STM32F042x4 STM32F042x6

ARM-based 32-bit MCU, up to 32 KB Flash, crystal-less USB

FS 2.0, CAN, 9 timers, ADC & comm. interfaces, 2.0 - 3.6 V
Datasheet - production data

Features
Core: ARM 32-bit Cortex-M0 CPU,
frequency up to 48 MHz LQFP48 7x7 mm UFQFPN48 7x7 mm WLCSP36 TSSOP20
LQFP32 7x7 mm UFQFPN32 5x5 mm 2.6x2.7 mm 6.5x4.4 mm
Memories UFQFPN28 4x4 mm
16 to 32 Kbytes of Flash memory
Nine timers
6 Kbytes of SRAM with HW parity
One 16-bit advanced-control timer for six
CRC calculation unit channel PWM output
Reset and power management One 32-bit and four 16-bit timers, with up to
Digital and I/Os supply: VDD = 2 V to 3.6 V four IC/OC, OCN, usable for IR control
Analog supply: VDDA = from VDD to 3.6 V decoding
Selected I/Os: VDDIO2 = 1.65 V to 3.6 V Independent and system watchdog timers
Power-on/Power down reset (POR/PDR) SysTick timer
Programmable voltage detector (PVD) Communication interfaces
Low power modes: Sleep, Stop, Standby One I2C interface supporting Fast Mode
VBAT supply for RTC and backup registers Plus (1 Mbit/s) with 20 mA current sink,
SMBus/PMBus and wakeup
Clock management
Two USARTs supporting master
4 to 32 MHz crystal oscillator synchronous SPI and modem control, one
32 kHz oscillator for RTC with calibration with ISO7816 interface, LIN, IrDA, auto
Internal 8 MHz RC with x6 PLL option baud rate detection and wakeup feature
Internal 40 kHz RC oscillator Two SPIs (18 Mbit/s) with 4 to 16
Internal 48 MHz oscillator with automatic programmable bit frames, one with I2S
trimming based on ext. synchronization interface multiplexed
Up to 38 fast I/Os CAN interface
All mappable on external interrupt vectors USB 2.0 full-speed interface, able to run
from internal 48 MHz oscillator and with
Up to 24 I/Os with 5 V tolerant capability
BCD and LPM support
and 8 with independent supply VDDIO2
HDMI CEC, wakeup on header reception
5-channel DMA controller
Serial wire debug (SWD)
One 12-bit, 1.0 s ADC (up to 10 channels)
Conversion range: 0 to 3.6 V 96-bit unique ID
Separate analog supply: 2.4 V to 3.6 V All packages ECOPACK2
Up to 14 capacitive sensing channels for Table 1. Device summary
touchkey, linear and rotary touch sensors Reference Part number

Calendar RTC with alarm and periodic wakeup STM32F042x4

STM32F042F4, STM32F042G4,
STM32F042K4, STM32F042T4, STM32F042C4
from Stop/Standby
STM32F042F6, STM32F042G6,
STM32F042x6
STM32F042K6, STM32F042T6, STM32F042C6

December 2015 DocID025832 Rev 4 1/118

This is information on a product in full production. www.st.com
Contents STM32F042x4 STM32F042x6

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.1 ARM-Cortex-M0 core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.2 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.4 Cyclic redundancy check calculation unit (CRC) . . . . . . . . . . . . . . . . . . . 14
3.5 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.2 Power supply supervisors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.5.4 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.7 General-purpose inputs/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.8 Direct memory access controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.9 Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.9.1 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 18
3.9.2 Extended interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . 18
3.10 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.10.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10.2 Internal voltage reference (VREFINT) . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.10.3 VBAT battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.11 Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.12 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.12.1 Advanced-control timer (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.12.2 General-purpose timers (TIM2, 3, 14, 16, 17) . . . . . . . . . . . . . . . . . . . . 22
3.12.3 Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.12.4 System window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.12.5 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.13 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 23
3.14 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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3.15 Universal synchronous/asynchronous receiver/transmitter (USART) . . . 25

3.16 Serial peripheral interface (SPI) / Inter-integrated sound interface (I2S) . 27
3.17 High-definition multimedia interface (HDMI) - consumer
electronics control (CEC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.18 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.19 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.20 Clock recovery system (CRS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.21 Serial wire debug port (SW-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

4 Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
6.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 48
6.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 49
6.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
6.3.6 Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.3.7 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
6.3.8 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
6.3.9 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
6.3.10 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
6.3.11 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
6.3.12 Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

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6.3.13 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

6.3.14 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
6.3.15 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
6.3.16 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.3.17 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.18 VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.19 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
6.3.20 Communication interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
7.1 LQFP48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
7.2 UFQFPN48 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
7.3 WLCSP36 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
7.4 LQFP32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
7.5 UFQFPN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
7.6 UFQFPN28 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
7.7 TSSOP20 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
7.8 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
7.8.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
7.8.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 112

8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

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STM32F042x4 STM32F042x6 List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. STM32F042x4/x6 device features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 3. Temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 4. Internal voltage reference calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 5. Capacitive sensing GPIOs available
on STM32F042x4/x6 devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 6. No. of capacitive sensing channels available on STM32F042x devices. . . . . . . . . . . . . . . 21
Table 7. Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 8. Comparison of I2C analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 9. STM32F042x4/x6 I2C implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 10. STM32F042x4/x6 USART implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 11. STM32F042x4/x6 SPI/I2S implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 12. Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 13. STM32F042x pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 14. Alternate functions selected through GPIOA_AFR registers for port A . . . . . . . . . . . . . . . 38
Table 15. Alternate functions selected through GPIOB_AFR registers for port B . . . . . . . . . . . . . . . 39
Table 16. Alternate functions selected through GPIOF_AFR registers for port F. . . . . . . . . . . . . . . . 39
Table 17. STM32F042x4/x6 peripheral register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 18. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 19. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 20. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 21. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 22. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 23. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 24. Programmable voltage detector characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 25. Embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 26. Typical and maximum current consumption from VDD supply at VDD = 3.6 V . . . . . . . . . . 51
Table 27. Typical and maximum current consumption from the VDDA supply . . . . . . . . . . . . . . . . . 53
Table 28. Typical and maximum consumption in Stop and Standby modes . . . . . . . . . . . . . . . . . . . 54
Table 29. Typical and maximum current consumption from the VBAT supply. . . . . . . . . . . . . . . . . . . 55
Table 30. Typical current consumption, code executing from Flash memory,
running from HSE 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Table 31. Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 32. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 33. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 34. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 35. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 36. HSE oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 37. LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Table 38. HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table 39. HSI14 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table 40. HSI48 oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table 41. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 42. PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 43. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 44. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 45. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 46. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

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Table 47. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Table 48. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table 49. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 50. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 51. Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Table 52. I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 53. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Table 54. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Table 55. RAIN max for fADC = 14 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 56. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 57. TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 58. VBAT monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 59. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 60. IWDG min/max timeout period at 40 kHz (LSI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 61. WWDG min/max timeout value at 48 MHz (PCLK). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 62. I2C analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 63. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 64. I2S characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Table 65. USB electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 66. LQFP48 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Table 67. UFQFPN48 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 68. WLCSP36 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 69. WLCSP36 recommended PCB design rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 70. LQFP32 package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Table 71. UFQFPN32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Table 72. UFQFPN28 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Table 73. TSSOP20 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Table 74. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Table 75. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Table 76. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

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STM32F042x4 STM32F042x6 List of figures

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 2. Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 3. LQFP48 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 4. UFQFPN48 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 5. WLCSP36 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 6. LQFP32 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 7. UFQFPN32 package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 8. UFQFPN28 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 9. TSSOP20 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 10. STM32F042x6 memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 11. Pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 12. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 13. Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 14. Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 15. High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 16. Low-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Figure 17. Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Figure 18. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 19. HSI oscillator accuracy characterization results for soldered parts . . . . . . . . . . . . . . . . . . 66
Figure 20. HSI14 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure 21. HSI48 oscillator accuracy characterization results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Figure 22. TC and TTa I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 23. Five volt tolerant (FT and FTf) I/O input characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Figure 24. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Figure 25. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Figure 26. ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 27. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Figure 28. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 29. SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Figure 30. SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Figure 31. I2S slave timing diagram (Philips protocol). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Figure 32. I2S master timing diagram (Philips protocol) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Figure 33. LQFP48 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Figure 34. Recommended footprint for LQFP48 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 35. LQFP48 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 36. UFQFPN48 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Figure 37. Recommended footprint for UFQFPN48 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Figure 38. UFQFPN48 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Figure 39. WLCSP36 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Figure 40. Recommended pad footprint for WLCSP36 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Figure 41. WLCSP36 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Figure 42. LQFP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Figure 43. Recommended footprint for LQFP32 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 44. LQFP32 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Figure 45. UFQFPN32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Figure 46. Recommended footprint for UFQFPN32 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 47. UFQFPN32 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 48. UFQFPN28 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

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8
List of figures STM32F042x4 STM32F042x6

Figure 49. Recommended footprint for UFQFPN28 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Figure 50. UFQFPN28 package marking example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Figure 51. TSSOP20 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Figure 52. Recommended footprint for TSSOP20 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Figure 53. TSSOP20 package marking example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111

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STM32F042x4 STM32F042x6 Introduction

1 Introduction

This datasheet provides the ordering information and mechanical device characteristics of
the STM32F042x4/x6 microcontrollers.
This document should be read in conjunction with the STM32F0xxxx reference manual
(RM0091). The reference manual is available from the STMicroelectronics website
www.st.com.
For information on the ARM Cortex-M0 core, please refer to the Cortex-M0 Technical
Reference Manual, available from the www.arm.com website.

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28
Description STM32F042x4 STM32F042x6

2 Description

The STM32F042x4/x6 microcontrollers incorporate the high-performance

ARM Cortex-M0 32-bit RISC core operating at up to 48 MHz frequency, high-speed
embedded memories (up to 32 Kbytes of Flash memory and 6 Kbytes of SRAM), and an
extensive range of enhanced peripherals and I/Os. All devices offer standard
communication interfaces (one I2C, two SPIs/one I2S, one HDMI CEC and two USARTs),
one USB Full-speed device (crystal-less), one CAN, one 12-bit ADC, four 16-bit timers, one
32-bit timer and an advanced-control PWM timer.
The STM32F042x4/x6 microcontrollers operate in the -40 to +85 C and -40 to +105 C
temperature ranges, from a 2.0 to 3.6 V power supply. A comprehensive set of
power-saving modes allows the design of low-power applications.
The STM32F042x4/x6 microcontrollers include devices in seven different packages ranging
from 20 pins to 48 pins with a die form also available upon request. Depending on the
device chosen, different sets of peripherals are included.
These features make the STM32F042x4/x6 microcontrollers suitable for a wide range of
applications such as application control and user interfaces, hand-held equipment, A/V
receivers and digital TV, PC peripherals, gaming and GPS platforms, industrial applications,
PLCs, inverters, printers, scanners, alarm systems, video intercoms and HVACs.

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STM32F042x4 STM32F042x6 Description

Table 2. STM32F042x4/x6 device features and peripheral counts

Peripheral STM32F042Fx STM32F042G STM32F042K STM32F042T STM32F042C

Flash memory (Kbyte) 16 32 16 32 16 32 16 32 16 32

SRAM (Kbyte) 6
Advanced
1 (16-bit)
control
Timers
General 4 (16-bit)
purpose 1 (32-bit)
SPI [I2S](1) 1 [1] 2 [1]
2
I C 1

Comm. USART 2
interfaces CAN 1
USB 1
CEC 1
12-bit ADC 1 1
(number of channels) (9 ext. + 3 int.) (10 ext. + 3 int.)
26
GPIOs 16 24 30 38
28

Capacitive sensing 13
7 11 14 14
channels 14
Max. CPU frequency 48 MHz
Operating voltage 2.0 to 3.6 V
Ambient operating temperature: -40C to 85C / -40C to 105C
Operating temperature
Junction temperature: -40C to 105C / -40C to 125C
LQFP32 LQFP48
Packages TSSOP20 UQFPN28 WLCSP36
UQFPN32 UFQFPN48
1. The SPI interfaces can be used either in SPI mode or in I2S audio mode.

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28
Description STM32F042x4 STM32F042x6

Figure 1. Block diagram

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STM32F042x4 STM32F042x6 Functional overview

3 Functional overview

Figure 1 shows the general block diagram of the STM32F042x4/x6 devices.

3.1 ARM-Cortex-M0 core

The ARM Cortex-M0 is a generation of ARM 32-bit RISC processors for embedded
systems. It has been developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced system response to interrupts.
The ARM Cortex-M0 processors feature exceptional code-efficiency, delivering the high
performance expected from an ARM core, with memory sizes usually associated with 8- and
16-bit devices.
The STM32F042x4/x6 devices embed ARM core and are compatible with all ARM tools and
software.

3.2 Memories
The device has the following features:
6 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait
states and featuring embedded parity checking with exception generation for fail-critical
applications.
The non-volatile memory is divided into two arrays:
16 to 32 Kbytes of embedded Flash memory for programs and data
Option bytes
The option bytes are used to write-protect the memory (with 4 KB granularity) and/or
readout-protect the whole memory with the following options:
Level 0: no readout protection
Level 1: memory readout protection, the Flash memory cannot be read from or
written to if either debug features are connected or boot in RAM is selected


Level 2: chip readout protection, debug features (Cortex -M0 serial wire) and
boot in RAM selection disabled

3.3 Boot modes

At startup, the boot pin and boot selector option bits are used to select one of the three boot
options:
boot from User Flash memory
boot from System Memory
boot from embedded SRAM
The boot pin is shared with the standard GPIO and can be disabled through the boot
selector option bits. The boot loader is located in System Memory. It is used to reprogram
the Flash memory by using USART on pins PA14/PA15, or PA9/PA10 or I2C on pins
PB6/PB7 or through the USB DFU interface.

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Functional overview STM32F042x4 STM32F042x6

3.4 Cyclic redundancy check calculation unit (CRC)

The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit
data word and a CRC-32 (Ethernet) polynomial.
Among other applications, CRC-based techniques are used to verify data transmission or
storage integrity. In the scope of the EN/IEC 60335-1 standard, they offer a means of
verifying the Flash memory integrity. The CRC calculation unit helps compute a signature of
the software during runtime, to be compared with a reference signature generated at link-
time and stored at a given memory location.

3.5 Power management

3.5.1 Power supply schemes

VDD = VDDIO1 = 2.0 to 3.6 V: external power supply for I/Os (VDDIO1) and the internal
regulator. It is provided externally through VDD pins.
VDDA = from VDD to 3.6 V: external analog power supply for ADC, Reset blocks, RCs
and PLL (minimum voltage to be applied to VDDA is 2.4 V when the ADC is used). It is
provided externally through VDDA pin. The VDDA voltage level must be always greater
or equal to the VDD voltage level and must be established first.
VDDIO2 = 1.65 to 3.6 V: external power supply for marked I/Os. VDDIO2 is provided
externally through the VDDIO2 pin. The VDDIO2 voltage level is completely independent
from VDD or VDDA, but it must not be provided without a valid supply on VDD. The
VDDIO2 supply is monitored and compared with the internal reference voltage
(VREFINT). When the VDDIO2 is below this threshold, all the I/Os supplied from this rail
are disabled by hardware. The output of this comparator is connected to EXTI line 31
and it can be used to generate an interrupt. Refer to the pinout diagrams or tables for
concerned I/Os list.
VBAT = 1.65 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and
backup registers (through power switch) when VDD is not present.
For more details on how to connect power pins, refer to Figure 13: Power supply scheme.

3.5.2 Power supply supervisors

The device has integrated power-on reset (POR) and power-down reset (PDR) circuits.
They are always active, and ensure proper operation above a threshold of 2 V. The device
remains in reset mode when the monitored supply voltage is below a specified threshold,
VPOR/PDR, without the need for an external reset circuit.
The POR monitors only the VDD supply voltage. During the startup phase it is required
that VDDA should arrive first and be greater than or equal to VDD.
The PDR monitors both the VDD and VDDA supply voltages, however the VDDA power
supply supervisor can be disabled (by programming a dedicated Option bit) to reduce
the power consumption if the application design ensures that VDDA is higher than or
equal to VDD.
The device features an embedded programmable voltage detector (PVD) that monitors the
VDD power supply and compares it to the VPVD threshold. An interrupt can be generated
when VDD drops below the VPVD threshold and/or when VDD is higher than the VPVD

14/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Functional overview

threshold. The interrupt service routine can then generate a warning message and/or put
the MCU into a safe state. The PVD is enabled by software.

3.5.3 Voltage regulator

The regulator has two operating modes and it is always enabled after reset.
Main (MR) is used in normal operating mode (Run).
Low power (LPR) can be used in Stop mode where the power demand is reduced.
In Standby mode, it is put in power down mode. In this mode, the regulator output is in high
impedance and the kernel circuitry is powered down, inducing zero consumption (but the
contents of the registers and SRAM are lost).

3.5.4 Low-power modes

The STM32F042x4/x6 microcontrollers support three low-power modes to achieve the best
compromise between low power consumption, short startup time and available wakeup
sources:
Sleep mode
In Sleep mode, only the CPU is stopped. All peripherals continue to operate and can
wake up the CPU when an interrupt/event occurs.
Stop mode
Stop mode achieves very low power consumption while retaining the content of SRAM
and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC and the
HSE crystal oscillators are disabled. The voltage regulator can also be put either in
normal or in low power mode.
The device can be woken up from Stop mode by any of the EXTI lines. The EXTI line
source can be one of the 16 external lines, the PVD output, RTC, I2C1 USART1, USB
or the CEC.
The CEC, USART1 and I2C1 peripherals can be configured to enable the HSI RC
oscillator so as to get clock for processing incoming data. If this is used when the
voltage regulator is put in low power mode, the regulator is first switched to normal
mode before the clock is provided to the given peripheral.
Standby mode
The Standby mode is used to achieve the lowest power consumption. The internal
voltage regulator is switched off so that the entire 1.8 V domain is powered off. The
PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering
Standby mode, SRAM and register contents are lost except for registers in the RTC
domain and Standby circuitry.
The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a
rising edge on the WKUP pins, or an RTC event occurs.
Note: The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop
or Standby mode.

