LG BL20 Manual Service

Service Manual
Internal Use Only
Service Manual
BL20
Model : BL20
Date: September, 2009 / Issue 1.0
Table Of Contents
1. INTRODUCTION ............................................... 5
4.16 Receiver Path ........................................................100
1.1 Purpose ......................................................................5
4.17 Headset path.........................................................103
1.2 Regulatory Information .................................................5
4.18 Speaker phone path ..............................................105

4.19 Main microphone ..................................................108
2. PERFORMANCE............................................... 7
4.20 Headset microphone ..............................................110
2.1 Product Name .............................................................7

2.2 Supporting Standard ....................................................7
5. Download ................................................... 112
2.3 Main Parts : GSM Solution ...........................................7
5.1 Introduction.............................................................112
2.4 HW Features ..............................................................8
5.2 Downloading Procedure ...........................................113
2.5 SW Features .............................................................10
5.3 Troubleshooting Download Errors ..............................129
2.6 HW SPEC. .................................................................12
5.4 Caution ...................................................................134
3. TECHNICAL BRIEF......................................... 16
6. Block Diagram ........................................... 135
3.1 GENERAL DESCRIPTION.............................................16
7. CIRCUIT DIAGRAM ...................................... 145
3.2 GSM MODE...............................................................17

3.3 UMTS MODE .............................................................21
3.4 OFF-CHIP RF COMPONENTS ......................................26
8. BGA Pin Map .............................................. 159

9. PCB LAYOUT ............................................... 165
3.5 OFF-CHIP COMPONENTS ...........................................29

3.6 General Description ...................................................33
3.7 Power management ..................................................45
10. Calibration................................................ 175

11. Test Mode ................................................. 178
3.8 SUB SYSTEM ............................................................50
4. TROUBLE SHOOTING ..................................... 57
12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................ 187
4.1 RF Component ..........................................................57

4.2 RF Path ....................................................................59
4.3 Trouble Shooting of GSM Part (GSM900/1800/1900) ..61
12.1 EXPLODED VIEW ...................................................187

12.2 Replacement Parts ................................................189
12.3 Accessory .............................................................213
4.4 Trouble Shooting of WCDMA part ................................69

4.5 Checking Bluetooth Block ..........................................75
4.6 Checking FM Radio Block ..........................................80
4.7 Power ON Troubleshooting .........................................83
4.8 Charger Troubleshooting ............................................86
4.9 USB Troubleshooting ..................................................87
4.10 USIM Detect Troubleshooting ....................................88
4.11 Camera Troubleshooting ..........................................91
4.12 Main side view LED Troubleshooting .........................93
4.13 Slide Key side view LED Troubleshooting ...................95
4.14 LCD Troubleshooting ................................................97
4.15 Vibrator Troubleshooting ...........................................99
Copyright 2009 LG Electronics. Inc. All right reserved.

Only for training and service purposes
-3-
LGE Internal Use Only
-4-

1. INTRODUCTION
BL20
1. INTRODUCTION
1.1.
Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2.
Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your companys employees, agents, subcontractors, or person working on your
companys behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common carrier telecommunication service of facilities accessed through or
connected to it. The manufacturer will not be responsible for any charges that result from such
unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

-5-
1. INTRODUCTION
BL20
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
information is ESD handling:
sign. Following
Service personnel should ground themselves by using a wrist strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
-6-

2. PERFORMANCE
2. PERFORMANCE
2.1 Product Name
BL20 : WCDMA900/2100+EGSM/DCS/PCS
(HSDPA 3.6Mbps / GPRS Class 10 / EDGE Class 10)
2.2 Supporting Standard

Item
Supporting
Standard
Frequency Range
Application
Standard
Feature
WCDMA(FDD1,8)/EGSM/DCS1800/PCS1900
seamless handover
Phase 2+(include AMR)
SIM Toolkit
: Class 1, 2, 3, C-E
WCDMA(FDD1) TX : 1920 1980 MHz
WCDMA(FDD1) RX : 2110 2170 MHz
WCDMA(FDD8) TX : 880 915 MHz
WCDMA(FDD8) RX : 925 960 MHz
EGSM TX : 880 915 MHz
EGSM RX : 925 960 MHz
DCS1800 TX
: 1710 1785 MHz
DCS1800 RX
: 1805 1880 MHz
PCS1900 TX
: 1850 1910 MHz
PCS1900 RX
: 1930 1990 MHz
WAP 2.0, JAVA 2.0
Comment
with
2.3 Main Parts : GSM Solution

Item
Digital Baseband
Analog Baseband
RF Chip
Part Name
QSC6270 : Qualcomm
QSC6270 : Qualcomm
QSC6270 : Qualcomm

-7-
Comment
2. PERFORMANCE
2.4 HW Features
Item
Form Factor
Battery
Size
Weight
Volume
PCB
Stand by time
Charging time
Talk time
RX sensitivity
TX output WCDMA/
power
GSM/
GPRS
EDGE
GPRS compatibility
EDGE compatibility
SIM card type
Display
Built-in Camera
Status Indicator
Keypad
ANT
System connector
Ear Phone Jack
PC synchronization
Memory
Speech coding
Data & Fax
Feature
Slider type
1) Capacity
Standard : Li-Ion, 900mAh
Comment
2) Packing Type : Soft Pack

Standard :
106.9 X 50.8 X 12.3mm
115g
TBD
LX-BUMP 2 10 Layers
2G Up to 300 hrs
3G Up to 300 hrs
4 hrs
2G Up to 180mins
3G Up to 110 mins
WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD8) : -103.7 dBm
EGSM
: -105 dBm
DCS 1800
: -105 dBm
PCS 1900
: -105 dBm
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM
: 33dBm
DCS 1800
: 30 dBm
PCS 1900
: 30 dBm
GSM 900
: 27 dBm
DCS 1800
: 26 dBm
PCS 1900
: 26 dBm
GPRS Class 10
EDGE Class 10
Plug-In SIM
3V /1.8V
2.4 TFT QVGA
5M CMOS Camera
Yes
Function Key : 4
Navigation Key
With Battery
@ Paging Period 5 (2G)

@ DRX 7 (3G)
@ Power Off / 900mAh
@ Power Level 5 (2G)
@ Tx = 12dBm (3G)
Class3(WCDMA)
Class4 (EGSM)
Class1 (PCS)
Class1 (DCS)
E2 (GSM900)
E2 (PCS)
E2 (DCS)
Navigation Key:
Cancel Key, Menu Key,
Send Key, END/PWR Key
:5
Main : Internal Fixed Type

5 Pin
3.5Phi, 4 Pole, Stereo
Yes
NAND Flash : 2Gbit
SDRAM : 1Gbit
FR, EFR, HR,AMR
Built in Data & Fax support
-8-

2. PERFORMANCE
Vibrator
Blue Tooth
MIDI(for Buzzer
Function)
Music Player
Video Player
Built in Vibrator
V2.1,A2DP
SW Decoded 64Poly
MP3/AAC/AAC+/WMA
MPEG4, H.263 40fps@QVGA
Camcorder
MPEG4, 15fps@QVGA
Voice Recording
Speaker Phone mode
Support
Travel Adapter
CDROM
Stereo Headset
Data Cable
T-Flash
(External Memory)
Yes
Yes
Yes
Yes
Yes
Yes
Yes

-9-
2. PERFORMANCE
2.5 SW Features
Item
RSSI
Battery Charging
Key Volume
Audio Volume
Time / Date Display
Multi-Language
Feature
0 ~ 7 Levels
0 ~ 3 Levels
0 ~ 7 Level
1 ~ 20 Level
Yes
Yes
Quick Access Mode
Dialing / Call Log / Contact / Menu /

Message / Camera / Favorite
Schedule / Phonebook / MEMO /
SMS / Download (Photo, file)
Yes (1~9)
Voice mail center -> 1 key
Yes
Yes
Name + 5 Numbers + 1 Memo + 2 e- Total 1000 Member
mail + 3 Group Select + Picture +
Ringtone + Anniversary day
Yes
Total Call DB Max 100
LDN (SIM) N/A
Yes
LDN (SIM) N/A
Yes
LDN (SIM) N/A
Name and Number
PC Sync
Speed Dial
Profile
CLIP / CLIR
Phone Book
Last Dial Number

Last Received
Number
Last Missed Number
Search by Number
/ Name
Group
Fixed Dial Number
Service Dial Number
Own Number
Voice Memo
Call Reminder
Network Selection
30
Yes
Yes
Yes
Yes
Yes
Automatic
Mute
Call Divert
Call Barring
Call Charge (AoC)
Call Duration
SMS (EMS)
Yes
Yes
Yes
Yes
Yes
1000
Comment
(English,German,Dutch,Czech,
Hungarian,Croatian,Polish,
Slovak,Turkish,French,
Italian,Spanish,Swedish,
Danish,Romanian,Greek,
Portuguese,Bulgarian,
TradChinese,SimpChinese,
Russian,Slovenian,Korean,Icela
ndic)
EMS : Release4
(Except Text align)
- 10 -

2. PERFORMANCE
SMS Over GPRS

EMS Melody / Picture
Send / Receive / Save
MMS MPEG4
Send / Receive / Save
Long Message
Yes
Yes
Receive only
Yes
Yes
MAX 1000 Characters
SMS 7pages
Cell Broadcast
Download
Game
Calendar
Memo
World Clock
Unit Convert
Yes
Over the WAP
Yes
Yes
100
Yes
Currency/Surface/Length/Volume/W
eight/Temperature/Velocity
Yes
Yes
Over WAP 2.0
Yes
Obigo
Over WAP
Stop Watch
Wall Paper
WAP Browser
Download Melody /
Wallpaper
SIM Lock
SIM Toolkit
MMS
EONS
CPHS
ENS
Camera
Yes
Yes
Yes
No
Yes
No
Yes
JAVA
Yes
Voice Dial
IrDa
Bluetooth
No
No
Yes
FM radio
Yes
GPRS
EDGE
Hold / Retrieve
Conference Call
DTMF
Memo pad
TTY
AMR
Yes
Yes
Yes
Yes
Yes
Yes
No
Yes
SyncML
IM
Email
Yes
Yes(Only Orange)
Yes

Operator Dependent
R99
Obigo +LG MMS Client
V4.2
5M AF /
Digital Zoom : x2
CLDC V1.1 / MIDP V2.1
Download Over WAP
BT 2.1+EDR
HFP/HSP/A2DP&AVRCP
/OPP/BPP/PBAP/SPP/DUN/FTP
Class 12
Class 12
Max. 6
ORANGE MSN
- 11 -
2. PERFORMANCE
2.6 HW SPEC.
1) GSM transceiver specification
Item
Phase Error
Frequency Error
EMC(Radiated
Spurious
Emission
Disturbance)
Transmitter Output power and Burst
Timing
Burst Timing
Spectrum due to modulation out to
less than 1800kHz offset
Spectrum due to modulation out to

larger than 1800kHz offset to the
edge of the transmit band
Spectrum due to switching transient

Reference Sensitivity TCH/FS
Usable receiver input level range
Intermodulation rejection Speech
channels
AM Suppression
GSM : -31dBm
- DCS : -29dBm
Timing Advance
Specification
Rms : 5
Peak : 20
GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
GSM/DCS : < -28dBm
GSM : 5dBm 33dBm 3dB
DCS/PCS : 0dBm 30dBm 3dB
<3.69us
200kHz : -36dBm
600kHz : -51dBm/-56dBm
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Class II(RBER) : -105dBm(2.439%)
0.012(-15 - -40dBm)
800kHz, 1600kHz
: -98dBm/-96dBm (2.439%)
-98dBm/-96dBm (2.439%)
0.5T
- 12 -

2. PERFORMANCE
2) WCDMA transmitter specification

Item
Transmit Frequency
Maximum Output Power
Frequency Error
Open Loop Power Control
Minimum Transmit Power
Occupied Bandwidth
Adjacent Channel Leakage
Power Ratio (ACLR)
Spurious Emissions
|f-fc| > 12.5 MHz
Transmit Intermodulation
Error Vector Magnitude
Peak Code Domain Error
Specification
Band1 : 1920 MHz ~ 1980 MHz
Band8 : 880MHz~915MHz
+24 dBm / 3.84 MHz, +1 / -3 dB
within 0.1 PPM
Normal Conditions : within 9 dB,
Extreme Conditions : within 12 dB
< -50 dBm /3.84 MHz
< 5 MHz at 3.84 Mcps (99% of power)
> 33 dB @ 5 MHz,
> 43 dB @ 10 MHz
< -36 dBm / 1 kHz RW @ 9 kHz f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz f 894 MHz
< -67 dBm / 100 kHz RW @ 925 MHz f 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz f 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
< -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBc
< 17.5 %, when Pout -20 dBm
< -15 dB at Pout t -20 dBm

- 13 -
2. PERFORMANCE
3) WCDMA receiver specification

Item
Receive Frequency
Reference Sensitivity Level
Maximum Input Level
Adjacent Channel Selectivity
(ACS)
Blocking Characteristic
Spurious Response
Intermodulation
Spurious Emissions
Inner Loop Power Control

In Uplink
Specification
Band1 : 2110 ~ 2170 MHz
Band8 : 925~960MHz
Band1 : BER < 0.001 when or = -106.7 dBm / 3.84 MHz
Band8 : BER < 0.001 when or = -103.7 dBm / 3.84 MHz
BER < 0.001 when or = -25 dBm / 3.84 MHz
ACS > 33 dB where BER < 0.001 when
or = -92.7 dBm / 3.84 MHz
& Ioac = 52 dBm / 3.84 MHz @ 5 MHz
BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = 10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = 15 MHz
BER < 0.001 when or = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
BER < 0.001 when or= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = 10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = 20 MHz
< -57 dBm / 100 kHz BW @ 9 kHz f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz f 12.75 GHz
Adjust output(TPC command)
cmd
1dB
2dB
3dB
+1
+0.5/1.5
+1/3
+1.5/4
0
-0.5/+0.5 -0.5/+0.5
-0.5/+0.5
-1
-0.5/-1.5
-1/-3
-1.5/-4
group(10equal command group)
+1
+8/+12
+16/+24
- 14 -

2. PERFORMANCE
4) HSDPA transmitter specification

Item
Transmit Frequency
Maximum Output Power
Specification
Band1 : 1920 MHz ~ 1980 MHz
Band8 : 880MHz~915 MHz
Sub-Test
1=1/15,
2=12/15
3=13/15 4=15/8
5=15/7
6=15/0
21~25dBm / 3.84 MHz

20~25dBm / 3.84 MHz
19~25dBm / 3.84 MHz
Sub-test
Power
Power Power step slot
in table
step size,
step
boundary
C.10.1.4
P [dB]
HS-DPCCH
1
2
3
Start of
Ack/Nack
Start of CQI
Middle of CQI
Transmitter power
step tolerance [dB]
+/- 2.3
1
0
+/- 0.6
+/- 0.6
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Spectrum Emission Mask
Adjacent Channel Leakage

Power Ratio (ACLR)
Error Vector Magnitude
Frequency offset
Measurement
Minimum requirement
Bandwidth
from carrier f
2.5 ~ 3.5 MHz
30 kHz
-35-15(f-2.5)dBc
3.5 ~ 7.5 MHz
1 MHz
-35-1(f-3.5)dBc
7.5 ~ 8.5 MHz
1 MHz
-35-10(f-7.5)dBc
8.5 ~ 12.5 MHz
-49dBc
1 MHz
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ 5 MHz
> 43 dB @ 10 MHz
< 17.5 %, when Pout -20 dBm
5) HSDPA receiver specification

Item
Receive Frequency
Maximum Input Level
(BLER or R), 16QAM Only
Specification
Band1 : 2110 ~ 2170 MHz
Band8 : 925 ~ 960Hz
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10%

or R >= 700kbps
- 15 -
3. Technical Brief
3. TECHNICAL BRIEF
3.1 GENERAL DESCRIPTION
The RF platform of BL20 supports two different communication modes (WCDMA/GSM modes) including five
communication bands (W2100/W850/GSM900/GSM1800/GSM190). The all the RF blocks can be divided into
three main parts, which are a WCDMA part, a GSM, and an antenna switch Mode.
The simplifed block diagram is shown in Figure 1.1.1i
[Figure 1-1] Block diagram of RF part
- 16 -

3. Technical Brief
3.2 GSM MODE

The EDGE/GPRS/GSM transceiver use a digital interface that is shared between receive and transmit data.
The receive interface is based on I and Q data and the transmitter interface is based on envelop and
frequency data.
The quad band EDGE/GSM/GPRS transceiver has the following general features:
Power class
GMSK low bands: Class 4 (33 dBm)
GMSK high bands: Class 1 (30 dBm)
8PSK low bands: Class E2 (27 dBm)
8PSK high bands: Class E2 (26 dBm)
Multi slot class 12 (4+4=5)
Dual Transfer Mode (DTM) class 9 (3+2=5)
Zero-IF receiver
-Polar modulation transmitter
3.2.1 GSM RECEIVER

There are two recommended GSM receiver path configurations; bothare shown in Figure 1.3.2.1. The
configuration shown on top allows the GSM 850 and GSM 1900 bands to share the UMTS 850 and UMTS 1900
paths for US applications and uses four LNA inputs to support quad-band GSM operation.
The lower example uses two LNAsfor quad-band GSM operation (one low band and one high
band), with two-way SAW filters between the antenna switch and the QSC inputs for each
band type.

- 17 -
3. Technical Brief
[Figure 1-2] QSC GSM receiver signal paths functional diagram
- 18 -

3. Technical Brief
3.2.2 GSM TRANSMITTER

The QSC62x0 device supports quad-band GSM transmissions with two separate dual-band
driver amplifer outputs; in fact, most Tx active circuits are contained within the device.
Both GSM transmit paths (Figure 1.3.1.1) begin with a single, shared analog baseband
signal from the devices baseband circuits - the same interface and baseband circuits used
by the UMTS transmitters. The GSM transmitters use the same quadrature upconvertersas well
-
one for low band signals and one for high band with just one active at a time. The
transmiter LO signals are generated by circuits described.

in next section and delivered to the upconvertercircuits at the correct frequency, with
the proper phase relationship, and with an adequate drive level.
The SPDT switches at each driver amplifier input allow selectionof the output signal:
either the actual GSM signal from the upconverteror a test signal generated by the Tx LO
synthesizer. The Tx output chain is functionally identical for both the low band and the
high band: the power amplifer is driven by the QSC device through a matching network
and a resistive attenuator; the PA output is routed to the antenna switch module whose
output is connected to the antenna. In addition to the through signal path, the QSC device
also provides the PA ramp control signal that ensures smooth transitions while the
transmitter is turned on and off for GSMsburst transmissions.
The ramp signal is generated by one of the baseband circuits Tx DACs. A switch after
the baseband amplifer selects whether the DAC output signal is routed to GSM PA
module for ramping the PA up or down, or to the transmitter signal path fo
transmission.

- 19 -
3. Technical Brief
[Figure 1.2.2] QSC GSM transmitter signal paths functional diagram
- 20 -

3. Technical Brief
3.3
UMTS MODE
The W-CDMA transceiver uses differential analog in-phase and quadrature-phase interfaces,
That is an IQ-interface, both in the receiver and transmitter information path..
The transceiver has the following general features:
. Power class : Power class 3 (+24dBm) in Band II and V
. Zero-IF Receiver.NoIF filter needed
. Direct IQ modulation transmitter
[Figure 1.3.1] WCDMA RF structure

- 21 -
3. Technical Brief
3.3.1 UMTS RECEIVER

The antenna collects the base station forward-link signal and radiates the phones reverse-link signal. In the
example of a multiband, multimode phone (Figure 1.2.2.1), a switch routes the antenna signals to one of the
three UMTS Rx/Tx paths, each begining with its own band-specific duplexer that separates that bands receive
and transmit paths
[Figure 1.3.2] WCDMA Receiver schematic
Each UMTS duplexer provides a differential output signal that is comlatible with its QSC LNA input. The
duplexer-to-LNA interface requires a differential matching network (MN) thatoptimizes the power transfer
into the LNA. Although there are three UMTS LNAs, only one is active at a time. The active gain-stepped LNA
output drives a shared quadrature
Downconverter directly an off-chip inter-stage filter is not required. The elimination of this filter is achieved
by a combination of factors:
-New on-chip QSC processing
-Higher performance achieved by the differential duplexer-to-LNA interface
-Greater duplexer suppression of Tx leakage
The downconvertersRF circuitry includes another gain-stepped amplifier that supplements the LNA gain
steps to further extend the receiver dynamic range. The downconvertertranslates the active LNAsRF signal
directly to baseband, producing two analog outputs: in-phase (I) and quadrature (Q). The UMTS baseband
signals are routed to lowpassfilters whose passbandand stopbandcharacteristics are optimized for the active
WCDMA waveform. Both filter outputs are buffered to drive their analog-to-digital converters for digitization.
The digital baseband outputs are routed to QSC baseband circuits for further processing.
- 22 -

3. Technical Brief
3.3.2 UMTS TRANSMITTER

The QSC62x0 device support tri-band UMTS transmissions with three separate driver amplifier outputs; in
fact, most Tx active circuits are contained within the device. All three UMTS transmit paths (Figure 1.2.1.1)
begin with a single,shared analog baseband signal from the devices baseband circuits. The baseband signal
is composed of two differential lines, one in-phase component and one quadrature-phase component. Each
component is lowpassfiltered and amplified to levels sufficient for driving the quadrature upconverters.
There are two upconvertersone for low-band signals and one for high band but only one upconverteris
active at a time.
[Figure 1.3.3] WCDMA Transceiver Architecture
Each UMTS duplexer provides a differential output signal that is compatible with its QSC LNA input. The
duplexer-to-LNA interface requires a differential matching network (MN) thatoptimizes the power transfer
into the LNA. Although there are three UMTS LNAs, only one is active at a time. The active gain-stepped LNA
output drives a shared quadrature downconverterdirectly - an off-chip inter-stage filter is not required. The
elimination of this filter is achieved by a combination of factors:
-New on-chip QSC processing
-Higher performance achieved by the differential duplexer-to-LNA interface
-Greater duplexer suppression of Tx leakage. The downconvertersRF circuitry includes another gain-stepped
amplifier that supplements the LNA gain steps to further extend the receiver dynamic range.
The downconvertertranslates the active LNAsRF signal directly to baseband, producing two analog outputs:
in-phase (I) and quadrature (Q).

