MPU9250 REV1.0 9-Axis Gyro-Accel-Magnet

InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A.

Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: w w w .invensense.com
Document Number: PS- MPU-9250A-01

Revision: 1.0
Release Date: 01/17/2014
MPU-9250
Product Specification
Revision 1.0
MPU-9250 Product Specification
Document Number: PS-MPU-9250A-01

Revision: 1.0
CONTENTS
1
DOCUMENT INFORMATION ............................................................................................................ 4

1.1
R EVISION HISTORY .................................................................................................................... 4
1.2
PURPOSE AND S COPE ................................................................................................................ 5
1.3
PRODUCT OVERVIEW ................................................................................................................. 5
1.4
APPLICATIONS .......................................................................................................................... 5
FEATURES ...................................................................................................................................... 6
2.1
GYROSCOPE F EATURES ............................................................................................................. 6
2.2
ACCELEROMETER F EATURES ...................................................................................................... 6
2.3
MAGNETOMETER F EATURES ....................................................................................................... 6
2.4
ADDITIONAL FEATURES .............................................................................................................. 6
2.5
MOTIONP ROCESSING ................................................................................................................. 7
ELECTRI CAL CHARACTERISTICS .................................................................................................. 8

3.1
GYROSCOPE S PECIFICATIONS ..................................................................................................... 8
3.2
ACCELEROMETER S PECIFICATIONS .............................................................................................. 9
3.3
MAGNETOMETER S PECIFICATIONS ............................................................................................. 10
3.4
ELECTRICAL SPECIFICATIONS .................................................................................................... 11
3.5
I2C TIMING C HARACTERIZATION ................................................................................................ 15
3.6
SPI TIMING C HARACTERIZATION ................................................................................................ 16
3.7
ABSOLUTE MAXIMUM RATINGS .................................................................................................. 18
APPLICATIONS INFORMATION ..................................................................................................... 19

4.1
PIN O UT AND SIGNAL D ESCRIPTION............................................................................................ 19
4.2
TYPICAL O PERATING C IRCUIT.................................................................................................... 20
4.3
BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................... 20
4.4
BLOCK D IAGRAM ..................................................................................................................... 21
4.5
OVERVIEW ............................................................................................................................. 22
4.6
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT A DCS AND S IGNAL CONDITIONING ............................. 22
4.7
THREE-AXIS MEMS A CCELEROMETER WITH 16-BIT A DCS AND S IGNAL CONDITIONING ...................... 22
4.8
THREE-AXIS MEMS MAGNETOMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ....................... 22
4.9
D IGITAL MOTION P ROCESSOR ................................................................................................... 22
4.10
PRIMARY I2C AND SPI S ERIAL COMMUNICATIONS INTERFACES ...................................................... 23
4.11
AUXILIARY I2C S ERIAL INTERFACE ............................................................................................. 23
4.12
SELF-TEST............................................................................................................................. 24
4.13
MPU-9250 SOLUTION USING I2C INTERFACE.............................................................................. 25
Page 2 of 42

Revision: 1.0
4.14
MPU-9250 SOLUTION USING SPI INTERFACE.............................................................................. 26
4.15
CLOCKING .............................................................................................................................. 26
4.16
SENSOR DATA R EGISTERS ....................................................................................................... 27
4.17
FIFO..................................................................................................................................... 27
4.18
INTERRUPTS ........................................................................................................................... 27
4.19
D IGITAL-O UTPUT TEMPERATURE S ENSOR ................................................................................... 27
4.20
BIAS AND LDO........................................................................................................................ 28
4.21
CHARGE PUMP ....................................................................................................................... 28
4.22
STANDARD P OWER MODE ........................................................................................................ 28
4.23
POWER S EQUENCING R EQUIREMENTS AND POWER ON R ESET ....................................................... 28
ADV ANCED HARDWARE FEATURES ............................................................................................ 29
PROGRAMMABLE INTERRUPTS ................................................................................................... 30

6.1
DIGITAL INTERFACE ..................................................................................................................... 32

7.1
I2C AND SP I S ERIAL INTERFACES .............................................................................................. 32
7.2
I2C INTERFACE ....................................................................................................................... 32
7.3
I2C C OMMUNICATIONS P ROTOCOL ............................................................................................. 32
7.4
I2C TERMS ............................................................................................................................ 35
7.5
SPI INTERFACE....................................................................................................................... 36
SERI AL INTERFACE CONSI DERATIONS ....................................................................................... 37

8.1
W AKE-ON-MOTION INTERRUPT .................................................................................................. 30
MPU-9250 SUPPORTED INTERFACES ......................................................................................... 37
ASSEMBLY.................................................................................................................................... 38
9.1
ORIENTATION OF AXES ............................................................................................................. 38
9.2
PACKAGE D IMENSIONS ............................................................................................................. 38
10 PART NUMBER PACKAGE MARKING ........................................................................................... 40

11 RELIABILITY.................................................................................................................................. 41
11.1
QUALIFICATION TEST POLICY .................................................................................................... 41
11.2
QUALIFICATION TEST PLAN ....................................................................................................... 41
12 REFERENCE.................................................................................................................................. 42
Page 3 of 42
1 Document Information
1.1
Revision History
Revision
Date
Revision
Description
01/17/14
1.0
Initial Release
Page 4 of 42

Revision: 1.0

Revision: 1.0
1.2 Purpose and Scope

This document is a preliminary product specification, providing a description, specifications, and design
related information on the MPU-9250 MotionTracking device. The device is housed in a small 3x3x1mm
QFN package.
Specifications are subject to change without notice. Final specifications will be updated based upon
characterization of production silicon. For references to register map and descriptions of individual registers,
please refer to the MPU-9250 Register Map and Register Descriptions document.
1.3 Product Overview

MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One
die houses the 3-Axis gyroscope and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis
magnetomet er from Asahi Kasei Microdevices Corporation. Hence, the MPU-9250 is a 9-axis
MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a
Digital Motion Proc essor (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade
2
from the MPU-6515. With its dedicated I C sens or bus, the MPU-9250 directly provides complete 9-axis
MotionFusion output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip
MotionFusion, and run-time calibration firmware, enables manufacturers to eliminat e the costly and
complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal
motion performance for consumers. MPU-9250 is also designed to interface with multiple non-inertial digit al
2
sensors, such as pressure sensors, on its auxiliary I C port.
MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gy roscope outputs,
three 16-bit ADCs for digitizing the accelerometer outputs, and three 16-bit ADCs for digitizing the
magnetomet er out puts. For precision tracking of both fast and slow motions, the parts feature a userprogrammable gyroscope full-scale range of 250, 500, 1000, and 2000/sec (dps), a userprogrammable accelerometer full-scale range of 2g, 4g, 8g, and 16g, and a magnetometer full-scale
range of 4800T.
Other industry-leading features include programmable digital filters, a precision clock with 1% drift from 2
40C to 85C, an embedded temperature sensor, and programmable interrupts. The devic e features I C and
SPI serial interfac es, a VDD operating range of 2.4V to 3.6V, and a separate digital IO supply, VDDIO from
1.71V to VDD.
2
Communication with all registers of the device is performed using either I C at 400kHz or SPI at 1MHz. For
applications requiring faster communications, the sensor and interrupt registers may be read using SPI at
20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication plat form, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package
size down to a footprint and thickness of 3x3x1mm, to provide a very small yet high performance low cost
package. The device provides high robustness by supporting 10,000g shock reliability.
1.4
Applications
TouchAnywhere technology (for no touch UI Application Control/Navigation)
MotionCommand technology (for Gesture Short-cuts)
Motion-enabled game and application framework
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Page 5 of 42

