STR-X6768N

Off-Line Quasi-Resonant Switching Regulators

Features and Benefits Description

▪ Quasi-resonant topology IC  Low EMI noise and soft The STR-X6768N is a quasi-resonant topology IC designed for
switching SMPS applications. It shows lower EMI noise characteristics
▪ Bottom-skip mode  Improved system efficiency over than conventional PWM solutions, especially at greater than
the entire output load by avoiding increase of switching 2 MHz. It also provides a soft-switching mode to turn on the
frequency internal MOSFET at close to zero voltage (VDS bottom point)
▪ Standby mode  Lowers input power at very light output by use of the resonant characteristic of primary inductance
load condition and a resonant capacitor.
▪ Avalanche-guaranteed MOSFET  Improves system-level
reliability and does not require VDSS derating The package is a fully molded TO-3P, which contains the
▪ 800 VDSS / 1.00 Ω RDS(on) controller chip (MIC) and MOSFET, enabling output
▪ Various protections  Improved system-level reliability power up to 200 W at 230 VAC and 130 W at universal
▫ Pulse-by-pulse drain overcurrent limiting input. The bottom-skip mode skips the first bottom of VDS and
▫ Overvoltage Protection (bias winding voltage sensing), turns on the MOSFET at the second bottom point, to
with latch minimize an increase of operating frequency at light output
▫ Overload Protection with latch load, improving system-level efficiency over the entire load
▫ Maximum on-time limit range.
A standby mode is executed by clamping the secondary output.
Package: 7-Pin TO-3P In general applications, standby mode reduces input power.
The soft-start mode minimizes surge voltage and reduces power
stress to the MOSFET and to the secondary rectifying diodes
during the start-up sequence.
Various protections such as overvoltage, overload, overcurrent,
maximum on-time protections and avalanche-energy guaranteed
MOSFET secure good system-level reliability.

Not to scale Continued on the next page…

Typical Application

STR-X6768N
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
STR-X6768N Off-Line Quasi-Resonant Switching Regulators

Description (continued)
Applications include the following:
▪ Set Top Box
▪ LCD PC monitor, LCD TV
▪ Printer, Scanner
▪ SMPS power supplies

Selection Guide
Part Number Package
STR-X6768N TO-3P

Absolute Maximum Ratings at TA = 25°C

Parameter Symbol Conditions Rating Unit
Drain Current1 IDpeak Single pulse 20 A
Maximum Switching Current2 IDmax TA = –20°C to 125°C 20 A
Single Pulse Avalanche Energy3 EAS Single pulse, VDD = 30 V, L = 50 mH, ILpeak = 3.9 A 395 mJ
Input Voltage for Controller (MIC) VCC 35 V
SS/OLP Terminal Voltage VSSOLP –0.5 to 6.0 V
FB Terminal Inflow Current IFB 10 mA
FB Terminal Voltage VFB IFB within the limits of IFB –0.5 to 9.0 V
OCP/BD Terminal Voltage VOCPBD –1.5 to 5.0 V
With infinite heatsink 46 W
MOSFET Power Dissipation4 PD1
Without heatsink 2.8 W
Controller (MIC) Power Dissipation PD2 VCC × ICC 0.8 W
Operating Internal Leadframe Temperature TF Recommended operation temperature, see cautions –20 to 125 °C
Operating Ambient Temperature TOP –20 to 125 °C
Storage Temperature Tstg –40 to 125 °C
Channel Temperature Tch 150 °C
1Refer to MOSFET ASO curve
2I
DMAX is the drain current determined by the drive voltage of the IC and the threshold voltage, Vth, of the MOSFET
3Refer to Avalanche Energy Derating curve
4Refer to MOSFET Ta-PD1 curve

All performance characteristics given are typical values for circuit or

system baseline design only and are at the nominal operating voltage and
an ambient temperature, TA, of 25°C, unless otherwise stated.

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

Functional
Block Diagram

Terminal List Table

Number Name Description Functions
1 D Drain MOSFET drain
2 S Source MOSFET source
3 GND Ground terminal Ground
4 VCC Power supply terminal Input of power supply for control circuit
5 SS/OLP Soft Start/Overload Protection terminal Input to set delay for Overload Protection and Soft Start operation
Input for Constant Voltage Control and Burst (intermittent) Mode
6 FB Feedback terminal
oscillation control signals
7 OCP/BD Overcurrent Protection/Bottom Detection Input for Overcurrent Detection and Bottom Detection signals

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

STR-X6768N
A.S.O. temperature derating coefficient STR-X6768N
curve MOS FET A.S.O. Curve Ta=25℃
Single pulse
100 100
A.S.O. temperature derating coefficient (%)

80
0.1ms

60 10

Drain Current
Determined by

I D [A]
On-Resistance
40 1 ms

20 1
Apply A.S.O temperature
coefficient from the left graph
to this curve for evaluating
actual operations' safety
0
0 20 40 60 80 100 120
TF [℃] 0.1
Internal frame temperature 10 100 1000
VDS[V]
Drain-to-Source Voltage

