2013 Advanced Micro Devices, Inc. All rights reserved.

November 17, 2013

DDR3 DRAM Modules Evaluated with the
AMD Second Generation A-Series Trinity Mobile APU

Introduction

This list contains DDR3 SO-DIMMs that have been evaluated by AMD and have shown reliable operation on the AMD
internal reference platform. Testing included functional testing over voltage and temperature, as well as V
REF
margining.

Purpose

As each mobile platform is different in design and characteristics, AMD cannot guarantee that a SO-DIMM contained in
this list will work reliably in a specific mobile platform. The sole purpose of this list is to provide guidance with respect to
creating the SO-DIMM test matrix a platform designer needs to validate the operation of a platform design. It is the
platform designers responsibility to completely test and verify operation of SO-DIMMs based on their own test
process.
AMD makes no representations or warranties with respect to any information provided in this document relating to the
products of other companies, and expressly disclaims any implied warranties of merchantability, fitness for a particular
purpose, or non-infringement with respect to such products. Furthermore, the inclusion of such information does not
constitute an endorsement by AMD of the product.




2013 Advanced Micro Devices, Inc. All rights reserved. November 17, 2013











[email protected]
Mfg PN Capacity Rank/Width Mfg PN Rev IC Capacity IC Date Code Speed/Config Date tested
AM1U16BC2P1 2GB 1Rx8 3CCD-1211A D 2Gb U150 1600/1DPC *
AM1U16BC4P2 4GB 2Rx8 3CCD-1211A D 2Gb U1213 1600/1DPC *
MI74C1B0873Z2 2GB 1Rx8 MT41K256M8DA-125 M 2Gb 1150 1600/1DPC *
MI74C1C167HZ2 4GB 2Rx8 MT41K256M8DA-125 M 2Gb 1150 1600/1DPC *
SSZ302G08-GGNED 2GB 1Rx8 EDJ2108BDBG-GN-F D 2Gb 1207 1600/1DPC *
SSA302G08-GGNED 4GB 2Rx8 EDJ2108BDBG-GN-F D 2Gb 1205 1600/1DPC *
EBJ20UF8BDU0-GN-F 2GB 1Rx8 J2108BDBG-GN-F D 2Gb 1151 1600/1DPC *
EBJ20UF8BCS0-GN-F 2GB 1Rx8 J2108BCSE-GN-F C 2Gb 1047 1600/1DPC *
EBJ41UF8BCS0-GN-F 4GB 2Rx8 J2108BCSE-GN-F C 2Gb 1047 1600/1DPC *
EBJ40UG8BBU0-GN-F 4GB 1Rx8 J4208BBBG-GN-F B 4Gb 1153 1600/1DPC *
EBJ41UF8BDU0-GN-F 4GB 2Rx8 J2108BDBG-GN-F D 2Gb 1151 1600/1DPC *
EBJ81UG8BBU0-GN-F 8GB 2Rx8 J4208BBBG-GN-F B 4Gb 1153 1600/1DPC *
