Tps 65171
Tps 65171
Tps 65171
www.ti.com
FEATURES
APPLICATIONS
TYPICAL APPLICATION
DESCRIPTION
The TPS65171 offers a compact power supply
solution to provide all voltages required by a LCD
panel for large TV panel applications running from a
12V supply rail. The device is optimized to support
LCD technology using ASG gate drive circuits.
The device generates all voltage rails for the TFT
LCD bias (VS, VONE, VOFFE, VSS). In addition to that it
includes a step-down converter (Vlogic) to provide the
logic voltage. By pulling the HVS pin high an
implemented high voltage stress test feature
programs the boost converter output voltage Vs to
higher values. The boost converter operates at a
fixed switching frequency of 750kHz. The positive
charge pump is running from the boost converter and
is regulated by an external transistor. A buck-boost
converter provides an adjustable temperature
dependent negative output voltage VOFFE. The
negative output voltage VSS is regulated by a shunt
regulator.
Safety features like overvoltage protection of the
buck-boost input voltage, the boost and buck output
voltage, undervoltage lockout, short circuit protection
of VONE, VOFFE, and Vlogic are included as well as
thermal shutdown.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1)
(2)
(2)
TA
ORDERING
PACKAGE
PACKAGE MARKING
40C to 85C
TPS65171RHAR
TPS65171
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
The RHA package is available taped and reeled. Add R suffix to the device type (TPS65171RHAR) to order the device taped and
reeled. The RHA package has quantities of 3000 devices per reel.
UNIT
0.3 to 20
0.3 to 20
0.3 to 20
Voltage range at COMP, SS, FB1,VSNS, FB2, FB3, FB4, TS, SET, FB5, DLY1, DLY2, PG
0.3 to 7.0
40
9.5 to 0.3
kV
200
700
40 to 150
40 to 85
65 to 150
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolutemaximumrated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
(1)
PACKAGE
RqJA
TA 25C
POWER RATING
TA = 70C
POWER RATING
TA = 85C
POWER RATING
40 pin QFN
35C/W
2.8W
1.6W
1.1W
Soldered Power Pad on a standard 2-Layer PCB without vias for thermal pad. See the Texas Instruments Application report (SLMA002)
regarding thermal characteristics of the PowerPAD package.
TYP
MAX
UNIT
14.7
VIN
8.5
VIN3
15
TA
40
85
TJ
40
125
(1)
TPS65171
www.ti.com
ELECTRICAL CHARACTERISTICS
AVIN=VIN1=VIN2=VIN3=12V, EN1=EN2=VIN, VS=15V, Vlogic=3.3V, TA = 40C to 85C, typical values are at TA = 25C
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VIN
IQIN
8.5
1.2
mA
Isd
EN1=EN2=GND
170
mA
VUVLO
VIN falling
8.0
8.2
VUVLO
VIN rising
8.2
8.5
Thermal shutdown
Temperature rising
150
15
14.7
V
V
VIL
II
EN1=EN2=GND
1.7
V
0.4
0.1
mA
0.3
0.01
0.1
mA
4.9
6.3
mA
1.21
1.24
1.27
0.01
POWER GOOD
VIL
I(sink) = 500mA
Ilkg
Leakage current
VPG = 5.0V
Vthreshold
Rdischrg
ISS
Vthreshold = 1.24V
3.2
Vthreshold = 1.24V
V
k
10
12
mA
600
750
900
kHz
19
V
V
SWITCHING FREQUENCY
fs
Switching frequency
Vswovp
VFB1
IFB1
VFB1 = 1.24V
RDS(on)
N-MOSFET on-resistance
ISW = 500mA
ILIM
Ileak
ton
Minimum on time
Vs rising
19.0
19.5
20
1.225
1.24
1.252
10
100
nA
120
170
3.2
4.0
10
mA
2.5
Vsw = 15V
80
Line regulation
Load regulation
1mA Iout 1A
ns
0.006
%/V
0.1
%/A
VGDM
VIN VGD
I(GD)
R(GD)
ton
EN2 = high
FB1 < 100mV
10
mA
10
1.4
