Materials Chemistry and Physics
Materials Chemistry and Physics
(Cu, Fe, Co, or Ni)-doped tin dioxide films deposited by spray pyrolysis:
Doping influence on thermal stability of the film structure
G. Korotcenkov a,b,∗ , Sang Do Han a,∗
a
Future Fundamental Technology Research Department, Korea Institute of Energy Research, 71-2 Jang-dong, Yuseong-gu, Daejeon 305-343, Republic of Korea
b
Technical University of Moldova, Bld. Stefan cel Mare 168, Chisinau 2004, Republic of Moldova
a r t i c l e i n f o a b s t r a c t
Article history: The results of doping influence on thermal stability of the SnO2 film morphology are presented in this
Received 9 May 2008 article. The SnO2 films doped by Fe, Cu, Ni, Co (16 at.%) were deposited by spray pyrolysis from 0.2 M
Received in revised form 6 August 2008 SnCl4 –water solution at Tpyr 350–450 ◦ C. The annealing at 850–1030 ◦ C was carried out in the atmosphere
Accepted 11 August 2008
of the air. The change of such parameters as film morphology, the grain size, texture and the intensity
of X-ray diffraction (XRD) peaks have been controlled. For structural analysis of tested films we have
Keywords:
been using X-ray diffraction, Scanning Electron Microscopy (SEM), and Atomic Force Microscopy (AFM)
Oxides
techniques. It was established that the doping does not improve thermal stability of both film morphology
Thin films
Annealing
and the grain size. It was made a conclusion that the increased contents of the fine dispersion phase of
Microstructure tin oxide in the doped metal oxide films, and the coalescence of this phase during thermal treatment are
the main factors, responsible for observed changes in the morphology of the doped SnO2 films.
© 2008 Elsevier B.V. All rights reserved.
0254-0584/$ – see front matter © 2008 Elsevier B.V. All rights reserved.
doi:10.1016/j.matchemphys.2008.08.031
G. Korotcenkov, S.D. Han / Materials Chemistry and Physics 113 (2009) 756–763 757
Fig. 1. SEM images of undoped SnO2 films and films doped by Co, Ni, Fe or Cu before and after annealing at T = 850 ◦ C. Films were deposited at Tpyr = 450 ◦ C and had thickness
∼120 nm.
758 G. Korotcenkov, S.D. Han / Materials Chemistry and Physics 113 (2009) 756–763
stability of those films’ structural parameters. The wide use of the films. Even more, at used concentrations (0–16 at.%) those additives
SnO2 doping by Cu, Fe, Co and Ni for optimization of the gas sensors do not control that changes. Noticeable distinction in the morphol-
parameters is an additional motivation of present research [1,13,18]. ogy of as-deposited films and similarity of their structure after
As it is known, working temperatures of gas sensors could be in the annealing allows concluding that the doping influence on the film
range of 100–600 ◦ C; and the determination of consequences of morphology at the stage of deposition is much stronger than dur-
doping for the structure stability of gas sensing materials gained a ing the process of the following annealing. It means that the grain
special significance for the improvement of working characteristics shape after annealing is being determined first of all by the tem-
of those devices. perature of thermal treatment and the grain size, but not by the
doping element.
2. Experimental details The comparison of SEM images presented in Figs. 1 and 2 shows
that the shape of the grains, formed as a result of annealing at
During present research we have been using the SnO2 films similar to the ones
described in Refs. [16,17]. Films, which thickness varied from 50–70 nm to 400 nm, Tan ∼ 850 ◦ C does not depend on Tpyr of annealed SnO2 films. After
were deposited by spray pyrolysis from 0.2 M SnCl4 –water solution on oxidized annealing at 850 ◦ C the SnO2 films deposited at Tpyr = 350 ◦ C and
Si substrate at Tpyr = 350 ◦ C and 450 ◦ C [19,20]. Such wide range of the thicknesses 450 ◦ C had very similar SEM images. Further thermal treatment at
was conditioned by the fact that SnO2 films find an application in devices, where
Tan = 950 ◦ C did not influence the film morphology and the grain
requirements to the thickness are being varied in very wide range.
