High-Efficiency, Main Power Supply Controllers For Notebook Computers
High-Efficiency, Main Power Supply Controllers For Notebook Computers
High-Efficiency, Main Power Supply Controllers For Notebook Computers
Features
The RT8206A/B dual step-down, switch-mode powersupply (SMPS) controller generates logic-supply voltages
in battery-powered systems. The RT8206A/B includes two
pulse-width modulation (PWM) controllers fixed at 5V/
3.3V or adjustable from 2V to 5.5V. An optional external
charge pump can be monitored through SECFB
(RT8206A). This device also features a linear regulator
providing a fixed 5V output. The linear regulator provides
up to 70mA output current with automatic linear-regulator
bootstrapping to the BYP input. The RT8206A/B includes
on-board power-up sequencing, the power-good outputs,
internal soft-start, and internal soft-discharge output that
prevents negative voltages on shutdown.
z
z
z
z
z
z
z
z
z
z
z
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Ordering Information
RT8206
Package Type
QW : WQFN-32L 5x5 (W-Type)
Operating Temperature Range
G : Green (Halogen Free with Commercial Standard)
Applications
z
z
A : With SECFB
B : Without SECFB
Note :
Richtek Green products are :
`
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
DS8206A/B-03
December 2009
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1
RT8206A/B
Pin Configurations
25
24
23
22
ENLDO
NC
VIN
LDO
NC
21
GND
BOOT2
LGATE2
PGND
GND
SECFB
PVCC
LGATE1
BOOT1
20
19
18
33
17
32
31
30
29
28
27
26
25
REF
TON
VCC
24
23
22
ENLDO
NC
VIN
LDO
NC
21
GND
20
19
18
33
17
10
11
12
13
14
15
16
10
11
12
13
14
15
16
BYP
FB1
ILIM1
PGOOD1
EN1
UGATE1
PHASE1
BYP
VOUT1
FB1
ILIM1
PGOOD1
EN1
UGATE1
PHASE1
VOUT1
PHASE2
PHASE2
26
UGATE2
UGATE2
27
EN2
EN2
28
PGOOD2
PGOOD2
29
SKIP
SKIP
30
VOUT2
VOUT2
31
ILIM2
ILIM2
32
REF
TON
VCC
FB2
FB2
(TOP VIEW)
WQFN-32L 5x5
WQFN-32L 5x5
RT8206A
RT8206B
BOOT2
LGATE2
PGND
GND
NC
PVCC
LGATE1
BOOT1
R14
3.9
C1
10F
RT8206A/B
6 VIN
C18
0.1F
Q1
VOUT1
5V
C3
220F
PHASE2 25
R3 0
17
LGATE2 23
18 LGATE1
9
C8
C9
1F
C7
0.1F
3 VCC
0.1F
VOUT2 30
REF 1
PGOOD1
C11
0.1F
20 SECFB/NC
R12
39k
R7 0
C16
1F
11 FB1
32 FB2
ILIM2
19 PVCC
SKIP
7 LDO
VOUT2
3.3V
C17
220F
R10
C14
C15
