The Role of Sodium Chloride On Surface Properties of Chalcopyrite Leached With Ferric Sulphate
The Role of Sodium Chloride On Surface Properties of Chalcopyrite Leached With Ferric Sulphate
The Role of Sodium Chloride On Surface Properties of Chalcopyrite Leached With Ferric Sulphate
www.elsevier.com/locate/hydromet
Abstract
Leaching of chalcopyrite in oxidizing conditions usually results in low copper extraction due to mineral passivation. It has been
proposed that sodium chloride has a positive effect on chalcopyrite dissolution increasing copper extraction. Aiming to bring
further insight into this topic, the present work seeks to evaluate the influence of sodium chloride on the leaching of chalcopyrite
focusing on surface area and porosity of the reaction products formed during leaching. A finely ground (d50 = 5.5 m) chalcopyrite
concentrate assaying 25.2% iron, 30.9% sulphur and 27.5% copper was leached in oxygenated ferric sulphate solutions at
atmospheric pressure and 95 C. It has been observed that although sodium chloride favoured natrojarosite precipitation, which
reduced the total iron concentration during leaching, copper extractions as high as 91% were accomplished as compared to 45%
copper extraction in the absence of NaCl. It is suggested that sodium chloride reduces chalcopyrite passivation and complexes Cu
(I) ions adding a second redox couple to the system. Furthermore, morphologic characterization of the reaction products performed
by SEM analyses as well as specific surface area and porosity measurements have confirmed that NaCl increases surface area and
porosity of the product layer, which explains the high copper extractions observed in the presence of the salt.
2007 Elsevier B.V. All rights reserved.
jarosite precipitation on the leaching residue. After 4 h concentrations, at 95 C. Fig. 1 shows the percentage of
leaching time, the solids were filtered, washed with copper leached from the concentrate. When chloride
distilled water and dried at 55 C, for 24 h. ions are absent, it can be seen that the leaching is very
Surface area and pore volume were determined by slow, with only 45% of the copper being extracted in a
nitrogen adsorption. Nitrogen isotherms were performed period of 10 h. This result is consistent with the slow
with a Nova 1000 High Speed Gas Sorption Analyzer kinetics observed in other studies of chalcopyrite
(Quantachrome). Sample degassing was carried out at leaching on sulphate systems (Hackl et al., 1995; Hirato
ambient temperature for 24 h to avoid (or minimize) et al., 1986; Jones and Peters, 1976; Majima et al., 1985;
effects of high temperature degassing on the sulphur Munoz et al., 1979). According to these previous works
layer formed during leaching. Nitrogen adsorption was the low copper extraction can be credited to the
performed at 196 C. Data were collected from a passivation of chalcopyrite surface. Fig. 1 also shows
relative pressure (p/p0) of 0.05 to 0.98. that at 0.5 mol/L Cl, copper dissolution increases to
Total surface area was calculated using the Brunauer 55%. Much better extractions are observed for higher
Emmett Teller (BET) adsorption isotherm model NaCl concentrations as copper dissolution reaches a
(Rouquerol and Sing, 1999) for the nitrogen isotherm maximum slightly above 90%, at 1.02.0 mol/L NaCl.
data. Surface area was calculated from the slope and y- These results confirm the positive effect of the presence
intercept of the linear region of the BET transformation of chloride ions on chalcopyrite leaching (Carneiro and
versus relative pressure plots. The nitrogen adsorption Leo, 2005; Hirato et al., 1986; Majima et al., 1985;
desorption data were also used to calculate the total Skorobian et al., 2005). Under similar conditions to
micro-pore volume and micro-pore surface area using those of the present work, Carneiro and Leo (2005)
the DubininRadushkevich (DR) potential theory. The have shown that the presence of sodium chloride also
micro-pore volume was calculated as the y-intercept of a increased chalcopyrite leaching with ferric chloride.