- 23 -
3. Technical Brief
The UMTS baseband signals are routed to lowpassfilters whose passbandand stopbandcharacteristics are
optimized for the active WCDMA waveform. Both filter outputs are buffered to drive their analog-to-digital
converters for digitization. The digital baseband outputs are routed to QSC baseband circuits for further
processing.
z
Shared UMTS/GSM configuration (four GSM LNAs)
In this configuration, the GSM 850 receive path shares the UMTS 850 receiver front-end path (including
LNA).Begining at the antenna switch output, the GSM signal is routedthrough the UMTS850 duplexer to the
shared LNA input at pins L22 and K2. Likewise, the GSM 1900 receive path shares the UMTS 190front-end,
including pins J23 and H23. The GSM 900 and GSM 180bands have dedicated receive paths from the antenna
switch outputs to the QSC LNA inputs.Each band has its own band-select filter that drives its LNA input. All
four GSM bands include input filtering: the 850 and 1900 bands share the UMTS duplexer filtering, while the
900 and 1800 bands have dedicated bandpassfilters. The filter functions suppress out-of-band received
signals and the handsets GSM transmitter leakage. Transmit power suppression must be adequate to avoid
overdrivingthe GSM Rx chain. Like the UMTS paths,
the GSM paths use a differential configuration into their LNAs, and thus equiredifferential matching networks.
The internal GSM receivers are functionally identical to the UMTS receivers: although there are multiple GSM
LNAs, only one is active at a time. The active gain-stepped LNA output drives a shared quadrature
downconverterdirectly
an off-chip inter-stage filter is not required. The elimination of this filter is achieved by a combination of
factors:
New on-chip QSC processing
Higher performance achieved by the differential duplexer-to-LNA interface
Greater duplexer suppression of Tx leakage
The downconverters RF circuitry includes another gain-stepped amplifier that supplements the LNA gain
step to further extend the receiver dynamic range. The downconvertertranslates the active LNAsRF signal
directly to baseband, producing two analog outputs: in-phase (I) and quadrature (Q). The GSM baseband
signals drive lowpass filters whose passbandand stopbandcharacteristics are optimized for the active GSM
waveform. Both filter outputs are buffered to drive their analog-to-digital converters for digitization. The
digital baseband outputs are routed to QSC baseband circuits for further processing.The Rx LO signal is
delivered to the downconvertercircuits from the LO generation and distribution circuits as described in next
section.
- 24 -

3. Technical Brief
Dedicated GSM configuration (two GSM LNAs)
In this configuration, the GSM 850 and GSM 1900 bands do not pass through the UMTS duplexers.
Instead, the two GSM LNA inputs are shared: the GSM 850 and GSM 900 bands share the low-band GSM LNA,
and the GSM 180and GSM 190bands share the high-band LNA. Four switch module outputs are required,
each driving its own GSM Rx path. A two-way SAW filter takes the two low-band (or high-band) single-ended
inputs from the antenna switch and provides one filtered, differential output that drives the appropriate QSC
LNA input.
Beyond the LNA inputs, this GSM receiver configuration is identical to the paths described earlier for the
shared UMTS/GSM configuration.
3.3.3. Rx LO circuits
The QSC62x0 device integrates all of the frequency synthesizer functions that generate the UMTS and GSM
receive LO signals (UHF local oscillator, PLL circuits, and loop filter), plus the distribution circuits that deliver
the quadrature LO signals to the two downconverters.
The buffered 19.2 MHz TCXO or XO signal provides the synthesizerinput (REF), the frequency refrence to
which the PLL is phase and frequency locked. The refernce is divided to create a fixed frequency input to the
phase detector, FR. The other phase detector input (FV) varies as the loop acquires a lock and is generated by
dividing the local oscillator output frequency using the feedback paths counter. The closed-lop wilforce FV to
equal FR when locked.
If the loop is not locked, the error between FV and FR will create an error signal. This error signal is filtered by
the loop filter and applied to the local oscillator, tuning the output frequency so that the error is decreased.
Ultimately the loop forces the error to approach zero and the PLL is phase and frequency locked.

- 25 -
3. Technical Brief
3.4
OFF-CHIP RF COMPONENTS
3.4.1 LMSP43QL-873 (FL100: FEM)

Low-loss SAW frontend module for mobile telephone systems e
Covering GSM850, GSM900, GSM1800, GSM1900, WCDMA 2100bands
Integration of TX low pass filters, switches and decoder
Integration of GSM 850, EGSM, PCN and PCS RX SAWs
Balanced outputs of all RX ports, diplexed for GSM 850/ EGSMa
Integration of ESD protection at Ant port to 8kV
acc. IEC-61000-4-2 (contact discharge)
[Figure 1.4.1] Block diagram of FEM
- 26 -

3. Technical Brief
3.4.2 W-CDMA Power Amplifier (U102/104:

ACPM7383/7311) and Coupler(U101/103: LDC151G8620Q-359/LDC15874M19Q-360)
The UMTS PA output power is monitored by external power detector circuits(Coupler : and HDET function in
QSC6270). This detector voltage can be used for transmitter calibration and monitor to meet RF system
specification.
PWR_DET
6dB Atten
PA_R1
PA_R0
WCDMA_PA_ON0
pF, when W1900 enabled

L127= 1nH, when W1900 enabled
PA_R0
PA_R1
WCDMA_PA_ON1
C130= 100pF, when W850 enabled

L110= DNI, when W850 enabled
[Figure 1.4.2] W-CDMA PAM, HDET, and Duplexer circuits.

- 27 -
3. Technical Brief
3.4.3 GSM850/EGSM/DCS/PCS Dual band Transmit Power Amplifier

(U101: TQM7M5012)
The dual band PA is operating to transmit for low band (GSM-850, GSM-900) and high band (GSM-1800,
GSM1900). Operating mode is selected and controlled by the QSC6270.(GSM_PA_BAND)
TX_GSM_HB
3dB
GSM_PA_BAND
TX_GSM_LB
DNI
GSM_PA_EN
GSM TX
GSM_PA_RAMP
B9442
EGSM Tx
3dB
SFSY0037601
B9442
[Figure 1.4.3] GSM900 /DCS/PCS TX Power Amplifier path
- 28 -

3. Technical Brief
BL20
3.5
OFF-CHIP COMPONENTS
3.5.1 Bluetooth (BCM2070)
Bluetooth block of BL20 consists of a BCM2070 chip-set, an external crystal oscillator(26MHz), and a
Bluetooth chip antenna (2.4GHz). QSC6270, which is main HW solution of BL20 Model, doesnt include BT
baseband core. Instead, Bluetooth chipset, BCM2070, contains stand-alone baseband processor (V2.1+EDR)
as well as BT RF block. An external crystal oscillator (26MHz) is used to provide reference frequency to
BCM2070.
Figure 1 shows the Bluetooth system architecture in the BL20.
[Figure 1.5] Bluetooth system architecture

- 29 -
3. Technical Brief
BL20
Table 1. Bluetooth Connection(GPIO) with QSC6270
- 30 -

3. Technical Brief
BL20
3.5.2 FM Receiver (TEA5991)
The TEA5991 is a single chip FM stereo radio with RDS and RBDS decoder. The radio can be connected to a
headphone antenna and can tune from 70-108 MHz to cover the European, US, Chinese and Japanese FM
band. The radio delivers stereo audio output to an external amplifier. The radio can be controlled with a high
level command based interface through a I2C or SPI-bus.
[Figure3.xx.x.x] shows the FM Radio system architecture in the BL20.
5pin MicroUSB Connector
HP_EAR_R
FM_ANT
FM
TEA5991
HP_EAR_L
FM_R
FM_L
FM_I2C_SDA
FM_I2C_SDL
QSC6270
HP_R
AUDIO
HP_L
SUBSYSTEM
[Figure3.xx.x.x]
Pin Descriptions
[Figure3.xx.x.x]

- 31 -
3. Technical Brief
BL20
[Table 3.15-1] PIN assign
SYMBOL
HVQFN
WLCSP
AGND
F1
Analog ground
RFI
E1
RF input
RFGND
D1
RF ground
NC
BUSSEL2
A1
Bus Selection pin 2
BUSSEL1
C1
Bus Selection pin 1
RST
A2
Reset, used for operating mode change
SEN
B1
Chip Select for SPI bus
SCL
A3
Serial Bus Clock
SDA
10
A4
Serial Bus Data
FREF
11
A5
Reference frequency (32.768 kHz)
VREFDIG
12
A6
Reference voltage for digital I/Os
VDD
13
B6
Digital supply voltage
DGND
14
C6
Digital ground
AUDOR
15
D6
Audio output signal right
AUDOL
16
E6
Audio output signal left
NC
17
VCC
18
F6
Analog supply voltage
GPIO2
19
F5
General Purpose I/O 2; Dataout for 4-wire SPI-bus
DESCRIPTION
not connected
Not connected
- 32 -

3. Technical Brief
3. Base Band Technical Description

3.6 General Description
QSC6270 has all eight major functional blocks as like Figure 2.1
Figure 2.1 QSC6270 Base band block

- 33 -
3. Technical Brief
3.6.1 Processor
The QSC6270 device integrates multiple processors on-chip: one ARM microprocessor and two
DSP processors. Each processor is part of a functional subsystem:
The micro subsystem includes the ARM926EJ-S microprocessor.
The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).
The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).
Figure 2.1.1 Processors and bus architecture
- 34 -

3. Technical Brief
3.6.2 Memory support (and LCD interface)

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new
mobile DDR SDRAM memories with its higher bandwidth and ability to run at high clock
frequencies. This interface supports the high-bandwidth, high-density, and low-latency
requirements of the QSCs advanced on-chip capabilities such as the ARM9 processor, highperformance
graphics, and video applications.
EBI2 is the slower speed interface intended to support memory devices such as NAND flash and
asynchronous SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or
broadcast reception (QSC6270 only). In addition, EBI2 is required to support a synchronous-burst
AAD NOR flash to enable a NOR/DDR SDRAM memory configuration because the simultaneous
mode (NOR, SDRAM) is not supported on the EBI1 bus.
The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory
use burst techniques of four or eight 32-bit words when the memory region is declared to be
cacheable/bufferable. To take advantage of this QSC higher performance feature, data from
memories must satisfy the requirements for these burst accesses.
EBI1
EBI2
SDRAM_CKE
DDR
SDRAM
512Mbit
SDRAM_CLK_P
EBI2_CS1_N
SDRAM_CLK_N
EBI2_WE_N
SDRAM_CS_N
EB2_OE_N
SDRAM_WE_N
EBI2_ALE
SDRAM_RAS_N
EBI2_CLE
SDRAM_CAS_N
RESOUT_N
NAND E2PROM
1Gbit
NAND_READY
SDRAM_DQM[0:1]
QSC6270
EBI2_DATA[0:15]
SDRAM_DQS[0:1]
ADDRESS[0:31]
DATA[0:15]
MICROSD_CLK
USIM_RST
External Memory (MICROSD card)
MICROSD_CMD
USIM_CLK
MICROSD_DETECT
USIM
USIM_DATA
MICROSD_DATA[0:3]
Figure 2.1.2.1 The memory control blocks of BL20

- 35 -
3. Technical Brief
LDO_LCD_2.8V
LDO_LCD_1.8V
LCD_RST
EBI2_WE_N
LCD_ADS
LCD_CS_N
EBI2_DATA[15:0]
QVGA Main LCD

(2.4`, 240x320)
LCD_IF(2:1)
QSC6270
WLED_PWR
Figure 2.1.2.2 The LCD interfaces of BL20
- 36 -

3. Technical Brief
3.6.3 Connectivity
QSC6270 has connectivity features as below
USB-OTG; USB LS, FS, and HS (2.0 compliant)
I2C compatible for peripheral controls (1.8 V)
UART: up to 4 Mbps
Bluetooth 2.0 support via external SoC
WLAN via external device (SDIO)
NFC via external module (I2C)
FM radio via external module (I2C)
USIM, SIM, and USB-UICC support; 1.8 and 3 V
Keypad interface
SPI (master only) for peripheral support
Two secure digital controllers WLAN and secure digital (SD) cards
QSC6270
Figure 2.1.3 The connectivity of BL20

- 37 -
3. Technical Brief
3.64 GPIOs
QSC6270 has 78 configurable I/O pins
LINMOT_EN
BT_RESET_N
MSM_WAKES_BT
BT_WAKES_MSM
MUSIM_DP
MUSIM_DM
MAIN_TOUCH_I2C_SCL
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_INT
SIDE_TOUCH_I2C_SCL
SIDE_TOUCH_I2C_SDA
SIDE_TOUCH_INT
TRK_LO_ADJ
CAM_I2C_SCL
PA_R0
PA_R1
ANT_SEL(0)
ANT_SEL(1)
ANT_SEL(2)
ANT_SEL(3)
FLASH_SET
FLASH_EN
FLASH_INH
VGA_CAM_PWDN
MEGA_CAM_PWDN
LCD_RESET_N
LCD_MAKER_ID
LCD_BL_CTRL
MUIC_FM_AUDIO_I2C_SCL
MUIC_FM_AUDIO_I2C_SDA
NAND_READY
USIM_DATA
USIM_CLK
USIM_RESET_N
VGA_CAM_RESET_N
MEGA_CAM_PWR_EN
LINMOT_PWM
LCD_IF_MODE2
CAM_I2C_SDA
CAM_MCLK
CAM_DATA[9]
CAM_DATA[8]
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
MEGA_CAM_RESET_N
CAM_VSYNC
CAM_HSYNC
CAM_PCLK
LCD_VSYNC_OUT
BT_PCM_CLK
BT_PCM_OUT
BT_PCM_IN
BT_PCM_SYNC
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
MUIC_INT
BT_REG_ON
UART1_RTS_N
UART1_CTS_N
MICROSD_CLK
MICROSD_DATA[3]
MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
MICROSD_CMD
SLIDE_DETECT
Figure 2.1.4 GPIOs of BL20
- 38 -

3. Technical Brief
3.6.5 Air interfaces

The supported air-interface standards and features include: (See the RF technical description)
UMTS/WCDMA/GSM/GPRS/EDGE Specification Release 99 (3GPP R99)
GSM/GPRS/EDGE Specification Release 4 (3GPP R4)
UMTS/WCDMA Specification Release 5 (3GPP R5, QSC6270 only)
HSDPA and equalizer; 3.6 Mbps
Enhanced GPS position location using gpsOne (with RGR6240 IC, only QSC6270)
Integrated gpsOne functionality, featuring enhancements by SnapTrack, Inc., to enable a
wide variety of location-based services and applications, including points of interest,
personal navigation, and friend finder
Simultaneous-GPS (processes GPS using dedicated circuitry while voice and/or data
signals continue to be processed separately)
1024x searcher, direct facility termination (DFT) accelerator, off-chip RAM for measured
data storage
3.6.6 Internal base band functions

Several baseband circuits within the QSC6270 device provide functions that are necessary only to
make the device operate properly these functions are not generally used directly by other
handset circuits and functions.
PLLs and clock generation
Modes and resets
Security
Qfuse
JTAG/ETM
The clock block includes two PLLs, all phase-locked to the TCXO signal. These PLLs generate
several different stable, low-jitter clock signals that are distributed throughout the QSC device and
to external components as needed.
All the required WCDMA, GSM, GPS(only QSC6270), ARM, QDSP, and most peripheral clocks are derived in
some way from the TCXO (or XO) source for their operating modes, plus the 32.768 kHz
oscillator for their sleep modes
Figure 2.1.6 Clock block basic architecture of QSC6270

- 39 -
3. Technical Brief
3.6.7 Multimedia
Multimedia topics are as below in QSC6270, including:
Camera interface and video front-end
Mobile display processor
Additional multimedia support: video, audio, graphics, and messaging
3.6.7.1 Camera interface and video front-end

The camera interface (CAMIF) connects the QSC62x0 device directly to a camera sensor. Typical
applications include Qcamera, Qcamcorder, and Qvideophone. The CAMIF delivers the raw
10-bit Bayer pattern data (preferred) to the video front-end (VFE) that performs the required image
processing (RGB-triplet generation, color-space conversion, auto-white balance, auto exposure,
gamma correction, etc.) and prepares the image for capture or transmission. The QSC device also
supports a YUV 4:2:2 input from the sensor (8-bit, 2:1 MUX YUV or CCIR656 YUV).
The video capabilities of the two QSC devices varies slightly, with the QSC6270 providing higher
performance than the QSC6270 device greater resolution, higher capture and streaming rates,
etc.
- 40 -

3. Technical Brief
3.6.7.2 Mobile display processor

The MDP is a hardware accelerator primarily responsible for transferring an updated image from
the QSC memory subsystem to the LCD module. The transferring of an updated image is an
operation that is shared between software, video processing, and graphics processing, so a
common block helps to reduce redundant circuitry. The MDP is designed with the assumption that
the LCD panel has an embedded LCD controller and a frame buffer. The image transfer is then the
copying of the image from the QSC memory system to the frame buffer within the LCD module.
While the MDP is transferring an image to the LCD module, it can perform a final set of
operations to the image. The set of operations that the MDP can perform has been chosen to
maximize the efficiency of the QSC memory subsystems, typically removing two or more copy
operations of the image to and from memory.
The MDP reduces redundant circuitry and offloads the ARM and aDSP from memory-transfer
operations and a certain set of graphics and video operations
Figure 2.1.7.2.1 MDP-to-LCD interface functional block diagram

- 41 -
3. Technical Brief
SLIDE_KEY_LED_N
LCD_IF_MODE2
LCD_VSYNC_OUT
EBI2_OE_N
FLT_LCD_WE_N
FLT_LCD_ADS
FLT_LCD_CS_N
FLT_LCD_DATA[15]
FLT_LCD_DATA[14]
FLT_LCD_DATA[13]
FLT_LCD_DATA[12]
FLT_LCD_DATA[11]
FLT_LCD_DATA[10]
FLT_LCD_DATA[9]
FLT_LCD_DATA[8]
FLT_LCD_DATA[7]
FLT_LCD_DATA[6]
FLT_LCD_DATA[5]
FLT_LCD_DATA[4]
FLT_LCD_DATA[3]
FLT_LCD_DATA[2]
FLT_LCD_DATA[1]
FLT_LCD_DATA[0]
MAIN_TOUCH_INT
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
LCD_MAKER_ID
LCD_RESET_N
LCD_BL_CTRL
Figure 2.1.7.2.2 The LCD interface of BL20
- 42 -

3. Technical Brief
3.6.8 UART
One universal asynchronous receiver transmitter (UART) port that supports
low-speed, full-speed, and high-speed modes
Serial data port communications that conform to the RS-232 interface protocol
Used for data transport during Bluetooth operation (BTS402x SoC required)
Other possible uses:
Test and debug
External keypad
Ringer
Load/upgrade system software
Separate FIFOs for Rx and Tx
Supporting circuits include:
Interrupt control
Clock source
Bit-rate generator (BRG)
Microprocessor interface
Flow control is not available on UART2 (behind USIM)
3.6.9 USB
Each USB link has a host and a peripheral; the host is responsible for initiating and controlling bus traffic
The USB specification requires PCs to act as hosts, and other devices such as printers, keyboards, mice, etc., to
act as peripherals
USB 2.0 implementation defines three modes
- Low-speed (LS): 1.5 Mbps
- Full-speed (FS): 12 Mbps
- High-speed (HS): 480 Mbps
The QSC62x0 is compliant with the USB 2.0 specification
- All three modes are supported when acting as a host
- FS and HS are supported when acting as a peripheral
The QSC62x0 has two USB controllers
- Primary USB controller
- Secondary USB controller
The primary USB controller is supplemented by an integrated physical layer (PHY)
3.6.10 HKADC
The HKADC includes an analog multiplexer that selects an input for the sample and
hold circuit. One of three inputs can be selected:
HKAIN1, pin R22 an external connection that is available as a general-purpose input,
though it is often used to monitor the power amplifier(s) temperature.
An on-chip connection to the power management circuits analog multiplexer output. This
allows monitoring of:
-. Key power supply nodes such as VBAT, VCHG, etc.
-. Multipurpose pins (when configured as analog inputs)
-. A few on-chip parameters such as the die temperature or VREF

- 43 -
3. Technical Brief
QSC6270HKADC Block diagram
- 44 -

3. Technical Brief
3.7 Power management

3.7.1 Input power management
Valid external supply attachment and removal detection
Unregulated (closed-loop) external charger supply as input power source
Integrated PFET charging pass transistor; eliminated sense resistor
Support for lithium-ion and lithium-ion polymer main batteries; nickel-based batteries are not supported
Trickle, constant current, constant voltage, and pulse charging of the main battery
Autonomous charging option driven by an on-chip state machine without software intervention
Software-controlled charging option backwards-compatible with previous QSC and PM products
Coin-cell battery (including charging)
Battery-voltage detectors with programmable thresholds
VDD collapse protection
Charger-current regulation and real-time monitoring for overcurrent protection
Charger-transistor protection by thermal control
Control drivers for the internal charging PFET and external battery PFET
Voltage, current, and thermal control loops
Automated recovery from sudden momentary power loss (requires external32.768 kHz crystal)
Figure 2.2.1 Input circuits schematic diagram

- 45 -
3. Technical Brief
3.7.2 Output voltage regulation

The QSC62x0 device includes all the regulated voltages needed for most low-cost wireless
handset applications (and many other applications). Independent regulated power sources are
required for various electronic functions to avoid signal corruption between diverse circuits,
support power-management sequencing, and meet different voltage-level requirements. Sixteen
voltage regulators are provided all programmable, all derived from a common bandgap reference circuit.
Three major types of voltage regulator circuits are on-chip:
Three positive voltage switched-mode power supply (SMPS) circuits
- One boost converter (rated for 600 mA)
- Three buck converters (rated for 500 mA each)
Thirteen positive voltage linear regulators
- Four rated for 300 mA
- Six rated for 150 mA
- Three rated for 50 mA
One negative voltage charge pump rated for 200 mA, referred to as a negative charge pump(NCP)
Each regulator has two logic-OR input bits; a logic high at either input enables that regulator:
A master bit that enables all regulators according to their default condition
A dedicated bit that enables only that regulator
The master enable reduces the number of write cycles needed when switching between the phones
sleep and active modes.
Additional comments that apply to regulator functions:
If a regulators default condition is on, that regulator will power on automatically at QSC startup.
The MSMP regulator must be on to allow internal communications between major functional blocks.
Each regulator and SMPS can provide more than its rated output current, though some
performance characteristics might be degraded.
All regulated output voltages are programmable.
All regulators can be set to a low-power mode except the VREG_USB_3P3 and VREG_NCP circuits
- 46 -

3. Technical Brief
Table 2.2.2 Voltage regulator summary

1. All regulator names are based on their intended use, though some may be used to power alternate functions.
For example, the USIM regulator is intended to power an external SIM card but may be used to power other circu
(or not used at all).
2. Each current listed in this table is its regulator's rated value the current at which the regulator meets all its
performance specifications. Higher currents are allowed, but higher input voltages may be required and some
performance characteristics may become degraded. See the appropriate regulator sections for details.
3. VREG_MSMP powers key internal circuits and should be kept on at its default voltage setting.
4. All regulators have default output voltage settings, even if they default to an off condition.