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Functional overview STM32F042x4 STM32F042x6

3.6 Clocks and startup

System clock selection is performed on startup, however the internal RC 8 MHz oscillator is
selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in
which case it is monitored for failure. If failure is detected, the system automatically switches
back to the internal RC oscillator. A software interrupt is generated if enabled. Similarly, full
interrupt management of the PLL clock entry is available when necessary (for example on
failure of an indirectly used external crystal, resonator or oscillator).
Several prescalers allow the application to configure the frequency of the AHB and the APB
domains. The maximum frequency of the AHB and the APB domains is 48 MHz.
Additionally, also the internal RC 48 MHz oscillator can be selected for system clock or PLL
input source. This oscillator can be automatically fine-trimmed by the means of the CRS
peripheral using the external synchronization.

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STM32F042x4 STM32F042x6 Functional overview

Figure 2. Clock tree

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3.7 General-purpose inputs/outputs (GPIOs)

Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as
input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the
GPIO pins are shared with digital or analog alternate functions.

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Functional overview STM32F042x4 STM32F042x6

The I/O configuration can be locked if needed following a specific sequence in order to
avoid spurious writing to the I/Os registers.

3.8 Direct memory access controller (DMA)

The 5-channel general-purpose DMAs manage memory-to-memory, peripheral-to-memory
and memory-to-peripheral transfers.
The DMA supports circular buffer management, removing the need for user code
intervention when the controller reaches the end of the buffer.
Each channel is connected to dedicated hardware DMA requests, with support for software
trigger on each channel. Configuration is made by software and transfer sizes between
source and destination are independent.
DMA can be used with the main peripherals: SPIx, I2Sx, I2Cx, USARTx, all TIMx timers
(except TIM14) and ADC.

3.9 Interrupts and events

3.9.1 Nested vectored interrupt controller (NVIC)

The STM32F0xx family embeds a nested vectored interrupt controller able to handle up to

32 maskable interrupt channels (not including the 16 interrupt lines of Cortex -M0) and 4
priority levels.
Closely coupled NVIC gives low latency interrupt processing
Interrupt entry vector table address passed directly to the core
Closely coupled NVIC core interface
Allows early processing of interrupts
Processing of late arriving higher priority interrupts
Support for tail-chaining
Processor state automatically saved
Interrupt entry restored on interrupt exit with no instruction overhead
This hardware block provides flexible interrupt management features with minimal interrupt
latency.

3.9.2 Extended interrupt/event controller (EXTI)

The extended interrupt/event controller consists of 24 edge detector lines used to generate
interrupt/event requests and wake-up the system. Each line can be independently
configured to select the trigger event (rising edge, falling edge, both) and can be masked
independently. A pending register maintains the status of the interrupt requests. The EXTI
can detect an external line with a pulse width shorter than the internal clock period. Up to 38
GPIOs can be connected to the 16 external interrupt lines.

3.10 Analog-to-digital converter (ADC)

The 12-bit analog-to-digital converter has up to 10 external and 3 internal (temperature

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sensor, voltage reference, VBAT voltage measurement) channels and performs conversions
in single-shot or scan modes. In scan mode, automatic conversion is performed on a
selected group of analog inputs.
The ADC can be served by the DMA controller.
An analog watchdog feature allows very precise monitoring of the converted voltage of one,
some or all selected channels. An interrupt is generated when the converted voltage is
outside the programmed thresholds.

3.10.1 Temperature sensor

The temperature sensor (TS) generates a voltage VSENSE that varies linearly with
temperature.
The temperature sensor is internally connected to the ADC_IN16 input channel which is
used to convert the sensor output voltage into a digital value.
The sensor provides good linearity but it has to be calibrated to obtain good overall
accuracy of the temperature measurement. As the offset of the temperature sensor varies
from chip to chip due to process variation, the uncalibrated internal temperature sensor is
suitable for applications that detect temperature changes only.
To improve the accuracy of the temperature sensor measurement, each device is
individually factory-calibrated by ST. The temperature sensor factory calibration data are
stored by ST in the system memory area, accessible in read-only mode.

Table 3. Temperature sensor calibration values

Calibration value name Description Memory address

TS ADC raw data acquired at a

TS_CAL1 temperature of 30 C ( 5 C), 0x1FFF F7B8 - 0x1FFF F7B9
VDDA= 3.3 V ( 10 mV)
TS ADC raw data acquired at a
TS_CAL2 temperature of 110 C ( 5 C), 0x1FFF F7C2 - 0x1FFF F7C3
VDDA= 3.3 V ( 10 mV)

3.10.2 Internal voltage reference (VREFINT)

The internal voltage reference (VREFINT) provides a stable (bandgap) voltage output for the
ADC. VREFINT is internally connected to the ADC_IN17 input channel. The precise voltage
of VREFINT is individually measured for each part by ST during production test and stored in
the system memory area. It is accessible in read-only mode.

Table 4. Internal voltage reference calibration values

Calibration value name Description Memory address

Raw data acquired at a

VREFINT_CAL temperature of 30 C ( 5 C), 0x1FFF F7BA - 0x1FFF F7BB
VDDA= 3.3 V ( 10 mV)

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Functional overview STM32F042x4 STM32F042x6

3.10.3 VBAT battery voltage monitoring

This embedded hardware feature allows the application to measure the VBAT battery voltage
using the internal ADC channel ADC_IN18. As the VBAT voltage may be higher than VDDA,
and thus outside the ADC input range, the VBAT pin is internally connected to a bridge
divider by 2. As a consequence, the converted digital value is half the VBAT voltage.

3.11 Touch sensing controller (TSC)

The STM32F042x4/x6 devices provide a simple solution for adding capacitive sensing
functionality to any application. These devices offer up to 14 capacitive sensing channels
distributed over 5 analog I/O groups.
Capacitive sensing technology is able to detect the presence of a finger near a sensor which
is protected from direct touch by a dielectric (glass, plastic...). The capacitive variation
introduced by the finger (or any conductive object) is measured using a proven
implementation based on a surface charge transfer acquisition principle. It consists in
charging the sensor capacitance and then transferring a part of the accumulated charges
into a sampling capacitor until the voltage across this capacitor has reached a specific
threshold. To limit the CPU bandwidth usage, this acquisition is directly managed by the
hardware touch sensing controller and only requires few external components to operate.
For operation, one capacitive sensing GPIO in each group is connected to an external
capacitor and cannot be used as effective touch sensing channel.
The touch sensing controller is fully supported by the STMTouch touch sensing firmware
library, which is free to use and allows touch sensing functionality to be implemented reliably
in the end application.

Table 5. Capacitive sensing GPIOs available

on STM32F042x4/x6 devices
Capacitive sensing Pin Capacitive sensing Pin
Group Group
signal name name signal name name

TSC_G1_IO1 PA0 TSC_G4_IO1 PA9

TSC_G1_IO2 PA1 TSC_G4_IO2 PA10
1 4
TSC_G1_IO3 PA2 TSC_G4_IO3 PA11
TSC_G1_IO4 PA3 TSC_G4_IO4 PA12
TSC_G2_IO1 PA4 TSC_G5_IO1 PB3
TSC_G2_IO2 PA5 TSC_G5_IO2 PB4
2 5
TSC_G2_IO3 PA6 TSC_G5_IO3 PB6
TSC_G2_IO4 PA7 TSC_G5_IO4 PB7
TSC_G3_IO2 PB0
3 TSC_G3_IO3 PB1
TSC_G3_IO4 PB2

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Table 6. No. of capacitive sensing channels available on STM32F042x devices

Number of capacitive sensing channels

Analog I/O group STM32F042Cx STM32F042Kx

STM32F042Tx STM32F042Gx STM32F042Fx
LQPF48 LQFP32
WLCSP36 UQFPN28 TSSOP20
UQFPN48 UQFPN32

G1 3 3 3 3 3
G2 3 3 3 3 3
1
G3 2 2 1 0
2
G4 3 3 3 1 1
G5 3 3 3 3 0

Number of capacitive 13
14 14 11 7
sensing channels 14

3.12 Timers and watchdogs

The STM32F042x4/x6 devices include up to five general-purpose timers and an advanced
control timer.
Table 7 compares the features of the different timers.

Table 7. Timer feature comparison

DMA
Timer Counter Counter Prescaler Capture/compare Complementary
Timer request
type resolution type factor channels outputs
generation

Advanced Up, down, integer from

TIM1 16-bit Yes 4 3
control up/down 1 to 65536
Up, down, integer from
TIM2 32-bit Yes 4 -
up/down 1 to 65536
Up, down, integer from
TIM3 16-bit Yes 4 -
General up/down 1 to 65536
purpose integer from
TIM14 16-bit Up No 1 -
1 to 65536
TIM16 integer from
16-bit Up Yes 1 1
TIM17 1 to 65536

3.12.1 Advanced-control timer (TIM1)

The advanced-control timer (TIM1) can be seen as a three-phase PWM multiplexed on six
channels. It has complementary PWM outputs with programmable inserted dead times. It

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Functional overview STM32F042x4 STM32F042x6

can also be seen as a complete general-purpose timer. The four independent channels can
be used for:
input capture
output compare
PWM generation (edge or center-aligned modes)
one-pulse mode output
If configured as a standard 16-bit timer, it has the same features as the TIMx timer. If
configured as the 16-bit PWM generator, it has full modulation capability (0-100%).
The counter can be frozen in debug mode.
Many features are shared with those of the standard timers which have the same
architecture. The advanced control timer can therefore work together with the other timers
via the Timer Link feature for synchronization or event chaining.

3.12.2 General-purpose timers (TIM2, 3, 14, 16, 17)

There are five synchronizable general-purpose timers embedded in the STM32F042x4/x6
devices (see Table 7 for differences). Each general-purpose timer can be used to generate
PWM outputs, or as simple time base.

TIM2, TIM3
STM32F042x4/x6 devices feature two synchronizable 4-channel general-purpose timers.
TIM2 is based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler. TIM3 is based
on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. They feature 4 independent
channels each for input capture/output compare, PWM or one-pulse mode output. This
gives up to 12 input captures/output compares/PWMs on the largest packages.
The TIM2 and TIM3 general-purpose timers can work together or with the TIM1 advanced-
control timer via the Timer Link feature for synchronization or event chaining.
TIM2 and TIM3 both have independent DMA request generation.
These timers are capable of handling quadrature (incremental) encoder signals and the
digital outputs from 1 to 3 hall-effect sensors.
Their counters can be frozen in debug mode.

TIM14
This timer is based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
TIM14 features one single channel for input capture/output compare, PWM or one-pulse
mode output.
Its counter can be frozen in debug mode.

TIM16 and TIM17

Both timers are based on a 16-bit auto-reload upcounter and a 16-bit prescaler.
They each have a single channel for input capture/output compare, PWM or one-pulse
mode output.

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TIM16 and TIM17 have a complementary output with dead-time generation and
independent DMA request generation.
Their counters can be frozen in debug mode.

3.12.3 Independent watchdog (IWDG)

The independent watchdog is based on an 8-bit prescaler and 12-bit downcounter with
user-defined refresh window. It is clocked from an independent 40 kHz internal RC and as it
operates independently from the main clock, it can operate in Stop and Standby modes. It
can be used either as a watchdog to reset the device when a problem occurs, or as a free
running timer for application timeout management. It is hardware or software configurable
through the option bytes. The counter can be frozen in debug mode.

3.12.4 System window watchdog (WWDG)

The system window watchdog is based on a 7-bit downcounter that can be set as free
running. It can be used as a watchdog to reset the device when a problem occurs. It is
clocked from the APB clock (PCLK). It has an early warning interrupt capability and the
counter can be frozen in debug mode.

3.12.5 SysTick timer

This timer is dedicated to real-time operating systems, but could also be used as a standard
down counter. It features:
a 24-bit down counter
autoreload capability
maskable system interrupt generation when the counter reaches 0
programmable clock source (HCLK or HCLK/8)

3.13 Real-time clock (RTC) and backup registers

The RTC and the five backup registers are supplied through a switch that takes power either
on VDD supply when present or through the VBAT pin. The backup registers are five 32-bit
registers used to store 20 bytes of user application data when VDD power is not present.
They are not reset by a system or power reset, or at wake up from Standby mode.

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Functional overview STM32F042x4 STM32F042x6

The RTC is an independent BCD timer/counter. Its main features are the following:
calendar with subseconds, seconds, minutes, hours (12 or 24 format), week day, date,
month, year, in BCD (binary-coded decimal) format
automatic correction for 28, 29 (leap year), 30, and 31 day of the month
programmable alarm with wake up from Stop and Standby mode capability
on-the-fly correction from 1 to 32767 RTC clock pulses. This can be used to
synchronize the RTC with a master clock
digital calibration circuit with 1 ppm resolution, to compensate for quartz crystal
inaccuracy
two anti-tamper detection pins with programmable filter. The MCU can be woken up
from Stop and Standby modes on tamper event detection
timestamp feature which can be used to save the calendar content. This function can
be triggered by an event on the timestamp pin, or by a tamper event. The MCU can be
woken up from Stop and Standby modes on timestamp event detection
reference clock detection: a more precise second source clock (50 or 60 Hz) can be
used to enhance the calendar precision
The RTC clock sources can be:
a 32.768 kHz external crystal
a resonator or oscillator
the internal low-power RC oscillator (typical frequency of 40 kHz)
the high-speed external clock divided by 32

3.14 Inter-integrated circuit interface (I2C)

The I2C interface (I2C1) can operate in multimaster or slave modes. It can support Standard
mode (up to 100 kbit/s), Fast mode (up to 400 kbit/s) and Fast Mode Plus (up to 1 Mbit/s)
with 20 mA output drive.
It supports 7-bit and 10-bit addressing modes, multiple 7-bit slave addresses (two
addresses, one with configurable mask). It also includes programmable analog and digital
noise filters.

Table 8. Comparison of I2C analog and digital filters

Aspect Analog filter Digital filter

Pulse width of Programmable length from 1 to 15

50 ns
suppressed spikes I2Cx peripheral clocks
Extra filtering capability vs.
Benefits Available in Stop mode standard requirements
Stable length
Wakeup from Stop on address
Variations depending on
Drawbacks match is not available when digital
temperature, voltage, process
filter is enabled.

In addition, I2C1 provides hardware support for SMBUS 2.0 and PMBUS 1.1: ARP
capability, Host notify protocol, hardware CRC (PEC) generation/verification, timeouts
verifications and ALERT protocol management. I2C1 also has a clock domain independent

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from the CPU clock, allowing the I2C1 to wake up the MCU from Stop mode on address
match.
The I2C peripheral can be served by the DMA controller.

Table 9. STM32F042x4/x6 I2C implementation

I2C features(1) I2C1

7-bit addressing mode X

10-bit addressing mode X
Standard mode (up to 100 kbit/s) X
Fast mode (up to 400 kbit/s) X
Fast Mode Plus with 20 mA output drive I/Os (up to 1 Mbit/s) X
Independent clock X
SMBus X
Wakeup from STOP X
1. X = supported.

3.15 Universal synchronous/asynchronous receiver/transmitter

(USART)
The device embeds two universal synchronous/asynchronous receivers/transmitters
(USART1, USART2) which communicate at speeds of up to 6 Mbit/s.
They provide hardware management of the CTS, RTS and RS485 DE signals,
multiprocessor communication mode, master synchronous communication and single-wire
half-duplex communication mode. USART1 supports also SmartCard communication (ISO
7816), IrDA SIR ENDEC, LIN Master/Slave capability and auto baud rate feature, and has a
clock domain independent of the CPU clock, allowing to wake up the MCU from Stop mode.
The USART interfaces can be served by the DMA controller.

Table 10. STM32F042x4/x6 USART implementation

USART modes/features(1) USART1 USART2

Hardware flow control for modem X X

Continuous communication using DMA X X
Multiprocessor communication X X
Synchronous mode X X
Smartcard mode X -
Single-wire half-duplex communication X X
IrDA SIR ENDEC block X -
LIN mode X -
Dual clock domain and wakeup from Stop mode X -
Receiver timeout interrupt X -

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Functional overview STM32F042x4 STM32F042x6

Table 10. STM32F042x4/x6 USART implementation (continued)

USART modes/features(1) USART1 USART2

Modbus communication X -
Auto baud rate detection X -
Driver Enable X X
1. X = supported.

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3.16 Serial peripheral interface (SPI) / Inter-integrated sound

interface (I2S)
Up to two SPIs are able to communicate up to 18 Mbit/s in slave and master modes in full-
duplex and half-duplex communication modes. The 3-bit prescaler gives 8 master mode
frequencies and the frame size is configurable from 4 bits to 16 bits.
One standard I2S interface (multiplexed with SPI1) supporting four different audio standards
can operate as master or slave at half-duplex communication mode. It can be configured to
transfer 16 and 24 or 32 bits with 16-bit or 32-bit data resolution and synchronized by a
specific signal. Audio sampling frequency from 8 kHz up to 192 kHz can be set by an 8-bit
programmable linear prescaler. When operating in master mode, it can output a clock for an
external audio component at 256 times the sampling frequency.

Table 11. STM32F042x4/x6 SPI/I2S implementation

SPI features(1) SPI1 SPI2

Hardware CRC calculation X X

Rx/Tx FIFO X X
NSS pulse mode X X
I2S mode X -
TI mode X X
1. X = supported.

3.17 High-definition multimedia interface (HDMI) - consumer

electronics control (CEC)
The device embeds a HDMI-CEC controller that provides hardware support for the
Consumer Electronics Control (CEC) protocol (Supplement 1 to the HDMI standard).
This protocol provides high-level control functions between all audiovisual products in an
environment. It is specified to operate at low speeds with minimum processing and memory
overhead. It has a clock domain independent from the CPU clock, allowing the HDMI_CEC
controller to wakeup the MCU from Stop mode on data reception.