MT8JTF25664HZ-1G6M1 2GB 1Rx8 MT41K256M8DA-125 M 2Gb 1112 1600/1DPC *
MT16JTF51264HZ-1G6M1 4GB 2Rx8 MT41K256M8DA-125 M 2Gb 1126 1600/1DPC *
MT8JTF51264HZ-1G6D1 4GB 1Rx8 MT41K512M8RA-125 D 4Gb 1136 1600/1DPC *
MT16JTF1G64HZ-1G6E1 8GB 2Rx8 MT41K512M8RH-125:E E 4Gb 1308 1600/1DPC 4/15/2013
MT16JTF1G64HZ-1G6D1 8GB 2Rx8 MT41K512M8RA-125 D 4Gb 1132 1600/1DPC *
NT2GC64B88G0NS-DI 2GB 1Rx8 NT5CB256M8GN-DI G 2Gb 1124 1600/1DPC *
NT2GC64BH4B0PS-DI 2GB 1Rx8 NT5CB256M16BP-DI B 2Gb 1228 1600/1DPC 8/23/2012
NT4GC64B8HG0NS-DI 4GB 2Rx8 NT5CB256M8GN-DI G 2Gb 1124 1600/1DPC *
AS8F8K83C-GN2E 2GB 1Rx8 A3P2GF3CKF-GGNAQ C 2Gb 217M9E0G 1600/1DPC 12/15/2012
AS9F8L93B-GN2E 4GB 1Rx8 A3P4GF3BLF-GGNAF B 4Gb 216M6B01 1600/1DPC 12/15/2012
ASAF8L93B-GN2E 8GB 2Rx8 A3P4GF3BLF-GGNAF B 4Gb 216M6B02 1600/1DPC 12/15/2012
RMT3150ED58E8W-1600 2GB 1Rx8 EDJ2108BDBG-GN-F D 2Gb 1149 1600/1DPC *
RMT3160ED58E9W-1600 4GB 2Rx8 EDJ2108BDBG-GN-F D 2Gb 1206 1600/1DPC *
RMT3160EB68FAW-1600 8GB 2Rx8 EDJ4208EBBG-GN-F B 4Gb 1223 1600/1DPC 5/7/2013
RMT3160MM58E9F-1600 4GB 2Rx8 MT41K256M8DA-125 M 2Gb 1220 1600/1DPC *
RMT3150MM58E8F-1600 4GB 1Rx8 MT41K256M8DA-125 M 2Gb 1220 1600/1DPC *
M471B5773DH0-CK0 2GB 1Rx8 K4B2G0846D-HCK0 D 2Gb 146 1600/1DPC *
M471B5773CHS-CK0 2GB 1Rx8 K4B2G0846C-HCK0 C 2Gb 149 1600/1DPC *
M471B5273CH0-CK0 4GB 2Rx8 K4B2G0846C-HCK0 C 2Gb 146 1600/1DPC *
M471B5273DH0-CK0 4GB 2Rx8 K4B2G0846D-HCK0 D 2Gb 134 1600/1DPC *
M471B1G73BH0-CK0 8GB 2Rx8 K4B4G0846B-HCK0 B 4Gb 146 1600/1DPC *
SM321NQ08ICF 4GB 1Rx8 MT41K512M8RH-125:E M 4Gb 1232 1600/1DPC 12/19/2012
SM322NW08IAF 8GB 2Rx8 MT41K512M8RH-125:E M 4Gb 1232 1600/1DPC 12/19/2012
HMT325S6CFR8C-PB 2GB 1Rx8 H5TQ2G83CFR-PBC C 2Gb 126 1600/1DPC *
HMT425S6AFR6C-PB 2GB 1Rx16 H5TC4G83AFR-PBA A 4Gb * 1600/1DPC 1/25/2013
HMT325S6EFR8C-PB 2GB 1Rx8 H5TQ2G83EFR-PBC E 2Gb 1301 1600/1DPC 10/7/2013
HMT351S6EFR8C-PB 4GB 2Rx8 H5TQ2G83EFR-PBC E 2Gb 1301 1600/1DPC 10/7/2013
HMT351S6CFR8C-PB 4GB 2Rx8 H5TQ2G83CFR-PBC C 2Gb 129 1600/1DPC *
HMT351S6CFR8C-PB 4GB 2Rx8 H5TQ2G83CFR-PBC C 2Gb 129 1600/1DPC *
HMT451S6AFR8C-PB 4GB 1Rx8 H5TC4G83AFR-PBA A 4Gb * 1600/1DPC 1/25/2013
HMT41GS6MFR8C-PB 8GB 2Rx8 H5TQ4G83MFR-PBC M 4Gb 1131 1600/1DPC *
HMT41GS6AFR8C-PB 8GB 2Rx8 H5TC4G83AFR-PBA A 4Gb * 1600/1DPC 1/25/2013
Elpida
DRAM Component
A-Data
Elpida
Micron
Asint
BOLD = New Entry, * = Data Unavailable
F
S
1
r
2