ms
VFB2
IFB2
VFB2 = 1.24V
RDS(on)
N-MOSFET on-resistance
(1)
(2)
2.2
1.215
4.0
1.24
1.265
10
100
nA
150
250
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
Ileak
Vsw = 0V
Line regulation
0.006
%/V
0.042
%/mA
0.06
%/A
Load regulation
UNIT
ILIM
A
1
100mA Iout 1A
mA
IBase1
VFB3 = VFB3nominal 5%
VFB3
IFB3
VFB3 = 1.24V
Line regulation
Load regulation
9.5
0.3
5
5%
V
mA
0.75
Vlogic
5%
10
100
nA
0.006
%/V
0.0004
%/mA
VOFFE
RDS(on)
P-MOSFET on resistance
ILIM
15
22
ISW5 at current limit
0.9
0.8
-5
1.6
1.8
1.9
2.0
Regulation accuracy
1.9
2.1
1.57
1.65
1.73
IFB5
VFB5 = 2V
10
100
nA
ITS
VTS = 1V
10
100
nA
ISET
VSET = 3V
mA
Line regulation
Load regulation
VFB5
0.003
%/V
0.0005
%/mA
VFB4 = VFB4nominal-5%
VFB4 = GND
14
40
50
mA
70
mA
20
1.24
1.30
VFB4 = 1.24V
10
100
0.9
VBase2
VFB4
IFB4
1.18
nA
%/V
0.004
%/mA
IRHVS
350
450
550
100
nA
TPS65171
www.ti.com
DEVICE INFORMATION
PACKAGE
PIN FUNCTIONS
PIN
NAME
GD
AVIN
VIN1, VIN2
NC
SW3, SW4
NO.
I/O
DESCRIPTION
3,4
5
6,7
Not connected
O
NC
VSNS
Not connected
Reference voltage input for the buck-boost and negative shunt regulator
FB2
10
PG
11
Power good output latched high when VS and VONE are in regulation
DLY1
12
EN1
13
EN2
14
Enable of the negative supplies VSS and VOFFE, enable DLY1 and DLY2
HVS
15
Logic pin to enable high voltage stress test. This allows programming the boost converter VS to a
higher voltage
FB3
16
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
NO.
I/O
DESCRIPTION
SS
17
BASE1
18
Base drive of the external npn transistor for the negative supply VSS
DLY2
19
FB4
20
BASE2
21
Base drive of the external pnp transistor for the positive charge pump VONE
NC
22, 23
Not connected
AGND/VL-
24
SET
25
Analog ground and connection of the bypass capacitor of VLInput pin for the reference voltage to set the higher limit for the temperature compensation for
VOFFE
TS
26
FB5
27
NC
28, 29
Not connected
SW5
30
VIN3
31
RHVS
32
This pin is pulled low when HVS is high. The resistor connected to this pin sets the boost
converter output voltage when HVS is pulled high
FB1
33
COMP
34
VL+
35
Output of the internal logic regulator. Connect a capacitor between this pin and AGND/VL-
OS
36
Connect this pin to the boost converter output for overvoltage protection
SW1, SW2
37, 38
Switch pin for the boost converter and the positive charge pump VONE
PGND1,
PGND2
39, 40
TPS65171
www.ti.com
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
TPS65171
www.ti.com
TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
FIGURE
Start-up Sequence
Startup sequencing
Figure 1
Startup sequencing
Figure 2
Boost Converter
Soft-start boost converter
vs load current
Figure 3
vs load current
Figure 4
PWM operation
Figure 5
PWM operation
Figure 6
Figure 7
Overvoltage protection
Figure 8
Buck Converter
Efficiency buck converter
vs load current
Figure 9
vs load current
Figure 10
PWM operation
Figure 11
PWM operation
Figure 12
Figure 13
Figure 14
vs load current
Figure 15
PWM operation
Figure 16
PWM operation
Figure 18
Figure 17
Charge Pump
Load transient response positive charge pump
Vs = 15V
Figure 19
Vs = 18V
Figure 20
Shunt Regulator
Load transient response negative shunt regulator
Figure 21
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
10
www.ti.com
Figure 1.
