User'S Manual of Intel H61 Express Chipset: M/B For Intel LGA 1155 Processors
User'S Manual of Intel H61 Express Chipset: M/B For Intel LGA 1155 Processors
User'S Manual of Intel H61 Express Chipset: M/B For Intel LGA 1155 Processors
Of
Intel H61 Express Chipset
Based
M/B for Intel LGA 1155 Processors
NO. G03-MIH61MD-F
Rev: 2.0
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request of
the main chipset)
z The increasing temperature of the capacitor may decrease the life of computer. Using
the close case may decrease the life of other device because the higher temperature in
the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
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TABLE OF CONTENT
CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS
1-1 FEATURES OF MOTHERBOARD................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD .................................1
1-2 ITEM CHECKLIST.........................................................................................2
1-3 SPECIFICATION ...........................................................................................3
1-4 LAYOUT DIAGRAM ......................................................................................4
CHAPTER 2 HARDWARE INSTALLATION
2-1 CPU INSTALLATION ..................................................................................6
2-2 MEMORY MODULE INSTALLATION...........................................................7
2-3 EXPANSION SLOTS.....................................................................................8
CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING
3-1 MOTHERBOARD INTERNAL CONNECTORS ............................................8
3-2 I/O BACK PANEL CONNECTORS ...............................................................10
3-3 HEADERS .....................................................................................................11
3-4 JUMPER SETTING .......................................................................................13
CHAPTER 4 USEFUL HELP
4-1 HOW TO UPDATE BIOS ..............................................................................14
4-2 TROUBLE SHOOTING .................................................................................14
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Chapter 1
Introduction of Intel H61 Motherboards
1-1 Features of Motherboard
The Intel H61 Express chipset based motherboard series are based on Intel H61
Express chipset technology which supports the innovative Intel LGA 1155 socket
Intel® Core™ i7, Intel® Core™ i5, Core™ i3.
The Intel H61 Express chipset based motherboard series comes with an integrated
DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system
memories which are expandable to 8 GB capacity.
The motherboard provides four serial ATA2 interfaces of 3.0 Gb / s data transfer rate
for four serial ATA devices.
Of the H61 Express chipset based motherboards, model MIH61M-DU3 and model
MIH61M-D series are integrated with gigabit LAN chip providing 10/100/1000Mbps
data transfer rate while model MIH61M-DS series are integrated with megabit PCI-E
LAN chip providing 10/100Mbps data transfer rate.
The H61 Express chipset based motherboard series are embedded 6-channel HD
CODEC fully compatible with Sound Blaster Pro® standards to offer you home cinema
quality and absolutely software compatibility.
The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16
graphics slot and two PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity
for the I/O of peripherals.
Embedded USB controllers as well as capability of expanding to 8 of USB 2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity and one USB3.0
port (optional for model MIH61M-DU3) delivering 5Gbp/s bandwidth of rich
connectivity, these motherboards meet the future USB demands which are also
equipped with hardware monitor function on system to monitor and protect your
system and maintain your non-stop business computing.
Some special features--- OC-CON/ Thunder Protection(optional)/ E.R.P. Standards
(Optional for model MIH61M-DU3/ MIH61M-DS series) provide extra protection to the
motherboard to extend product life and ensure system stability.
1-1-1 Special Features of motherboard
OC-CON solid capacitors-High-polymer Solid Electrolysis Aluminum Capacitors
CPU Vcore Input and Output of the motherboard adopts OC-CON solid capacitors to
make it possible for motherboard to work from 55 degrees Centigrade below zero to
125 degrees centigrade. OC-CON capacitors possess superior physical
characteristics to prolong product life ten times than corresponding motherboard
without capacitors every time working temperature increases 20 degrees. Life of
product of motherboard with solid capacitors declines only 10% of those without solid
capacitors as well under same conditions.
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Thunder Protection (Optional)
LAN chips of optional motherboards are integrated with thunder protection IC.
Thunder-lightning protection can effectively ensure PC security in the thundering and
rainy season. Please note that do not use PC when it is thundering and lightning.
E.R.P. Standards—(Energy Using Product Standards)
Model MIH61M-DU3/ MIH61M-DS series are in compliance with E.R.P. Standards
and support ACPI S3 Function.The full name of E.R.P. Standards is Energy Using
Product Standards, obviously technology utilized to low power consumption. ERP is a
technology with remarkable power saving function.