The annealing was carried out in a flow type reactor in the atmosphere of air. The
size, confirming our assumption that the main changes in SnO2
annealing temperature was varied from 850 ◦ C to 1030 ◦ C. The choice of indicated film morphology were connected with coalescence of the fine dis-
temperatures was necessary for obtaining effect, applicable for analysis. As it was persion phase and the small grains, which has already taken place at
found in Refs. [21,22], noticeable changes in the morphology and the grain size of
the SnO2 films deposited by spray pyrolysis take place only after thermal treatments
at Tan higher 600–700 ◦ C. The duration of annealing was usually equaled to 1 h.
Fe, Cu, Co, and Ni have been used as doping additives, embedded into sprayed
solution in the form of chlorides. The concentration of doping elements in sprayed
solution was equaled 16 at.%. At lower concentration of additives (1–8 at.%) the
doping influence was not so clear shown as at the concentration equaled 16 at.%.
Therefore it was decided that consideration of the behavior of the film structure
with maximum concentration of doping additives would be enough for establishing
a general peculiarities of the influence of the dopants’ nature on the transformation
of the films morphology during thermal treatment.
X-ray diffraction (XRD), Scanning Electron Microscopy (SEM), and Atomic Force
Microscopy (AFM) have been used for structural characterization of analyzed films.
XRD measurements were conducted by a Rigaku Rotaflex X-ray diffractometer with a
rotating anode source, working with the K␣ of the Cu. For structural characterization
we have been using the /2 mode of measurements. The size of the crystallites,
forming the film, was evaluated by Scherrer’s formula.
For SEM measurements we have been using scanning electronic microscopes
Philips XL30, and Stereoscan JS360 Cambridge Instruments with structural resolu-
tion ∼0.3–0.4 nm. AFM images were obtained by using MultiMode Scanning Probe
Microscope with Nanoscope IIIa Controller of Digital Instruments. These measure-
ments have been carried out in contact scanning mode using AS-0.5 scanner (scan
rate 2 Hz; resolution 0.4 nm).
dopants is found in the state of bulk solid solution; while the most
part of the dopants is segregated on the surface of the SnO2 crys- of SnO2 . It is necessary to note that the small limiting solubility of
tallites in the form of small grains with size smaller than 2–4 nm. various metal oxides is typical for SnO2 [12,14].
It is known that X-ray diffraction on the crystallographic planes of
the grains with such small size does not give any noticeable peaks. 3.3. Doping influence on grain size stability
The absence of significant shifts in the position of X-ray
diffraction peaks in comparison with undoped SnO2 is additional Regarding the influence of the nature of doping additives on the
confirmation of the made-above conclusion. Even after annealing stability of the SnO2 grain size, obtained XRD data allows to make
at 1000 ◦ C the shift in XRD peak position in doped films in compar- the following conclusions.
ison with undoped ones was in the limits of experimental error. It Additives actually affect the thermal stability of the SnO2 grain
means that the doping is not accompanied by the change of lattice size. However it is necessary to note, that optimizing influence, i.e.
parameter of SnO2 . Such situation at used levels of doping is pos- the decrease of the grain size change during thermal treatment,
sible only in case when the solubility of doping elements is small, in contrast to the results obtained for the SnO2 powders, is not
i.e. only small part of doping additives incorporates in the lattice being observed for all studied additives. For example, the addition
760 G. Korotcenkov, S.D. Han / Materials Chemistry and Physics 113 (2009) 756–763
Table 1
Doping influence on the intensity of X-ray diffraction at (1 1 0) plane of SnO2 grains
low temperatures the necks with essentially big area (diameter) ence of the fine dispersed phase. After annealing at Tan = 850 ◦ C
could be formed between crystallites. The presence of the necks all AFM images even for SnO2 films doped by cooper (see Fig. 6b)
between grains can be considered as factor, promoting the coa- had clearly defined contours of grains, confirming the absence in
lescence of closely located grains. This fact could be an important the SnO2 matrix of the grains with sizes, smaller than the limit of
reason of degradation of the sensors parameters after high tem- resolution of used measuring instruments.