Revision: 1.0
2 Features
2.1 Gyroscope Features
The triple-axis MEMS gyroscope in the MPU-9250 includes a wide range of features:
Digital-output X-, Y-, and Z-Axis angular rate sensors (gy roscopes) wit h a user-programmable fullscale range of 250, 500, 1000, and 2000/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Gyroscope operating current: 3.2mA
Sleep mode current: 8A
Factory calibrated sensitivity scale factor
Self-test
2.2 Accelerometer Features

The triple-axis MEMS accelerometer in MPU-9250 includes a wide range of features:
Digital-output triple-axis accelerometer with a programmable full scale range of 2g, 4g, 8g and
16g and integrated 16-bit ADCs
Accelerometer normal operating current: 450A
Low power accelerometer mode current: 8.4A at 0.98Hz, 19.8A at 31.25Hz
Sleep mode current: 8A
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test
2.3 Magnetometer Features

The triple-axis MEMS magnetometer in MPU-9250 includes a wide range of features:
3-axis silicon monolithic Hall-effect magnetic sensor with magnetic concentrator

Wide dynamic measurement range and high resolution with lower current consumption.
Output data resolution of 14 bit (0.6T/LSB) or 16 bit (15T/LSB)
Full scale measurement range is 4800T
Magnetometer normal operating current: 280A at 8Hz repetition rate
Self-t est function with internal magnetic source to confirm magnetic sensor operation on end
products
2.4 Additional Features

The MPU-9250 includes the following additional features:
Auxiliary master I C bus for reading data from external sensors (e.g. pressure sensor)
3.5mA operating current when all 9 motion sensing axes and the DMP are enabled
VDD supply voltage range of 2.4 3.6V
2
VDDIO reference voltage for auxiliary I C devices
Smallest and thinnest QFN package for portable devices: 3x3x1mm
Minimal cross-axis sensitivity between the accelerometer, gyroscope and magnetometer axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
2
400kHz Fast Mode I C for communicating with all registers
1MHz SPI serial interface for communicating with all registers
Page 6 of 42
2.5

Revision: 1.0
20MHz SPI serial interface for reading sensor and interrupt registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
MotionProcessing
Internal Digital Motion Processing (DMP) engine supports advanced MotionP rocessing and low
power functions such as gesture recognition using programmable interrupts
Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the
step count.
Page 7 of 42

Revision: 1.0
3 Electrical Characteristics
3.1 Gyroscope Specifications
Typical Operating Circuit of section 4.2, VDD = 2.5V, VDDIO = 2.5V, TA=25C, unless otherwise noted.
PARAMETER
CONDITIONS
Full-Scale Range
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
Gyroscope ADC Word Length

Sensitivity Scale Factor
Sensitivity Scale Factor Tolerance

Sensitivity Scale Factor Variation Over
Temperature
Nonlinearity
Cross-Axis Sensitivity
Initial ZRO Tolerance
ZRO Variation Over Temperature
Total RMS Noise
Rate Noise Spectral Density
Gyroscope Mechanical Frequencies
Low Pass Filter Response
MIN
FS_SEL=0
FS_SEL=1
FS_SEL=2
FS_SEL=3
25C
-40C to +85C
Best fit straight line; 25C
25C
-40C to +85C
DLPFCFG=2 (92 Hz)
Programmable Range
Gyroscope Startup Time
From Sleep mode
Output Data Rate
Programmable, Normal mode
Table 1 Gyroscope Specifications
Page 8 of 42
25
5
TYP
MAX
/s
/s
/s
/s
bits
LSB/(/s)
LSB/(/s)
LSB/(/s)
LSB/(/s)
%
%
0.1
2
5
30
0.1
0.01
27
29
250
%
%
/s
/s
/s-rms
/s/Hz
KHz
Hz
8000
Hz
35
4
UNITS
250
500
1000
2000
16
131
65.5
32.8
16.4
3
4
ms

Revision: 1.0
3.2 Accelerometer Specifications

PARAMETER
Full-Scale Range
ADC Word Length
Initial Tolerance
Sensitivity Change vs. Temperature
Nonlinearity
Cross-Axis Sensitivity
Zero-G Initial Calibration Tolerance
Zero-G Level Change vs. Temperature
Noise Pow er Spectral Density
Total RMS Noise
Low Pass Filter Response
Intelligence Function Increment
Accelerometer Startup Time
CONDITIONS
MIN
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Output in tw os complement format
AFS_SEL=0
AFS_SEL=1
AFS_SEL=2
AFS_SEL=3
Component-Level
-40C to +85C AFS_SEL=0
Component-level
Best Fit Straight Line
Output Data Rate
0.026
%/C
8
260
4
20
30
500
0.24
Duty-cycled, over temp

Low noise (active)
Table 2 Accelerometer Specifications
15
4
UNITS
g
g
g
g
bits
LSB/g
LSB/g
LSB/g
LSB/g
%
From Sleep mode

From Cold Start, 1ms V DD ramp
Page 9 of 42
MAX
2
4
8
16
16
16,384
8,192
4,096
2,048
3
0.5
2
60
80
1.5
300
Component-level, X,Y
Component-level, Z
-40C to +85C
Low noise mode
DLPFCFG=2 (94Hz)
Programmable Range
Low power (duty-cycled)
TYP
%
%
mg
mg
mg/C
g/Hz
mg-rms
Hz
mg/LSB
ms
ms
Hz
%
4000
Hz

Revision: 1.0
3.3 Magnetometer Specifications

PARAMETER
CONDITIONS
MIN
MAGNETOMETER SENSITIVITY
Full-Scale Range
ADC Word Length
ZERO-FIELD OUTPUT
Initial Calibration Tolerance
Page 10 of 42
TYP
MAX
UNITS
4800
14
0.6
T
bits
T / LSB
500
LSB

Revision: 1.0
3.4
Electrical Specifications
3.4.1
D.C. Electrical Characteristics
PARAMETER
CONDITIONS
MIN
TYP
MAX
Units
VDD
2.4
VDDIO
1.71
2.5
3.6
1.8
VDD
Notes
SUPPLY VOLTAGES
SUPPLY CURRENTS
Normal Mode
Accelerometer Low Pow er Mode

(DMP, Gyroscope, Magnetometer
disabled)
Full Chip Idle Mode Supply Current
9-axis (no DMP), 1 kHz gyro ODR, 4 kHz

accel ODR, 8 Hz mag. repetition rate
3.7
mA
6-axis (accel + gyro, no DMP), 1 kHz gyro

ODR, 4 kHz accel ODR
3.4
mA
3-axis Gyroscope only (no DMP), 1 kHz ODR
3.2
mA
6-axis (accel + magnetometer, no DMP), 4

kHz accel ODR, mag. repetition rate = 8 Hz
730
3-Axis Accelerometer, 4kHz ODR (no DMP)
450
3-axis Magnetometer only (no DMP), 8 Hz

repetition rate
280
0.98 Hz update rate
8.4
31.25 Hz update rate
19.8
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable

beyond Specified Temperature Range
-40
+85
Table 3 D.C. Electrical Characteristics

Notes:
1.
Acceleromet er Low Power Mode supports the following output data rates (ODRs ): 0.24, 0.49, 0.98,
1.95, 3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500Hz. Supply current for any update rat e can be
calculated as:
Supply Current in A = Sleep Current + Update Rate * 0.376
Page 11 of 42
3.4.2