Figure 2.
Figure 3.
Figure 4.
TPS65171
www.ti.com
Figure 5.
Figure 6.
Figure 7.
Figure 8.
11
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
12
www.ti.com
Figure 9.
Figure 10.
Figure 11.
Figure 12.
TPS65171
www.ti.com
Figure 13.
Figure 14.
Figure 15.
Figure 16.
13
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
14
www.ti.com
Figure 17.
Figure 18.
Figure 19.
Figure 20.
TPS65171
www.ti.com
Figure 21.
15
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
APPLICATION INFORMATION
Thermal Shutdown
A thermal shutdown is implemented to prevent damages because of excessive heat and power dissipation. Once
a temperature of typlically 150C is exceeded the device enters shutdown. It enables again if the temperature
drops below the threshold temperature of typically 135 C and does normal startup.
Undervoltage Lockout
To avoid mis-operation of the device at low input voltages an undervoltage lockout is included, which shuts down
the device at voltages lower than typically 8.0V.
16
TPS65171
www.ti.com
The buck converter detects a short circuit if FB2 falls below 400 mV and the whole device except the buck
converter itself is shut down as if EN2 would be disabled. The switching frequency of the buck converter is
reduced to 1/4th of the normal operation frequency. If the short is removed the buck converter will start operation
again and the whole device auto recovers to normal operation by doing startup sequencing as if EN2 would be
enabled.
The negative buck boost converter VOFFE has a short circuit protection where the switch current is limited to
typically 300 mA and switching frequency is reduced to about 150 kHz. A short is detected if VOFFE rises above
-3 V
The shunt regulator Vss has no short circuit protection.
Start-Up Sequencing
The device has adjustable start-up sequencing to provide correct sequencing as required by the display.
450W Vlog ic
450W + R 22
(1)
Submit Documentation Feedback
17
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
The resulting PG voltage if PG pin is high impedance is dependent on R22 connection voltage (Vlogic), R22 value
and output current Iout of PG node. The output current is flowing to the external scan driver. Assuming a
maximum switch leakage current of 1mA the minimum PG output voltage can be calculated as following:
VPG _ high = Vlog ic - R 22 (1m A + Iout )
(2)
Recommended are R22 values between 5k and 500k. Typical value for R22 is 10k.
(4)
Boost Converter
The non-synchronous current mode boost converter operates in Pulse Width Modulation (PWM) operation with a
fixed frequency of 750 kHz. For maximum flexibility and stability with different external components the converter
uses external loop compensation. At start up the boost converter starts with an externally adjustable soft-start.
The boost converter provides the supply voltage for the LCD source driver as well as for the charge pump
regulator VONE. This needs to be taken into account when defining the output current requirements for the boost
converter. No feed-forward capacitor is needed for proper operation.
18
TPS65171
www.ti.com
CSS
V
Dt
CSS =
0.43 D t
mA 2
V
D Iinductor
(5)
19
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
1
2 p R 4 C5
(6)
CURRENT RATING
4.7 A / 60 m
6 A / 38 m
3.7 A / 65 m
R1 R2
VsHV S
- 1 R2 - R1
VFB 1
R1 R2
VsHVS
- 1 R2 - R1
1.24V
(8)
With:
VsHVS = Boost converter output voltage with HVS high
20
TPS65171
www.ti.com
Overvoltage Protection
The boost converter has two overvoltage protection mechanisms for the switch. Vs is monitored with an
overvoltage protection comparator on the OS pin and as soon as 19.5V typical is reached, the boost converter
stops switching. The converter also detects overvoltage if the feedback voltage at the feedback pin FB1 is 3%
above the typical regulation voltage of 1.24V, which stops switching. The converter starts switching again if the
output voltage falls below the overvoltage thresholds.
