Uc2825 PDF
Uc2825 PDF
Uc2825 PDF
INFO
available
UC2825
UC3825
BLOCK DIAGRAM
UDG-92030-2
2
UC1825
UC2825
UC3825
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for , RT = 3.65k, CT = 1nF, VCC
= 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TO.
UC1825
UC3825
PARAMETERS TEST CONDITIONS UC2825
MIN TOP MAX MIN TOP MAX UNITS
Reference Section
Output Voltage TO = 25°C, IO = 1mA 5.05 5.10 5.15 5.00 5.10 5.20 V
Line Regulation 10V < VCC < 30V 2 20 2 20 mV
Load Regulation 1mA < IO < 10mA 5 20 5 20 mV
Temperature Stability* TMIN < TA < TMAX 0.2 0.4 0.2 0.4 mV/°C
Total Output Variation* Line, Load, Temperature 5.00 5.20 4.95 5.25 V
Output Noise Voltage* 10Hz < f < 10kHz 50 50 µV
Long Term Stability* TJ = 125°C, 1000hrs. 5 25 5 25 mV
Short Circuit Current VREF = 0V -15 -50 -100 -15 -50 -100 mA
Oscillator Section
Initial Accuracy* TJ = 2°C 360 400 440 360 400 440 kHz
Voltage Stability* 10V < VCC < 30V 0.2 2 0.2 2 %
Temperature Stability* TMIN < TA < TMAX 5 5 %
Total Variation* Line, Temperature 340 460 340 460 kHz
Oscillator Section (cont.)
Clock Out High 3.9 4.5 3.9 4.5 V
Clock Out Low 2.3 2.9 2.3 2.9 V
Ramp Peak* 2.6 2.8 3.0 2.6 2.8 3.0 V
Ramp Valley* 0.7 1.0 1.25 0.7 1.0 1.25 V
Ramp Valley to Peak* 1.6 1.8 2.0 1.6 1.8 2.0 V
Error Amplifier Section
Input Offset Voltage 10 15 mV
Input Bias Current 0.6 3 0.6 3 µA
Input Offset Current 0.1 1 0.1 1 µA
Open Loop Gain 1V < VO < 4V 60 95 60 95 dB
CMRR 1.5V < VCM < 5.5V 75 95 75 95 dB
PSRR 10V < VCC < 30V 85 110 85 110 dB
Output Sink Current VPIN 3 = 1V 1 2.5 1 2.5 mA
Output Source Current VPIN 3 = 4V -0.5 -1.3 -0.5 -1.3 mA
Output High Voltage IPIN 3 = -0.5mA 4.0 4.7 5.0 4.0 4.7 5.0 V
Output Low Voltage IPIN 3 = 1mA 0 0 .5 1.0 0 0.5 1.0 V
Unity Gain Bandwidth* 3 5.5 3 5.5 MHz
Slew Rate* 6 12 6 12 V/µs
3
UC1825
UC2825
UC3825
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for , RT = 3.65k, CT = 1nF, VCC
= 15V, -55°C<TA<125°C for the UC1825, –40°C<TA<85°C for the UC2825, and 0°C<TA<70°C for the UC3825, TA=TJ.
