J1901

123

14240375

BTB
Connector,female,40Pin,0.4m
m,0.8mm,SMT,Terminal
Dedicated

1.0 PCS

J1601

124

14240496

BTB
Connector,Female,24Pin,0.4m
m,SMT,Mating Height
0.8mm,Terminal Dedicated

2.0 PCS

J1801, J2201

125

14240579

BTB
Connector,BTBconnector,34PI
N,0.4mm,0.8mm,SMT,female,
Terminal Dedicated

1.0 PCS

J1802

126

14240155

Card Socket Connector,SIM

Card

2.0 PCS

J2101, J2102

2013-04-09

Huawei confidential. No spreading without permission.

Page 79 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Socket,6pin,Horizontal,2.54m
m,Without Lock,Without Hold
Peg,Height 0.95mm,Terminal
Dedicated
127

14240460

BTB
Connector,female,10Pin,0.4m
m,0.9mm,SMT,Terminal
Dedicated

1.0 PCS

J2202

129

14240433

RF Connector,Coaxial
Connector,50ohm,Straight,mal
e,SMT,W.FL2,PCN
Control,Terminal Dedicated

1.0 PCS

J4401

130

14240655

RF Connector,RF
Switch,Straight,female,SMT,S
plit from 14240432,Terminal
Dedicated

4.0 PCS

J4402, J5301, J5402, J5503

131

51621023

108-5785,Ground
Spring,U1250

2.0 PCS

J5400, J5403

132

51623882

Antenna-contact-C9800D

5.0 PCS

J5401, J5501, J5505, U5302,

U5304

135

51621024

WN9149-N83-7F-W,Antenna
Spring,U1250

1.0 PCS

J5502

136

10100541

Terminal Power
Inductor,0.47uH,+/-30%,3.4A,
0.039ohm,2.5*2.0*1.2mm,100
8,3.8A,High Current
Inductor,Terminal Dedicated

1.0 PCS

L800

137

10100175

Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-2A-0.1
15ohm-2.5*2.0*1.2mm

2.0 PCS

L900, L901

138

10100475

Terminal Chip
Inductor,2.2uH,+/-20%,1.75A,
0.096ohm,2.5*2.0*1.2mm,1.8
A,include self-temperature rise
40degC,Terminal Dedicated

3.0 PCS

L903, L904, L905

139

10100185

Mobile Dedicated,Chip
Inductor-2.2uH-+/-20%-0.97A0.19ohm-2.5*2.0*1.0mm

2.0 PCS

L1210, L5604

140

10100051

Mobile Dedicated,EMI beads,

600ohm+/-25%,0.2A,0.65ohm,
0402,BT,Terminal Dedicated

11.0 PCS

L1502, L1910, L3101,

L3102, L3105, LB600,
LB601, LB602, LB603,
LB604, LB605

141

10100147

SMT Power
Inductors,22uH,20%,0.42A,0.7
56ohm,3*3*1.2mm,Terminal

1.0 PCS

L1600

2013-04-09

Huawei confidential. No spreading without permission.

Page 80 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Dedicated
142

10100473

Mobile Dedicated,Chip
Inductor-2.2uH-+/-30%-1.9A-0
.117ohm-2.5*2.0*1.2mm-Term
inal Dedicated

2.0 PCS

L1601, L1803

144

10100038

Terminal Chip
Inductor,0.015uH,+/-5%,0.3A,
0.5ohm,0402,2300000000Hz,
Multilayer inductor,Terminal
Dedicated

3.0 PCS

L1804, L1805, L1806

145

10100353

Terminal Chip
Inductor,1uH,+/-30%,3.0A,0.0
59ohm,2.5*2.0*1.2mm,Termin
al Dedicated

1.0 PCS

L1901

146

10100328

Terminal Chip
Inductor,1uH,+/-30%,1.58A,0.
102ohm,2.5*2.0*1.2mm(comp
atible with
2.4*2.4*1.2mm),Terminal
Dedicated

3.0 PCS

L3103, L3230, L5605

148

10100053

Terminal Power
Inductor,4.7uH,20%,0.49A,0.8
97ohm,0805,0.275A,Terminal
Dedicated

1.0 PCS

L4001

149

10100168

Special Inductor and

Bead,Power
Inductor,4.7uH,-+/-20%,0.8A,0
.18ohm,2.5*2.0*1.2mm,25MH
z,Terminal Dedicated

1.0 PCS

L4002

151

10100119

Terminal Chip Inductor,

0.0062uH,+/-5%,0.15A,0.44oh
m,0201,EAR99.Chip Inductor

1.0 PCS

L4402

152

10100116

Mobile Dedicated,Chip
Inductor-0.0047uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated

2.0 PCS

L4501, L4502

154

10100127

Mobile Dedicated,Chip
Inductor-0.018uH-+/-5%-0.1A0.9ohm-201

3.0 PCS

L4603, L5313, L5801

155

10100079

Terminal Chip
Inductor,0.039uH,+/-5%,0.2A,
0.6ohm,1.19*0.64*0.66 max
mm-2100000000Hz,wire
wound inductor

1.0 PCS

L4605

156

10100124

Mobile Dedicated,Chip

2.0 PCS

L4606, L5306

2013-04-09

Huawei confidential. No spreading without permission.

Page 81 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Inductor-0.01uH-+/-5%-0.15A0.63ohm-201-TS16949-Termin
al Dedicated
157

10100118

Mobile Dedicated,Chip
Inductor-0.0056uH-+/-0.3nH-0.
15A-0.4ohm-201-TS16949-Ter
minal Dedicated

3.0 PCS

L5301, L5303, L5804

159

10100117

Mobile Dedicated,Chip
Inductor-0.0051uH-+/-0.3nH-0.
15A-0.4ohm-201

1.0 PCS

L5304

160

10100128

Mobile Dedicated,Chip
Inductor-0.022uH-+/-5%-0.1A1.2ohm-201-TS16949-Termina
l Dedicated

2.0 PCS

L5307, L5314

165

10100033

Mobile Dedicated,chip
Inductor,10nH+/-5%,0.45ohm,
0.2A,0402,Terminal Dedicated

1.0 PCS

L5315

166

8070749

SMD Ceramic
Capacitor-25V-0.0047nF-+/-0.
25pF-NPO-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

L5317

169

10100280

Mobile Dedicated,Chip
Inductor-0.18uH-+/-5%-0.1A-3
.8ohm-1.0*0.5*0.55mm-0402500000000Hz-Terminal
Dedicated

1.0 PCS

L5603

170

10100350

Mobile Dedicated,Chip
Inductor-0.47uH-+/-30%-1.6A0.075ohm-2.0*1.6*1.0mm-Ter
minal Dedicated

1.0 PCS

L5606

171

10100122

Mobile Dedicated,Chip
Inductor-0.0082uH-+/-5%-0.15
A-0.55ohm-201-TS16949-Ter
minal Dedicated

1.0 PCS

L5607

174

10100150

ZD Dedicated Inductor and

Bead,EMI
Bead,330ohm@100MHZ,25%,
1.5A,0.08ohm,0603,Terminal
Dedicated

1.0 PCS

LB1201

175

10070019

EMI
beads,+/-25%,1000ohm,1.25oh
m,0.25A,0402

7.0 PCS

LB1601, LB1602, LB1603,

LB1604, LB1605, LB2201,
LB2204

177

10100507

Terminal EMI
beads,220ohm,25%,3A,0.04oh
m,0805,@30~500M

1.0 PCS

LB1900

2013-04-09

Huawei confidential. No spreading without permission.

Page 82 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Impedance>120ohm,Terminal
Dedicated
178

10100184

Terminal EMI
beads-1800ohm-25%-0.2A-2.2
ohm-0402-Terminal Dedicated

3.0 PCS

LB2205, LB2206, LB2207

179

10100075

Mobile Dedicated,Chip
Inductor-0.0062uH-+/-0.2nH-0.
7A-0.09ohm-1.19*0.7*0.66
max
mm-4800000000Hz-Terminal
Dedicated

1.0 PCS

LB5802

180

15020235

LED,240cd,white,500mA,Ter
minal Dedicated,Flash LED

1.0 PCS

LED1801

182

15060238

MOSFET,N
Channel,20V,0.7A,530mohm,6
V,SC,75

6.0 PCS

Q2101, Q4301, Q4302,

Q5100, Q5101, Q5102

184

7092269

Chip Thick Film

Resistor-0.05W-1800ohm-+/-1
%-0201(0.6*0.3*0.23mm)-Ter
minal Dedicated

1.0 PCS

R300

185

7092050

Chip Thick Film

Resistor-0.05W-200ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated

1.0 PCS

R301

186

7091300

Chip Thick Film

Resistor-0.05W-6040ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

3.0 PCS

R302, R303, R304

188

7091298

Chip Thick Film

Resistor-0.05W-4700ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated

9.0 PCS

R1101, R2104, R2105,

R2113, R3011, R3014,
R3198, R3199, R400

190

7091150

Chip Thick Film

Resistor-0.05W-22ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

1.0 PCS

R405

191

7091161

Chip Thick Film

Resistor-0.05W-2000ohm-+/-5
%-0201-Terminal
Dedicated-Terminal Dedicated

4.0 PCS

R1812, R1813, R406, R407

192

7091172

Chip Thick Film

Resistor-0.05W-22000ohm-+/1%-0201-Terminal

14.0 PCS

R1004, R500, R501, R502,

R503, R504, R505, R506,
R507, R508, R509, R510,

2013-04-09

Huawei confidential. No spreading without permission.