&

F
P
2
SK Hynix SK Hynix
Micron Micron
PSC PSC
Ramaxel
Elpida
Sharetronic Micron
Testing Data
Nanya Nanya
Micron
DIMM Module
Elpida
Elpida
Samsung Samsung
2013 Advanced Micro Devices, Inc. All rights reserved. November 17, 2013

[email protected]
Mfg PN Capacity Rank/Width Mfg PN Rev IC Capacity IC Date Code Speed/Config Date tested
EBJ20UF8EDU0-GN-F 2GB 1Rx8 J2108EDBG-GN-F D 2Gb * 1600/1DPC *
EBJ41UF8EDU0-GN-F 4GB 2Rx8 J2108EDBG-GN-F D 2Gb * 1600/1DPC *
EBJ40UG8EBU0-GN-F 4GB 1Rx8 J4208EBBG-GN-F B 4Gb * 1600/1DPC *
EBJ40UG8EFU0-GN-F 4GB 1Rx8 EDJ4208EFBG-GN-F F 4Gb 1229 1600/1DPC 12/19/2012
EBJ81UG8EFU0-GN-F 8GB 2Rx8 EDJ4208EFBG-GN-F F 4Gb 1229 1600/1DPC 12/28/2012
EBJ81UG8EBU0-GN-F 8GB 2Rx8 J4208EBBG-GN-F B 4Gb * 1600/1DPC *
HP16D3LS1KDG/2G 2GB 1Rx8 D2568EERDPGGBU D 2Gb 1245 1600/1DPC 1/28/2013
HP16D3LS1KBG/4G 4GB 1Rx8 D5128EETBPGGBU B 4Gb 1248 1600/1DPC 1/28/2013
HP16D3LS1KFG/4G 4GB 1Rx8 D5128ED1FPGGBU F 4Gb 1317 1600/1DPC 10/31/2013
HP16D3LS1KFG/8G 8GB 2Rx8 D5128ED1FPGGBU F 4Gb 1316 1600/1DPC 10/31/2013
HP16D3LS1KBG/8G 8GB 2Rx8 D5128EETBPGGBU B 4Gb 1242 1600/1DPC 1/28/2013
MT8KTF25664HZ-1G6M1 2GB 1Rx8 MT41K256M8DA-125 M 2Gb 1128 1600/1DPC *
MT16KTF51264HZ-1G6M1 4GB 2Rx8 MT41K256M8DA-125 M 2Gb 1112 1600/1DPC *
MT8KTF51264HZ-1G6E1 4GB 1Rx8 MT41K512M8RH-125 E 4Gb * 1600/1DPC *
MT8KTF51264HZ-1G6D1 4GB 1Rx8 MT41K512M8RA-125 D 4Gb 1136 1600/1DPC *
MT4MTF25664HZ-1G6E1 4GB 1Rx8 MT41K256M16HA-125 E 4Gb 1242 1600/1DPC 12/7/2012
MT8KTF51264HZ-1G9E1 4GB 1Rx8 MT41K512M8RH-107 E 4Gb 1228 1866/1DPC 1/22/2013
MT16KTF1G64HZ-1G9E1 8GB 2Rx8 MT41K512M8RH-107 E 4Gb 1228 1866/1DPC 1/22/2013