3.18 Controller area network (CAN)

The CAN is compliant with specifications 2.0A and B (active) with a bit rate up to 1 Mbit/s. It
can receive and transmit standard frames with 11-bit identifiers as well as extended frames
with 29-bit identifiers. It has three transmit mailboxes, two receive FIFOs with 3 stages and
14 scalable filter banks.

3.19 Universal serial bus (USB)

The STM32F042x4/x6 embeds a full-speed USB device peripheral compliant with the USB
specification version 2.0. The internal USB PHY supports USB FS signaling, embedded DP
pull-up and also battery charging detection according to Battery Charging Specification
Revision 1.2. The USB interface implements a full-speed (12 Mbit/s) function interface with

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Functional overview STM32F042x4 STM32F042x6

added support for USB 2.0 Link Power Management. It has software-configurable endpoint
setting with packet memory up-to 1 KB (the last 256 byte are used for CAN peripheral if
enabled) and suspend/resume support. It requires a precise 48 MHz clock which can be
generated from the internal main PLL (the clock source must use an HSE crystal oscillator)
or by the internal 48 MHz oscillator in automatic trimming mode. The synchronization for this
oscillator can be taken from the USB data stream itself (SOF signalization) which allows
crystal-less operation.

3.20 Clock recovery system (CRS)

The STM32F042x4/x6 embeds a special block which allows automatic trimming of the
internal 48 MHz oscillator to guarantee its optimal accuracy over the whole device
operational range. This automatic trimming is based on the external synchronization signal,
which could be either derived from USB SOF signalization, from LSE oscillator, from an
external signal on CRS_SYNC pin or generated by user software. For faster lock-in during
startup it is also possible to combine automatic trimming with manual trimming action.

3.21 Serial wire debug port (SW-DP)

An ARM SW-DP interface is provided to allow a serial wire debugging tool to be connected
to the MCU.

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STM32F042x4 STM32F042x6 Pinouts and pin descriptions

4 Pinouts and pin descriptions

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DocID025832 Rev 4 29/118

39
Pinouts and pin descriptions STM32F042x4 STM32F042x6

Figure 5. WLCSP36 package pinout

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30/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Pinouts and pin descriptions

Figure 7. UFQFPN32 package pinout

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DocID025832 Rev 4 31/118

39
Pinouts and pin descriptions STM32F042x4 STM32F042x6

Figure 9. TSSOP20 package

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Table 12. Legend/abbreviations used in the pinout table

Name Abbreviation Definition

Unless otherwise specified in brackets below the pin name, the pin function during and
Pin name
after reset is the same as the actual pin name
S Supply pin
Pin type I/O Input / output pin
FT 5 V-tolerant I/O
FTf 5 V-tolerant I/O, FM+ capable
TTa 3.3 V-tolerant I/O directly connected to ADC
I/O structure TC Standard 3.3 V I/O
RST Bidirectional reset pin with embedded weak pull-up resistor
Unless otherwise specified by a note, all I/Os are set as floating inputs during and after
Notes
reset.
Alternate
Functions selected through GPIOx_AFR registers
Pin functions
functions Additional
Functions directly selected/enabled through peripheral registers
functions

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Table 13. STM32F042x pin definitions

Pin numbers Pin functions
LQFP48/UFQFPN48

I/O structure
Pin name
UFQFPN32

UFQFPN28

TSSPOP20

Notes
Pin
WLCSP36

LQFP32

(function upon
type Additional
reset) Alternate function
functions

1 - - - - - VBAT S - - Backup power supply

WKUP2,
(1)
RTC_TAMP1,
2 A6 - - - - PC13 I/O TC (2) -
RTC_TS,
RTC_OUT
PC14- (1)
3 B6 - - - - OSC32_IN I/O TC (2) - OSC32_IN
(PC14)
PC15- (1)
4 C6 - - - - OSC32_OUT I/O TC (2) - OSC32_OUT
(PC15)

PF0-OSC_IN CRS_ SYNC

5 B5 2 2 2 2 I/O FTf - OSC_IN
(PF0) I2C1_SDA
PF1-OSC_OUT
6 C5 3 3 3 3 I/O FTf - I2C1_SCL OSC_OUT
(PF1)
Device reset input / internal reset output
7 D5 4 4 4 4 NRST I/O RST -
(active low)
(3)
8 D6 32 0 16 15 VSSA S Analog ground
9 E5 5 5 5 5 VDDA S - Analog power supply
RTC_
USART2_CTS,
TAMP2,
10 F6 6 6 6 6 PA0 I/O TTa - TIM2_CH1_ETR,
WKUP1,
TSC_G1_IO1
ADC_IN0,
USART2_RTS,
TIM2_CH2,
11 D4 7 7 7 7 PA1 I/O TTa - ADC_IN1
TSC_G1_IO2,
EVENTOUT
USART2_TX,
ADC_IN2,
12 E4 8 8 8 8 PA2 I/O TTa - TIM2_CH3,
WKUP4
TSC_G1_IO3
USART2_RX,
13 F5 9 9 9 9 PA3 I/O TTa - TIM2_CH4, ADC_IN3
TSC_G1_IO4

DocID025832 Rev 4 33/118

39
Pinouts and pin descriptions STM32F042x4 STM32F042x6

Table 13. STM32F042x pin definitions (continued)

Pin numbers Pin functions
LQFP48/UFQFPN48

I/O structure
Pin name
UFQFPN32

UFQFPN28

TSSPOP20

Notes
Pin
WLCSP36

LQFP32

(function upon
type Additional
reset) Alternate function
functions

SPI1_NSS, I2S1_WS,
TIM14_CH1,
14 C3 10 10 10 10 PA4 I/O TTa - TSC_G2_IO1, ADC_IN4
USART2_CK
USB_NOE
SPI1_SCK, I2S1_CK,
CEC,
15 D3 11 11 11 11 PA5 I/O TTa - ADC_IN5
TIM2_CH1_ETR,
TSC_G2_IO2
SPI1_MISO, I2S1_MCK,
TIM3_CH1, TIM1_BKIN,
16 E3 12 12 12 12 PA6 I/O TTa - TIM16_CH1, ADC_IN6
TSC_G2_IO3,
EVENTOUT
SPI1_MOSI, I2S1_SD,
TIM3_CH2, TIM14_CH1,
TIM1_CH1N,
17 F4 13 13 13 13 PA7 I/O TTa - ADC_IN7
TIM17_CH1,
TSC_G2_IO4,
EVENTOUT
TIM3_CH3,
TIM1_CH2N,
18 F3 14 14 14 - PB0 I/O TTa - ADC_IN8
TSC_G3_IO2,
EVENTOUT
TIM3_CH4, TIM14_CH1,
19 F2 15 15 15 14 PB1 I/O TTa - TIM1_CH3N, ADC_IN9
TSC_G3_IO3
20 D2 - 16 - - PB2 I/O FT - TSC_G3_IO4 -
SPI2_SCK, CEC,
21 - - - - - PB10 I/O FTf - TSC_SYNC, TIM2_CH3, -
I2C1_SCL
TIM2_CH4,
22 - - - - - PB11 I/O FTf - EVENTOUT, -
I2C1_SDA
23 F1 16 0 16 15 VSS S - - Ground
24 - - - 17 16 VDD S - - Digital power supply
TIM1_BKIN, SPI2_NSS,
25 - - - - - PB12 I/O FT - -
EVENTOUT

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STM32F042x4 STM32F042x6 Pinouts and pin descriptions

Table 13. STM32F042x pin definitions (continued)

Pin numbers Pin functions
LQFP48/UFQFPN48

I/O structure
Pin name
UFQFPN32

UFQFPN28

TSSPOP20

Notes
Pin
WLCSP36

LQFP32

(function upon
type Additional
reset) Alternate function
functions

SPI2_SCK,
26 - - - - - PB13 I/O FTf - TIM1_CH1N, -
I2C1_SCL
SPI2_MISO,
27 - - - - - PB14 I/O FTf - TIM1_CH2N, -
I2C1_SDA
SPI2_MOSI, WKUP7,
28 - - - - - PB15 I/O FT -
TIM1_CH3N RTC_REFIN
USART1_CK,
(4) TIM1_CH1,
29 E2 18 18 - - PA8 I/O FT -
EVENTOUT, MCO,
CRS_SYNC
USART1_TX,
(4) TIM1_CH2,
30 D1 19 19 19 17 PA9 I/O FTf -
TSC_G4_IO1,
I2C1_SCL
USART1_RX,
TIM1_CH3,
(4)
31 C1 20 20 20 18 PA10 I/O FTf TIM17_BKIN, -
TSC_G4_IO2,
I2C1_SDA
CAN_RX,
USART1_CTS,
TIM1_CH4,
32 C2 21 21 19(5) 17(5) PA11 I/O FTf (4)
USB_DM
TSC_G4_IO3,
EVENTOUT,
I2C1_SCL
CAN_TX,USART1_RTS,
TIM1_ETR,
33 A1 22 22 20(5) 18(5) PA12 I/O FTf (4)
TSC_G4_IO4, USB_DP
EVENTOUT,
I2C1_SDA
(4) IR_OUT, SWDIO
34 B1 23 23 21 19 PA13 I/O FT (6) -
USB_NOE
35 - - - - - VSS S - - Ground
36 E1 17 17 18 16 VDDIO2 S - - Digital power supply
(4)
37 B2 24 24 22 20 PA14 I/O FT (6) USART2_TX, SWCLK -

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Pinouts and pin descriptions STM32F042x4 STM32F042x6

Table 13. STM32F042x pin definitions (continued)

Pin numbers Pin functions
LQFP48/UFQFPN48

I/O structure
Pin name
UFQFPN32

UFQFPN28

TSSPOP20

Notes
Pin
WLCSP36

LQFP32

(function upon
type Additional
reset) Alternate function
functions

SPI1_NSS, I2S1_WS,
USART2_RX,
(4)
38 A2 25 25 23 - PA15 I/O FT TIM2_CH1_ETR, -
EVENTOUT,
USB_NOE
SPI1_SCK, I2S1_CK,
TIM2_CH2,
39 B3 26 26 24 - PB3 I/O FT - -
TSC_G5_IO1,
EVENTOUT
SPI1_MISO, I2S1_MCK,
TIM17_BKIN,
40 A3 27 27 25 - PB4 I/O FT - TIM3_CH1, -
TSC_G5_IO2,
EVENTOUT
SPI1_MOSI, I2S1_SD,
I2C1_SMBA,
41 E6 28 28 26 - PB5 I/O FT - WKUP6
TIM16_BKIN,
TIM3_CH2
I2C1_SCL,
USART1_TX,
42 C4 29 29 27 - PB6 I/O FTf - -
TIM16_CH1N,
TSC_G5_I03
I2C1_SDA,
USART1_RX,
43 A4 30 30 28 - PB7 I/O FTf - -
TIM17_CH1N,
TSC_G5_IO4
Boot memory
44 - - 31 - - PF11-BOOT0 I/O FT - -
selection
I2C1_SCL, CEC,
TIM16_CH1, Boot memory
- B4 31 - 1 1 PB8-BOOT0 I/O FTf -
TSC_SYNC, selection
CAN_RX
I2C1_SCL, CEC,
TIM16_CH1,
45 - - 32 - - PB8 I/O FTf - -
TSC_SYNC,
CAN_RX

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STM32F042x4 STM32F042x6 Pinouts and pin descriptions

Table 13. STM32F042x pin definitions (continued)

Pin numbers Pin functions
LQFP48/UFQFPN48

I/O structure
Pin name
UFQFPN32

UFQFPN28

TSSPOP20

Notes
Pin
WLCSP36

LQFP32

(function upon
type Additional
reset) Alternate function
functions

SPI2_NSS,
I2C1_SDA, IR_OUT,
46 - - - - - PB9 I/O FTf - TIM17_CH1, -
EVENTOUT,
CAN_TX
47 - 32 0 - - VSS S - - Ground
48 A5 1 1 - - VDD S - - Digital power supply
1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current
(3 mA), the use of GPIOs PC13 to PC15 in output mode is limited:
- The speed should not exceed 2 MHz with a maximum load of 30 pF.
- These GPIOs must not be used as current sources (e.g. to drive an LED).
2. After the first RTC domain power-up, PC13, PC14 and PC15 operate as GPIOs. Their function then depends on the
content of the RTC registers which are not reset by the system reset. For details on how to manage these GPIOs, refer to
the RTC domain and RTC register descriptions in the reference manual.
3. Distinct VSSA pin is only available on 48-pin packages. On all other packages, the pin number corresponds to the VSS
pin to which VSSA pad of the silicon die is connected.
4. PA8, PA9, PA10, PA11, PA12, PA13, PA14 and PA15 I/Os are supplied by VDDIO2.
5. Pin pair PA11/12 can be remapped in place of pin pair PA9/10 using SYSCFG_CFGR1 register.
6. After reset, these pins are configured as SWDIO and SWCLK alternate functions, and the internal pull-up on the SWDIO
pin and the internal pull-down on the SWCLK pin are activated.

DocID025832 Rev 4 37/118

39
38/118

Pinouts and pin descriptions

Table 14. Alternate functions selected through GPIOA_AFR registers for port A
Pin name AF0 AF1 AF2 AF3 AF4 AF5 AF6 AF7

PA0 - USART2_CTS TIM2_CH1_ETR TSC_G1_IO1 - - - -

PA1 EVENTOUT USART2_RTS TIM2_CH2 TSC_G1_IO2 - - - -
PA2 - USART2_TX TIM2_CH3 TSC_G1_IO3 - - - -
PA3 - USART2_RX TIM2_CH4 TSC_G1_IO4 - - - -
PA4 SPI1_NSS, I2S1_WS USART2_CK USB_NOE TSC_G2_IO1 TIM14_CH1 - - -
PA5 SPI1_SCK, I2S1_CK CEC TIM2_CH1_ETR TSC_G2_IO2 - - - -
PA6 SPI1_MISO, I2S1_MCK TIM3_CH1 TIM1_BKIN TSC_G2_IO3 - TIM16_CH1 EVENTOUT -
PA7 SPI1_MOSI, I2S1_SD TIM3_CH2 TIM1_CH1N TSC_G2_IO4 TIM14_CH1 TIM17_CH1 EVENTOUT -
DocID025832 Rev 4

PA8 MCO USART1_CK TIM1_CH1 EVENTOUT CRS_SYNC - - -

PA9 - USART1_TX TIM1_CH2 TSC_G4_IO1 I2C1_SCL MCO - -
PA10 TIM17_BKIN USART1_RX TIM1_CH3 TSC_G4_IO2 I2C1_SDA - - -
PA11 EVENTOUT USART1_CTS TIM1_CH4 TSC_G4_IO3 CAN_RX I2C1_SCL - -
PA12 EVENTOUT USART1_RTS TIM1_ETR TSC_G4_IO4 CAN_TX I2C1_SDA - -
PA13 SWDIO IR_OUT USB_NOE - - - - -
PA14 SWCLK USART2_TX - - - - - -
PA15 SPI1_NSS, I2S1_WS USART2_RX TIM2_CH1_ETR EVENTOUT - USB_NOE - -

STM32F042x4 STM32F042x6
 Table 15. Alternate functions selected through GPIOB_AFR registers for port B

STM32F042x4 STM32F042x6
Pin name AF0 AF1 AF2 AF3 AF4 AF5

PB0 EVENTOUT TIM3_CH3 TIM1_CH2N TSC_G3_IO2 - -

PB1 TIM14_CH1 TIM3_CH4 TIM1_CH3N TSC_G3_IO3 - -
PB2 - - - TSC_G3_IO4 - -
PB3 SPI1_SCK, I2S1_CK EVENTOUT TIM2_CH2 TSC_G5_IO1 - -
PB4 SPI1_MISO, I2S1_MCK TIM3_CH1 EVENTOUT TSC_G5_IO2 - TIM17_BKIN
PB5 SPI1_MOSI, I2S1_SD TIM3_CH2 TIM16_BKIN I2C1_SMBA - -
PB6 USART1_TX I2C1_SCL TIM16_CH1N TSC_G5_IO3 - -
PB7 USART1_RX I2C1_SDA TIM17_CH1N TSC_G5_IO4 - -
PB8 CEC I2C1_SCL TIM16_CH1 TSC_SYNC CAN_RX -
PB9 IR_OUT I2C1_SDA TIM17_CH1 EVENTOUT CAN_TX SPI2_NSS
DocID025832 Rev 4

PB10 CEC I2C1_SCL TIM2_CH3 TSC_SYNC - SPI2_SCK

PB11 EVENTOUT I2C1_SDA TIM2_CH4 - - -
PB12 SPI2_NSS EVENTOUT TIM1_BKIN - - -
PB13 SPI2_SCK - TIM1_CH1N - - I2C1_SCL
PB14 SPI2_MISO - TIM1_CH2N - - I2C1_SDA
PB15 SPI2_MOSI - TIM1_CH3N - - -

Pinouts and pin descriptions

Table 16. Alternate functions selected through GPIOF_AFR registers for port F
Pin name AF0 AF1

PF0 CRS_SYNC I2C1_SDA

PF1 - I2C1_SCL
39/118
Memory mapping STM32F042x4 STM32F042x6

5 Memory mapping

To the difference of STM32F042x6 memory map in Figure 10, the two bottom code memory
spaces of STM32F042x4 end at 0x0000 3FFF and 0x0800 3FFF, respectively.