Page 83 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Dedicated-Terminal Dedicated

Position
R511, R5306

193

7092051

Chip Thick Film

Resistor-0.05W-240ohm-+/-1%
-0.6mm*0.3mm*0.23mm-Term
inal Dedicated

4.0 PCS

R512, R513, R514, R515

194

7091159

Chip Thick Film

Resistor-0.05W-1000ohm-+/-5
%-0201-ELOM,TS16949

15.0 PCS

R1311, R2135, R2136,

R4301, R4310, R4311,
R4601, R5124, R516, R517,
R518, R519, R5309, R5311,
R5313

196

7090800

Chip Thick Film

Resistor-0.0625W-0ohm-<
50mohm-0402-1A-BT

18.0 PCS

R1102, R1103, R1502,

R1943, R2101, R2102,
R2142, R2268, R2269,
R5000, R5001, R5010,
R5100, R5102, R5301,
R5302, R5650, R702

198

7091408

Chip Thick Film

Resistor-0.05W-68000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

R1008, R900

199

7090875

Chip Thick Film

Resistor-0.0625W-100000ohm+/-1%-0402

1.0 PCS

R901

200

7092053

Chip Thick Film

Resistor-0.05W-1000000ohm+/-1%-0.6mm*0.3mm*0.23mm
-Terminal Dedicated-Terminal
Dedicated

2.0 PCS

R3109, R902

201

7090823

Chip Thick Film

Resistor-0.0625W-180000ohm+/-1%-0402

1.0 PCS

R903

202

7091256

Chip Thick Film

Resistor-0.05W-33ohm-+/-5%0201-Terminal
Dedicated-Terminal Dedicated

3.0 PCS

R5626, R907, R908

203

7091246

Chip Thick Film

Resistor-0.05W-100000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated

17.0 PCS

R1105, R1633, R1637,

R1929, R1933, R1935,
R2106, R2187, R2264,
R3230, R3299, R4315,
R5115, R5116, R5139,
R5140, R5153

204

7091405

Chip Thick Film

Resistor-0.05W-56000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R1002

2013-04-09

Huawei confidential. No spreading without permission.

Page 84 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

205

7091169

Chip Thick Film

Resistor-0.05W-10000ohm-+/5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

20.0 PCS

R1010, R1011, R1514,

R1639, R1640, R1808,
R1809, R1910, R1917,
R1921, R2012, R3104,
R3121, R3140, R3195,
R3197, R4014, R4101,
R4203, R5109

206

7091350

Chip Thick Film

Resistor-0.0625W-1500ohm-+/
-1%-0402-BT

1.0 PCS

R1020

207

7091378

Chip Thick Film

Resistor-0.0625W-27400ohm+/-1%-0402

1.0 PCS

R1021

208

7091301

Chip Thick Film

Resistor-0.05W-10000ohm-+/1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

5.0 PCS

R1104, R1939, R1940,

R3008, R5312

210

7091175

Chip Thick Film

Resistor-0.05W-100000ohm-+/
-5%-0201-Terminal
Dedicated-Terminal Dedicated

6.0 PCS

R1226, R1231, R1505,

R1512, R1901, R1947

211

7091380

Chip Thick Film

Resistor-0.0625W-39200ohm+/-1%-0402

1.0 PCS

R1232

212

7090858

Chip Thick Film

Resistor-0.0625W-2000000oh
m-+/-1%-0402

1.0 PCS

R1302

213

7091783

Chip Thick Film

Resistor-0.2W-0.01ohm-+/-1%
-0603

1.0 PCS

R1303

216

7091155

Chip Thick Film

Resistor-0.05W-100ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

7.0 PCS

R1309, R1310, R4308,

R5118, R5119, R5122,
R5123

217

7090796

Chip Thick Film

Resistor-0.0625W-18000ohm+/-5%-0402

1.0 PCS

R1312

218

7090810

Chip Thick Film

Resistor-0.0625W-2200ohm-+/
-1%-0402-ELOM

1.0 PCS

R1501

219

7091393

Chip Thick Film

Resistor-0.0625W-301000ohm+/-1%-0402

1.0 PCS

R1603

2013-04-09

Huawei confidential. No spreading without permission.

Page 85 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

220

7091389

Chip Thick Film

Resistor-0.0625W-91000ohm+/-1%-0402

1.0 PCS

R1604

221

7091395

Chip Thick Film

Resistor-0.0625W-392000ohm+/-1%-0402

1.0 PCS

R1611

222

7091148

Chip Thick Film

Resistor-0.05W-10ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

R1638, R4103

225

7092272

Chip Thick Film

Resistor-0.05W-180ohm-1%-0
201(0.6*0.3*0.23mm)-Termina
l Dedicated

1.0 PCS

R1907

227

7091174

Chip Thick Film

Resistor-0.05W-51000ohm-+/5%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

5.0 PCS

R2005, R2402, R4001,

R4002, R4003

228

7090867

Chip Thick Film

Resistor-0.0625W-10000ohm+/-1%-0402-BT

1.0 PCS

R2013

229

7091374

Chip Thick Film

Resistor-0.0625W-20000ohm+/-1%-0402-TS16949

1.0 PCS

R2103

230

7091162

Chip Thick Film

Resistor-0.05W-2200ohm-+/-1
%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

3.0 PCS

R2120, R2121, R5026

231

7091404

Chip Thick Film

Resistor-0.05W-180ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

2.0 PCS

R2204, R4706

232

7091153

Chip Thick Film

Resistor-0.05W-51ohm-+/-5%0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

12.0 PCS

R2240, R2241, R2242,

R4007, R4008, R4010,
R4020, R4309, R4312,
R4313, R4710, R5511

233

7091166

Chip Thick Film

Resistor-0.05W-5100ohm-+/-5
%-0201-/

2.0 PCS

R2401, R4603

237

7091384

Chip Thick Film

Resistor-0.0625W-51000ohm-

1.0 PCS

R3128

2013-04-09

Huawei confidential. No spreading without permission.

Page 86 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

+/-1%-0402
238

7090892

Chip Thick Film

Resistor-0.0625W-30000ohm+/-1%-0402

2.0 PCS

R3129, R3242

239

7090798

Chip Thick Film

Resistor-0.0625W-22000ohm+/-1%-0402

1.0 PCS

R3241

240

7091151

Chip Thick Film

Resistor-0.05W-30ohm-+/-5%0201-Terminal
Dedicated-Terminal Dedicated

6.0 PCS

R4005, R4011, R4012,

R4205, R4206, R4707

241

7091146

Chip Thick Film

Resistor-0.05W-4.7ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4102

242

7091247

Chip Thick Film

Resistor-0.05W-2.2ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4106

244

7091176

Chip Thick Film

Resistor-0.05W-121000ohm-+/
-1%-0201-Terminal
Dedicated,TS16949-Terminal
Dedicated

2.0 PCS

R1000, R4307

245

7090850

Chip Thick Film

Resistor-0.0625W-12100ohm+/-1%-0402

1.0 PCS

R4502

246

7091017

Chip Thick Film

Resistor-0.05W-560ohm-+/-5%
-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R4602

248

7091280

Chip Thick Film

Resistor-0.0625W-604000ohm+/-1%-0402

1.0 PCS

R4703

249

7090829

Chip Thick Film

Resistor-0.0625W-47000ohm+/-1%-0402

1.0 PCS

R4711

250

7091168

Chip Thick Film

Resistor-0.05W-6200ohm-+/-1
%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R5012

251

7091394

Chip Thick Film

Resistor-0.0625W-330000ohm+/-1%-0402

1.0 PCS

R5013

2013-04-09

Huawei confidential. No spreading without permission.

Page 87 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

252

7092168

Chip Thick Film

Resistor-0.0625W-39000ohm+/-1%-0402(1.0*0.5*0.35mm)Terminal Dedicated

1.0 PCS

R5016

253

7091139

Chip Thick Film

Resistor-0.0625W-5.1ohm-+/-5
%-0402

2.0 PCS

R5126, R5127

254

7091250

Chip Thick Film

Resistor-0.05W-12000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R5143

257

7091173

Chip Thick Film

Resistor-0.05W-47000ohm-+/5%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R5602

258

7091299

Chip Thick Film

Resistor-0.05W-30000ohm-+/1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R5637

259

7050106

NTC-220000ohm-NTC-0402-1
.0*0.5*0.5mm-Terminal
Dedicated

1.0 PCS

RT1801

260

7050063

NTC-150000ohm-SMT-0402Terminal Dedicated

1.0 PCS

RT4701

261

7040075

Varistor-18V-14V-10A-40V-S
MT-0402-Terminal Dedicated

1.0 PCS

RV1900

262

16100067

Tact
Switch,SPDT,DC,SMT,0.4mm,
5.65*3.5*0.9,5000,Terminal
Dedicated

1.0 PCS

S2102

263

10100527

Terminal Common Mode

Inductor,28ohm,+/-20%,5V,0.1
A,
2.5ohm,03025,0.85*0.65*0.45(
mm),TAIYO YUDEN
12ohm@100M;TDK
35ohm@100M,Terminal
Dedicated

8.0 PCS

T1801, T1802, T1803,

T1804, T1805, T1806,
T1807, T1808

264

10100331

Terminal Common Mode

Inductor,40ohm,+/-25%,5V,0.1
A,1.625ohm,1.25*1.0*0.5(mm)
,Terminal Dedicated

1.0 PCS

T1901

265

10100564

Terminal Com-mode
Inductor,45ohm,+/-25%,5V,0.1
A,2.5ohm,0504,1.25mm*1.0m

1.0 PCS

T1902

2013-04-09

Huawei confidential. No spreading without permission.

Page 88 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

m*0.65mm,USB D+/DApplication
266

12070038

Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(
max),+1.8V,+/-0.5ppm(max),-4
0degC,85degC,Terminal
Dedicated

2.0 PCS

TCXO1001, TCXO5601

270

35020171

Consumption
Chip,Hi3620GFCV111G15,FC
CSP
576,1.1/1.2/1.8/2.6/3.3V,Appli
cation processor

1.0 PCS

U300

271

40020229

DDR2 DRAM,16Gb
LPDDR2,533MHz,32bit,1.8V/
1.2V,216BALL
FBGA(POP),D2
Dedicated,Terminal Dedicated

1.0 PCS

U300_POP

272

39200279

Dedicated Terminal
IC,CDMA2000 1*Digital
Baseband
Processor(QSC6085-1),
Support EV-DO rev.A and
S-GPS,3.0/3.6V/4.2/5.0V,BGA
424(Pb-Free),Terminal
Dedicated

1.0 PCS

U700

273

39110780

Switching Regulators-DC/DC
buck for
GPU-2.5V-5.5V-4000mA-2.5
MHz-CSP16-Terminal
Dedicated

1.0 PCS

U800

274

35020158

Consumer
Chips-Hi6421GFCV231-FCCS
P189-1.8/3.3/4.2V-K3 PMU
and Codec chip

1.0 PCS

U900

275

40060453

NAND FLASH,32GB EMMC

V4.41,52MHz,1024KB,3.3V,F
BGA169(Pb-Free),D2
Dedicated,Terminal Dedicated

1.0 PCS

U1101

276

38020077

Analog Switch,one input one

output Load
switch,1.1V~3.6V-1.8Vinput,<
55mohm;1.2Vinput,<90mohm,
WLCSP4,Terminal Dedicated

2.0 PCS

U1102, U3203

277

39080180

Operation Amplifier,Audio
Power
Amplifier,2.5V~5.5V,Differenc
ial,Micro SMD

1.0 PCS

U1201

2013-04-09

Huawei confidential. No spreading without permission.