Revision: 1.0
A.C. Electrical Characteristics
Param eter
Supply Ramp Time
Conditions
Monotonic ramp. Ramp rate
is 10% to 90% of the final
value
Operating Range
Ambient
Sensitivity
Untrimmed
Room Temp Offset
21C
Supply Ramp Time (TRAMP )
Valid pow er-on RESET
Start-up time for register read/write
From pow er-up
I C ADDRESS
V IH, High Level Input Voltage
V IL, Low Level Input Voltage
CI, Input Capacitance
V OH, High Level Output Voltage
V OL1, LOW-Level Output Voltage
V OL.INT 1, INT Low -Level Output Voltage
Output Leakage Current
tINT , INT Pulse Width
VIL, LOW Level Input Voltage
VIH, HIGH-Level Input Voltage
Vhys, Hysteresis
VOL, LOW-Level Output Voltage
I OL, LOW-Level Output Current
t of, Output Fall Time from VIHmax to VILmax
V IL, LOW-Level Input Voltage
V IH, HIGH-Level Input Voltage
V hys , Hysteresis
IOL, LOW-Level Output Current
tof, Output Fall Time from V IHmax to V ILmax
Sample Rate
Clock Frequency Initial Tolerance
MIN
TYP
MAX
Units
0.1
100
ms
-40
85
333.87
LSB/C
0
0.01
AD0 = 0
AD0 = 1
LSB
20
100
ms
11
100
ms
1101000
1101001
0.7*VDDIO
0.3*VDDIO
< 10
RLOAD=1M;
RLOAD=1M;
0.9*VDDIO
0.1*VDDIO
0.1
OPEN=1, 0.3mA sink

Current
OPEN=1
LATCH_INT_EN=0
100
50
-0.5V
0.7*VDDIO
0.3*VDDIO
VDDIO +
0.5V
0.1*VDDIO
3mA sink current

VOL=0.4V
VOL=0.6V
Cb bus capacitance in pf
0.4
3
6
100
20+0.1Cb
-0.5V
0.7* VDDIO
250
0.3*VDDIO
VDDIO +
0.5V
0.1* VDDIO
VDDIO > 2V; 1mA sink

current
VDDIO < 2V; 1mA sink
current
V OL
=
0.4V
V OL = 0.6V
Cb bus capacitance in pF
Fchoice=0,1,2
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=0 or 7
SMPLRT_DIV=0
Fchoice=3;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
CLK_SEL=0, 6; 25C
Page 12 of 42
V
V
pF
V
V
V
nA
s
V
V
V
V
mA
mA
nA
ns
V
V
0.4
V
V
0.2* VDDIO
250
mA
mA
nA
ns
3
6
100
20+0.1Cb
-2
32
kHz
kHz
kHz
+2
Frequency Variation over Temperature
CLK_SEL=1,2,3,4,5; 25C
CLK_SEL=0,6
CLK_SEL=1,2,3,4,5
-1
-10
Table 4 A.C. Electrical Characteristics
Page 13 of 42

Revision: 1.0
+1
+10
1
%
%
%

Revision: 1.0
3.4.3
Other Electrical Specifications
PARAMETER
CONDITIONS
SPI Operating Frequency, All

Registers Read/Write
Low Speed Characterization
MIN
High Speed Characterization
SPI Operating Frequency, Sensor

and Interrupt Registers Read Only
I2C Operating Frequency
TYP
100
10%
1 10%
MAX
kHz
MHz
20 10%
All registers, Fast-mode
All registers, Standard-mode
Table 5 Other Electrical Specifications
Page 14 of 42
Units
MHz
400
100
kHz
kHz

Revision: 1.0
3.5 I2C Timing Characterization

Typical Operating Circuit of section 4.2, VDD = 2.4V to 3.6V, VDDIO = 1.71 to VDD, TA=25C, unless
otherwise noted.
Param eters
I2C TIMING
f SCL, SCL Clock Frequency
tHD.ST A , (Repeated) START Condition Hold
Time
tLOW , SCL Low Period
tHIGH, SCL High Period
tSU.ST A , Repeated START Condition Setup
Time
tHD.DAT , SDA Data Hold Time
tSU.DAT , SDA Data Setup Time
tr, SDA and SCL Rise Time
tf, SDA and SCL Fall Time
tSU.ST O, STOP Condition Setup Time
Conditions
I2C FAST-MODE
Cb bus cap. from 10 to 400pF

Cb bus cap. from 10 to 400pF
tBUF, Bus Free Time Betw een STOP and

START Condition
Cb, Capacitive Load for each Bus Line
tVD.DAT , Data Valid Time
tVD.ACK , Data Valid Acknowledge Time
Min
Typical
Max
Units
400
0.6
kHz
s
1.3
0.6
0.6
s
s
s
0
100
20+0.1Cb
20+0.1Cb
0.6
s
ns
ns
ns
s
300
300
1.3
Notes
s
< 400
0.9
0.9
pF
s
s
Table 6 I C Timing Characteristics

Notes:
Timing Characteristics apply to both Primary and Auxiliary I2C Bus

Based on characterizat ion of 5 parts over temperature and voltage as mounted on evaluation board or in
sockets
I C Bus Timing Diagram
Page 15 of 42

Revision: 1.0
3.6 SPI Timing Characterization

Typical Operating Circuit of section 4.2, VDD = 2.4V to 3.6V, VDDIO = 1.71V to VDD, TA=25C, unless
otherwise noted.
Param eters
Conditions
Min
Typical
Max
Units
MHz
Notes
SPI TIMING
f SCLK , SCLK Clock Frequency
tLOW , SCLK Low Period
400
ns
tHIGH, SCLK High Period
400
ns
tSU.CS , CS Setup Time
ns
tHD.CS , CS Hold Time
500
ns
tSU.SDI, SDI Setup Time
11
ns
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
Cload = 20pF
tHD.SDO, SDO Hold Time
Cload = 20pF
ns
100
ns
ns
tDIS.SDO, SDO Output Disable Time
50
ns
Table 7 SPI Timing Characteristics

Notes:
1.
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
SPI Bus Timing Diagram
3.6.1
fSCLK = 20MHz
Param eters
Conditions
Min
Typical
Max
Units
20
MHz
SPI TIMING
f SCLK , SCLK Clock Frequency
0.9
tLOW , SCLK Low Period
ns
tHIGH, SCLK High Period
ns
tSU.CS , CS Setup Time
ns
tHD.CS , CS Hold Time
ns
Page 16 of 42

Revision: 1.0
tSU.SDI, SDI Setup Time
ns
tHD.SDI, SDI Hold Time
ns
tVD.SDO, SDO Valid Time
Cload = 20pF
25
tDIS.SDO, SDO Output Disable Time
ns
25
ns
Table 8 fCLK = 20MHz

Note:
1.
Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Page 17 of 42

Revision: 1.0
3.7 Absolute Maximum Ratings

Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these conditions is not implied.
Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability.
Specification
Sym bol
Supply Voltage
Acceleration
Conditions
MIN
MAX
Units
V DD
-0.5
4.0
V DDIO
-0.5
4.0
10,000
Any axis, unpow ered,

0.2ms duration
Temperature
ESD Tolerance
Operating
-40
105
Storage
-40
125
HBM
KV
MM
250
Page 18 of 42

Revision: 1.0
4 Applications Information
Pin Out and Signal Description
Pin Num ber
1
Pin Nam e
RESV
Pin Description
Reserved. Connect to VDDIO.
7
8
AUX_CL
VDDIO
I2C Master serial clock, for connecting to external sensors

Digital I/O supply voltage
9
10
AD0 / SDO
REGOUT
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
Regulator filter capacitor connection
11
12
FSYNC
INT
13
18
VDD
GND
Pow er supply voltage and Digital I/O supply voltage

Pow er supply ground
19
20
RESV
RESV
Reserved. Do not connect.