UC1825
UC3825
PARAMETERS TEST CONDITIONS UC2825
MIN TOP MAX MIN TOP MAX UNITS
PWM Comparator Section
Pin 7 Bias Current VPIN 7 = 0V -1 -5 -1 -5 µA
Duty Cycle Range 0 80 0 85 %
Pin 3 Zero DC Threshold VPIN 7 = 0V 1.1 1.25 1.1 1.25 V
Delay to Output* 50 80 50 80 ns
Soft-Start Section
Charge Current VPIN 8 = 0.5V 3 9 20 3 9 20 µA
Discharge Current VPIN 8 = 1V 1 1 mA
Current Limit / Shutdown Section
Pin 9 Bias Current 0 < VPIN 9 < 4V 15 10 µA
Current Limit Threshold 0.9 1.0 1.1 0.9 1.0 1.1 V
Shutdown Threshold 1.25 1.40 1.55 1.25 1.40 1.55 V
Delay to Output 50 80 50 80 ns
Output Section
Output Low Level IOUT = 20mA 0.25 0.40 0.25 0.40 V
IOUT = 200mA 1.2 2.2 1.2 2.2 V
Output High Level IOUT = -20mA 13.0 13.5 13.0 13.5 V
IOUT = -200mA 12.0 13.0 12.0 13.0 V
Collector Leakage VC = 30V 100 500 10 500 µA
Rise/Fall Time* CL = 1nF 30 60 30 60 ns
Under-Voltage Lockout Section
Start Threshold 8.8 9.2 9.6 8.8 9.2 9.6 V
UVLO Hysteresis 0.4 0.8 1.2 0.4 0.8 1.2 V
Supply Current Section
Start Up Current VCC = 8V 1.1 2.5 1.1 2.5 mA
ICC VPIN 1, VPIN 7, VPIN 9 = 0V; VPIN 2 = 1V 22 33 22 33 mA
4
UC1825
UC2825
Printed Circuit Board Layout Considerations UC3825
High speed circuits demand careful attention to layout this purpose. 3) Bypass VCC, VC, and VREF. Use 0.1µF
and component placement. To assure proper perfor- monolithic ceramic capacitors with low equivalent series
mance of the UC1825 follow these rules: 1) Use a ground inductance. Allow less than 1 cm of total lead length for
plane. 2) Damp or clamp parasitic inductive kick energy each capacitor between the bypassed pin and the ground
from the gate of driven MOSFETs. Do not allow the out- plane. 4) Treat the timing capacitor, CT, like a bypass ca-
put pins to ring below ground. A series gate resistor or a pacitor.
shunt 1 Amp Schottky diode at the output pin will serve
PWM Applications
Current-Mode
Conventional (Voltage Mode)
5
UC1825
UC2825
Oscillator Circuit UC3825
Deadtime vs CT (3k RT 100k)
µ
Timing Resistance vs Frequency Deadtime vs Frequency
160
1.0nF
140
TD (ns) 120
100
470pF
80
10k 100k 1M
FREQ (Hz)
Synchronized Operation
6
UC1825
UC2825
Forward Technique for Off-Line Voltage Mode Application UC3825
Output Section
7
UC1825
UC2825
Open Loop Laboratory Test Fixture UC3825
UDG-92032-2
This test fixture is useful for exercising many of the As with any wideband circuit, careful grounding and by-
UC1825’s functions and measuring their specifications. pass procedures should be followed. The use of a
ground plane is highly recommended.
UDG-92033-3
8
PACKAGE OPTION ADDENDUM
www.ti.com 27-Mar-2019
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
5962-87681012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87681012A
UC1825L/
883B
5962-8768101EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8768101EA
UC1825J/883B
5962-8768101QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8768101QF
A
UC1825W/883B
UC1825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 UC1825J
UC1825J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8768101EA
UC1825J/883B
UC1825L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 UC1825L
UC1825L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87681012A
UC1825L/
883B
UC1825W883B ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8768101QF
A
UC1825W/883B
UC2825DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW
& no Sb/Br)
UC2825DWG4 ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW
& no Sb/Br)
UC2825DWTR ACTIVE SOIC DW 16 2000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 UC2825DW
& no Sb/Br)
UC2825J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -40 to 85 UC2825J
UC2825N ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 UC2825N
& no Sb/Br)
UC2825NG4 ACTIVE PDIP N 16 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 UC2825N
& no Sb/Br)
UC3825DW ACTIVE SOIC DW 16 40 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR 0 to 70 UC3825DW
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 27-Mar-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 27-Mar-2019
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
GENERIC PACKAGE VIEW
DW 16 SOIC - 2.65 mm max height
7.5 x 10.3, 1.27 mm pitch SMALL OUTLINE INTEGRATED CIRCUIT
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224780/A
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PACKAGE OUTLINE
DW0016A SCALE 1.500
SOIC - 2.65 mm max height
SOIC
10.5 2X
10.1 8.89
NOTE 3
8
9
0.51
16X
0.31
7.6
B 0.25 C A B 2.65 MAX
7.4
NOTE 4
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0.3
0 -8 0.1
1.27
0.40 DETAIL A
(1.4) TYPICAL
4220721/A 07/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MS-013.
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EXAMPLE BOARD LAYOUT
DW0016A SOIC - 2.65 mm max height
SOIC
1 16
16X (0.6)
SYMM
14X (1.27)
8 9
R0.05 TYP
(9.3)
4220721/A 07/2016
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
DW0016A SOIC - 2.65 mm max height
SOIC
1 16
16X (0.6)
SYMM
14X (1.27)
8 9
R0.05 TYP
(9.3)
4220721/A 07/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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