STR-X6768N
Avalanche energy derating curve
100

80
E AS temperature derating coefficient (%)

60

40

20

0
25 50 75 100 125 150

Tch [℃]
Channel temperature

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

STR-X6768N
MOSFET Ta-PD1 Curve STR-X6768N
MIC TF-PD2 Curve
60
1

50 PD1 =46[W]
0.8
With infinite heatsink
Power dissipation

40

Power dissipation
PD1 〔Ｗ〕

PD2 〔Ｗ〕
0.6

30
0.4

20
Without heatsink
0.2
10 PD1 =2.8[W]

0
0 0 20 40 60 80 100 120 140
0 20 40 60 80 100 120 140
TF〔℃〕
Ta〔℃〕 Internal frame temperature
Ambient temperature

STR-X6768N
Transient thermal resistance curve
1
Transient thermal resistance

0.1
θch-c〔 ℃/W〕

0.01

0.001
1μ 〔sec〕
ｔ 100 m
Time

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

ELECTRICAL CHARACTERISTICS
Characteristic Symbol Test Conditions Min. Typ. Max. Units
ELECTRICAL CHARACTERISTICS for Controller (MIC)1, valid at TA = 25°C, VCC = 20 V, unless otherwise specified
Power Supply Start-up Operation
Operation Start Voltage VCC(ON) VCC = 0→20 V 16.3 18.2 19.9 V
Operation Stop Voltage VCC(OFF) VCC = 20→8.8 V 8.8 9.7 10.6 V
Circuit Current In Operation ICC(ON) – – 6 mA
Circuit Current In Non-Operation ICC(OFF) VCC = 15 V – – 100 μA
Oscillation Frequency fosc 19 22 25 kHz
Soft Start Operation Stop Voltage VSSOLP(SS) VSS/OLP increasing 1.1 1.2 1.4 V
Soft Start Operation Charging Current ISSOLP(SS) VSS/OLP = 0 V –710 –550 –390 μA
Normal Operation
Bottom-Skip Operation Threshold Voltage 1 VOCPBD(BS1) –0.720 –0.665 –0.605 V
Bottom-Skip Operation Threshold Voltage 2 VOCPBD(BS2) –0.485 –0.435 –0.385 V
Overcurrent Detection Threshold Voltage VOCPBD(LIM) VOCP/BD falling –0.995 –0.940 –0.895 V
OCP/BD Terminal Outflow Current IOCPBD VOCP/BD = –0.95 V –250 –100 –40 μA
Quasi-Resonant Operation Threshold Voltage 1 VOCPBD(TH1) VOCP/BD falling 0.28 0.40 0.52 V
Quasi-Resonant Operation Threshold Voltage 2 VOCPBD(TH2) VOCP/BD rising 0.67 0.80 0.93 V
FB Terminal Threshold Voltage VFB(OFF) VFB rising 1.32 1.45 1.58 V
FB Terminal Inflow Current (Normal Operation) IFB(ON) VFB = 1.6 V 600 1000 1400 μA
Standby Operation
Standby Operation Start Voltage VCC(S) VCC = 0→15 V, VFB = 1.6 V 10.3 11.2 12.1 V
Standby Operation Start Voltage Interval VCC(SK) VCC(SK) = VCC(S) – VCC(OFF) 1.10 1.35 1.65 V
Standby Non-Operation Circuit Current ICC(S) VCC = 10.2 V, VFB = 1.6 V – 20 56 μA
FB Terminal Inflow Current, Standby Operation IFB(S) VCC = 10.2 V, VFB = 1.6 V – 4 14 μA
FB Terminal Threshold Voltage, Standby Operation VFB(S) VCC = 15 V, VFB rising 0.55 1.10 1.50 V
Minimum On Time tON(MIN) 0.5 0.95 1.40 μs
Protection Operation
Maximum On Time tON(MAX) 27.5 32.5 39.0 μs
Overload Protection Operation Threshold Voltage VSSOLP(OLP) 4.0 4.9 5.8 V
Overload Protection Operation Charging Current ISSOLP(OLP) VSS/OLP = 2.5 V –16 –11 –6 μA
Overvoltage Protection Operation Voltage VCC(OVP) VCC = 0→30 V 25.5 27.7 29.9 V
Latch Circuit Holding Current2 ICC(H) VCC(OFF) – 0.3 V – 45 140 μA
Latch Circuit Release Voltage2 VCC(La.OFF) VCC = 30→6 V, OVP operating 6.0 7.2 8.5 V
ELECTRICAL CHARACTERISTICS for MOSFET, valid at TA = 25°C, unless otherwise specified
Drain-to-Source Breakdown Voltage VDSS IDSS = 300 μA 800 – – V
Drain Leakage Current IDSS VDSSS = 800 V – – 300 μA
On Resistance RDS(on) IDS = 2.5 A – – 1.0 Ω
Switching Time tf – – 450 ns
Thermal Resistance Rθch-F Channel to internal frame – – 0.99 °C/W
1Current polarity with respect to the IC: positive current indicates current sink at the terminal named, negative current indicates source at the
terminal named.
2The latch circuit means a circuit operated OVP and OLP.