plot of the adsorption data in the following equation However, the effect was less pronounced: copper
(Rouquerol and Sing, 1999): extraction increased from 70% (without NaCl) to 81%
(1 mol/L NaCl). As in the present work copper dissolution
logV logV0 Dlogp=p0 2 2
increased from 45% (no NaCl) to 91% (1 mol/L NaCl),
where V and V0 are the volume of nitrogen adsorbed and chloride addition has a more important role on leaching
micro-pore volume, respectively, p/p0 the relative with Fe2(SO4)3 than FeCl3.
pressure, and D is a constant related to the energy of Total iron and Fe(II) concentrations are depicted in
adsorption. Surface area and porosity results were Figs. 2 and 3, respectively. Both figures show that the
obtained from at least three determinations for 95% total iron content is lower and Fe(II) concentrations are
confidence interval (Filfield and Kealey, 1995). higher in the presence of NaCl. In those experiments
where NaCl is added, Na+ ions led to the precipitation of
2.3. Scanning electron microscopy natrojarosite (reaction 3 and Fig. 4) reducing the Fe(III)
concentration during the experiments. Natrojarosite is
Scanning electron microscopy (SEM) was used to not observed in the experiments performed without
examine the morphology of the leach residues. The NaCl. Interestingly, the observed higher Fe(III)
samples were coated with graphite by electro-deposition,
using a Jeol JEE 4C instrument and investigated by a
JEOL JSM 5510 scanning electron microscope (SEM),
with an accelerating voltage 0.530 kV and equipped
with a spectrometer for micro-analysis based on an
energy dispersive X-ray spectroscopy system (EDS).
3. Results
Fig. 4. X-ray diffraction of the residue produced during chalcopyrite leaching with ferric sulphate and sodium chloride. Experimental conditions: d50:
5.5 m; 50 g/L Fe3+; 1 mol/L NaCl; pH 0.15 (initial); 0.45 L/min O2; 5.0% solids (w/v); temperature: 95 C; 10 h leaching time.
leaching, a lamellar film is noticed covering the residue to leach chalcopyrite with chloride ions (FeCl2, CuCl2).
produced in the absence of chloride ions (Fig. 5(b) and These processes are far more common than those
(c)). It seems that the reaction product has grown based on the chloride/sulphate route. The former
following the morphology of the chalcopyrite particle include the CLEAR, CUPREX, CYMET, Minemet,
which is consistent with the observations of Majima et and Outokumpu, among other processes. All of them
al. (1985). Nevertheless, in the presence of NaCl the can be represented, essentially, by the following set of
elemental sulphur morphology is different (Fig. 5(d) and equations:
(e)). A more dense structure is formed and grows in
preferential directions suggesting some crystalline CuFeS2 Cu Fe2 2S0 3e 4
structure. Lu et al. (2000a,b,c) proposed that the reaction
product is elemental sulphur in both cases. In the present Cu nCl CuCln 1n 5
work, X-ray diffraction showed the presence of
elemental sulphur in the residue (Fig. 4) although it There is, however, an important difference as
was not seen by SEMEDS on the chalcopyrite surface. compared to ferric sulphate leaching. As cuprous ions
EDS always showed a phase formed by sulphur, copper are stable in chloride systems, the Cu(II)/Cu(I) couple
and iron, where the sulphur content was higher than in (instead of Fe(III)/Fe(II)) becomes the main chalcopyr-
the concentrate. As EDS and X-ray diffraction did not ite oxidant provided enough chloride is available:
confirm the presence of jarosite as the reaction product, CuFeS2 3Cu2 4Cu Fe2 2S 6
it is suggested that the main reaction product was
elemental sulphur. These processes were carried out at low pressure and
The positive effects of chloride ions on chalcopyrite therefore fine milled concentrates and leaching near the
leaching enabled the development of a series of processes solution boiling point were required for higher than 95%
Table 1
Surface parameters of chalcopyrite concentrate and residues of ferric sulphate leaching with and without sodium chloride
Parameter Chalcopyrite concentrate Residue after Fe2(SO4)3 Residue after Fe2(SO4)3
leaching with NaCl leaching without NaCl
Surface area (m2/g) 1.51 0.23 1.41 0.01 1.00 0.04
Microporous volume (cm3/g) (6.60 0.84) 10 4 (6.28 0.05) 10 4 (4.48 0.06) 10 4
Microporous area (m2/g) 1.86 0.23 1.78 0.01 1.27 0.02
Leach residues produced under the following experimental conditions: d50: 5.5 m; pH: 0.0 (initial); 50 g/L Fe3+; 0.45 L/min O2; 5.0% solids (w/v);
temperature: 95 C; time: 4 h. NaCl: 1.0 mol/L.