Figure 10. STM32F042x6 memory map

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40/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Memory mapping

Table 17. STM32F042x4/x6 peripheral register boundary addresses

Bus Boundary address Size Peripheral

0x4800 1800 - 0x5FFF FFFF ~384 MB Reserved

0x4800 1400 - 0x4800 17FF 1 KB GPIOF
0x4800 0C00 - 0x4800 13FF 2 KB Reserved
AHB2 0x4800 0800 - 0x4800 0BFF 1 KB GPIOC
0x4800 0400 - 0x4800 07FF 1 KB GPIOB
0x4800 0000 - 0x4800 03FF 1 KB GPIOA
0x4002 4400 - 0x47FF FFFF ~128 MB Reserved
0x4002 4000 - 0x4002 43FF 1 KB TSC
0x4002 3400 - 0x4002 3FFF 3 KB Reserved
0x4002 3000 - 0x4002 33FF 1 KB CRC
0x4002 2400 - 0x4002 2FFF 3 KB Reserved
AHB1 0x4002 2000 - 0x4002 23FF 1 KB Flash memory interface
0x4002 1400 - 0x4002 1FFF 3 KB Reserved
0x4002 1000 - 0x4002 13FF 1 KB RCC
0x4002 0400 - 0x4002 0FFF 3 KB Reserved
0x4002 0000 - 0x4002 03FF 1 KB DMA
0x4001 8000 - 0x4001 FFFF 32 KB Reserved
0x4001 5C00 - 0x4001 7FFF 9 KB Reserved
0x4001 5800 - 0x4001 5BFF 1 KB DBGMCU
0x4001 4C00 - 0x4001 57FF 3 KB Reserved
0x4001 4800 - 0x4001 4BFF 1 KB TIM17
0x4001 4400 - 0x4001 47FF 1 KB TIM16
0x4001 3C00 - 0x4001 43FF 2 KB Reserved
0x4001 3800 - 0x4001 3BFF 1 KB USART1
APB 0x4001 3400 - 0x4001 37FF 1 KB Reserved
0x4001 3000 - 0x4001 33FF 1 KB SPI1/I2S1
0x4001 2C00 - 0x4001 2FFF 1 KB TIM1
0x4001 2800 - 0x4001 2BFF 1 KB Reserved
0x4001 2400 - 0x4001 27FF 1 KB ADC
0x4001 0800 - 0x4001 23FF 7 KB Reserved
0x4001 0400 - 0x4001 07FF 1 KB EXTI
0x4001 0000 - 0x4001 03FF 1 KB SYSCFG
0x4000 8000 - 0x4000 FFFF 32 KB Reserved

DocID025832 Rev 4 41/118

42
Memory mapping STM32F042x4 STM32F042x6

Table 17. STM32F042x4/x6 peripheral register boundary addresses (continued)

Bus Boundary address Size Peripheral

0x4000 7C00 - 0x4000 7FFF 1 KB Reserved

0x4000 7800 - 0x4000 7BFF 1 KB CEC
0x4000 7400 - 0x4000 77FF 1 KB Reserved
0x4000 7000 - 0x4000 73FF 1 KB PWR
0x4000 6C00 - 0x4000 6FFF 1 KB CRS
0x4000 6800 - 0x4000 6BFF0 1 KB Reserved
0x4000 6400 - 0x4000 67FF 1 KB BxCAN
0x4000 6000 - 0x4000 63FF 1 KB USB/CAN RAM
0x4000 5C00 - 0x4000 5FFF 1 KB USB
0x4000 5800 - 0x4000 5BFF 1 KB Reserved
0x4000 5400 - 0x4000 57FF 1 KB I2C1
0x4000 4800 - 0x4000 53FF 3 KB Reserved
0x4000 4400 - 0x4000 47FF 1 KB USART2
APB
0x4000 3C00 - 0x4000 43FF 2 KB Reserved
0x4000 3800 - 0x4000 3BFF 1 KB SPI2
0x4000 3400 - 0x4000 37FF 1 KB Reserved
0x4000 3000 - 0x4000 33FF 1 KB IWDG
0x4000 2C00 - 0x4000 2FFF 1 KB WWDG
0x4000 2800 - 0x4000 2BFF 1 KB RTC
0x4000 2400 - 0x4000 27FF 1 KB Reserved
0x4000 2000 - 0x4000 23FF 1 KB TIM14
0x4000 0800 - 0x4000 1FFF 6 KB Reserved
0x4000 0400 - 0x4000 07FF 1 KB TIM3
0x4000 0000 - 0x4000 03FF 1 KB TIM2

42/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Electrical characteristics

6 Electrical characteristics

6.1 Parameter conditions

Unless otherwise specified, all voltages are referenced to VSS.

6.1.1 Minimum and maximum values

Unless otherwise specified, the minimum and maximum values are guaranteed in the worst
conditions of ambient temperature, supply voltage and frequencies by tests in production on
100% of the devices with an ambient temperature at TA = 25 C and TA = TAmax (given by
the selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics
are indicated in the table footnotes and are not tested in production. Based on
characterization, the minimum and maximum values refer to sample tests and represent the
mean value plus or minus three times the standard deviation (mean 3).

6.1.2 Typical values

Unless otherwise specified, typical data are based on TA = 25 C, VDD = VDDA = 3.3 V. They
are given only as design guidelines and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from
a standard diffusion lot over the full temperature range, where 95% of the devices have an
error less than or equal to the value indicated (mean 2).

6.1.3 Typical curves

Unless otherwise specified, all typical curves are given only as design guidelines and are
not tested.

6.1.4 Loading capacitor

The loading conditions used for pin parameter measurement are shown in Figure 11.

6.1.5 Pin input voltage

The input voltage measurement on a pin of the device is described in Figure 12.

Figure 11. Pin loading conditions Figure 12. Pin input voltage

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DocID025832 Rev 4 43/118

90
Electrical characteristics STM32F042x4 STM32F042x6

6.1.6 Power supply scheme

Figure 13. Power supply scheme

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Caution: Each power supply pair (VDD/VSS, VDDA/VSSA etc.) must be decoupled with filtering ceramic
capacitors as shown above. These capacitors must be placed as close as possible to, or
below, the appropriate pins on the underside of the PCB to ensure the good functionality of
the device.

44/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Electrical characteristics

6.1.7 Current consumption measurement

Figure 14. Current consumption measurement scheme

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DocID025832 Rev 4 45/118

90
Electrical characteristics STM32F042x4 STM32F042x6

6.2 Absolute maximum ratings

Stresses above the absolute maximum ratings listed in Table 18: Voltage characteristics,
Table 19: Current characteristics and Table 20: Thermal characteristics may cause
permanent damage to the device. These are stress ratings only and functional operation of
the device at these conditions is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

Table 18. Voltage characteristics(1)

Symbol Ratings Min Max Unit

VDDVSS External main supply voltage 0.3 4.0 V

VDDIO2VSS External I/O supply voltage 0.3 4.0 V
VDDAVSS External analog supply voltage 0.3 4.0 V
VDDVDDA Allowed voltage difference for VDD > VDDA - 0.4 V
VBATVSS External backup supply voltage 0.3 4.0 V
(3)
Input voltage on FT and FTf pins VSS 0.3 VDDIOx + 4.0 V
VIN(2) Input voltage on TTa pins VSS 0.3 4.0 V
Input voltage on any other pin VSS 0.3 4.0 V
|VDDx| Variations between different VDD power pins - 50 mV
Variations between all the different ground
|VSSx VSS| - 50 mV
pins
Electrostatic discharge voltage see Section 6.3.12: Electrical
VESD(HBM) -
(human body model) sensitivity characteristics
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power
supply, in the permitted range.
2. VIN maximum must always be respected. Refer to Table 19: Current characteristics for the maximum
allowed injected current values.
3. Valid only if the internal pull-up/pull-down resistors are disabled. If internal pull-up or pull-down resistor is
enabled, the maximum limit is 4 V.

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STM32F042x4 STM32F042x6 Electrical characteristics

Table 19. Current characteristics

Symbol Ratings Max. Unit

IVDD Total current into sum of all VDD power lines (source)(1) 120
(1)
IVSS Total current out of sum of all VSS ground lines (sink) -120
(1)
IVDD(PIN) Maximum current into each VDD power pin (source) 100
IVSS(PIN) Maximum current out of each VSS ground pin (sink)(1) -100
Output current sunk by any I/O and control pin 25
IIO(PIN)
Output current source by any I/O and control pin -25
(2)
Total output current sunk by sum of all I/Os and control pins 80
IIO(PIN) Total output current sourced by sum of all I/Os and control pins(2) -80 mA
Total output current sourced by sum of all I/Os supplied by VDDIO2 -40
Injected current on FT and FTf pins -5/+0(4)
IINJ(PIN)(3) Injected current on TC and RST pin 5
Injected current on TTa pins(5) 5
IINJ(PIN) Total injected current (sum of all I/O and control pins)(6) 25
1. All main power (VDD, VDDA) and ground (VSS, VSSA) pins must always be connected to the external power supply, in the
permitted range.
2. This current consumption must be correctly distributed over all I/Os and control pins. The total output current must not be
sunk/sourced between two consecutive power supply pins referring to high pin count QFP packages.
3. A positive injection is induced by VIN > VDDIOx while a negative injection is induced by VIN < VSS. IINJ(PIN) must never be
exceeded. Refer to Table 18: Voltage characteristics for the maximum allowed input voltage values.
4. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum
value.
5. On these I/Os, a positive injection is induced by VIN > VDDA. Negative injection disturbs the analog performance of the
device. See note (2) below Table 56: ADC accuracy.
6. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and
negative injected currents (instantaneous values).

Table 20. Thermal characteristics

Symbol Ratings Value Unit

TSTG Storage temperature range 65 to +150 C

TJ Maximum junction temperature 150 C

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Electrical characteristics STM32F042x4 STM32F042x6

6.3 Operating conditions

6.3.1 General operating conditions

Table 21. General operating conditions

Symbol Parameter Conditions Min Max Unit

fHCLK Internal AHB clock frequency - 0 48

MHz
fPCLK Internal APB clock frequency - 0 48
VDD Standard operating voltage - 2.0 3.6 V
Must not be supplied if VDD
VDDIO2 I/O supply voltage 1.65 3.6 V
is not present
Analog operating voltage
VDD 3.6
(ADC not used) Must have a potential equal
VDDA V
Analog operating voltage to or higher than VDD
2.4 3.6
(ADC used)
VBAT Backup operating voltage - 1.65 3.6 V
TC and RST I/O -0.3 VDDIOx+0.3
VIN I/O input voltage TTa I/O -0.3 VDDA+0.3(1) V
FT and FTf I/O -0.3 5.5(1)
LQFP48 - 364
UFQFPN48 - 606
WLCSP36 - 313
Power dissipation at TA = 85 C
PD for suffix 6 or TA = 105 C for LQFP32 - 351 mW
suffix 7(2)
UFQFPN32 - 526
UFQFPN28 - 170
TSSOP20 - 263

Ambient temperature for the Maximum power dissipation 40 85

C
suffix 6 version Low power dissipation (3)
40 105
TA
Ambient temperature for the Maximum power dissipation 40 105
C
suffix 7 version Low power dissipation(3) 40 125
Suffix 6 version 40 105
TJ Junction temperature range C
Suffix 7 version 40 125
1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.
2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.8: Thermal characteristics.
3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.8:
Thermal characteristicsSection 7.8: Thermal characteristics).

6.3.2 Operating conditions at power-up / power-down

The parameters given in Table 22 are derived from tests performed under the ambient
temperature condition summarized in Table 21.

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Table 22. Operating conditions at power-up / power-down

Symbol Parameter Conditions Min Max Unit

VDD rise time rate 0

tVDD -
VDD fall time rate 20
s/V
VDDA rise time rate 0
tVDDA -
VDDA fall time rate 20

6.3.3 Embedded reset and power control block characteristics

The parameters given in Table 23 are derived from tests performed under the ambient
temperature and supply voltage conditions summarized in Table 21: General operating
conditions.

Table 23. Embedded reset and power control block characteristics

Symbol Parameter Conditions Min Typ Max Unit

Power on/power down Falling edge(2) 1.80 1.88 1.96(3) V

VPOR/PDR(1)
reset threshold Rising edge 1.84(3) 1.92 2.00 V
VPDRhyst PDR hysteresis - - 40 - mV
tRSTTEMPO(4) Reset temporization - 1.50 2.50 4.50 ms
1. The PDR detector monitors VDD and also VDDA (if kept enabled in the option bytes). The POR detector
monitors only VDD.
2. The product behavior is guaranteed by design down to the minimum VPOR/PDR value.
3. Data based on characterization results, not tested in production.
4. Guaranteed by design, not tested in production.

Table 24. Programmable voltage detector characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rising edge 2.1 2.18 2.26 V

VPVD0 PVD threshold 0
Falling edge 2 2.08 2.16 V
Rising edge 2.19 2.28 2.37 V
VPVD1 PVD threshold 1
Falling edge 2.09 2.18 2.27 V
Rising edge 2.28 2.38 2.48 V
VPVD2 PVD threshold 2
Falling edge 2.18 2.28 2.38 V
Rising edge 2.38 2.48 2.58 V
VPVD3 PVD threshold 3
Falling edge 2.28 2.38 2.48 V
Rising edge 2.47 2.58 2.69 V
VPVD4 PVD threshold 4
Falling edge 2.37 2.48 2.59 V
Rising edge 2.57 2.68 2.79 V
VPVD5 PVD threshold 5
Falling edge 2.47 2.58 2.69 V

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Table 24. Programmable voltage detector characteristics (continued)

Symbol Parameter Conditions Min Typ Max Unit

Rising edge 2.66 2.78 2.9 V

VPVD6 PVD threshold 6
Falling edge 2.56 2.68 2.8 V
Rising edge 2.76 2.88 3 V
VPVD7 PVD threshold 7
Falling edge 2.66 2.78 2.9 V
VPVDhyst(1) PVD hysteresis - 100 - mV
IDD(PVD) PVD current consumption - 0.15 0.26(1) A
1. Guaranteed by design, not tested in production.

6.3.4 Embedded reference voltage

The parameters given in Table 25 are derived from tests performed under the ambient
temperature and supply voltage conditions summarized in Table 21: General operating
conditions.

Table 25. Embedded internal reference voltage

Symbol Parameter Conditions Min Typ Max Unit

VREFINT Internal reference voltage 40 C < TA < +105 C 1.16 1.2 1.25 V
ADC_IN17 buffer startup
tSTART - - - 10(1) s
time
ADC sampling time when
tS_vrefint reading the internal - 4(1) - - s
reference voltage
Internal reference voltage
VREFINT spread over the VDDA = 3 V - - 10(1) mV
temperature range

TCoeff Temperature coefficient - - 100(1) - 100(1) ppm/C

1. Guaranteed by design, not tested in production.

6.3.5 Supply current characteristics

The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 14: Current consumption
measurement scheme.
All Run-mode current consumption measurements given in this section are performed with a
reduced code that gives a consumption equivalent to CoreMark code.

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Typical and maximum current consumption

The MCU is placed under the following conditions:
All I/O pins are in analog input mode
All peripherals are disabled except when explicitly mentioned
The Flash memory access time is adjusted to the fHCLK frequency:
0 wait state and Prefetch OFF from 0 to 24 MHz
1 wait state and Prefetch ON above 24 MHz
When the peripherals are enabled fPCLK = fHCLK
The parameters given in Table 26 to Table 28 are derived from tests performed under
ambient temperature and supply voltage conditions summarized in Table 21: General
operating conditions.

Table 26. Typical and maximum current consumption from VDD supply at VDD = 3.6 V
All peripherals enabled(1) All peripherals disabled
Parameter
Symbol

Conditions fHCLK Max @ TA(2) Max @ TA(2) Unit

Typ Typ
25 C 85 C 105 C 25 C 85 C 105 C

HSI48 48 MHz 20.3 23.2 23.4 24.6 12.7 14.4 14.4 14.7
48 MHz 20.2 22.9 23.0 23.9 12.6 14.1 14.3 14.4
code executing from Flash memory

HSE bypass,
Supply current in Run mode,

32 MHz 14.0 16.0 16.1 16.7 8.7 9.5 9.7 10.3

PLL on
24 MHz 11.0 13.5 13.7 13.8 6.9 7.6 7.8 8.2

HSE bypass, 8 MHz 3.9 5.2 5.3 5.6 2.6 3.1 3.2 3.3
IDD PLL off 1 MHz 0.9 1.3 1.5 1.8 0.7 1.0 1.1 1.3 mA

48 MHz 20.5 23.1 23.3 23.6 12.8 14.6 14.6 15.0

HSI clock,
32 MHz 14.3 15.6 15.9 17.0 8.6 9.5 9.7 10.0
PLL on
24 MHz 11.2 13.6 13.8 14.8 6.9 7.4 7.5 7.7
HSI clock,
8 MHz 4.1 5.2 5.3 5.6 2.6 3.1 3.1 3.3
PLL off

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Table 26. Typical and maximum current consumption from VDD supply at VDD = 3.6 V (continued)
Parameter All peripherals enabled(1) All peripherals disabled
Symbol

Conditions fHCLK Max @ TA(2) Max @ TA(2) Unit

Typ Typ
25 C 85 C 105 C 25 C 85 C 105 C

HSI48 48 MHz 19.3 21.9 22.1 23.7 11.9 13.4 13.6 13.7
(3) 22.1(3) 13.3(3) 13.7(3)
48 MHz 19.2 21.8 22.0 11.7 13.5
HSE bypass,
Supply current in Run mode,

32 MHz 13.4 15.8 15.9 16.0 7.9 8.8 8.9 9.7

code executing from RAM

PLL on
24 MHz 10.3 12.6 13.0 13.4 6.2 8.0 8.2 8.3

HSE bypass, 8 MHz 3.6 4.1 4.3 4.4 2.0 2.1 2.1 2.5
PLL off 1 MHz 0.8 0.9 0.9 1.1 0.4 0.5 0.6 0.8
48 MHz 19.5 22.0 22.1 22.5 11.8 13.6 13.8 13.9
HSI clock,
32 MHz 13.5 16.3 16.4 16.6 8.0 8.8 9.1 9.9
PLL on
24 MHz 10.5 12.8 13.0 13.8 6.5 8.0 8.1 8.4
HSI clock,
8 MHz 3.7 4.7 5.0 5.3 2.1 2.3 2.4 3.0
PLL off
IDD mA
HSI48 48 MHz 12.4 15.1 16.3 16.7 3.0 3.2 3.3 3.4
48 MHz 12.3 15.0(3) 16.0 16.2(3) 2.9 3.2(3) 3.3 3.4(3)
HSE bypass,
Supply current in Sleep mode

32 MHz 8.5 10.6 11.2 11.7 1.9 2.1 2.2 2.5

PLL on
24 MHz 6.5 8.1 8.5 8.7 1.6 1.8 1.8 1.9

HSE bypass, 8 MHz 2.3 3.0 3.1 3.2 0.7 0.8 0.8 0.9
PLL off 1 MHz 0.4 0.4 0.4 0.6 0.1 0.3 0.3 0.4
48 MHz 12.4 15.3 15.7 15.9 3.0 3.0 3.2 3.4
HSI clock,
32 MHz 8.6 10.7 11.3 11.6 2.1 2.2 2.2 2.5
PLL on
24 MHz 6.6 8.4 8.7 8.9 1.6 1.6 1.7 1.9
HSI clock,
8 MHz 2.4 3.2 3.4 3.6 0.6 0.8 0.9 1.0
PLL off
1. USB is kept disabled as this IP functions only with a 48 MHz clock.
2. Data based on characterization results, not tested in production unless otherwise specified.
3. Data based on characterization results and tested in production (using one common test limit for sum of IDD and IDDA).