- 47 -
3. Technical Brief
3.7.3 Charging control

A control driver for the charging pass transistor is included within the QSC device; the driver output is applied
internally to an on-chip P-channel MOSFET. The QSC62x0 device uses closed-loop control of the charging pass
transistor to regulate the VDD voltage during normal operation, the detected current (IDET) during fast (constant
current) charging if needed, or the battery voltage (VBAT) during the final stages of charging. The resistance of the
charging pass transistor can also be increased for overcurrent protection.
See Section 13.9 for more details about VDD and VBAT regulation, and Section 13.10 for current regulation,
monitoring, and overcurrent protection.
Controlling the charging pass transistor also allows for overheating protection: the QSC device monitors the charging
pass transistor temperature and reduces its through current if the temperature exceeds an acceptable limit.
Handset designers should consider the following points to help reduce charging pass transistor power dissipation
and heating:
Minimize the voltage across the charging pass transistor by using an external supply voltage that is only slightly
above the top-off voltage of the Li-ion battery.
Design the charger voltage compliance so its output voltage collapses during fast charging, thereby
reducing the voltage across the charging pass transistor.
If thermal limiting occurs and the VDD voltage collapses momentarily below VBAT, the QSC620x device will close the
battery MOSFET to prevent a phone shutdown
Trickle Charging
Trickle charging of the main battery, powered from VDD, is provided by the QSC62x0 device. This mode is used to
raise a severely depleted batterys voltage to a level sufficient to begin fast charging.
Software sets the desired trickle charging current. Valid settings are from 10 to 160 mA, in 10 mA increments.
- 48 -

3. Technical Brief
Constant Current Charging

The QSC62x0 device supports constant current charging of the main battery by closing the battery MOSFET
(connecting the battery to VDD), and closed-loop controlling the charging pass transistor. If current limiting is not
implemented by the external supply, the closed-loop charging pass transistor control regulates the total current
(handset electronics (plus charging current) to match the programmed value (IMAXSEL). Software monitors the
charging process as described earlier and continues the constant current mode until the battery reaches its target
voltage.
Charging of Li-ion batteries require further charging using constant voltage or pulse techniques for top-off and
maintenance.
Constant Voltage Charging
Once constant current charging of a Li-ion battery is finished, the charging continues using either constant
voltage or pulse techniques. Discussion of constant voltage charging is presented here; pulse charging is covered
in the next subsection.
The end of constant voltage charging is typically detected in one of two ways:
1. Monitor the charging current using the HKADC and terminate charging when it decreases to a predetermined
threshold (such as 10% of the full charging current).
2. Allow constant voltage operation for a predetermined duration beyond crossing the VBATDET threshold (on
the order of one-half to two hours).
In either case, do not allow charging to continue indefinitely charging too long will damage the battery.
Consult battery manufacturers for specific recommendations.
If option 1 is implemented, the charging current is measured during the constant-current charging mode, then is
monitored regularly during constant voltage charging until the terminating condition is realized. The HKADC
takes two readings for each charging current measurement:
1. With the battery MOSFET closed (handset plus charging current)
2. With the battery MOSFET opened (handset current only)
The difference between these two current measurements is the charging current. Regardless of the technique
used to detect the end of charge, software must take the appropriate action to terminate the charging operation.

- 49 -
3. Technical Brief
3.8 SUB SYSTEM

3.8.1 KEY PAD
QSC62x0 devices provide a keypad interface that supports five sense lines, or columns, and (typically) five
keypad rows (though more can be software defined). The columns are a set of five QSC pins that are used for
sensing (KEYSENSE_xN); another set of pins are connected to the keypads rows and are used for driving
(KYPD_x). The sensed columns reveal when any keypad button is pressed, and then the rows are driven
sequentially to determine precisely which keypad button was pressed.
KEY_ROW(0)
KEY_ROW_0
KEY_ROW(1)
KEY_ROW_1
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_COL(0)
KEY_ROW_2
KEY_ROW_3
KEY_ROW_4
KEY_COL_0
KEY_COL(1)
KEY_COL_1
KEY_COL(2)
KEY_COL_2
3.8.2 External memory interface

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.
EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR
SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports
the high-bandwidth, high-density, and low-latency requirements of the QSCs advanced on-chip capabilities such
as the ARM9 processor, highperformance graphics, and video applications.
EBI2 is the slower speed interface intended to support memory devices such as NAND flash and asynchronous
SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270 only).
In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM memory
configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.
EBI1 Features
EBI1 is a high-performance external memory interface for the QSC62x0 digital block that supports DDR SDRAM
devices
Specifically, the following memory devices are supported on EBI1:
- 50 -

3. Technical Brief
SDRAM
-16-bit low-power DDR SDRAM
-Minimum size per chip-select: 16 MB (128 Mbit)
-Maximum size per chip-select: 128 MB (1 Gbit, 1 k columns only)
Characteristics of the EBI1 clock are listed below:
-Maximum clock rate is 92 MHz, defined by the AMSS software.
-The EBI1 memory controller clock is synchronous to the bus clock (HCLK).
EBI2 Features
EBI2 is used to interface with slower memory and peripheral devices (NAND flash, burst NOR, LCDs, etc.). The following
EBI2 devices are supported:
NAND flash
-8/16 bit, single-level cell (SLC)/multi-level cell (MLC) 512/2048-byte page devices
-DMA support
-Boot-up capability from the above devices
Burst NOR flash
-16-bit multiplexed AAD burst NOR devices
8/16/18-bit (write only) LCD devices (both Motorola and Intel style)
Characteristics of the EBI2 clock are listed below:
The maximum clock rate is 46 MHz, defined by the AMSS software.
The EBI2 memory controller operates at HCLK/2.
Broadcasting and multicasting (QSC6270 only, with MBP1600 IC) are based on:
-Wideband MediaFLO, DBV-H, and ISDB-T
Asynchronous/burst controller (EBI1 and EBI2)
The external memory controller (xmem_ctlr) forms the asynchronous/burst controller for both EBI1 and EBI2 in the
QSC62x0 device. The controller is generic in terms of its software programmable options and can be customized when
used for EBI1 and EBI2. This block has been enhanced in the QSC62x0 device to support 32-bit burst memories and
byte masking during write operations.
Interface Spec
Device
Part Name
Maker
Memory cell array
Flash
TYA000B001BLKF
Toshiba
2G
SDRAM
TYA000B001BLKF
Toshiba
1G

- 51 -
3. Technical Brief
3.8.3 Camera Interface ( 5M CAMERA )

BL20 Installed a 5M Pixel Camera. Below picture shows the camera board to board connector and camera I/F
signal.
CAM_MCLK
CAM_PCLK
MEGA_CAM_RESET_N
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
FLT_CAM_DATA[8]
FLT_CAM_DATA[9]
CAM_I2C_SDA
CAM_I2C_SCL
CAM_VSYNC
CAM_HSYNC
MEGA_CAM_PWDN
- 52 -

3. Technical Brief
The 5MEGA Camera module is connected to Main PCB with 34pin Board to Board connector Its interface is
dedicated camera interface port in QSC6270 chip. The camera port supply 24.0MHz master clock to camera
module, vertical sync signal, horizontal sync signal, reset signal and 10bits data from camera module. The
camera module is controlled by I2C port from QSC6270 chip.
3.8.4 LCD Module (LQ024Q3UX01 : SHARP)

This data sheet is to introduce the specification of LQ024Q3UX01 active matrix 262,144color LCD module.
Main color LCD module is controlled by Driver IC (Renesas R61520).
If any problem occurs concerning the items not stated in this specification, it must be solved sincerely
by both parties after deliberation.
As to basic specification of driver IC refer to the IC specification and handbook.
Features
Display mode(Main LCD) : Normally Black, Transmissive VA mode 262K colors
LCD Driver IC: Renesas R61520
Driving Method : a-Si TFT Active Matrix
8/16 Bit, CPU I/F Parallel

- 53 -
3. Technical Brief
D0~D15
CS
WR
RD
RS
RESET
VSYNC_O
+2.8V_VCC
+1.8V_IOVCC
GND
QSC6270
AAT3169
TFT LCD
2.4 (240 x 320)
LED ANODE
LED CATHODE 1 to 5
3.8.5 Audio Signal Processing & Interface

Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from
MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6280). This transmitted
signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the
signal from DBB chip (MSM6280) and outputs it to receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs
earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L,
HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two
differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
- 54 -

3. Technical Brief
3.8.6 Touch Screen Interface
3.8.6.1 MAIN Touch Interface

The SO1G2000 device has up to 16 capacitive buttons, up to 2 capacitive scroll strips. The SO1G2000 device is
controlled by I2C port from QSC6270.
Touch interface scheme is shown and, there control signals are followed
MAIN_TOUCH_I2C_SCL
: I2C CLOCK
MAIN_TOUCH_I2C_SDA
: I2C DATA
MAIN_TOUCH_INT : IC2 INT
3.8.6.2 Side Interface

Side touch interface scheme is shown and there control signals are followed
SIDE_TOUCH_I2C_SCL : I2C CLOCK
SIDE_TOUCH_I2C_SDA : I2C DATA
SIDE_TOUCH_I2C_INT : I2C INT

- 55 -
3. Technical Brief
MUSIM_DM
MAIN_TOUCH_I2C_SCL
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_INT
SIDE_TOUCH_I2C_SCL
SIDE_TOUCH_I2C_SDA
SIDE_TOUCH_INT
VREG_TOUCH_2.85V
SIDE_TOUCH_RST
SIDE_TOUCH_INT
SIDE_TOUCH_I2C_SCL
SIDE_TOUCH_I2C_SDA
KQ13L2-6R
SENSE0
SENSE1
SENSE2
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
MAIN_TOUCH_INT
SENSE3
SENSE4
SENSE7
SENSE5
SENSE8
SENSE6
- 56 -

4.TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.
4. TROUBLE SHOOTING
4.1 RF Component
4.1.1 MAIN board TOP
FL102
FL103
FL107
U100
U102
U104
U103
FL100
U101
FL120
FL106
X100
SW101
SW100
U301

- 57 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
RF component (WCDMA / GSM)

Reference
Description
Reference
Description
U301
QSC6270
FL106
WCDMA (VIII) Duplexer
FL100
FEM
U100
WCDMA VIII PAM
U102
WCDMA I PAM
X100
VCTCXO(19.2MHz)
FL103
WCDMA (I) TX SAW Filter
U104
GSM/EDGE PAM
FL102
WCDMA (VIII) TX SAW Filter
SW100
RF Antenna Connector
U103
WCDMA (I) Coupler
SW101
RF Connector
U101
WCDMA (VIII) Coupler
FL120
WCDMA (I) Duplexer
- 58 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.2 RF Path
4.2.1 WCDMA path
TX Path
RX Path
Tx/RX Path

- 59 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.2.2 GSM path
- 60 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.3 Trouble Shooting of GSM Part (GSM900/1800/1900)

- 61 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
- 62 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.3.1 Checking VCTCXO Circ
TP1
TP2
TP3
TP2
TCXO CIRCUIT
TRK_LO_ADJ
TP3
19M_XTAL_IN
19.2MHz
TP1

- 63 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.3.2 Checking Front-End Module Block
- 64 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
TP7 TP7
TP6
TP6
TP5
TP5
TP1
TP2
TP3
TP4
ANT_SEL(0)
ANT_SEL(1)
ANT_SEL(2)
ANT_SEL(3)
TP6
TP5
TP7
F E M C ontrolLogic ___ W C D M A B A N D 1& 8

C TR L
A N T _S E L_0 A N T _S E L_1 A N T _S E L_2 A N T _S E L_3
G S M 850/E G S M T X
P C N /P C S T X
W B 1900
W B 900*
W B 2100
G S M 850 R x
E G S M R x*
PC N R x
PC S R x
*(WCDMA BC8 shared FEM output_pin with GSM900)

- 65 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.3.3 Checking GSM Rx part
TP1
GLNA_HB_IN_P
GSM1800 Rx Band
GLNA_HB_IN_M
WLNA_HB1_IN_M_GSM
GSM1900 Rx Band
TP2
WLNA_HB1_IN_P_GSM
GLNA_LB_IN_P
GSM850 Rx Band
GLNA_LB_IN_M
TP3
L126= 100pF, when W850 enabled
WCDMA_LB
897.5MHz,942.5MHz
WLNA_LB_IN_M
WCDMA_900/GSM900
15nH
WLNA_LB_IN_P
- 66 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.3.4 Checking GSM Txpart
TP1
TP1
TP3
GLNA_HB_IN_P
GSM1800 Rx Band
GLNA_HB_IN_M
TP3
WLNA_HB1_IN_M_GSM
GSM1900 Rx Band
WLNA_HB1_IN_P_GSM
TP5
GSM900 Rx Band
TP5
GLNA_LB_IN_P
GSM900 Rx Band (Direct) C155
GSM850 Rx Band
Value
1pF
L121
L100
L118
3.9nH
3.9nH
DNI
GLNA_LB_IN_M
WCDMA_2100
WCDMA_1900
WCDMA_LB
TX_GSM_HB
3dB
GSM_PA_BAND
TP2
TX_GSM_LB
DNI
GSM_PA_EN
ANT_SEL(0)
ANT_SEL(1)
ANT_SEL(2)
ANT_SEL(3)
GSM TX
TP2
GSM_PA_RAMP
TP4

- 67 -
B9442
EGSM Tx
3dB
TP4
SFSY0037601
B9442
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
TP4
TP5
TP3
TP2
TP1
- 68 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.4 Trouble Shooting of WCDMA part

- 69 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
High band PAM
Low band PAM
FEM
VCTCXO
RF Con
4.4.1 Checking VCTCXO

Refer to GSM Part (4.3.1)
4.4.2 Checking Mobile SW & FEM
Refer to GSM Part (4.3.2)
- 70 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.4.3 Checking WCDMA Rx
TP2

TP3
- 71 -
TP1
4. TROUBLE SHOOTING
TP1
WCDMA_2100
WCDMA 2100
WLNA_HB2_IN_M
WLNA_HB2_IN_P
TP3
WLNA_HB1_IN_M
18pF, when enabled
TP2
WLNA_HB1_IN_P
18pF, when enabled
1910M
1710M
1nH, when enabled

WCDMA_1900
DNI, when enabled
WCDMA 1900
1880,1960MHz

WCDMA_LB
897.5MHz,942.5MHz
WLNA_LB_IN_M
WCDMA_900/GSM900
15nH
WLNA_LB_IN_P
- 72 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.4.4 Checking WCDMA Tx part
TP5
TP1
TP3
TP2
TP4
TP6
TP7
TP8
TP9

- 73 -
4. TROUBLE SHOOTING
TP9
ANT_SEL(0)
ANT_SEL(1)
ANT_SEL(2)
ANT_SEL(3)
TP7
WCDMA_2100
WCDMA 2100
PWR_DET
WLNA_HB2_IN_M
6dB Atten
TP5
TP1
WLNA_HB2_IN_P
TP3
WCDMA_1900(33pF)
WCDMA_1900(DNI)
WCDMA_1900 TX Band
WCDMA_1900_TX_OUT
WLNA_HB1_IN_M
18pF, when enabled
WCDMA_2100_TX_OUT
PA_R1
PA_R0
B9414
SFSY0035101
WCDMA_PA_ON0
WLNA_HB1_IN_P
18pF, when enabled
1910M
WCDMA_2100 TX Band
1710M
1nH, when enabled

WCDMA_1900
DNI, when enabled
WCDMA 1900
PA_R0
1880,1960MHz
PA_R1
WCDMA_850(DNI)

WCDMA_LB
WCDMA_PA_ON1
WCDMA_LB_TX_OUT
897.5MHz,942.5MHz
897.5 MHz
WLNA_LB_IN_M
WCDMA_900 TX Band

WCDMA_900/GSM900
TP4
15nH
TP2
TP6
WLNA_LB_IN_P
TP8
- 74 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.TROUBLE SHOOT
4.5 Checking Bluetooth Block
4.5.1 BLUETOOTH RF components
ANT1
ANT1
FL1
FL1
U1
U1
X1
X1
RF component ( BT )
- Sub board bottom Reference
Description
ANT1
BT chip ANT
( 3 x1.5 X 1 )
`U1
BT module_BCM2070
FL1
Band pass filter
X1
26Mhz crystal

- 75 -
4.TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.5.2 BLUETOOTH SIGNAL PATH
Bluetooth Signal PATH (sub board bottom)

Bluetooth T/Rx PATH
- 76 -

4.TROUBLE
SHOOTING
4. TROUBLE
SHOOTING
4.5.3 BLUETOOTH Trouble shooting
Start
TP1, TP2
Signals exist?
Change the main board
No
Yes
TP3
Is Clock OK?
No
Change the X1(crystal)
No
Change the U1
Yes
TP4
Signal exist?
Yes

- 77 -
4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
TP#
TP description
TP1
VREG_MSMP_2.6V
TP2
VREG_MSME_1.8V
TP3
BT_CLK(26Mhz)
TP4
BT_ANT_OUT
TP4
TP1
TP2
TP3
TP2
TP4
TP3
TP3
can be removed
close to VDDIF(B1)
TP4
BT_ANT
RF
BT_IN_OUT
close to VDDTF(C1)
close to VREGHV(A2)
close to VDDO
close to G1 and E1
TP1
VERY close to E1, F1
can be removed
VREG_MSMP_2.6V
can be removed
TP1
VERY close to VREG(A1)
TP2
VREG_GP1_BT
close to VDDC
VREG_MSME_1.8V
BT_IN_OUT
BT_RESET_N
BT_REG_ON
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
SLEEP_CLK
26MHz
UART1_RX_DATA
UART1_TX_DATA
UART1_CTS_N
UART1_RTS_N
MSM_WAKES_BT
BT_WAKES_MSM
- 78 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
[BT main clk : 26MHz]

- 79 -
4. TROUBLE SHOOTING
4.TROUBLE4.TROUBLE
SHOOTINGSHOOTING
4.6 Checking FM Radio Block
4.6.1 BLUETOOTH RF components & FM Signal Path
U60
U60
U601
Reference
Description
U601
TEA5991(FM module)
- 80 -

4. TROUBLE SHOOTING
4.TROUBLE SHOOTING
4.6.2 FM Trouble shooting
Start
TP1, TP2
No
No
Change the Ear MIC
Signals exist?
Yes
TP3
Signals exist?
Yes
TP4
No
Change the U601
Signal exist?
Yes

- 81 -
4.TROUB
4. TROUBLE SHOOTING
U601
4.TROUBLE SHOOTING
TP1
U601
TP4
TP3
TP2
VREG_MSMP_2.6V
TP2
VREG_MSME_1.8V
TP3
FM_ANT_IN
TP4
FM_OUT_AUDIO signal
TP1
SLEEP_CLK
TP description
TP#
TP2(C213)
VREG_MSMP_2.6V
FM_OUT_R
FM_OUT_L
FM_AUDIO_R
FM_AUDIO_L
FM_ANT_N
TP4 (C305)
TP1 (C603)
TP1 (C602)
- 82 -