Page 89 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

16pin(WLCSP),Terminal
Dedicated
278

39070073

-0.3~2.75V,Battery
Gauge,SON,Terminal
Dedicated

1.0 PCS

U1301

280

39080124

Operation
Amplifier,Headphone Audio
Power Amplifier,2.3 V to 5.5
V,differential AB
Amplifier,QFN,Terminal
Dedicated

1.0 PCS

U1501

281

39110626

Switching
Regulators-Vin~38V-0.02A-Q
FN-2*2-SMT-2*2-10 LED
Driver, Terminal Dedicated

1.0 PCS

U1600

282

39110636

Switching
Regulators-ThinQFN-LCD
Driver-Terminal Dedicated

1.0 PCS

U1601

283

39110620

Power Driver,1.5A LED flash

driver IC,CSP,Terminal
Dedicated

1.0 PCS

U1800

284

39070149

Battery Management IC-charge

IC-buck-3A input
ability-3.9V-6.5V-QFN-24-OT
G-Terminal Dedicated

1.0 PCS

U1901

285

38020043

Analog
Switch,DPDT,3.0~3.6V,6.5oh
m,550MHz,Terminal
Dedicated

1.0 PCS

U1902

286

38020071

Analog Switch,double-pole,
triple throw (DP3T)
multiplexer,2.5V-4.5V,<6.6oh
m,1470MHz,QFN12,Terminal
Dedicated

1.0 PCS

U1905

287

33030026

Temperature
Sensor,-40~+125degC,1.4V~2.
75V,Digital
Output,+/-1degC,DFN,60000us
,NA,12bit,IIC,Terminal
Dedicated

1.0 PCS

U2001

288

38140103

Semiconductor Sensor,three
axis
gyroscope,LGA-16,Terminal
Dedicated

1.0 PCS

U2003

289

38140098

Semiconductor

1.0 PCS

U2004

2013-04-09

Huawei confidential. No spreading without permission.

Page 90 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

Sensor,Accelerometer,LGA,3a
xis,Terminal Dedicated
290

38140069

Semiconductor
Sensor,E-Compass,WLCSP(Pb
-free),3axis,Terminal
Dedicated

1.0 PCS

U2005

291

38020072

Bi-directional,4PDT,
1.65-4.3V ,Rond(max)<12ohm
;Ronv<0.7ohm-160MHz-UML
P, Terminal Dedicated

3.0 PCS

U2101, U2102, U2109

292

36020419

CMOS,Dual
Reverse,QFN,33.6ns,20mA,C
MOS,CMOS, Terminal
Dedicated

1.0 PCS

U2111

293

39080185

Operation Amplifier, Linear

Motor
Driver,2.5~5.5V,Differential, 9
Ball 0.5mm Pitch
WCSP,Terminal Dedicated

1.0 PCS

U2203

294

43110067

AUDIO Chip,2 digital

microphones/4 Digital Audio
Ports (PCM/I2S)/Voice
equalization,BGA32, Terminal
Dedicated

1.0 PCS

U3000

295

38020046

DUAL
SPDT,2.7-4.2V,0.6ohm,16MH
z,QFN10L,Terminal Dedicated

2.0 PCS

U3001, U3002

296

43090148

VIDEO Chip,49
VFBGA,1.2V/1.8V/3.3V,HDM
I&USB 2in1,1080p/60Hz,
Terminal Dedicated

1.0 PCS

U3101

297

39110548

LDO-3.3V-2%-0.15A-SC70-5Terminal Dedicated-Terminal
Dedicated

1.0 PCS

U3104

298

39110756

Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,D
FN/QFN

2.0 PCS

U3105, U3204

299

38020074

Analog Switch,one input one

output load
switch,1.4V~5.5V,60mohm,W
LCSP, Terminal Dedicated

2.0 PCS

U4001, U5001

300

40060417

MCP,1Gb(64Mx16) NAND
FLASH,23MHz,128KB,1.8V,1
30ball
BGA(Pb-free),256Mb(16Mbx1

1.0 PCS

U4201

2013-04-09

Huawei confidential. No spreading without permission.

Page 91 of 187

D2 Maintenance Manual

No.

Part Number

Name

INTERNAL

Quantity

Position

6) DDR 200MHz,Terminal
Dedicated
301

12070055

Temperature Compensated
Oscillator,19.2MHz,+/-2.5ppm,
2.8V,+/-2.0ppm,-30degC,85de
gC,Terminal Dedicated

1.0 PCS

U4302

302

47100136

Power Module,824~
849MHz,27dB(High
Gain)/17dB(Low Gain),M9
3*3mm

1.0 PCS

U4700

303

47050047

RF coupler,823
MHz~925MHz,19.40 +/- 1.00
dB,32dB,0402,Terminal
Dedicated

1.0 PCS

U4702

304

39200454

Terminal Baseband process

IC,GSM/GPRS BASEBAND
PROCESSOR
MT6252D,1.2V/1.8V/2.8V,TF
BGA-350,Terminal Dedicated

1.0 PCS

U5000

305

36020366

CMOS,4BIT Level Shifter

With Automatic Direction
Sensing,WLCSP(Pb-free),7.4ns
,50mA,CMOS,CMOS,Termina
l Dedicated

1.0 PCS

U5100

306

47150231

RF Multi-Functional
Device,QUAD-BAND
Tx/DUAL-BAND Rx
GSM/GPRS
TxM,824~849/880~915/1710~
1785/1850~1910MHz,QFN,Ter
minal Dedicated

1.0 PCS

U5301

307

13080106

Duplexer,1565~1607MHz/240
0~2500MHz,0.8dB./0.9dB.,13d
B./18dB,1608,Terminal
Dedicated

1.0 PCS

U5400

308

47140114

RF
Switch-20~6000MHz-SPDT-0.
65dB
max.-1.43-22dB.-QFN-Termin
al Dedicated

1.0 PCS

U5501

309

47140113

RF
Switch-100~3500MHz-SP3T-0
.65dB max. at
2400~2500MHz-1.29 at
2450MHz-32dB.-QFN-Termin
al Dedicated

2.0 PCS

U5502, U5504

2013-04-09

Huawei confidential. No spreading without permission.

Page 92 of 187

D2 Maintenance Manual

INTERNAL

No.

Part Number

Name

Quantity

Position

310

39210059

Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949

1.0 PCS

U5603

311

47090053

RF LNA,1575MHz,14dB
min.,1.6dB
max.,SOT886,Terminal
Dedicated

1.0 PCS

U5801

312

36020404

LVCMOS,4 BIT bidirectional

voltage level translator with
automatic sensing,
QFN12,13.5ns,50mA,CMOS,C
MOS,0ns,0ns,0ns

1.0 PCS

U6501

313

12020125

Crystal,0.032768MHz,12.5pF+
/-30ppm,60/80kohm,3.2*1.5
SMD,Terminal
Dedicate,ELOM,TS16949

2.0 PCS

X1000, X5000

314

12020202

Crystal
Oscillator,0.032768MHz,7pF,+
-20ppm,70000ohm,3.2*1.5,Ter
minal Dedicated

1.0 PCS

X4301

315

12020268

Crystal
Oscillitor,26MHz,7.5pF,+/-10p
pm,30ohm,3225,Terminal
Dedicated

1.0 PCS

X5301

316

15040385

Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN16-Terminal Dedicated

1.0 PCS

Z1601

317

15040384

Transient Suppression
Diode-5.6V-12V-50W-5A-WD
FN10-Terminal Dedicated

1.0 PCS

Z1602

318

13010147

SAW
Filter-881.5MHz-2.2dB-00241
564-Terminal Dedicated

1.0 PCS

Z4501

319

13010174

SAW
Filter-836.5MHz-2.1dB-1.4*1.
1mm-Terminal
Dedicated-TS16949

1.0 PCS

Z4700

320

13010188

SAW
Filter-942.5MHz-2.1-1.4mm*1
.1mm-Terminal Dedicated

1.0 PCS

Z5301

321

8071219

SMD Ceramic
Capacitor-10V-100nF-+/-10%X5R-0201-Terminal Dedicated

12.0 PCS

C1246, C300, C5019, C5020,

C5021, C5022, C5023,
C5024, C5025, C5026,
C5806, C5809

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No.

Part Number

Name

Quantity

Position

322

13010258

SAW
Filter-1842.5MHz/1960MHz-2.
8dB/3.0dB-50V-1814-Terminal
Dedicated

1.0 PCS

Z5302

323

13010189

SAW
Filter-897.5MHz-2.7dB-SFLT5
-0101-Terminal Dedicated

1.0 PCS

Z5303

324

13030067

Ceramic
Filter,2450MHz,1.8dB,20125,T
erminal Dedicated

2.0 PCS

Z5401, Z5501

325

13030061

Ceramic
Filter,5375MHz,1.7dB,SMD

1.0 PCS

Z5502

326

13010264

SAW
Filter-1590.16MHz-1.8dB-50V
-1411-Terminal Dedicated

2.0 PCS

Z5801, Z5802

327

22050075

Microphone,-42dB.,3.76*2.95*
1.1mm,silicon

1.0 PCS

MIC1402

328

7091177

Chip Thick Film

Resistor-0.05W-180000ohm-+/
-1%-0201-Terminal
Dedicated-Terminal Dedicated

1.0 PCS

R1001

329

13080068

Duplexer-TX:824MHz~849M
Hz/RX:869MHz~894MHz-1.5
dB.-2dB.-48dB./56dB.-2.5*2.0
*0.95-Terminal Dedicated

1.0 PCS

Z4401

330

05020YXR

Board
Software,HDD2-2010M,HDD2
-2010M01B,D2-2010 Handset
Software,Program,China(QSC6
085)

1.0 PCS

U4201

331

05020YXM

Board
Software,HDD2-2010M,HDD2
-2010M01A,D2-2010 Handset
Software,Program,China(K3V2
+QSC6085 + MTK6252D)

1.0 PCS

332

10100017

Terminal EMI
beads-470ohm-+/-25%-0.5A-0.
21ohm-0603-BT,TS16949-Ter
minal Dedicated

2.0 PCS

LB1202, LB1203

The component list is for your reference only and subject to changes without notices. The latest
component list is available in Huawei's ITEM information system. If you have any questions, contact
your local technical support.