perature annealing. In this context, a considerable improvement of It is important to note that the morphology of the SnO2 films
the sensors parameters after mechanical milling of sintered metal after thermal treatments replicates the macrostructure of the films
oxide powders could be considered as a result of those necks’ break- formed by agglomerates (see Fig. 6). Such behavior one can con-
ing [28]. sider as the evidence of the fact that the transformation of the
The mechanism of the appearance of the fine dispersed phase we film morphology first of all takes place through the coalescence
have discussed earlier in Ref. [16]. According to suggested model, of crystallites forming the agglomerates.
the growth of contents of the fine dispersed phase in doped films is Comparing the influence of annealing on the XRD patterns of
conditioned by the appearance of additional nucleation centers for both thick and thin SnO2 films, deposited at the same tempera-
the SnO2 growth, formed by the second oxide phase. As we indi- ture, one can see that the change of the X-ray diffraction peaks’
cated earlier the second oxide phase, appearing during the process intensity after thermal treatments is higher for the thin films (see
of SnO2 growth as a rule is being segregated on the surface of basic Table 1). For the SnO2 films with thickness of 400 nm (Tpyr = 450 ◦ C),
oxide grains [4,12,29], which stimulates the appearance on the sur- the change of the X-ray diffraction peaks’ intensity after annealing
face of big crystallites of the layer of the fine dispersed phase, filling at T = 850 ◦ C was equaled 1.5–2 times, while for the films with thick-
inter-crystallite space. It is necessary to note that we are not the ness of 100 nm this change could exceed 3–5 times. Basing on our
only ones, using such approach in analyzing structural properties assumptions this effect can be easily explained, since in the thin
of the SnO2 films. In Ref. [30] it was also mentioned the form- films the contents of the fine dispersion phase is bigger. This is
ing of the fine dispersed amorphous-like phase during the growth understandable, because with the thickness’ growth the grain size
of the SnO2 films. The authors of mentioned work, as well as in is being increased as well [20,25]. Besides that, as we have shown
our case, have been observing both the increase of contents of the earlier in Ref. [15], the SnO2 films at the interface with substrate
fine dispersed phase at the lowering of deposition temperature and always had transient layer with thickness of ∼3–10 nm, consist-
the sharp reduction of this phase’s concentration at the following ing from randomly oriented fine dispersed crystallites. Therefore,
annealing at Tan > 500 ◦ C. the contribution of this transition layer crystallization and struc-
On the base of the assumption that the main changes in the ture ordering in XRD patterns of the thin films should be obviously
grain size of doped SnO2 films during the annealing at Tan ∼ 850 ◦ C higher, than in the thick films.
are connected with the presence of the fine dispersed phase, and The comparison of data presented in Table 1 also indicates that
basing on the data of the annealing influence on the intensity of the films deposited at low temperatures (Tpyr ∼ 350 ◦ C) subjected
X-ray diffraction peaks, we receive the confirmation of the con- to much more structural changes than the films, grown at higher
clusion made in Ref. [16] that the maximum contents of the fine temperatures (Tpyr > 400–450 ◦ C). This result is quite appropriate,
dispersion phase in the SnO2 films during spray pyrolysis deposi- because the coalescence of the fine dispersed grains formed dur-
tion are being formed after doping by Cu. With regard to another ing the process of the growth with big crystallites could take place
doped SnO2 films, we can concluded that the contents of the fine already at the stage of the film growth. It means that devices, man-
dispersed phase have been decreasing in the line SnO2 :Cu, SnO2 :Fe, ufactured of the base of films, grown at high temperatures would
SnO2 :Co, SnO2 :Ni, SnO2 . Given line reflects the degree in the change be more stable during exploitation in comparison with the ones,
of the XRD peaks intensity as a result of thermal treatment. fabricated on the base of low temperature films.