TP
4. TROUBLE SHOOTING
4.7 Power ON Troubleshooting

Power On sequence is :
PWR key press PM_ON_SW_N QSC6270 KPDPWR_N pin(AA2) go to low(KEY BOARD VA1) QSC6270
Power Up VREG_MSMC_1.2V(C261), VREG_MSME_1.8V(C209), VREG_MSMP_2.6V(C414),
VREG_RFRX2_1.3V(C232), VREG_TCXO_2.85V(C239) power up and system reset assert to QSC6270 Phone
booting and PS_HOLD assert to QSC6270
Start
NO
Change or charging the Battery
Battery voltage. higher

than 3.20V?
YES
NO
VA106 go to low
when key press?
Check the Key Dome
YES
VREG_MSMC_1.2V
VREG_MSME_1.8V
VREG_MSMP_2.6V
VREG_TCXO_2.85V
power up?
NO
YES
NO
Is clock ok?
X201 : 32.768KHz
C108 : 19M
Change the TCXO & Sleep Crystal
YES

- 83 -
4. TROUBLE SHOOTING
TCXO (19MHz)
Sleep Crystal (32.768kHz)
Sleep Crystal (32.768kHz)
- 84 -

4. TROUBLE SHOOTING
MAIN TOP VIEW
MAIN BOTTOM VIEW

- 85 -
4. TROUBLE SHOOTING
4.8 Charger Troubleshooting

Charging Procedure
- Connect TA or USB Cable
- Control the charging current by QSC6270
- Charging current flows into the battery
Troubleshooting Setup
Check Point
Troubleshooting Procedure
- Connection of TA or USB Cable

- Charging current path
- Battery
- Check the charger (TA or USB Cable) connector

- Check the charging current Path
- Check the battery
- Connect TA and battery to the phone
Start
Check the pin and battery

Connect terminals of I/O
connector
NO
Connection OK?
Change I/O connector
Yes
NO
Change TA
Is the TA voltage 5.1V?
Yes
Yes
Is it charging properly?
END
NO
[ Charger Troubleshooting Flow ]
- 86 -

4. TROUBLE SHOOTING
4.9 USB Troubleshooting

USB Initial sequence is : Isert USB Cable USB_VBUS +5V Check U410, FL400, IC400 triggered
USB IF work
START
NO
Cable is insert
Change the USB cable
YES
NO
USB_VBUS is about to 5V
(C414,C419)
Change the CN400
YES
NO
U401(MAX14528) OUTPUT
is about 5V (ZD400)
Change the U401
YES
FL400(NFM21PC105BA3)
OUTPUT is 5V
(C418)
NO
Change the FL400
YES
IC400(MAX14526) OUTPUT is
USB_DM,USB_DP signal
check
NO
Change the IC400
YES
[ USB Troubleshooting Flow ]

- 87 -
4. TROUBLE SHOOTING
<Figure 3.7 Signal in USB connection>
- 88 -

4. TROUBLE SHOOTING
4.10 USIM Detect Troubleshooting

USIM Initial sequence is :
VREG_USIM_2.85V go to 1.8V or 3.0V USIM_CLK,USIM_RST,USIM_DATA triggered USIM IF work
Start
Re-insert the SIM card
Yes
Work well ?
End
No
NO
Vreg_USIM is 1.8V or 3.0V ?
USIM_P_CLK & RST is run ?
Check J401
YES
Yes
Change the SIM card
Work well?
No
No
Work well ?
Change the Main board
Yes
End

- 89 -
4. TROUBLE SHOOTING
VREG_USIM_2.85V
E
B
G
USIM_DATA
USIM_RESET_N
C
USIM_CLK
MUSIM_DP
MUSIM_DM
A:VREG_USIM_2.85V
B:USIM_RESET_N
A
C:USIM_CLK
D:MUSIM_DP
E:GND
F:NC
G:USIM_DATA
H:MUSIM_DM
- 90 -

4. TROUBLE SHOOTING
4.11 Camera Troubleshooting

Camera control signals are generated by QSC6270.
Start
Check the camera connection to the

socket and reconnect the camera
Yes
Camera is OK?
END
NO
NO
CAM_AVDD_2.8V
CAM_VDD_1.8V
(C510,C509)
Chang the Main board
Yes
NO
Check the CAM_MCLK

R505
NO
Check the CAM_PCLK
R504
Change the Camera Module
Yes
Camera is OK
END
NO

- 91 -
4. TROUBLE SHOOTING
CAM_24MHz MCLK
CAM_70MHz PCLK
- 92 -

4. TROUBLE SHOOTING
4.12 Main side view LED Troubleshooting

MAIN Key Pad LED is on as below :
Key pressing LED_CON go down low (below 0.8v) MAIN Key Backlight LED On
Start
Key press
NO
Check battery
+VPWR is above 3.2V?
Yes
NO
Check VA2
below 0.8v
Change the FPCB

OR KEY PCB
Yes
NO
Change the MAIN PCB
LED ON ?
Yes
END

- 93 -
4. TROUBLE SHOOTING
LD2
2
R1
A
C
SSC-SWTS1007
LD1
10
+VPWR
R2
C
A
SSC-SWTS1007
10
+VPWR
MAIN_KEY_LED_N
VA2
ICVS0514X350FR
Check point (VA2)
R1
R2
[Main KEY PCB TOP ]
- 94 -

4. TROUBLE SHOOTING
4.13 Slide Key side view LED Troubleshooting

Sub Key Pad Slide is on as below :
Key pressing LED_CON go down low (below 0.8v) Sub Key Backlight LED On
Start
Key press
NO
Check battery
+VPWR is above 3.2V?
Yes
NO
Check VA200
below 0.8v
Change the FPCB

OR KEY PCB
Yes
NO
Change the MAIN PCB
LED ON ?
Yes
END

- 95 -
4. TROUBLE SHOOTING
SLIDE_KEY_LED_N
Check point (VA200)
[Slide Side view schemetic]
[Slide Side view placement]
- 96 -

4. TROUBLE SHOOTING
4.14 LCD Troubleshooting

LCD control signals are generated by QSC6270.
The signal path is : QSC6270 CN102 LCD Module
Start
Press END key
Key LED is on?
NO
Slide Side view Troubleshooting
Yes
Disconnect and reconnect
The LCD connector
(Slide PCB CN100,CN101)
LCD display OK?
Yes
END
No
Change the FPCB
LCD display OK?
Yes
END
No
Change SUB PCB
LCD display OK?
Yes
END
No
Change the Main Board

- 97 -
4. TROUBLE SHOOTING
[Slide Side view placement]
- 98 -

4. TROUBLE SHOOTING
4.15 Vibrator Troubleshooting

Vibrator is operate when DC motor driver is enabled.
Start
Operate the Vibrator
Wired
Vibrator to FPCB
VIB?
NO
Solder the wire on to FPCB
YES
LINMOT_P
above 3.0V or LINMOT_M
below 1V?
YES
Change vibrator or Change

the Main PCB
NO
Change the FPCB
NO
working?
Change vibrator or Change

the Main PCB
YES
END
[LCD FPCB ]

- 99 -
4. TROUBLE SHOOTING
4.16 Receiver Path

QSC6270 RCV R508,R509 C517,C518 Audio sub system FPCB Speaker Pad
Start
Connect the phone to network

Equipment and setup call
Setup 1KHz tone out
Can you hear the tone?
YES
END
NO
The sine wave appears at
R508,R509?
YES
Change QSC6270
Change Main PCB
YES
Change audio sub system
YES
Change FPCB
NO
C517,C518?
NO
Speaker pad
NO
- 100 -

4. TROUBLE SHOOTING
RCV-(R508)
RCV-(R509)
SPK_RCV+ (C517)
Audio Sub system IC500
SPK_RCV- (C518)

- 101 -
4. TROUBLE SHOOTING
SPEAKER -
SPEAKER +
- 102 -

4. TROUBLE SHOOTING
4.17 Headset path

R6,R7 IC500(Audio Sub System) R408 IC400(MUIC) CN400 (u USB Connector)
Start

equipment and setup call.
Setup 1KHz tone out
and insert headset.
YES
END
Can you hear the tone?

NO
Sine wave appears at
R6,R7
YES
Change Audio Sub System
NO
R408?
YES
Check the MUIC

NO

- 103 -
4. TROUBLE SHOOTING
I/O Connector
(CN400)
HP_EAR_L ( R6 )
HP_EAR_R ( R7)
[ MAIN Bottom]
R408
MUIC IC400
- 104 -

4. TROUBLE SHOOTING
4.18 Speaker phone path

QSC6270 SPK C528,C529 C517,C518(DNI) Audio Sub System(IC500) CN501 Speaker pad( FPCB)
Start

equipment and setup call
Setup 1KHz tone out
NO
C528,C529?
YES
Change QSC6270
Change Main PCB
NO
C517,C518?
YES
Change audio sub system
NO

SPK Pad?
YES
Change FPCB
NO

- 105 -
4. TROUBLE SHOOTING
SPK_RCV+ (C517)
[ MAIN Bottom ]
SPK_R(C529)
SPK_RCV- (C518)
SPK_L(C528)
- 106 -

4. TROUBLE SHOOTING
SPEAKER -
SPEAKER +

- 107 -
4. TROUBLE SHOOTING
4.19 Main microphone

MIC1 MIC_BIAS(C2) MIC1P(C3) QSC6270
Start
Make a call
MIC_BIAS(C2)
is 1.8V?
NO
YES
Make sound to MIC

C3?
YES
NO
Change the MIC
NO
YES
Work well?
- 108 -
END

4. TROUBLE SHOOTING
MICBIAS
MIC1N
MIC1P
MAIN MIC
C7
C2
10u
47p
MIC1
MICBIAS
1
2
MIC1N
MIC1P
C4
100n
C3
100n
P
G1
G2
O
SPU0410HR5H-PB

- 109 -
C6
C8
33p
33p
4. TROUBLE SHOOTING
4.20 Headset microphone

Headset CN400 (u USB connector) IC400(MUIC) MIC2P(C411) QSC6270
Start
Insert Headset & Make a call
NO
R408 is 1.8V ?
Change the MAIN board

Change the MUIC
Yes
C411?
NO
Check the MUIC

Change the Headset
Yes
- 110 -

4. TROUBLE SHOOTING
I/O Connector
MUIC IC400
CN400
R408
MIC2P C411

- 111 -
5. Download
5. Download
5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool
with capabilities to upload image les to the handset. LGMDP is designed to be simple to use and easy enough
for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG
(Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 9 handsets
at the same time.
- 112 -

5. Download
5.2 Downloading Procedure

Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting
started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File
menu and select Preferences.
Play a success sound

It will be played a .wav le when the download has been completed. To enable this simply check the box.
Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
Automatically run Select Port When LGMDP starts
When LGMDP starts, it will automatically select Select Port button to download new image le.

- 113 -
5. Download
5.2.1 Connection to PC
Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to
be connected for downloading images. Then click on the Connect button.
(The port number(COM7) shall be different from that of the port number in the snapshot.)
- 114 -

5. Download
The status Ready is displayed when the application is ready for downloading. While the images are transmitted
from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.

- 115 -
5. Download
1) Image Folder indicates loot path where all image files are placed. To change location of the default image
path, select Browse button. The edit box shows the file path where images are located. Please note that all
images should be located in a selected folder.
2) Click on the Browse button to select image files to be downloaded on the handset.
1)
2)
3)
5)
4)
6)
7)
WARNING! For a Media Image, please make sure that country code is match with
connected phone. If country code does not match, select Browse button next to the
Media Image, and then select the media image with matched country code.
- 116 -

5. Download
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the
NV data and restore the backed up NV data automatically.
4) Reset database & Contents:
User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option.
Erase_EFS:
The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV
backup/restore is checked. The user contents and file system physically are wiped out.
Keep All Contents
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected.
5) Additional Options:
Display Information is defaultly not selected and user cannot choose.
Override partition table is also also defaultly not selected and user cannot choose.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.

- 117 -
5. Download
5.2.2 Choosing image les

Select the image folder, where all the image files are located, by clicking on the Browse.
(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the
path where the image files are located.)
- 118 -

5. Download
Select the path on the Image Folder by clicking on the Browse, then the LGMDP will automatically load images
accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file
by clicking on the Browse button. The selected AMSS image will be downloaded to the handset from the path
directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is selected,
the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)

- 119 -
5. Download
If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file
to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP
installation directory by clicking on the Browse button.
- 120 -

5. Download
Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click
on the Yes button to continue downloading selected image file with options.

- 121 -
5. Download
DZ is one image S/W binary consisting of variety S/W images such as partition.mbn, pbl.mbn,.., module.bin.
The new download function has been provided to allow the testing of the integrity of the DZ image by checking a hash code of every included file.
(DZ does not allowing extracting or creating zip archive with other public opened archive tool such as WinZip
or Alzip.) To download DZ image, simply click on the DZ button.
- 122 -

5. Download
Select dz image path where dz image file is located by clicking on the Browse button. Click on the Start Button to start downloading DZ image. If you want to go back to original download mode, click on the Original
button.

- 123 -
5. Download
5.2.3 Downloading
This message box informs that a new le for NV backup will be
created in the displayed le name in the LGMDP installation
directory.
Backing up NV data and backed up NV data will be stored in

the LGMDP installation directory.
Erasing the existing directories and les before the Module

image is downloaded.
- 124 -

5. Download
Downloading the AMSS modem image
Rebooting the handset and re-establishing the connection.
Restoring NV data which backed up in the Backing up process.

User can also restore NV data using NV Default image selection.

- 125 -
5. Download
Rebooting the handset and re-establishing the connection
Erasing the existing directories and les before downloading

the selected Media image
Downloading Media image in progress
- 126 -

5. Download
Downloading Module image in progress
Rebooting handset
Downloading process has completed successfully

- 127 -
5. Download
5.2.4 Tools
Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed
to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the
Tools of the file menu.
- 128 -

5. Download
5.3 Troubleshooting Download Errors

1) When the phone does not work after downloading has been completed.
2) Media Erasing Error
3) NV Restore Error
5.3.1 When the phone does not work
Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to
download all the images up to AMSS. In the emergency mode, you can not download media or module image.
The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is
running so that users can download the images again in case of emergency situation. (AMSS modem, Media,
and Module images can not be running in this mode.)
The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the
Connect button to continue.

- 129 -
5. Download
Choose Image file after clicking on the Browse button. Make sure that you have chosen the right image file.
After choosing valid images, then click on the Start button to start downloading selected images. The selected
image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.
- 130 -

5. Download
5.3.2 NV Restore Error

Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.

- 131 -
5. Download
Connect the handset and Press the Connect button in the Select Port window.(Enable state in the window
indicates that the Phone has been detected and is ready to download.)
- 132 -

5. Download
Click on Browse . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown.
These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined
based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset,
and click on Start.

- 133 -
5. Download
5.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) If you see the message cal mode after completing download, you must do NV restore and image (media and
module) download.
3) The NV data saved at LGMDP folder as following format.
D:LGMDP004400-01-429926_COM14_
LGMDP folder name

IMEI number
Port number
4) Recommended that the Module and Media Image have to be downloaded at the same time.
5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.
- 134 -

6. Block Diagram
6. Block Diagram
1. System HW Block Diagram : BL20 Total Block Diagram

- 135 -
6. Block Diagram
2. System HW Block Diagram : POWER_1
- 136 -

6. Block Diagram
2. System HW Block Diagram : POWER_2

- 137 -
6. Block Diagram
3. System HW Block Diagram : BB Block
- 138 -

6. Block Diagram
4. System HW Block Diagram : RF Block

- 139 -
6. Block Diagram
5. System HW Block Diagram : Connectivity (BT & FM Radio)
- 140 -

6. Block Diagram
6. System HW Block Diagram : MEMORY

- 141 -
6. Block Diagram
7. System HW Block Diagram : AUDIO
- 142 -

6. Block Diagram
8. System HW Block Diagram : VISUAL( LCD & CAMERA )

- 143 -
- 144 -

7. CIRCUIT DIAGRAM
BL20_MAIN_REV.1.0
ANTENNA SWITCH MODULE LOGIC
ANTENNA SWITCH MODULE LOGIC
WCDMA BAND 2&5(WB 2 Shared)
WCDMA BAND 1&8(WB 8 Shared)

NET Name(PIN Name)
GSM1800 Rx Band
WLNA_HB1_IN_M_GSM
GSM1900 Rx Band
WLNA_HB1_IN_P_GSM
ANT_SEL1
ANT_SEL2
NET Name(PIN Name)
ANT_SEL3
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
GSM850/EGSM TX
GSM850/EGSM TX
PCN/PCS TX
PCN/PCS TX
WCDMA1900(21PIN)
WCDMA1900(21PIN)
WCDMA_900(22PIN)
WCDMA850(22PIN)
WCDMA2100(20PIN)
WCDMA2100(20PIN)
GSM850 RX
GSM850 RX
EGSM RX
EGSM RX
PCN RX
PCN RX
PCS RX(W1900)
PCS RX(W1900)
GLNA_HB_IN_P
GLNA_HB_IN_M
ANT_SEL0
GSM900 Rx Band
GLNA_LB_IN_P
GSM900 Rx Band (Direct)
GSM850 Rx Band
Value
C155
1pF
L121
L100
3.9nH
3.9nH
L118
DNI
GLNA_LB_IN_M
WCDMA_2100
WCDMA_1900
WCDMA_LB
TX_GSM_HB
3dB
GSM_PA_BAND
TX_GSM_LB
DNI
GSM_PA_EN
ANT_SEL(0)
GSM TX
ANT_SEL(1)
ANT_SEL(2)
B9442
EGSM Tx
GSM_PA_RAMP
3dB
ANT_SEL(3)
SFSY0037601
B9442
TCXO CIRCUIT
WCDMA_2100
TRK_LO_ADJ
19M_XTAL_IN
WCDMA 2100
19.2MHz
PWR_DET
WLNA_HB2_IN_M
6dB Atten
WLNA_HB2_IN_P
WCDMA_1900(33pF)
WCDMA_1900(DNI)
WCDMA_1900 TX Band
WCDMA_1900_TX_OUT
WLNA_HB1_IN_M
18pF, when enabled
WCDMA_2100_TX_OUT
PA_R1
PA_R0
B9414
SFSY0035101
WCDMA_PA_ON0
WLNA_HB1_IN_P
18pF, when enabled
1910M
WCDMA_2100 TX Band
1710M
1nH, when enabled

WCDMA_1900
DNI, when enabled
WCDMA 1900
PA_R0
1880,1960MHz
PA_R1
WCDMA_850(DNI)

WCDMA_LB
WCDMA_PA_ON1
WCDMA_LB_TX_OUT
897.5MHz,942.5MHz
897.5 MHz
WLNA_LB_IN_M
WCDMA_900 TX Band

WCDMA_900/GSM900
15nH
WLNA_LB_IN_P
DUPLEXER(W850)
L100
C164
C165
1.8pF
12nH
12nH
L104
OR
WCDMA_850/GSM850 SAYFP836MCA0F00

DNI
- 145 -
7. CIRCUIT DIAGRAM
BL20_MAIN_REV.1.0
VREG_MSMC_1.2V
VSW_MSMC
VREG_RF1_2.3V
VSW_RF1
VREG_RF1_2.3V|VREG_RF1
UART_BT_SEL
MICBIAS
MSM_RESIN_N
VREF_THERM_OUT
VBATT_TEMP
19M_XTAL_IN
SIDE_TOUCH_RST
SLEEP_CLK
PS_HOLD
PM_ON_SW_N
VREG_RF2_1.4V|VREG_RF2
WCDMA_PA_ON0
WCDMA_PA_ON1
GSM_PA_EN
GSM_PA_BAND
VSW_RF2
SLIDE_KEY_LED_N
MAIN_KEY_LED_N
High : BT UART
Low : UART Comm
VREG_RF2_1.4V
GLNA_HB_IN_M
GLNA_HB_IN_P
GLNA_LB_IN_M
GLNA_LB_IN_P
WLNA_HB1_IN_M
WLNA_HB1_IN_P
WLNA_HB2_IN_M
WLNA_HB2_IN_P
WLNA_HB1_IN_M_GSM
WLNA_HB1_IN_P_GSM
WLNA_LB_IN_M
WLNA_LB_IN_P
WCDMA_1900_TX_OUT
WCDMA_2100_TX_OUT
WCDMA_LB_TX_OUT
TX_GSM_HB
TX_GSM_LB
PWR_DET
GSM_PA_RAMP
Backup Battery
VBACK_UP
VSW_RF1
VREG_RF1
VSW_RF2
VREG_RF2
VSW_MSMC
BATT_FET_N
VBATT
27pF
1nF
VREF_THERM_OUT
BATT_FET_N
Close to QSC
VBATT_TEMP
Close to QSC
- 146 -

7. CIRCUIT DIAGRAM
ADC
HKAIN1 : PCB_Rev_ADC
HKAIN0 - VBATT_TEMP
MODE_3 MODE_2 MODE_1 MODE_0
UART_BT_SEL
0
UTXD
URXD
PWR
VBAT
ON_SW
VCHAR
TX
RX
GND
Native ARM9 JTAG
MPP1 - VREF_RFA_2.2V (internally)