MT16KTF1G64HZ-1G6E1 8GB 2Rx8 MT41K512M8RH-125 E 4Gb * 1600/1DPC *
MT16MTF1G64HZ-1G6E1 8GB 2Rx8 MT41K512M8RH-125 E 4Gb 1244 1600/1DPC 12/7/2012
MT16KTF1G64HZ-1G6D1 8GB 2Rx8 MT41K512M8RA-125 D 4Gb 1132 1600/1DPC *
NT2GC64C88G0NS-DI 2GB 1Rx8 NT5CC256M8GN-DI G 2Gb 1140 1600/1DPC *
NT2GC64CH4C0PS-DI 2GB 1Rx16 NT5CC256M16CP-DI C 4Gb 1218 1600/1DPC *
NT4GC64C8HG0NS-DI 4GB 2Rx8 NT5CC256M8GN-DI G 2Gb 1124 1600/1DPC *
NT4GC64C88B0NS-DI 4GB 1Rx8 NT5CC512M8BN-DI B 4Gb 1213 1600/1DPC *
NT4GC64C88C0NS-DI 4GB 1Rx8 NT5CC512M8CN-DI C 4Gb 1209 1600/1DPC *
NT8GC64C8HB0NS-DI 8GB 2Rx8 NT5CC512M8BN-DI B 4Gb 1211 1600/1DPC *
NT8GC64C8HC0NS-DI 8GB 2Rx8 NT5CC512M8CN-DI C 4Gb 1218 1600/1DPC *
M471B5773CHS-YK0 2GB 1Rx8 K4B2G0846C-HYK0 C 2Gb 222 1600/1DPC *
M471B5674QH0-YK0 2GB 1Rx16 K4B4G1646Q-HYK0 Q 4Gb 1328 1600/1DPC 8/31/2013
M471B5273DH0-YK0 4GB 2Rx8 K4B2G0846D-HYK0 D 2Gb 222 1600/1DPC *
M471B5273CH0-YK0 4GB 2Rx8 K4B2G0846C-HYK0 C 2Gb 216 1600/1DPC *
M471B5173BH0-YK0 4GB 1Rx8 K4B4G0846B-HYK0 B 4Gb 1310 1600/1DPC 5/28/2013
M471B5173CB0-YK0 4GB 1Rx8 K4B4G0846C-BYK0 C 4Gb 1308 1600/1DPC 4/15/2013
M471B5173QH0-YK0 4GB 1Rx8 K4B4G0846Q-HYK0 Q 4Gb 1325 1600/1DPC 8/31/2013
M471B5173DB0-YK0 4GB 1Rx8 K4B4G0846D-BYK0 D 4Gb 1304 1600/1DPC 8/31/2013
M471B1G73QH0-YK0 8GB 2Rx8 K4B4G0846Q-HYK0 Q 4Gb 1325 1600/1DPC 8/31/2013
M471B1G73DB0-YK0 8GB 2Rx8 K4B4G0846D-BYK0 D 4Gb 1310 1600/1DPC 8/31/2013
M471B1G73BH0-YK0 8GB 2Rx8 K4B4G0846B-HYK0 B 4Gb 1319 1600/1DPC 6/19/2013
SM321NH08IAF 2GB 1Rx8 MT41K256M8DA-125:M M 2Gb 1150 1600/1DPC *
SM321NH16IBF 2GB 1Rx16 MT41K256M16HA-125:E E 4Gb * 1600/1DPC 6/24/2013