The same conclusion one can make analyzing AFM images of From our point of view the increase of contents of the fine dis-
doped SnO2 films (see Fig. 6). As we have shown in Ref. [16], the persed phase in doped SnO2 films has great importance for doped
sharpness (image detail) of the grain contours, observed at AFM films’ application in real devices, since the appearance of the fine
images for doped SnO2 films is being worsening due to the pres- dispersed phase can change such metal oxides’ parameters as real
Fig. 6. AFM images of SnO2 :Cu films (a) before and (b) after thermal treatments at 850 ◦ C. SnO2 films were deposited at Tpyr = 350 ◦ C and had thickness equaled d ∼ 250 nm.
762 G. Korotcenkov, S.D. Han / Materials Chemistry and Physics 113 (2009) 756–763
area of intergrain contacts, the active surface area, the surface activ- size after thermal treatment. At that the contents of this phase
ity, gas penetrability of gas sensing matrix, and so on. For example, are being increased in the line SnO2 , SnO2 :Ni, SnO2 :Fe, SnO2 :Co,
the presence of the fine dispersed phase, inclined to coalescence and SnO2 :Cu. It was assumed that the fine dispersed phase, fill-
already at low temperatures could be a reason, responsible for ing inter-crystalline space, besides coalescence with the big grain
observed temporal drift of the sensors parameters [1,15,31–33]. As creates conditions for mass transition from one grain to another
it is known, the instability of the gas sensing material structure is one, necessary for coalescence of bigger crystallites, forming film.
the main reason of instability of the gas sensors parameters [15,32]. After annealing the morphology of doped and undoped SnO2 films
Therefore, indicated peculiarity of doped films should be taken into becomes similar. The grains lose clearly defined faceting.
account while analyzing the doping influence on electro-physical Such unexpected influence of additives on the SnO2 films struc-
properties of deposited films. In particularly, for avoidance of pos- ture, i.e. the decrease of the grain size in as-deposited SnO2 films in
sible temporal instability it is desirable to age as-deposited doped comparison with undoped films and the increase of the grain size
films through their additional thermal treatment. after annealing, forces researchers to be careful while elaborating
It is necessary to note that this statement receives good exper- the technologies of gas sensing layers’ forming on the base of doped
imental confirmation. Numerous researches have shown that the and multi-component materials. For example, the presence of the
decrease of the grain size is inevitably accompanied by the degrada- fine dispersed phase could be a reason of instability of the metal
tion of thermal stability of the film structure even for metal oxides, oxide films’ structure and generate temporal drift of the parameters
having maximum thermodynamic stability among well-known of gas sensors, manufactured on their base.
materials [21,34,35]. It was shown that the fine dispersed phase Therefore, while choosing additives for either the gas sensor
with the grain size smaller than 1–3 nm was inclined to coalescence optimization or for the film structure stabilization one should take
with bigger crystallites already at low temperatures, which did not into account that after changing of the conditions of synthesis,
exceeded 300–400 ◦ C, promoting their growth [21,26,36,37]. exploitation, or parameters of post-deposition thermal treatments,
Structural disorder and the growth of concentration of the point the consequences of the doping could be substantially different
defects in doped SnO2 films is another important factor, stimulating from the ones, observed during our initial experiments with as-
structure’s instability of doped films during the process of anneal- deposited films.
ing. As we have established earlier in Ref. [17], basing on the analysis
of cathodoluminescence and optical transmission, the doping of Acknowledgements
the SnO2 films is accompanied by structure disordering, appearing
through the growth of the concentration of centers of non-radiating This work was supported by the Supreme Council of Science
recombination and the appearance of the tails of electronic states and Advanced Technology of the Republic of Moldova, as well as by
inside the band gap. At that maximal effect from the doping was the Korean Brain Pool Program. The authors are thankful to Prof.
observed exactly for the films, doped by Cu, for which the maxi- J. Schawnk from University of Michigan, USA, and Dr. V. Brinzari
mum instability of the film’s structural parameters was found. The from Technical University of Moldova for their help in structural
authors of Refs. [13,38] have also indicated an essential growth of characterization of studied samples.
structural defects in doped SnO2 films. For example in Ref. [13] the
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