MPP2 - MAIN_TOUCH_INT
MPP3 - MAIN_KEY_LED_N
JTAG_TDI
PS_HOLD
MSM_RESIN_N
JTAG_RTCK
LCD_DRV_N - SLIDE_KEY_LED_N
100K
100K
100K
100K
100K
100K
100K
100K
100K
100K
:
:
:
:
:
:
:
:
:
:
6.2K : 0.128V - A, G
13K : 0.258V - B, H
22K : 0.396V - C, I
47K : 0.703V - D, J
62K : 0.842V - F, L
91K : 1.048V - 1.0
150K : 1.32V - 1.1
240K : 1.553V - 1.2
470K : 1.814V - 1.3
1.5M : 2.062V - 1.4
HP_L
HP_R
SPK_L
SPK_R
RCV+
RCV-
MIC2P
FM_AUDIO_L
FM_AUDIO_R
0.47uF
UART1_TX_DATA
Close to QSC
MIC1P
MIC1N
USB_DM
JTAG_TDO
JTAG_RTCK
USB_DP
RESOUT_N
3G
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_TRST_N
2.5G
HKAIN1 - PCB_Rev_ADC
* MODE_3 : Not connected(internally pulled-up) - Enabled

by -HW
MPP4
SIDE_TOUCH_INT
JTAG_TCK
JTAG_TMS
JTAG_TRST_N
JTAG_TDO
UART1_RX_DATA
VBUS
VBATT
PM_ON_SW_N
VBUS
UART1_TX_DATA
UART1_RX_DATA
(Default Pull-Down)
SDRAM_ADDR[0:15]
SDRAM_ADDR15
SDRAM_ADDR14
SDRAM_ADDR13
SDRAM_ADDR12
SDRAM_ADDR11
SDRAM_ADDR10
SDRAM_ADDR9
LINMOT_EN
BT_RESET_N
MSM_WAKES_BT
BT_WAKES_MSM
MUSIM_DP
MUSIM_DM
MAIN_TOUCH_I2C_SCL
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_INT
SIDE_TOUCH_I2C_SCL
SIDE_TOUCH_I2C_SDA
SIDE_TOUCH_INT
SDRAM_ADDR8
SDRAM_ADDR7
SDRAM_ADDR6
SDRAM_ADDR5
SDRAM_ADDR4
SDRAM_ADDR3
SDRAM_ADDR2
SDRAM_ADDR1
SDRAM_ADDR0
SDRAM_DATA[0:15]
SDRAM_DATA15
SDRAM_DATA14
SDRAM_DATA13
SDRAM_DATA12
SDRAM_DATA11
SDRAM_DATA10
SDRAM_DATA9
SDRAM_DATA8
SDRAM_DATA7
SDRAM_DATA6
SDRAM_DATA5
SDRAM_DATA4
SDRAM_DATA3
SDRAM_DATA2
SDRAM_DATA1
SDRAM_DATA0
TRK_LO_ADJ
CAM_I2C_SCL
SDRAM_ADDR[0:15]
PA_R0
PA_R1
ANT_SEL(0)
ANT_SEL(1)
ANT_SEL(2)
ANT_SEL(3)
FLASH_SET
FLASH_EN
FLASH_INH
VGA_CAM_PWDN
MEGA_CAM_PWDN
LCD_RESET_N
LCD_MAKER_ID
LCD_BL_CTRL
NAND_READY
USIM_DATA
USIM_CLK
USIM_RESET_N
VGA_CAM_RESET_N
MEGA_CAM_PWR_EN
LINMOT_PWM
LCD_IF_MODE2
EBI2_DATA[0:15]
EBI2_DATA15
EBI2_DATA14
EBI2_DATA13
EBI2_DATA12
EBI2_DATA11
EBI2_DATA10
EBI2_DATA9
EBI2_DATA8
EBI2_DATA7
EBI2_DATA6
EBI2_DATA5
EBI2_DATA4
EBI2_DATA3
EBI2_DATA2
EBI2_DATA1
EBI2_DATA0
CAM_I2C_SDA
CAM_MCLK
CAM_DATA[9]
CAM_DATA[8]
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
MEGA_CAM_RESET_N
CAM_VSYNC
CAM_HSYNC
CAM_PCLK
LCD_VSYNC_OUT
BT_PCM_CLK
BT_PCM_OUT
BT_PCM_IN
BT_PCM_SYNC
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
MUIC_INT
BT_REG_ON
UART1_RTS_N
UART1_CTS_N
MICROSD_CLK
MICROSD_DATA[3]
MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
MICROSD_CMD
SLIDE_DETECT
SDRAM_DQS(0)
SDRAM_DQS(1)
SDRAM_DQM(0)
SDRAM_DQM(1)
SDRAM_CKE(0)
SDRAM_CS_N(0)
SDRAM_ADV_N
SDRAM_OE_N
SDRAM_WE_N
SDRAM_CLK_P
SDRAM_CLK_M
LCD_ADS
LCD_CS_N
EBI2_WE_N
EBI2_OE_N
EBI2_CLE_N
EBI2_ALE_N
EBI2_CS1_N
BL20_MAIN_REV.1.0

- 147 -
7. CIRCUIT DIAGRAM
BL20_MAIN_REV.1.0
SDRAM_ADDR(0:13)
SDRAM_DATA(0:15)
SDRAM_ADDR0
SDRAM_ADDR1
SDRAM_ADDR2
SDRAM_ADDR3
SDRAM_ADDR4
SDRAM_ADDR5
SDRAM_ADDR6
SDRAM_ADDR7
SDRAM_ADDR8
SDRAM_ADDR9
SDRAM_ADDR10
SDRAM_ADDR11
SDRAM_ADDR12
SDRAM_ADDR13
SDRAM_DATA0
SDRAM_DATA1
SDRAM_DATA2
SDRAM_DATA3
SDRAM_DATA4
SDRAM_DATA5
SDRAM_DATA6
SDRAM_DATA7
SDRAM_DATA8
SDRAM_DATA9
SDRAM_DATA10
SDRAM_DATA11
SDRAM_DATA12
SDRAM_DATA13
SDRAM_DATA14
SDRAM_DATA15
EBI2_DATA[0:15]
VREG_MSME_1.8V
EBI2_CS1_N
EBI2_WE_N
EBI2_OE_N
EBI2_ALE_N
EBI2_CLE_N
NAND_READY
RESOUT_N
VREG_MSME_1.8V
SDRAM_DQM(0)
SDRAM_DQM(1)
SDRAM_DQS(0)
SDRAM_DQS(1)
SDRAM_CLK_M
SDRAM_CLK_P
SDRAM_CKE(0)
SDRAM_ADDR14
SDRAM_ADDR15
SDRAM_ADV_N
SDRAM_OE_N
SDRAM_WE_N
SDRAM_CS_N(0)
VREG_MSME_1.8V
FM_ANT_N
MUIC-MAX14526
USB_DM
USB_DP
USB_DUSB_D+
UART1_RX_DATA
UART1_TX_DATA
USB_ID
1uF
MIC2P
HP_EAR_L
HP_EAR_R
uUSB 5Pin Connector

MUIC_INT
USB_DUSB_D+
USB_ID
- 148 -

7. CIRCUIT DIAGRAM
BL20_MAIN_REV.1.0
Audio Sub System
5M Camera & AF Power
MEGA_CAM_PWR_EN
MEGA_CAM_PWR_EN
HP_EAR_R
FM_OUT_L
FM_OUT_R
HP_R
HP_L
HP_EAR_L
SPK_R
SPK_L
SPK_RCV+
SPK_RCV-
RCV+
RCV-
5M & 3M Camera Connector

FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
FLT_CAM_DATA[8]
FLT_CAM_DATA[9]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[8]
CAM_DATA[9]
7.5pF
CAM_MCLK
CAM_DATA[2]
CAM_DATA[3]
CAM_DATA[4]
CAM_DATA[5]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
CAM_PCLK
MEGA_CAM_RESET_N
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
FLT_CAM_DATA[8]
FLT_CAM_DATA[9]
7.5pF
CAM_DATA[0]
CAM_DATA[1]
CAM_I2C_SDA
CAM_I2C_SCL
CAM_VSYNC
CAM_HSYNC
MEGA_CAM_PWDN
FLT_CAM_DATA[0]
FLT_CAM_DATA[1]
7.5pF

- 149 -
BL20_MAIN_REV.1.0
SLEEP_CLK
7. CIRCUIT DIAGRAM
VREG_MSMP_2.6V
FM_OUT_R
FM_OUT_L
FM_AUDIO_R
FM_AUDIO_L
FM_ANT_N
KEY_ROW(0)
KEY_ROW_0
KEY_ROW(1)
KEY_ROW_1
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_COL(0)
KEY_ROW_2
KEY_ROW_3
KEY_ROW_4
KEY_COL_0
KEY_COL(1)
KEY_COL_1
KEY_COL(2)
KEY_COL_2
Flash Driver
LINMOT_EN
+VPWR
FLASH_SET
FLASH_EN
FLOUT
FLASH_INH
LINMOT_EN
LINMOT_P
FLASH_OUT
LINMOT_PWM
LINMOT_M
- 150 -

7. CIRCUIT DIAGRAM
BL20_MAIN_REV.1.0
Main Sub Connector
FLT_LCD_DATA[0]
FLT_LCD_DATA[1]
FLT_LCD_DATA[2]
FLT_LCD_DATA[3]
FLT_LCD_DATA[4]
FLT_LCD_DATA[5]
FLT_LCD_DATA[6]
FLT_LCD_DATA[7]
FLT_LCD_DATA[8]
FLT_LCD_DATA[9]
FLT_LCD_DATA[10]
FLT_LCD_DATA[11]
FLT_LCD_DATA[12]
FLT_LCD_DATA[13]
FLT_LCD_DATA[14]
FLT_LCD_DATA[15]
FLT_LCD_CS_N
FLT_LCD_ADS
FLT_LCD_WE_N
EBI2_OE_N
LCD_VSYNC_OUT
LCD_IF_MODE2
MUSIM_DP
MUSIM_DM
UART_BT_SEL
MAIN_TOUCH_INT
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
PM_ON_SW_N
SIDE_TOUCH_I2C_SDA
SIDE_TOUCH_INT
SIDE_TOUCH_I2C_SCL
UART1_RX_DATA
UART1_TX_DATA
UART1_RTS_N
UART1_CTS_N
LCD_MAKER_ID
LCD_RESET_N
LCD_BL_CTRL
LINMOT_P
LINMOT_M
SIDE_TOUCH_RST
USIM_DATA
USIM_RESET_N
USIM_CLK
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
SPK_RCV+
SPK_RCVVGA_CAM_RESET_N
CAM_HSYNC
CAM_VSYNC
MICROSD_DATA[3]
MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
MICROSD_CMD
MICROSD_CLK
BT_WAKES_MSM
MSM_WAKES_BT
SLIDE_KEY_LED_N
SLEEP_CLK
CAM_MCLK
FLT_CAM_DATA[2]
FLT_CAM_DATA[3]
FLT_CAM_DATA[4]
FLT_CAM_DATA[5]
FLT_CAM_DATA[6]
FLT_CAM_DATA[7]
FLT_CAM_DATA[8]
FLT_CAM_DATA[9]
VGA_CAM_PWDN
BT_RESET_N
BT_REG_ON
CAM_PCLK
CAM_I2C_SCL
CAM_I2C_SDA
FLASH_OUT
FLOUT
EBI2_WE_N
LCD_ADS
LCD_CS_N
FLT_LCD_WE_N
FLT_LCD_ADS
FLT_LCD_CS_N
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
15pF
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
FLT_LCD_DATA[11]
FLT_LCD_DATA[10]
FLT_LCD_DATA[9]
FLT_LCD_DATA[8]
15pF
FLT_LCD_DATA[3]
FLT_LCD_DATA[2]
FLT_LCD_DATA[1]
FLT_LCD_DATA[0]
FLT_LCD_DATA[15]
FLT_LCD_DATA[14]
FLT_LCD_DATA[13]
FLT_LCD_DATA[12]
EBI2_DATA(15)
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
15pF
15pF
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
Key Connector
MICBIAS
PM_ON_SW_N
KEY_ROW_0
KEY_ROW_1
KEY_ROW_2
KEY_ROW_3
KEY_ROW_4
KEY_COL_0
KEY_COL_1
KEY_COL_2
MIC1P
MIC1N
MAIN_KEY_LED_N
SLIDE_DETECT
FLT_LCD_DATA[7]
FLT_LCD_DATA[6]
FLT_LCD_DATA[5]
FLT_LCD_DATA[4]
KEY_COL[2]
KEY_ROW[0]
15pF

- 151 -
7. CIRCUIT DIAGRAM
BL20_SUB_REV.1.0
Main Sub Connector
FLASH LED
Side Touch Connector
MUSIM_DP
MUSIM_DM
UART_BT_SEL
PM_ON_SW_N
SIDE_TOUCH_I2C_SDA
SIDE_TOUCH_INT
SIDE_TOUCH_I2C_SCL
SIDE_TOUCH_RST
VREG_TOUCH_2.85V
UART1_RX_DATA
UART1_TX_DATA
UART1_RTS_N
UART1_CTS_N
FLOUT
SIDE_TOUCH_RST
USIM_DATA
USIM_RESET_N
USIM_CLK
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
CMERA FLASH LED

SIDE_TOUCH_INT
SIDE_TOUCH_I2C_SCL
SIDE_TOUCH_I2C_SDA
MICROSD_DATA[3]
MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
MICROSD_CMD
MICROSD_CLK
BT_WAKES_MSM
MSM_WAKES_BT
FLASH_OUT
KQ13L2-6R
SLEEP_CLK
BT_RESET_N
BT_REG_ON
FLASH_OUT
FLOUT
Micro SD Connector
SIM Connector
VREG_MICROSD_3.0V
VREG_USIM_2.85V
MICROSD_DATA[2]
MICROSD_DATA[3]
MICROSD_CMD
USIM_DATA
MICROSD_DATA[1]
MICROSD_DATA[0]
USIM_RESET_N
MICROSD_CLK
USIM_CLK
MUSIM_DP
MUSIM_DM
- 152 -

7. CIRCUIT DIAGRAM
BL20_SUB_REV.1.0
BT_ANT
RF
BT_IN_OUT
BLUETOOTH_BCM2070
close to VDDIF(B1)
close to VDDTF(C1)
can be removed
close to G1 and E1
VERY close to E1, F1
close to VREGHV(A2)
close to VDDO
VERY close to VREG(A1)
VREG_MSMP_2.6V
can be removed
can be removed
VREG_GP1_BT
close to VDDC
VREG_MSME_1.8V
BT_IN_OUT
BT_RESET_N
BT_REG_ON
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_PCM_SYNC
SLEEP_CLK
26MHz
UART1_RX_DATA
UART1_TX_DATA
UART1_CTS_N
UART1_RTS_N
MSM_WAKES_BT
BT_WAKES_MSM

- 153 -
7. CIRCUIT DIAGRAM
BL20_SLIDE_Rev.1.0
SENSE0
SENSE1
SENSE2
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
MAIN_TOUCH_INT
SLIDE_KEY_LED_N
SENSE3
SENSE4
SENSE7
SENSE8
SLIDE KEY_ SIDE VIEW LED 4EA 0.2T
SENSE5
SENSE6
NAVI_TOUCH_DRIVER IC
- 154 -

7. CIRCUIT DIAGRAM
SLIDE_KEY_LED_N
LCD_IF_MODE2
LCD_VSYNC_OUT
EBI2_OE_N
FLT_LCD_WE_N
FLT_LCD_ADS
FLT_LCD_CS_N
LCD_IF_MODE2
LCD_VSYNC_OUT
EBI2_OE_N
FLT_LCD_WE_N
FLT_LCD_ADS
FLT_LCD_CS_N
FLT_LCD_DATA[15]
FLT_LCD_DATA[14]
FLT_LCD_DATA[13]
FLT_LCD_DATA[12]
FLT_LCD_DATA[11]
FLT_LCD_DATA[10]
FLT_LCD_DATA[9]
FLT_LCD_DATA[8]
FLT_LCD_DATA[7]
FLT_LCD_DATA[6]
FLT_LCD_DATA[5]
FLT_LCD_DATA[4]
FLT_LCD_DATA[3]
FLT_LCD_DATA[2]
FLT_LCD_DATA[1]
FLT_LCD_DATA[0]
LCD_MAKER_ID
FLT_LCD_DATA[15]
FLT_LCD_DATA[14]
FLT_LCD_DATA[13]
FLT_LCD_DATA[12]
FLT_LCD_DATA[11]
FLT_LCD_DATA[10]
FLT_LCD_DATA[9]
FLT_LCD_DATA[8]
FLT_LCD_DATA[7]
FLT_LCD_DATA[6]
FLT_LCD_DATA[5]
FLT_LCD_DATA[4]
FLT_LCD_DATA[3]
FLT_LCD_DATA[2]
FLT_LCD_DATA[1]
FLT_LCD_DATA[0]
LCD_RESET_N
MLED1
MLED2
MLED3
MLED4
MLED5
MLED_OUT
MAIN_TOUCH_INT
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
LCD_MAKER_ID
LCD_RESET_N
LCD_BL_CTRL
37 Pins LCD Zip Connector

FPCB to Slide Pcb 49Pins Connector
MLED_OUT
MLED1
MLED2
LCD_BL_CTRL
MLED3
MLED4
MLED5
LCD LDO 2.8V & 1.8V
LCD Backlight 5-Channels Driver

- 155 -
7. CIRCUIT DIAGRAM
12
H
11
10
BL20_SLIDE FPCB_EU_REV.1.0
H
+VPWR
VREG_MSMP_2.6V
VREG_TOUCH_2.85V
49
VREG_MSMP_2.6V
47
VREG_TOUCH_2.85V
46
CN101
FLT_LCD_DATA[0]
FLT_LCD_DATA[1]
FLT_LCD_DATA[2]
FLT_LCD_DATA[3]
FLT_LCD_DATA[4]
FLT_LCD_DATA[5]
FLT_LCD_DATA[6]
FLT_LCD_DATA[7]
FLT_LCD_DATA[8]
FLT_LCD_DATA[9]
FLT_LCD_DATA[10]
FLT_LCD_DATA[11]
FLT_LCD_DATA[12]
FLT_LCD_DATA[13]
FLT_LCD_DATA[14]
FLT_LCD_DATA[15]
FLT_LCD_CS_N
FLT_LCD_ADS
FLT_LCD_WE_N
EBI2_OE_N
LCD_VSYNC_OUT
LCD_IF_MODE2
SLIDE_KEY_LED_N
45
LCD_IF_MODE2
LCD_VSYNC_OUT
EBI2_OE_N
FLT_LCD_WE_N
FLT_LCD_ADS
FLT_LCD_CS_N
+VPWR
G2
48
SLIDE_KEY_LED_N
G1
44
43
42
41
40
39
70
69
68
67
66
65
64
63
62
61
10
60
11
59
12
58
13
57
14
56
15
55
16
54
17
53
18
52
19
51
20
50
21
49
22
17
48
23
16
47
24
15
46
25
14
45
26
44
27
43
28
42
29
41
30
40
31
39
32
38
33
37
34
36
35
38
FLT_LCD_DATA[15]
FLT_LCD_DATA[14]
FLT_LCD_DATA[13]
FLT_LCD_DATA[12]
FLT_LCD_DATA[11]
FLT_LCD_DATA[10]
FLT_LCD_DATA[9]
FLT_LCD_DATA[8]
FLT_LCD_DATA[7]
FLT_LCD_DATA[6]
FLT_LCD_DATA[5]
FLT_LCD_DATA[4]
FLT_LCD_DATA[3]
FLT_LCD_DATA[2]
FLT_LCD_DATA[1]
FLT_LCD_DATA[0]
MAIN_TOUCH_INT
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
LCD_MAKER_ID
LCD_RESET_N
LCD_BL_CTRL
LINMOT_P
LINMOT_M
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
SPK_RCV+
SPK_RCV-
19
18
13
12
11
MAIN_TOUCH_INT
MAIN_TOUCH_I2C_SDA
MAIN_TOUCH_I2C_SCL
10
9
8
LCD_MAKER_ID
LCD_RESET_N
6
5
4
LCD_BL_CTRL
3
G4
G3
2
1
FPCB_70P_CONNECTOR
CN100
PAD100
SPK_RCV+
LINMOT_P
2
SPK_RCV-
FPCB TO SLIDE PCB 49Lines
LINMOT_M
MVMU-A360G
1810-8T-05W1P
SPK & RCV +/-
MOTOR +/-
A
12
11
10
- 156 -

7. CIRCUIT DIAGRAM
12
11
10
BL20_KEY FPCB_REV.1.0
1
H
KEY CONNECTOR
VREG_MSMP_2.6V
MAIN KEY MAP
CN1
G1
KB12
KB14
KEYPAD_BUTTON
KEYPAD_BUTTON
PM_ON_SW_N
KEY_ROW[0]
KEY_ROW[1]
KEY_ROW[2]
KEY_ROW[3]
KEY_ROW[4]
KEY_COL[0]
KEY_COL[1]
KEY_COL[2]
KEY_ROW[0]
KB6
KB8
KEYPAD_BUTTON
KB10
KEYPAD_BUTTON
KEYPAD_BUTTON
KEY_ROW[1]
KB13
KB11
KEYPAD_BUTTON
KB9
KEYPAD_BUTTON
KEYPAD_BUTTON
20
19
18
17
16
15
14
13
12
10
MICBIAS
MIC1P
MIC1N
MAIN_KEY_LED_N
SLIDE_DETECT
+VPWR
11
G3
G2
+VPWR
G4
KEY_ROW[2]
KB7
KB5
KEYPAD_BUTTON
AXT620124
KB3
KEYPAD_BUTTON
KEYPAD_BUTTON
KEY_ROW[3]
KB1
KB2
KEYPAD_BUTTON
KB4
KEYPAD_BUTTON
KEYPAD_BUTTON
KEY_ROW[4]
KEY_COL[0]
Slide Detect Hall IC
KEY_COL[1]
KEY_COL[2]
U1
Power Key
MAIN LED
GND
VDD
NC
VREG_MSMP_2.6V
3
R3
BU52031NVX
OUT
PGND
100K
LD2
+VPWR
R1
A
C
SSC-SWTS1007
10
KEYPAD_BUTTON
R2
A
C
SSC-SWTS1007
10
0.1uF
10pF
PM_ON_SW_N
LD1
+VPWR
SLIDE_DETECT
C11
C5
KB15
VA1
ICVS0514X350FR
MAIN_KEY_LED_N
VA2
ICVS0514X350FR
MAIN MIC
RF Connector
ANT1
C7
C2
10u
47p
ANT2
MIC1
ANTENNA_PAD
MICBIAS
ANTENNA_PAD
1
2
100p
G2
ANT
C4
100n
C3
100n
G1
UFL-R-SMT10
SW1
C10
C9
DNI
0.5p
P
G1
G2
O
SPU0410HR5H-PB
R110
C1
MIC1N
MIC1P
C6
C8
33p
33p
A
12
11
10