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5 Software Upgrade
5.1 Preparing for the Upgrade
Table 5-1 Upgrading the Software
Category

Description

Remarks

Upgrade
environment

Computer

Operating system: Windows 2000/Windows

XP/Win7

Battery

Remaining power > 20%

update.app

This version is provided for reference only. Use the

latest version when upgrading the software.

Upgrade using the USB

port

Normal upgrade

Upgrade file

Forcible upgrade

5.2 Installing the Driver

Before upgrade, install the driver: connect the phone to the PC and switch the working mode of the USB
port to Normal (#*#2846579#*#* -> Engineering menu -> Background setting -> USB port mode ->
Normal) to see if the adb port can be found.
If you can find the adb port, ignore the following step.
If you cannot find the adb port, install the following driver.

Handset WinDriver.exe

5.3 Installing the Driver

There are two upgrade portals:
After turning on the phone, make sure the working mode of the USB port has been switched to Normal
(#*#2846579#*#* -> Engineering menu -> Background setting -> USB port mode -> Normal), then use
upgrade tool to conduct upgrade.
Disconnect the phone from the power socket. Press the volume key and connect the phone to a USB cable,
and the phone will be forced into USB upgrade mode, then use the upgrade tool to implement USB
upgrade.

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5.4 Login Tool

Password: Huawei

5.5 Configuration Tools

Select Allow upgrade for the second time
Select Firmware and select UPDATE.APP

Select Please Choose The Configuration File

Select the following configuration files (Configuration files are provided by the device).

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The configuration interface is displayed as follows.

Then enter the upgrade interface.

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5.6 Start Upgrade

Click Scan & Download to implement upgrade.

NOTE

This upgrade mode will erase user data.

5.7 Other Upgrade Modes

1.

Automatic, easy, and fast online HOTA system firmware update. Restoring the phone to default
settings.

2.

Local upgrade: Recover the update.app file in the local storage device. You can copy the upgrade file
to the phone through the MTP mode: Connect the phone to a computer, click the Media device (MTP),
and then open the device on the computer.

3.

USB update can be realized through software in a connected USB device. The update files are stored
in the dload folder in the root directory of the SD card.

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See the following figure and click Icon setting > About the device.

6 Repair Tools
Name: constant-temperature heat gun
Usage: heats components

Name: soldering iron

Usage: solders components

Name: DC regulated power supply

Usage: supplies power

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Name: soldering table

Usage: secures the PCBA

Name: lead-free tin solder wire

Usage: solders components

Name: digital multimeter

Usage: measures parameters during maintenance

Name: toolkit
Usage: assembles and disassembles the U9508

Name: electric screwdriver

Usage: fastens and removes screws

7 Disassembly Procedure
7.1 Disassembly Preparation
Disassembly tools: ESD-preventive gloves and wrist strap, pry bars, pry boards (homemade), tweezers,
four-angle screwdrivers, hexagon screwdrivers, and the cutting knives.

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7.2 Disassembly Procedure (Read the Notes to Save Workload)

NOTE

The disassembly of this phone is complex and hard to explain in traditional ways. The following figures are used to
illustrate the disassembly procedure. The numbers in the figures do not indicate the disassembly sequence. The left
procedure is prior to the right procedure. All the left procedures are necessary to their next procedure. The up procedure
is not necessarily prior to the bottom procedure. For example, if you want to remove the silicon pads of the
photoreceptor, implement only procedure 1, 3, 5, 10 + 11 + 12 + 13, 16, 19, 23 and ignore the others.

7.2.1 Removing the Battery Cover

1.

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Insert the cutting knife between the battery cover and A cover and separate them in the direction
shown in the figure.

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2.

INTERNAL

Remove the battery cover slowly.

7.2.2 Removing the SIM Card Component

1.

Use the tweezers to press the SIM card lever to release the SIM card component.

2.

After the SIM card component is released, hold the component and pull it out.

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7.2.3 Removing Screws of Cover C

Four screws

7.2.4 Removing Motor Support Insulation Mylar.

7.2.5 Removing Cover C Components

1.

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Release the shielding cover from the latch of cover C with tweezers.

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2.

Pry cover C from the front cover starting from the bottom right. There are seven latches as shown in
the figure.

3.

Remove cover C slowly.

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7.2.6 Removing Motor Support Screws

1.

Remove the screw at the top right of the support.

2.

Remove the FPC from the connector.

Tweezer

3.

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Remove the FPC of the motor pad starting from top right. Remove the FPC of the motor pad from the
headset connector FPC.

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4.

INTERNAL

Remove the screw at the left bottom of the support.

7.2.7 Removing the Fixed Speaker Box Screw

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7.2.8 Removing the Primary Camera

Connector

Camera

7.2.9 Removing the Secondary Microphone Cover

Silicon case of
the secondary
microphone

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7.2.10 Removing Main Board Screws

7.2.11 Removing the Main Board Graphite Sheet

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7.2.12 Removing the conductive fabric of the LCD Connector

7.2.13 Removing the Side Button Connector Mylar

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7.2.14 Removing the Motor Support Component

7.2.15 Removing Speaker Box

1.

Remove the speaker FPC connector from the main FPC.

2.

Pry the speaker box off the phone starting from the battery side. Do not damage the battery.

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7.2.16 Removing the Main Board Component

1.

Remove the power key, volume key, and FPC from the shielding cover. Then remove their male
connectors from the main FPC connector.

Stuck to the
shielding
cover

ZIF connector

2.

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Remove the main FPC connector from the main board.

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Stuck to the
shielding
cover

3.

Main FPC
connector

Remove the coaxial connector of the antenna and the male connectors of the USB-FPC, receiver-FPC,
LCD, and battery from the main board.
Receiver-FPC
connector

USB-FPC
connector
LCD
connector

Coaxial cable
connector of
the antenna

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Battery
connector

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7.2.17 Removing Screws at the Left of the Earphone

7.2.18 Removing the Coaxial Connector at the Antenna PCB Side

7.2.19 Removing the TP-LCD Component

1.

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Remove the TP from the slot of the middle cover support.

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2.

Heat the digital display heat gun to around 70C.

3.

Use a sucker to remove the TP-LCD.

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7.2.20 Removing the Main FPC

1.

Remove the main FPC from the battery slowly.

2.

Insert a stick with a diameter equaling that of a headphone ( 3 mm) into the headphone jack and pry
the headphone component as shown in the figure.

3.

Hold the headphone component and remove it from the front cover.

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7.2.21 Removing the Antenna PCB and Its Screws

Two
screws

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7.2.22 Removing the Receiver Ornament

Speaker
ornament

7.2.23 Removing the Silicon Pad of the Photoreceptor

Silicon pad of the
photoreceptor

7.2.24 Remove the Magnesium Support of the Middle Cover

1.

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Remove the screws of the magnesium support of the middle cover.

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2.

INTERNAL

Try to make the front cover deform as shown by the red line. Then press the magnesium support at the
bottom against the TP-LCD to remove the support from the front cover.

7.2.25 Remove REC-FPC and Receiver

1.

Pry the SMT-FPC photoreceptor of the receiver off the front cover.

2.

Remove the receiver-FPC from the front cover.

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3.

INTERNAL

Remove the receiver from the front cover.

7.2.26 Remove the USB-FPC

1.

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Remove the USB-FPC screws.

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2.

INTERNAL

Remove the USB component and USB-FPC from the front cover.

7.2.27 Removing Side Key FPC and Side Keys

1.

Remove the three screws of the side key FPC.

2.

Remove the FPC, washers, inner side key assembly, and side keys.

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After the FPC is removed, the side keys and inner

side key assembly can be taken out.

Pads
FPC

7.2.28 Remove the Battery.

1.

Heat the front cover and then use the home-made pry board to pry the battery off the cover.

2.

Insert the pry board ever deeper between the battery and the support until the battery is completely off
the front cover.

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7.2.29 Removing the Antenna Coaxial Cable

1.

Use tweezers to release the coaxial cable from the latch.

Latch at the bottom

of the battery
compartment

2.

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Pull the coaxial cable out slowly from right to left.

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7.2.30 Removing the Main Microphone FPC

7.2.31 Removing the Motor

Pull the motor out of the motor support in the direction as indicated by the arrow.

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7.2.32 Removing the Earphone Sealing Ring

7.2.33 Removing the Speaker Sealing Ring

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7.3 Disassembly Panoroma

8 Assembly Procedure
8.1 Assembly Preparation
Assembly tools: ESD-preventive gloves and wrist straps, tweezers, four-angle screwdrivers, hexagon
screwdrivers, and cutting knives.

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8.2 Assembly Procedure (Read the Notes to Save Workload)

NOTE

The assembly of this phone is complex and hard to explain in traditional ways. The following figures are used to
illustrate the assembly procedure. The numbers in the figures do not indicate the disassembly sequence. The left
procedure is prior to the right procedure. All the left procedures are necessary to their next procedure. The up procedure
is not necessarily prior to the bottom procedure. In addition, many components are one-off products in phone
maintenance. New components are needed in assembly.

8.2.1 Installing the Front Cover Components

1.

Install the power and volume keys.

a. Install the power and volume keys

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b. Install the inner side key assemblies.

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c. Install the dome pad.

2.

INTERNAL

d. Install the side key FPC and

screw the assemblies.

Install the receiver.

b. Install the REC FPC.

a. Install the REC

component

c. Install the silicon pad

of the sensor

3.

