Attiny26 Complete
Attiny26 Complete
Rev. 1477G–AVR–03/05
Pin Configuration
PDIP/SOIC
PB0 (MOSI/DI/SDA/OC1A)
PB1 (MISO/DO/OC1A)
PB2 (SCK/SCL/OC1B)
PA0 (ADC0)
PA1 (ADC1)
NC
NC
NC
32
31
30
29
28
27
26
NC 1 25 24 NC
(OC1B) PB3 2 23 PA2 (ADC2)
NC 3 22 PA3 (AREF)
VCC 4 21 GND
GND 5 20 NC
NC 6 19 NC
(ADC7/XTAL1) PB4 7 18 AVCC
(ADC8/XTAL2) PB5 8 17 PA4 (ADC3)
10
11
12
13
14
15
16
9 NC
(ADC9/INT0/T0) PB6
(ADC10/RESET) PB7
NC
(ADC6/AIN1) PA7
(ADC5/AIN0) PA6
(ADC4) PA5
NC
Note: Note: The bottom pad under the QFN/MLF package should be soldered to ground.
2 ATtiny26(L)
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ATtiny26(L)
Description The ATtiny26(L) is a low-power CMOS 8-bit microcontroller based on the AVR
enhanced RISC architecture. By executing powerful instructions in a single clock cycle,
the ATtiny26(L) achieves throughputs approaching 1 MIPS per MHz allowing the system
designer to optimize power consumption versus processing speed.
The AVR core combines a rich instruction set with 32 general purpose working registers.
All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing
two independent registers to be accessed in one single instruction executed in one clock
cycle. The resulting architecture is more code efficient while achieving throughputs up to
ten times faster than conventional CISC microcontrollers. The ATtiny26(L) has a high
precision ADC with up to 11 single ended channels and 8 differential channels. Seven
differential channels have an optional gain of 20x. Four out of the seven differential
channels, which have the optional gain, can be used at the same time. The ATtiny26(L)
also has a high frequency 8-bit PWM module with two independent outputs. Two of the
PWM outputs have inverted non-overlapping output pins ideal for synchronous rectifica-
tion. The Universal Serial Interface of the ATtiny26(L) allows efficient software
implementation of TWI (Two-wire Serial Interface) or SM-bus interface. These features
allow for highly integrated battery charger and lighting ballast applications, low-end ther-
mostats, and firedetectors, among other applications.
The ATtiny26(L) provides 2K bytes of Flash, 128 bytes EEPROM, 128 bytes SRAM, up
to 16 general purpose I/O lines, 32 general purpose working registers, two 8-bit
Timer/Counters, one with PWM outputs, internal and external Oscillators, internal and
external interrupts, programmable Watchdog Timer, 11-channel, 10-bit Analog to Digital
Converter with two differential voltage input gain stages, and four software selectable
power saving modes. The Idle mode stops the CPU while allowing the Timer/Counters
and interrupt system to continue functioning. The ATtiny26(L) also has a dedicated ADC
Noise Reduction mode for reducing the noise in ADC conversion. In this sleep mode,
only the ADC is functioning. The Power-down mode saves the register contents but
freezes the oscillators, disabling all other chip functions until the next interrupt or hard-
ware reset. The Standby mode is the same as the Power-down mode, but external
oscillators are enabled. The wakeup or interrupt on pin change features enable the
ATtiny26(L) to be highly responsive to external events, still featuring the lowest power
consumption while in the Power-down mode.
The device is manufactured using Atmel’s high density non-volatile memory technology.
By combining an enhanced RISC 8-bit CPU with Flash on a monolithic chip, the
ATtiny26(L) is a powerful microcontroller that provides a highly flexible and cost effec-
tive solution to many embedded control applications.
The ATtiny26(L) AVR is supported with a full suite of program and system development
tools including: Macro assemblers, program debugger/simulators, In-circuit emulators,
and evaluation kits.
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Block Diagram Figure 1. The ATtiny26(L) Block Diagram
VCC
MCU CONTROL
PROGRAM
FLASH
SRAM REGISTER
AVCC
MCU STATUS
INSTRUCTION GENERAL REGISTER
REGISTER PURPOSE
REGISTERS
TIMER/
X COUNTER0
INSTRUCTION Y
DECODER Z
TIMER/
COUNTER1
CONTROL
LINES ALU
UNIVERSAL
SERIAL
INTERFACE
STATUS
REGISTER
INTERRUPT
UNIT
PROGRAMMING
LOGIC ISP INTERFACE EEPROM OSCILLATORS
COMPARATOR
ANALOG
PA0-PA7 PB0-PB7
4 ATtiny26(L)
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ATtiny26(L)
Pin Descriptions
AVCC AVCC is the supply voltage pin for Port A and the A/D Converter (ADC). It should be
externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be
connected to VCC through a low-pass filter. See page 94 for details on operating of the
ADC.
Port A (PA7..PA0) Port A is an 8-bit general purpose I/O port. PA7..PA0 are all I/O pins that can provide
internal pull-ups (selected for each bit). Port A has alternate functions as analog inputs
for the ADC and analog comparator and pin change interrupt as described in “Alternate
Port Functions” on page 46.
Port B (PB7..PB0) Port B is an 8-bit general purpose I/O port. PB6..0 are all I/O pins that can provide inter-
nal pull-ups (selected for each bit). PB7 is an I/O pin if not used as the reset. To use pin
PB7 as an I/O pin, instead of RESET pin, program (“0”) RSTDISBL Fuse. Port B has
alternate functions for the ADC, clocking, timer counters, USI, SPI programming, and
pin change interrupt as described in “Alternate Port Functions” on page 46.
An External Reset is generated by a low level on the PB7/RESET pin. Reset pulses
longer than 50 ns will generate a reset, even if the clock is not running. Shorter pulses
are not guaranteed to generate a reset.
XTAL1 Input to the inverting oscillator amplifier and input to the internal clock operating circuit.
About Code This datasheet contains simple code examples that briefly show how to use various
parts of the device. These code examples assume that the part specific header file is
Examples included before compilation. Be aware that not all C compiler vendors include bit defini-
tions in the header files and interrupt handling in C is compiler dependent. Please
confirm with the C compiler documentation for more details.
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AVR CPU Core
Architectural Overview The fast-access Register File concept contains 32 x 8-bit general purpose working reg-
isters with a single clock cycle access time. This means that during one single clock
cycle, one ALU (Arithmetic Logic Unit) operation is executed. Two operands are output
from the Register File, the operation is executed, and the result is stored back in the
Register File – in one clock cycle.
Six of the 32 registers can be used as 16-bit pointers for indirect memory access. These
pointers are called the X-, Y-, and Z-pointers, and they can address the Register File
and the Flash program memory.
32 x 8 Universal
Instruction General Serial Interface
Register Purpose
Registers
ISP Unit
Instruction
Indirect Addressing
Direct Addressing
Decoder
2 x 8-bit
Timer/Counter
ALU
Control Lines Watchdog
Timer
128 x 8
ADC
SRAM
I/O Lines
The ALU supports arithmetic and logic functions between registers or between a con-
stant and a register. Single register operations are also executed in the ALU. Figure 2
shows the ATtiny26(L) AVR Enhanced RISC microcontroller architecture. In addition to
the register operation, the conventional memory addressing modes can be used on the
Register File as well. This is enabled by the fact that the Register File is assigned the 32
lowermost Data Space addresses ($00 - $1F), allowing them to be accessed as though
they were ordinary memory locations.
The I/O memory space contains 64 addresses for CPU peripheral functions as Control
Registers, Timer/Counters, A/D Converters, and other I/O functions. The I/O Memory
can be accessed directly, or as the Data Space locations following those of the Register
File, $20 - $5F.
6 ATtiny26(L)
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ATtiny26(L)
The AVR uses a Harvard architecture concept with separate memories and buses for
program and data memories. The program memory is accessed with a two stage
pipelining. While one instruction is being executed, the next instruction is pre-fetched
from the program memory. This concept enables instructions to be executed in every
clock cycle. The program memory is In-System programmable Flash memory.
With the relative jump and relative call instructions, the whole address space is directly
accessed. All AVR instructions have a single 16-bit word format, meaning that every
program memory address contains a single 16-bit instruction.
During interrupts and subroutine calls, the return address program counter (PC) is
stored on the Stack. The Stack is effectively allocated in the general data SRAM, and
consequently the stack size is only limited by the total SRAM size and the usage of the
SRAM. All user programs must initialize the SP in the reset routine (before subroutines
or interrupts are executed). The 8-bit Stack Pointer SP is read/write accessible in the I/O
space. For programs written in C, the stack size must be declared in the linker file. Refer
to the C user guide for more information.
The 128 bytes data SRAM can be easily accessed through the five different addressing
modes supported in the AVR architecture.
The memory spaces in the AVR architecture are all linear and regular memory maps.
The I/O memory space contains 64 addresses for CPU peripheral functions as Control
Registers, Timer/Counters, and other I/O functions. The memory spaces in the AVR
architecture are all linear and regular memory maps.
A flexible interrupt module has its control registers in the I/O space with an additional
Global Interrupt Enable bit in the Status Register. All the different interrupts have a sep-
arate Interrupt Vector in the Interrupt Vector table at the beginning of the program
memory. The different interrupts have priority in accordance with their Interrupt Vector
position. The lower the Interrupt Vector address, the higher the priority.
General Purpose Figure 3 shows the structure of the 32 general purpose working registers in the CPU.
Register File
Figure 3. AVR CPU General Purpose Working Registers
7 0 Addr.
R0 $00
R1 $01
R2 $02
…
R13 $0D
General R14 $0E
Purpose R15 $0F
Working R16 $10
Registers R17 $11
…
R26 $1A X-register Low Byte
R27 $1B X-register High Byte
R28 $1C Y-register Low Byte
R29 $1D Y-register High Byte
R30 $1E Z-register Low Byte
R31 $1F Z-register High Byte
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All of the register operating instructions in the instruction set have direct and single cycle
access to all registers. The only exceptions are the five constant arithmetic and logic
instructions SBCI, SUBI, CPI, ANDI, and ORI between a constant and a register, and
the LDI instruction for load immediate constant data. These instructions apply to the
second half of the registers in the Register File – R16..R31. The general SBC, SUB, CP,
AND, and OR, and all other operations between two registers or on a single register
apply to the entire Register File.
As shown in Figure 3, each register is also assigned a data memory address, mapping
them directly into the first 32 locations of the user Data Space. Although not being phys-
ically implemented as SRAM locations, this memory organization provides flexibility in
access of the registers, as the X-, Y-, and Z-registers can be set to index any register in
the file.
X-register, Y-register, and Z- The registers R26..R31 have some added functions to their general purpose usage.
register These registers are address pointers for indirect addressing of the Data Space. The
three indirect address registers X, Y, and Z are defined as:
15 0
X-register 7 0 7 0
R27 ($1B) R26 ($1A)
15 0
Y-register 7 0 7 0
R29 ($1D) R28 ($1C)
15 0
Z-register 7 0 7 0
R31 ($1F) R30 ($1E)
In the different addressing modes, these address registers have functions as fixed dis-
placement, automatic increment and decrement (see the descriptions for the different
instructions).
ALU – Arithmetic Logic The high-performance AVR ALU operates in direct connection with all 32 general pur-
Unit pose working registers. Within a single clock cycle, ALU operations between registers in
the Register File are executed. The ALU operations are divided into three main catego-
ries – Arithmetic, Logical, and Bit-functions.
8 ATtiny26(L)
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ATtiny26(L)
Status Register – SREG The AVR Status Register – SREG – at I/O space location $3F is defined as:
Bit 7 6 5 4 3 2 1 0
$3F ($5F) I T H S V N Z C SREG
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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Stack Pointer – SP The ATtiny26(L) Stack Pointer is implemented as an 8-bit register in the I/O space loca-
tion $3D ($5D). As the ATtiny26(L) data memory has 224 ($E0) locations, eight bits are
used.
Bit 7 6 5 4 3 2 1 0
$3D ($5D) SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 SP
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
The Stack Pointer points to the data SRAM stack area where the Subroutine and Inter-
rupt Stacks are located. This Stack space in the data SRAM must be defined by the
program before any subroutine calls are executed or interrupts are enabled. The Stack
Pointer must be set to point above $60. The Stack Pointer is decremented by one when
data is pushed onto the Stack with the PUSH instruction, and it is decremented by two
when an address is pushed onto the Stack with subroutine calls and interrupts. The
Stack Pointer is incremented by one when data is popped from the Stack with the POP
instruction, and it is incremented by two when an address is popped from the Stack with
return from subroutine RET or return from interrupt RETI.
Program and Data The ATtiny26(L) AVR Enhanced RISC microcontroller supports powerful and efficient
Addressing Modes addressing modes for access to the Flash program memory, SRAM, Register File, and
I/O Data memory. This section describes the different addressing modes supported by
the AVR architecture. In the figures, OP means the operation code part of the instruction
word. To simplify, not all figures show the exact location of the addressing bits.
10 ATtiny26(L)
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ATtiny26(L)
Register Direct, Two Registers Figure 6. Direct Register Addressing, Two Registers
Rd and Rr
Operands are contained in register r (Rr) and d (Rd). The result is stored in register d
(Rd).
$00DF
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A 16-bit Data Address is contained in the 16 LSBs of a two-word instruction. Rd/Rr
specify the destination or source register.
15 10 6 5 0
OP n a
$00DF
Operand address is the result of the Y- or Z-register contents added to the address con-
tained in 6 bits of the instruction word.
$00DF
Data Indirect with Pre- Figure 11. Data Indirect Addressing with Pre-decrement
decrement Data Space
$0000
15 0
X-, Y-, OR Z-REGISTER
-1
$00DF
12 ATtiny26(L)
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ATtiny26(L)
The X-, Y-, or Z-register is decremented before the operation. Operand address is the
decremented contents of the X-, Y-, or Z-register.
Data Indirect with Post- Figure 12. Data Indirect Addressing with Post-increment
increment Data Space
$0000
15 0
X-, Y-, OR Z-REGISTER
$00DF
The X-, Y-, or Z-register is incremented after the operation. Operand address is the con-
tent of the X-, Y-, or Z-register prior to incrementing.
$3FF
Constant byte address is specified by the Z-register contents. The 15 MSBs select word
address (0 - 1K), the LSB selects low byte if cleared (LSB = 0) or high byte if set
(LSB = 1).
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Indirect Program Addressing, Figure 14. Indirect Program Memory Addressing
IJMP and ICALL PROGRAM MEMORY
$000
$3FF
+1
$3FF
14 ATtiny26(L)
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ATtiny26(L)
Memories The AVR CPU is driven by the System Clock Ø, directly generated from the external
clock crystal for the chip. No internal clock division is used.
Figure 16 shows the parallel instruction fetches and instruction executions enabled by
the Harvard architecture and the fast-access Register File concept. This is the basic
pipelining concept to obtain up to 1 MIPS per MHz with the corresponding unique results
for functions per cost, functions per clocks, and functions per power-unit.
System Clock Ø
Figure 17 shows the internal timing concept for the Register File. In a single clock cycle
an ALU operation using two register operands is executed, and the result is stored back
to the destination register.
System Clock Ø
The internal data SRAM access is performed in two System Clock cycles as described
in Figure 18.
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Figure 18. On-chip Data SRAM Access Cycles
T1 T2 T3 T4
System Clock Ø
Data
Write
WR
Data
Read
RD
In-System Programmable The ATtiny26(L) contains 2K bytes On-chip In-System Programmable Flash memory for
Flash Program Memory program storage. Since all instructions are 16- or 32-bit words, the Flash is organized as
1K x 16. The Flash memory has an endurance of at least 10,000 write/erase cycles. The
ATtiny26(L) Program Counter – PC – is 10 bits wide, thus addressing the 1024 program
memory addresses, see “Memory Programming” on page 107 for a detailed description
on Flash data downloading. See “Program and Data Addressing Modes” on page 10 for
the different program memory addressing modes.
R29 $001D
R30 $001E
R31 $001F
I/O Registers
$00 $0020
$01 $0021
$02 $0022
… …
$3D $005D
$3E $005E
$3F $005F
Internal SRAM
$0060
$0061
...
$00DE
$00DF
SRAM Data Memory Figure 19 above shows how the ATtiny26(L) SRAM Memory is organized.
The lower 224 Data Memory locations address the Register File, the I/O Memory and
the internal data SRAM. The first 96 locations address the Register File and I/O Mem-
ory, and the next 128 locations address the internal data SRAM.
16 ATtiny26(L)
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ATtiny26(L)
The five different addressing modes for the data memory cover: Direct, Indirect with Dis-
placement, Indirect, Indirect with Pre-decrement, and Indirect with Post-increment. In
the Register File, registers R26 to R31 feature the indirect addressing pointer registers.
The direct addressing reaches the entire data space. The Indirect with Displacement
mode features a 63 address locations reach from the base address given by the Y- or Z-
register.
When using register indirect addressing modes with automatic pre-decrement and post-
increment, the address registers X, Y, and Z are decremented and incremented.
The 32 general purpose working registers, 64 I/O Registers and the 128 bytes of inter-
nal data SRAM in the ATtiny26(L) are all accessible through all these addressing
modes.
See “Program and Data Addressing Modes” on page 10 for a detailed description of the
different addressing modes.
EEPROM Data Memory The ATtiny26(L) contains 128 bytes of data EEPROM memory. It is organized as a sep-
arate data space, in which single bytes can be read and written (see “Memory
Programming” on page 107). The EEPROM has an endurance of at least 100,000
write/erase cycles per location.
EEPROM Read/Write Access The EEPROM Access Registers are accessible in the I/O space.
The write access time is typically 8.3 ms. A self-timing function lets the user software
detect when the next byte can be written. A special EEPROM Ready Interrupt can be
set to trigger when the EEPROM is ready to accept new data.
An ongoing EEPROM write operation will complete even if a reset condition occurs.
In order to prevent unintentional EEPROM writes, a two state write procedure must be
followed. Refer to the description of the EEPROM Control Register for details on this.
When the EEPROM is written, the CPU is halted for two clock cycles before the next
instruction is executed.
When the EEPROM is read, the CPU is halted for four clock cycles before the next
instruction is executed.
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EEPROM Data Register –
Bit 7 6 5 4 3 2 1 0
EEDR
$1D ($3D) MSB LSB EEDR
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
18 ATtiny26(L)
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ATtiny26(L)
EEPROM Write During Power- When entering Power-down sleep mode while an EEPROM write operation is active, the
down Sleep Mode EEPROM write operation will continue, and will complete before the write access time
has passed. However, when the write operation is completed, the crystal Oscillator con-
tinues running, and as a consequence, the device does not enter Power-down entirely.
It is therefore recommended to verify that the EEPROM write operation is completed
before entering Power-down.
Preventing EEPROM During periods of low VCC, the EEPROM data can be corrupted because the supply volt-
Corruption age is too low for the CPU and the EEPROM to operate properly. These issues are the
same as for board level systems using the EEPROM, and the same design solutions
should be applied.
An EEPROM data corruption can be caused by two situations when the voltage is too
low. First, a regular write sequence to the EEPROM requires a minimum voltage to
operate correctly. Secondly, the CPU itself can execute instructions incorrectly, if the
supply voltage for executing instructions is too low.
EEPROM data corruption can easily be avoided by following these design recommen-
dations (one is sufficient):
1. Keep the AVR RESET active (low) during periods of insufficient power supply
voltage. This can be done by enabling the internal Brown-out Detector (BOD) if
the operating voltage matches the detection level. If not, an external Brown-out
Reset Protection circuit can be applied.
2. Keep the AVR core in Power-down Sleep mode during periods of low VCC. This
will prevent the CPU from attempting to decode and execute instructions, effec-
tively protecting the EEPROM Registers from unintentional writes.
Store constants in Flash memory if the ability to change memory contents from software
is not required. Flash memory can not be updated by the CPU, and will not be subject to
corruption.
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I/O Memory The I/O space definition of the ATtiny26(L) is shown in Table 2
20 ATtiny26(L)
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ATtiny26(L)
21
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System Clock and
Clock Options
Clock Systems and their Figure 20 presents the principal clock systems in the AVR and their distribution. All of
Distribution the clocks need not be active at a given time. In order to reduce power consumption, the
clocks to modules not being used can be halted by using different sleep modes, as
described in “Power Management and Sleep Modes” on page 36. The clock systems
are detailed below.
clkADC
clkFLASH
Clock Watchdog
Multiplexer Oscillator
clkPCK clkPLL
CPU Clock – clkCPU The CPU clock is routed to parts of the system concerned with operation of the AVR
core. Examples of such modules are the General Purpose Register File, the Status Reg-
ister and the data memory holding the Stack Pointer. Halting the CPU clock inhibits the
core from performing general operations and calculations.
I/O Clock – clkI/O The I/O clock is used by the majority of the I/O modules, like Timer/Counters, and USI.
The I/O clock is also used by the External Interrupt module, but note that some external
interrupts are detected by asynchronous logic, allowing such interrupts to be detected
even if the I/O clock is halted.
Flash Clock – clkFLASH The Flash clock controls operation of the Flash interface. The Flash clock is usually
active simultaneously with the CPU clock.
ADC Clock – clkADC The ADC is provided with a dedicated clock domain. This allows halting the CPU and
I/O clocks in order to reduce noise generated by digital circuitry. This gives more accu-
rate ADC conversion results.
22 ATtiny26(L)
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ATtiny26(L)
Internal PLL for Fast The internal PLL in ATtiny26(L) generates a clock frequency that is 64x multiplied from
Peripheral Clock Generation – nominally 1 MHz input. The source of the 1 MHz PLL input clock is the output of the
clkPCK internal RC Oscillator which is automatically divided down to 1 MHz, if needed. See the
Figure 21 on page 23. When the PLL reference frequency is the nominal 1 MHz, the fast
peripheral clock is 64 MHz. The fast peripheral clock, or a clock prescaled from that, can
be selected as the clock source for Timer/Counter1.
The PLL is locked on the RC Oscillator and adjusting the RC Oscillator via OSCCAL
Register will adjust the fast peripheral clock at the same time. However, even if the pos-
sibly divided RC Oscillator is taken to a higher frequency than 1 MHz, the fast peripheral
clock frequency saturates at 70 MHz (worst case) and remains oscillating at the maxi-
mum frequency. It should be noted that the PLL in this case is not locked any more with
the RC Oscillator clock.
Therefore it is recommended not to take the OSCCAL adjustments to a higher fre-
quency than 1 MHz in order to keep the PLL in the correct operating range. The internal
PLL is enabled only when the PLLE bit in the register PLLCSR is set or the PLLCK Fuse
is programmed (“0”). The bit PLOCK from the register PLLCSR is set when PLL is
locked.
Both internal 1 MHz RC Oscillator and PLL are switched off in Power-down and Standby
sleep modes.
PLLCK &
CKSEL
FUSES
OSCCAL
Lock PLOCK
Detector
1
DIVIDE PLL PCK
RC OSCILLATOR 2
4 TO 1 MHz 64x
8 MHz
DIVIDE
BY 4
CK
XTAL1
OSCILLATORS
XTAL2
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Clock Sources The device has the following clock source options, selectable by Flash Fuse bits as
shown below on Table 3. The clock from the selected source is input to the AVR clock
generator, and routed to the appropriate modules.The use of pins PB5 (XTAL2), and
PB4 (XTAL1) as I/O pins is limited depending on clock settings, as shown below in
Table 4.
Note: 1. For all fuses “1” means unprogrammed while “0” means programmed.
The various choices for each clocking option is given in the following sections. When the
CPU wakes up from Power-down, the selected clock source is used to time the start-up,
ensuring stable oscillator operation before instruction execution starts. When the CPU
starts from Reset, there is as an additional delay allowing the power to reach a stable
level before commencing normal operation. The Watchdog Oscillator is used for timing
this real-time part of the start-up time. The number of WDT Oscillator cycles used for
24 ATtiny26(L)
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ATtiny26(L)
each time-out is shown in Table 5. The frequency of the Watchdog Oscillator is voltage
dependent as shown in the Electrical Characteristics section.
Default Clock Source The deviced is shipped with CKSEL = “0001”, SUT = “10”, and PLLCK unprogrammed.
The default clock source setting is therefore the internal RC Oscillator with longest star-
tup time. This default setting ensures that all users can make their desired clock source
setting using an In-System or Parallel Programmer.
Crystal Oscillator XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can
be configured for use as an On-chip Oscillator, as shown in Figure 22. Either a quartz
crystal or a ceramic resonator may be used. The maximum frequency for resonators is
12 MHz. The CKOPT Fuse should always be unprogrammed when using this clock
option. C1 and C2 should always be equal. The optimal value of the capacitors depends
on the crystal or resonator in use, the amount of stray capacitance, and the electromag-
netic noise of the environment. Some initial guidelines for choosing capacitors for use
with crystals are given in Table 6. For ceramic resonators, the capacitor values given by
the manufacturer should be used.
C2
XTAL2
C1
XTAL1
GND
The Oscillator can operate in three different modes, each optimized for a specific fre-
quency range. The operating mode is selected by the fuses CKSEL3..1 as shown in
Table 6.
Note: 1. This option should not be used with crystals, only with ceramic resonators.
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The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown
in Table 7.
Notes: 1. These options should only be used when not operating close to the maximum fre-
quency of the device, and only if frequency stability at start-up is not important for the
application.
2. These options are intended for use with ceramic resonators and will ensure fre-
quency stability at start-up. They can also be used with crystals when not operating
close to the maximum frequency of the device, and if frequency stability at start-up is
not important for the application.
Low-frequency Crystal To use a 32.768 kHz watch crystal as the clock source for the device, the Low-fre-
Oscillator quency Crystal Oscillator must be selected by setting the PLLCK to “1” and CKSEL
Fuses to “1001”. The crystal should be connected as shown in Figure 22. By program-
ming the CKOPT Fuse, the user can enable internal capacitors on XTAL1 and XTAL2,
thereby removing the need for external capacitors. The internal capacitors have a nomi-
nal value of 36 pF.
When this oscillator is selected, start-up times are determined by the SUT Fuses as
shown in Table 8.
Table 8. Start-up Times for the Low-frequency Crystal Oscillator Clock Selection
Start-up Time Additional Delay from
SUT1..0 from Power-down Reset (VCC = 5.0V) Recommended Usage
(1)
00 1K CK 4.1 ms Fast rising power or BOD enabled
(1)
01 1K CK 65 ms Slowly rising power
10 32K CK 65 ms Stable frequency at start-up
11 Reserved
Note: 1. These options should only be used if frequency stability at start-up is not important
for the application.
26 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
External RC Oscillator For timing insensitive applications, the external RC configuration shown in Figure 23
can be used. The frequency is roughly estimated by the equation f = 1/(3RC). C should
be at least 22 pF. By programming the CKOPT Fuse, the user can enable an internal
36 pF capacitor between XTAL1 and GND, thereby removing the need for an external
capacitor.
VCC
PB5 (XTAL2)
R
XTAL1
C
GND
The oscillator can operate in four different modes, each optimized for a specific fre-
quency range. The operating mode is selected by the fuses CKSEL3..0 as shown in
Table 9.
When this oscillator is selected, start-up times are determined by the SUT Fuses as
shown in Table 10.
Table 10. Start-up Times for the External RC Oscillator Clock Selection
Start-up Time Additional Delay from
SUT1..0 from Power-down Reset (VCC = 5.0V) Recommended Usage
00 18 CK – BOD enabled
01 18 CK 4.1 ms Fast rising power
10 18 CK 65 ms Slowly rising power
(1)
11 6 CK 4.1 ms Fast rising power or BOD enabled
Notes: 1. This option should not be used when operating close to the maximum frequency of
the device.
27
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Calibrated Internal RC The calibrated internal RC Oscillator provides a fixed 1.0, 2.0, 4.0, or 8.0 MHz clock. All
Oscillator frequencies are nominal values at 5V and 25°C. This clock may be selected as the sys-
tem clock by programming the CKSEL Fuses as shown in Table 11. If selected, it will
operate with no external components. The CKOPT Fuse should always be unpro-
grammed when using this clock option. During Reset, hardware loads the calibration
byte into the OSCCAL Register and thereby automatically calibrates the RC Oscillator.
At 5V, 25°C and 1.0 MHz Oscillator frequency selected, this calibration gives a fre-
quency within ± 3% of the nominal frequency. Using run-time calibration methods as
described in application notes available at www.atmel.com/avr it is possible to achieve ±
1% accuracy at any given VCC and Temperature. When this oscillator is used as the chip
clock, the Watchdog Oscillator will still be used for the Watchdog Timer and for the reset
time-out. For more information on the pre-programmed calibration value, see the section
“Calibration Byte” on page 109.
Table 12. Start-up Times for the Internal Calibrated RC Oscillator Clock Selection
Start-up Time from Additional Delay from
SUT1..0 Power-down Reset (VCC = 5.0V) Recommended Usage
00 6 CK – BOD enabled
01 6 CK 4.1 ms Fast rising power
(1)
10 6 CK 65 ms Slowly rising power
11 Reserved
28 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
will increase the frequency of the internal oscillator. Writing $FF to the register gives the
highest available frequency. The calibrated Oscillator is used to time EEPROM and
Flash access. If EEPROM or Flash is written, do not calibrate to more than 10% above
the nominal frequency. Otherwise, the EEPROM or Flash write may fail. Note that the
oscillator is intended for calibration to 1.0, 2.0, 4.0, or 8.0 MHz. Tuning to other values is
not guaranteed, as indicated in Table 13.
External Clock To drive the device from an external clock source, XTAL1 should be driven as shown in
Figure 24. To run the device on an external clock, the CKSEL Fuses must be pro-
grammed to “0000” and PLLCK to “1”. By programming the CKOPT Fuse, the user can
enable an internal 36 pF capacitor between XTAL1 and GND.
PB5 (XTAL2)
EXTERNAL
XTAL1
CLOCK
SIGNAL
GND
When this clock source is selected, start-up times are determined by the SUT Fuses as
shown in Table 14.
When applying an external clock, it is required to avoid sudden changes in the applied
clock frequency to ensure stable operation of the MCU. A variation in frequency of more
than 2% from one clock cycle to the next can lead to unpredictable behaviour. It is
required to ensure that the MCU is kept in reset during such changes in the clock
frequency.
29
1477G–AVR–03/05
High Frequency PLL There is an internal PLL that provides nominally 64 MHz clock rate locked to the RC
Clock – PLLCLK Oscillator for the use of the Peripheral Timer/Counter1 and for the system clock source.
When selected as a system clock source, by programming (“0”) the fuse PLLCK, it is
divided by four. When this option is used, the CKSEL3..0 must be set to “0001”. This
clocking option can be used only when operating between 4.5 - 5.5V to guaratee safe
operation. The system clock frequency will be 16 MHz (64 MHz/4). When using this
clock option, start-up times are determined by the SUT Fuses as shown in Table 15.
See also “PCK Clocking System” on page 23.
30 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
MCU Status
Register (MCUSR)
PORF
BORF
EXTRF
WDRF
Brown-Out
BODEN
BODLEVEL Reset Circuit
CKSEL[3:0]
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1477G–AVR–03/05
Table 16. Reset Characteristics
Symbol Parameter Condition Min Typ Max Units
Power-on Reset Threshold
1.4 2.3 V
Voltage (rising)
VPOT
Power-on Reset Threshold
1.3 2.3 V
Voltage (falling)(1)
VRST RESET Pin Threshold Voltage 0.2 0.9 VCC
Minimum pulse width on
tRST 1.5 µs
RESET Pin
Brown-out Reset Threshold BODLEVEL = 1 2.4 2.7 2.9
VBOT Voltage(2) V
BODLEVEL = 0 3.7 4.0 4.5
Minimum low voltage period for BODLEVEL = 1 2 µs
tBOD Brown-out Detection
BODLEVEL = 0 2 µs
VHYST Brown-out Detector hysteresis 130 mV
Notes: 1. The Power-on Reset will not work unless the supply voltage has been below VPOT
(falling)
2. VBOT may be below nominal minimum operating voltage for some devices. For
devices where this is the case, the device is tested down to VCC = VBOT during the
production test. This guarantees that a Brown-out Reset will occur before VCC drops
to a voltage where correct operation of the microcontroller is no longer guaranteed.
The test is performed using BODLEVEL=1 for ATtiny26L and BODLEVEL=0 for
ATtiny26. BODLEVEL=1 is not applicable for ATtiny26.
See start-up times from reset from “System Clock and Clock Options” on page 22.
When the CPU wakes up from Power-down, only the clock counting part of the start-up
time is used. The Watchdog Oscillator is used for timing the real-time part of the start-up
time.
Power-on Reset A Power-on Reset (POR) pulse is generated by an On-chip Detection circuit. The detec-
tion level is defined in Table 16 The POR is activated whenever V CC is below the
detection level. The POR circuit can be used to trigger the Start-up Reset, as well as
detect a failure in supply voltage.
The Power-on Reset (POR) circuit ensures that the device is reset from Power-on.
Reaching the Power-on Reset threshold voltage invokes a delay counter, which deter-
mines the delay, for which the device is kept in RESET after V CC rise. The time-out
period of the delay counter can be defined by the user through the CKSEL Fuses. The
different selections for the delay period are presented in “System Clock and Clock
Options” on page 22. The RESET signal is activated again, without any delay, when the
VCC decreases below detection level.
32 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
VRST
RESET
tTOUT
TIME-OUT
INTERNAL
RESET
VRST
RESET
tTOUT
TIME-OUT
INTERNAL
RESET
External Reset An External Reset is generated by a low level on the RESET pin. Reset pulses longer
than 500 ns will generate a reset, even if the clock is not running. Shorter pulses are not
guaranteed to generate a reset. When the applied signal reaches the Reset Threshold
Voltage – VRST – on its positive edge, the delay timer starts the MCU after the Time-out
period tTOUT has expired.
RESET
VRST
t TOUT
TIME-OUT
INTERNAL
RESET
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Brown-out Detection ATtiny26(L) has an On-chip Brown-out Detection (BOD) circuit for monitoring the VCC
level during the operation. The BOD circuit can be enabled/disabled by the fuse
BODEN. When the BOD is enabled (BODEN programmed), and VCC decreases below
the trigger level, the Brown-out Reset is immediately activated. When VCC increases
above the trigger level, the Brown-out Reset is deactivated after a delay. The delay is
defined by the user in the same way as the delay of POR signal, in Table 29. The trigger
level for the BOD can be selected by the fuse BODLEVEL to be 2.7V (BODLEVEL
unprogrammed), or 4.0V (BODLEVEL programmed). The trigger level has a hysteresis
of 50 mV to ensure spike free Brown-out Detection.
The BOD circuit will only detect a drop in VCC if the voltage stays below the trigger level
for longer than tBOD given in Table 16.
VCC VBOT+
VBOT-
RESET
TIME-OUT tTOUT
INTERNAL
RESET
Watchdog Reset When the Watchdog times out, it will generate a short reset pulse of one CK cycle dura-
tion. On the falling edge of this pulse, the delay timer starts counting the Time-out period
tTOUT. Refer to page 78 for details on operation of the Watchdog.
1 CK Cycle
34 ATtiny26(L)
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ATtiny26(L)
35
1477G–AVR–03/05
Power Management Sleep modes enable the application to shut down unused modules in the MCU, thereby
saving power. The AVR provides various sleep modes allowing the user to tailor the
and Sleep Modes power consumption to the application’s requirements.
To enter any of the four sleep modes, the SE bit in MCUCR must be written to logic one
and a SLEEP instruction must be executed. The SM1, and SM0 bits in the MCUCR
Register select which sleep mode (Idle, ADC Noise Reduction, Power Down, or Stand-
by) will be activated by the SLEEP instruction. See Table 17 for a summary. If an
enabled interrupt occurs while the MCU is in a sleep mode, the MCU wakes up. The
MCU is then halted for four cycles in addition to the start-up time, it executes the inter-
rupt routine, and resumes execution from the instruction following SLEEP. The contents
of the Register File and SRAM are unaltered when the device wakes up from sleep. If a
Reset occurs during sleep mode, the MCU wakes up and executes from the Reset
Vector.
Table 19 on page 38 presents the different clock systems in the ATtiny26, and their dis-
tribution. The figure is helpful in selecting an appropriate sleep mode.
MCU Control Register – The MCU Control Register contains control bits for general MCU functions.
MCUCR Bit 7 6 5 4 3 2 1 0
$35 ($55) – PUD SE SM1 SM0 – ISC01 ISC00 MCUCR
Read/Write R R/W R/W R/W R/W R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
36 ATtiny26(L)
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ATtiny26(L)
Note: 1. When changing the ISC10/ISC00 bits, INT0 must be disabled by clearing its Interrupt
Enable bit in the GIMSK Register. Otherwise an interrupt can occur when the bits are
changed.
Idle Mode When the SM1..0 bits are written to “00”, the SLEEP instruction makes the MCU enter
Idle mode, stopping the CPU but allowing Analog Comparator, ADC, USI,
Timer/Counters, Watchdog, and the interrupt system to continue operating. This sleep
mode basically halts clkCPU and clkFLASH, while allowing the other clocks to run.
Idle mode enables the MCU to wake up from external triggered interrupts as well as
internal ones like the Timer Overflow and USI Start and Overflow interrupts. If wake-up
from the Analog Comparator interrupt is not required, the Analog Comparator can be
powered down by setting the ACD bit in the Analog Comparator Control and Status
Register – ACSR. This will reduce power consumption in Idle mode. If the ADC is
enabled, a conversion starts automatically when this mode is entered.
ADC Noise Reduction When the SM1..0 bits are written to “01”, the SLEEP instruction makes the MCU enter
Mode ADC Noise Reduction mode, stopping the CPU but allowing the ADC, the External Inter-
rupts, the USI start condition detection, and the Watchdog to continue operating (if
enabled). This sleep mode basically halts clkI/O, clkCPU, and clkFLASH, while allowing the
other clocks to run.
This improves the noise environment for the ADC, enabling higher resolution measure-
ments. If the ADC is enabled, a conversion starts automatically when this mode is
entered. Apart form the ADC Conversion Complete interrupt, only an External Reset, a
Watchdog Reset, a Brown-out Reset, USI start condition interrupt, an EEPROM ready
interrupt, an External Level Interrupt on INT0, or a pin change interrupt can wake up the
MCU from ADC Noise Reduction mode.
Power-down Mode When the SM1..0 bits are written to “10”, the SLEEP instruction makes the MCU enter
Power-down mode. In this mode, the External Oscillator is stopped, while the External
Interrupts, the USI start condition detection, and the Watchdog continue operating (if
enabled). Only an External Reset, a Watchdog Reset, a Brown-out Reset, USI start con-
dition interrupt, an External Level Interrupt on INT0, or a pin change interrupt can wake
up the MCU. This sleep mode basically halts all generated clocks, allowing operation of
asynchronous modules only.
When waking up from Power-down mode, there is a delay from the wake-up condition
occurs until the wake-up becomes effective. This allows the clock to restart and become
stable after having been stopped. The wake-up period is defined by the same CKSEL
Fuses that define the reset time-out period, as described in “Clock Sources” on page 24.
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1477G–AVR–03/05
Note that if a level triggered external interrupt or pin change interrupt is used from
Power-down mode, the changed level must be held for some time to wake up the MCU.
This makes the MCU less sensitive to noise.
If the wake-up condition disappears before the MCU wakes up and starts to execute,
e.g., a low level on INT0 is not held long enough, the interrupt causing the wake-up will
not be executed.
Standby Mode When the SM1..0 bits are “11” and an External Crystal/Resonator clock option is
selected, the SLEEP instruction forces the MCU into the Standby mode. This mode is
identical to Power-down with the exception that the Oscillator is kept running. From
Standby mode, the device wakes up in only six clock cycles.
Table 19. Active Clock Domains and Wake-up Sources in the different Sleep Modes.
Active Clock domains Oscillators Wake-up Sources
Main Clock INT0, and Pin USI Start EEPROM
clkCPU clkFLASH clkIO clkADC ADC Other I/O
Sleep Mode Source Enabled Change Condition Ready
Idle X X X X X X X X
ADC Noise
Reduction X X X(2) X X X
(2)
Power-down X X
Standby(1) X X(2) X
Notes: 1. Only recommended with external crystal or resonator selected as clock source.
2. Only level interrupt INT0.
38 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Minimizing Power There are several issues to consider when trying to minimize the power consumption in
Consumption an AVR controlled system. In general, sleep modes should be used as much as possi-
ble, and the sleep mode should be selected so that as few as possible of the device’s
functions are operating. All functions not needed should be disabled. In particular, the
following modules may need special consideration when trying to achieve the lowest
possible power consumption.
Analog to Digital Converter If enabled, the ADC will be enabled in all sleep modes. To save power, the ADC should
be disabled before entering any sleep mode. When the ADC is turned off and on again,
the next conversion will be an extended conversion. Refer to “Analog to Digital Con-
verter” on page 94 for details on ADC operation.
Analog Comparator When entering Idle mode, the Analog Comparator should be disabled if not used. When
entering ADC Noise Reduction mode, the Analog Comparator should be disabled. In the
other sleep modes, the Analog Comparator is automatically disabled. However, if the
Analog Comparator is set up to use the Internal Voltage Reference as input, the Analog
Comparator should be disabled in all sleep modes. Otherwise, the Internal Voltage Ref-
erence will be enabled, independent of sleep mode. Refer to “Analog Comparator” on
page 91 for details on how to configure the Analog Comparator.
Brown-out Detector If the Brown-out Detector is not needed in the application, this module should be turned
off. If the Brown-out Detector is enabled by the BODEN Fuse, it will be enabled in all
sleep modes, and hence, always consume power. In the deeper sleep modes, this will
contribute significantly to the total current consumption. Refer to “Brown-out Detection”
on page 34 for details on how to configure the Brown-out Detector.
Internal Voltage Reference The Internal Voltage Reference (see Table 20) will be enabled when needed by the
Brown-out Detector, the Analog Comparator or the ADC. If these modules are disabled
as described in the sections above, the Internal Voltage Reference will be disabled and
it will not be consuming power. When turned on again, the user must allow the reference
to start up before the output is used. If the reference is kept on in sleep mode, the output
can be used immediately.
Watchdog Timer If the Watchdog Timer is not needed in the application, this module should be turned off.
If the Watchdog Timer is enabled, it will be enabled in all sleep modes, and hence,
always consume power. In the deeper sleep modes, this will contribute significantly to
the total current consumption. Refer to “Watchdog Timer” on page 78 for details on how
to configure the Watchdog Timer.
Port Pins When entering a sleep mode, all port pins should be configured to use minimum power.
The most important thing is then to ensure that no pins drive resistive loads. In sleep
modes where the both the I/O clock (clkI/O) and the ADC clock (clkADC) are stopped, the
input buffers of the device will be disabled. This ensures that no power is consumed by
the input logic when not needed. In some cases, the input logic is needed for detecting
wake-up conditions, and it will then be enabled. Refer to “Digital Input Enable and Sleep
Modes” on page 45 for details on which pins are enabled. If the input buffer is enabled
39
1477G–AVR–03/05
and the input signal is left floating or have an analog signal level close to VCC/2, the
input buffer will use excessive power.
40 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
I/O Ports
Introduction All AVR ports have true Read-Modify-Write functionality when used as general digital
I/O ports. This means that the direction of one port pin can be changed without uninten-
tionally changing the direction of any other pin with the SBI and CBI instructions. The
same applies when changing drive value (if configured as output) or enabling/disabling
of pull-up resistors (if configured as input). Each output buffer, except reset, has sym-
metrical drive characteristics with both high sink and source capability. The pin driver is
strong enough to drive LED displays directly. All port pins have individually selectable
pull-up resistors with a supply-voltage invariant resistance. All I/O pins have protection
diodes to both VCC and Ground as indicated in Figure 31.
Rpu
Pxn Logic
Cpin
See Figure
"General Digital I/O" for
Details
All registers and bit references in this section are written in general form. A lower case
“x” represents the numbering letter for the port, and a lower case “n” represents the bit
number. However, when using the register or bit defines in a program, the precise form
must be used. For example, PORTB3 for bit no. 3 in Port B, here documented generally
as PORTxn. The physical I/O Registers and bit locations are listed in “Register Descrip-
tion for I/O Ports” on page 56.
Three I/O memory address locations are allocated for each port, one each for the Data
Register – PORTx, Data Direction Register – DDRx, and the Port Input Pins – PINx. The
Port Input Pins I/O location is read only, while the Data Register and the Data Direction
Register are read/write. In addition, the Pull-up Disable – PUD bit in MCUCR disables
the pull-up function for all pins in all ports when set.
Using the I/O port as General Digital I/O is described in “Ports as General Digital I/O” on
page 42. Most port pins are multiplexed with alternate functions for the peripheral fea-
tures on the device. How each alternate function interferes with the port pin is described
in “Alternate Port Functions” on page 46. Refer to the individual module sections for a
full description of the alternate functions.
Note that enabling the alternate function of some of the port pins does not affect the use
of the other pins in the port as general digital I/O.
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Ports as General Digital The ports are bi-directional I/O ports with optional internal pull-ups. Figure 32 shows a
I/O functional description of one I/O-port pin, here generically called Pxn.
PUD
Q D
DDxn
Q CLR
WDx
RESET
RDx
DATA BUS
Pxn Q D
PORTxn
Q CLR
WPx
RESET
SLEEP RRx
SYNCHRONIZER
RPx
D Q D Q
PINxn
L Q Q
clk I/O
Note: 1. WPx, WDx, RRx, RPx, and RDx are common to all pins within the same port. clkI/O,
SLEEP, and PUD are common to all ports.
Configuring the Pin Each port pin consists of 3 Register bits: DDxn, PORTxn, and PINxn. As shown in “Reg-
ister Description for I/O Ports” on page 56, the DDxn bits are accessed at the DDRx I/O
address, the PORTxn bits at the PORTx I/O address, and the PINxn bits at the PINx I/O
address.
The DDxn bit in the DDRx Register selects the direction of this pin. If DDxn is written
logic one, Pxn is configured as an output pin. If DDxn is written logic zero, Pxn is config-
ured as an input pin.
If PORTxn is written logic one when the pin is configured as an input pin, the pull-up
resistor is activated. To switch the pull-up resistor off, PORTxn has to be written logic
zero or the pin has to be configured as an output pin. The port pins are tri-stated when a
reset condition becomes active, even if no clocks are running.
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is
driven high (one). If PORTxn is written logic zero when the pin is configured as an out-
put pin, the port pin is driven low (zero).
When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn,
PORTxn} = 0b11), an intermediate state with either pull-up enabled ({DDxn, PORTxn} =
0b01) or output low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up
enabled state is fully acceptable, as a high-impedant environment will not notice the
42 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
difference between a strong high driver and a pull-up. If this is not the case, the PUD bit
in the MCUCR Register can be set to disable all pull-ups in all ports.
Switching between input with pull-up and output low generates the same problem. The
user must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state
({DDxn, PORTxn} = 0b11) as an intermediate step.
Table 21 summarizes the control signals for the pin value.
Reading the Pin Value Independent of the setting of Data Direction bit DDxn, the port pin can be read through
the PINxn Register Bit. As shown in Figure 32, the PINxn Register bit and the preceding
latch constitute a synchronizer. This is needed to avoid metastability if the physical pin
changes value near the edge of the internal clock, but it also introduces a delay. Figure
33 shows a timing diagram of the synchronization when reading an externally applied
pin value. The maximum and minimum propagation delays are denoted tpd,max and tpd,min
respectively.
SYSTEM CLK
SYNC LATCH
PINxn
t pd, max
t pd, min
Consider the clock period starting shortly after the first falling edge of the system clock.
The latch is closed when the clock is low, and goes transparent when the clock is high,
as indicated by the shaded region of the “SYNC LATCH” signal. The signal value is
latched when the system clock goes low. It is clocked into the PINxn Register at the suc-
ceeding positive clock edge. As indicated by the two arrows tpd,max and tpd,min, a single
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1477G–AVR–03/05
signal transition on the pin will be delayed between ½ and 1½ system clock period
depending upon the time of assertion.
When reading back a software assigned pin value, a nop instruction must be inserted as
indicated in Figure 34. The out instruction sets the “SYNC LATCH” signal at the positive
edge of the clock. In this case, the delay tpd through the synchronizer is one system
clock period.
SYSTEM CLK
r16 0xFF
SYNC LATCH
PINxn
t pd
44 ATtiny26(L)
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ATtiny26(L)
The following code example shows how to set port B pins 0 and 1 high, 2 and 3 low, and
define the port pins from 4 to 7 as input with pull-ups assigned to port pins 6 and 7. The
resulting pin values are read back again, but as previously discussed, a nop instruction
is included to be able to read back the value recently assigned to some of the pins.
Note: 1. For the assembly program, two temporary registers are used to minimize the time
from pull-ups are set on pins 0, 1, 6, and 7, until the direction bits are correctly set,
defining bit 2 and 3 as low and redefining bits 0 and 1 as strong high drivers.
Digital Input Enable and Sleep As shown in Figure 32, the digital input signal can be clamped to ground at the input of
Modes the schmitt-trigger. The signal denoted SLEEP in the figure, is set by the MCU Sleep
Controller in Power-down mode, Standby mode, and ADC Noise Reduction mode to
avoid high power consumption if some input signals are left floating, or have an analog
signal level close to VCC/2.
SLEEP is overridden for port pins enabled as External Interrupt pins. If the External
Interrupt Request is not enabled, SLEEP is active also for these pins. SLEEP is also
overridden by various other alternate functions as described in “Alternate Port Func-
tions” on page 46.
If a logic high level (“one”) is present on an Asynchronous External Interrupt pin config-
ured as “Interrupt on a Rising Edge, Falling Edge, or Any Logic Change on Pin” while
the external interrupt is not enabled, the corresponding External Interrupt Flag will be set
when resuming from the above mentioned sleep modes, as the clamping in these sleep
modes produces the requested logic change.
45
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Unconnected Pins If some pins are unused, it is recommended to ensure that these pins have a defined
level. Even though most of the digital inputs are disabled in the deep sleep modes as
described above, floating inputs should be avoided to reduce current consumption in all
other modes where the digital inputs are enabled (Reset, Active mode, and Idle mode).
The simplest method to ensure a defined level of an unused pin, is to enable the internal
pullup. In this case, the pullup will be disabled during reset. If low power consumption
during reset is important, it is recommended to use an external pullup or pulldown. Con-
necting unused pins directly to VCC or GND is not recommended, since this may cause
excessive currents if the pin is accidentally configured as an output.
Alternate Port Functions Most port pins have alternate functions in addition to being general digital I/Os. Figure
35 shows how the port pin control signals from the simplified Figure 32 can be overrid-
den by alternate functions. The overriding signals may not be present in all port pins, but
the figure serves as a generic description applicable to all port pins in the AVR micro-
controller family.
PUOVxn
1
0
PUD
DDOExn
DDOVxn
1
0 Q D
DDxn
Q CLR
WDx
PVOExn
RESET
PVOVxn RDx
DATA BUS
1
Pxn
0 Q D
PORTxn
Q CLR
DIEOExn
WPx
DIEOVxn RESET
1
RRx
0 SLEEP
SYNCHRONIZER
RPx
SET
D Q D Q
PINxn
L CLR Q CLR Q
clk I/O
DIxn
AIOxn
Note: 1. WPx, WDx, RLx, RPx, and RDx are common to all pins within the same port. clkI/O,
SLEEP, and PUD are common to all ports. All other signals are unique for each pin.
46 ATtiny26(L)
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ATtiny26(L)
Table 22 summarizes the function of the overriding signals. The pin and port indexes
from Figure 35 are not shown in the succeeding tables. The overriding signals are gen-
erated internally in the modules having the alternate function.
The following subsections shortly describes the alternate functions for each port, and
relates the overriding signals to the alternate function. Refer to the alternate function
description for further details.
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MCU Control Register – The MCU Control Register contains control bits for general MCU functions.
MCUCR
Bit 7 6 5 4 3 2 1 0
$35 ($55) – PUD SE SM1 SM0 – ISC01 ISC00 MCUCR
Read/Write R R/W R/W R/W R/W R R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Alternate Functions of Port A Port A has an alternate functions as analog inputs for the ADC and Analog Comparator
and pin change interrupt as shown in Table 23. If some Port A pins are configured as
outputs, it is essential that these do not switch when a conversion is in progress. This
might corrupt the result of the conversion. The ADC is described in “Analog to Digital
Converter” on page 94. Analog Comparator is described in “Analog Comparator” on
page 91. Pin change interrupt triggers on pins PA7, PA6 and PA3 if interrupt is enabled
and it is not masked by the alternate functions even if the pin is configured as an output.
See details from “Pin Change Interrupt” on page 62.
Table 24 and Table 25 relates the alternate functions of Port A to the overriding signals
shown in Figure 35 on page 46. Thera are changes on PA7, PA6, and PA3 digital
inputs. PA3 output and pullup driver are also overridden.
• ADC6/AIN1 Port – A, Bit 7
AIN1: Analog Comparator Negative input and ADC6: ADC input channel 6. Configure
the port pin as input with the internal pull-up switched off to avoid the digital port function
from interfering with the function of the analog comparator or analog to digital converter.
PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate function do not
mask the interrupt. The masking alternate function is the Analog Comparator. Digital
input is enabled on pin PA7 also in SLEEP modes, if the pin change interrupt is enabled
and not masked by the alternate function.
• ADC5/AIN0 Port – A, Bit 6
48 ATtiny26(L)
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ATtiny26(L)
AIN0: Analog Comparator Positive input and ADC5: ADC input channel 5. Configure the
port pin as input with the internal pull-up switched off to avoid the digital port function
from interfering with the function of the Analog Comparator or analog to digital
converter.
PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate function do not
mask the interrupt. The masking alternate function is the Analog Comparator. Digital
input is enabled on pin PA6 also in SLEEP modes, if the pin change interrupt is enabled
and not masked by the alternate function.
• ADC4, ADC3 Port – A, Bit 5, 4
ADC4/ADC3: ADC Input Channel 4 and 3. Configure the port pins as inputs with the
internal pull-ups switched off to avoid the digital port function from interfering with the
function of the analog to digital converter.
• AREF/PCINT1 Port – A, Bit 3
AREF: External Reference for ADC. Pullup and output driver are disabled on PA3 when
the pin is used as an external reference or Internal Voltage Reference (2.56V) with
external capacitor at the AREF pin by setting (one) the bit REFS0 in the ADC Multiplexer
Selection Register (ADMUX).
PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate function do not
mask the interrupt. The masking alternate function is the pin usage as an analog refer-
ence for the ADC. Digital input is enabled on pin PA3 also in SLEEP modes, if the pin
change interrupt is enabled and not masked by the alternate function.
49
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Table 25. Overriding Signals for Alternate Functions in PA3..PA0
Signal
Name PA3/AREF/PCINT1 PA2/ADC2 PA1/ADC1 PA0/ADC0
PUOE ADMUX[REFS0] 0 0 0
PUOV 0 0 0 0
DDOE ADMUX[REFS0] 0 0 0
DDOV 0 0 0 0
PVOE 0 0 0 0
PVOV 0 0 0 0
DIEOE PCINT1_ENABLE(1) • 0 0 0
~(2)ADMUX[REFS0]
DIEOV 1 0 0 0
DI PCINT1 – – –
AIO ANALOG REFERENCE INPUT ADC2 INPUT ADC1 INPUT ADC0 INPUT
Notes: 1. Note that the PCINT1 Interrupt is only enabled if both the Global Interrupt Flag is
enabled, the PCIE1 flag in GIMSK is set and the alternate function of the pin is dis-
abled as described in “Pin Change Interrupt” on page 62
2. Not operator is marked with “~”.
50 ATtiny26(L)
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ATtiny26(L)
Alternate Functions Of Port B Port B has an alternate functions for the ADC, Clocking, Timer/Counters, USI, SPI pro-
gramming and pin change interrupt. The ADC is described in “Analog to Digital
Converter” on page 94, Clocking in “AVR CPU Core” on page 6, timers in
“Timer/Counters” on page 64 and USI in “Universal Serial Interface – USI” on page 80.
Pin change interrupt triggers on pins PB7 - PB0 if interrupt is enabled and it is not
masked by the alternate functions even if the pin is configured as an output. See details
from “Pin Change Interrupt” on page 62. Pin functions in programming modes are
described in “Memory Programming” on page 107. The alternate functions are shown in
Table 26.
51
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PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate function do not
mask the interrupt. The masking alternate function is the pin usage as RESET. Digital
input is enabled on pin PB7 also in SLEEP modes, if the pin change interrupt is enabled
and not masked by the alternate function.
• ADC9/INT0/T0/PCINT1 – Port B, Bit 6
ADC9: ADC Input Channel 9. Configure the port pins as inputs with the internal pull-ups
switched off to avoid the digital port function from interfering with the function of the ana-
log to digital converter.
INT0: External Interrupt source 0: The PB6 pin can serve as an external interrupt source
enabled by setting (one) the bit INT0 in the General Input Mask Register (GIMSK).
T0: Timer/Counter0 External Counter Clock input is enabled by setting (one) the bits
CS02 and CS01 in the Timer/Counter0 Control Register (TCCR0).
PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate functions are the external low level Interrupt
source 0 (INT0) and the Timer/Counter0 External Counter clock input (T0). Digital input
is enabled on pin PB6 also in SLEEP modes, if the pin change interrupt is enabled and
not masked by the alternate functions.
• ADC8/XTAL2/PCINT1 – Port B, Bit 5
ADC8: ADC Input Channel 8. Configure the port pins as inputs with the internal pull-ups
switched off to avoid the digital port function from interfering with the function of the ana-
log to digital converter.
XTAL2: Chip Clock Oscillator pin 2. Used as clock pin for all chip clock sources except
internal calibrateble RC Oscillator, external clock and PLL clock. When used as a clock
pin, the pin can not be used as an I/O pin. When using internal calibratable RC Oscilla-
tor, External clock or PLL clock as Chip clock sources, PB5 serves as an ordinary I/O
pin.
PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate functions are the XTAL2 outputs. Digital input
is enabled on pin PB5 also in SLEEP modes, if the pin change interrupt is enabled and
not masked by the alternate functions.
• ADC7/XTAL1/PCINT1 – Port B, Bit 4
ADC7: ADC Input Channel 7. Configure the port pins as inputs with the internal pull-ups
switched off to avoid the digital port function from interfering with the function of the ana-
log to digital converter.
XTAL1: Chip Clock Oscillator pin 1. Used for all chip clock sources except internal cali-
brateble RC oscillator and PLL clock. When used as a clock pin, the pin can not be used
as an I/O pin. When using internal calibratable RC Oscillator or PLL clock as chip clock
sources, PB4 serves as an ordinary I/O pin.
PCINT1: Pin Change Interrupt 1 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate functions are the XTAL1 inputs. Digital input
is enabled on pin PB4 also in SLEEP modes, if the pin change interrupt is enabled and
not masked by the alternate functions.