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1-3 Specification
Spec Description
Design z U-ATX PCB size:24.5cmx18.0cm
Chipset z Intel H61 Express Chipset
z supports the innovative Intel LGA 1155 socket Intel®
CPU Socket Core™ i7, Core™ i5, Core™ i3 Processor
z DDRIII module slot x 2
z Support 2pcs DDRIII 1066/DDRIII 1333 memory modules
Memory Slot
expandable to 8 GB
z Support dual channel function
z 1pcs PCI-Express 2.0 x16 by16 lane slot
Expansion Slots
z 2pcs PCI-Express 2.0 x1 slots
z The Intel H61chipset supports four internal Serial ATA
Serial ATA2 ports for four SATA devices providing 3.0 Gb/sec data
transfer rate
z Integrated gigabit PCI-E LAN chip that supports Fast
Ethernet LAN function of providing 10/100/1000Mbps data
transfer rate (for MIH61M-DU3 and MIH61M-D series
LAN chip motherboard)
z Integrated megabit PCI-E LAN chip that supports Fast
Ethernet LAN function of providing 10/100Mbps data
transfer rate (for MIH61M-DS series motherboard)
z 6-CHHD Audio Codec integrated
HD Audio Chip
z Audio driver and utility included
BIOS z AMI 32MB SMT Flash ROM
z Coaxial S/PDIF_OUT connector x1
z VGA Connector x1
z DVI Connector x1
z PS/2 keyboard connector x1
z USB 2.0 port x4 and header x2
z USB 3.0 port x1 (Optional for model MIH61M-DU3)
z RJ-45 LAN connector x1
Multi I/O z Audio connector x1 (6-CH Audio)
z Front Panel Audio Header x1
z Serial Port headerx1
z HDMI-SPDIF header x1
z LPC_CON header x1
z Front panel header x1
z PWELED header x1
z Speaker header x1
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1-4 Layout Diagram
MIH61M-DU3 Series Motherboard:
USB 2.0 Ports RJ-45 LAN Port
Line-IN
VGA Port USB 3.0
DVI Port
Port Line-OUT
MIC-IN
Coaxial
SPDIF_OUT Port
ATX 12V
Power Connector DDRIII Slot x 2
VGA Port
DVI Port
CPU Socket
RJ-45 over
USB 2.0 ports
Audio Connector PCI Express2.0 x16 by 16 Lane slot
Serial-ATAII Connector
PCI Express 2.0x1 slots JBAT (SATA 1, 2, 3, 4)
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MIH61M-D / MIH61M-DS Series Motherboard:
USB 2.0 Ports RJ-45 LAN Port
Line-IN
VGA Port
DVI Port
Line-OUT
MIC-IN
Coaxial
SPDIF_OUT Port
ATX 12V
Power Connector DDRIII Slot x 2
VGA Port
DVI Port
CPU Socket
RJ-45 over
USB 2.0 ports
Audio Connector PCI Express2.0 x16 by 16 Lane slot
Serial-ATAII Connector
PCI Express 2.0x1 slots JBAT (SATA 1, 2, 3, 4)
* Note: Model MIH61M-D is integrated with gigabit LAN chip. Model MIH61M-DS is integrated with
megabit LAN chip. Other Specifications of these two models are the same.
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Chapter 2
Hardware Installation
WARNING! Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 CPU Installation
This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,
referred to as the LGA 1155 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
NOTED! Be sure that there is sufficient air circulation across the processor’s
heat sink and CPU cooling FAN is working correctly, otherwise it
may cause the processor and motherboard overheat and damage,
you may install an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA
1155 socket and open it by first pulling the level sideways away from the socket then
upward to a 135-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the
CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation
as shown.
When you install the CPU into the LGA 1155 socket, there’s no force required CPU
insertion; then presses the level to locate position slightly without any extra force.
Alignment key
Pin-1 Indicator
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2-2 Memory Module Installation
This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES
(DIMM) socket for DDR III memory expansion available to maximum memory volume
of 8 GB DDRIII SDRAM.
Valid Memory Configurations
Bank 240-Pin DIMM PCS Maximum Capacity
DIMM1 DDR III 1066/ DDR III1333 X1 4GB
DIMM2 DDR III 1066/ DDR III1333 X1 4GB
Total System Memory (Max 4GB) 2 8GB
DIMM2 (BANK2+BANK3)
NOTICE! When you install DIMM module fully into the DIMM socket the eject
tab should be locked into the DIMM module very firmly and fit into its
indention on both sides.
Installation Tips:
Open the two plastic clips of memory slots then push down the module
vertically into the slot. See to it that the hole of the module fit into the notch of
the slot;
The two plastic clips will automatically close if the memory module is fitted in a
proper way.