COMPONENT SUPPLIER
10mF/16V
Murata, GRM31CR71C106KAC7
10mF/16V
10mF/16V
Murata, GRM31CR61C106KA88
V D Iout
3. Peak switch current:
Iswpeak = in
+
2fs L 1- D
(9)
With,
Iswpeak = Converter peak switch current (minimum switch current limit = 2.5 A)
fs = Converter switching frequency (typical 750 kHz)
L = Selected inductor value
h = Estimated converter efficiency (use the number from the efficiency curves or 0.9 as an assumption)
21
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
COMPONENT SUPLIER
Isat/DCR
10 mH
Sumida CDRH5D28R/HP
2.5 A/74 m
10 mH
Sumida CDRH6D26/HP
7 7 2.8
2.5 A/72 m
10 mH
Sumida CDRH6D28
7 7 3.0
1.7 A/48 m
10 mH
Sumida CDRH5D28R
1.3 A/40 m
(10)
(10)
Usually a Schottky diode with 2A maximum average rectified forward current rating is sufficient for most
applications. The Schottky rectifier can be selected with lower forward current capability depending on the output
current Iout, but has to be able to dissipate the power. The dissipated power is calculated according to the the
following equation:
PD = Iavg Vforward
(11)
(11)
Vforward
RqJA
SIZE
COMPONENT SUPPLIER
20V/2A
0.38V at 2A
60C/W
PowerDI 123
20V/2A
0.44V at 2A
25C/W
SMA
20V/2A
0.44V at 2A
75C/W
SMB
22
COMPONENT SUPPLIER
22mF/25V
Murata, GRM32ER61E226KE15
10mF/25V
Murata, GRM31CR61E106KA12
10mF/50V
TPS65171
www.ti.com
Vs = VFB1 1+
= 1.24 V 1+
R2
R2
(12)
R2 =
VFB1
100 mA
1.24 V
12 kW
100 mA
(13)
Vs
- 1
R1 = R2 s - 1 = R2
1.24 V
VFB1
(14)
Buck Converter
The non-synchronous current mode buck converter operates at fixed frequency PWM operation. The converter
drives an internal N-channel MOSFET switch with an internal bootstrap capacitor. The output voltage can be set
between 2.5V and 3.3V by an external feedback divider. If the feedback voltage FB2 is 15% above the reference
voltage of 1.24V the converter stops switching and starts switching again if the FB2 voltage falls below the
threshold. For 3.3V output voltage the overvoltage lockout is approximately 3.8 V.
23
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
Iswpeak = Iout +
Vin (1 - D)
2fsL
Vin (1- D)
2fs L
D
(15)
With;
Iswpeak = Converter peak switch current (minimum switch current limit = 1A)
fs = Converter switching frequency (typical 750kHz)
L = Selected inductor value
h = Estimated converter efficiency (use the number from the efficiency curves or 0.8 as an assumption)
COMPONENT SUPPLIER
Isat/DCR
10mH
Sumida CDRH3D23
0.85A/95m
10mH
Sumida CDRH3D28
1.1A/116m
10mH
Sumida CDRH4D22
0.8A/79m
24
(16)
(16)
TPS65171
www.ti.com
Usually a Schottky diode with a 1A maximum average rectified forward current rating is sufficient for most
applications. The Schottky rectifier can be selected with lower forward current capability depending on the output
current Iout, but has to be able to dissipate the power. The dissipated power is the average rectified forward
current times the diode forward voltage. The efficiency rises with lower forward voltage.