Reserved. Connect to GND.
21
22
AUX_DA
nCS
23
SCL / SCLK
24
SDA / SDI
2 6, 14 - 17
NC
Frame synchronization digital input. Connect to GND if unused.

Interrupt digital output (totem pole or open-drain)
I2C master serial data, for connecting to external sensors

Chip select (SPI mode only)
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
Not internally connected. May be used for PCB trace routing.
SDA / SDI
SCL / SCLK
nCS
AUX_DA
RESV
RESV
24
23
22
21
20
19
Table 9 Signal Descriptions
RESV
18 GND
NC
17 NC
NC
NC
15 NC
NC
14 NC
NC
13 VDD
16 NC
10
11
12
VDDIO
AD0/SDO
REGOUT
FSYNC
INT
MPU-9250
AUX_CL
4.1
Figure 1 Pin Out Diagram for MPU-9250 3.0x3.0x1.0mm QFN
Page 19 of 42

Revision: 1.0
Typical Operating Circuit
RESV
18
NC
NC
NC
GND
RESV
19
20
21
RESV
AUX_DA
SDA / SDI
nCS
22
23
24
RESV
RESV
19
20
21
nCS
SCL / SCLK
AUX_DA
22
23
SDA / SDI
24
SCLK
SDI
SCL / SCLK
nCS
VDDIO
SCL
SDA
GND
RESV
18
17 NC
NC
17 NC
16 NC
NC
15 NC
NC
NC
14 NC
NC
14 NC
NC
13 VDD
NC
13 VDD
C3, 10 nF
AD0
2.4 3.3VDC
12
C2, 0.1 F
INT
11
FSYNC
REGOUT 10
9
AD0/SDO
AUX_CL
1.8 3.3VDC
15 NC
C2, 0.1 F
C1, 0.1 F
C3, 10 nF
16 NC
MPU-9250
12
2.4 3.3VDC
INT
11
FSYNC
REGOUT 10
9
AD0/SDO
1.8 3.3VDC
VDDIO
AUX_CL
MPU-9250
VDDIO
4.2
C1, 0.1 F
SD0
(a)
(b)
Figure 2 MPU-9250 QFN Application Schematic: (a) I2C operation, (b) SPI operation
Note that the INT pin should be connected to a GPIO pin on the system processor that is capable of waking
the system processor from suspend mode.
4.3
Bill of Materials for External Components

Component
Label
Specification
Quantity
Regulator Filter Capacitor
C1
Ceramic, X7R, 0.1F 10%, 2V
VDD Bypass Capacitor
C2
Ceramic, X7R, 0.1F 10%, 4V
VDDIO Bypass Capacitor
C3
Ceramic, X7R, 10nF 10%, 4V
Table 10 Bill of Materials
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Revision: 1.0
4.4
Block Diagram
MPU-9250
Self
test
X Accel
ADC
Self
test
Y Accel
ADC
INT
Interrupt
Status
Register
nCS
Slave I2C and
SPI Serial
Interface
FIFO
AD0 / SDO
SCL / SCLK
SDA / SDI
Z Accel
ADC
Self
test
X Gyro
ADC
Self
test
Y Gyro
Self
test
Z Gyro
Signal Conditioning
Self
test
User & Config

Registers
Serial
Interface
Bypass
Mux
Master I2C
Serial
Interface
Sensor
Registers
AUX_DA
FSYNC
ADC
Digital Motion
Processor
(DMP)
ADC
Signal Conditioning
Temp Sensor
AUX_CL
ADC
ADC
ADC
ADC
X
Compass
Y
Compass
Z
Compass
Bias & LDOs
Charge
Pump
VDD
Page 21 of 42
GND
REGOUT
VDDIO

Revision: 1.0
4.5 Overview
The MPU-9250 is comprised of the following key blocks and functions:
4.6
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS magnetometer sensor with 16-bit ADCs and signal conditioning
Digital Motion Processor (DMP) engine
2
Primary I C and SPI serial communications interfaces
2
rd
Auxiliary I C serial interface for 3 party sensors
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Gyroscope, Accelerometer and Magnetometer Self-test
Bias and LDO
Charge Pump
Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning
The MPU-9250 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about
the X-, Y-, and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes
a vibration that is detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered
to produce a voltage that is proportional to t he angular rat e. This voltage is digitized using individual on-chip
16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range of the gyro sensors
may be digitally programmed to 250, 500, 1000, or 2000 degrees per second (dps). The ADC sample
rate is programmable from 8,000 s amples per second, down to 3.9 samples per second, and us er-s electable
low-pass filters enable a wide range of cut-off frequencies.
4.7
Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning
The MPU-9250s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a
particular axis induces displacement on the corresponding proof mass, and capacitive sensors detect the
displacement differentially. The MPU-9250s architecture reduces the acceleromet ers susceptibility to
fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it will measure
0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers scale factor is calibrated at the factory
and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta A DC for providing
digital outputs. The full scale range of the digital output can be adjusted to 2g, 4g, 8g, or 16g.
4.8
Three-Axis MEMS Magnetometer with 16-bit ADCs and Signal Conditioning
The 3-axis magnetometer uses highly sensitive Hall sensor technology. The magnetometer portion of the IC
incorporates magnetic sensors for detecting terrestrial magnetism in the X-, Y-, and Z- Axes, a sensor driving
circuit, a signal amplifier chain, and an arithmetic circuit for processing the signal from each sensor. Each
ADC has a 16-bit resolution and a full scale range of 4800 T.
4.9
Digital Motion Processor
The embedded Digital Motion Processor (DMP) is located within the MPU-9250 and offloads comput ation of
motion processing algorithms from the host processor. The DMP ac quires data from accelerometers,
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Revision: 1.0
rd
gyroscopes, magnet ometers and additional 3 party sensors, and processes the data. The resulting data can
be read from the DMPs registers, or can be buffered in a FIFO. The DMP has access to one of the MPUs
external pins, which can be used for generating interrupts. This pin (pin 12) should be connected t o a pin on
the host processor that can wake the host from suspend mode.
The purpose of the DMP is to offload both timing requirements and processing power from the host
processor. Typically, motion processing algorithms should be run at a high rate, oft en around 200Hz, in order
to provide accurat e results with low latency. This is required even if the application updates at a much lower
rate; for example, a low power user interface may update as slowly as 5Hz, but the motion processing should
still run at 200Hz. The DMP can be used as a tool in order t o minimize power, simplify timing, simplify the
software architecture, and save valuable MIPS on the host processor for use in the application.
4.10 Primary I2C and SPI Serial Communications Interfaces

2
The MP U-9250 communicates to a system processor using either a SP I or an I C serial interface. The MPU2
9250 always acts as a slave when communicating to the system processor. The LSB of the of the I C slave
address is set by pin 9 (AD0).
4.11 Auxiliary I2C Serial Interface