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Install the water-proof USB assemblies.

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a. Install the water-proof USB coil

4.

INTERNAL
b. Install the USB
assembly and
screw it.

Install the magnesium middle frame.

a. Install the middle cover

b. Snap the latch

Start from
this side.

c. Screw the middle cover

(seven screws in total)

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8.2.2 Installing the TP-LCD Assemblies

a. Stick the TP adhesive

b. Remove the
release paper.

Clean the front cover and the

TP with alcohol before sticking

d. Install the TP and press it tight.

c. Install the TP-LCD.

e. Stick the LCD FPC

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8.2.3 Installing the Shielding Cover of the Main Board

a. Shielding cover 1 and 2

b. Shielding cover 3 and 4

Shielding cover
3

Shielding cover 1

Shielding cover
4

Shielding cover 2

8.2.4 Installing the Camera

a. Install the primary camera

b. Install the
secondary camera

8.2.5 Installing the Secondary Microphone Sheath

a.Install the secondary
microphone sheath.

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8.2.6 Installing the Main Board

a. Install the main board

b. Install the TP, USB,

REC, and FPC assemblies

c. Screw the assemblies

8.2.7 Installing the Antenna Board

a. Connect the antenna mini-board
to the coaxial cable

b. Install the coaxial cable

The coaxial
cable here
should be
under the
latch.

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The coaxial cable

here should be
away from the right
screw hole to
avoid being
damaged while
installing cover C.

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8.2.8 Installing the Battery

a. Remove the release
paper of the battery

b. Install the battery and

snap it to the slot.

8.2.9 Installing the Main Microphone

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8.2.10 Installing the Motor, Main FPC, and the Speaker Box
a. Install the water-proof
pad of the headphone

b. Install the headphone

Tilt the headphone assembly 30 degrees

and install it slowly, then latch it.

c. Install the motor

d. Screw the headphone

holder (two screws)

e. Install the water-proof

pad for the speaker box

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f. Install the speaker box.

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g. Screw the speaker box and the motor (two

screws for the speaker box, one for the motor)

INTERNAL

h. Install the speaker box and the main

microphone ZIF connector.

8.2.11 Connecting the ZIF Connector of the Main FPC with the Side Key
FPC
a. Stick the side key FPC to the shielding cover

b. Connect the side key FPC ZIF to the

ZIF connector of the main FPC.

Glued to the
shielding cover.

ZIF connector

c. Install the side key connector mylar

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8.2.12 Sticking the Conductive Fabric and Graphite Sheet to the Main
Board
a. Stick conductive fabric of the
main board

Stick the fabric

using this angle as
the locating basis.
b. Stick the
graphite sheet

8.2.13 Installing Cover C

a. Install latches of cover C

b. Screw cover C (four screws)

1. Install latch1 and latch2 first

2. Install latch3 and latch and
avoid the latches from deforming

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8.2.14 Installing the Battery Cover

a. Remove the release paper
of the battery backplane
assembly.

b. Install the battery cover

Before install the battery

cover, clean the front cover
with alcohol for example.
Press the battery cover tight.

9 Troubleshooting Common Faults

Before repairing a phone, ensure that the failure of the phone is not caused by environmental factors or
incorrect functional settings,
and it is recommended that you restore the phone to its default settings.

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9.1 Working Principles of the Phone

Figure 9-1 Schematic Diagram of Circuits
Hi3620
LPDDR2/DDR3

HSIC
SDIO0
SPI1
UART1
GPIO

3G/4G
Modem

DDRC
Baseband I/F

LPDDR2/DDR3

ARM Cotex A9 *4
ICache

DCache

NANDC

NAND FLASH

eMMC 4.41

eMMC

MMC/SD3.0

Memory Card

PCM

1MB L2 Cache
Hi6421

I2S

Power
Audio

Audio Signal Processor

G2D/G3D GPU

Headset
Receiver

MMU
PMU_SPI

Headset
Vibrator

CSI/I2C

PMSPI

Speaker
MIC

MIPI CSI*2
Video Encoder

DVP

Video Decoder

PCM

BT Baseband

Hi6350

RF TX

WiFi

Camera3

LCD Panel 1

MIPI DSI*2

GPS/BT RF

BT/WiFi Switch

DVP/I2C

EDC

DMA Controller

Camera1
Camera2

ISP

LCD Panel 2

HDMI

TMDS/DDC/CEC

HD TV

System Controller
GPS Baseband

RF RX

CRG

Periph Ctrl

SYS
Ctrl

IO CONF

KeyPad Controller

SDIO1

UART4

BT

UART3

GPS

I2C0

FM X-Sensor

I2C1

Capacitive Charger
TP
IC

SIM

SPI0

Mobile TV

UART0

JTAG

Trace

Debug

8*8

KEYPAD

USB 2.0 Device

PC

USB 2.0 Host

USB Disk

PCI-E 1X

South Bridge

Huawei D2-2010 is a bar-type smartphone with AP+MODEM structure and based on the K3 platform.
Powered by 1.5 GHz quad core ARM Cortex-A9 processor, D2 is equipped with two dual-channel
LPDDR2 ports, which improves the system performance.D2's hardware structure can be divided into three
parts: the AP subsystem, Modem subsystem and RF module.K3 (AP) processes input and output signals
(including image, video, and connectivity signals) and provides interfaces for the keyboard, LCD screen,
SD card, Bluetooth module, and cameras. HI6421, as the audio codec and power management unit, is
responsible for encoding and decoding audio. X-GOLD 626 is the modem and responsible for the RF
interfaces. RF engine is responsible for transmitting and receiving radiofrequency signals. BCM4330 is an
integrated chip that supports Bluetooth, Wi-Fi and FM. BCM 4751 is an integrated chip that receives and
processes GPS signals. The whole system is composed of the PCBA, external battery and mechanical parts.
The PCBA incorporates the main board, main FPC (HD1U9800DL), side key FPC (HD1U9800DK), REC
FPC(HD1U9800DR), and USB FPC (HD1U9800DU).Others include TP/LCD modules, 1.3/13 megapixel
HD camera modules, and motor/microphone/speaker/recording modules. Mechanical parts include B shell,
C shell, sound cavity, main antenna, GPS antenna, and Wi-Fi/Bluetooth antenna.
Figure 9-2 shows the hardware structure of D2.

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Figure 9-2 Hardware structure of D2

Serial R array

ISP_8b
NAND_D0~D7/ctrl

GPIO:ECC_SEL

WIFI&BT 3

PU R array

eMMC_dat/cmd

eMMC_CLK

UART0

eMMC 4.41

JTAG

SPI0

I2C

CLK/CMD/D0..7

Bootmode

MODEM I/F

ESD

DDC/CEC/HPD
ESD&LS

Video Encoder

GPIO_72/
73/74/78

EMI
choke

TMDS
ESD

MMU

Video Decoder

From PMU

HDMI
D Connector

MODEM_EN
MODEM_RST
MODEM_PLED
MODEM_PD

HDMI

Serial R array

MODEM
Connector

Rbais=5.5k_%

G2D/G3D GPU
HSIC
SDIO0
SPI1
UART1

SDR50
DDR50

Micro SD
Connector

DCache
1MB L2 Cache

CLK/CMD/D0..3

UART4

ICache

PMU codec

HSIC
Connector

BT/TEST
mode
Selector R

APU

BT_BB

In_BT_PCM

Serial R array

ARM Cotex A9 *4

BT_CFG/CLK/RST
BT_SPI
In_BT_IOC

Serial R array

FAC/DFN

GPS_BB

GPS_IOC

/BT_BB
PCM R array

8b NANDC

CE/ALE/CLE/RE/WE/
CS0..3/RB0..3/IO0..7

Serial R array

MMC/SD3.0

GPS_PD
GPS_SPI(UART3)

BT_PRIO
BT_ACT
WIFI_ACT

Connector
Serial R array

Serial R on
CLK

TMDS/DDC/CEC

Serial R array
Serial R array

WIFI

WIFI_SDIO1

Serial R array

BWGU
Connector

ECC mode
Selector R

eMMC
NAND FLASH

DDC_5V

Charger

DMA Controller

SYS_CLK
RTC_CLK
RST
PWR_HOLD
PMU_INT
BUCK0/1/3_EN

VBUS

PMU SPI
PMU I2S
GPIO_LREN
GPIO_CHARGER_EN
I2C1 for CHARGER

CRG

Periph Ctrl

SYS
Ctrl

IO CONF

Confirmation
Circuit charger DRV

System Controller

PICO_VBUS_DCT
PICO_ID
PICO_D+/D-

VBUS
Charger

ESD
ESD
EMI

USB 2.0 HOST/Device

ESD

NANO_VBUS_DCT
PICO_D+/D-

ESD
EMI

USB 2.0 HOST

CLK & RST&AUDIO&SPI

Rbais=200ohm_1%

PICO_Rbais
NANO_Rbais

USB HOST
Connector

Speaker
MIC
Headset
Vibrator

Serial R array

Power
Audio
Headset
Receiver

USB
HOST/DEVICE
Connector

Confirmation
(charge pump)
Backup
Ossi

Rbais=200ohm_1%

ISP & MMU_CFG

8*8Keybaord
interface

MIPI_DSI0

I2C0/1

MIPI_CSI0

PCI-E 1X

MIPI_DSI1/CSI1

CLK/TX/RX

1CLK lane

4CLK lane

0R
D-PHY ESD

Rbais=6.04K_1%

0R
D-PHY ESD

Rbais=6.04K_1%

0R
D-PHY ESD

Rbais=6.04K_1%

To MMU connector

1CLK lane

Serial R array

PU R

Serial R array

4CLK lane

GPIO:
Xsensor_INT
TPC_RST/INT
PWM0/1

1CLK lane

GPIO:
ISP_I2C0/1
Serial R array

TX&RX
100MHz_REF

Rbais=191ohm_1%

Serial R array

4CLK lane

GPIO:
RST/FSIN/CLK/
FLASH_EN/PD

TX/RX ESD

To MMU connector

PCI-E 1X
Connector

By function, the PCBA can be divided into four subsystems: baseband (including the AP, modem, and BB),
RF, power, and user interfaces. Table describes the subsystems' modules, units, and their functions.
Table 9-1 Main Board System Structure
Subsystem

Module

Unit

Function

Baseband
subsystem

K3

Application subsystem

45 nm fabrication, dual ARM9 processors,

supports the micro SD card and UART/SIM
card, incorporates functional modules, such
as the I2C, HIS, MIPI, GPIO, HDMI, Smart
reflex 2, and clocks.