78 M.F.C. Carneiro, V.A. Leo / Hydrometallurgy 87 (2007) 7382
Fig. 5. Secondary electron micrograph of chalcopyrite before leaching. (a) Leach residues produced in the absence of NaCl: 3000 (b) and 6000 (d);
leach residues obtained in the presence of NaCl: 4000 (d) and 8000 (e). Panels (b) and (c) as well as panels (d) and (e) show the same particle,
respectively.
copper extractions. Either gaseous oxygen or Fe(III) copper grains suitable to be melted without significant
reoxidised Cu(I) to Cu(II) ensuring a high potential metal oxidation. The Minemet process extracted copper
during leaching. Copper was recovered by different from the pregnant solution with LIX-65N after oxygen
routes. The CLEAR process added powdered metallic injection to oxidize copper to Cu(II). After scrubbing the
copper to the pregnant solution to reduce all copper to chloride ions, the loaded organic was stripped with
Cu(I). Then, copper was produced by electrolysis using sulphuric acid so that a conventional acidic CuSO4
a diaphragm cell. High current densities were applied solution was produced and electrowon. The Cuprex
and together with mechanical agitation produced coarse process applied a different extractant (ACORGA CLX
M.F.C. Carneiro, V.A. Leo / Hydrometallurgy 87 (2007) 7382 79
50) to selectively extract cupric chloride. Then, the chloride complexes. Chloride can complex and stabilize
loaded organic was stripped with water to produce a Cu(I) ions thereby increasing copper solubility although
concentrated CuCl2 solution. This solution was electro- high Cl concentrations are required to avoid CuCl
lyzed in the presence of cation-selective membrane precipitation.
producing high purity copper powders. Silver recovery Considering the high ionic concentrations in leaching
is usually a drawback in these processes (with the systems, NIST database shows 4 Cu(I)Cl complexes at
exception of the Cuprex process), as it was not easily high ionic strength (I = 5.0): CuCl 0 (log 1 = 2.7);
removed from the pregnant solution and followed CuCl2 (log 2 = 6.1); CuCl3 2 (log 3 = 6.0); Cu2Cl4 2
copper during electrowinning (Dutrizac, 1992). More (log 4 = 13.0). Conversely, only one complex is listed
recently, Outokumpu has proposed a similar process for Cu(II) with a low stability constant (CuCl+, log
where chalcopyrite leaching is performed at atmo- 1 = 0.17). Fe(III) and Fe(II) also show only one
spheric pressure with a chlorinecupric chloridebrine chlorocomplex each: Fe(III)Cl with a higher stability
solution. In this process, chlorine oxidizes Cu(I) to Cu (FeCl+ 2, log 1 = 1.3); as compared to Fe(II)Cl+ (log
(II) and copper is recovered from the purified leach 1 = 0.2, I = 0); i.e. unlike Cu(I), cupric copper and iron
solution by precipitating cuprous oxide with caustic ions do not show strong chloride complexes (Martell
soda. Then, metallic copper is produced by hydrogen and Smith, 2003).