2
The MPU-9250 has an auxiliary I C bus for communicating to off-chip sensors. This bus has two operating
modes:
I C Master Mode: The MPU-9250 acts as a master to any external sens ors connected to the
2
auxiliary I C bus
2
Pass-Through Mode: The MPU-9250 directly connects the primary and auxiliary I C buses together,
allowing the system processor to directly communicate with any external sensors.
2
Note: AUX_DA and AUX_CL should be left unconnected if the Auxiliary I C mode is not used.
2
Auxiliary I C Bus Modes of Operation:
I C Master Mode: Allows the MPU-9250 to directly access the data registers of external digit al
sensors, such as a magnetometer. In this mode, the MPU-9250 directly obtains data from auxiliary
sensors without intervention from the system applications processor.
2
For example, In I C Master mode, the MPU-9250 can be configured to perform burst reads, returning
the following data from a magnetometer:
X magnetometer data (2 bytes)

Y magnetometer data (2 bytes)
Z magnetometer data (2 bytes)
The I C Master can be configured to read up to 24 bytes from up to 4 auxiliary sensors. A fifth sensor
can be configured to work single byte read/write mode.
Pass-Through Mode: Allows an external system processor to act as master and directly
2
communicate to the external sensors connected to the auxiliary I C bus pins (AUX_DA and
2
rd
AUX_CL). In this mode, the auxiliary I C bus control logic (3 party sensor interface block) of the
2
MPU-9250 is disabled, and the auxiliary I C pins AUX_DA and A UX_CL are connected to the main
2
I C bus through analog switches internally.
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Revision: 1.0
Pass-Through mode is useful for c onfiguring the external sensors, or for keeping the MPU-9250 in a
low-power mode when only the external sensors are used. In this mode, the system processor can
2
still access MPU-9250 data through the I C interface.
Pass-Through mode is also used to access the AK8963 magnetometer directly from the host. In this
configuration the slave address for the AK8963 is 0X0C or 12 decimal.
2
Auxiliary I C Bus IO Logic Levels

2
For MPU-9250, the logic level of the auxiliary I C bus is VDDIO. For further information regarding the MPU9250 logic levels, please refer to Section 10.2.
4.12 Self-Test
Please refer to the register map document for more details on self-test.
Self-t est allows for the testing of the mechanical and electrical portions of the sensors. The self-test for eac h
measurement axis can be activated by means of the gy roscope and accelerometer self-test registers
(registers 13 to 16).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output
signal. The output signal is used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled Sensor output without self-test enabled
When the value of the self-test res ponse is within the appropriate limits, the part has passed self-t est. When
the self-t est response exceeds the appropriate values, the part is deemed to have failed self-test. It is
recommended to use InvenSense MotionA pps software for executing self-test. Further det ails, including the
self-test limits are included in the MPU-9250 Self-Test applications note available from InvenSense.
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4.13 MPU-9250 Solution Using I2C Interface

2
In the figure below, the system processor is an I C master to the MPU-9250. In addition, the MPU-9250 is an
2
rd
2
I C master to the optional external 3 party sensor. The MP U-9250 has limited capabilities as an I C Master,
and depends on the system processor to manage the initial configuration of any auxiliary sensors. The MPU2
9250 has an interface bypass multiplexer, which connects the system processor I C bus (S DA and S CL)
2
directly to the auxiliary sensor I C bus (AUX_DA and AUX_CL).
Once the auxiliary sensors have been configured by the system processor, the interface bypass multiplexer
2
2
should be disabled so that the MPU-9250 auxiliary I C master can take control of the sensor I C bus and
gather dat a from the auxiliary sensors. The INT pin should be connected to a GP IO on the system processor
that can wake the system from suspend mode.
Interrupt
Status
Register
INT
I2C Processor Bus: for reading all
sensor data from MPU and for
configuring external sensors (i.e.
compass in this example)
MPU-9250
AD0
Slave I2C
or SPI
Serial
Interface
VDD or GND
SCL
SCL
SDA/SDI
SDA
FIFO
Sensor I2C Bus: for
configuring and reading
from external sensors
User & Config

Registers
Optional
Sensor
Master I2C
Serial
Interface
Sensor
Register
Interface
Bypass
Mux
AUX_CL
SCL
AUX_DA
SDA
3rd party
sensor
Factory
Calibration
Digital
Motion
Processor
(DMP)
Interface bypass mux allows
direct configuration of
compass by system processor
Bias & LDOs
VDD
GND
REGOUT
VDDIO
Page 25 of 42
System
Processor

Revision: 1.0
4.14 MPU-9250 Solution Using SPI Interface

In the figure below, the system processor is a SPI master to the MPU-9250. The CS, SDO, SCLK, and SDI
2
signals are used for SPI communications. Because thes e SPI pins are s hared with the I C slave pins, the
2
system processor cannot access the auxiliary I C bus through the interface bypass multiplexer, whic h
2
2
connects the processor I C interface pins to the sensor I C interface pins.
2
Since the MPU-9250 has limited capabilities as an I C Master, and depends on the system processor to
manage t he initial configuration of any auxiliary sensors, another method must be used for programming the
2
sensors on the auxiliary sensor I C bus (AUX_DA and AUX_CL).
When using SPI communications between the MP U-9250 and the system proc essor, configuration of
2
2
devic es on the auxiliary I C sensor bus can be achieved by using I C Slaves 0-4 to perform read and writ e
2
2
transactions on any device and register on the auxiliary I C bus. The I C Slave 4 int erface can be used t o
perform only single byte read and write transactions.
Once the external s ensors have been configured, the MP U-9250 can perform single or multi-byte reads
2
using the sensor I C bus. The read res ults from the Slave 0-3 controllers can be written to the FIFO buffer as
well as to the external sensor registers.
The INT pin should be connected to a GPIO on the system processor capable of waking the processor from
suspend
2
For further information regarding the cont rol of the MPU-9250s auxiliary I C interface, please refer to the
MPU-9250 Register Map and Register Descriptions document.
Interrupt
Status
Register
Processor SPI Bus: for reading all

data from MPU and for configuring
MPU and external sensors
INT
nCS
nCS
MPU-9250
SDI
SDO
Slave I2C
or SPI
Serial
Interface
SCLK
SCLK
System
Processor
SDO
SDI
FIFO
2
Sensor I C Bus: for

configuring and
reading data from
external sensors
Config
Register
Optional
Sensor
Master I2C
Serial
Interface
Sensor
Register
Interface
Bypass
Mux
AUX_CL
SCL
AUX_DA
SDA
3rd party
sensor
Factory
Calibration
Digital
Motion
Processor
(DMP)
I2C Master performs

read and write
transactions on
Sensor I2C bus.
Bias & LDOs
VDD
GND
REGOUT
VDDIO
4.15 Clocking
The MP U-9250 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the
internal synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, the
DMP, and various control circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for
generating this clock.
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Revision: 1.0
Allowable internal sources for generating the internal clock are:
An internal relaxation oscillator

Any of the X, Y, or Z gyros (MEMS oscillators with a variation of 1% over temperature)
Selection of the source for generating the internal synchronous clock depends on the requirements for power
consumption and clock accuracy. These requirements will most likely vary by mode of operation. For
example, in one mode, where the biggest concern is power consumption, the user may wish to operate the
Digital Motion Processor of the MP U-9250 to process acceleromet er data, while keeping t he gyros off. In this
case, the internal relaxation oscillator is a good clock choice. However, in anot her mode, where the gyros
are active, selecting the gyros as the clock source provides for a more accurate clock source.
Clock accuracy is important, since timing errors directly affect the distance and angle calculations performed
by the Digital Motion Processor (and by extension, by any processor).
There are also start-up conditions to consider. When the MPU-9250 first starts up, the device uses its
internal clock until programmed to operate from anot her source. This allows the user, for example, to wait
for the MEMS oscillators to stabilize before they are selected as the clock source.
4.16 Sensor Data Registers