0.22F
R6
100k
R13
100k
PVCC
PVCC
5V Enable
ON
3.3V Enable
OFF
LDO Control
31
TON 2
GND
C12
10F
L2
4.7H
Q4
13
EN1 14
EN2 27
C13
10F
R8 0
ILIM1 12
R11
200k
C19
Q2
PGND 22
ENLDO 4
D4
CP
R9
0
PGOOD2 28
D2
D3
BYP
10 VOUT1
C5
0.1F
D1
BOOT1
16 PHASE1
C4
C6
0.1F
24
15 UGATE1
Q3
R5
BOOT2
R4 0
C2
0.1F
L1
6.8H
UGATE2 26
29
VIN
R1
180k
R2
180k
Frequency Control
PWM/DEM/Ultrasonic
C10
4.7F
DS8206A/B-03
December 2009
RT8206A/B
VIN
6V to 25V
R14
3.9
C1
10F
RT8206A/B
6 VIN
C18
0.1F
R4 0
Q1
R3 0
C2
0.1F
L1
6.8H
VOUT1
5V
C3
220F
R5
BOOT2
15 UGATE1
17
18 LGATE1
9
C4
D1
C6
0.1F
BYP
C9
1F
3 VCC
C8
0.1F
C23
C20
0.1F
R15
15k
R16
10k
CP
C19
20 SECFB/NC
R12
39k
11 FB1
R7 0
C16
1F
C10
4.7F
19 PVCC
7 LDO
L2
4.7H
Q4
C17
220F
R10
R17
11.5k
C15
0.22F
SKIP
GND
C22
C21
0.1F
PVCC
PVCC
ON
3.3V Enable
OFF
LDO Control
VIN
R1
180k
R2
180k
31
29
R18
10k
5V Enable
ILIM1 12
TON 2
R6
100k
R13
100k
PGOOD2 28
ILIM2
VOUT2
3.3V
C14
13
ENLDO 4
R11
200k
C11
0.1F
VOUT2 30
FB2 32
REF 1
C12
10F
R8 0
PGND 22
EN1 14
EN2 27
D4
C13
10F
Q2
LGATE2 23
PGOOD1
C7
0.1F
24
R9
0
PHASE2 25
10 VOUT1
C5
0.1F
D2
D3
BOOT1
16 PHASE1
Q3
UGATE2 26
Frequency Control
PWM/DEM/Ultrasonic
DS8206A/B-03
December 2009
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3
RT8206A/B
Function Block Diagram
TON SKIP
BOOT1
BOOT2
UGATE1
UGATE2
PHASE1
PV CC
PHASE2
PV CC
SMPS1
PWM Buck
Controller
LGATE1
PGND
SMPS2
PWM Buck
Controller
LGATE2
VOUT2
FB2
ILIM2
PGOOD2
VOUT1
FB1
ILIM1
PGOOD1
GND
SW Threshold
VCC
PVCC
ENLDO
EN1
EN2
BYP
Internal
Logic
LDO
Power-On
Sequence
Clear Fault Latch
Thermal
Shutdown
LDO
REF
REF
VIN
VIN
UGATE
On-Time
Compute
VOUT
T ON
Q
1-Shot
T OFF
TRIG 1-Shot
Q
TRIG
REF
Comp
LGATE
FB
1.1 x V REF
Over-Voltage
+
Fault
Latch
-
0.7 x V REF
+
Under-Voltage
V CC
Blanking
Time
0.9 x V REF
PGOOD
ILIM
SS
Time
25kHz
Detector Zero
Detector
Current
Limit
PHASE
SKIP
DS8206A/B-03
December 2009
RT8206A/B
Functional Pin Description
REF (Pin 1)
TON (Pin 2)
December 2009
RT8206A/B
BOOT1 (Pin 17)
No Internal Connection.
DS8206A/B-03
December 2009
RT8206A/B
FB2 (Pin 32)
SMPS2 Feedback Input. Connect FB2 to VCC or GND for
fixed 3.3V operation. Connect FB2 to a resistive voltagedivider from VOUT2 to GND to adjust output from 2V to
5.5V.