User interface
processing unit

Provides camera, PCM, broadband codec,

RF, HKADC, LCD, micro SD card, USB,
UART, SIM card, HSI, MIPI, GPIO,
JTAG/ETM, and keypad interfaces.

Multimedia and game

engine

The multimedia and game engine runs MPEG

and JPEG hardware engines and game
engines, JAVA accelerator, and provides
MP3/MMS/MIDI functions.

Modem BB

QSC6085(China Telecom): WCDMA

baseband module with low-consumption SIP

QSC6085/
MT6252DA

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Subsystem

Module

INTERNAL

Unit

/ Balong

RF subsystem

User interface
subsystem

2013-04-09

Function
technology. MT6252DA(China
Telecom):GSM baseband module. Balong BB
6920(China Mobile and China Unicom):
WCDMA/GSM 40nmbaseband module. The
subsystem include ARM processor, modem
DSP, interruption controller, and sleep
controller.

Modem PMU

Supplies power to modem and BB, provides

reset function, two Switch-Mode Power
Supplies (SMPS) and eight LDO regulators.

Modem memory

MCP (1G + 256M)

EMMC

EMMC feature, power

consumption, file
system support

Stores programs and NV items, 4 GB

DDR RAM

Power consumption

RAM for program running, 2GB

Transmissio
n and
receiving of
WCDMA
and
GSM/DCS

Smartti-UE2

Performs the RF function of WCDMA signal

reception and transmission. Mainly includes
the RFMD RF chip, PMU, and the peripheral
circuit.

GPS

GPS reception

Receives and processes GPS signals, mainly

including Broadcom 4751 chip and its
peripheral circuit.

Bluetooth
interface

Bluetooth module

Transmits and receives the Bluetooth

baseband function and RF signal. Mainly
includes the Bluetooth module of Broadcom
4330 and peripheral circuit.

Wi-Fi
interface

Wi-Fi Module

Transmits and receives Wi-Fi baseband and

RF signals, mainly includes Wi-Fi module of
Broadcom 4330 and the peripheral circuit.

Crystal
oscillator
and
frequency
synthesizer

26 MHz TCVCXO
and control circuit

Generates the highly accurate, 26 MHz local

reference clock TCVCXO.

Antenna

External antenna,
internal interface
component, antenna
protection

The phone uses internal antennas for wireless

communication, supporting WCDMA high
and low frequency bands. The VIVA phone
antennas include the main antenna,
Wi-Fi/Bluetooth antenna, and GPS antenna.

UART
interface

The UART0 interface of the AP subsystem is

used for commissioning; the UART1 is used
for the modem module. UART2 is used for
audio denoising chip ES305. UART3 is used

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Subsystem

Module

INTERNAL

Unit

Function
for MediaTek (MTK). UART4 is used to
connect the four-in-one chip W1873.

Power

2013-04-09

USB port

Driver, protection
circuit, output
interface component

Indicates the peripheral circuit of USB

interface in the AP, modem, and MHL
subsystems, and unit circuits such as
protection circuit and interface connectors. It
is the major data service channel for the
engineering sample, and can be used to debug
and test devices during product development.

SIM card
interfaces

Power supply,
protection circuit, SIM
card holder

Mainly includes the SIM card holder and

related connection circuits.

Color LCD
and
backlight

LCD driver, interface

mode, and backlight
control

Main display, 16.7 million colors

Speaker

Driver mode,
connection mode,
speaker component

The power of the speaker that plays

polyphonic ringtones when there is an
incoming call can be 500 mW. Their
frequency response is good enough to
playback 20 Hz to 20 KHz ringtones
smoothly. They can also play mono-audio
MP3 files.

Receiver

Driver mode,
connection mode,
receiver component

The power of the receiver for calls must be

less than 10 mW.

MIC

Interface circuit,
connection mode,
microphone
component

Built-in microphone, with dual silicon

microphone noise reduction.

Earphone

Earphone, headset
interface circuit,
microphone interface
circuit

The phone provides a headset jack to output

audio or MP3 audio. The microphone on the
headset cable picks up audio.

Vibration
motor
interface

Driver mode,
connection mode,
motor

When there is an incoming call, the motor

vibrates to notify the user of the call.

Acceleromet
er

I2C interface control

Senses acceleration to help realize game

functions.

Gyroscope

I2C interface control

Three-axial rate sensor

Compass

I2C interface control

Geomagnetic sensor

Proximity
sensor

I2C interface control

Senses the ambient light and proximity light.

Internal
backup

Li-ion battery,

Li-ion battery with standard output of 3.8

V/2900 mAh. It is required that the

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Subsystem

Module

Unit

Function

subsystem

battery

interface component

charge/discharge lifecycle is over 500 times.

The battery should pass the following
authentication: GB18287 safety requirements
(Li-ion battery)

External
power
supply
(travel
charger)

Adapter and interface

component

The charger can be used in China, Europe, the

USA, and Australia: 90264 V, 47-63 Hz,
AC input. The model differs with different
markets. The output voltage of the charger is
5 0.25 V. The charger passes certifications
such as the CE certification, China
Compulsive Certification, FCC, and A-tick
certification. The charger's output current
shall be adequate to charge the battery and
supply power to the phone for normal
operation at the same time.

Power
distribution
network and
power
management

Power distribution
network

Includes filtering networks and cabling for

the power supply.

Backup battery
management, charge
circuit, charge mode,
charge protection

It manages battery charging and discharging,

overcharging and over-discharging
protection, and also charges the capacitance
used for RTC current maintenance.

Board circuit power

management
(power-on/off
analysis)

Mainly indicates LDO, which manages power

supply flexibly. Based on the service status,
protocol requirements and power-saving
analysis, the board software manages power
supply to unit circuits on the board to reduce
power consumption. A 32 KHz sleep clock is
provided.

RTC

The built-in RTC circuit uses a sleep clock of

32.768 KHz to provide precise time.

ADC

Supports five 12 bit/10 bit/8 bit

programmable analog signal input.

Two I2C Interfaces

Controls the camera.

UVLO

Low-voltage power-off function. When the

input voltage is lower than the threshold for a
specific period, the phone powers off.

Overheat protection

When the on-chip junction temperature

exceeds 150C, the phone powers off.

Internal driver circuit

Provides the LED driver, the LCD backlight

driver, one vibrator driver, and one speaker
driver.

UART

High-speed UART1: 4 Mbit/s, low-speed

UART2: 115 Kbit/s

Interrupt management

The built-in interrupt manager handles

TWL1873
enhanced
functions

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Subsystem

Module

INTERNAL

Unit

Function
interrupted signals.

USB driver

D2 has a built-in OTG USB driver that

supports USB 2.0 HS and /B interface. Its
software supports the OTG function.

The following are maintenance schematics and reference drawings:

hc1c9800dm Front and Back board Drawings.rar

hc1T9800L & U9800D Front and Back Board Drawings.rar

hl1d25000m (Maintenance Schematic Diagram-China Mobile ).rar

hc1c9800dmMaintenance Schematic Diagram-China Telecom.rar

HL1D20082MMaintenance Schematic Diagram-China Unicom.rar

9.2 Startup Failure

Check the faulty phone and locate the fault. The possible faults are as follows:
1.

No voltage output caused by battery damage, protection upon startup caused by low voltage, or
improper installation of battery connection components

2.

Startup failure caused by PCBA faults

3.

Seeming power-on failure caused by LCD damage

4.

Seeming power-on failure caused by power key FPC fault (The power key is disabled.).

5.

Identification methods:

Check whether the motor vibrates or there is any start-up tone after the power key is pressed. If the
motor vibrates or there is start-up tone, the fault is LCD damage. Then replace the LCD to identify
the fault.

Use a USB charger to charge the faulty phone to identify that whether the fault occurs in the power
key FPC, the battery or the main board. If it is the power key FPC fault or battery fault, the
charging interface will be displayed after the USB power is connected.

If no charging interface is displayed and the battery is not faulty, the fault may occur in the PCBA.
In this case, disassemble the phone to detect the fault. After confirming that the battery and the
power key FPC are normal, you can determine that the main board is damaged.
For PCBA damage, you can charge the phone with external power supply, and then power on the
phone to detect the current to identify the possible cause.
Three situations may occur: excessive current, weak current, and no current.

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INTERNAL

9.2.2 Excessive Current (DC Power Supply)

Excessive current is mainly caused by short circuits. When the phone is charged by the DC power supply,
the current is equal to or greater than 500 mA. (Generally, it can achieve the output protection value of the
external power supply.)The main reason is ground short circuits of VBAT and VPH_PWR.
Figure 9-3 Troubleshooting excessive current
When charging the phone by
an external power supply or
dummy, excessive current is
detected after the power key
is pressed.

N
Check whether the relevant
circuits of the VPH_PWR are
short-circuited.

Check whether there is

a VBAT short circuit.

Check whether
the circuit of the battery
connection components
are short-circuited.

Y
Re-solder or
replace the
components.

Is the problem solved

after U1901 is removed.

End

N
Y

Check whether there is

short circuit in U1901,
U1301, and U5301.

Re-solder or
replace the
components.

Check whether other circuits

are short-circuited (especially
the circuits near the
connection components).

Check whether other circuits

are short-circuited (especially
the circuits near the
connection components).

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INTERNAL

9.2.3 Weak Current (DC Power Supply)

After the phone is powered on, if weak current is generated, partial short circuits may exist on the PM or
the system does not start normally and reserves certain current. It may be caused by main chip or memory
faults that result in the system startup failure. The current is between 20 mA and several hundreds mA.

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INTERNAL

Figure 9-4 Troubleshooting weak current

When charging the phone by
external power supply or
dummy battery, weak current is
detected after the power key is
pressed, but the phone cannot
be powered on.

N
Check whether
U900 power output
is normal.

Re-solder or replace
U900.