reduction. Chlorine is regenerated using chloroalkali Despite some controversy, recent studies have
cell technology (Dreisinger, 2004). suggested that copper is monovalent in the chalcopyrite
Mixed sulphate/chloride systems are represented by structure (Boekema et al., 2004; Pearce et al., 2006). A
the Noranda process in which chalcopyrite was comprehensive discussion of copper and iron oxidation
converted to solid CuSO4Cu(OH)2 instead of cupric states in chalcopyrite is beyond the scope of the present
or cuprous ions, at 135145 C and 1370 KPa oxygen. work, but considering that copper is present in
Hematite and elemental sulphur were also produced. chalcopyrite as Cu+ 1, it would be complexed by Cl
Basic copper sulphate was then leached in a pH 2.5 during leaching. Therefore, chloride would enhance
sulphuric acid solution. Using a similar approach, the leaching by increasing copper(I) solubility as Cu(I)
CESL process uses pressure oxidation (150 C, 700 KPa complexes. Notwithstanding, the oxidizing conditions
O2, 1100 KPa total pressure) with chloride (12 g/L Cl) prevailing during leaching in the present work (presence
as a catalyst to produce CuSO4Cu(OH)2 which is of Fe(III) and oxygen) make this assumption unlikely as
leached by sulphuric acid. Gold is recovered from the the ferric chloride oxidation of cuprous ions (Eq. (7)) is
residue by cyanidation following elemental sulphur one of the key reactions during ferric chloride leaching
removal, so that cyanide consumption is reduced of chalcopyrite (Dutrizac, 1992; Winand, 1991).
(Defreyne et al., 2004).
Fe3 Cu Fe2 Cu2 DE 0 0:1 V 7
4. Discussion
In addition, Eh measurements have shown potentials
The improvement on chalcopyrite leaching by in the range 700425 mV (Ag/AgCl) during the whole
chloride ions was soon recognized. As early as 1970s, experiment of the present work which is above the rest
researches on chalcopyrite leaching had highlighted that potential of Cu(I) oxidation to Cu(II) (600 mV, versus
ferric chloride gives faster leaching kinetics than ferric SHE, at 0.1 mol/L CuCl2, 0.1 mol/L CuCl, 0.2 mol/L
sulphate (Gupta and Mukherjee, 1990; Jones and Peters, HCl, 3.0 mol/L NaCl) (Hirato et al., 1987). Regarding
1976). This improvement is credited, at least, to the the kinetics of copper(I) oxidation by Fe(III) no
following reasons: (i) formation of copper chloride information could be found, but it has been observed
complexes; (ii) increase in the anodic current during that provided enough Fe(III) is available, Cu(II) was the
chalcopyrite leaching, (iii) changes on the surface form only copper species observed during chalcopyrite
and properties of the reaction product. These aspects leaching with ferric chloride (O'Malley and Liddell,
will be discussed in light of the results of the present 1987) which suggests that Cu(I) oxidation by Fe(III) is
work. fast. Furthermore, copper(I) oxidation on the surface of
chalcopyrite in the presence of chloride ions is also fast
4.1. Copperchloride complexes (Yamakawa and Hine, 1970). Therefore Cu(I) concen-
trations in oxidizing systems should be low and would
Some authors have attributed the increase in copper not explain the high chalcopyrite dissolution in the
leaching from chalcopyrite to the formation of copper presence of chloride ions. Chloride effects are thus
80 M.F.C. Carneiro, V.A. Leo / Hydrometallurgy 87 (2007) 7382
related to the electrochemistry of leaching and surface (Hirato et al., 1987). The evidences of this phenomenon
properties as will be discussed in the next paragraphs. are the increase in the mixed potential during chalco-
pyrite oxidation with FeCl3 due to the addition of Cu(II)
4.2. Electrochemistry of chalcopyrite in the presence of ions, and the large exchange current density observed
Cl ions during copper(II) reduction (or Cu(I) oxidation) on
chalcopyrite surface (Hirato et al., 1986). Eq. (6) has
The concept that sulphide and oxides are leached by therefore been proposed as the actual reaction during
an electrochemical mechanism was proposed by Nicol chalcopyrite leaching in chloride system.