DS8206A/B-03
December 2009
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7
RT8206A/B
Absolute Maximum Ratings
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z
z
(Note 1)
(Note 3)
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DS8206A/B-03
December 2009
To be continued
RT8206A/B
Electrical Characteristics
(VIN = 12V, EN1 = EN2 = VCC, VBYP = 5V, PVCC = 5V, VENLDO = 5V, No Load on LDO, VOUT1, VOUT2 and REF, TA = 25C,
unless otherwise specified)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
--
180
250
--
20
40
--
mW
4.975
5.05
5.125
Input Supply
VIN = 6V to 25V, Both SMPS Off,
ENLDO = 5V
V = 6V to 25V,
VIN Shutdown Supply
I VIN_SHDH IN
Current
ENx = ENLDO = GND
Both SMPSs On,
Quiescent Power
FB1 = SKIP = GND, FB2 = VCC,
Consumption
VOUT1 = BYP = 5.3V,
(Note 5)
VOUT2 = 3.5V
SMPS Output and FB Voltage
VIN = 6V to 25V, FB1= GND,
VOUT1 Output Voltage in
VOUT1
SKIP
= 5V
Fixed Mode
VIN Standby Supply Current I VIN_SBY
VOUT2
3.285
3.33
3.375
FBx
VIN = 6V to 25V
1.975
2.025
SECFB
1.92
2.08
--
5.5
0.2
0.4
0.55
--
0.1
--
--
1.7
--
--
1.5
--
--
0.005
--
%/V
SMPS1, SMPS2
Fixed or Adj-Mode comparator
threshold
Either SMPS, SKIP = VCC , 0 to 5A
VLOAD
VLINE
On Time
Minimum Off-Time
t UGATEx
TON =
VCC
1895
2105
2315
999
1110
1221
TON =
REF
1227
1403
1579
647
740
833
TON =
GND
895
1052
1209
475
555
635
200
300
400
ns
SKIP = REF
25
33
--
kHz
--
--
ms
90
100
110
mV
4.75
5.25
t LGATEx
ns
Soft Start
Soft-Start Time
t SSx
Current Sense
Current Limit Threshold
(Default)
Current Limit Current
Source
I LIMX
To be continued
DS8206A/B-03
December 2009
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9
RT8206A/B
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
0.5
--
VILIMx = 0.5V
40
50
60
mV
VILIMx = 1V
90
100
110
mV
VILIMx = 2V
180
200
220
mV
--
--
mV
Current-Limit Threshold
GND
PHASEx
Zero-Current Threshold
Internal Regulator and Reference
LDO Output Voltage
VLDO
4.9
5.1
ILDO
70
--
--
mA
--
200
300
mA
4.53
4.66
4.79
--
1.5
VBYP
No External Load
1.98
2.02
IREF = 0 to 50uA
--
10
--
mV
REF in Regulation
10
--
--
Rising Edge
--
4.35
4.5
Falling Edge
3.9
4.05
--
11
7.5
--
10
--
--
--
ISINK = 4mA
--
--
0.3
108
111
115
VREF
UVLO
PVCC UVLO Threshold
PVCC
Power Good
FBx with Respect to Internal
Reference, Falling Edge,
Hysteresis = 1%
Falling Edge
PGOODx Threshold
PGOODx Propagation Delay
PGOODx Leakage Current
PGOODx Output Low
Voltage
Fault Detection
OVP Trip Threshold
VFB_OVP
--
10
--
65
70
75
--
--
ms
TSHDN
--
150
--
--
10
--
--
--
0.2
VCC1
--
--
To be continued
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10
DS8206A/B-03
December 2009
RT8206A/B
Parameter
Symbol
Conditions
Min
Typ
Max
--
--
0.8
1.8
--
2.3
2.5
--
--
--
--
0.8
1.8
--
2.3
2.5
--
--
--
--
0.8
Delay Start
1.8
--
2.3
SMPS On Level
2.5
--
--
Rising Edge
1.2
1.6
2.0
Falling Edge
0.94
1.06
ENLDO = 0V or 25V
--
+3
ENx = 0V or 5V
--
+1
TON, SKIP = 0V or 5V
--
+1
FBx = 0V or 5V
--
+1
SECFB = 0V or 5V (RT8206A)
--
+1
PVCC to BOOTx
--
20
--
UGATEx Forced to 2V
--
--
LGATEx Forced to 2V
--
1.7
--
LGATEx Forced to 2V
--
3.3
--
UGATEx On-Resistance
--
1.5
--
2.2
--
0.6
1.5
LG Rising
--
30
--
UG Rising
--
40
--
VENLDO
Unit
V
LGATEx On-Resistance
Dead Time
ns
Note 1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution is recommended.
Note 3. The device is not guaranteed to function outside its operating conditions.