- 157 -
- 158 -

8. BGA Pin Map
8. BGA Pin Map

QSC6270 -U301 (bottom view)

- 159 -
8. BGA Pin Map
TYA000B001BLKF -U400
- 160 -

8. BGA Pin Map
MAX14526 (MUIC) IC400(MAX14526EEWP+TCC6)

- 161 -
8. BGA Pin Map
MAX9877(AUDIO SUB SYSTEM)

- IC500(MAX9877AEWP_TG45)
- 162 -

8. BGA Pin Map
TEA5991 (FM_RECEIVER (RDS)) U603

- 163 -
8. BGA Pin Map
BCM2070 (BLUETOOTH_BCM2070) U1
- 164 -

9. PCB LAYOUT
CN701 Main Conn

Can not use LCD/ Speaker/
Motor/Touch / Navi key LED
U1 02/U100 WCDMA PAM

WCDMA BC1/BC8 /BC8 Tx
po wer N o service
35
FL102(I)/ FL103(VIII)
WCDMA BC1/BC8 Tx filter
Tx power No service
70
C110
FB707
VA 65 5
FB704
FB706
FB705
C220
VA657
R6006
C264
VA313
VA312
VA311
VA310
VA309
BAT200
C206
C205
C204
C291
C231
C221
R3000
C240
CN300
TP210
C 236
C 232
C235
C 233
C222
C230
C227
TP211
C228
C225
C5C161
C3C135
C106
C104
C140
X100
R100
C105
FL106(duplexer)/FL104(filter)
WCDMA BC2 no service
*originally disabled for
BL20(EU)*
C165
C164
L104
L109
R6007
FL120(I)/FL105(VIII)
Du plexer
WC D M A TX Power &
R X S e n s i t i v i ty
No Service
R290
R390
C219
L100
C133
L119
C134
L117
C136
FL104
C153
C154
L120
L125
C100
C162
C163
L130
L121
L118
C152
L124
C155
R6005
C260
C223
L108
R6002
VA658
VA656
C399
C125
C137
R6001
VA653
C218
FL105
L107
VA652
R650
R6004
R205
C217
U101
R103
L126
R6003
FB702
C130
L 1 10
L 10 3
L111
FL120
C132
C259
FB703
R6000
FB701
C281
FB700
C127
C102
FL100
R A 6 50
U 1 00
C126
VA654
10
C114
L199
C 124
FL106
L114
L122
C212
VA651
C159C151
L106
C158
R 111
R 106
R 109
R110
L123
C149
C142
C176
L116
C150
FL100 FEM
WCDMA/GSM RX
Sensitiv ity & TX Power
No Service
L112
C209
C210
C211
C157
L113
C213
C111
U 103
C115
L102
C112
R 101
R102
R 112
C156
L127
C160
C128
C122
C138
C121
C131
L2
C116
C113
C123
L1
FL102
U 102
R107
U104
R104
R105
C109
C108
L105
C129
C1 0 7
C144
C103
C147
C166
FL107
U102 GSM PAM

GSM Tx power
No service
C146
FL103
L115
C139
SC1
C117
C120
FL701
L101
C119
FL702
C118
C143
FL703
FL704
C145
R108
FL700
36
VA700
R7 0 1
C701
R 700
C7 0 0
FL 10 7 GS M T x filte r
GSM Tx po we r N o s er vi c e
U101(I)/U103(VIII)
Co upler
W C D M A B C 1 / B C8
Tx power
No service
CN701
C237
C239
C238
C241
C256
C234
C254
X100 VCT C XO
No service
is YW thpuzwmWYWZWWXXUW[t{vw

- 165 -
9. PCB LAYOUT
U 5 0 1 C a me r a A F LD O
Can not use AF at camera
CN702 Sub PCB Con.

Can not use
BT/ U S IM/TF la s h / C a m e ra
Flash/Side Touch
U8 00 Flash Driver
Can not use Camera Flash
U5 02 Came r a LDO
Can not use camera
SW1
U6 03 FM Receiver
Can not use FM Radio
C602
L800
C802
C800
U800
R801
R800
C413
C801
FB4
C412
C416
FB3
C536
C501
CN400
C419
R411 R410
U401
C418
I C 4 0 0 MU IC
Can not operate USB
FL400
IC500
U501
C503
R503
R502
CN702
C502
C524
C523
C507
17
C414
C532
C535
C526
VA801
VA800
C411
TP2
TP302
C603
R409
FB5
TP1
TP3
IC400
ZD400
FB1
C517
C530
R508
R509
C531
C695
C696
18
C306
C304
CN400 u-USB Conn.

Can not operate USB
Dont charge
C303
R408
R490
R491
C417
VA400
C415
F
E
D
C
B
A
R6
FB2
C518
VA503VA504
C533
C527
C528
FL500
FL501
C506
C534
CN602 Motor LDO.

Can not use Motor
C529
C525
25 72
R7
FL502
U502
R307
R306
CN601 Motor IC .
Can not use Motor
C2
26 82
R803
45 50
TP404
C305
U6 0 3
R12
R11
R9
R8
R10
R14
C791
R5
R4
R13
CN500 Camera Conn.

Can not use Camera
L400
S W1 L ock K ey
Can not use Lock Key
R3
R500
C406
R402
R400
R401
C405
C410
C409
C407
C404
VA501
C513
R505
VA502
R504
C514
C505
CN500
C504
VA500
R501
C509
IC500 Audi o sub sys.

No sound
34
C508
FB500
C510
U400
R316
A
1
AA
AB
C3001
R391
C300
R301
C216
F
C215
R1
C10
C600
R291
C262
C208
D
R303
R304
C141
C101
R399
R305
L205
C3000
TP402
R207 R209 VA200 R208
C263
C214
C242
L202
L203
C248
U400 Memory
Can not boot
C265
C290
ZD200
L206
L204
C307
C261
C250
Q2000
C9
C252
C247
R2
23
C402
C207
C251
C249
C273
C299
C1
11
C408
U301
C229
C243
L201
C246
L200
X200
20
SW100
C203
C202
A
1
12
SW100 RF Co nn.
No service
CN700
C258
C257
C253
C245
CN200
10
isYW thpuzwmWYWZWWXXUW[tiv{
U 4 0 0 M e m or y
Can not boot
SW101
C403
AC
H
G
C226
CN700 Key Co nn.

Can not use Mic/Slide
detect/Key led/power
key/Dial key/
C401
C224
R302
R299
X200 VCT C XO
No service
TP401
TP400
C690
C606
U601
U602
U3 01 QSC6 270
(BB & Power chipset)
Can not power on
No L C D Di s p la y
No Ser vi ce
- 166 -
CN200 Battery Conn.

Can not power on
Can not detect battery

9. PCB LAYOUT
28
54
CN1
27
CN1 Sub PCB conn.

Can not use USIM / MicroSD /
Blutooth / CAMARA ash
/ Side touch
is Y W z|i i{ zwq W W ] _ W W X TX U W T{ vw

- 167 -
9. PCB LAYOUT
ANT1
Bluetooth chip ANT
Can not use BT
C51
ANT1
L52
C16
C17
C13
TP20 TP21 TP15 TP18 TP23 TP22 TP19 TP17
J1 MicroSD Socket
Can not use MicroSD
LD1
C 11
C29
C10
C7
C9
C34
C14
CN2
LD1 Camera ash

driver Can not use camera ash
J1
CN2 Side Touch Conn

Can not use Side Touch
C33
C6
C8
C5
C12
FL 1
C24
TP13
R4
TP9
FB1
C27
C15
C18
TP5
TP12
TP10
C20
C30
U1 Bluetooth module
Can not use BT
B
C
U1
TP7
C32
R1
R2
C3
C4
C21
C28
C31
TP11
TP6
C22
TP8
C19
TP16
C2 3
C1
C26
R3
C25
TP14
CN3
R12
C2
CN3 USIM conn.

Can not detect USIM
X1
VA21
TP4
TP3
VA22
VA23
TP2
VA24
X1 26Mhz Crystal
Can not use BT
TP1
is Y W z|i i{ zwq W W ] _ W W X TX U W Tiv{
- 168 -

9. PCB LAYOUT
LD200 ~LD205 Navi

KEY LED
Can not use LED
LD205
LD204
TP203
2
LD
TP201
LD20
0
03
TP208
TP204
TP209
TP207
TP206
TP205
LD201
L D2
02
TP202
is Y W zs p kl zwl W W ] Y Z W X X U X { vw

- 169 -
9. PCB LAYOUT
R217
R218
R216
CN101 Conn from FPCB

Can not use Touch / LCD /
LED
CN100 LCD Conn

Can not use LCD
CN101
CN100
R105
R212
T P 2 00
R213
R210
R215
C200
R207
R211
U200
R214
C201
VA100 C108
R1 01
R203
R206
R 2 08
R 20 5
R 2 09
C104
U200 Touch IC
Can not use Touch
VA200
R204
R202
R 10 0
U101
U100
C106
ZD100
C105
ZD101
C202
C101
C103
C100
C107
C102
R200
R201
U101 LCD LDO

Can not use LCD
R104
C203
U100 Charge Pump

Can not use LCD
Backlight
is Y W zs p kl zwl W W ] Y Z W X X U X iv{
- 170 -

9. PCB LAYOUT
11
CN1 Key FPCB Conn

Can not use LED / Slide
Detect / Mic
20
CN1
10
LD1
C8
C2
R1
C6
VA2
C4
C3
R2
VA1
C7
LD2
KB12
KB14
KB15
KB6
KB8
KB10
KB13
KB11
KB9
KB7
KB5
KB3
KB1
KB2
KB4
C5
C11
R3
MIC1
U1
U1 Hall IC Can not use Slide

Detect
MIC1 MIC.
Can not use MIC.
is Y W m rl zwj W X _ [ Y W X TX U W T{ vw

- 171 -
9. PCB LAYOUT
SW1
C10
C1
ANT1
C9
R110
ANT2
SW1 Hall IC
No Service
is Y W m rl zwj W X _ [ Y W X TX U W Tiv{
- 172 -

9. PCB LAYOUT
PAD100 Motor Pad

Can not use Motor.
CN101 FPCB 70 pin Conn

Can not use Speaker /
Motor / LCD / Touch Key
LED / Touch
PAD100
70
36
CN101
35
ECN100
is Y W m s jk zwj W X _ Z _ W X TX U W T{ vw
- 173 -
9. PCB LAYOUT
CN100
CN100 Speaker PAD.

Can not use Speaker.
is Y W m s jk zwj W X _ Z _ W X TX U W Tiv{
- 174 -

10. Calibration
10. Calibration
10.1 Usage of Hot-Kimchi
1.1.1 Calibration
Model Name(BL20)
Model Name(BL20)
Calibration Only
z Procedure
1. Click SETTING in menu, and logic operation in sub-menu.
Choose 1 in LOGIC MODE (means calibration alone)
2.Select the model name which you want in list box
3.Click Start button to calibrate a phone

- 175 -
10. Calibration
0.1.2 Basic Setting
z Contents
9 Click SETTING in menu, and logic operation in sub-menu.
9 You can select how to control AT comm, Testset, and Power supply in DLL Operating Mode.
9 You can set UART Port and logic mode. (mode 1 : Calibration alone)
9 You can set Result Files name type. If you choose TIME, the saved files name is saved in a run - time.
9 You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.)
9 You can set the path of HOTKIMCHI program.
- 176 -

10. Calibration
10.1.3 Log of Calibration and Test
Model Name(BL20)
Model Name(BL20)
z Contents
9 On Running, Log window is created in center area. It displays logs of command, and
measurements of Calibration or Autotest.
9 The result files are saved in the directory ~janghee\debug\Cal, ~janghee\debug\Auto, or
~janghee\debug\CalAuto.

- 177 -
11. Test Mode
11. Test Mode

Phone Test Mode _ BL20
1.
2.
3.
Enter the Engineer Menu

Tap 2. Device Test
Tap 1. Auto ALL Test
- 178 -

11. Test Mode
Phone Test Mode Scenario_ UMTS(1)

Item
Order
Description
(1) Key Press Test

Key Test
Key Test
IF OK, tab Cent

button
Press all keys for test
- UP key
- Down key
- Right key
- Left key
.
.
.

- 179 -
Display the Key info
11. Test Mode

Item
(2) Sound
Order
Description
Sound On
R i n gt o n e ( M P 3 ) i s p l a ye d
re gularly
IF OK, tab Cent

button
Press OK button (Cent key)

Move to next step
- 180 -

11. Test Mode

Item
( 3 ) Vi b r at o r T e st
Order
Description
Vibrator On
Press OK button (Cent)

Move to next step
IF OK, tab Cent

button

- 181 -
11. Test Mode

Item
(4) Flash Test
Order
Description
Flash On
Press OK button (Cent)

Move to next step
IF OK, tab Cent

button
- 182 -

11. Test Mode

Item
( 5 ) E xt e r n a l
Memory
Test
Order
Description
External Memory
Test Start
IF OK, tab Cent

button
If not inserted External
memory card.

- 183 -
External memory
inserted and test
was ok then display
OK Sign.
11. Test Mode

Item
(6) Slide On/Off
Test
Order
Slide On/Off
Test Start
IF OK, tab Cent

button.
Or Slide On Off
Description
If Slide on status.
- 184 -
Slide Close Status

11. Test Mode

Item
(7) Camera Test
Order
Description
C ame ra Off
In Camera Preview Mode

Press Cent Key
to start Camera Auto Test.
C a m e r a A u to On
( Preview )
If OK next
P ho t o Sh o t
P ho t o S a v e
preview
ok
Video on
( Preview )
If OK next
Record video(3)
Video Save
Call Photo
If OK next
Call Video
If OK End

- 185 -
- 186 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW

- 187 -
ASSY EXPLODED VIEW
- 188 -

12.2 Replacement Parts
Note: This Chapter is used for reference, Part order is ordered

by SBOM standard on GCSC
<Mechanic component>
Level
Location
No.
AAAY00
ADDITION
AAAY0393102
WITHOUT
COLOR
ACGA00
COVER ASSY,BATTERY
ACGA0029105
BLACK
MCCE00
CAP,RECEPTACLE
MCCE0051201
MOLD, PC LUPOY SC-1004A, , , , ,
BLACK
102
MCJA00
COVER,BATTERY
MCJA0089305
BLACK
101
MTAB00
TAPE,PROTECTION
MTAB0358501
COMPLEX, (empty), , , , ,
WITHOUT
COLOR
103
AMBA00
MANUAL
ASSY,OPERATION
AMBA0165511
BL20 manual assy for ORF
WITHOUT
COLOR
MCDE00
CARD,SERVICE GUIDE
MCDE0006503
PRINTING, (empty), , , , ,
WITHOUT
COLOR
MCHZ00
COMPACT DISK
MCHZ0083901
SILVER
SNOW
MMBB00
MANUAL,OPERATION
MMBB0356111
WITHOUT
COLOR
APAY00
PACKAGE
APAY0135502
BL20 ORF(TR1-1H/ORG UB/Void/12403_AL)
WITHOUT
COLOR
APLY00
PALLET ASSY
APLY0003203
TDR TR1-1 ORG STD Palletizing
Without
Color
MPBZ00
PAD
MPBZ0219601
COMPLEX, (empty), , 503, 860, 145,
Without
Color
MPCY00
PALLET
MPCY0012403
DARK BLUE
MBAD00
BAG,VINYL(PE)
MBAD0005204
Without
Color
MLAC00
LABEL,BARCODE
MLAC0004541
Without
Color
MLAZ00
LABEL
MLAZ0050901
WITHOUT
COLOR
MLAZ01
LABEL
MLAZ0037104
METAL
SILVER
APEY
PHONE
APEY0788606
ACGM00
COVER ASSY,REAR
ACGM0135605
ABGC00
BUTTON ASSY,SIDE
ABGC0012601
MDAC00
DECO,SIDE
MDAC0026601
BLACK
GMZZ
SCREW MACHINE
GMZZ0024202
1.4 mm,2.7 mm,MSWR3(BK) ,B ,+ ,- ,HEAD D=2.7mm ,;

,[empty] ,[empty] , , ,A-5052 ,BLACK ,[empty] ,B
BLACK
93
MBJZ00
BUTTON
MBJZ0013201
RED
81
Description
Part Number

Spec
Color
Remark
BLACK
France
- 189 -
BLACK
BLACK
80
Level
Location
No.
MCCZ00
CAP
MCCZ0033501
MCJN00
COVER,REAR
MDAK00
Description
Color
Remark
BLACK
86
MCJN0104101
MOLD, PC LUPOY SC-2302, , , , ,
BLACK
79
DECO,REAR
MDAK0019501
RED
83
MGAZ
GASKET
MGAZ0076601
WITHOUT
COLOR
71
MGAZ01
GASKET
MGAZ0077001
WITHOUT
COLOR
68
MGAZ02
GASKET
MGAZ0077101
WITHOUT
COLOR
67
MIDZ
INSULATOR
MIDZ0218901
GREEN
BLUE
84
MIDZ00
INSULATOR
MIDZ0239201
WITHOUT
COLOR
70
MIDZ01
INSULATOR
MIDZ0241401
WITHOUT
COLOR
69
MIDZ02
INSULATOR
MIDZ0241501
WITHOUT
COLOR
72
MLAB
LABEL,A/S
MLAB0001102
C2000 USASV DIA 4.0
WHITE
66
MLAR
LABEL,WARNING
MLAR0005301
YELLOW
MLCE00
LENS,FLASH
MLCE0013701
MOLD, PMMA HI835M, , , , ,
WITHOUT
COLOR
78
MPBT00
PAD,CAMERA
MPBT0077901
BLACK
77
MPBU0
PAD,CONNECTOR
MPBU0076001
WITHOUT
COLOR
75
MPBU01
PAD,CONNECTOR
MPBU0075901
BLACK
65
MPBU04
PAD,CONNECTOR
MPBU0075601
BLACK
73
MPBZ00
PAD
MPBZ0261501
WITHOUT
COLOR
91
MPBZ01
PAD
MPBZ0265801
WITHOUT
COLOR
74
MPFZ00
PLATE
MPFZ0040801
PRESS, STS, , , , ,
WITHOUT
COLOR
63
MTAA01
TAPE,DECO
MTAA0192101
WITHOUT
COLOR
82
MTAB00
TAPE,PROTECTION
MTAB0365401
WITHOUT
COLOR
89
MTAK0
TAPE,CAMERA
MTAK0033201
WITHOUT
COLOR
87
MTAZ0
TAPE
MTAZ0255401
WITHOUT
COLOR
62
MTAZ00
TAPE
MTAZ0265901
BLACK
92
Part Number
Spec
- 190 -

Level
Location
No.
MTAZ01
TAPE
MTAZ0255501
MTAZ02
TAPE
MTAZ04
MWAE00
Description
Part Number
Color
Remark
WITHOUT
COLOR
64
MTAZ0255601
WITHOUT
COLOR
76
TAPE
MTAZ0263501
WITHOUT
COLOR
85
WINDOW,CAMERA
MWAE0048201
CUTTING, Tempered Glass, , , , ,
WITHOUT
COLOR
88
ACGQ
COVER ASSY,SLIDE
ACGQ0042201
BLACK
ACGS00
COVER
ASSY,SLIDE(UPPER)
ACGS0029101
BLACK
MCJW00
COVER,SLIDE(UPPER)
MCJW0026001
MOLD, PC LUPOY SC-2302, , , , ,
BLACK
MDAP00
DECO,SLIDE(UPPER)
MDAP0007001
MFBC00
FILTER,SPEAKER
MFBC0051701
BLACK
MGAZ00
GASKET
MGAZ0074301
WITHOUT
COLOR
MPBG00
PAD,LCD
MPBG0094301
BLACK
MTAA00
TAPE,DECO
MTAA0192001
WITHOUT
COLOR
MTAF00
TAPE,MOTOR
MTAF0028601
WITHOUT
COLOR
MTAZ0
TAPE
MTAZ0254601
WITHOUT
COLOR
MTAZ01
TAPE
MTAZ0254701
WITHOUT
COLOR
MWAC00 WINDOW,LCD
MWAC0120601
CUTTING, PMMA MR 200, , , , ,
BLACK
ADBY00
DECO ASSY
ADBY0014801
SLIDER LOWER
BLACK
E, 19
MDAP00
DECO,SLIDE(UPPER)
MDAP0007101
MOLD, POM LUCEL N109-LD, , , , ,
BLACK
10
MMAA
MAGNET,SWITCH
MMAA0009601
COMPLEX, (empty), 1, , , ,
Without
Color
ADBY01
DECO ASSY
ADBY0016501
MDAP00
DECO,SLIDE(UPPER)
MDAP0006901
MTAA00
TAPE,DECO
MTAA0191801
ADBY02
DECO ASSY
ADBY0016601
MDAG00
DECO,FRONT
MDAG0050401
MFBZ00
FILTER
MFBZ0004701
MTAZ00
TAPE
MTAZ0275201