PD = Iavg Vforward
(17)
(17)
Vforward
RqJA
SIZE
COMPONENT SUPPLIER
20V/1A
0.46V at 1A
20C/W
SMA
20V/0.5A
0.44V at 0.5A
150C/W
SOT123
20V/1A
0.32V at 1A
60C/W
PowerDI 123
COMPONENT SUPPLIER
22mF/6.3V
Murata, GRM31CR60J226KE19
10mF/6.3V
Murata, GRM21BR70J106KE76
47mF/6.3V
Murata, GRM32ER60J476ME20
10mF/6.3V
(18)
R6 =
VFB2
1mA
1.24 V
1.2 k W
1 mA
(19)
Vlogic
Vlogic
- 1 = R6
- 1
R5 = R6
V
1.24 V
FB2
(20)
25
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
-10 V
-11 V
7.5 kW
7 kW
-12 V
-15 V
-16 V
Vref 3.3 V
6.5 kW
-13 V
-14 V
www.ti.com
Slope of curve
adjusted by
NTC and R18
6 kW
VOFFE_max set by
resistor network FB5
and SET
5.5 kW
5 kW
R18
NTC
-17 V
TS
-18 V
-19 V
R19
-20 V
VOFFE_min set by
resistor network FB5
-21 V
-22 V
-23 V
-10C
0C
10C
20C
30C
40C
50C
26
TPS65171
www.ti.com
Vlogic
2
R21
R21
1= 1.65 V 1
, select R21 about 1 MW to achieve good soft-start.
R20
R20
(21)
R20 =
Vlogic R21
Vlogic - 2VOFFE_min
3.3 V R21
3.3 V - 2 VOFFE_min
VSET =
R21
R21
= VSET - (3.3V - VSET )
, VSET is calculated below.
R20
R20
VSET = Vlogic
(22)
R20 + R21
(23)
(24)
R17
R17
= 3.3 V
, select R17 between 1 kW and 20 kW for good accuracy.
R16 + R17
R16 + R17
(25)
Vlogic
3.3V
R16 = R17
- 1 = R17
- 1
VSET
VSET
(26)
1
1
- B
-
T
T
0
(27)
Where,
RT0 is the resistance at an absolute temperature T0 in Kelvin (normally 25C)
T is the temperature in Kelvin (C + 273.15 K/C)
B is a material constant
The NTC termistor manufacturer provides the above parameters. Typically a 22k NTC is used. Table 9
provides a suggestion for NTCs.
Table 9. Negative Termistor Selection
RESISTANCE (25C)
B CONSTANT
COMPONENT SUPPLIER
COMMENT
22k
3950 K
Murata, NCP18XW223E
3%
22k
3800 K
Vishay, NTCS0805E3223FHT
1%
22k
4554 K
TDK, NTCG164LH223HT
3%
To linearize the resistance-temperature characteristic of the NTC termistor, a parallel resistor R18 is added. T is
the temperature at which the NTC characteristic curve is linearized. Typically T is located in the middle of the set
temperature range at which the VOFFE voltage should be adjusted. For example, if the temperature compensation
should start at 0C and stop at 25C T = 12.5C + 273.15 K/C = 285.65 K.
B - 2T
R18 = RNTC (T)
B + 2T
(28)
The resulting overall resistance RNTC||R18 can be calculated as follows.
R18 RNTC (T)
RNTC||R18 =
R18 + RNTC (T)
(29)
27
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
30 kW
250 kW
25 kW
200 kW
20 kW
150 kW
15 kW
100 kW
10 kW
50 kW
5 kW
0 kW
-20C
0C
20C
40C
60C
80C
0 kW
-20C
0C
20C
40C
60C
80C
Figure 29. Resistance-Temperature Characteristics NTC (22 k) and Linearized NTC Network at 12.5C
To achieve different slopes, different R18 values are required. To obtain the most linear slope, the calculated
value has to be used. To achieve steeper slopes, higher values for R18 are necessary, smaller values produce
shallower slopes. By adjusting the resistor R19, the start and end point of the compensation can be set. The
voltage VTS of the resistor network at TS is calculated by the following equation:
VTS = Vlogic
R19
R19
= 3.3 V
RNTC||R18 + R19
RNTC||R18 + R19
(30)
Finally, the resulting output voltage, VOFFE, during the compensation period can be calculated as follows:
VOFFE = 2VTS - (Vlogic - 2VTS )
R21
R21
= 2VTS - (3.3V - 2VTS )
R20
R20
(31)
Figure 30 shows examples for VOFFE_min = 22V and VOFFE_max = 11V with different slopes and starting points of
the temperature compensation. For further compensation characteristics, refer to the available TPS65171
support excel sheet.