Check whether the

signals of XTAL26_IN
and RTC_OUT are
normal.

N
Re-solder or replace
TCX01001 and X1000

Y
Check whether
the signal of
H_SYS_NRESPW
R is normal.

N
Re-solder or replace
U900.

Y
Check whether other circuits
are normal (especially
circuits of U300, U1102, and
U300_POP)

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INTERNAL

The common power supplies are as follows:

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9.3 No Current (DC Power Supply)

This fault is caused when the power supply channel is not established or poorly soldered, or circuits related
to the power key are faulty.

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INTERNAL

Figure 9-5 Procedure of troubleshooting no current

When charging the phone
by external power supply or
dummy battery, no current is
detected.

N
Press to fasten the
side key or replace the
power key FPC.

Check whether the

side key FPC is
normal.

Check whether the

battery connection
components are
normal.

N
Re-solder or replace
battery connection
components.

Y
N
Check whether
D1905 is normal.

Re-solder or
replace D1905.

Re-solder or replace U1901.

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INTERNAL

9.4 Charging Failure

D2-2010 employs dedicated charging chip BQ24192 for charging control. If the system is operating
normally but fails to be charged, check circuits in the charging management module, or replace U1901 to
check whether this fault is fixed. If not, replace U1301 and check it again.
Figure 9-6 Schematic diagram of the charging circuit

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Figure 9-7 Schematic diagram of battery fuel gauge

9.5 Display Failure

Figure 9-8 Troubleshooting display failure
Display failure

N
No display at all?

Replace the screen to

deterrmine whether it is
screen failure or main
board failure.

Check whether the

screen is properly
connected to the man
baoard.

Snap the connectors

of the screen to the
main board.

Y
N
Check whether it is
a problem of the
screen.

Check
whetherL1600 and
U1600 are normal.

Y
Replace the FHD screen.

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9.6 Vibration Failure

Figure 9-9 Troubleshooting vibration failure
Vibration failure

N
No vibration at all?

Check whether the motor

FPC and the main board
FPC are well connected
via the ZIF connector.

Y
Whether the motor
vibrates when powered
on by an external
power supply?

N
Replace the motor.

Y
Check whether the
signal DR2_LM_VDP
and DR2_LM_VDN
are normal.

Check whether U300

and U2203
communicate with
each other well.

Y
Re-solder or replace U2203.

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INTERNAL

9.7 SIM Card Identification Failure

Figure 9-10 Troubleshooting SIM card detection failure
Unable to detect the SIM card.

Check whether the

SIM card holder work
properly.

N
Re-solder or replace
the holder J2102.

Y
Check whether the
SIM card detection
switch S2102 works
properly.

N
Re-solder or replace
the holder S2102.

Y
Check whether
the circuits of
SIM1_VCC/SIM2_VCC
and other circuits are
normal.

N
Re-solder or replace
the components.

Y
Re-solder or replace U2101/
U2102

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9.8 Touchscreen Failure

The touchscreen failure is reflected as touchscreen unlocking failure while the LCD display is normal.
Since the TP and LCD are provided by the same supplier and the two are full laminated. You can replace
the display modules to determine whether it is the display screen fault or the main board circuit fault.

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INTERNAL

Figure 9-11 Troubleshooting touchscreen failure

Touchscreen failure

Is the problem
solved after the TP
is replaced.

Y
Replace the touchscreen
components.

N
Check whether the
TP power supply is
normal.

N
Re-solder or replace
U900.

Y
Check whether the
circuits between RST/
INT and I2C of the TP
are normal.

N
Re-solder or replace TP
circuit components.

Y
Re-solder or replace
connectorJ1601.

NOTE

The screen film may reduce the sensitivity of the touchscreen, making the phone irresponsive to touch operation.

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INTERNAL

9.9 Proximity Sensor and Automatic Light Sensor Failure

Figure 9-12 Troubleshooting proximity sensor and automatic light sensor failure
Proximity sensor and automatic
light sensor failure

Is there any
shielding object on
the panel? Is the
silicon pad properly
installed?

Remove the shielding

object and ensure the
silicon pad properly
installed?

N
N
Check whether J2202
is firmly connected.

Ensure J2202 is firmly

connected.

Y
Replace the senso r FPC

9.10 Accelerometer Failure

If the accelerometer is faulty, the compass sensor does not work either, because the compass sensor
software operation depends on the accelerometer. This is an identification basis.

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INTERNAL

Figure 9-13 Troubleshooting accelerometer failure

The accelerometer sensor is
faulty.

Check whether the

power supply
SENSOR_2V6/1V8
works properly.

Check the power

supply circuit.

Y
Is the problem
solved after the
accelerometer
sensor chip is
replaced.

Y
End

N
Re-solder or replace U300.

9.11 Compass Sensor Failure

Figure 9-14 Troubleshooting compass sensor failure
Compass sensor failure

Y
Check whether
the power supply
is normal.

Check the power

supply circuit.

Y
N
Check whether the
compass sensor chip
U2005 is normal.

End

Y
Re-solder or replace U300.

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INTERNAL

9.12 Gyroscope Failure

The gyroscope is also called the angular rate sensor and is mainly used to test the angular variation. If the
gyroscope is faulty, users will fail to take turns effectively when they are playing racing games. Therefore,
you can determine whether the gyroscope is faulty by playing racing games.
Figure 9-15 Troubleshooting gyroscope failure
Gyroscope failure

Check whether
the power supply
is normal?

Check the power

supply circuit.

Y
Y
Is the problem solved
after gyroscope chip
U2003 is replaced?

End

N
Re-solder or replace U300.

9.13 Camera Failure

1.

First, use the software to identify whether it is a front camera fault or rear camera fault.

2.

Currently, the camera components are connected in the BTB mode. If only one camera is abnormal, it
is considered as a single component fault, and you can detect the fault by replacing the camera.

3.

If the camera does not work properly after being replaced, check whether the software is able to detect
the camera and whether power is supplied normally. If the camera is not detected or power is supplied
abnormally, check the relevant circuits of the PCBA.

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9.14 Audio Failure

9.14.1 Ringtone Failure
Figure 9-16 Troubleshooting ringtone failure
Ringtone failure

Check whether the

speaker is normal.

Replace the
speaker.

Y
Check whether
The Speaker signal circuit is
normal.

Troubleshoot the
FPC flat cable
and main board
J2201 faults.

Y
Re-solder or replace U1201.

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9.14.2 Call Transmitting Failure

Figure 9-17 Troubleshooting call transmitting failure
Call transmitting failure

Check whether the

Main microphone is normal

Replace the main

microphone.

Y
Check whether
The relevant signal
circuits are faulty.

Troubleshoot the
relevant signal
circuit faults of the
main PFC and the
main board.

Y
Replace microphone 1402

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9.14.3 Call Receiving Failure

Figure 9-18 Troubleshooting call receiving failure
Call receiving failure

Check whether the

earpiece is normal.

Replace the
earpiece.

Check whether the

earpiece FPC is normal.

Replace the
earpiece FPC

Y
Check whether the
EARN/EARP signals
are normal.

Troubleshoot the
relevant signal
circuit faults of the
main board.

Y
Re-solder or replace U900.

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9.15 Headphone Audio Failure

9.15.1 Headphone Silence Failure
Figure 9-19 Troubleshooting headphone silence failure
Headphone silence failure

Check whether the

main FPC and the
headphone jack are
normal.

Replace the main

FPC.

Y
Check whether
the headphone power
amplifier U1501 and
relevant components
are normal.

N
Replace relevant
components.

Y
Check the
headphone channel
to see if ground short
circuit exists.

Troubleshoot the
signal circuit fault.

Y
Replace U900.

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9.15.2 Headphone Transmitting Failure

Figure 9-20 Troubleshooting headphone transmitting failure
Headphone transmitting failure

Check whether the

main FPC and the
headphone jack are
normal.

Replace the main

FPC.

Check whether the

HS_MICBIAS voltage
is normal.

Find the reason

and solve the
problem.

Y
Check the
microphone channel
to see if ground short
circuit exists.

Troubleshoot the
signal circuit fault.

Y
Replace U900

9.16 Speaker Noise Failure

1.

2013-04-09

If the speaker is water penetrated or contains impurities, such as iron scraps, noise may occur on the
speaker.

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Figure 9-21 Troubleshooting speaker noise failure

Speaker noise failure

Whether the
speaker is water
penetrated?

Troubleshoot the
fault according to
regulations.

Troubleshoot the
fault according to
regulations.

Whether the speaker

contains iron dusts?

N
Is the problem solved
after the speaker is
replaced?

Y
End

N
Is the problem solved
after the front cover is
replaced?

Y
End

N
Repair or replace the backplane
components.

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9.17 Wi-Fi and Bluetooth Failure

9.17.1 2.4 GHz WIFI
Figure 9-22 Troubleshooting Wi-Fi and Bluetooth failure
Wi-Fi/Bluetooth failure

Check whether
the software is
operating normally.

Re-solder or
replace U5603.

Ensure that they

contact with each
other properly.

Troubleshoot the
signal circuit fault.

Y
Check whether the
spring U5302 contacts
with the antenna
properly.
Y
Check whether
U5400 and Z5401 are
normal.
Y
Is the problem
solved after U5400
and Z5401 are
replaced?

Troubleshoot the
signal circuit fault.

Y
End

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9.17.2 5 GHz Wi-Fi

Figure 9-23 Wi-Fi/Bluetooth signal input circuit diagram
Wi-Fi/Bluetooth failure

Check whether
the software is
operating
normally.

Re-solder or
replace U5603.

Y
Check whether the
spring J5501 contacts
with the antenna
properly.

Ensure that they

contact with each
other properly.

Troubleshoot the
signal circuit fault.

Troubleshoot the
signal circuit fault.

Check whether Z5502

is normal.
Y
Is the problem
solved after
U5501is replaced.
Y
End

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9.18 FM Failure (D2 Is Not Equipped with the FM Function.)

9.19 GPS Failure
Figure 9-24 Troubleshooting GPS failure
GPS failure

Check
whether the spring U5302
contacts with the antenna
properly.

Ensure that they

contact with each
other properly.

Y
Is the
problem solved after
U5400 and Z5801 are
replaced?