The sensor dat a registers contain the latest gyroscope, accelerometer, magnetometer, auxiliary sensor, and
temperature measurement data. They are read-only registers, and are accessed via the serial interface.
Data from these registers may be read anytime.
4.17 FIFO
The MPU-9250 contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO
configuration register determines which data is written into the FIFO. Possible choices include gyro data,
accelerometer data, temperature readings, auxiliary sensor readings, and FSY NC input. A FIFO counter
keeps track of how many bytes of valid dat a are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
For further information regarding the FIFO, please refer to the MPU-9250 Register Map and Register
Descriptions document.
4.18 Interrupts
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include
the INT pin configuration, the int errupt latching and clearing method, and triggers for the interrupt. It ems that
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (us ed when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers ); (3) acceleromet er event
interrupts; and (4) the MP U-9250 did not receive an acknowledge from an auxiliary sensor on the secondary
2
I C bus. The interrupt status can be read from the Interrupt Status register.
The INT pin should be connected to a pin on the host processor capable of waking that processor from
suspend.
For further information regarding interrupts, please refer to the MPU-9250 Register Map and Register
Descriptions document.
4.19 Digital-Output Temperature Sensor

An on-chip temperat ure sensor and A DC are used to meas ure the MPU-9250 die temperat ure. The readings
from the ADC can be read from the FIFO or the Sensor Data registers.
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Revision: 1.0
4.20 Bias and LDO

The bias and LDO section generates the int ernal supply and the reference voltages and currents required by
the MPU-9250. Its two inputs are an unregulated VDD and a V DDIO logic reference supply voltage. The
LDO output is bypassed by a capacitor at REGOUT. For further details on the capacitor, please refer to the
Bill of Materials for External Components.
4.21 Charge Pump

An on-chip charge pump generates the high voltage required for the MEMS oscillators.
4.22 Standard Power Mode

The following table lists the user-accessible power modes for MPU-9250.
Mode
Name
Gyro
Accel
Magnetometer
DMP
Sleep Mode
Off
Off
Off
Off
Standby Mode
Drive On
Off
Off
Off
Low-Power Accelerometer Mode
Off
Duty-Cycled
Off
On or Off
Low-Noise Accelerometer Mode
Off
On
Off
On or Off
Gyroscope Mode
On
Off
Off
On or Off
Magnetometer Mode
Off
Off
On
On or Off
Accel + Gyro Mode
On
On
Off
On or Off
Accel + Magnetometer Mode
Off
On
On
On or Off
9-Axis Mode
On
On
On
On or Off
Notes:
1. Power consumption for individual modes can be found in Electrical Characteristics section.
4.23 Power Sequencing Requirements and Power on Reset
During power up and in normal operation, V DDIO must not exceed V DD. During power up, VDD and V DDIO
must be monotonic ramps. As stated in Table 4, the minimum VDD rise time is 0.1ms and the maximum ris e
time is 100 ms. Valid gyroscope data is available 35 ms (typical) aft er VDD has risen to its final voltage from
a cold start and valid accelerometer data is available 30 ms (typical) aft er VDD has risen to its final voltage
assuming a 1ms VDD ramp from cold start. Magnetometer data is valid 7.3ms (typical) after VDD has risen
to its final voltage value from a cold start.
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Revision: 1.0
5 Advanced Hardware Features

The MPU-9250 includes advanced hardware features that can be enabled and disabled through simple
hardware register settings. The advanced hardware features are not initially enabled after device power up.
These features must be individually enabled and configured. These advanced hardware features enable the
following motion-based functions without using an external microprocessor:
Low Power Quaternion (3-Axis Gyro & 6-Axis Gyro + Accel)

Android Orientation (A low-power implementation of Androids screen rotation algorithm)
Tap (detects the tap gesture)
Pedometer
Significant Motion Detection
To ensure significant motion detection can operate properly, the INT pin should be connected to a GPIO pin
on the host processor that can wake that processor from suspend mode.
Note: Android Orientation is compliant to the Ice Cream Sandwich definition of the function.
For further details on advanced hardware features please refer to the MPU-9250 Register Map.
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Revision: 1.0
6 Programmable Interrupts
The MPU-9250 has a programmable interrupt system which can generate an interrupt signal on the INT pin.
Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
Table of Interrupt Sources

Interrupt Nam e
Module
Motion Detection
Motion
FIFO Overflow
FIFO
Data Ready
Sensor Registers
I2C Master errors: Lost Arbitration, NACKs
I2C Master
I2C Slave 4
I2C Master
For information regarding the interrupt enable/disable registers and flag registers, please refer to the MPU9250 Register Map and Register Descriptions document. Some interrupt sources are explained below.
6.1 Wake-on-Motion Interrupt

The MPU-9250 provides motion det ection capability. A qualifying motion sample is one where the high
passed sample from any axis has an absolute value exceeding a us er-programmable threshold. The
following flowchart explains how to configure the Wake-on-Motion Interrupt. For further details on individual
registers, please refer to the MPU-9250 Registers Map and Registers Description document.
In order to properly enable motion interrupts, the INT pin should be connected to a GP IO on the system
processor that is capable of waking up the system processor.
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Revision: 1.0
Configuration Wake-on-Motion Interrupt using low power Accel mode
Make Sure Accel is running:

In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0
In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1
SetAccel
AccelLPF
LPFsetting
settingto
to184
184 Hz
Hz Bandwidth:
Bandwidth:
Set
InACCEL_CONFIG
2
(0x1D)
set
ACCEL_FCHOICE_B
=
0 and=A_DLPFCFG[2:0]=1(b001)
In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B
1 and A_DLPFCFG[2:]=1(b001)
Enable Motion Interrupt:

In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only.
Enable Accel Hardware Intelligence:

In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 and ACCEL_INTEL_MODE = 1
Set Motion Threshold:

In WOM_THR (0x1F), set the WOM_Threshold [7:0] to 1~255 LSBs (0~1020mg)
Set Frequency of Wake-up:

In LP_ACCEL_ODR (0x1E), set Lposc_clksel [3:0] = 0.24Hz ~ 500Hz
Enable Cycle Mode (Accel Low Power Mode):

In PWR_MGMT_1 (0x6B) make CYCLE =1
Motion Interrupt Configuration Completed
Figure 3. Wake-on-Motion Interrupt Configuration
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Revision: 1.0
7 Digital Interface
7.1 I2C and SPI Serial Interfaces
2
The internal registers and memory of the MPU-9250 can be accessed using either I C at 400 kHz or SPI at
1MHz. SPI operates in four-wire mode.
Serial Interface
Pin Num ber
Pin Nam e
VDDIO
Pin Description
AD0 / SDO
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
23
SCL / SCLK
I2C serial clock (SCL); SPI serial clock (SCLK)
24
SDA / SDI
Digital I/O supply voltage.
I2C serial data (SDA); SPI serial data input (SDI)
Note:
2
To prevent switching int o I C mode when using SP I, the I C interface s hould be disabled by setting the
I2C_IF_DIS configuration bit. Setting this bit should be performed immediately after waiting for the time
specified by the Start-Up Time for Register Read/Write in Section 6.3.
For further information regarding the I2C_IF_DIS bit, pleas e refer to the MPU-9250 Register Map and
Register Descriptions document.
7.2 I2C Interface