Note 4. JA is measured in the natural convection at TA = 25C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard.
Note 5. PVIN + PPVCC
DS8206A/B-03
December 2009
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11
RT8206A/B
Typical Operating Characteristics
VOUT1 Efficiency vs. Load Current
100
DEM Mode
90
80
80
70
70
60
Efficiency (%)
Efficiency (%)
90
Ultrasonic Mode
50
PWM Mode
40
30
20
0
0.001
0.01
0.1
60
Ultrasonic Mode
50
40
PWM Mode
30
20
10
DEM Mode
10
0
0.001
10
0.01
DEM Mode
70
60
50
Ultrasonic Mode
40
PWM Mode
30
0
0.001
0.01
0.1
70
60
50
Ultrasonic Mode
40
PWM Mode
30
20
10
DEM Mode
80
Efficiency (%)
Efficiency (%)
100
20
10
0
0.001
10
0.01
DEM Mode
80
Efficiency (%)
60
50
Ultrasonic Mode
40
PWM Mode
30
20
10
0.01
0.1
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10
70
0
0.001
100
90
80
0.1
100
Efficiency (%)
10
100
80
90
0.1
10
70
DEM Mode
60
50
Ultrasonic Mode
40
PWM Mode
30
20
10
0
0.001
0.01
0.1
10
DS8206A/B-03
December 2009
RT8206A/B
VOUT1 Switching Frequency vs. Load Current
250
250
200
175
PWM Mode
150
125
100
75
50
Ultrasonic Mode
25
0
0.001
DEM Mode
0.01
0.1
225
200
175
PWM Mode
150
125
100
75
50
Ultrasonic Mode
25
DEM Mode
0
0.001
10
0.01
300
275
200
175
PWM Mode
150
125
100
75
50
Ultrasonic Mode
25
0
0.001
DEM Mode
0.01
0.1
250
225
200
175
150
125
100
75
50
Ultrasonic Mode
25
0
0.001
10
DEM Mode
0.01
225
300
250
PWM Mode
200
175
150
125
100
75
50
Ultrasonic Mode
25
0
0.001
0.1
DS8206A/B-03
December 2009
275
10
250
225
200
175
150
125
100
75
50
Ultrasonic Mode
25
DEM Mode
0.01
0.1
300
10
225
250
0.1
10
0
0.001
DEM Mode
0.01
0.1
10
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RT8206A/B
VREF vs. Output Current
2.00500
2.00475
2.00450
5.032
V REF (V)
5.036
5.028
2.00425
2.00400
2.00375
2.00350
5.024
2.00325
5.02
2.00300
0
10
20
30
40
50
60
-10
70
10
30
40
50
20
214
PWM Mode
10
Ultrasonic Mode
DEM Mode
212
210
208
Standby Current
206
204
202
200
198
0.1
7
11
13
15
17
19
21
23
25
11
13
19
21
23
25
2.04
23
2.03
21
2.02
19
17
2.05
V REF (V)
25
15
Shutdown Current
17
15
2.01
2.00
1.99
1.98
13
1.97
11
1.96
1.95
7
11
13
15
17
19
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14
21
23
25
20
35
50
65
80
95 110 125
Temperature (C)
DS8206A/B-03
December 2009
RT8206A/B
Power On from VIN
VIN
(10V/Div)
EN1
(5V/Div)
LDO
(5V/Div)
VOUT1
(5V/Div)
REF
(2V/Div)
IL1
(2A/Div)
CP
(10V/Div)
No Load, VIN = 12V, TON = VCC, EN1 = VCC,
EN2 = GND, ENLDO = VIN
PGOOD1
(5V/Div)
Time (400s/Div)
Time (1ms/Div)
PWM Mode
PWM Mode
EN1
(5V/Div)
EN1
(5V/Div)
VOUT1
(5V/Div)
VOUT1
(5V/Div)
IL1
(2A/Div)
IL1
(2A/Div)
PGOOD1
(5V/Div)
PGOOD1
(5V/Div)
Time (1ms/Div)
Time (1ms/Div)
DEM Mode
PWM Mode
EN2
(5V/Div)
EN2
(5V/Div)
VOUT2
(5V/Div)
VOUT2
(5V/Div)
IL2
(2A/Div)
IL2
(2A/Div)
PGOOD2
(5V/Div)
Time (1ms/Div)
DS8206A/B-03
December 2009
PGOOD2
(5V/Div)
Time (1ms/Div)
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15
