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Maxim Integrated Products: Reliability Report FOR MAX483ECPA+ Plastic Encapsulated Devices

The document provides reliability test results and manufacturing details for Maxim Integrated Products' MAX483ECPA+ plastic encapsulated RS-485/RS-422 transceiver. It describes the device, manufacturing process, packaging, die details, quality assurance procedures, and accelerated life test results showing the device meets reliability standards.

Uploaded by

Iman Akbari
Copyright
© © All Rights Reserved
44 views5 pages

Maxim Integrated Products: Reliability Report FOR MAX483ECPA+ Plastic Encapsulated Devices

The document provides reliability test results and manufacturing details for Maxim Integrated Products' MAX483ECPA+ plastic encapsulated RS-485/RS-422 transceiver. It describes the device, manufacturing process, packaging, die details, quality assurance procedures, and accelerated life test results showing the device meets reliability standards.

Uploaded by

Iman Akbari
Copyright
© © All Rights Reserved
You are on page 1/ 5

MAX483E

RELIABILITY REPORT

FOR

MAX483ECPA+

PLASTIC ENCAPSULATED DEVICES

October 9, 2009

MAXIM INTEGRATED PRODUCTS


120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Approved by

Ken Wendel

Quality Assurance

Director, Reliability Engineering

Maxim Integrated Products. All rights reserved. Page 1/5


MAX483E

Conclusion

The MAX483ECPA+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.

Table of Contents

I. ........Device Description V. ........Quality Assurance Information

II. ........Manufacturing Information VI. .......Reliability Evaluation

III. .......Packaging Information IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX481E, MAX483E, MAX485E, MAX487E- MAX491E, and MAX1487E are low-power transceivers for RS-485 and RS-422 communications in
harsh environments. Each driver output and receiver input is protected against ±15kV electro-static discharge (ESD) shocks, without latchup. These
parts contain one driver and one receiver. The MAX483E, MAX487E, MAX488E, and MAX489E feature reduced slew-rate drivers that minimize EMI
and reduce reflections caused by improperly terminated cables, thus allowing error-free data transmission up to 250kbps. The driver slew rates of the
MAX481E, MAX485E, MAX490E, MAX491E, and MAX1487E are not limited, allowing them to transmit up to 2.5Mbps. These transceivers draw as
little as 120µA supply current when unloaded or when fully loaded with disabled drivers (see Selector Guide). Additionally, the MAX481E, MAX483E,
and MAX487E have a low-current shutdown mode in which they consume only 0.5µA. All parts operate from a single +5V supply. Drivers are
short-circuit current limited, and are protected against excessive power dissipation by thermal shutdown circuitry that places their outputs into a
high-impedance state. The receiver input has a fail-safe feature that guarantees a logic-high output if the input is open circuit. The MAX487E and
MAX1487E feature quarter-unit-load receiver input impedance, allowing up to 128 transceivers on the bus. The MAX488E-MAX491E are designed for
full-duplex communications, while the MAX481E, MAX483E, MAX485E, MAX487E, and MAX1487E are designed for half-duplex applications. For
applications that are not ESD sensitive see the pinand function-compatible MAX481, MAX483, MAX485, MAX487-MAX491, and MAX1487.

Maxim Integrated Products. All rights reserved. Page 2/5


MAX483E

II. Manufacturing Information

A. Description/Function: ±15kV ESD-Protected, Slew-Rate-Limited, Low-Power, RS-485/RS-422


Transceivers

B. Process: S3
C. Number of Device Transistors:
D. Fabrication Location: Oregon
E. Assembly Location: Thailand, Philippines
F. Date of Initial Production: Pre 1997

III. Packaging Information

A. Package Type: 8-pin PDIP


B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Gold (1.3 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: #05-1901-0136
H. Flammability Rating: Class UL94-V0
I. Classification of Moisture Sensitivity per Level 1
JEDEC standard J-STD-020-C

J. Single Layer Theta Ja: 110°C/W


K. Single Layer Theta Jc: 40°C/W

IV. Die Information

A. Dimensions: 85 X 128 mils


B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect: Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization: None
E. Minimum Metal Width: 3.0 microns (as drawn)
F. Minimum Metal Spacing: 3.0 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectric: SiO2
I. Die Separation Method: Wafer Saw

Maxim Integrated Products. All rights reserved. Page 3/5


MAX483E

V. Quality Assurance Information

A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering)


Bryan Preeshl (Managing Director of QA)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm


D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:

= 1 = 4.045 (Chi square value for MTTF upper limit)


MTTF 192 x 4340 x 1520 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 1.56 x 10
= 1.56 F.I.T. (60% confidence level @ 25°C)

The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S3 Process results in a FIT Rate of 0.04 @ 25C and 0.69 @ 55C (0.8 eV, 60% UCL)

B. Moisture Resistance Tests

The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.

C. E.S.D. and Latch-Up Testing

The RS29-2 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per JEDEC
JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250 mA.

Maxim Integrated Products. All rights reserved. Page 4/5


MAX483E

Table 1
Reliability Evaluation Test Results

MAX483ECPA+

TEST ITEM TEST CONDITION FAILURE SAMPLE SIZE NUMBER OF


IDENTIFICATION FAILURES

Static Life Test (Note 1)


Ta = 135°C DC Parameters 1520 1
Biased & functionality
Time = 192 hrs.

Moisture Testing (Note 2)


HAST Ta = 130°C DC Parameters 77 0
RH = 85% & functionality
Biased
Time = 96hrs.

Mechanical Stress (Note 2)


Temperature -65°C/150°C DC Parameters 77 0
Cycle 1000 Cycles & functionality
Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data

Maxim Integrated Products. All rights reserved. Page 5/5

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