Innovations in Abrasive Products For Precision Grinding PDF
Innovations in Abrasive Products For Precision Grinding PDF
Innovations in Abrasive Products For Precision Grinding PDF
Abstract
This paper is a review of recent developments in the design and manufacture of precision, fixed-abrasive tools. The role of
each component within the engineered composite is also discussed, with examples showing how the components have
been enhanced to achieve their current high levels of performance. The paper also looks at examples where innovations in
the abrasive tool have enabled the development of innovative abrasive processes. A vision of future abrasive product
developments is also presented by the authors.
Keywords:
grinding, abrasives, machine
Acknowledgements
The authors would like to acknowledge all who have
contributed to this paper through suggestions,
discussions and documents of their work. Special thanks
are given to Prof. E. Brinksmeier and his co-workers at
IWT Bremen, Prof. F. Klocke and his co-workers at WZL
Aachen, Prof. B. Denkena and his co-workers at IFW
Hannover, Prof. D. Stephenson of Cranfield Univ., Prof.
F. Rehsteiner, Prof. J. C. Aurich of Kaiserslautern Univ.,
Prof. K. Weinert of Dortmund Univ., Prof. B. Hon of
Liverpool Univ., Dr. H. W. Hoffmeister of Braunschweig
Univ., Prof. V. Kovalenko of Kiev Polytechnic, Prof. P.
Koshy of McMaster Univ., Dr. R. Stabenow and his coworkers at Hermes Schleifmittel, Dr. T. Tawakoli, and
also Drs. K. Breder and K. Subramanian, Saint Gobain.
1. General Overview of paper
Presenting technical accomplishments from the multibillion dollars abrasive industry necessarily requires
being selective. It was therefore decided to limit the
scope of this paper to precision grinding, a loose
designation merely used to focus on abrasive processes
where forms and/or surface integrity (e.g. roughness, but
also subsurface damage etc.) are the primary figure of
merit. Significant developments have of course also been
demonstrated in abrasive processes where volumetric
removal rates or other goals are the primary drivers, but
these will not be covered here for the sake of brevity.
It was further decided to primarily report on applications
where recent abrasive product developments have
translated into novel abrasive process accomplishments
(e.g. increase in grinding wheel permeability for new
creep feed grinding applications, new grinding wheel
shapes for high speed grinding etc.). It was also the
intention of the authors to exclude the constant and
obviously important continual improvements made by
abrasive manufacturer worldwide, to merely improve their
existing product for mere incremental performance
improvement (e.g. new bond formulation to improve
wheel life by 10%).
The fragmented nature of the abrasive industry (in North
America alone, several hundred manufacturers vie for
market share) makes it a competitive one, rife with
proprietary issues. To steer well clear of confidential
developments, and perhaps in a new approach for CIRP,
this paper relies heavily on issued patents, particularly
recent ones, as well as academic publications.
3.
4.
BOND
STRUCTURE
ADDITIVES
DESIGN
a)
3m
b)
3m
14
12
10
8
6
4
Type H1 wet; G = 16.8 mm/mm
Type H1 dry; G = 71.6 mm/mm
Type K1 wet; G = 54,4 mm/mm
Type K1 dry; G = 72,4 mm/mm
2
0
0
200
400
600
800
1000
Metal removed per unit width V'w [mm/mm]
1200
0.59m
0.67m
0.97m
3.5m
10.1m
si z
e
lite
SiC single
crystal
Al2O3 single
crystal
Temperature (C)
Fig. 4. High temperature hardness variation [63]
Sales of natural diamond wheels increased significantly
during the 1940s, representing 20% of all sales (by
value) of the Norton Company by 1952 [23].
The first synthesis of artificial diamond was reported by
Bundy and his colleagues at General Electric in 1955
[19], culminating as they pointed out more than a
century of claims and counterclaims for the synthesis of
diamond attest to the fascination of the subject and the
extreme difficulty of the experimental techniques. In an
B181_V_D_A_V180
v
100
gra
in
vo
lu
40
60
60
40
80
20
100
0
vP
sp
ec
.
80
me
olu
rev
po
me
.