RT8206A/B
Power On from EN1 (Delay Start)
EN2 = REF
PWM Mode
EN2
(5V/Div)
EN1
(5V/Div)
VOUT2
(5V/Div)
EN2
(5V/Div)
IL2
(2A/Div)
PGOOD2
(5V/Div)
VOUT1
(2V/Div)
VOUT2
(2V/Div)
Time (1ms/Div)
Time (400s/Div)
EN1 = REF
EN1
(10V/Div)
EN1
(5V/Div)
VOUT1
(5V/Div)
EN2
(5V/Div)
VOUT1
(2V/Div)
UGATE1
(20V/Div)
VOUT2
(2V/Div)
LGATE1
(5V/Div)
Time (400s/Div)
Time (10ms/Div)
VOUT2_ac-
VOUT1_ac-
coupled
coupled
(50mV/Div)
(50mV/Div)
IL1
(5A/Div)
IL2
(2A/Div)
LGATE1
(5V/Div)
LGATE2
(5V/Div)
Time (20s/Div)
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16
Time (20s/Div)
DS8206A/B-03
December 2009
RT8206A/B
OVP
VOUT1
(5V/Div)
UVP
VOUT1
(5V/Div)
IL1
(10A/Div)
PGOOD1
(5V/Div)
VOUT2
(5V/Div)
UGATE1
(20V/Div)
PGOOD2
(5V/Div)
LGATE1
(5V/Div)
Time (500s/Div)
Time (10s/Div)
VOUT1 = Short
IL1
(5A/Div)
UGATE1
(20V/Div)
LGATE1
(5V/Div)
Time (400s/Div)
DS8206A/B-03
December 2009
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17
RT8206A/B
Application Information
The RT8206A/B is a dual, high efficiency, Mach
ResponseTM DRVTM dual ramp valley mode synchronous
buck controller. The controller is designed for low-voltage
power supplies for notebook computers. Richtek Mach
Response TM technology is specifically designed for
providing 100ns instant-on response to load steps while
maintaining a relatively constant operating frequency and
inductor operating point over a wide range of input voltages.
The DRVTM mode PWM modulator is specifically designed
to have better noise immunity for such a dual output
application. The RT8206A/B achieves high efficiency at a
reduced cost by eliminating the current-sense resistor
found in traditional current-mode PWMs. Efficiency is
further enhanced by its ability to drive very large
synchronous rectifier MOSFETs. The RT8206A/B includes
5V (LDO) linear regulator which can step down the battery
voltage to supply both internal circuitry and gate drivers.
When VOUT1 voltage is above 4.66V, an automatic circuit
turns off the linear regulator and powers the device from
VOUT1 through BYP pin connected to VOUT1.
PWM Operation
The Mach ResponseTM DRVTM mode controller relies on
the output filter capacitor's effective series resistance
(ESR) to act as a current-sense resistor, so the output
ripple voltage provides the PWM ramp signal. Refer to the
function block diagram, the UGATE driver will be turned
on at the beginning of each cycle. After the internal oneshot timer expires, the UGATE driver will be turned off.
The pulse width of this one shot is determined by the
converter's input voltage and the output voltage to keep
the frequency fairly constant over the input voltage range.
Another one-shot sets a minimum off-time (300ns typ.).
The on-time one-shot is triggered if the error comparator
is high, the low-side switch current is below the currentlimit threshold, and the minimum off-time one-shot has
timed out.