2
I C is a two-wire interface comprised of the signals serial data (SDA ) and serial clock (SCL). In general, the
2
lines are open-drain and bi-directional. In a generalized I C int erface implementation, attached devic es can
be a master or a slave. The master device puts the slave address on the bus, and the slave device with the
matching address acknowledges the master.
The MPU-9250 always operates as a slave device when communicating to the system proc essor, which thus
acts as the master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is
400 kHz.
The slave address of the MPU-9250 is b110100X which is 7 bits long. The LSB bit of the 7 bit address is
2
determined by the logic level on pin AD0. This allows two MPU-9250s to be connected to the same I C bus.
When used in this configuration, the address of the one of the devices should be b1101000 (pin A D0 is logic
low) and the address of the other should be b1101001 (pin AD0 is logic high).
7.3 I2C Communications Protocol

START (S) and STOP (P) Conditions
2
Communication on the I C bus starts when t he master puts the S TA RT condition (S) on the bus, which is
defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is
considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to
HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
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SDA
SCL
S
START condition
STOP condition
START and STOP Conditions
Data Format / Ack nowledge

2
I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per
data transfer. Each byte transferred must be followed by an acknowledge (ACK ) signal. The clock for the
acknowledge signal is generated by the master, while the receiver generates the actual acknowledge signal
by pulling down SDA and holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been
performed, it can hold S CL LOW, thus forcing the master into a wait state. Normal data transfer resumes
when the slave is ready, and releases the clock line (refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
clock pulse for

acknowledgement
START
condition
2
Acknowledge on the I C Bus
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Communications
After beginning communications with the S TA RT condition (S), the master sends a 7-bit slave address
th
followed by an 8 bit, the read/write bit. The read/writ e bit indicates whether the master is receiving data from
or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledge
signal (ACK ) from the slave device. Each byte transferred must be followed by an acknowledge bit. To
acknowledge, the slave device pulls the S DA line LOW and keeps it LOW for the high period of the S CL line.
Data transmission is always terminated by the master with a S TOP condition (P), thus freeing the
communications line. However, the master can generate a repeated S TART condition (Sr), and address
another slave without first generating a STOP condition (P). A LOW to HIGH transition on the SDA line while
SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
SDA
SCL
17
17
17
START ADDRESS
condition
R/W
ACK
DATA
ACK
DATA
ACK
STOP
condition
Complete I C Data Transfer

2
To write the internal MPU-9250 registers, the master transmits the start condition (S), followed by the I C
th
address and the write bit (0). At the 9 clock cycle (when the clock is high), the MP U-9250 acknowledges the
transfer. Then the master puts the register address (RA ) on the bus. After the MPU-9250 acknowledges the
reception of the register address, the master puts the register data ont o the bus. This is followed by the A CK
signal, and data transfer may be concluded by the stop condition (P). To writ e multiple bytes after the last
ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the
MPU-9250 automatically increments the register address and loads the data to the appropriate register. The
following figures show single and two-byte write sequences.
Single-Byte Write Sequence

Master
AD+W
Slave
RA
ACK
DATA
ACK
P
ACK
Burst Write Sequence

Master
Slave
AD+W
RA
ACK
DATA
ACK
DATA
ACK
Page 34 of 42
P
ACK

Revision: 1.0
To read the internal MP U-9250 registers, the master sends a start condition, followed by the I C address and
a writ e bit, and then t he register address that is going to be read. Upon receiving the A CK signal from the
MPU-9250, the master transmits a start signal followed by the slave address and read bit. As a result, the
MPU-9250 sends an ACK signal and the data. The communication ends with a not acknowledge (NACK )
signal and a stop bit from master. The NA CK condition is defined such t hat the S DA line remains high at the
th
9 clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence

Master
AD+W
Slave
RA
ACK
AD+R
ACK
NACK
ACK
DATA
Burst Read Sequence

Master
Slave
AD+W
RA
ACK
S
ACK
AD+R
ACK
ACK
DATA
7.4 I2C Terms

Signal Description
S
Start Condition: SDA goes from high to low while SCL is high
2
AD
Slave I C address
W
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: S DA line is low while the S CL line is high at the
th
9 clock cycle
th
NACK
Not-Acknowledge: SDA line stays high at the 9 clock cycle
RA
MPU-9250 internal register address
DATA
Transmit or received data
P
Stop condition: SDA going from low to high while SCL is high
Page 35 of 42
NACK
DATA

Revision: 1.0
7.5 SPI Interface

SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-9250
always operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK ), the Serial Data Output (SDO) and the Serial
Data Input (SDI) are shared among the Slave devices. Each SPI slave device requires its own Chip Select
(CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line
is active at a time, ensuring that only one slave is selected at any given time. The CS lines of the nonselected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) state
so that they do not interfere with any active devices.
SPI Operational Features
1.
2.
3.
4.
5.
Data is delivered MSB first and LSB last

Data is latched on the rising edge of SCLK
Data should be transitioned on the falling edge of SCLK
The maximum frequency of SCLK is 1MHz
SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The
first byte contains the SPI A ddress, and the following byte(s) contain(s) the SPI data. The first
bit of the first byte contains the Read/Write bit and indicates the Read (1) or Write (0) operation.
The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is
two or more bytes:
SPI Address format
MSB
R/W
A6
A5
A4
A3
A2
A1
LSB
A0
D4
D3
D2
D1
LSB
D0
SPI Data format

MSB
D7
6.
D6
D5
Supports Single or Burst Read/Writes.
SCLK
SDI
SDO
SPI Master
/CS1
SPI Slave 1
/CS
/CS2
SCLK
SDI
SDO
/CS
SPI Slave 2
Typical SPI Master / Slave Configuration
Page 36 of 42

Revision: 1.0
8 Serial Interface Considerations

8.1 MPU-9250 Supported Interfaces
2
The MPU-9250 supports I C communications on both its primary (microprocessor) serial interface and its
auxiliary interface.
The MPU-9250s I/O logic levels are set to be VDDIO.
2
The figure below depicts a sample circuit of MP U-9250 with a third party sensor attached to the auxiliary I C
bus. It shows the relevant logic levels and voltage connections.
Note: Actual configuration will depend on the auxiliary sensors used.
I/O Levels and Connections
Page 37 of 42

Revision: 1.0
9 Assembly
This section provides general guidelines for assembling InvenS ense Micro Electro-Mechanical Systems
(MEMS) devices packaged in quad flat no-lead package (QFN) surface mount integrated circuits.
9.1 Orientation of Axes

The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Not e the pin 1
identifier () in the figure.
+Z
+Y
+Z
MP
+Y
U-
92
50
+X
+X
Figure 4. Orientation of Axes of Sensitivity and Polarity of Rotation for Accelerometer and Gyroscope
+X
MP
U-
92
50
+Y
+Z
Figure 5. Orientation of Axes of Sensitivity for Compass
9.2
Package Dimensions
24 Lead QFN (3x3x1) mm NiPdAu Lead-frame finish
Page 38 of 42

Revision: 1.0
SYMBOLS
A
A1
b
c
D
D2
E
E2
e
f (e-b)
K
L
R
s
y
DIMENSIONS IN
MILLIMETERS
MIN
NOM
MAX
DESCRIPTION
Package thickness
Lead finger (pad) seating height
Lead finger (pad) width
Lead frame (pad) height
Package width
Exposed pad width