et al. (1975). Since then an electrochemical approach The change in the oxidation mechanism is likely the
has been used to study chalcopyrite (and other reason for the faster reduction on the Fe(III) concentra-
sulphides) leaching. During chalcopyrite leaching, a tion observed during leaching with NaCl in the present
parabolic kinetics is observed which is attributed to the study. This can be inferred by comparing Figs. 2 and 3.
passivation of its surface. Electrochemical studies Although part of ferric iron is precipitated as natrojar-
(anodic polarization curves and cyclic voltammetry, osite, the concentration of ferrous iron is higher in the
among other techniques) enabled the proposition that presence of NaCl than in its absence. This effect is
passivation occurs due to the formation of a surface higher for 1.0 mol/L NaCl and higher concentrations
layer that inhibits dissolution. It is agreed that iron is compared to the experiment carried out with 0.5 mol/L
leached ahead of copper, higher temperature reduces the NaCl, matching the behaviour observed for copper
passivation phenomena and impurities affect the oxida- dissolution (Fig. 1). The increase in Fe(II) concentration
tion behaviour of specific samples of chalcopyrite. would be ascribed to the fast Cu(I) oxidation (Eq. (7))
Furthermore, passivation starts after a certain potential, instead of the direct mineral oxidation which is slow due
which depends on the sample studied, usually on the to chalcopyrite passivation. The fast leaching kinetics
250450 mV (Ag/AgCl) range. Working below this observed with the Cu(II)/Cu(I) couple is attributed to a
critical potential allows the non-oxidative leaching of good overlap between the energy levels of the Cu(II)/Cu
chalcopyrite (Lazaro and Nicol, 2003). (I) couple and the conduction band of chalcopyrite while
The accepted reaction describing the formation of the energy levels of the Fe(III)/Fe(II) couple are within
this passivating layer is as follows: the chalcopyrite band gap, and the leaching kinetics is
CuFeS2 Cu1x Fe1y S2z xCu2 yFe2 zS therefore slower (Venkatachalam, 1991).
2x ye 8
4.3. Effect of chloride ion on the surface properties of
As shown in Eq. (8), the passivation layer is believed the reaction products
to be formed by Cu1xFe1yS2z or something similar
(layers of a non-stoichiometric compounds presenting Scanning electron micrographs (Fig. 5ae) show that
SS bonds (Mikhlin et al., 2004)). It has also been ferric sulphate leaching of chalcopyrite without NaCl
suggested that this layer is around 20 nm thick (Lazaro produces an adherent reaction product that follows the
and Nicol, 2003). morphology of the chalcopyrite grains. This new surface
It has been shown that chloride ions also affect the is roughened although an increase of surface area is not
electrochemical behaviour of chalcopyrite (passivation). observed. Actually, surface area is reduced compared
Currenttime curves for chalcopyrite oxidation at with that of the concentrate. This finding is consistent
constant potential show a decrease in the current passing with other works regarding chalcopyrite oxidation
through the working electrode. The initial current (Elsherief, 2002; Majima et al., 1985).
reduces with time and reaches a steady value which is Unlike the morphology of the reaction product
consistent with the passivating of the mineral surface. generated in the absence of NaCl where chalcopyrite
However, in the presence of sodium chloride this steady particle was completely coated by an amorphous or
value of current is higher than in its absence. It has been cryptocrystalline film of sulphur, Lu et al. (2000a) state
show that in the presence of 0.5 mol/L NaCl the current that a crystalline and porous sulphur layer is formed in
density is 7 times higher than in the absence of this salt the presence of NaCl. However, the authors made this
(Lu et al., 2000b). This increase may be attributed to a statement only by analysis of SEM images. In the
change in the leaching mechanism since Fe(III)/Fe(II) is present work, however, it was possible to determine the
the single redox couple in the absence of NaCl, but the surface area and porosity of leach residue in the
Cu(II)/Cu(I) couple becomes more important in the presence and absence of NaCl. Table 1 shows that
presence of chloride ions since the latter is more reactive there is a reduction of surface area and porosity after
M.F.C. Carneiro, V.A. Leo / Hydrometallurgy 87 (2007) 7382 81
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