PWM Frequency and On-Time Control
The Mach ResponseTM control architecture runs with
pseudo-constant frequency by feed-forwarding the input
and output voltage into the on-time one-shot timer. The
high-side switch on-time is inversely proportional to the
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18
December 2009
RT8206A/B
Operation Mode Selection
The RT8206A/B supports three operation modes: DiodeEmulation Mode, Ultrasonic Mode, and Forced-CCM
Mode. Users can set operation mode by SKIP pin. All of
the three operation modes will be introduced as follows.
Diode-Emulation Mode (SKIP = GND)
In Diode-Emulation mode, the RT8206A/B automatically
reduces switching frequency at light-load conditions to
maintain high efficiency. This reduction of frequency is
achieved smoothly and without the increase of VOUTx ripple
or load regulation. As the output current decreases from
heavy-load condition, the inductor current is also reduced,
and eventually comes to the point that its valley touches
zero current, which is the boundary between continuous
conduction and discontinuous conduction modes. By
emulating the behavior of diodes, the low-side MOSFET
allows only partial of negative current when the inductor
free-wheeling current reach negative. As the load current
further decreases, it takes longer and longer to discharge
the output capacitor to the level that requires for the next
ON cycle. The on-time is kept the same as that in the
heavy-load condition. In reverse, when the output current
increases from light load to heavy load, the switching
frequency increases to the preset value as the inductor
current reaches the continuous conduction. The transition
load point to the light-load operation can be calculated as
following equation.
ILOAD
(VIN VOUT )
TON
2L
Slope = (V IN -V OUT) / L
tON
DS8206A/B-03
December 2009
iL, peak
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19
RT8206A/B
Reference and Linear Regulator (REF, LDO and 14V
Charge Pump)
The 2V reference (REF) is accurate within 1% over
temperature, making REF useful as a precision system
reference. Bypass REF to GND with 0.22uF(MIN) capacitor.
REF can supply up to 50uA for external loads. Loading
REF degrades FBx and output accuracy according to the
REF load-regulation error.
An internal regulator produces a fixed output voltage 5V.
The LDO regulator can supply up to 70mA for external
loads. Bypass LDO with a minimum 4.7F ceramic
capacitor. When the output voltage of the VOUT1 is higher
than the switchover threshold, an internal 1.5 N-Channel
MOSFET switch connects VOUT1 to LDO through BYP
while simultaneously shutting down the internal linear
regulator.
ILoad
ILIM
DS8206A/B-03
December 2009
RT8206A/B
MOSFET Gate Driver (UGATEx, LGATEx)
The high-side driver is designed to drive high-current, low
RDS(ON) N-MOSFET(s). When configured as a floating driver
the instantaneous drive current is supplied by the flying
capacitor between BOOTx and PHASEx pins. A dead time
to prevent shoot through is internally generated between
high-side MOSFET off to low-side MOSFET on, and lowside MOSFET off to high-side MOSFET on.
The low-side driver is designed to drive high current low
RDS(ON) N-MOSFET(s). The internal pulldown transistor
that drives LGATEx low is robust, with a 0.6 typical onresistance. A 5V bias voltage is typically delivered from
PVCC through LDO supply. The instantaneous drive
current is supplied by an input capacitor connected
between PVCC and GND.
For high-current applications, some combinations of highand low-side MOSFETs might be encountered that will
cause excessive gate-drain coupling, which can lead to
efficiency-killing, EMI-producing shoot-through currents.
This is often remedied by adding a resistor in series with
BOOTx, which increases the turn-on time of the high-side
MOSFET without degrading the turn-off time (Figure 5).
V IN
BOOTx
10
UGATEx
PHASEx
DS8206A/B-03
December 2009
RT8206A/B
LDO causes large power dissipation on automatic
switches, which may result in thermal shutdown.
VOUTx = VFBx 1 + R1
R2
Where VFBx is 2V (typ.).