Spec
RED
RED
RED
46
WITHOUT
COLOR
45
RED
RED
F, 21
BLACK
22
WITHOUT
COLOR
97
- 191 -
Level
Location
No.
ARDY00
RAIL ASSY,SLIDE
ACGK00
Description
Part Number
Spec
Color
Remark
ARDY0011801
BLACK
H, 39
COVER ASSY,FRONT
ACGK0136501
BLACK
MSAZ00
SHEET
MSAZ0056501
BLACK
41
MTAZ00
TAPE
MTAZ0255001
WITHOUT
COLOR
27
MTAZ01
TAPE
MTAZ0275101
WITHOUT
COLOR
98
ACGR00
COVER
ASSY,SLIDE(LOWER)
ACGR0019701
MGAZ00
GASKET
MGAZ0076501
WITHOUT
COLOR
29
MPBJ00
PAD,MOTOR
MPBJ0066001
BLACK
32
MPBN00
PAD,SPEAKER
MPBN0074101
BLACK
33
MPBZ00
PAD
MPBZ0234201
BLACK
34
MPBZ01
PAD
MPBZ0234601
BLACK
28
MPBZ03
PAD
MPBZ0234801
BLACK
30
MPBZ04
PAD
MPBZ0234901
BLACK
31
MPBZ05
PAD
MPBZ0246601
BLACK
MSAZ00
SHEET
MSAZ0056401
WITHOUT
COLOR
35
MTAZ00
TAPE
MTAZ0254901
WITHOUT
COLOR
37
MTAZ01
TAPE
MTAZ0255201
WITHOUT
COLOR
40
APGZ00
PLATE ASSY
APGZ0003601
MIDZ00
INSULATOR
MIDZ0232701
GMEY00
SCREW MACHINE,BIND
GMEY0012901
GMEY01
SCREW MACHINE,BIND
MGAZ00
BLACK
BLACK
WITHOUT
COLOR
38
1.4 mm,2.5 mm,MSWR3 ,B ,+ ,
Silver
44
GMEY0019203
1.4 mm,1.8 mm,SWCH18A ,N ,+ , ,; ,[empty] ,+ , , ,CR-7

,BLACK ,[empty] ,[empty]
Black
47
GASKET
MGAZ0076701
SILVER
17
MIDZ00
INSULATOR
MIDZ0211701
BLUE
18
MIDZ01
INSULATOR
MIDZ0232601
WITHOUT
COLOR
MKAG00
KEYPAD,MAIN
MKAG0016301
RED
F, 23
MTAB00
TAPE,PROTECTION
MTAB0358201
WITHOUT
COLOR
20
MTAB01
TAPE,PROTECTION
MTAB0358301
WITHOUT
COLOR
43
- 192 -

Level
Location
No.
Description
MTAB02
TAPE,PROTECTION
MTAB0358401
MTAB03
TAPE,PROTECTION
MTAZ01
Part Number
Spec
Color
Remark
WITHOUT
COLOR
94
MTAB0366401
WITHOUT
COLOR
TAPE
MTAZ0255301
BLACK
42
MTAZ02
TAPE
MTAZ0263101
BLACK
24
MTAZ03
TAPE
MTAZ0280601
WITHOUT
COLOR
MTAZ04
TAPE
MTAZ0280701
WITHOUT
COLOR
ADCA00
DOME ASSY,METAL
ADCA0099701
MPFL00
PLATE,LIGHT GUIDE
MPFL0003601
MTAZ
TAPE
MTAZ00
WHITE
25
WITHOUT
COLOR
12
MTAZ0275301
BLACK
96
TAPE
MTAZ0262801
BLACK
15
MTAZ01
TAPE
MTAZ0262901
BLACK
14
MTAZ02
TAPE
MTAZ0263001
BLACK
95
GMEY00
SCREW MACHINE,BIND
GMEY0009201
1.4 mm,3.5 mm,MSWR3(BK) ,B ,+ ,HEAD D=2.7mm
MLAA00
LABEL,APPROVAL
MLAA0062303
ABFZ00
BRACKET ASSY
ABFZ0019301
MBFZ00
BRACKET
MBFZ0035601
MTAZ00
TAPE
MTAZ0255701
ABFZ01
BRACKET ASSY
ABFZ0019401
MBFZ00
BRACKET
MBFZ0039401
MTAZ00
TAPE
MTAZ0255801
ACKA00
CAN ASSY,SHIELD
ACKA0015501
MCBA00
CAN,SHIELD
MCBA0051201
PRESS, STS, , , , ,
MIDZ01
INSULATOR
MIDZ0237701
MIDZ02
INSULATOR
MCBA00
Black
WITHOUT
COLOR
99
BLACK
BLACK
52
WITHOUT
COLOR
53
BLACK
BLACK
59
WITHOUT
COLOR
60
BLACK
BLACK
54
WITHOUT
COLOR
55
MIDZ0237801
WITHOUT
COLOR
56
CAN,SHIELD
MCBA0053401
PRESS, STS, , , , ,
WITHOUT
COLOR
50
MSAZ00
SHEET
MSAZ0056601
BLACK
61
MTAZ00
TAPE
MTAZ0266201
WITHOUT
COLOR
51

- 193 -
Level
Location
No.
MGAZ00
GASKET
MGAZ0074601
MPBZ00
PAD
MLAZ00
SC1
Description
Color
Remark
WITHOUT
COLOR
57
MPBZ0237601
WHITE
36, 58
LABEL
MLAZ0038301
PID Label 4 Array
WITHOUT
COLOR
CAN,SHIELD
MCBA0053501
PRESS, STS, , , , ,
WITHOUT
COLOR
Part Number
Spec
- 194 -
49

12.2 Replacement Parts

<Main component>
Level
Location
No.
Description
IMT-2000(SLIDE)
Part Number
Spec
TISL0012607
Remark
BLACK
3.0 ,-2 dBd, ,GSM900/DCS/PCS/BAND1/BAND8,
INTERNAL ,; ,MULTI ,-2.0 ,50 ,3.0
SNGF00
ANTENNA,GSM,FIXED
SNGF0047902
SACY00
PCB ASSY,FLEXIBLE
SACY0098702
SACE00
PCB ASSY,FLEXIBLE,SMT
SACE0089402
SACD00
TOP
SACD0077902
CN101
CONNECTOR,BOARD TO
BOARD
ENBY0031401
70 PIN,0.4 mm,ETC , ,H=1.5, Header
SPCY
PCB,FLEXIBLE
SPCY0183801
POLYI , mm,DOUBLE , ,; , , , , , , , , ,
SACY01
PCB ASSY,FLEXIBLE
SACY0098802
SACB00
PCB
ASSY,FLEXIBLE,INSERT
SACB0057602
SACE00
SACE0089502
SACC00
BOTTOM
SACC0065502
C1
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C9
CAP,CHIP,MAKER
ECZH0001002
0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
R110
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
SW1
CONN,RF SWITCH
ENWY0003901
,SMD , dB,
SACD00
TOP
SACD0078002
C11
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C2
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
C3
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C4
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C5
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C6
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C7
CAP,CERAMIC,CHIP
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
C8
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
CN1
CONNECTOR,BOARD TO
BOARD
ENBY0043601
20 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT

,MALE ,SMD ,[empty] , ,

Color
90
16
D, G
- 195 -
Level
Location
No.
LD1
DIODE,LED,CHIP
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,

,[empty] ,[empty] ,2P
LD2
DIODE,LED,CHIP
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,

,[empty] ,[empty] ,2P
MIC1
MICROPHONE
SUMY0010609
UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI

,[empty] , ,[empty]
R1
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R2
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R3
RES,CHIP,MAKER
ERHZ0000204
100 Kohm,1/16W ,F ,1005 ,R/TP
U1
IC
EUSY0362601
SSON004 ,4 ,R/TP ,Hall IC ,; ,IC,CMOS
VA1
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
VA2
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
SPCY
PCB,FLEXIBLE
SPCY0184201
POLYI , 0.12mm,DOUBLE , ,; , , , , , , , , ,
SAEY00
PCB ASSY,KEYPAD
SAEY0070101
SAEB00
PCB
ASSY,KEYPAD,INSERT
SAEB0031101
SAEE00
PCB ASSY,KEYPAD,SMT
SAEE0036001
SAEC00
PCB ASSY,KEYPAD,SMT
BOTTOM
SAEC0034801
C100
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C101
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C102
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C103
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C104
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C105
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C106
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C107
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C108
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C200
CAP,CERAMIC,CHIP
ECCH0000187
150 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C201
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C202
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
CN100
CONNECTOR,FFC/FPC
ENQY0014301
37 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

,STRAIGHT ,BOTH ,SMD ,[empty] ,[empty] ,
CN101
CONNECTOR,FFC/FPC
ENQY0014601
49 PIN,0.3 mm,ANGLE , , ,; , ,0.30MM ,FFC/FPC

,ANGLE ,BOTH ,SMD ,[empty] ,LOCKING ,
R100
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Spec
Color
Remark
26
- 196 -

Level
Location
No.
R101
RES,CHIP,MAKER
ERHZ0000204
100 Kohm,1/16W ,F ,1005 ,R/TP
R105
RES,CHIP,MAKER
ERHZ0000287
47 Kohm,1/16W ,F ,1005 ,R/TP
R200
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
R201
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
R202
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R203
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R204
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R205
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R206
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R207
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R208
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R209
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R210
RES,CHIP,MAKER
ERHZ0000441
22 ohm,1/16W ,J ,1005 ,R/TP
R211
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R212
RES,CHIP,MAKER
ERHZ0000286
4700 ohm,1/16W ,F ,1005 ,R/TP
R213
RES,CHIP,MAKER
ERHZ0000286
4700 ohm,1/16W ,F ,1005 ,R/TP
R214
RES,CHIP,MAKER
ERHZ0000286
4700 ohm,1/16W ,F ,1005 ,R/TP
R215
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
R216
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
R217
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
R218
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
U100
IC
EUSY0336502
, PIN,R/TP , ,; ,IC,Charge Pump
U101
IC
EUSY0319001
WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual

LDO
U200
IC
EUSY0316201
Capacitive sensing IC 32QFN ,32 PIN,R/TP ,Cap touch

controller IC
VA100
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA200
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ZD100
DIODE,TVS
EDTY0008610
SOD-523 ,5 V,250 W,R/TP ,PB-FREE
ZD101
DIODE,TVS
EDTY0008610
SAED00
PCB ASSY,KEYPAD,SMT
TOP
SAED0034401
LD200
DIODE,LED,CHIP
EDLH0015108
Description
Part Number

Spec
Color
Remark
RED ,ETC ,R/TP ,1.8x1.0x0.35T(sideview) ,; ,[empty]

,1.7~2.2V ,25mA ,57~112mcd ,631nm ,60mW ,[empty]
,[empty] ,2P
- 197 -
Level
Location
No.
LD201
DIODE,LED,CHIP
EDLH0015108

,[empty] ,2P
LD202
DIODE,LED,CHIP
EDLH0015108

,[empty] ,2P
LD203
DIODE,LED,CHIP
EDLH0015108

,[empty] ,2P
LD204
DIODE,LED,CHIP
EDLH0015108

,[empty] ,2P
LD205
DIODE,LED,CHIP
EDLH0015108

,[empty] ,2P
SPEY
PCB,KEYPAD
SPEY0062301
FR-4 , 0.5mm,BUILD-UP 6 , ,; , , , , , , , , ,
SJMY00
VIBRATOR,MOTOR
SJMY0008504
2.0 V,0.1 A,10*3.6 ,12mm linear motor ,; ,3V , , , , , , ,
104
SUSY00
SPEAKER
SUSY0028012
ASSY ,8 ohm,92 dB,1810 mm,10mm ,; , , , , , , ,WIRE
105
SVLM00
LCD MODULE
SVLM0034601
Main ,2.4" ,240*320 ,40.62*58.84*1.5T ,262K ,TFT ,TM

,R61520 , ,
B,11
SWCC00
CABLE,COAXIAL
SWCC0008801
74.5 mm,U.FL_U.FL, H=2.0, ?=0.8, white LINE, ,;

,[empty] ,[empty] ,[empty] , ,[empty] , ,[empty]
SAFY00
PCB ASSY,MAIN
SAFY0219798
SAFB00
PCB ASSY,MAIN,INSERT
SAFB0103102
BRAH00
RESIN,PC
BRAH0001301
SAJY00
PCB ASSY,SUB
SAJY0041905
SAJB00
PCB ASSY,SUB,INSERT
SAJB0020902
SAJE
PCB ASSY,SUB,SMT
SAJE0033804
SAJC
PCB ASSY,SUB,SMT
BOTTOM
SAJC0032502
ANT1
ANTENNA,GSM,FIXED
SNGF0048003
3.0 ,-2.0 dBd, ,BLUETOOTH, SMD, 3.0*1.5*1.1 ,;

,SINGLE ,-2.0 ,50 ,3.0
C1
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
C10
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
C11
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
C12
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C17
INDUCTOR,CHIP
ELCH0004704
4.7 nH,S ,1005 ,R/TP ,
C18
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C19
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C2
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Spec
Color
Remark
J, 48
; , , , ,[empty]
Black
C, 13
- 198 -

Level
Location
No.
C20
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C21
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C22
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C23
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C24
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C25
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C26
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C27
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C28
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C29
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C3
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C30
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
C31
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C32
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C4
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C5
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
C51
CAP,CERAMIC,CHIP
ECCH0000701
1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C6
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
C7
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
C8
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
C9
CAP,CERAMIC,CHIP
ECCH0000118
30 pF,50V,J,NP0,TC,1005,R/TP
CN2
CONNECTOR,ETC
ENZY0025801
6 ,1.0 mm,ETC , ,6.6x4x1.35(t), Stroke:-0.65, Touch

window Contact CNT
CN3
CONN,SOCKET
ENSY0024101
8 ,ETC , , mm,Block type, 13.5x11.12x0.5t
FB1
FILTER,BEAD,CHIP
SFBH0008101
600 ohm,1005 ,
FL1
FILTER,CERAMIC
SFCY0000901
2450 MHz,2.00*1.25*0.95 ,SMD ,Bluetooth Band Pass

Filter
J1
CONN,SOCKET
ENSY0021401
8 PIN,ETC , , mm,
L52
INDUCTOR,CHIP
ELCH0004721
2.2 nH,S ,1005 ,R/TP ,
LD1
DIODE,LED,MODULE
EDLM0009401
WHITE ,1 LED,3.5X2.8X0.6T ,R/TP ,
R12
RES,CHIP,MAKER
ERHZ0000422
15 Kohm,1/16W ,J ,1005 ,R/TP
R3
RES,CHIP
ERHY0000128
15K ohm,1/16W,F,1005,R/TP
U1
IC
EUSY0382201
FPBGA ,50 ,R/TP ,4.5x4.0x0.6, BT2.1 ,; ,IC,Bluetooth
Description
Part Number

Spec
- 199 -
Color
Remark
Level
Location
No.
VA21
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA22
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA23
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA24
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
X1
X-TAL
EXXY0024401
26 MHz,10 PPM,10 pF,.5 ohm,SMD ,32*25*0.6 ,. ,. ,.

,10PPM ,10 ,. ,. ,SMD ,P/TP
SAJD
PCB ASSY,SUB,SMT TOP
SAJD0035102
CN1
CONNECTOR,BOARD TO
BOARD
ENBY0039001
54 PIN,0.4 mm,ETC , ,H=1.5, P4S Header
SPJY
PCB,SUB
SPJY0068001
FR-4 ,0.4 mm,BUILD-UP 4 , ,; , , , , , , , , ,
SVCY00
CAMERA
SVCY0023101
CMOS ,MEGA ,5M AF Toshiba(1/3.2"),

9.5x9.5x6.6t,Parallel,90degree,FPCB
SAFF
PCB ASSY,MAIN,SMT
SAFF0140897
SAFC
PCB ASSY,MAIN,SMT
BOTTOM
SAFC0096906
C1
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C10
CAP,CHIP,MAKER
ECZH0001120
3.9 nF,50V ,K ,X7R ,HD ,1005 ,R/TP , , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty]
C101
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C2
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
C202
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C203
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C207
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C208
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C214
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C215
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C216
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C224
CAP,CERAMIC,CHIP
ECCH0005604

C226
CAP,CERAMIC,CHIP
ECCH0005604

C229
CAP,CERAMIC,CHIP
ECCH0005604

C242
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C243
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C245
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
Description
Part Number
Spec
- 200 -
Color
Remark

Level
Location
No.
C246
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C247
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C248
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C249
CAP,CHIP,MAKER
ECZH0000826
27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C250
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C251
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
C252
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C253
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C257
CAP,CHIP,MAKER
ECZH0001116
270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
C258
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C261
CAP,CERAMIC,CHIP
ECCH0005604

C262
CAP,CERAMIC,CHIP
ECCH0005604

C263
CAP,CERAMIC,CHIP
ECCH0005604

C265
CAP,TANTAL,CHIP
ECTH0004807
10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
C273
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C290
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C299
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C300
CAP,CHIP,MAKER
ECZH0000803
2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C3000
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
C3001
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
C303
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C304
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C305
CAP,CHIP,MAKER
ECZH0001217
470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C306
CAP,CHIP,MAKER
ECZH0001217
470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C307
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C401
CAP,CERAMIC,CHIP
ECCH0000143
C402
CAP,CERAMIC,CHIP
ECCH0000143
C403
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C404
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C405
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
Part Number

Spec
- 201 -
Color
Remark
Level
Location
No.
C406
CAP,CERAMIC,CHIP
ECCH0000143
C407
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C408
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C409
CAP,CERAMIC,CHIP
ECCH0000143
C410
CAP,CERAMIC,CHIP
ECCH0000143
C411
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C412
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C413
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C414
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C415
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C416
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
C417
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C418
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C419
CAP,CHIP,MAKER
ECZH0003503
1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
C501
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C502
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C503
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C504
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C505
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
C506
CAP,TANTAL,CHIP
ECTH0001902
10 uF,10V ,M ,L_ESR ,1608 ,R/TP
C507
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C508
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C509
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C510
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C523
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
C524
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C525
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C526
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C527
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C528
CAP,CHIP,MAKER
ECZH0001102
18000 pF,16V ,K ,X7R ,HD ,1005 ,R/TP
C529
CAP,CHIP,MAKER
ECZH0001102
18000 pF,16V ,K ,X7R ,HD ,1005 ,R/TP
C530
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
Part Number
Spec
- 202 -
Color
Remark

Level
Location
No.
C531
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C532
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C533
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C534
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
C535
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
C536
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
C600
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C602
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
C603
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C606
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C690
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C800
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C801
CAP,CERAMIC,CHIP
ECCH0000163
47 nF,10V,K,X5R,HD,1005,R/TP
C802
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C9
CAP,TANTAL,CHIP
ECTH0005704
33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
CN200
CONNECTOR,ETC
ENZY0027201
3 ,2.5 mm,ETC ,- ,-
CN400
CONNECTOR,I/O
ENRY0009601
5 ,0.4 mm,ANGLE , ,Mold with SUS ,; , ,0.40MM ,ANGLE

,RECEPTACLE ,DIP ,[empty] ,
CN500
CONNECTOR,BOARD TO
BOARD
ENBY0040301
34 PIN,0.4 mm,ETC , ,H=1.0, Socket
CN700
CONNECTOR,BOARD TO
BOARD
ENBY0043701
20 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT

,FEMALE ,SMD ,[empty] , ,
CN702
CONNECTOR,BOARD TO
BOARD
ENBY0039101
54 PIN,0.4 mm,ETC , ,H=1.5, P4S Socket
FB3
FILTER,BEAD,CHIP
SFBH0008102
1800 ohm,1005 ,Bead
FB4
FILTER,BEAD,CHIP
SFBH0008102
1800 ohm,1005 ,Bead
FB5
FILTER,BEAD,CHIP
SFBH0008102
1800 ohm,1005 ,Bead
FB500
FILTER,BEAD,CHIP
SFBH0000909
60 ohm,1005 ,
FL400
FILTER,EMI/POWER
SFEY0006501
SMD ,3 TERMINAL EMI FILTER
FL500
FILTER,EMI/POWER
SFEY0011701
SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF)
FL501
FILTER,EMI/POWER
SFEY0011701
FL502
FILTER,EMI/POWER
SFEY0011701
IC400
IC
EUSY0371201
WLP ,20 ,R/TP ,MUIC for 5Pin Micro USB ,; ,IC,Analog

Switch
Description
Part Number

Spec
- 203 -
Color
Remark
Level
Location
No.
IC500
IC
EUSY0360201
CSP ,20 ,R/TP ,Class D(mono) + Capless HP + A/S ,;

,IC,Audio Sub System
L200
INDUCTOR,CHIP
ELCH0004715
27 nH,J ,1005 ,R/TP ,
L201
INDUCTOR,CHIP
ELCH0004715
27 nH,J ,1005 ,R/TP ,
L202
INDUCTOR,CHIP
ELCH0001401
15 nH,J ,1005 ,R/TP ,Pb Free
L203
INDUCTOR,CHIP
ELCH0005018
39 nH,J ,1005 ,R/TP ,
L204
INDUCTOR,SMD,POWER
ELCP0008004
L205
INDUCTOR,SMD,POWER
ELCP0008004
L206
INDUCTOR,SMD,POWER
ELCP0008004
L400
INDUCTOR,CHIP
ELCH0001556
270 nH,J ,1608 ,R/TP ,
L800
INDUCTOR,CHIP
ELCH0003811
1000 nH,K ,1608 ,R/TP ,COIL TYPE
Q2000
TR,FET,P-CHANNEL
EQFP0009401
SC75-6 ,19 W,-20 V,-12 A,R/TP ,P-Channel FET ,; ,PCHANNEL ,MOSFET ,-20 ,8 ,-12 ,0.041 ,19 ,SC75 ,R/TP
,6P
R10
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
R11
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
R12
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
R13
RES,CHIP
ERHY0003201
1000 ohm,1/16W ,F ,1005 ,R/TP
R14
RES,CHIP
ERHY0003201
1000 ohm,1/16W ,F ,1005 ,R/TP
R2
RES,CHIP,MAKER
ERHZ0000434
1 ohm,1/16W ,J ,1005 ,R/TP
R207
RES,CHIP,MAKER
ERHZ0000268
33 Kohm,1/16W ,F ,1005 ,R/TP
R208
RES,CHIP
ERHY0003201
1000 ohm,1/16W ,F ,1005 ,R/TP
R209
RES,CHIP,MAKER
ERHZ0000222
150 Kohm,1/16W ,F ,1005 ,R/TP
R291
RES,CHIP
ERHY0003201
1000 ohm,1/16W ,F ,1005 ,R/TP
R299
RES,CHIP,MAKER
ERHZ0000323
91 Kohm,1/16W ,F ,1005 ,R/TP
R301
RES,CHIP
ERHY0024201
6040 ohm,1/16W ,F ,1005 ,R/TP ,; ,6040 ,1% ,1/16W