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Table 27. Typical and maximum current consumption from the VDDA supply
VDDA = 2.4 V VDDA = 3.6 V
Para- Conditions
Symbol (1) fHCLK Max @ TA(2) Max @ TA(2) Unit
meter
Typ Typ
25 C 85 C 105 C 25 C 85 C 105 C

HSI48 48 MHz 309 325 332 342 317 334 338 344
(3) (3) (3)
48 MHz 148 167 176 179 161 181 193 197(3)
HSE
Supply
bypass, 32 MHz 102 119 124 126 111 128 135 137
current in
PLL on
Run or 24 MHz 80 95 99 100 88 102 106 108
Sleep
HSE 8 MHz 2.7 3.7 4.2 4.5 3.5 4.7 5.2 5.5
mode,
bypass,
IDDA code 1 MHz 2.7 3.7 4.2 4.2 3.6 4.7 5.2 5.5 A
PLL off
executing
from 48 MHz 220 242 251 254 242 264 275 279
Flash HSI clock,
32 MHz 173 193 200 202 191 211 219 221
memory PLL on
or RAM 24 MHz 151 169 175 177 167 184 191 193
HSI clock,
8 MHz 72 82 85 85 82 92 95 95
PLL off
1. Current consumption from the VDDA supply is independent of whether the digital peripherals are enabled or disabled, being
in Run or Sleep mode or executing from Flash memory or RAM. Furthermore, when the PLL is off, IDDA is independent from
the frequency.
2. Data based on characterization results, not tested in production unless otherwise specified.
3. Data based on characterization results and tested in production (using one common test limit for sum of IDD and IDDA).

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Table 28. Typical and maximum consumption in Stop and Standby modes
Typ @VDD (VDD = VDDA) Max(1)
Parameter
Symbol

Unit
Conditions
TA = TA = TA =
2.0 V 2.4 V 2.7 V 3.0 V 3.3 V 3.6 V
25C 85C 105C

Regulator in run
mode, all 14.3 14.5 14.6 14.7 14.8 14.9 21.0 47.0 64.0
Supply oscillators OFF
current in
Stop mode Regulator in low-
power mode, all 2.9 3.1 3.2 3.3 3.4 3.5 6.5 32.0 44.0
IDD oscillators OFF

Supply LSI ON and IWDG

0.8 0.9 1.1 1.2 1.3 1.5 - - -
current in ON
Standby LSI OFF and IWDG
mode 0.6 0.7 0.8 0.9 1.0 1.1 2.0 2.5 3.0
OFF
Regulator in
run mode, all
2.0 2.1 2.2 2.4 2.5 2.7 3.5 3.5 4.5
oscillators
Supply OFF
VDDA monitoring ON

current in Regulator in
Stop mode low-power
mode, all 2.0 2.1 2.2 2.4 2.5 2.7 3.5 3.5 4.5
oscillators
OFF A

Supply LSI ON and

2.4 2.6 2.8 3.0 3.1 3.4 - - -
current in IWDG ON
Standby LSI OFF and
mode 1.9 2.0 2.1 2.3 2.4 2.5 3.4 3.5 4.5
IWDG OFF
IDDA
Regulator in
run mode, all
1.3 1.3 1.3 1.4 1.4 1.5 - - -
oscillators
Supply OFF
VDDA monitoring OFF

current in Regulator in
Stop mode low-power
mode, all 1.3 1.3 1.3 1.4 1.4 1.5 - - -
oscillators
OFF

Supply LSI ON and

1.7 1.8 1.8 2.0 2.1 2.2 - - -
current in IWDG ON
Standby LSI OFF and
mode 1.1 1.2 1.2 1.3 1.3 1.4 - - -
IWDG OFF
1. Data based on characterization results, not tested in production unless otherwise specified.

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Table 29. Typical and maximum current consumption from the VBAT supply
Typ @ VBAT Max(1)

Symbol Parameter Conditions Unit

1.65 V

2.7 V
TA = TA = TA =

1.8 V

2.4 V

3.3 V

3.6 V
25 C 85 C 105 C

LSE & RTC ON; Xtal

mode: lower driving
0.5 0.5 0.6 0.7 0.9 1.1 1.2 1.5 2.0
RTC capability;
domain LSEDRV[1:0] = '00'
IDD_VBAT A
supply LSE & RTC ON; Xtal
current mode higher driving
0.8 0.9 1.1 1.2 1.4 1.5 1.6 2.0 2.6
capability;
LSEDRV[1:0] = '11'
1. Data based on characterization results, not tested in production.

Typical current consumption

The MCU is placed under the following conditions:
VDD = VDDA = 3.3 V
All I/O pins are in analog input configuration
The Flash memory access time is adjusted to fHCLK frequency:
0 wait state and Prefetch OFF from 0 to 24 MHz
1 wait state and Prefetch ON above 24 MHz
When the peripherals are enabled, fPCLK = fHCLK
PLL is used for frequencies greater than 8 MHz
AHB prescaler of 2, 4, 8 and 16 is used for the frequencies 4 MHz, 2 MHz, 1 MHz and
500 kHz respectively

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Table 30. Typical current consumption, code executing from Flash memory,
running from HSE 8 MHz crystal
Typical consumption in Typical consumption in
Run mode Sleep mode
Symbol Parameter fHCLK Unit
Peripherals Peripherals Peripherals Peripherals
enabled disabled enabled disabled

48 MHz 20.7 12.8 12.3 3.4

36 MHz 15.9 9.9 9.5 2.7
32 MHz 14.3 9.0 8.5 2.5
24 MHz 11.0 7.1 6.6 2.1
Current
consumption 16 MHz 7.7 5.0 4.7 1.6
IDD mA
from VDD 8 MHz 4.3 3.0 2.7 1.2
supply
4 MHz 2.6 2.0 1.7 0.9
2 MHz 1.8 1.5 1.2 0.8
1 MHz 1.4 1.2 1.0 0.8
500 kHz 1.2 1.1 0.8 0.7
48 MHz 163.3
36 MHz 124.3
32 MHz 111.9
24 MHz 87.1
Current
consumption 16 MHz 62.5
IDDA A
from VDDA 8 MHz 2.5
supply
4 MHz 2.5
2 MHz 2.5
1 MHz 2.5
500 kHz 2.5

I/O system current consumption

The current consumption of the I/O system has two components: static and dynamic.
I/O static current consumption
All the I/Os used as inputs with pull-up generate current consumption when the pin is
externally held low. The value of this current consumption can be simply computed by using
the pull-up/pull-down resistors values given in Table 50: I/O static characteristics.
For the output pins, any external pull-down or external load must also be considered to
estimate the current consumption.
Additional I/O current consumption is due to I/Os configured as inputs if an intermediate
voltage level is externally applied. This current consumption is caused by the input Schmitt

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trigger circuits used to discriminate the input value. Unless this specific configuration is
required by the application, this supply current consumption can be avoided by configuring
these I/Os in analog mode. This is notably the case of ADC input pins which should be
configured as analog inputs.
Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently,
as a result of external electromagnetic noise. To avoid current consumption related to
floating pins, they must either be configured in analog mode, or forced internally to a definite
digital value. This can be done either by using pull-up/down resistors or by configuring the
pins in output mode.
I/O dynamic current consumption
In addition to the internal peripheral current consumption measured previously (see
Table 32: Peripheral current consumption), the I/Os used by an application also contribute
to the current consumption. When an I/O pin switches, it uses the current from the I/O
supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load
(internal or external) connected to the pin:

I SW = V DDIOx f SW C

where
ISW is the current sunk by a switching I/O to charge/discharge the capacitive load
VDDIOx is the I/O supply voltage
fSW is the I/O switching frequency
C is the total capacitance seen by the I/O pin: C = CINT + CEXT + CS
CS is the PCB board capacitance including the pad pin.
The test pin is configured in push-pull output mode and is toggled by software at a fixed
frequency.

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Table 31. Switching output I/O current consumption

I/O toggling
Symbol Parameter Conditions(1) Typ Unit
frequency (fSW)

4 MHz 0.07

8 MHz 0.15
VDDIOx = 3.3 V
C =CINT 16 MHz 0.31
24 MHz 0.53
48 MHz 0.92
4 MHz 0.18

VDDIOx = 3.3 V 8 MHz 0.37

CEXT = 0 pF 16 MHz 0.76
C = CINT + CEXT+ CS 24 MHz 1.39
48 MHz 2.188
4 MHz 0.32

VDDIOx = 3.3 V 8 MHz 0.64

CEXT = 10 pF 16 MHz 1.25
C = CINT + CEXT+ CS 24 MHz 2.23

I/O current 48 MHz 4.442

ISW mA
consumption
4 MHz 0.49
VDDIOx = 3.3 V
8 MHz 0.94
CEXT = 22 pF
16 MHz 2.38
C = CINT + CEXT+ CS
24 MHz 3.99
4 MHz 0.64
VDDIOx = 3.3 V 8 MHz 1.25
CEXT = 33 pF
16 MHz 3.24
C = CINT + CEXT+ CS
24 MHz 5.02
VDDIOx = 3.3 V 4 MHz 0.81
CEXT = 47 pF 8 MHz 1.7
C = CINT + CEXT+ CS
C = Cint 16 MHz 3.67

4 MHz 0.66
VDDIOx = 2.4 V
CEXT = 47 pF 8 MHz 1.43
C = CINT + CEXT+ CS 16 MHz 2.45
C = Cint
24 MHz 4.97
1. CS = 7 pF (estimated value).

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On-chip peripheral current consumption

The current consumption of the on-chip peripherals is given in Table 32. The MCU is placed
under the following conditions:
All I/O pins are in analog mode
All peripherals are disabled unless otherwise mentioned
The given value is calculated by measuring the current consumption
with all peripherals clocked off
with only one peripheral clocked on
Ambient operating temperature and supply voltage conditions summarized in Table 18:
Voltage characteristics

Table 32. Peripheral current consumption

Peripheral Typical consumption at 25 C Unit

BusMatrix(1) 2.2
CRC 1.9
DMA 5.1
Flash memory interface 15.0
GPIOA 8.2
AHB GPIOB 7.7 A/MHz
GPIOC 2.1
GPIOF 1.8
SRAM 1.1
TSC 4.9
All AHB peripherals 49.8

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Table 32. Peripheral current consumption (continued)

Peripheral Typical consumption at 25 C Unit
(2)
APB-Bridge 2.9
ADC(3) 3.9
CAN 12.9
CEC 1.5
CRS 1.0
DBG (MCU Debug Support) 0.2
I2C1 3.6
PWR 1.4
SPI1 8.5
SPI2 6.1
SYSCFG 1.8
APB A/MHz
TIM1 15.1
TIM2 16.8
TIM3 11.7
TIM14 5.5
TIM16 7.0
TIM17 6.9
USART1 17.8
USART2 5.6
USB 4.9
WWDG 1.4
All APB peripherals 136.7
1. The BusMatrix is automatically active when at least one master is ON (CPU, DMA).
2. The APB Bridge is automatically active when at least one peripheral is ON on the Bus.
3. The power consumption of the analog part (IDDA) of peripherals such as ADC is not included. Refer to the
tables of characteristics in the subsequent sections.

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6.3.6 Wakeup time from low-power mode

The wakeup times given in Table 33 are the latency between the event and the execution of
the first user instruction. The device goes in low-power mode after the WFE (Wait For
Event) instruction, in the case of a WFI (Wait For Interruption) instruction, 16 CPU cycles
must be added to the following timings due to the interrupt latency in the Cortex M0
architecture.
The SYSCLK clock source setting is kept unchanged after wakeup from Sleep mode.
During wakeup from Stop or Standby mode, SYSCLK takes the default setting: HSI 8 MHz.
The wakeup source from Sleep and Stop mode is an EXTI line configured in event mode.
The wakeup source from Standby mode is the WKUP1 pin (PA0).
All timings are derived from tests performed under the ambient temperature and supply
voltage conditions summarized in Table 21: General operating conditions..

Table 33. Low-power mode wakeup timings

Typ @VDD = VDDA
Symbol Parameter Conditions Max Unit
= 2.0 V = 2.4 V = 2.7 V =3V = 3.3 V

Regulator in run
3.2 3.1 2.9 2.9 2.8 5
Wakeup from Stop mode
tWUSTOP
mode Regulator in low
7.0 5.8 5.2 4.9 4.6 9
power mode
s
Wakeup from
tWUSTANDBY - 60.4 55.6 53.5 52 51 -
Standby mode
Wakeup from Sleep
tWUSLEEP - 4 SYSCLK cycles -
mode

6.3.7 External clock source characteristics

High-speed external user clock generated from an external source
In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO.
The external clock signal has to respect the I/O characteristics in Section 6.3.14. However,
the recommended clock input waveform is shown in Figure 15: High-speed external clock
source AC timing diagram.

Table 34. High-speed external user clock characteristics

Symbol Parameter(1) Min Typ Max Unit

fHSE_ext User external clock source frequency - 8 32 MHz

VHSEH OSC_IN input pin high level voltage 0.7 VDDIOx - VDDIOx
V
VHSEL OSC_IN input pin low level voltage VSS - 0.3 VDDIOx
tw(HSEH)
OSC_IN high or low time 15 - -
tw(HSEL)
ns
tr(HSE)
OSC_IN rise or fall time - - 20
tf(HSE)

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1. Guaranteed by design, not tested in production.

Figure 15. High-speed external clock source AC timing diagram

WZ+6(+

9+6(+


9+6(/

WU+6( W
WI+6( WZ+6(/
7+6(

069

Low-speed external user clock generated from an external source

In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO.
The external clock signal has to respect the I/O characteristics in Section 6.3.14. However,
the recommended clock input waveform is shown in Figure 16.

Table 35. Low-speed external user clock characteristics

Symbol Parameter(1) Min Typ Max Unit

fLSE_ext User external clock source frequency - 32.768 1000 kHz

VLSEH OSC32_IN input pin high level voltage 0.7 VDDIOx - VDDIOx
V
VLSEL OSC32_IN input pin low level voltage VSS - 0.3 VDDIOx
tw(LSEH)
OSC32_IN high or low time 450 - -
tw(LSEL)
ns
tr(LSE)
OSC32_IN rise or fall time - - 50
tf(LSE)
1. Guaranteed by design, not tested in production.

Figure 16. Low-speed external clock source AC timing diagram

WZ/6(+

9/6(+


9/6(/

WU/6( W
WI/6( WZ/6(/
7/6(

069

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High-speed external clock generated from a crystal/ceramic resonator

The high-speed external (HSE) clock can be supplied with a 4 to 32 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on design
simulation results obtained with typical external components specified in Table 36. In the
application, the resonator and the load capacitors have to be placed as close as possible to
the oscillator pins in order to minimize output distortion and startup stabilization time. Refer
to the crystal resonator manufacturer for more details on the resonator characteristics
(frequency, package, accuracy).

Table 36. HSE oscillator characteristics

Symbol Parameter Conditions(1) Min(2) Typ Max(2) Unit

fOSC_IN Oscillator frequency - 4 8 32 MHz

RF Feedback resistor - - 200 - k
(3)
During startup - 8.5
VDD = 3.3 V,
Rm = 30 , - 0.4 -
CL = 10 pF@8 MHz
VDD = 3.3 V,
Rm = 45 , - 0.5 -
CL = 10 pF@8 MHz

IDD HSE current consumption VDD = 3.3 V, mA

Rm = 30 , - 0.8 -
CL = 5 pF@32 MHz
VDD = 3.3 V,
Rm = 30 , - 1 -
CL = 10 pF@32 MHz
VDD = 3.3 V,
Rm = 30 , - 1.5 -
CL = 20 pF@32 MHz
gm Oscillator transconductance Startup 10 - - mA/V
tSU(HSE)(4) Startup time VDD is stabilized - 2 - ms
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Guaranteed by design, not tested in production.
3. This consumption level occurs during the first 2/3 of the tSU(HSE) startup time
4. tSU(HSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer

For CL1 and CL2, it is recommended to use high-quality external ceramic capacitors in the
5 pF to 20 pF range (Typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see Figure 17). CL1 and CL2 are usually the
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of CL1 and CL2. PCB and MCU pin capacitance must be included (10 pF
can be used as a rough estimate of the combined pin and board capacitance) when sizing
CL1 and CL2.
Note: For information on selecting the crystal, refer to the application note AN2867 Oscillator
design guide for ST microcontrollers available from the ST website www.st.com.

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Figure 17. Typical application with an 8 MHz crystal

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1. REXT value depends on the crystal characteristics.