End

N
Is the
problem solved after U5603 is
replaced?

End

N
Is the
problem solved after U5603 is
replaced?

End

N
Replace U300.

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Figure 9-25 GPS circuit diagram

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9.20 Mobile High-Definition Link (MHL) Failure

Figure 9-26 Troubleshooting MHL failure
MHL failure

Check
whether J1901 contacts with
MHLconnector properly?

Ensure that they

Y
Check
whether the pull-up resistor of the
MHL_CBUS_ID channel is
Normal?

N
Re-solder or replace R3109.

Y
Check
whether power supplies for MHL are
normal?

Troubleshoot power supply

faultsReplace U3104, U3105,
and other power channel
components in order.

Y
Check
whether MHL output circuits are
normal?

Troubleshoot circuit
faultsReplace T1901, U1905,
U3101, and peripheral components
in order.

Y
Is
the problem solved after U3101 is
replaced?

Y
End

N
Replace U300.

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9.21 UIM1 Card Detection Failure

Figure 9-27 Troubleshooting card detection failure-GSM
GSM card detection

Check
Whether the SIM card is
properly inserted into the card
Holder?

Re-insert
the UIM card properly to see if
the problem is solved?

Y
End

N
Y

Check Whether
there is any foreign matter
in the SIM card holder or
whetherthe holder
is damaged?

Replace
the J2102 SIM card holder,
S2102, U2101, and U20109 to
see if the problem is
Solved?

Y
End

N
N
At
the dialing interface, check the
IMEI No. by keying
in *#06#?

Is
the problem solved after U700
is replaced?

Y
End

N
Y

Replace Z4700 and U4700?

End

Is the
problem solved after U4702
and Z4401 are replaced
in orede?

End

According to the faulty

frequency band, replace
corresponding circuits to see if
the problem is
solved?

End

N
Check and replace U300.

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9.22 UIM2 Card Detection Failure

Figure 9-28 Troubleshooting the UIM2 card detection failure
UIM2 card detection

Check
whether the SIM card is properly
inserted into the card
holder?

Re-insert
the UIM card properly to see if the
problem is solved?

Y
End

Y
Check whether
there is any foreign matter in the
SIM card holder or whether the
holder is damaged ?

Replace
the SIM card holder, S2102, and
U2102 to see if the problem is
solved?

Y
End

At the
dialing interface, check the IMEI
No. by keying in *#06#?

Is the
problem solved after U5000 is
replaced?

End

Is the
problem solved after Z5301 and
Z5302 are replaced?

End

Y
Is the
problem solved after U5301 is
replaced?

End

N
According to
the faulty frequency band,
replace corresponding circuits to
see if the problem
is solved?

End

N
Replace U300.

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9.23 RF Reception Failure-CDMA (D2-2010)

Figure 9-29 Troubleshooting RF reception failure-CDMA
WCDMA RF reception failure

Check whether the hardware

components are normal?

Check whether the RF

connector and the antenna
spring are properly installed
and well contacted?

N
Whether
the problem is solved after the
software is updated to the latest
version?

End

N
Check
whether the circuit for the RF signal is
normal?

Replace Z4401 to solve the

problem.

End

Y
Is the
problem solved after Z4501 is
replaced?
N
According to the
faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

Y
End

N
Is the
problem solved after C4616 and
C4617R4602L4605
are replaced?

Y
End

N
Replace U700.

NOTE

If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.

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9.24 RF Sending Failure-CDMA (D2-2010)

Figure 9-30 Troubleshooting RF sending failure-CDMA
CDMA RF signal sending

Check
whether the hardware components are
normal?

Check whether the RF

connector and the antenna
spring are properly installed
and well contacted?

N
Whether the
problem is solved after the software is
updated to the latest
version?

End

Check whether RF receiving is normal?

Replace Z4401 to solve the

problem.

Y
Is the
problem solved after Z4700 is
replaced?

End

N
Is the
problem solved after U4700 and U4702
are replaced?

End

N
According to the
faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

End

N
Replace U700.

NOTE

If all RF signals are abnormal, inspect the circuits for the power supply, antenna switch chip and antenna connector.

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9.25 RF Signal Receiving Failure-GSM (D2-2010)

Figure 9-31 Troubleshooting RF signal receiving failure-GSM
GSM RF signal receiving failure

Check
whether the hardware components are
normal?

Check whether the RF

connector and the antenna
spring are properly installed
and well contacted?

N
Whether the
problem is solved after the software is
updated to the latest
version?

End

N
Check
whether the RF sending components are
normal?

Replace U5301 to solve the

problem.

Y
Is the
problem solved after Z5302 and Z5301
are replaced?

End

N
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

End

N
Replace U5000

NOTE

If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.

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9.26 RF Signal Sending Failure-GSM (D2-2010)

Figure 9-32 Troubleshooting RF signal sending failure-GSM
GSM RF signal sending

Check whether the hardware

components are normal?

Check whether the RF

connector and the antenna
spring are properly

Y
Whether
the problem is solved after the
software is updated?

End

N
Check
whether the radio receiving circuit is
normal?

Replace U5301 to solve the

problem.

Y
Is
the problem sovled after Z5303 is
replaced?

Y
End

N
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

Y
End

N
Replace U3801.

NOTE

If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.

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9.27 RF Reception Failure-WCDMA (D2-5000)

Figure 9-33 Troubleshooting the RF reception failure-WCDMA
WCDMA RF reception failure

Check
whether the hardware components are
normal?

Check whether the RF connector and

the antenna spring are properly
installed and well contacted?

End

N
Is the
problem solved after the software is
updated to the latest version?

N
Check
whether the radio sending circuit is
normal?

Replace Z4401 to solve the problem.

Y
Is the
problem solved after Z4501 is
replaced?

End

N
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

End

N
Is the
problem solved after C4616 and
C4617R4602L4605 are
replaced?

End

N
Replac e U700.

NOTE

If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.

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9.28 RF Sending Failure-CDMA (D2-5000)

Figure 9-34 Troubleshooting RF sending failure-CDMA
RF sending failure-CDMA

Check whether the hardware

components are normal?

Check whether the RF connector and

the antenna spring are properly
installed and well contacted?

N
Is the
problem solved after the software is
updated to the latest
version?

End

N
Check
whether radio receiving is
normal?

Replace Z4401 to solve the problem.

Y
Is the
problem solved after Z4700 is
replaced?

End

N
Is the
problem solved after U4700 and U4702
are replaced?

End

N
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

End

N
Replace U700.

NOTE

If all RF signals are abnormal, inspect the circuits for the power supply, PA patch, coupler patch, antenna connector, and
the main chip.

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9.29 RF Signal Receiving Failure-GSM (D2-5000)

Figure 9-35 Troubleshooting RF signal receiving failure-GSM
RF signal receiving

Check
whether the hardware components are
Normal?

Check whether the RF connector and

the antenna spring are properly
installed and well contacted?

N
Is the
problem solved after the software is
updated to the latest
version?

End

N
Check
whether the RF sending components
are normal?

Replace U5301 to solve the problem.

Y
Is the
problem solved after Z5302 and Z5301
are replaced?

End

N
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

End

N
Replace U5000.

NOTE

If all RF signals are abnormal, pay attention to inspecting the circuits for the power supply, antenna feed point, antenna
switch chip, antenna connector, and RF test base.

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9.30 RF Signal Sending Failure-GSM (D2-5000)

Figure 9-36 Troubleshooting RF signal sending failure-GSM
RF signal sending

Check
whether the hardware components are
normal?

Check whether the RF connector

and the antenna spring are properly
installed and well contacted?

End

Replace U5301 to solve the

problem.

N
Is the
problem solved after the software is
updated to the latest
version?
N
Check
whether the radio receiving circuit is
normal?
Y
Is the problem solved after Z5303 is
replaced?

End

N
According to
the faulty frequency band, replace
corresponding circuits to see if the
problem is solved?

End

N
Replace U3801

NOTE

If all RF signals are abnormal, inspect the circuits for the power supply, antenna feed point, antenna switch chip,
antenna connector, and RF test base.

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10 Chapter Ten Function Tests

10.1 Keys
D2 has only three buttons. They are the power button, volume up button, and volume down button.
D2's built-in battery is not user removable; therefore, the forcible power-off function is designed. The
phone will be forcibly powered off after you press the power key for 10 seconds. The function applies to
cases such as software upgrade.
Figure 10-1 D2's keys

Power on key

Volume + key

Volume - key

10.2 MMI Tests

HUAWEI D2-2010
V100R001C00B118 MMI.xls

10.3 Wi-Fi Test

NOTE

To ensure a normal network, place the mobile phone within 15 meters from an AP, and there must be no obstacle
between the mobile phone and the AP.

1.

Configure the AP properly. Power on the phone and place it within the AP's transmission range.

2.

Tap Settings > Wireless & Settings > WLAN > Turn WLAN on, and enable network notifications.

3.

After the phone automatically finds the AP's SSID, enter the password to establish a connection.

4.

Change the distance between the phone and AP to check the change of the Wi-Fi signal strength.

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5.

INTERNAL

In the normal network, launch a browser and access a website to test the network quality.

If no problems are found, finish the Wi-Fi test. If any problems are found, troubleshoot the phone or send it
to an advanced service center for repair.

10.4 Voice Call Test

1.

Install a SIM card or UIM card on the fixed station.

2.

Power on the phone.

3.

Check whether the signal strength displayed on the LCD is normal (given that the network is normal).

4.

Make a call to a fixed-line phone, and check the voice quality during the call.

5.

If no problems are found, exit the voice call test. If any problem is found, troubleshoot the problem or
send the phone to an advanced service center for repair.

11 Solder Points on the PCB and the BGA Chip

Red (R: 255, G: 0, B: 0)
Green (R: 0, G: 255, B: 0)

: Solder point
: Vacant point

D2-2010:
Top solder point diagram

Bottom solder point diagram

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D2-5000/D2-0082:
Top solder point diagram

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Bottom solder point diagram

12 PCBA Layout
D2-2010:
Top slot layout:

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Bottom slot layout:

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D2-5000/D2-0082:
Top slot layout:

Bottom slot layout:

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Schematic diagrams:

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