,1005 ,R/TP
R302
RES,CHIP,MAKER
ERHZ0000204
100 Kohm,1/16W ,F ,1005 ,R/TP
R303
RES,CHIP,MAKER
ERHZ0000428
18 ohm,1/16W ,J ,1005 ,R/TP
R304
RES,CHIP,MAKER
ERHZ0000428
18 ohm,1/16W ,J ,1005 ,R/TP
R305
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
R306
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R307
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R316
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Spec
Color
Remark
4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD

,2.5X2X1MM ,11MM ,R/TP
- 204 -

Level
Location
No.
R391
RES,CHIP,MAKER
ERHZ0000484
470 ohm,1/16W ,J ,1005 ,R/TP
R399
RES,CHIP,MAKER
ERHZ0000484
470 ohm,1/16W ,J ,1005 ,R/TP
R4
RES,CHIP
ERHY0003201
1000 ohm,1/16W ,F ,1005 ,R/TP
R400
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
R401
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
R402
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
R408
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R409
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R410
RES,CHIP
ERHY0000147
56K ohm,1/16W,F,1005,R/TP
R411
RES,CHIP
ERHY0000161
200K ohm,1/16W,F,1005,R/TP
R490
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R491
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R5
RES,CHIP
ERHY0003201
1000 ohm,1/16W ,F ,1005 ,R/TP
R500
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R501
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R502
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R503
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R504
RES,CHIP,MAKER
ERHZ0000206
10 ohm,1/16W ,F ,1005 ,R/TP
R505
RES,CHIP,MAKER
ERHZ0000463
33 ohm,1/16W ,J ,1005 ,R/TP
R508
RES,CHIP,MAKER
ERHZ0000410
12 ohm,1/16W ,J ,1005 ,R/TP
R509
RES,CHIP,MAKER
ERHZ0000410
12 ohm,1/16W ,J ,1005 ,R/TP
R6
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R7
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
R8
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
R800
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
R801
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
R803
RES,CHIP,MAKER
ERHZ0000439
200 Kohm,1/16W ,J ,1005 ,R/TP
R9
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
SW1
SWITCH,TACT
ESCY0004401
12 V,0.02 A,HORIZONTAL ,1 G,
SW100
CONN,RF SWITCH
ENWY0003901
,SMD , dB,
SW101
CONN,RF SWITCH
ENWY0005301
,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER

,SMD ,R/TP ,AU , ,
Description
Part Number

Spec
- 205 -
Color
Remark
Level
Location
No.
U301
Description
Part Number
Spec
IC
EUSY0369201
CSP ,424 ,R/TP ,HSDPA3.6,CAM3M,AAC+,MP4,H.264 ,;

,IC,Digital Baseband Processor
U400
IC
EUSY0362803
FBGA ,149 ,ETC ,FULLY 1.8V 2G(LB/128Mx16)

NAND+1G(DDR/16Mx4x16) SDRAM ,; ,IC,MCP
U401
IC
EUSY0374601
TDFN ,8 ,R/TP ,Programmable OVP ,; ,IC,Charger
U501
IC
EUSY0355701
PLP1010-4 ,4 PIN,R/TP ,150mA 2.8V Single LDO ,;

,IC,Voltage Regulator
U502
IC
EUSY0319001
WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual

LDO
U601
IC
EUSY0200803
MFL ,8 ,R/TP ,Haptic Driver IC,2X2 ,; ,IC,Motor Driver
U602
IC
EUSY0373901
PLP1010 ,4 ,R/TP ,150mA, 3.0V Single LDO ,; ,IC,LDO

Voltage Regulator
U603
IC
EUSY0385901
WL-CSP(BSC) ,20 ,R/TP ,FM Tuner (RDS), 2.6*2.6*0.64

,; ,IC Assembly
U800
IC
EUSY0264502
DFN ,14 PIN,R/TP ,700mA Boost converter ,; ,IC,DC,DC

Converter
VA200
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA400
VARISTOR
SEVY0007301
5 V,<0.5pF ,SMD ,
VA500
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA501
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA502
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA503
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA504
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA800
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
VA801
VARISTOR
SEVY0001001
14 V, ,SMD ,50pF, 1005
X200
X-TAL
EXXY0016601
32.768 KHz,20 PPM,9 pF,65 Kohm,SMD ,4.9*1.8*0.9 ,
ZD200
DIODE,TVS
EDTY0008601
ZD400
DIODE,TVS
EDTY0008602
SOD-323 ,13.3 V,400 W,R/TP ,PB-FREE
SAFD
PCB ASSY,MAIN,SMT TOP
SAFD0096107
BAT200
BATTERY,CELL,LITHIUM
SBCL0002001
3 V,1 mAh,COIN ,3V, SMT type Backup Batt,

Coin(4.8mm, 1.4t) , Pb-Free ,; ,3 ,1mAh ,COIN
C100
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
C103
CAP,CERAMIC,CHIP
ECCH0000143
C104
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C105
CAP,CERAMIC,CHIP
ECCH0000143
C106
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
- 206 -
Color
Remark

Level
Location
No.
C108
CAP,CERAMIC,CHIP
ECCH0000184
2.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C110
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C111
CAP,CHIP,MAKER
ECZH0000844
68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C112
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C113
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C114
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C115
CAP,CHIP,MAKER
ECZH0001002
0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
C116
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C118
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C120
INDUCTOR,CHIP
ELCH0003836
5.6 nH,S ,1005 ,R/TP ,MLCI
C121
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
C122
CAP,CERAMIC,CHIP
ECCH0000143
C123
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C124
CAP,TANTAL,CHIP
ECTH0002701
2.2 uF,10V ,M ,STD ,1608 ,R/TP
C125
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C126
CAP,CERAMIC,CHIP
ECCH0000129
120 pF,50V,J,NP0,TC,1005,R/TP
C127
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
C128
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C129
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C130
CAP,CERAMIC,CHIP
ECCH0000109
8 pF,50V,D,NP0,TC,1005,R/TP
C131
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C132
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C133
CAP,CERAMIC,CHIP
ECCH0000195
3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C134
CAP,CERAMIC,CHIP
ECCH0000195
3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C138
CAP,TANTAL,CHIP
ECTH0002701
2.2 uF,10V ,M ,STD ,1608 ,R/TP
C139
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
C140
CAP,CERAMIC,CHIP
ECCH0000143
C142
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C143
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
C144
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
C145
CAP,TANTAL,CHIP
ECTH0001902
10 uF,10V ,M ,L_ESR ,1608 ,R/TP
C146
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
Description
Part Number

Spec
- 207 -
Color
Remark
Level
Location
No.
C147
CAP,CHIP,MAKER
ECZH0001120
3.9 nF,50V ,K ,X7R ,HD ,1005 ,R/TP , , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty]
C149
CAP,CERAMIC,CHIP
ECCH0000180
3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C150
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C151
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C152
CAP,CHIP,MAKER
ECZH0001002
0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
C153
CAP,CHIP,MAKER
ECZH0001002
0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
C154
CAP,CERAMIC,CHIP
ECCH0000196
0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C155
CAP,CERAMIC,CHIP
ECCH0000196
0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
C157
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C158
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C160
CAP,CERAMIC,CHIP
ECCH0000143
C162
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C163
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C164
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
C165
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
C204
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C205
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C206
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C209
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C210
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C211
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C212
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C213
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C217
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C218
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C219
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C220
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C221
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C222
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C223
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C225
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
Description
Part Number
Spec
- 208 -
Color
Remark

Level
Location
No.
C227
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C228
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C230
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C231
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
C232
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C233
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C234
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C235
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C236
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C237
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C238
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C239
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C240
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C241
CAP,CERAMIC,CHIP
ECCH0005603
2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
C254
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C256
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C259
CAP,CERAMIC,CHIP
ECCH0007802
4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
C260
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
C264
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
C281
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C291
CAP,CHIP,MAKER
ECZH0003103
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
C3
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
C399
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
C5
CAP,CERAMIC,CHIP
ECCH0000113
18 pF,50V,J,NP0,TC,1005,R/TP
CN300
CONNECTOR,BOARD TO
BOARD
ENBY0018501
10 PIN,.4 mm,STRAIGHT , ,H=0.9,HEADER
CN701
CONNECTOR,BOARD TO
BOARD
ENBY0031501
70 PIN,0.4 mm,ETC , ,H=1.5, Socket
FB700
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FB701
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FB702
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FB703
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FB704
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
Description
Part Number

Spec
- 209 -
Color
Remark
Level
Location
No.
Description
Part Number
FB705
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FB706
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FB707
FILTER,BEAD,CHIP
SFBH0000912
1000 ohm,1005 ,
FL100
FILTER,SEPERATOR
SFAY0013101
GSM Quad ,UMTS Triple ,3.6 dB,1.25 dB,27 dB,25

dB,4532 ,QSC6240_6270 FEM
FL102
FILTER,SAW
SFSY0037501
897.5 MHz,1.4*1.1*0.6 ,SMD ,880.48M~914.52M, IL 4.0,

5pin, U-U, 50-50, W-BAND VIII Tx ,; ,897.5 ,1.4*1.1*0.6
,SMD ,R/TP
FL103
FILTER,SAW
SFSY0035101
1950 MHz,1.4*1.1*0.45 ,SMD ,1920M~1980M, IL 3.2,

5pin, U-U, 50-50, WCDMA BAND I Tx ,; ,1950
,1.4*1.1*0.45 ,SMD ,R/TP
FL105
DUPLEXER,IMT
SDMY0002101
897.5 MHz,942.5 MHz,2.8 dB,3.5 dB,50 dB,43

dB,2.5*2.0*0.55 ,SMD ,SAW, Band8 Rx balanced type ,;
,942.5 ,925.48 to 959.52 ,897.5 ,880.48 to 914.52 ,3.5
,2.8 ,2.5x2.0x0.55 ,DUAL ,SMD ,R/TP
FL107
FILTER,SAW
SFSY0037601
897.5 MHz,1.4*1.1*0.4 ,SMD ,880M~915M, IL 3.6, 5pin,

U-U, 50-50, W-BAND VIII Tx ,; ,897.5 ,1.4*1.1*0.4 ,SMD
,R/TP
FL120
DUPLEXER,IMT
SDMY0002601
1950 MHz,2140 MHz,1.9 dB,2.6 dB,55 dB,46

dB,2.5*2.0*0.89 ,SMD ,Band1, Rx balance type, SAW ,;
,2140 ,2112.4 to 2167.6 ,1950 ,1922.4 to 1977.6 ,2.6 ,1.9
,2.5x2.0x0.89 ,DUAL ,SMD ,R/TP
FL700
FILTER,EMI/POWER
SFEY0013201
SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm
FL701
FILTER,EMI/POWER
SFEY0013201
FL702
FILTER,EMI/POWER
SFEY0013201
FL703
FILTER,EMI/POWER
SFEY0013201
FL704
FILTER,EMI/POWER
SFEY0013201
L1
INDUCTOR,CHIP
ELCH0004727
100 nH,J ,1005 ,R/TP ,
L100
INDUCTOR,CHIP
ELCH0012510
15 nH,G ,1005 ,R/TP ,chip coil
L105
INDUCTOR,CHIP
ELCH0001049
6.8 nH,J ,1005 ,R/TP ,PBFREE
L107
INDUCTOR,CHIP
ELCH0001057
3.9 nH,S ,1005 ,R/TP ,PBFREE
L108
INDUCTOR,CHIP
ELCH0003820
3 nH,S ,1005 ,R/TP ,PBFREE
L110
INDUCTOR,CHIP
ELCH0001031
15 nH,J ,1005 ,R/TP ,PBFREE
L112
INDUCTOR,CHIP
ELCH0001417
33 nH,J ,1005 ,R/TP ,PBFREE
L117
INDUCTOR,CHIP
ELCH0004726
1.5 nH,J ,1005 ,R/TP ,
L119
INDUCTOR,CHIP
ELCH0001403
1 nH,S ,1005 ,R/TP ,PBFREE
L121
INDUCTOR,CHIP
ELCH0001420
L122
INDUCTOR,CHIP
ELCH0003826
3.3 nH,S ,1005 ,R/TP ,chip
L123
INDUCTOR,CHIP
ELCH0001401
15 nH,J ,1005 ,R/TP ,Pb Free
Spec
- 210 -
Color
Remark

Level
Location
No.
L124
INDUCTOR,CHIP
ELCH0004706
10 nH,J ,1005 ,R/TP ,
L126
INDUCTOR,CHIP
ELCH0001411
L127
INDUCTOR,CHIP
ELCH0004720
1.2 nH,S ,1005 ,R/TP ,
L130
INDUCTOR,CHIP
ELCH0001420
L199
INDUCTOR,CHIP
ELCH0003826
3.3 nH,S ,1005 ,R/TP ,chip
L2
INDUCTOR,CHIP
ELCH0004727
100 nH,J ,1005 ,R/TP ,
R100
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
R101
RES,CHIP,MAKER
ERHZ0000219
150 ohm,1/16W ,F ,1005 ,R/TP
R102
RES,CHIP,MAKER
ERHZ0000473
39 ohm,1/16W ,J ,1005 ,R/TP
R103
RES,CHIP
ERHY0000105
51 ohm,1/16W,F,1005,R/TP
R104
RES,CHIP,MAKER
ERHZ0000458
300 ohm,1/16W ,J ,1005 ,R/TP
R105
RES,CHIP,MAKER
ERHZ0000458
300 ohm,1/16W ,J ,1005 ,R/TP
R106
RES,CHIP
ERHY0009504
1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
R107
RES,CHIP,MAKER
ERHZ0000428
18 ohm,1/16W ,J ,1005 ,R/TP
R108
RES,CHIP,MAKER
ERHZ0000243
2200 ohm,1/16W ,F ,1005 ,R/TP
R109
RES,CHIP
ERHY0009504
1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
R110
RES,CHIP
ERHY0009504
1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
R111
RES,CHIP
ERHY0009504
1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
R112
RES,CHIP,MAKER
ERHZ0000219
150 ohm,1/16W ,F ,1005 ,R/TP
R205
RES,CHIP,MAKER
ERHZ0000486
47 Kohm,1/16W ,J ,1005 ,R/TP
R290
RES,CHIP
ERHY0000254
4.7K ohm,1/16W,J,1005,R/TP
R390
RES,CHIP,MAKER
ERHZ0000437
2 Kohm,1/16W ,J ,1005 ,R/TP
R6000
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6001
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6002
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6003
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6004
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6005
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6006
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R6007
RES,CHIP,MAKER
ERHZ0000457
30 ohm,1/16W ,J ,1005 ,R/TP
R650
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
RA650
RES,ARRAY,R
ERNR0000404
100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP
Description
Part Number

Spec
- 211 -
Color
Remark
Level
Location
No.
SPFY02
Description
Part Number
Spec
PCB,MAIN
SPFY0203001
FR-4 ,0.8 mm,LX-BUMP 10 , ,; , , , , , , , , ,
U100
PAM
SMPY0021201
27.5 dBm, %,3 mA,-37 dBc,28 dB,4x4 ,SMD ,3G Band 8

Single PAM H/F ,; , , , , , , , ,LGA ,R/TP ,
U101
COUPLER,RF
DIRECTIONAL
SCDY0004401
19.4 dB,0.25 dB,32 dB,1.0*0.5*0.4 ,SMD ,Pbfree_DCN+JCDMA ,; ,[empty] ,874.5MHz ,101MHz ,SMD
,R/TP
U102
PAM
SMPY0019901
dBm, %, A, dBc, dB,4x4 ,SMD ,3G Band 1 Single Band ,;

, , , , , , , ,LGA ,R/TP ,
U103
COUPLER,RF
DIRECTIONAL
SCDY0004301
20.5 dB,0.22 dB,34 dB,1.0*0.5*0.4 ,SMD

,Pb_free_KPCS+USPCS+WCDMA ,; ,[empty] ,1865MHz
,230MHz ,SMD ,R/TP
U104
PAM
SMPY0020901
35 dBm,50 %, A, dBc, dB,5x5x1.1 ,SMD ,TQM7M5012

Halogen Free version ,; , , , , , , , ,LGA ,R/TP ,12
VA309
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA310
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA311
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA312
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA313
VARISTOR
SEVY0003601
5.6 V, ,SMD ,100pF, 1005
VA651
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA652
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA653
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA654
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA655
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA656
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA657
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA658
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
VA700
VARISTOR
SEVY0004301
18 V, ,SMD ,10pF, 1005
X100
VCTCXO
EXSK0004802
19.2 MHz,1.5 PPM,10 pF,SMD ,3.2*2.5*1.2 , ,; ,19.2 Mhz

,1.5PPM ,2.8V ,3.2 ,2.5 ,1.2 , ,SMD ,P/TP
- 212 -
Color
Remark

12.3 Accessory
Level
Location
No.
SBPL00
Description

Part Number
Spec
Remark
100
BATTERY PACK,LI-ION
SBPL0097801
3.7 V,900 mAh,1 CELL,PRISMATIC ,553443, Standard

pack, Wolrdwide Label ,; , , , ,PRISMATIC , , ,BLACK , ,
BLACK
BATTERY PACK,LI-ION
SBPL0098301
3.7 V,900 mAh,1 CELL,PRISMATIC

,553443,INNERPACK,WW ,; ,3.7 ,900 ,180 ,PRISMATIC
,5.5X34X43 ,6.1X44X36.5 ,BLACK ,INNERPACK ,
BLACK
SGDY00
DATA CABLE
SGDY0014302
; ,[empty] ,[empty] ,1.2M , ,BLACK ,1.2m, 4, Shield case

MicroUSB, ID resistor open ,N
SGEY00
HEADSET
SGBS0004609
HBM-210 BGFSBKK ,French,CD Manual,WEEE Card
SSAD00
ADAPTOR,AC-DC
SSAD0031001
100-240V ,5060 Hz,5.1 V,0.7 A,CE ,STA-U12ED, Europe,

Cableless ,; , ,5.1 ,0.7 , , ,WALL 2P ,USB ,
ADAPTOR,AC-DC
SSAD0031002
100-240V ,5060 Hz,5.1 V,0.7 A,CE ,STA-U12ER, Europe,

Cableless ,; , ,5.1 ,0.7 , , ,WALL 2P ,USB ,
Color

- 213 -
Note
- 214 -


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Service Manual

Internal Use Only

Date: September, 2009 / Issue 1.0

4.16 Receiver Path ........................................................100

1.1 Purpose ......................................................................5

4.17 Headset path.........................................................103

1.2 Regulatory Information .................................................5

4.18 Speaker phone path ..............................................105

4.20 Headset microphone ..............................................110

2.1 Product Name .............................................................7

5. Download ................................................... 112

2.3 Main Parts : GSM Solution ...........................................7

2.4 HW Features ..............................................................8

5.2 Downloading Procedure ...........................................113

2.5 SW Features .............................................................10

5.3 Troubleshooting Download Errors ..............................129

2.6 HW SPEC. .................................................................12

5.4 Caution ...................................................................134

6. Block Diagram ........................................... 135

3.1 GENERAL DESCRIPTION.............................................16

7. CIRCUIT DIAGRAM ...................................... 145

3.2 GSM MODE...............................................................17

8. BGA Pin Map .............................................. 159

3.5 OFF-CHIP COMPONENTS ...........................................29

10. Calibration................................................ 175

3.8 SUB SYSTEM ............................................................50

4. TROUBLE SHOOTING ..................................... 57

12. EXPLODED VIEW & REPLACEMENT

4.1 RF Component ..........................................................57

12.1 EXPLODED VIEW ...................................................187

4.4 Trouble Shooting of WCDMA part ................................69

Copyright 2009 LG Electronics. Inc. All right reserved.

LGE Internal Use Only

LGE Internal Use Only

Copyright 2009 LG Electronics. Inc. All right reserved.

E. Notice of Radiated Emissions

Copyright 2009 LG Electronics. Inc. All right reserved.

LGE Internal Use Only

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

LGE Internal Use Only

Copyright 2009 LG Electronics. Inc. All right reserved.

2.2 Supporting Standard

2.3 Main Parts : GSM Solution

Copyright 2009 LG Electronics. Inc. All right reserved.

LGE Internal Use Only

LGE Internal Use Only

2) Packing Type : Soft Pack

@ Paging Period 5 (2G)

Main : Internal Fixed Type

Copyright 2009 LG Electronics. Inc. All right reserved.

Copyright 2009 LG Electronics. Inc. All right reserved.

LGE Internal Use Only

Quick Access Mode

Dialing / Call Log / Contact / Menu /

Last Dial Number

LGE Internal Use Only