Low-speed external clock generated from a crystal resonator

The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal resonator
oscillator. All the information given in this paragraph are based on design simulation results
obtained with typical external components specified in Table 37. In the application, the
resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).

Table 37. LSE oscillator characteristics (fLSE = 32.768 kHz)

Symbol Parameter Conditions(1) Min(2) Typ Max(2) Unit

LSEDRV[1:0]=00
- 0.5 0.9
lower driving capability
LSEDRV[1:0]= 01
- - 1
medium low driving capability
IDD LSE current consumption A
LSEDRV[1:0] = 10
- - 1.3
medium high driving capability
LSEDRV[1:0]=11
- - 1.6
higher driving capability

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Table 37. LSE oscillator characteristics (fLSE = 32.768 kHz)

Symbol Parameter Conditions(1) Min(2) Typ Max(2) Unit

LSEDRV[1:0]=00
5 - -
lower driving capability
LSEDRV[1:0]= 01
8 - -
Oscillator medium low driving capability
gm A/V
transconductance LSEDRV[1:0] = 10
15 - -
medium high driving capability
LSEDRV[1:0]=11
25 - -
higher driving capability
tSU(LSE)(3) Startup time VDDIOx is stabilized - 2 - s
1. Refer to the note and caution paragraphs below the table, and to the application note AN2867 Oscillator design guide for
ST microcontrollers.
2. Guaranteed by design, not tested in production.
3. tSU(LSE) is the startup time measured from the moment it is enabled (by software) to a stabilized 32.768 kHz oscillation is
reached. This value is measured for a standard crystal and it can vary significantly with the crystal manufacturer

Note: For information on selecting the crystal, refer to the application note AN2867 Oscillator
design guide for ST microcontrollers available from the ST website www.st.com.

Figure 18. Typical application with a 32.768 kHz crystal

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Note: An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden
to add one.

6.3.8 Internal clock source characteristics

The parameters given in Table 38 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 21: General operating
conditions. The provided curves are characterization results, not tested in production.

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High-speed internal (HSI) RC oscillator

Table 38. HSI oscillator characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

fHSI Frequency - - 8 - MHz

(2)
TRIM HSI user trimming step - - - 1 %
DuCy(HSI) (2) (2)
Duty cycle - 45 - 55 %
(3) (3)
TA = -40 to 105C -2.8 - 3.8
TA = -10 to 85C -1.9(3) - 2.3(3)

Accuracy of the HSI TA = 0 to 85C -1.9(3) - 2(3)

ACCHSI %
oscillator TA = 0 to 70C -1.3(3) - 2(3)
TA = 0 to 55C -1(3) - 2(3)
TA = 25C(4) -1 - 1
tsu(HSI) HSI oscillator startup time - 1(2) - 2(2) s
HSI oscillator power
IDDA(HSI) - - 80 100(2) A
consumption
1. VDDA = 3.3 V, TA = -40 to 105C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.
4. Factory calibrated, parts not soldered.

Figure 19. HSI oscillator accuracy characterization results for soldered parts
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High-speed internal 14 MHz (HSI14) RC oscillator (dedicated to ADC)

Table 39. HSI14 oscillator characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

fHSI14 Frequency - - 14 - MHz

(2)
TRIM HSI14 user-trimming step - - - 1 %
DuCy(HSI14) Duty cycle (2) (2)
- 45 - 55 %
TA = 40 to 105 C 4.2 (3) (3)
- 5.1 %

Accuracy of the HSI14 TA = 10 to 85 C 3.2(3) - 3.1(3) %

ACCHSI14
oscillator (factory calibrated) TA = 0 to 70 C 2.5 (3)
- 2.3 (3)
%
TA = 25 C 1 - 1 %
tsu(HSI14) HSI14 oscillator startup time - 1(2) - 2(2) s
HSI14 oscillator power
IDDA(HSI14) - - 100 150(2) A
consumption
1. VDDA = 3.3 V, TA = 40 to 105 C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.

Figure 20. HSI14 oscillator accuracy characterization results


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High-speed internal 48 MHz (HSI48) RC oscillator

Table 40. HSI48 oscillator characteristics(1)

Symbol Parameter Conditions Min Typ Max Unit

fHSI48 Frequency - - 48 - MHz

(2) (2)
TRIM HSI48 user-trimming step - 0.09 0.14 0.2 %
DuCy(HSI48) Duty cycle (2) (2)
- 45 - 55 %
TA = 40 to 105 C (3) (3)
-4.9 - 4.7 %

Accuracy of the HSI48 TA = 10 to 85 C -4.1(3) - 3.7(3) %

ACCHSI48
oscillator (factory calibrated) T = 0 to 70 C -3.8 (3)
- 3.4 (3)
%
A

TA = 25 C -2.8 - 2.9 %
tsu(HSI48) HSI48 oscillator startup time - - - 6(2) s
HSI48 oscillator power
IDDA(HSI48) - - 312 350(2) A
consumption
1. VDDA = 3.3 V, TA = 40 to 105 C unless otherwise specified.
2. Guaranteed by design, not tested in production.
3. Data based on characterization results, not tested in production.

Figure 21. HSI48 oscillator accuracy characterization results


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Low-speed internal (LSI) RC oscillator

Table 41. LSI oscillator characteristics(1)

Symbol Parameter Min Typ Max Unit

fLSI Frequency 30 40 50 kHz

(2)
tsu(LSI) LSI oscillator startup time - - 85 s
IDDA(LSI)(2) LSI oscillator power consumption - 0.75 1.2 A
1. VDDA = 3.3 V, TA = 40 to 105 C unless otherwise specified.
2. Guaranteed by design, not tested in production.

6.3.9 PLL characteristics

The parameters given in Table 42 are derived from tests performed under ambient
temperature and supply voltage conditions summarized in Table 21: General operating
conditions.

Table 42. PLL characteristics

Value
Symbol Parameter Unit
Min Typ Max

PLL input clock(1) 1(2) 8.0 24(2) MHz

fPLL_IN
(2)
PLL input clock duty cycle 40 - 60(2) %
fPLL_OUT PLL multiplier output clock 16(2) - 48 MHz
tLOCK PLL lock time - - 200(2) s
JitterPLL Cycle-to-cycle jitter - - 300(2) ps
1. Take care to use the appropriate multiplier factors to obtain PLL input clock values compatible with the
range defined by fPLL_OUT.
2. Guaranteed by design, not tested in production.

6.3.10 Memory characteristics

Flash memory
The characteristics are given at TA = 40 to 105 C unless otherwise specified.

Table 43. Flash memory characteristics

Symbol Parameter Conditions Min Typ Max(1) Unit

tprog 16-bit programming time TA = 40 to +105 C 40 53.5 60 s

tERASE Page (1 KB) erase time TA = 40 to +105 C 20 - 40 ms
tME Mass erase time TA = 40 to +105 C 20 - 40 ms
Write mode - - 10 mA
IDD Supply current
Erase mode - - 12 mA
1. Guaranteed by design, not tested in production.

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Table 44. Flash memory endurance and data retention

Symbol Parameter Conditions Min(1) Unit

NEND Endurance TA = 40 to +105 C 10 kcycle

1 kcycle(2) at TA = 85 C 30
tRET (2)
Data retention 1 kcycle at TA = 105 C 10 Year
10 kcycle(2) at TA = 55 C 20
1. Data based on characterization results, not tested in production.
2. Cycling performed over the whole temperature range.

6.3.11 EMC characteristics

Susceptibility tests are performed on a sample basis during device characterization.

Functional EMS (electromagnetic susceptibility)

While a simple application is executed on the device (toggling 2 LEDs through I/O ports).
the device is stressed by two electromagnetic events until a failure occurs. The failure is
indicated by the LEDs:
Electrostatic discharge (ESD) (positive and negative) is applied to all device pins until
a functional disturbance occurs. This test is compliant with the IEC 61000-4-2 standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and
VSS through a 100 pF capacitor, until a functional disturbance occurs. This test is
compliant with the IEC 61000-4-4 standard.
A device reset allows normal operations to be resumed.
The test results are given in Table 45. They are based on the EMS levels and classes
defined in application note AN1709.

Table 45. EMS characteristics

Level/
Symbol Parameter Conditions
Class

VDD = 3.3 V, LQFP48, TA = +25 C,

Voltage limits to be applied on any I/O pin
VFESD fHCLK = 48 MHz, 3B
to induce a functional disturbance
conforming to IEC 61000-4-2
Fast transient voltage burst limits to be VDD = 3.3 V, LQFP48, TA = +25C,
VEFTB applied through 100 pF on VDD and VSS fHCLK = 48 MHz, 4B
pins to induce a functional disturbance conforming to IEC 61000-4-4

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.

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Software recommendations
The software flowchart must include the management of runaway conditions such as:
Corrupted program counter
Unexpected reset
Critical Data corruption (for example control registers)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with
IEC 61967-2 standard which specifies the test board and the pin loading.

Table 46. EMI characteristics

Max vs. [fHSE/fHCLK]
Monitored
Symbol Parameter Conditions Unit
frequency band
8/48 MHz

0.1 to 30 MHz -9
VDD = 3.6 V, TA = 25 C,
LQFP48 package 30 to 130 MHz 9 dBV
SEMI Peak level
compliant with 130 MHz to 1 GHz 17
IEC 61967-2
EMI Level 3 -

6.3.12 Electrical sensitivity characteristics

Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.

Electrostatic discharge (ESD)

Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts (n+1) supply pins). This test
conforms to the JESD22-A114/C101 standard.

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Table 47. ESD absolute maximum ratings

Maximum
Symbol Ratings Conditions Packages Class Unit
value(1)

Electrostatic discharge voltage TA = +25 C, conforming

VESD(HBM) All 2 2000 V
(human body model) to JESD22-A114
Electrostatic discharge voltage TA = +25 C, conforming
VESD(CDM) All C4 500 V
(charge device model) to ANSI/ESD STM5.3.1
1. Data based on characterization results, not tested in production.

Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:
A supply overvoltage is applied to each power supply pin.
A current injection is applied to each input, output and configurable I/O pin.
These tests are compliant with EIA/JESD 78A IC latch-up standard.

Table 48. Electrical sensitivities

Symbol Parameter Conditions Class

LU Static latch-up class TA = +105 C conforming to JESD78A II level A

6.3.13 I/O current injection characteristics

As a general rule, current injection to the I/O pins, due to external voltage below VSS or
above VDDIOx (for standard, 3.3 V-capable I/O pins) should be avoided during normal
product operation. However, in order to give an indication of the robustness of the
microcontroller in cases when abnormal injection accidentally happens, susceptibility tests
are performed on a sample basis during device characterization.

Functional susceptibility to I/O current injection

While a simple application is executed on the device, the device is stressed by injecting
current into the I/O pins programmed in floating input mode. While current is injected into
the I/O pin, one at a time, the device is checked for functional failures.
The failure is indicated by an out of range parameter: ADC error above a certain limit (higher
than 5 LSB TUE), out of conventional limits of induced leakage current on adjacent pins (out
of the -5 A/+0 A range) or other functional failure (for example reset occurrence or
oscillator frequency deviation).
The characterization results are given in Table 49.
Negative induced leakage current is caused by negative injection and positive induced
leakage current is caused by positive injection.

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Table 49. I/O current injection susceptibility

Functional
susceptibility
Symbol Description Unit
Negative Positive
injection injection

Injected current on PA12 pin -0 +5

Injected current on PA9, PB3, PB13, PF11 pins with induced
-5 NA
IINJ leakage current on adjacent pins less than 50 A mA
Injected current on PB0, PB1 and all other FT and FTf pins -5 NA
Injected current on all other TC, TTa and RST pins -5 +5

6.3.14 I/O port characteristics

General input/output characteristics
Unless otherwise specified, the parameters given in Table 50 are derived from tests
performed under the conditions summarized in Table 21: General operating conditions. All
I/Os are designed as CMOS- and TTL-compliant.

Table 50. I/O static characteristics

Symbol Parameter Conditions Min Typ Max Unit

TC and TTa I/O - - 0.3 VDDIOx+0.07(1)

Low level input
VIL FT and FTf I/O - - 0.475 VDDIOx0.2(1) V
voltage
All I/Os - - 0.3 VDDIOx
TC and TTa I/O 0.445 VDDIOx +0.398(1) - -
High level input
VIH FT and FTf I/O 0.5 VDDIOx +0.2(1) - - V
voltage
All I/Os 0.7 VDDIOx - -

Schmitt trigger TC and TTa I/O - 200(1) -

Vhys mV
hysteresis FT and FTf I/O - 100 (1) -
TC, FT and FTf I/O
TTa in digital mode - - 0.1
VSS VIN VDDIOx
TTa in digital mode
Input leakage - - 1
Ilkg VDDIOx VIN VDDA A
current(2)
TTa in analog mode
- - 0.2
VSS VIN VDDA
FT and FTf I/O
- - 10
VDDIOx VIN 5 V
Weak pull-up
RPU equivalent resistor VIN = VSS 25 40 55 k
(3)

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Table 50. I/O static characteristics (continued)

Symbol Parameter Conditions Min Typ Max Unit

Weak pull-down
RPD equivalent VIN = VDDIOx 25 40 55 k
resistor(3)
CIO I/O pin capacitance - - 5 - pF
1. Data based on design simulation only. Not tested in production.
2. The leakage could be higher than the maximum value, if negative current is injected on adjacent pins. Refer to Table 49:
I/O current injection susceptibility.
3. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This
PMOS/NMOS contribution to the series resistance is minimal (~10% order).

All I/Os are CMOS- and TTL-compliant (no software configuration required). Their
characteristics cover more than the strict CMOS-technology or TTL parameters. The
coverage of these requirements is shown in Figure 22 for standard I/Os, and in Figure 23 for
5 V tolerant I/Os. The following curves are design simulation results, not tested in
production.

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Figure 22. TC and TTa I/O input characteristics


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Output driving current

The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink or
source up to +/- 20 mA (with a relaxed VOL/VOH).
In the user application, the number of I/O pins which can drive current must be limited to
respect the absolute maximum rating specified in Section 6.2:
The sum of the currents sourced by all the I/Os on VDDIOx, plus the maximum
consumption of the MCU sourced on VDD, cannot exceed the absolute maximum rating
IVDD (see Table 18: Voltage characteristics).
The sum of the currents sunk by all the I/Os on VSS, plus the maximum consumption of
the MCU sunk on VSS, cannot exceed the absolute maximum rating IVSS (see
Table 18: Voltage characteristics).

Output voltage levels

Unless otherwise specified, the parameters given in the table below are derived from tests
performed under the ambient temperature and supply voltage conditions summarized in
Table 21: General operating conditions. All I/Os are CMOS- and TTL-compliant (FT, TTa or
TC unless otherwise specified).

Table 51. Output voltage characteristics(1)

Symbol Parameter Conditions Min Max Unit

VOL Output low level voltage for an I/O pin CMOS port(2) - 0.4
|IIO| = 8 mA V
VOH Output high level voltage for an I/O pin VDDIOx 2.7 V VDDIOx0.4 -

VOL Output low level voltage for an I/O pin TTL port(2) - 0.4
|IIO| = 8 mA V
VOH Output high level voltage for an I/O pin VDDIOx 2.7 V 2.4 -

VOL(3) Output low level voltage for an I/O pin |IIO| = 20 mA - 1.3
V
VOH(3) Output high level voltage for an I/O pin VDDIOx 2.7 V VDDIOx1.3 -
VOL(3) Output low level voltage for an I/O pin |IIO| = 6 mA - 0.4
V
VOH(3) Output high level voltage for an I/O pin VDDIOx 2 V VDDIOx0.4 -
VOL(4) Output low level voltage for an I/O pin - 0.4 V
|IIO| = 4 mA
VOH(4) Output high level voltage for an I/O pin VDDIOx0.4 - V
|IIO| = 20 mA
- 0.4 V
VOLFm+(3)
Output low level voltage for an FTf I/O pin in VDDIOx 2.7 V
Fm+ mode
|IIO| = 10 mA - 0.4 V
1. The IIO current sourced or sunk by the device must always respect the absolute maximum rating specified in Table 18:
Voltage characteristics, and the sum of the currents sourced or sunk by all the I/Os (I/O ports and control pins) must always
respect the absolute maximum ratings IIO.
2. TTL and CMOS outputs are compatible with JEDEC standards JESD36 and JESD52.
3. Data based on characterization results. Not tested in production.
4. Data based on characterization results. Not tested in production.

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Input/output AC characteristics
The definition and values of input/output AC characteristics are given in Figure 24 and
Table 52, respectively. Unless otherwise specified, the parameters given are derived from
tests performed under the ambient temperature and supply voltage conditions summarized
in Table 21: General operating conditions.