ec
sp
18
20
40
60
80
0
100
cBN grit
substrate
Bond
breakage
Grain
pullout
Electro-plated bonding
Qw,max = 1.000 - 10.000 mm/mms
bonding type
metallic bonding
Qw,max = 50 - 250 mm/mms
vitrified bonding
Qw,max = 50-150 mm/mms
resin bonding
Qw,max = 50-150 mm/mms
vitrified/bakelite
Qw,max=10-100mm/mms
100
150
200
250
300
600
600
central bore
effective stress
N/mm
1A1-wheel
400
bs = 5 mm
p = 2,71 kg/dm
vs = 500 m/s
300
200
400
300
200
100
100
0
HSG-wheel
0
50
100
150
wheel radius rs
- - - radial elongation
1A1-wheel
0
200
HSG-wheel
Ploughing
1.3
Sliding
2. CHIP/BOND
3. CHIP/WORK
4. BOND/WORK
Cutting
Sliding
Sliding
Sliding
cBN grit
TiC film
brazed layer
substrate
grain
Wheel
bond
Agglomerate
bond
Disadvantages include:
133m
source: T. Tawakoli
grinding wheel
nozzle
fluid
chamber
workpiece
perforated
hole
temperature sensor
synthetic resin aluminum composite hub
telemetry stator
9.4 m
circumference of the
rotating grinding wheel
d
aluminum hub
Ft =
18 N/mm
Fn = Fresultant= 110 N/mm
3
2 1
m
nodal displacement
0 (vector sum,
aluminum hub wheel)
4 m
circumference of the
rotating grinding wheel
dimensions : displacement
1 : 400
workpiece material : hot-pressed silicon nitride
: a e = 1.5 mm
depth of cut
cutting speed
: v c = 50 m/s
: v w = 160 mm/min
feed rate
telemetry ring
conventional
wheel
ds = 400mm; a = 6mm
Material: 16MnCr5
Qw = 100 mm3/s.mm
Fluid: mineral oil
cBN
wheel
Wheelspeed(m/s)
Fig. 20. The HEDG effect [109]
1400
m
cBN
1000
800
600
200
0
G = 2.6 mm /mm
alumina
fibres
3
3
G = 19.0 mm /mm
400
500
1000
1500
2000
2500
mm3/mm 3500
Fig. 21. Radial wear for cBN versus alumina fibres [69]
The result showed that after low initial wear the
comparison B126 vitrified cBN wheel gradually
developed greater grain wear than the 80 mesh sintered
alumina fibre wheels, giving a G-ratio of 2.6 mm/mm for
the cBN-wheel, and a G-ratio of 19.0 mm/mm for the
alumina fibre wheel. It must be noted that this result was
obtained in water-based fluid.
5.2. High speed traverse/contour/peel grinding
Traverse, contour or peel grinding, as the process is
known, is analogous to turning of a cylindrical part, with a
grinding wheel instead of a single-point cutting tool. The
advantage of this approach, as compared to plunge
grinding, is that a single wheel can form a multi-diameter,
fully hardened, shaft in only a few passes. These single
pass traverse approaches are only possible using high
wear
resistant
superabrasive
wheels,
typically,
electroplated, vitrified, or metal-bond types. The wheels
primarily cut the workpiece material on their sides and
therefore require the abrasive to wrap around the edges.
Narrow, but sufficiently stiff, wheels help reduce the
contact width to reduce the thermal loading on the
workpiece surface [100][113]. Fig 22 shows the principle
of the process.
vf
bc
Grinding
wheel
closed structure
residual stress
300
work
MPa
white etching
area (WEA)
0
- 150
structure of
etchable
martensite
- 300
- 450
- 500
Q / w = d w nw a f tan .
(1)
5.3. Grind-hardening
It has been shown that the heat flux generated in grinding
can be used to induce martensitic phase transformations
into the surface layers of annealed or tempered steel,
creating a hardened surface, with pre-dominantly
compressive surface residual stresses. This technique
can replace both the rough grinding in soft state and
heat treatment operations, that are traditionally used in a
production sequence [17][18]. Grind-hardening is not to
be confused with grinding burn, where a hardened
workpiece adopts a martensitic white layer, containing
tensile surface residual stresses.
The maximum depth of hardness penetration, and
hardness profile, obtained by grind-hardening, to date,
ranges from 2mm for flat surfaces and 1.6mm for round
surfaces. Fig. 24 shows the surface residual stress
0,05
0,1
mm
depth beneath surface
0,2
work
coolant
nozzle
spacer rollers
feed roller
take-up roller
Electro-Discharge
Machining
and
Grinding
(EDMG)[93]
rotation grinding
coolant
(electrolyte)
+
workpiece
+
-
U
workpiece
electrode
= cathode (copper, graphite)
electrode
= cathode
coolant
(electrolyte)
metal bond
abrasive
workpiece
Fig. 27. Principle of EDDG [60]
The cBN that Shin used was typical of that used in a
standard vitrified product. However, Hoffmeister and
Timmer [44] found that the greater transparency of
natural diamonds allowed them to withstand the energy
of the laser far better than the yellow synthetic diamonds.
They also determined that larger grit sizes are more
tolerant of the laser energy, with regards to grit fracturing
due to a reduction in fracture toughness.
Hoffmeister and Timmer [44] compared traditional
phenolic resin bond with high-temperature, copper filled,
polyimide resin bond, showing the former took longer to
profile, using a tangential laser. Their tests on resin bond
wheels concluded that careful control of the bond
material, and use of more transparent diamonds, will lead
to a product that is tuned to the laser-truing process.