28
TPS65171
www.ti.com
-10 V
-10 V
-11 V
-11 V
-12 V
6 kW
10 kW
-13 V
7 kW
-14 V
12 kW
-14 V
-15 V
15 kW
-15 V
-12 V
-13 V
-16 V
-16 V
20 kW
-17 V
25 kW
-17 V
-18 V
30 kW
-18 V
10 kW
11 kW
-19 V
-19 V
-20 V
-20 V
-21 V
R18 = open
-21 V
R18 = 51 kW
-22 V
-22 V
-23 V
-10C
8 kW
9 kW
0C
10C
20C
30C
40C
50C
-23 V
-10C
0C
10C
20C
30C
40C
50C
-10 V
-10 V
-11 V
-11 V
5.5 kW
-12 V
-14 V
2.7 kW
-16 V
5 kW
-17 V
2.8 kW
-15 V
4.5 kW
-16 V
2.9 kW
-14 V
4 kW
-15 V
3 kW
-13 V
3.5 kW
-13 V
3.1 kW
-12 V
2.5 kW
-17 V
5.2 kW
-18 V
-18 V
-19 V
-19 V
-20 V
-20 V
-21 V
-21 V
R18 = 20 kW
R18 = 10 kW
-22 V
-22 V
-23 V
-10C
0C
10C
20C
30C
40C
50C
-23 V
-10C
0C
10C
20C
30C
40C
50C
Iswpeak =
Iout
V - D
+ in
1- D
2fs L
(32)
With,
Iswpeak = Converter peak switch current (minimum switch current limit = 0.8A)
fs = Converter switching frequency (typical 750 kHz)
L = Selected inductor value
h = Estimated converter efficiency (use the number from the efficiency curves or 0.8 as an assumption)
29
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
COMPONENT SUPPLIER
Isat/DCR
22mH
Sumida CDRH3D23/HP
0.8A/306m
22mH
Sumida CDRH4D22/HP
1.1A/214m
22mH
Sumida CDH3D13D/SHP
0.6A/753m
(33)
(33)
Usually a Schottky diode with a 500mA maximum average rectified forward current rating is sufficient for most
applications. The Schottky rectifier can be selected with lower forward current capability depending on the output
current Iout, but has to be able to dissipate the power. The dissipated power is the average rectified forward
current times the diode forward voltage. The efficiency rises with lower forward voltage.
PD = Iavg Vforward
(34)
(34)
Vforward
RqJA
SIZE
COMPONENT SUPPLIER
40V/0.5A
0.43V at 0.5A
206C/W
SOD-123
40V/1A
0.42V at 0.5A
88C/W
SMA
COMPONENT SUPPLIER
22mF/25V
Murata, GRM32ER61E226KE15
10mF/25V
Murata, GRM31CR61E106KA12
10mF/50V
30
TPS65171
www.ti.com
Setting the Output Voltage and Selecting the Feed-Forward Capacitor (Positive Charge Pump)
To minimize noise a minimum current through the feedback divider of 500 mA is recommended. At startup the
device is in short circuit mode with reduced current (typ. 50 mA) until the feedback voltage FB4 exceeds 100 mV,
then the device switches to soft-start mode until the output voltage VONE is in regulation. Due to the high output
current and low required voltage drop, high current Schottky diodes with low forward voltage are recommended
for this regulator.
R14
R14
Vout = VFB4 1+
= 1.24 V 1+
R15
R15
(35)
VFB4
R15 =
500 mA
1.24V
2.4 kW
500 mA
(36)
FB4
(37)
To minimize noise and leakage current sensitivity keep the lower feedback divider resistor R15 between 100
and 4.7k. See typical application section for charge pump circuit.
Across the upper feedback resistor R14, a bypass capacitor C17 is required. The capacitor is calculated as:
C17 =
1
2 p 12 kHz R14
(38)
IONE
R - VQ
D
(39)
With:
Vs = boost converter output voltage
VD1 = Forward voltage of boost converter Schottky diode
VD2 = Forward voltage of charge pump diode for a current of IONE / D
IONE = VONE output current
D = Duty cycle of boost converter (D = 1 Vin / Vs)
R = Series resistor (if applicable, e.g., 2 for typical application)
VQ = Transistor saturation voltage
As a general recommendation the VONE voltage level in use should be at least 0.5V lower than the calculated
maximum VONE voltage.