SM322NQ08IAF 4GB 2Rx8 MT41K256M8DA-125:M M 2Gb 1150 1600/1DPC *
HMT325S6CFR8A-PB 2GB 1Rx8 H5TC2G83CFR-PBA C 2Gb 137 1600/1DPC *
HMT325S6EFR8A-PB 2GB 1Rx8 H5TC2G83EFR-PBA E 2Gb na 1600/1DPC *
HMT325S6CFR8A-PB 2GB 1Rx8 H5TC2G83CFR-PBA C 2Gb 137 1600/1DPC *
HMT425S6AFR6A-PB 2GB 1Rx16 H5TC4G63AFR-PBA A 4Gb * 1600/1DPC 1/25/2013
HMT351S6CFR8A-PB 4GB 2Rx8 H5TC2G83CFR-PBA C 2Gb 130 1600/1DPC *
HMT351S6EFR8A-PB 4GB 2Rx8 H5TC2G83EFR-PBA E 2Gb na 1600/1DPC *
HMT351S6CFR8A-PB 4GB 2Rx8 H5TC2G83CFR-PBA C 2Gb 137 1600/1DPC *
HMT451S6AFR8A-PB 4GB 1Rx8 H5TC4G83AFR-PBA A 4Gb * 1600/1DPC 1/25/2013
HMT41GS6AFR8A-PB 8GB 2Rx8 H5TC4G83AFR-PBA A 4Gb * 1600/1DPC 1/25/2013
HMT41GS6MFR8A-PB 8GB 2Rx8 H5TC4G83MFR-PBA M 4Gb 143 1600/1DPC *
HMT41GS6MFR8A-PB 8GB 2Rx8 H5TC4G83MFR-PBA M 4Gb 143 1600/1DPC *
RMT3190EB76F8W-1600 2GB 1Rx16 EDJ4216EBBG-GN-F B 4Gb 1223 1600/1DPC 12/19/2012
RMT3170ED58F8W-1600 2GB 1Rx8 EDJ2108BDBG-GN-F D 2Gb 1243 1600/1DPC 1/28/2013
RMT3170EB68F9W-1600 4GB 1Rx8 EDJ4208EBBG-GN-F B 4Gb 1223 1600/1DPC 12/19/2012
RMT3170EF68F9W-1600 4GB 1Rx8 EDJ4204EFBG-GN-F F 4Gb 1323 1600/1DPC 8/20/2013
RMT3160EB68FAW-1600 8GB 2Rx8 EDJ4208EBBG-GN-F B 4Gb 1223 1600/1DPC 12/19/2012
RMT3170MK58F8F-1600 2GB 1Rx8 MT41K256M8DA-125:K K 2Gb 1322 1600/1DPC 8/8/2013
RMR3170ME68F9F-1600 4GB 1Rx8 MT41K512M8RH-125:E E 4Gb 1320 1600/1DPC 6/24/2013
RMR3160ME68FAF-1600 8GB 2Rx8 MT41K512M8RH-125:E E 4Gb 1322 1600/1DPC 10/24/2013
BOLD = New Entry, * = Data Unavailable
Sharetronic Micron
SK Hynix SK Hynix
Elpida
Ramaxel
Micron
Testing Data DIMM Module
Kingston Elpida
Nanya Nanya
Elpida Elpida
F
S
1
r
2