Table 52. I/O AC characteristics(1)(2)

OSPEEDRy
Symbol Parameter Conditions Min Max Unit
[1:0] value(1)

fmax(IO)out Maximum frequency(3) - 2 MHz

tf(IO)out Output fall time CL = 50 pF, VDDIOx 2 V - 125
ns
tr(IO)out Output rise time - 125
x0
fmax(IO)out Maximum frequency(3) - 1 MHz
tf(IO)out Output fall time CL = 50 pF, VDDIOx < 2 V - 125
ns
tr(IO)out Output rise time - 125
fmax(IO)out Maximum frequency(3) - 10 MHz
tf(IO)out Output fall time CL = 50 pF, VDDIOx 2 V - 25
ns
tr(IO)out Output rise time - 25
01
fmax(IO)out Maximum frequency(3) - 4 MHz
tf(IO)out Output fall time CL = 50 pF, VDDIOx < 2 V - 62.5
ns
tr(IO)out Output rise time - 62.5
CL = 30 pF, VDDIOx 2.7 V - 50
CL = 50 pF, VDDIOx 2.7 V - 30
fmax(IO)out Maximum frequency(3) MHz
CL = 50 pF, 2 V VDDIOx < 2.7 V - 20
CL = 50 pF, VDDIOx < 2 V - 10
CL = 30 pF, VDDIOx 2.7 V - 5
CL = 50 pF, VDDIOx 2.7 V - 8
11 tf(IO)out Output fall time
CL = 50 pF, 2 V VDDIOx < 2.7 V - 12
CL = 50 pF, VDDIOx < 2 V - 25
ns
CL = 30 pF, VDDIOx 2.7 V - 5
CL = 50 pF, VDDIOx 2.7 V - 8
tr(IO)out Output rise time
CL = 50 pF, 2 V VDDIOx < 2.7 V - 12
CL = 50 pF, VDDIOx < 2 V - 25

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Table 52. I/O AC characteristics(1)(2) (continued)

OSPEEDRy
Symbol Parameter Conditions Min Max Unit
[1:0] value(1)

fmax(IO)out Maximum frequency(3) - 2 MHz

tf(IO)out Output fall time CL = 50 pF, VDDIOx 2 V - 12
ns
Fm+ tr(IO)out Output rise time - 34
configuration
(4) fmax(IO)out Maximum frequency(3) - 0.5 MHz
tf(IO)out Output fall time CL = 50 pF, VDDIOx < 2 V - 16
ns
tr(IO)out Output rise time - 44
Pulse width of external
- tEXTIpw signals detected by the - 10 - ns
EXTI controller
1. The I/O speed is configured using the OSPEEDRx[1:0] bits. Refer to the STM32F0xxxx RM0091 reference manual for a
description of GPIO Port configuration register.
2. Guaranteed by design, not tested in production.
3. The maximum frequency is defined in Figure 24.
4. When Fm+ configuration is set, the I/O speed control is bypassed. Refer to the STM32F0xxxx reference manual RM0091
for a detailed description of Fm+ I/O configuration.

Figure 24. I/O AC characteristics definition

 

 

 

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6.3.15 NRST pin characteristics

The NRST pin input driver uses the CMOS technology. It is connected to a permanent pull-
up resistor, RPU.
Unless otherwise specified, the parameters given in the table below are derived from tests
performed under the ambient temperature and supply voltage conditions summarized in
Table 21: General operating conditions.

Table 53. NRST pin characteristics

Symbol Parameter Conditions Min Typ Max Unit

VIL(NRST) NRST input low level voltage - - - 0.3 VDD+0.07(1)

V
VIH(NRST) NRST input high level voltage - 0.445 VDD+0.398(1) - -

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Table 53. NRST pin characteristics (continued)

Symbol Parameter Conditions Min Typ Max Unit

NRST Schmitt trigger voltage

Vhys(NRST) - - 200 - mV
hysteresis
Weak pull-up equivalent
RPU VIN = VSS 25 40 55 k
resistor(2)
VF(NRST) NRST input filtered pulse - - - 100(1) ns
2.7 < VDD < 3.6 300(3) - -
VNF(NRST) NRST input not filtered pulse ns
(3)
2.0 < VDD < 3.6 500 - -
1. Data based on design simulation only. Not tested in production.
2. The pull-up is designed with a true resistance in series with a switchable PMOS. This PMOS contribution to the series
resistance is minimal (~10% order).
3. Data based on design simulation only. Not tested in production.

Figure 25. Recommended NRST pin protection

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1. The external capacitor protects the device against parasitic resets.

2. The user must ensure that the level on the NRST pin can go below the VIL(NRST) max level specified in
Table 53: NRST pin characteristics. Otherwise the reset will not be taken into account by the device.

6.3.16 12-bit ADC characteristics

Unless otherwise specified, the parameters given in Table 54 are derived from tests
performed under the conditions summarized in Table 21: General operating conditions.
Note: It is recommended to perform a calibration after each power-up.

Table 54. ADC characteristics

Symbol Parameter Conditions Min Typ Max Unit

Analog supply voltage for

VDDA - 2.4 - 3.6 V
ADC ON
Current consumption of
IDDA (ADC) VDDA = 3.3 V - 0.9 - mA
the ADC(1)
fADC ADC clock frequency - 0.6 - 14 MHz
fS(2) Sampling rate 12-bit resolution 0.043 - 1 MHz

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Table 54. ADC characteristics (continued)

Symbol Parameter Conditions Min Typ Max Unit

fADC = 14 MHz,
- - 823 kHz
fTRIG(2) External trigger frequency 12-bit resolution
12-bit resolution - - 17 1/fADC
VAIN Conversion voltage range - 0 - VDDA V
See Equation 1 and
RAIN(2) External input impedance - - 50 k
Table 55 for details
Sampling switch
RADC(2) - - - 1 k
resistance
Internal sample and hold
CADC(2) - - - 8 pF
capacitor
fADC = 14 MHz 5.9 s
tCAL(2)(3) Calibration time
- 83 1/fADC
1.5 ADC 1.5 ADC
ADC clock = HSI14 cycles + 2 - cycles + 3
fPCLK cycles fPCLK cycles
ADC_DR register ready
WLATENCY(2)(4) fPCLK
latency ADC clock = PCLK/2 - 4.5 -
cycle
fPCLK
ADC clock = PCLK/4 - 8.5 -
cycle
fADC = fPCLK/2 = 14 MHz 0.196 s
fADC = fPCLK/2 5.5 1/fPCLK
tlatr(2) Trigger conversion latency fADC = fPCLK/4 = 12 MHz 0.219 s
fADC = fPCLK/4 10.5 1/fPCLK
fADC = fHSI14 = 14 MHz 0.179 - 0.250 s
ADC jitter on trigger
JitterADC fADC = fHSI14 - 1 - 1/fHSI14
conversion
fADC = 14 MHz 0.107 - 17.1 s
tS(2) Sampling time
- 1.5 - 239.5 1/fADC
tSTAB(2) Stabilization time - 14 1/fADC
fADC = 14 MHz,
1 - 18 s
Total conversion time 12-bit resolution
tCONV(2)
(including sampling time) 14 to 252 (tS for sampling +12.5 for
12-bit resolution 1/fADC
successive approximation)
1. During conversion of the sampled value (12.5 x ADC clock period), an additional consumption of 100 A on IDDA and 60 A
on IDD should be taken into account.
2. Guaranteed by design, not tested in production.
3. Specified value includes only ADC timing. It does not include the latency of the register access.
4. This parameter specify latency for transfer of the conversion result to the ADC_DR register. EOC flag is set at this time.

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Equation 1: RAIN max formula

TS
R AIN < ---------------------------------------------------------------
N+2
- R ADC
f ADC C ADC ln ( 2 )

The formula above (Equation 1) is used to determine the maximum external impedance
allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).

Table 55. RAIN max for fADC = 14 MHz

Ts (cycles) tS (s) RAIN max (k)(1)

1.5 0.11 0.4

7.5 0.54 5.9
13.5 0.96 11.4
28.5 2.04 25.2
41.5 2.96 37.2
55.5 3.96 50
71.5 5.11 NA
239.5 17.1 NA
1. Guaranteed by design, not tested in production.

Table 56. ADC accuracy(1)(2)(3)

Symbol Parameter Test conditions Typ Max(4) Unit

ET Total unadjusted error 1.3 2

EO Offset error fPCLK = 48 MHz, 1 1.5
fADC = 14 MHz, RAIN < 10 k
EG Gain error 0.5 1.5 LSB
VDDA = 3 V to 3.6 V
ED Differential linearity error TA = 25 C 0.7 1
EL Integral linearity error 0.8 1.5
ET Total unadjusted error 3.3 4
EO Offset error fPCLK = 48 MHz, 1.9 2.8
fADC = 14 MHz, RAIN < 10 k
EG Gain error 2.8 3 LSB
VDDA = 2.7 V to 3.6 V
ED Differential linearity error TA = 40 to 105 C 0.7 1.3
EL Integral linearity error 1.2 1.7
ET Total unadjusted error 3.3 4
EO Offset error fPCLK = 48 MHz, 1.9 2.8
fADC = 14 MHz, RAIN < 10 k
EG Gain error 2.8 3 LSB
VDDA = 2.4 V to 3.6 V
ED Differential linearity error TA = 25 C 0.7 1.3
EL Integral linearity error 1.2 1.7
1. ADC DC accuracy values are measured after internal calibration.

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2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-robust) analog input
pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog
input. It is recommended to add a Schottky diode (pin to ground) to standard analog pins which may potentially inject
negative current.
Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in Section 6.3.14 does not affect the ADC
accuracy.
3. Better performance may be achieved in restricted VDDA, frequency and temperature ranges.
4. Data based on characterization results, not tested in production.

Figure 26. ADC accuracy characteristics

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1. Refer to Table 54: ADC characteristics for the values of RAIN, RADC and CADC.
2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 13: Power supply
scheme. The 10 nF capacitor should be ceramic (good quality) and it should be placed as
close as possible to the chip.

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STM32F042x4 STM32F042x6 Electrical characteristics

6.3.17 Temperature sensor characteristics

Table 57. TS characteristics

Symbol Parameter Min Typ Max Unit

TL(1) VSENSE linearity with temperature - 1 2 C

(1)
Avg_Slope Average slope 4.0 4.3 4.6 mV/C
(2)
V30 Voltage at 30 C ( 5 C) 1.34 1.43 1.52 V
tSTART(1) ADC_IN16 buffer startup time - - 10 s
ADC sampling time when reading the
tS_temp(1) 4 - - s
temperature
1. Guaranteed by design, not tested in production.
2. Measured at VDDA = 3.3 V 10 mV. The V30 ADC conversion result is stored in the TS_CAL1 byte. Refer to Table 3:
Temperature sensor calibration values.

6.3.18 VBAT monitoring characteristics

Table 58. VBAT monitoring characteristics

Symbol Parameter Min Typ Max Unit

R Resistor bridge for VBAT - 2 x 50 - k

Q Ratio on VBAT measurement - 2 -
Er(1) Error on Q 1 - +1 %
tS_vbat(1) ADC sampling time when reading the VBAT 4 - - s
1. Guaranteed by design, not tested in production.

6.3.19 Timer characteristics

The parameters given in the following tables are guaranteed by design.
Refer to Section 6.3.14: I/O port characteristics for details on the input/output alternate
function characteristics (output compare, input capture, external clock, PWM output).

Table 59. TIMx characteristics

Symbol Parameter Conditions Min Typ Max Unit

- - 1 - tTIMxCLK
tres(TIM) Timer resolution time
fTIMxCLK = 48 MHz - 20.8 - ns
Timer external clock - - fTIMxCLK/2 - MHz
fEXT frequency on CH1 to
CH4 fTIMxCLK = 48 MHz - 24 - MHz

16-bit timer maximum - - 216 - tTIMxCLK

period fTIMxCLK = 48 MHz - 1365 - s
tMAX_COUNT
32-bit counter - - 232 - tTIMxCLK
maximum period fTIMxCLK = 48 MHz - 89.48 - s

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Table 60. IWDG min/max timeout period at 40 kHz (LSI)(1)

Min timeout RL[11:0]= Max timeout RL[11:0]=
Prescaler divider PR[2:0] bits Unit
0x000 0xFFF

/4 0 0.1 409.6
/8 1 0.2 819.2
/16 2 0.4 1638.4
/32 3 0.8 3276.8 ms
/64 4 1.6 6553.6
/128 5 3.2 13107.2
/256 6 or 7 6.4 26214.4
1. These timings are given for a 40 kHz clock but the microcontroller internal RC frequency can vary from 30
to 60 kHz. Moreover, given an exact RC oscillator frequency, the exact timings still depend on the phasing
of the APB interface clock versus the LSI clock so that there is always a full RC period of uncertainty.

Table 61. WWDG min/max timeout value at 48 MHz (PCLK)

Prescaler WDGTB Min timeout value Max timeout value Unit

1 0 0.0853 5.4613
2 1 0.1706 10.9226
ms
4 2 0.3413 21.8453
8 3 0.6826 43.6906

6.3.20 Communication interfaces

I2C interface characteristics
The I2C interface meets the timings requirements of the I2C-bus specification and user
manual rev. 03 for:
Standard-mode (Sm): with a bit rate up to 100 kbit/s
Fast-mode (Fm): with a bit rate up to 400 kbit/s
Fast-mode Plus (Fm+): with a bit rate up to 1 Mbit/s.
The I2C timings requirements are guaranteed by design when the I2Cx peripheral is
properly configured (refer to Reference manual).
The SDA and SCL I/O requirements are met with the following restrictions: the SDA and
SCL I/O pins are not true open-drain. When configured as open-drain, the PMOS
connected between the I/O pin and VDDIOx is disabled, but is still present. Only FTf I/O pins
support Fm+ low level output current maximum requirement. Refer to Section 6.3.14: I/O
port characteristics for the I2C I/Os characteristics.
All I2C SDA and SCL I/Os embed an analog filter. Refer to the table below for the analog
filter characteristics:

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Table 62. I2C analog filter characteristics(1)

Symbol Parameter Min Max Unit

Maximum width of spikes that are

tAF 50(2) 260(3) ns
suppressed by the analog filter
1. Guaranteed by design, not tested in production.
2. Spikes with widths below tAF(min) are filtered.
3. Spikes with widths above tAF(max) are not filtered

SPI/I2S characteristics
Unless otherwise specified, the parameters given in Table 63 for SPI or in Table 64 for I2S
are derived from tests performed under the ambient temperature, fPCLKx frequency and
supply voltage conditions summarized in Table 21: General operating conditions.
Refer to Section 6.3.14: I/O port characteristics for more details on the input/output alternate
function characteristics (NSS, SCK, MOSI, MISO for SPI and WS, CK, SD for I2S).

Table 63. SPI characteristics(1)

Symbol Parameter Conditions Min Max Unit

fSCK Master mode - 18

SPI clock frequency MHz
1/tc(SCK) Slave mode - 18
tr(SCK) SPI clock rise and fall
Capacitive load: C = 15 pF - 6 ns
tf(SCK) time
tsu(NSS) NSS setup time Slave mode 4Tpclk -
th(NSS) NSS hold time Slave mode 2Tpclk + 10 -
tw(SCKH) Master mode, fPCLK = 36 MHz,
SCK high and low time Tpclk/2 -2 Tpclk/2 + 1
tw(SCKL) presc = 4

tsu(MI) Master mode 4 -

Data input setup time
tsu(SI) Slave mode 5 -
th(MI) Master mode 4 -
Data input hold time ns
th(SI) Slave mode 5 -
ta(SO)(2) Data output access time Slave mode, fPCLK = 20 MHz 0 3Tpclk
(3)
tdis(SO) Data output disable time Slave mode 0 18
tv(SO) Data output valid time Slave mode (after enable edge) - 22.5
tv(MO) Data output valid time Master mode (after enable edge) - 6
th(SO) Slave mode (after enable edge) 11.5 -
Data output hold time
th(MO) Master mode (after enable edge) 2 -
SPI slave input clock
DuCy(SCK) Slave mode 25 75 %
duty cycle
1. Data based on characterization results, not tested in production.
2. Min time is for the minimum time to drive the output and the max time is for the maximum time to validate the data.
3. Min time is for the minimum time to invalidate the output and the max time is for the maximum time to put the data in Hi-Z

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Figure 28. SPI timing diagram - slave mode and CPHA = 0

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1. Measurement points are done at CMOS levels: 0.3 VDD and 0.7 VDD.

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STM32F042x4 STM32F042x6 Electrical characteristics

Figure 30. SPI timing diagram - master mode

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1. Measurement points are done at CMOS levels: 0.3 VDD and 0.7 VDD.

Table 64. I2S characteristics(1)

Symbol Parameter Conditions Min Max Unit

Master mode (data: 16 bits, Audio

fCK 1.597 1.601
I2S clock frequency frequency = 48 kHz) MHz
1/tc(CK)
Slave mode 0 6.5
tr(CK) I2S clock rise time - 10
Capacitive load CL = 15 pF
tf(CK) I2S clock fall time - 12
tw(CKH) I2S clock high time Master fPCLK= 16 MHz, audio 306 -
tw(CKL) 2
I S clock low time frequency = 48 kHz 312 -
ns
tv(WS) WS valid time Master mode 2 -
th(WS) WS hold time Master mode 2 -
tsu(WS) WS setup time Slave mode 7 -
th(WS) WS hold time Slave mode 0 -
I2S slave input clock duty
DuCy(SCK) Slave mode 25 75 %
cycle

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Table 64. I2S characteristics(1) (continued)

Symbol Parameter Conditions Min Max Unit

tsu(SD_MR) Master receiver 6 -

Data input setup time
tsu(SD_SR) Slave receiver 2 -
(2)
th(SD_MR) Master receiver 4 -
Data input hold time
(2)
th(SD_SR) Slave receiver 0.5 -
ns
tv(SD_MT)(2) Master transmitter - 4
Data output valid time
tv(SD_ST)(2) Slave transmitter - 20
th(SD_MT) Master transmitter 0 -
Data output hold time
th(SD_ST) Slave transmitter 13 -
1. Data based on design simulation and/or characterization results, not tested in production.
2. Depends on fPCLK. For example, if fPCLK = 8 MHz, then TPCLK = 1/fPLCLK = 125 ns.

Figure 31. I2S slave timing diagram (Philips protocol)

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1. Measurement points are done at CMOS levels: 0.3 VDDIOx and 0.7 VDDIOx.
2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.

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STM32F042x4 STM32F042x6 Electrical characteristics

Figure 32. I2S master timing diagram (Philips protocol)



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1. Data based on characterization results, not tested in production.

2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first
byte.

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Electrical characteristics STM32F042x4 STM32F042x6

USB characteristics
The STM32F042x4/x6 USB interface is fully compliant with the USB specification version
2.0 and is USB-IF certified (for Full-speed device operation).