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2-3 Expansion Slots
The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16
graphics slot and two PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity
for the I/O of peripherals.
Chapter 3
Connectors, Headers &Jumper Setting
3-1 Motherboard Internal Connectors
(1) Power Connector (24-pin block): ATXPWR1
ATX Power Supply connector: This is a new defined 24-pins connector that
usually comes with ATX case. The ATX Power Supply allows using soft power
on momentary switch that connect from the front panel switch to 2-pins Power
On jumper pole on the motherboard. When the power switch on the back of the
ATX power supply turned on, the full power will not come into the system board
until the front panel switch is momentarily pressed. Press this switch again will
turn off the power to the system board.
** We recommend that you use an ATX 12V Specification 2.0-compliant power
supply unit (PSU) with a minimum of 350W power rating. This type has 24-pin
and 4-pin power plugs.
** If you intend to use a PSU with 20-pin and 4-pin power plugs, make sure that the
20-pin power plug can provide at least 15A on +12V and the power supply unit
has a minimum power rating of 350W. The system may become unstable or may
not boot up if the power is inadequate.
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** If you are using a 20-pin power plug, please refer to Figure1 for power supply
connection. Power plug form power supply and power connectors from motherboard
both adopt key design to avoid mistake installation. You can insert the power plug into
the connector with ease only in the right direction. If the direction is wrong it is hard to
fit in and if you make the connection by force if is possible.
Pin 1
MIC-IN
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Line-in: (BLUE) Audio input to sound chip
Line-out: (GREEN) Audio output to speaker
MIC: (PINK) Microphone Connector
3-3 Headers
(1) Line-Out/MIC Header for Front Panel (9-pin): FP_AUDIO1
These headers connect to Front Panel Line-out, MIC connector with cable.
Audio-GND
Audio-JD
LINE2-JD
MIC2-JD
KEY
AU D I O 2 10
P in 1
9
Sense-FB
MIC2-L
MIC2 -R
Lineout2 -R
Lineout2-L
L ine-O ut, MIC Headers
OC
Pin 1
-DATA
+DATA
GND
VCC
11
PWR LED
PWRBTN
PWRLED
PWRBTN
VCC5
GND
PWRLED
Pin 1
JW FP
SPEAK
Pin 1 Pin 1
HDDLE
RSTSW
VCC5
GND
VCC5
SPKR
NC
GND
NC
RESET
HDLED
System Case Connections
CPUFAN
1 4
SYSFAN1 3
Pin1
12
HDMI_SPDIF_OUT GND
1 2
HDMI_SPDIF Header
(11) LPC_CON header: LPC_CON
VCC3
LAD2
LAD1
GND
GND
NC
2 12
Pin 1 11
LAD0
LPCRST
LPC_CLK
LFRAME
VCC3
LAD3
LPC_CON
JP1 JP1
1-2 Closed: KB/MS Power ON Disable (Default) 2-3 Closed: KB/MS Power ON Enabled
WARNNING! Please remove or turn off the power supply before CMOS clear.
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3. Locate JBAT and short pins 2-3 for a few seconds
4. Return JBAT to its normal setting by shorting pins 1-2
5. Connect ATX power cable back to ATX power connector
JBAT JBAT
Chapter 4
Useful Help
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4-2 Trouble Shooting
Problem Solution
No power to the system to the all power light 1. Make sure power cable is security
don’t illuminate, fan inside power supply plugged in. 2. Replace cable. 3. Contact
doesn’t turn on. technical support.
System inoperative. Keyboard lights are on , Using ever pressure on both ends of the
power indicator lights are lit, and hard drive DIMM , press down firmly until the module
is spinning. snaps into places.
System doesn’t boot from hard disk drive, 1. Check cable running from disk to disk
can be booted from optical drive. controller board. .Make sure both ends are
securely plugged in, check the drive type in
the standard CMOS setup. 2. Backing up the
hard drive is extremely important .All hard
disks are capable of breaking down at any
time.
System only boots from optical drive .Hard 1. Back up date and applications files. 2.
disk can be read and applications can be Reformat the hard drive. Reinstall
used but booting from hard disk is applications and date using backup disks.
impossible.
Screen message says “Invalid Review system‘s equipment .Make sure
Configuration” or “CMOS Failure” correct information on is in setup.
Can not boot system after installing second 1. Set master /slave jumpers correctly. 2.
hard drive. Run SETUP program and select correct
drive types. Call the drive manufacture for
compatibility with other drives.
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