&

F
P
2
Samsung Samsung
Micron Micron
DRAM Component
2013 Advanced Micro Devices, Inc. All rights reserved. November 17, 2013


























[email protected]
Mfg PN Capacity Rank/Width Mfg PN Rev IC Capacity IC Date Code Speed/Config Date tested
MI74C1B0873Z2 2GB 1Rx8 MT41K256M8DA-125 M 2Gb 1150 1333/1DPC *
MI74C1C167HZ2 4GB 2Rx8 MT41K256M8DA-125 M 2Gb 1150 1333/1DPC *
AM1U16BC4P2 4GB 2Rx8 A-Data 3CCD-1211A D 2Gb U1213 1333/1DPC *
Samsung M471B5273CH0-CH9 4GB 2Rx8 Samsung K4B2G0846C-HCH9 C 2Gb 943 1333/1DPC *
RMT3010EC58E8F-1333 2GB 1Rx8 EDJ2108BCSE-DJ-F C 2Gb 1128 1333/1DPC *
RMT3020EC58E9F-1333 4GB 2Rx8 EDJ2108BCSE-DJ-F C 2Gb 1128 1333/1DPC *
RMT3160ED58E9W-1600 4GB 2Rx8 EDJ2108BDBG-GN-F D 2Gb 1206 1333/1DPC *
[email protected]
Mfg PN Capacity Rank/Width Mfg PN Rev IC Capacity IC Date Code Speed/Config Date tested
EBJ20UF8EDU0-DJ-F 2GB 1Rx8 J2108EDBG-DJ-F D 2Gb 1145 1333/1DPC *
EBJ41UF8EDU0-DJ-F 4GB 2Rx8 J2108EDBG-DJ-F D 2Gb 1145 1333/1DPC *
EBJ40UG8EBU0-DJ-F 4GB 1Rx8 J4208EBBG-DJ-F B 4Gb 1204 1333/1DPC *
EBJ81UG8EBU0-DJ-F 8GB 2Rx8 J4208EBBG-DJ-F B 4Gb 1204 1333/1DPC *
EBJ41UF8BDU0-GN-F 4GB 2Rx8 J2108BDBG-GN-F D 2Gb 1151 1333/1DPC *
MT8KTF25664HZ-1G4M1 2GB 1Rx8 MT41K256M8DA-125 M 2Gb 1112 1333/1DPC *
MT16KTF51264HZ-1G4M1 4GB 2Rx8 MT41K256M8DA-125 M 2Gb 1114 1333/1DPC *
MT8KTF51264HZ-1G4D1 4GB 1Rx8 MT41K512M8RA-15E D 4Gb 1130 1333/1DPC *
MT16KTF1G64HZ-1G4D1 8GB 2Rx8 MT41K512M8RA-125 D 4Gb 1132 1333/1DPC *
NT2GC64C88G0NS-CG 2GB 1Rx8 NT5CC256M8GN-CG G 2Gb 1140 1333/1DPC *
NT4GC64C8HG0NS-CG 4GB 2Rx8 NT5CC256M8GN-CG G 2Gb 1140 1333/1DPC *
Samsung M471B5273CH0-CH9 4GB 2Rx8 Samsung K4B2G0846C-HCH9 C 2Gb 943 1333/1DPC *
HMT325S6CFR8A-H9 2GB 1Rx8 H5TC2G83CFR-H9A C 2Gb 136 1333/1DPC *
HMT325S6EFR8A-H9 2GB 1Rx8 H5TC2G83EFR-H9A E 2Gb 1301 1333/1DPC 10/7/2013
HMT351S6EFR8A-H9 4GB 2Rx8 H5TC2G83EFR-H9A E 2Gb 1301 1333/1DPC 10/7/2013
HMT351S6CFR8A-H9 4GB 2Rx8 H5TC2G83CFR-PBA C 2Gb 130 1333/1DPC *
HMT351S6CFR8A-H9 4GB 2Rx8 H5TC2G83CFR-H9A C 2Gb 136 1333/1DPC *
F
S
1
r
2

&

F
P
2
Ramaxel
DIMM Module DRAM Component Testing Data
Elpida
DIMM Module DRAM Component
BOLD = New Entry, * = Data Unavailable
BOLD = New Entry, * = Data Unavailable
Testing Data
A-Data
Micron
F
S
1
r
2

&

F
P
2
Elpida Elpida
Micron Micron
Nanya Nanya
SK Hynix SK Hynix
2013 Advanced Micro Devices, Inc. All rights reserved. November 17, 2013


























2013 Advanced Micro Devices, Inc. All rights reserved.


The contents of this document are provided in connection with Advanced Micro Devices,
Inc. (AMD) products. AMD makes no representations or warranties with respect to the
accuracy or completeness of the contents of this publication and reserves the right to
make changes to specifications and product descriptions at any time without notice. No
license, whether express, implied, arising by estoppel, or otherwise, to any intellectual
property rights are granted by this publication. Except as set forth in AMDs Standard
Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any
express or implied warranty, relating to its products including, but not limited to, the
implied warranty of merchantability, fitness for a particular purpose, or infringement of
any intellectual property right. AMDs products are not designed, intended, authorized or
warranted for use as components in systems intended for surgical implant into the body,
or in other applications intended to support or sustain life, or in any other application in
which the failure of AMDs product could create a situation where personal injury, death,
or severe property or environmental damage may occur. AMD reserves the right to
discontinue or make changes to its products at any time without notice.

Trademarks
AMD, the AMD Arrow logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc.