High Voltage 8-CH LED Driver: Features General Description
High Voltage 8-CH LED Driver: Features General Description
High Voltage 8-CH LED Driver: Features General Description
Marking Information
SS
ACTL
VC
NC
NC
RISET
...
...
15
PWM Signal LED7
7 VC 16
LED8
R1 17 R2
C8 1.8k CREG OVP 6 VOUT
9 SS
C3 RISET 10 R3
C2 4.7µF C4
3.9nF RISET
0.1µF
4.75k
Note :
Due to the limitation of maximum duty, 5V input can support typically to VOUT = 33V.
OSC
VCC - LED1
S
4.2V + +
R
-
OVP + R
1.2V -
EN -
-
+
LED2
1.6V +
Shutdown +
- .
5V
CREG
LDO .
.
VOUT
VC Regulation LED7
Unit +
-
5V
5µA
SS
LED8
+
ACTL +
-
GND -
RISET
Electrical Characteristics
(VCC = 17V, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Supply Current IVCC VC ≤ 0.2V (Switching off) -- 3 5 mA
VIN Under Voltage Lockout VIN Rising -- 4.2 4.5
VUVLO V
Threshold Hysteresis -- 0.3 --
Shutdown Current ISHDN VEN = 0V -- -- 10 μA
EN Threshold Logic-High VEN_H 1.6 -- 5
V
Voltage Logic-Low VEN_L -- -- 0.65
ACTL Threshold Logic-High VACTL_H 1.3 -- 5
V
Voltage Logic-Low VACTL_L -- -- 0.65
EN Pin Input Current IEN VEN ≤ 5V -- -- 0.1 μA
LED Current Programming
LED Current ILED 2V > VLED > 0.6V, RISET = 4.75kΩ 19 20 21 mA
2V > VLED > 0.6V, RISET = 4.75kΩ
LEDs Current Matching Calculating -- -- 1.5 %
(I (MAX) − I(MIN)) / IAverage x 100%
RISET Pin Voltage VRISET 3.6kΩ ≤ RISET ≤ 9.6kΩ, VACTL > 1.2V 1.17 1.2 1.23 V
Input Current of ACTL IACTL VACTL = 1.3V -- 1 2 μA
VLED Threshold Un-connection -- 0.1 -- V
To be continued
www.richtek.com DS8561C-00 April 2011
4
RT8561C
Parameter Symbol Test Conditions Min Typ Max Unit
PWM Boost Converter
Switching Frequency 0.8 1 1.2 MHz
Minimum On Time -- 100 -- ns
Regulated VLED Highest Voltage LED String 0.5 0.6 0.7 V
Amplifier (gm) Output Current 2.4V > VC > 0.2V -- ±15 -- μA
VC Threshold PWM Switch Off 0.1 0.2 -- V
LX RDS(ON) -- 0.3 0.5 Ω
LX Current Limit I LIM 2.5 -- -- A
OVP & Soft Start
OVP Threshold VOVP 1.1 1.2 1.3 V
OVP Input Current I OVP VOVP ≤ 3V -- -- 50 nA
Soft Start Current I SS VSS ≤ 2.5V 3 5 8 μA
Thermal Shutdown
TSD -- 150 -- °C
Temperature
Thermal Shutdown Hysteresis -- 20 -- °C
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard. The case point of θJC is on the expose pad for the WQFN package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
60 20.4
50 20.0 LED1
LED2
40 19.6 LED3
LED4
30 19.2
LED5
20 18.8 LED6
LED7
10 18.4
LED8
0 18.0
4 6 8 10 12 14 16 18 20 22 24 4 6 8 10 12 14 16 18 20 22 24
Input Voltage (V) Input Voltage (V)
23 1.22
22
LED Current (mA)
1.20
21
VRISET (V)
1.18
20
1.16
19
1.14
18
17 1.12
VIN = 12V VIN = 12V
16 1.10
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)
VRISET vs. Input Voltage LED Current vs. PWM Duty Cycle
1.25 25
1.24
1.23 20
LED Current (mA)
1.22
15
VRISET (V)
1.21
1.20
PWM = 200Hz
1.19 10 PWM = 1kHz
PWM = 10kHz
1.18 PWM = 30kHz
1.17 5
1.16
VPWM = 0V to 3V, VIN = 12V
1.15 0
4 6 8 10 12 14 16 18 20 22 24 0
0 10
0.1 20
0.2 30 0.4
0.3 40 0.5
50 0.6
60 0.7
70 0.8
80 0.9
90 100
1
Input Voltage (V) Duty Cycle (%)
5
Shutdown Current (μA)1
4
6
3
4
2
2
1
3.6 7.2
3.4 6.8
SS Current (μA)
3.2 6.4
3.0 6.0
2.8 5.6
2.6 5.2
2.4 4.8
2.2 4.4
VCOMP = 0V VIN = 12V, CSS = 0.1μF
2.0 4.0
4 6 8 10 12 14 16 18 20 22 24 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)
1.24
SS Current (μA)
5.6 1.22
1.20
5.4 1.18
1.16
5.2 1.14
1.12
CSS = 0.1μF VIN = 12V
5.0 1.10
4 6 8 10 12 14 16 18 20 22 24 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)
1.2 12V
1.0
10V
OVP Voltage (V)
0.8 IOUT
(100mA/Div)
0.6
0.4
0.2 VIN
VIN = 10.8V to 13.2V
0.0
4 6 8 10 12 14 16 18 20 22 24 Time (50ms/Div)
Input Voltage (V)
Power On from EN
EN
(2V/Div)
VOUT
(20V/Div)
LX
(20V/Div)
I IN
(100mADiv)
VIN = 12V
Time (10ms/Div)
Soft-Start Table 1.