5.6. Fixed abrasive grinding, with a vertical spindle
Manufacturing of silicon wafers consists of a succession
of abrasive processes: saw, edge, lap, etch and polish.
As the requirements for flatness and wafer size
tolerances increase, new process were needed to
replace some of the loose abrasive (lapping and
polishing) steps by fixed abrasive. In addition, it was felt
the throughput of loose abrasive process in the finishing
of a wide variety of ceramic materials could be improved
by grinding processes, provided of course that the
necessary low roughness (typically sub-100 Angstroms
Rms) could be achieved. This led to the development of
a grinding process [114] with a narrow abrasive rim
(approx. 6 mm) and special kinematics (e.g. centre of
wafer directly under abrasive rim) to generate mirror
finishes on a variety of advanced ceramic components.
Fine
Infeed Grinding Wheel
Air
Bearing
Spindle
Wafer
Air
Bearing
Spindle
Side
Vi
Wafer
Vacuum
Chuck
Top
Vi
scanner
laser
recoater
part
powder
platform
laser
beam
sintered
layer
substrate
plate
powder
133m
zV= 200 m
possible defect:
gap in grit pattern
axial profile
Roughness Ra (m)
3. 5
3. 0
57.6 m
52.6 m
axial pitch 47.6 m
2. 5
Axial offset
2. 0
vs
1. 5
1. 0
Axial pitch
0. 5
0. 0
0
10
20
30
40
50
60
US spindle (axial
movement initiated by
an ultrasonic generator)
f = 20 kHz
xspi = 1 3 m
oscillating tool
xtoo = 3 50 m
diamond layer
workpiece
(e.g. glass, ceramics,
CFRP, ...)
vft
BC4N
BC2N
C3N4
B4C
cBN
N
B
Fig. 38. Superhard Materials in B-C-N System [123]
6.5. Superhard material development
The search for novel superhard materials continues
following the successful synthesis of man-made diamond
and cubic boron nitride at high temperatures and
pressures. Designing new superhard materials with
novel properties, and developing practical methods of
production, are the goals of several research teams
[123][41][72][46]. Potential candidates are from the
systems of carbon nitrides (C3N4), boron-carbon-nitrides
(BC2N), boron carbides (B4C), and boron nitrides (cBN),
as illustrated in Fig. 38.
In one exciting example, a theoretical calculation from
first principles predicted that certain carbon nitrides have
bulk moduli comparable to or even greater than that of
diamond. Based on the assumption that hardness
correlates with the bulk modulus, cubic C3N4 (with a
calculated bulk modulus of 496Gpa) will likely be harder
Hardness
Bulk Mod.
Shear Mod.
(GPa)
(GPa)
(GPa)
Diamond
70-90
443
535
Cubic BN
48
400
409
Cubic C3N4
??
496
332*
- C3N4
??
437
320*
BC2N
60
408
445*
B4C
30
247
171
Fig. 39. Measured and Calculated Modulus Values [123]
Low oxygen content cBN and its production, has also
been reported [124]. Higher pressures are needed to
obtain single-phase material and to search for suitable
catalysts to lower the pressure and temperature
conditions. In the boron-oxide system, single phase of
B6O has been produced at conditions of 5-7.5 GPa and
1700C [46], while cubic B6O was reported to be
synthesized at much lower pressure and temperature
ranges of 3.5-5.5 GPa, 1000C-1200C [123]. However,
further work is needed to characterize their structure and
properties.
Zhao et al [123] carried out high-pressure synthesis of
well-sintered millimetre-sized bulks of superhard BC2N
and BC4N materials in the form of a nano-crystalline
composite with diamond-like amorphous carbon grain
boundaries. These new high-pressure phases of B-C-N
compound have extreme hardnesses, second only to
diamond. The final products are well-sintered millimetre
size chunks which are translucent and yellowish in
colour. The synthesized BC2N and BC4N materials have
a zinc-blend structure and a face-centred cubic unit cell.
The hardness measurements show that the BC2N and
BC4N samples synthesized under high pressure and
temperature have nominal hardnesses of 62 GPa and 68
GPa respectively, which is very close to diamond and far
higher than cBN.
Zhao et al [123] states that reactive sintering of diamondSiC nano-composites, based on thorough mixing of
diamond and silicon nano-size powder, can be applied to
produce large specimens. It is expected that by better
sample preparation, carefully designed mixing protocols,
and by using silicon powder of smaller grain size, it will
be possible to eliminate graphitization, reduce porosity
and decrease SiC content, and thus further improve
properties of diamond-SiC nano-composites.
7. Concluding remarks
This paper does not reflect the views of Saint Gobain or
QED Technologies, but is the result of extensive
literature and patent searches by the authors. The
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