Discharge Mode
V IN
V OUTx
UGATEx
PHASEx
LGATEx
R1
VOUTx
FBx
Shutdown Mode
The RT8206A/B SMPS1, SMPS2 and LDO have
independent enabling control. Drive ENLDO, EN1 and EN2
below the precise input falling-edge trip level to place the
RT8206A/B in its low-power shutdown state. The
RT8206A/B consumes only 20uA of quiescent current while
in shutdown. When shutdown mode is activated, the
reference turns off. The accurate 1V falling-edge threshold
on the ENLDO can be used to detect a specific analog
voltage level and shutdown the device. Once in shutdown,
the 1.6V rising-edge threshold activates, providing sufficient
hysteresis for most application.
Power-Up Sequencing and On/Off Controls (ENx)
EN1 and EN2 control SMPS power-up sequencing. When
the RT8206A/B applies in the single channel mode, EN1
or EN2 enables the respective outputs when ENx voltage
rising above 2.5V, and disables the respective outputs
when ENx voltage falling below 1.8V.
Connecting one of ENx to VCC and the other one to REF
can force the latter one output starts after the former one
regulates.
If both of ENx forced to connect to REF, both outputs will
always wait for the regulation of the other one. However,
in this situation, neither of the two ENx will be in regulation.
Output Voltage Setting (FBx)
Connect FB1 directly to GND or VCC for a fixed 5V output
(VOUT1). Connect FB2 directly to GND or VCC for a fixed
3.3V output (VOUT2).
The output voltage can also be adjusted from 2V to 5.5V
with a resistor-divider network (Figure 6). The following
equation is for adjusting the output voltage. Choose R2 to
be approximately 10k, and solve for R1 using the following
equation :
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22
R2
GND
VSAG =
VIN VOUTx
2 COUT VOUTx K
TOFF(MIN)
V
IN
DS8206A/B-03
December 2009
RT8206A/B
Output Capacitor Selection
The output filter capacitor must have low enough ESR to
meet output ripple and load-transient requirements, its
commanded to keep the feedback voltage between 6 to
12mV. Also, the capacitance value must be high enough
to absorb the inductor energy going from a full-load to noload condition without tripping the OVP circuit.
For CPU core voltage converters and other applications
where the output is subject to violent load transients, the
output capacitors size depends on how much ESR is
needed to prevent the output from dipping too low under a
load transient. Ignoring the sag due to finite capacitance :
ESR
VP-P
ILOAD(MAX)
VP-P
LIR ILOAD(MAX)
f
1
SW
2 ESR COUT
4
DS8206A/B-03
December 2009
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23
RT8206A/B
The maximum power dissipation depends on operating
ambient temperature for fixed T J(MAX) and thermal
25
50
75
100
125
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DS8206A/B-03
December 2009
RT8206A/B
Table 2. Operation Mode Truth Table
Mode
Condition
Comment
VEN2 (V)
>2V High
Low
Low
>2V High
Low
REF
>2V High
Low
High
>2V High
REF
Low
>2V High
REF
REF
>2V High
REF
High
>2V High
High
Low
>2V High
High
REF
>2V High
High
High
ENLDO (V)
Low
DS8206A/B-03
December 2009
LDO
Off
5V SMPS1
Off
3V SMPS2
Off
Off
Off
Off
Off
Off
On
Off
Off
Off
Off
On
(after SMPS2 on)
On
On
Off
On
(after REF powers up)
On
On
(after SMPS1 on)
On
(after REF powers up)
On
On
X
(after
(after
(after
(after
(after
(after
(after
On
REF powers
On
REF powers
On
REF powers
On
REF powers
On
REF powers
On
REF powers
On
REF powers
up)
up)
up)
up)
up)
up)
up)
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25
RT8206A/B
Outline Dimension
D2
SEE DETAIL A
L
1
E2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A
A1
A3
Symbol
Dimensions In Inches
Min
Max
Min
Max
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
0.180
0.300
0.007
0.012
4.950
5.050
0.195
0.199
D2
3.400
3.750
0.134
0.148
4.950
5.050
0.195
0.199
E2
3.400
3.750
0.134
0.148
e
L
0.500
0.350
0.020
0.450
0.014
0.018
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Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.
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26
DS8206A/B-03
December 2009