Package length
Exposed pad length

Lead finger-finger (pad-pad) pitch
Lead-lead (Pad-Pad) space
Lead (pad) to Exposed Pad Space
Lead (pad) length
Lead (pad) corner radius
Corner lead (pad) outer radius to corner
lead outer radius
Page 39 of 42
0.95
0.00
0.15
--2.90
1.65
2.90
1.49
--0.15
--0.25
0.075
1.00
0.02
0.20
0.15 REF
3.00
1.70
3.00
1.54
0.40
0.20
0.35 REF
0.30
REF
1.05
0.05
0.25
--3.10
1.75
3.10
1.59
--0.25
--0.35
---
--0.00
0.25 REF
---
--0.075

Revision: 1.0
10 Part Number Package Marking

The part number package marking for MPU-9250 devices is summarized below:
Part Number
Part Number Package Marking
MPU-9250
MP92
Page 40 of 42

Revision: 1.0
11 Reliability
11.1 Qualification Test Policy
InvenSenses products complete a Qualification Test Plan before being released to production. The
Qualification Test Plan for the MPU-9250 followed the JEDE C JESD 47I Standard, Stress-Test-Driven
Qualification of Integrated Circuits, with the individual tests described below.
11.2 Qualification Test Plan
Accelerated Life Tests
TEST
Method/Condition
(HTOL/LFR)
High Temperature Operating Life
JEDEC JESD22-A108D
Dynamic, 3.63V biased, Tj>125C
[read-points: 168, 500, 1000 hours]
JEDEC JESD22-A118A
Condition A, 130C, 85%RH, 33.3 psia., unbiased
[read-point: 96 hours]
JEDEC JESD22-A103D
Condition A, 125C Non-Bias Bake
[read-points: 168, 500, 1000 hours]
(HAST)
Highly Accelerated Stress Test (1)
(HTS)
High Temperature Storage Life
Lot
Sample
Quantity
/ Lot
Acc /
Reject
Criteria
77
(0/1)
77
(0/1)
77
(0/1)
Device Component Level Tests

TEST
Method/Condition
(ESD-HBM)
ESD-Human Body Model
JEDEC JS-001-2012
(2KV)
(0/1)
(ESD-MM)
ESD-Machine Model
JEDEC JESD22-A115C
(250V)
(0/1)
(ESD-CDM)
ESD-Charged Device Model
JEDEC JESD22-C101E
(500V)
(0/1)
(LU)
Latch Up
JEDEC JESD-78D
Class II (2), 125C; 100mA
1.5X Vdd Over-voltage
(0/1)
(MS)
Mechanical Shock
JEDEC JESD22-B104C, Mil-Std-883, Method

2002.5 Cond. E, 10,000gs, 0.2ms,
X, Y, Z 6 directions, 5 times/direction
JEDEC JESD22-B103B
Variable Frequency (random), Cond. B, 5-500Hz,
X, Y, Z 4 times/direction
JEDEC JESD22-A104D
Condition G [-40C to +125C], Soak Mode 2 [5]
[read-Point: 1000 cycles]
(0/1)
(0/1)
77
(0/1)
(VIB)
Vibration
(TC)
Temperature Cycling (1)
(1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F
Page 41 of 42
Lot
Sample
Quantity
/ Lot
Acc /
Reject
Criteria

Revision: 1.0
12 Reference
Please refer to InvenSense MEMS Handling Application Note (A N-IVS-0002A-00) for the following
information:
Manufacturing Recommendations
o Assembly Guidelines and Recommendations
o PCB Design Guidelines and Recommendations
o MEMS Handling Instructions
o ESD Considerations
o Reflow Specification
o Storage Specifications
o Package Marking Specification
o Tape & Reel Specification
o Reel & Pizza Box Label
o Packaging
o Representative Shipping Carton Label
Compliance
o Environmental Compliance
o DRC Compliance
o Compliance Declaration Disclaimer
This information furnis hed by InvenSense is believed to be accurate and reliable. How ever, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of thir d parties that may result from its use. Specific ations are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, w ithout prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specif ications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask w ork and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwis e under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or lif e threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies w ith which they are associated.
2014 InvenSense, Inc. All rights reserved.
Page 42 of 42

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InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A.

Document Number: PS- MPU-9250A-01

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01

DOCUMENT INFORMATION ............................................................................................................ 4

R EVISION HISTORY .................................................................................................................... 4

PURPOSE AND S COPE ................................................................................................................ 5

PRODUCT OVERVIEW ................................................................................................................. 5

GYROSCOPE F EATURES ............................................................................................................. 6

ACCELEROMETER F EATURES ...................................................................................................... 6

MAGNETOMETER F EATURES ....................................................................................................... 6

ADDITIONAL FEATURES .............................................................................................................. 6

MOTIONP ROCESSING ................................................................................................................. 7

ELECTRI CAL CHARACTERISTICS .................................................................................................. 8

GYROSCOPE S PECIFICATIONS ..................................................................................................... 8

ACCELEROMETER S PECIFICATIONS .............................................................................................. 9

MAGNETOMETER S PECIFICATIONS ............................................................................................. 10

ELECTRICAL SPECIFICATIONS .................................................................................................... 11

I2C TIMING C HARACTERIZATION ................................................................................................ 15

SPI TIMING C HARACTERIZATION ................................................................................................ 16

ABSOLUTE MAXIMUM RATINGS .................................................................................................. 18

APPLICATIONS INFORMATION ..................................................................................................... 19

PIN O UT AND SIGNAL D ESCRIPTION............................................................................................ 19

TYPICAL O PERATING C IRCUIT.................................................................................................... 20

BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................... 20

BLOCK D IAGRAM ..................................................................................................................... 21

D IGITAL MOTION P ROCESSOR ................................................................................................... 22

PRIMARY I2C AND SPI S ERIAL COMMUNICATIONS INTERFACES ...................................................... 23

AUXILIARY I2C S ERIAL INTERFACE ............................................................................................. 23

MPU-9250 SOLUTION USING I2C INTERFACE.............................................................................. 25

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01

MPU-9250 SOLUTION USING SPI INTERFACE.............................................................................. 26

SENSOR DATA R EGISTERS ....................................................................................................... 27

D IGITAL-O UTPUT TEMPERATURE S ENSOR ................................................................................... 27

BIAS AND LDO........................................................................................................................ 28

CHARGE PUMP ....................................................................................................................... 28

STANDARD P OWER MODE ........................................................................................................ 28

POWER S EQUENCING R EQUIREMENTS AND POWER ON R ESET ....................................................... 28

ADV ANCED HARDWARE FEATURES ............................................................................................ 29

PROGRAMMABLE INTERRUPTS ................................................................................................... 30

DIGITAL INTERFACE ..................................................................................................................... 32

I2C AND SP I S ERIAL INTERFACES .............................................................................................. 32

I2C INTERFACE ....................................................................................................................... 32

I2C C OMMUNICATIONS P ROTOCOL ............................................................................................. 32

I2C TERMS ............................................................................................................................ 35

SERI AL INTERFACE CONSI DERATIONS ....................................................................................... 37

W AKE-ON-MOTION INTERRUPT .................................................................................................. 30

MPU-9250 SUPPORTED INTERFACES ......................................................................................... 37

ORIENTATION OF AXES ............................................................................................................. 38

PACKAGE D IMENSIONS ............................................................................................................. 38

10 PART NUMBER PACKAGE MARKING ........................................................................................... 40

QUALIFICATION TEST POLICY .................................................................................................... 41

QUALIFICATION TEST PLAN ....................................................................................................... 41

MPU-9250 Product Specification

Document Number: PS-MPU-9250A-01

Document Number: PS-MPU-9250A-01

MPU-9250 Product Specification

1.2 Purpose and Scope