31
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
The power dissipation of the transistor should be calculated for the maximum applied boost output voltage VS. If
high voltage stress mode (HVS) is used the maximum VS voltage occurs during HVS mode.:
I
(40)
As an example for Vs = 18V and IONE = 75mA, the power dissipation is approximately 0.5W.
Because of the 1mF collector capacitor C16 a wide range of transistors can be used. The most important
transistor parameters are Collector-Emitter voltage which must be at least 2 x VS , average current rating of 1.2 x
IONE and DC current gain hFE, which must be at least IONE / IBase2. IBase2 minimum value of 8mA should be used
for calculation. See Table 13 for possible transistor selection.
Table 13. Transistor Selection (Positive Charge Pump)
TRANSISTOR
PZT2907A
KTA1551T
KTA1718D
KTA1666
(41)
COMPONENT SUPPLIER
4.7mF/50V
Murata, GRM31CR71H475KA12
4.7mF/50V
R10 =
R9 =
32
Vlogic R9
R9
R9
= 0.75 Vlogic = 2.475V - 0.825
R10
4 R10
R10
0.825 V
10 kW
80 mA
(43)
(42)
(44)
TPS65171
www.ti.com
(45)
COMPONENT SUPPLIER
1mF/25V
Murata, GRM21BR71E105KA99
1mF/50V
Layout Considerations
PCB layout is an important step in power supply design.
NC pins 5, 8, 22, and 29 should not be connected to GND, if so, the device is not P2P short protected any
more.
The input capacitors should be placed as close as possible to the device. AVIN, VIN1, and VIN2 must be
shorted.
The buffer capacitor C25 must be connected to VL+ and AGND/VL- by a single trace.
The line device, diode, output cap of the buck boost should be kept as short as possible.
For the boost converter the line C3 GND output capacitor GND and PGND1 should be kept short.
For the buck converter the line switch pin SW3, 4 to diode should be kept short.
All lower feedback resistors connected to GND should be placed close to the device.
Switching lines should not be next to feedback lines to avoid coupling.
Use short lines or make sure the lines do not affect other regulating parts for the charge pump switching
connection to SW1,2 because this trace carrys switching waveforms.
The PowerPAD of the QFN package should be soldered to GND and as much as possible thermal vias
should be used to lower the thermal resistance and keep the device cool.
A solid PCB ground plane structure is essential for good device performance.
Place red marked components and lines first and as close as possible to the device. Keep red marked lines
short. Bold marked lines should be wide on the PCB, because these traces carry high currents.
Green marked components can be placed further away.
33
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
34
TPS65171
www.ti.com
Typical Applications
Figure 34. Typical Application With Vs= 15V, HVS = 18V, Vlogic = 3.3V
35
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
Figure 35. Typical Application With Vs = 18V, HVS = 19V, Vlogic = 3.3V
36
TPS65171
www.ti.com
Figure 36. Typical Application With Vs = 18V, HVS = 19V, Vlogic = 2.5V
37
TPS65171
SLVSA22A OCTOBER 2009 REVISED JANUARY 2010
www.ti.com
VS = 15V
VS 16V
10.8 V
100mA
100mA
12.0V
85mA
100mA
13.2V
55mA
100mA
38
TPS65171
www.ti.com
REVISION HISTORY
Changes from Original (October 2009) to Revision A
Page
39
8-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TPS65171RHAR
ACTIVE
VQFN
RHA
Lead/Ball Finish
CU NIPDAU
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
9-Aug-2011
Device
TPS65171RHAR
RHA
40
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.3
1.1
12.0
16.0
Q2
9-Aug-2011
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS65171RHAR
VQFN
RHA
40
2500
346.0
346.0
33.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Amplifiers
amplifier.ti.com
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP Products
www.dlp.com
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2011, Texas Instruments Incorporated