The RT8561C employs a soft-start feature to limit the inrush Dimming Frequency (Hz) Duty (Min.) Duty (Max.)
current. The soft-start circuit prevents excessive inrush 100 < fPWM ≤ 200 0.16% 100%
200 < fPWM ≤ 500 0.40% 100%
current and input voltage droop. The soft-start time is
500 < fPWM ≤ 1k 0.80% 100%
determined by the capacitor, C4, which is connected to 1k < fPWM ≤ 2k 1.60% 100%
the SS pin with 5μA constant current. The value of capacitor 2k < fPWM ≤ 5k 4.00% 100%
C4 is user defined to satisfy the designer's requirement. 5k < fPWM ≤ 10k 8.00% 100%
10k < f PWM ≤ 20k 16.00% 100%
LED Connection
Note : The minimum duty in Table 1 is based on the application
The RT8561C provides an 8-CH LED driver with each circuit and does not consider the deviation of current linearity.
channel capable of supporting up to 10 LEDs. The 8 LED
strings are connected from VOUT to pins 1, 2, 3, 4, 5, 14, LED Current vs. PWM Duty Cycle
25
15, and 16 respectively. If one of the LED channels is not
in use, the LED pin should be tied to ground directly.
20
LED Current (mA)
The inductor must be selected with a saturation current For recommended operating condition specifications of
rating greater than the peak current provided by the RT8561C, the maximum junction temperature is 125°C
following equation : and TA is the ambient temperature. The junction to ambient
thermal resistance, θJA, is layout dependent. For WQFN-
IPEAK = VOUT × IOUT + VIN × T ⎛⎜ VOUT − VIN ⎞⎟ 24L 4x4 packages, the thermal resistance, θJA, is 52°C/
η × VIN 2 × L ⎝ VOUT ⎠ W on a standard JEDEC 51-7 four-layer thermal test board.
The maximum power dissipaton at TA = 25°C can be
calculated by the following formula :
GND
GND
GND
GND
GND
LX
LX
curve in Figure 9 allows the designer to see the effect of
R4
rising ambient temperature on the maximum power 24 23 22 21 20 19
C6
dissipation. LED1 1 18 VCC
Locate the C6 as
LED2 2 17 CREG close to VCC pin as
2.40
Four-Layer PCB LED3 3 16 LED8 possible.
Maximum Power Dissipation (W)1
GND
LED4 4 15 LED7
2.00
LED5 5 14 LED6
OVP 6 25 13 EN
1.60
7 8 9 10 11 12
1.20
SS
VC
NC
RISET
NC
ACTL
0.80 C8 R1 Locate the compensation
components to VC pin as
0.40 C2 close as possible.
0.00 GND
0 25 50 75 100 125
Figure 10. PCB Layout Guide
Ambient Temperature (°C)
Layout Guideline
PCB layout is very important for designing power switching
converter circuits. Some recommended layout guides that
should be strictly be followed are shown as follows :
` The power components L1, D1, CVIN1, COUT1 and COUT2
must be placed as close as possible to reduce the ac
current loop. The PCB trace between power components
must be short and wide as possible due to large current
flow these trace during operation.
` Place L1 and D1 connected to LX pin as close as possible.
The trace should be short and wide as possible.
` Recommend place CVIN2 close to VCC pin.
` Pin7 is the compensation point to adjust system
stability. Place the compensation components to pin7
as close as possible, no matter the compensation is
RC or capacitance.
D2 SEE DETAIL A
D
L
1
E E2
1 1
2 2
e b
DETAIL A
A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.