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

Package Outline Drawing, TO-3P

15.6 ±0.2
5.5±0.2

2 ±0.2
Gate Burr 6
3.45±0.2

5.5±0.2

Ø3.2 ±0.2
Branding
23 ±0.3

Area XXXXXXXX
XXXXXXXX
XXXXXXXX

3.3±0.5

3.35±0.1

3.3
7.0±0.5

3
12.5±0.5

+0.2
0.55 –0.1
REF
5.5

View A

2X 2.54±0.1 4X 1.27±0.1 4.5 ±0.7 4.5 ±0.7

Terminal dimension at lead tip Terminal dimension at lead tip
+0.2
1 4 6 1.33 –0.1 +0.2
5X 0.75 –0.1
3 5 7 +0.2 +0.2
2X 0.83 –0.1 5X 0.65 –0.1

+0.2
1.89 –0.1

2
Enlargement View A

0.7 0.7 0.7 0.7

Front View (Plan View) Side View

Gate burr: 0.3 mm (max.) Drawing for reference only

Terminal core material: Cu Branding codes (exact appearance at manufacturer discretion):
Terminal treatment: Ni plating and Pb-free solder dip 1st line, type: STR
Leadform: 1902 2nd line, subtype: X6768
3rd line, lot: YM DD N
Approximate weight: 6 g Where: Y is the last digit of the year of manufacture
M is the month (1 to 9, O, N, D)
Dimensions in millimeters DD is the 2-digit date
N is the suffix of the subtype

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

Because reliability can be affected adversely by improper • Please select suitable screws for the product shape. Do not
storage environments and handling methods, please observe use a flat-head machine screw because of the stress to the
the following cautions. products. Self-tapping screws are not recommended. When
Cautions for Storage using self-tapping screws, the screw may enter the hole
• Ensure that storage conditions comply with the standard diagonally, not vertically, depending on the conditions of hole
temperature (5°C to 35°C) and the standard relative before threading or the work situation. That may stress the
humidity (around 40% to 75%); avoid storage locations products and may cause failures.
that experience extreme changes in temperature or • Recommended screw torque: 0.588 to 0.785 N●m (6 to 8
humidity. kgf●cm).
• Avoid locations where dust or harmful gases are present • For tightening screws, if a tightening tool (such as a driver)
and avoid direct sunlight. hits the products, the package may crack, and internal
• Reinspect for rust on leads and solderability of the stress fractures may occur, which shorten the lifetime of
products that have been stored for a long time. the electrical elements and can cause catastrophic failure.
Cautions for Testing and Handling Tightening with an air driver makes a substantial impact.
When tests are carried out during inspection testing and In addition, a screw torque higher than the set torque can
other standard test periods, protect the products from be applied and the package may be damaged. Therefore, an
power surges from the testing device, shorts between electric driver is recommended.
the product pins, and wrong connections. Ensure all test When the package is tightened at two or more places, first
parameters are within the ratings specified by Sanken for pre-tighten with a lower torque at all places, then tighten
the products. with the specified torque. When using a power driver, torque
Remarks About Using Silicone Grease with a Heatsink control is mandatory.
• When silicone grease is used in mounting the products on Soldering
a heatsink, it shall be applied evenly and thinly. If more • When soldering the products, please be sure to minimize
silicone grease than required is applied, it may produce the working time, within the following limits:
excess stress. 260±5°C 10±1 s (Flow, 2 times)
• Volatile-type silicone greases may crack after long periods 380±10°C 3.5±0.5 s (Soldering iron, 1 time)
of time, resulting in reduced heat radiation effect. Silicone • Soldering should be at a distance of at least 2.0 mm from
greases with low consistency (hard grease) may cause the body of the products.
cracks in the mold resin when screwing the products to a Electrostatic Discharge
heatsink. • When handling the products, the operator must be
Our recommended silicone greases for heat radiation grounded. Grounded wrist straps worn should have at
purposes, which will not cause any adverse effect on the least 1 MΩ of resistance from the operator to ground to
product life, are indicated below: prevent shock hazard, and it should be placed near the
operator.
Type Suppliers • Workbenches where the products are handled should be
G746 Shin-Etsu Chemical Co., Ltd. grounded and be provided with conductive table and floor
YG6260 Momentive Performance Materials Inc. mats.
SC102 Dow Corning Toray Co., Ltd. • When using measuring equipment such as a curve tracer,
the equipment should be grounded.
Cautions for Mounting to a Heatsink • When soldering the products, the head of soldering irons
• When the flatness around the screw hole is insufficient, such or the solder bath must be grounded in order to prevent
as when mounting the products to a heatsink that has an leak voltages generated by them from being applied to the
extruded (burred) screw hole, the products can be damaged, products.
even with a lower than recommended screw torque. For • The products should always be stored and transported in
mounting the products, the mounting surface flatness should Sanken shipping containers or conductive containers, or
be 0.05 mm or less. be wrapped in aluminum foil.

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STR-X6768N Off-Line Quasi-Resonant Switching Regulators

• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-
ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-
ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-
ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-
tion network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.

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