Table 65. USB electrical characteristics

Symbol Parameter Conditions Min. Typ Max. Unit

USB transceiver operating

VDDIO2 - 3.0(1) - 3.6 V
voltage
tSTARTUP(2) USB transceiver startup time - - - 1.0 s
Embedded USB_DP pull-up
RPUI - 1.1 1.26 1.5
value during idle
k
Embedded USB_DP pull-up
RPUR - 2.0 2.26 2.6
value during reception
Driving high
ZDRV(2) Output driver impedance(3) 28 40 44
and low
1. The STM32F042x4/x6 USB functionality is ensured down to 2.7 V but not the full USB electrical
characteristics which are degraded in the 2.7-to-3.0 V voltage range.
2. Guaranteed by design, not tested in production.
3. No external termination series resistors are required on USB_DP (D+) and USB_DM (D-); the matching
impedance is already included in the embedded driver.

CAN (controller area network) interface

Refer to Section 6.3.14: I/O port characteristics for more details on the input/output alternate
function characteristics (CAN_TX and CAN_RX).

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STM32F042x4 STM32F042x6 Package information

7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

7.1 LQFP48 package information

LQFP48 is a 48-pin, 7 x 7 mm low-profile quad flat package.

Figure 33. LQFP48 package outline

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DocID025832 Rev 4 91/118

114
Package information STM32F042x4 STM32F042x6

Table 66. LQFP48 package mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A - - 1.600 - - 0.0630
A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.170 0.220 0.270 0.0067 0.0087 0.0106
c 0.090 - 0.200 0.0035 - 0.0079
D 8.800 9.000 9.200 0.3465 0.3543 0.3622
D1 6.800 7.000 7.200 0.2677 0.2756 0.2835
D3 - 5.500 - - 0.2165 -
E 8.800 9.000 9.200 0.3465 0.3543 0.3622
E1 6.800 7.000 7.200 0.2677 0.2756 0.2835
E3 - 5.500 - - 0.2165 -
e - 0.500 - - 0.0197 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -
k 0 3.5 7 0 3.5 7
ccc - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 34. Recommended footprint for LQFP48 package





 
 



 



 
 







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1. Dimensions are expressed in millimeters.

92/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Package information

Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.

Figure 35. LQFP48 package marking example

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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

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Package information STM32F042x4 STM32F042x6

7.2 UFQFPN48 package information

UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package.

Figure 36. UFQFPN48 package outline

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1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.

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STM32F042x4 STM32F042x6 Package information

Table 67. UFQFPN48 package mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A 0.500 0.550 0.600 0.0197 0.0217 0.0236

A1 0.000 0.020 0.050 0.0000 0.0008 0.0020
D 6.900 7.000 7.100 0.2717 0.2756 0.2795
E 6.900 7.000 7.100 0.2717 0.2756 0.2795
D2 5.500 5.600 5.700 0.2165 0.2205 0.2244
E2 5.500 5.600 5.700 0.2165 0.2205 0.2244
L 0.300 0.400 0.500 0.0118 0.0157 0.0197
T - 0.152 - - 0.0060 -
b 0.200 0.250 0.300 0.0079 0.0098 0.0118
e - 0.500 - - 0.0197 -
ddd - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 37. Recommended footprint for UFQFPN48 package





 

 

 








 

 

 


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1. Dimensions are expressed in millimeters.

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Package information STM32F042x4 STM32F042x6

Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.

Figure 38. UFQFPN48 package marking example

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5

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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

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STM32F042x4 STM32F042x6 Package information

7.3 WLCSP36 package information

WLCSP36 is a 36-ball, 2.605 x 2.703 mm, 0.4 mm pitch wafer-level chip-scale package.

Figure 39. WLCSP36 package outline

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1. Drawing is not to scale.

Table 68. WLCSP36 package mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A 0.525 0.555 0.585 0.0207 0.0219 0.0230

A1 - 0.175 - - 0.0069 -
A2 - 0.380 - - 0.0150 -
A3(2) - 0.025 - - 0.0010 -
(3)
b 0.220 0.250 0.280 0.0087 0.0098 0.0110
D 2.570 2.605 2.640 0.1012 0.1026 0.1039
E 2.668 2.703 2.738 0.1050 0.1064 0.1078
e - 0.400 - - 0.0157 -
e1 - 2.000 - - 0.0787 -
e2 - 2.000 - - 0.0787 -

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Table 68. WLCSP36 package mechanical data (continued)

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

F - 0.3025 - - 0.0119 -
G - 0.3515 - - 0.0138 -
aaa - - 0.100 - - 0.0039
bbb - - 0.100 - - 0.0039
ccc - - 0.100 - - 0.0039
ddd - - 0.050 - - 0.0020
eee - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Figure 40. Recommended pad footprint for WLCSP36 package

'SDG

'VP 069

Table 69. WLCSP36 recommended PCB design rules

Dimension Recommended values

Pitch 0.4 mm
260 m max. (circular)
Dpad
220 m recommended
Dsm 300 m min. (for 260 m diameter pad)
PCB pad design Non-solder mask defined via underbump allowed

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STM32F042x4 STM32F042x6 Package information

Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.

Figure 41. WLCSP36 package marking example

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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

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7.4 LQFP32 package information

LQFP32 is a 32-pin, 7 x 7 mm low-profile quad flat package.

Figure 42. LQFP32 package outline

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1. Drawing is not to scale.

100/118 DocID025832 Rev 4

STM32F042x4 STM32F042x6 Package information

Table 70. LQFP32 package mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A - - 1.600 - - 0.0630
A1 0.050 - 0.150 0.0020 - 0.0059
A2 1.350 1.400 1.450 0.0531 0.0551 0.0571
b 0.300 0.370 0.450 0.0118 0.0146 0.0177
c 0.090 - 0.200 0.0035 - 0.0079
D 8.800 9.000 9.200 0.3465 0.3543 0.3622
D1 6.800 7.000 7.200 0.2677 0.2756 0.2835
D3 - 5.600 - - 0.2205 -
E 8.800 9.000 9.200 0.3465 0.3543 0.3622
E1 6.800 7.000 7.200 0.2677 0.2756 0.2835
E3 - 5.600 - - 0.2205 -
e - 0.800 - - 0.0315 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295
L1 - 1.000 - - 0.0394 -
k 0 3.5 7 0 3.5 7
ccc - - 0.100 - - 0.0039
1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 43. Recommended footprint for LQFP32 package





 
  










 
 






6?&0?6

1. Dimensions are expressed in millimeters.

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Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.

Figure 44. LQFP32 package marking example

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.7

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5

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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

7.5 UFQFPN32 package information

UFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch ultra-thin fine-pitch quad flat package.

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STM32F042x4 STM32F042x6 Package information

Figure 45. UFQFPN32 package outline

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1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.

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Table 71. UFQFPN32 package mechanical data

millimeters inches(1)
Symbol
Min Typ Max Min Typ Max

A 0.500 0.550 0.600 0.0197 0.0217 0.0236

A1 0.000 0.020 0.050 0.0000 0.0008 0.0020
A3 - 0.152 - - 0.0060 -
b 0.180 0.230 0.280 0.0071 0.0091 0.0110
D 4.900 5.000 5.100 0.1929 0.1969 0.2008
D1 3.400 3.500 3.600 0.1339 0.1378 0.1417
D2 3.400 3.500 3.600 0.1339 0.1378 0.1417
E 4.900 5.000 5.100 0.1929 0.1969 0.2008
E1 3.400 3.500 3.600 0.1339 0.1378 0.1417
E2 3.400 3.500 3.600 0.1339 0.1378 0.1417
e - 0.500 - - 0.0197 -
L 0.300 0.400 0.500 0.0118 0.0157 0.0197
ddd - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 46. Recommended footprint for UFQFPN32 package






 

 



 




  

  


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1. Dimensions are expressed in millimeters.

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STM32F042x4 STM32F042x6 Package information

Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.

Figure 47. UFQFPN32 package marking example

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).
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5
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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

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7.6 UFQFPN28 package information

UFQFPN28 is a 28-lead, 4x4 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package.

Figure 48. UFQFPN28 package outline

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1. Drawing is not to scale.

Table 72. UFQFPN28 package mechanical data(1)

millimeters inches
Symbol
Min Typ Max Min Typ Max

A 0.500 0.550 0.600 0.0197 0.0217 0.0236

A1 - 0.000 0.050 - 0.0000 0.0020
D 3.900 4.000 4.100 0.1535 0.1575 0.1614
D1 2.900 3.000 3.100 0.1142 0.1181 0.1220
E 3.900 4.000 4.100 0.1535 0.1575 0.1614
E1 2.900 3.000 3.100 0.1142 0.1181 0.1220
L 0.300 0.400 0.500 0.0118 0.0157 0.0197
L1 0.250 0.350 0.450 0.0098 0.0138 0.0177
T - 0.152 - - 0.0060 -
b 0.200 0.250 0.300 0.0079 0.0098 0.0118
e - 0.500 - - 0.0197 -

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1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 49. Recommended footprint for UFQFPN28 package










 









$%B)3B9

1. Dimensions are expressed in millimeters.

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Package information STM32F042x4 STM32F042x6

Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.

Figure 50. UFQFPN28 package marking example

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'DWHFRGH
< :: 5 5HYLVLRQFRGH

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1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

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STM32F042x4 STM32F042x6 Package information

7.7 TSSOP20 package information

TSSOP20 is a 20-lead thin shrink small-outline, 6.5 x 4.4 mm, 0.65 mm pitch, package.

Figure 51.TSSOP20 package outline

 
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1. Drawing is not to scale.

Table 73. TSSOP20 package mechanical data

millimeters inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.

A - - 1.200 - - 0.0472
A1 0.050 - 0.150 0.0020 - 0.0059
A2 0.800 1.000 1.050 0.0315 0.0394 0.0413
b 0.190 - 0.300 0.0075 - 0.0118
c 0.090 - 0.200 0.0035 - 0.0079
(2)
D 6.400 6.500 6.600 0.2520 0.2559 0.2598
E 6.200 6.400 6.600 0.2441 0.2520 0.2598
E1(3) 4.300 4.400 4.500 0.1693 0.1732 0.1772
e - 0.650 - - 0.0256 -
L 0.450 0.600 0.750 0.0177 0.0236 0.0295

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Table 73. TSSOP20 package mechanical data (continued)

millimeters inches(1)
Symbol
Min. Typ. Max. Min. Typ. Max.

L1 - 1.000 - - 0.0394 -
k 0 - 8 0 - 8
aaa - - 0.100 - - 0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15mm per side.
3. Dimension E1 does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25mm per side.

Figure 52. Recommended footprint for TSSOP20 package



 





 



 

  9!?&0?6

1. Dimensions are expressed in millimeters.

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STM32F042x4 STM32F042x6 Package information

Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.

Figure 53. TSSOP20 package marking example

3URGXFWLGHQWLILFDWLRQ ))3
'DWHFRGH
3LQLGHQWLILHU
< :: 5 5HYLVLRQFRGH

06Y9

1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.

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7.8 Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 21: General operating conditions.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x JA)
Where:
TA max is the maximum ambient temperature in C,
JA is the package junction-to-ambient thermal resistance, in C/W,
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = (VOL IOL) + ((VDDIOx VOH) IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.

Table 74. Package thermal characteristics

Symbol Parameter Value Unit

Thermal resistance junction-ambient

55
LQFP48 - 7 mm x 7 mm
Thermal resistance junction-ambient
33
UFQFPN48 - 7 mm x 7 mm
Thermal resistance junction-ambient
64
WLCSP36 2.6 mm x 2.7 mm
Thermal resistance junction-ambient
JA 57 C/W
LQFP32 - 7 mm x 7 mm
Thermal resistance junction-ambient
38
UFQFPN32 - 5 mm x 5 mm
Thermal resistance junction-ambient
118
UFQFPN28 - 4 mm x 4 mm
Thermal resistance junction-ambient
76
TSSOP20 - 6.5 mm x 6.4 mm

7.8.1 Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org

7.8.2 Selecting the product temperature range

When ordering the microcontroller, the temperature range is specified in the ordering
information scheme shown in Section 8: Part numbering.

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Each temperature range suffix corresponds to a specific guaranteed ambient temperature at

maximum dissipation and, to a specific maximum junction temperature.
As applications do not commonly use the STM32F042x4/x6 at maximum dissipation, it is
useful to calculate the exact power consumption and junction temperature to determine
which temperature range will be best suited to the application.
The following examples show how to calculate the temperature range needed for a given
application.

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Part numbering STM32F042x4 STM32F042x6

8 Part numbering

For a list of available options (memory, package, and so on) or for further information on any
aspect of this device, please contact your nearest ST sales office.

Table 75. Ordering information scheme

Example: STM32 F 042 C 6 T 6 xxx

Device family
STM32 = ARM-based 32-bit microcontroller

Product type
F = General-purpose

Sub-family
042 = STM32F042xx

Pin count
F = 20 pins
G = 28 pins
K = 32 pins
T = 36 pins
C = 48 pins

User code memory size

4 = 16 Kbyte
6 = 32 Kbyte

Package
P = TSSOP
T = LQFP
U = UFQFPN
Y = WLCSP

Temperature range
6 = 40 to 85 C
7 = 40 to 105 C

Options
xxx = code ID of programmed parts (includes packing type)
TR = tape and reel packing
blank = tray packing

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9 Revision history

Table 76. Document revision history

Date Revision Changes

25-Feb-2014 1 Initial release.

Added the sample engineering sections for all the packages in the
chapter Package information:
Updated tables:
STM32F042x4/x6 USART implementation: added one table
footnote.
STM32F042x pin definitions,
Current characteristics,
Typical and maximum current consumption from VDD supply at VDD
= 3.6 V,
Typical and maximum current consumption from the VDDA supply,
Typical and maximum consumption in Stop and Standby modes,
Typical and maximum current consumption from the VBAT supply,
Typical current consumption, code executing from Flash, running
from HSE 8 MHz crystal,
Flash memory characteristics,
I/O static characteristics,
03-Apr-2014 2 I/O current injection susceptibility,
EMS characteristics,
EMI characteristics,
Updated figures:
UFQFPN32 32-pin package pinout,
UQFPN28 28-pin package,
Power supply scheme,
TC and TTa I/O input characteristics,
Five volt tolerant (FT and FTf) I/O input characteristics.
LQFP48 marking example (package top view),
UFQFPN48 marking example (package top view),
WLCSP36 marking example (package top view),
LQFP32 marking example (package top view),
UFQFPN28 marking example (package top view),
UFQFPN32 marking example (package top view),
TSSOP20 marking example (package top view)
Cover page: number of I/Os and timers updated.
Updates in Section 2: Description:
updated Figure 1: Block diagram
Updates in Section 3: Functional overview:
26-Oct-2015 3 updated Figure 2: Clock tree
addition of the number of complementary outputs for the advanced
control timer and for TIM16, TIM17 general purpose timers in
Table 7: Timer feature comparison
removal of USART2 from Figure 3.5.4: Low-power modes

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Revision history STM32F042x4 STM32F042x6

Table 76. Document revision history (continued)

Date Revision Changes
2
Table 9: STM32F042x4/x6 I C implementation - adding 20 mA
Updates in Section 4: Pinouts and pin descriptions
Table 12: Legend/abbreviations used in the pinout table - removing
I pin type
Updates in Section 5: Memory mapping:
Figure 10: STM32F042x6 memory map, x4 difference described in
text
Updates in Section 6: Electrical characteristics:
the condition Regulator in run mode, all oscillators OFF in Table 28:
Typical and maximum consumption in Stop and Standby modes,
footnote for VIN max value in Table 18: Voltage characteristics,
footnote for max VIN in Table 21: General operating conditions,
tSTART parameter definition in Table 25: Embedded internal
reference voltage
addition of tSTART parameter in Table 25: Embedded internal
reference voltage, removal of -40C to 85C condition and the
associated footnote
Table 26: Typical and maximum current consumption from VDD
supply at VDD = 3.6 V: removing code executing from Flash or
RAM
removal of the min value for tSTART parameter in Table 57: TS
26-Oct-2015 3 characteristics
the typical value for R parameter in Table 58: VBAT monitoring
characteristics
removal of ResTM parameter line from Table 59: TIMx characteristics
and putting all values in new Typ column, substitution of tCOUNTER
with tMAX_COUNT, values defined as powers of two
VESD(CDM) class in Table 47: ESD absolute maximum ratings
reorganization of Table 64: I2S characteristics and filling max value
of tv(SD_ST)
adding definition of levels in Figure 32: I2S master timing diagram
(Philips protocol)
Updates in Section 7: Package information:
heading and display of columns in Table 68: WLCSP36 package
mechanical data.,
Figure 38: UFQFPN48 package marking example
Figure 41: WLCSP36 package marking example
Figure 50: UFQFPN28 package marking example
Figure 41: WLCSP36 package marking example
Figure 51: TSSOP20 package outline - correcting GAGE to GAUGE
removing die 445 from Table 74: Package thermal characteristics
Updates in Section 8: Part numbering:
adding tray packing to options

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STM32F042x4 STM32F042x6 Revision history

Table 76. Document revision history (continued)

Date Revision Changes

Section 3: Functional overview:

Figure 2: Clock tree modified
Section 4: Pinouts and pin descriptions:
Package pinout figures updated (look and feel)
Figure 5: WLCSP36 package pinout- now presented in top view
Table 13: STM32F042x pin definitions - note 3 added; CIMP1_OUT
and USART4_CTS removed
Table 15: Alternate functions selected through GPIOB_AFR
registers for port B - change of I2C2_SDA and I2C2_SCL to
I2C1_SDA and I2C1_SCL
16-Dec-2015 4
Section 5: Memory mapping:
Table 17: STM32F042x4/x6 peripheral register boundary addresses
- change of SYSCFG + COMP to SYSCFG
Section 6: Electrical characteristics:
Table 50: I/O static characteristics- removed note
Section 6.3.16: 12-bit ADC characteristics - changed introductory
sentence
Section 7: Package information:
Figure 49: Recommended footprint for UFQFPN28 package
distance between corner pads added

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 STM32F042x4 STM32F042x6

IMPORTANT NOTICE PLEASE READ CAREFULLY

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acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

2015 STMicroelectronics All rights reserved

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