• OC1B/PCINT0 – Port B, Bit 3
52 ATtiny26(L)
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ATtiny26(L)
OC1B: Output Compare match output: The PB3 pin can serve as an output for the
Timer/Counter1 compare match B. The PB3 pin has to be configured as an output
(DDB3 set (one)) to serve this function. The OC1B pin is also the output pin for the PWM
mode.
PCINT0: Pin Change Interrupt 0 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate function is the output compare match output
OC1B. Digital input is enabled on pin PB3 also in SLEEP modes, if the pin change inter-
rupt is enabled and not masked by the alternate functions.
• SCK/SCL/OC1B/PCINT0 – Port B, Bit 2
SCK: Clock input or output in USI Three-wire mode. When the SPI is enabled this pin is
configured as an input. In the USI Three-wire mode the bit DDRB2 controls the direction
of the pin, output for the Master mode and input for the Slave mode.
SCL: USI External Open-collector Serial Clock for USI Two-wire mode. The SCL pin is
pulled low when PORTB2 is cleared (zero) or USI start condition is detected and
DDRB2 is set (one). Pull-up is disabled in USI Two-wire mode.
OC1B: Inverted Timer/Counter1 PWM Output B: The PB2 pin can serve as an inverted
output for the Timer/Counter1 PWM mode if USI is not enabled. The PB2 pin has to be
configured as an output (DDB2 set (one)) to serve this function.
PCINT1: Pin Change Interrupt 0 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate function are the inverted output compare
match output OC1B and USI clocks SCK/SCL. Digital input is enabled on pin PB2 also
in SLEEP modes, if the pin change interrupt is enabled and not masked by the alternate
functions.
• DO/OC1A/PCINT0 – Port B, Bit 1
DO: Data Output in USI Three-wire mode. Data output (DO) overrides PORTB1 value
and it is driven to the port when the data direction bit DDB1 is set (one). However the
PORTB1 bit still controls the pullup, enabling pullup if direction is input and PORTB1 is
set(one).
OC1A: Output Compare match output: The PB1 pin can serve as an output for the
Timer/Counter1 compare match A. The PB1 pin has to be configured as an output
(DDB1 set (one)) to serve this function. The OC1B pin is also the output pin for the PWM
mode timer function if not used in programming or USI.
PCINT0: Pin Change Interrupt 0 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate functions are the output compare match out-
put OC1A and Data Output (DO) in USI Three-wire mode. Digital input is enabled on pin
PB1 also in SLEEP modes, if the pin change interrupt is enabled and not masked by the
alternate functions.
53
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• DI/SDA/OC1A/PCINT0 – Port B, Bit 0
DI: Data Input in USI Three-wire mode. USI Three-wire mode does not override normal
port functions., so pin must be configure as an input.
SDA: Serial Data in USI Two-wire mode. Serial data pin is bi-directional and uses open-
collector output. The SDA pin is enabled by setting the pin as an output. The pin is
pulled low when the PORTB0 or USI shiftRegister is zero when DDB0 is set (one). Pull-
up is disabled in USI Two-wire mode.
OC1A: Inverted Timer/Counter1 PWM output A: The PB0 pin can serve as an Inverted
output for the PWM mode if not used in programming or USI. The PB0 pin has to be
configured as an output (DDB0 set (one)) to serve this function.
PCINT0: Pin Change Interrupt 0 pin. Pin change interrupt is enabled on pin when global
interrupt is enabled, pin change interrupt is enabled and the alternate functions do not
mask the interrupt. The masking alternate functions are the inverted output compare
match output OC1A and USI data DI or SDA. Digital input is enabled on pin PB0 also in
SLEEP modes, if the pin change interrupt is enabled and not masked by the alternate
functions. Table 27 and Table 28 relate the alternate functions of Port B to the overriding
signals shown in “Alternate Port Functions” on page 46.
54 ATtiny26(L)
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ATtiny26(L)
55
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Register Description for
I/O Ports
56 ATtiny26(L)
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ATtiny26(L)
Interrupts
Interrupt Vectors The ATtiny26(L) provides eleven interrupt sources. These interrupts and the separate
Reset Vector, each have a separate program vector in the program memory space. All
the interrupts are assigned individual enable bits which must be set (one) together with
the I-bit in the Status Register in order to enable the interrupt.
The lowest addresses in the program memory space are automatically defined as the
Reset and Interrupt vectors. The complete list of vectors is shown in Table 29. The list
also determines the priority levels of the different interrupts. The lower the address the
higher is the priority level. RESET has the highest priority, and next is INT0 – the Exter-
nal Interrupt Request 0 etc.
The most typical and general program setup for the Reset and Interrupt Vector
Addresses are:
Address Labels Code Comments
$000 rjmp RESET ; Reset handler
$001 rjmp EXT_INT0 ; IRQ0 handler
$002 rjmp PIN_CHANGE ; Pin change handler
$003 rjmp TIM1_CMP1A ; Timer1 compare match 1A
$004 rjmp TIM1_CMP1B ; Timer1 compare match 1B
$005 rjmp TIM1_OVF ; Timer1 overflow handler
$006 rjmp TIM0_OVF ; Timer0 overflow handler
$007 rjmp USI_STRT ; USI Start handler
$008 rjmp USI_OVF ; USI Overflow handler
$009 rjmp EE_RDY ; EEPROM Ready handler
$00A rjmp ANA_COMP ; Analog Comparator handler
$00B rjmp ADC ; ADC Conversion Handler
;
$009 RESET: ldi r16, RAMEND ; Main program start
$00A out SP, r16
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1477G–AVR–03/05
$00B sei
… … … …
Interrupt Handling The ATtiny26(L) has two 8-bit Interrupt Mask Control Registers; GIMSK – General Inter-
rupt Mask Register and TIMSK – Timer/Counter Interrupt Mask Register.
When an interrupt occurs, the Global Interrupt Enable I-bit is cleared (zero) and all inter-
rupts are disabled. The user software can set (one) the I-bit to enable nested interrupts.
The I-bit is set (one) when a Return from Interrupt instruction – RETI – is executed.
When the Program Counter is vectored to the actual Interrupt Vector in order to execute
the interrupt handling routine, hardware clears the corresponding flag that generated the
interrupt. Some of the interrupt flags can also be cleared by writing a logic one to the flag
bit position(s) to be cleared.
If an interrupt condition occurs when the corresponding interrupt enable bit is cleared
(zero), the interrupt flag will be set and remembered until the interrupt is enabled, or the
flag is cleared by software.
If one or more interrupt conditions occur when the Global Interrupt Enable bit is cleared
(zero), the corresponding interrupt flag(s) will be set and remembered until the Global
Interrupt Enable bit is set (one), and will be executed by order of priority.
Note that external level interrupt does not have a flag, and will only be remembered for
as long as the interrupt condition is active.
Note that the Status Register is not automatically stored when entering an interrupt rou-
tine and restored when returning from an interrupt routine. This must be handled by
software.
Interrupt Response Time The interrupt execution response for all the enabled AVR interrupts is four clock cycles
minimum. After the four clock cycles the program vector address for the actual interrupt
handling routine is executed. During this four clock cycle period, the Program Counter
(10 bits) is pushed onto the Stack. The vector is a relative jump to the interrupt routine,
and this jump takes two clock cycles. If an interrupt occurs during execution of a multi-
cycle instruction, this instruction is completed before the interrupt is served.
A return from an interrupt handling routine takes four clock cycles. During these four
clock cycles, the Program Counter (10 bits) is popped back from the Stack. When AVR
exits from an interrupt, it will always return to the main program and execute one more
instruction before any pending interrupt is served. Note that the Status Register – SREG
– is not handled by the AVR hardware, neither for interrupts nor for subroutines. For the
routines requiring a storage of the SREG, this must be performed by user software.
58 ATtiny26(L)
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ATtiny26(L)
interrupt is activated on rising or falling edge, on pin change, or low level of the INT0 pin.
Activity on the pin will cause an interrupt request even if INT0 is configured as an output.
The corresponding interrupt of External Interrupt Request 0 is executed from program
memory address $001. See also “External Interrupt” on page 62.
• Bit 5 – PCIE1: Pin Change Interrupt Enable1
When the PCIE1 bit is set (one) and the I-bit in the Status Register (SREG) is set (one),
the interrupt pin change is enabled on analog pins PB[7:4], PA[7:6] and PA[3]. Unless
the alternate function masks out the interrupt, any change on the pin mentioned before
will cause an interrupt. The corresponding interrupt of Pin Change Interrupt Request is
executed from program memory address $002. See also “Pin Change Interrupt” on
page 62.
• Bit 4– PCIE0: Pin Change Interrupt Enable0
When the PCIE0 bit is set (one) and the I-bit in the Status Register (SREG) is set (one),
the interrupt pin change is enabled on digital pins PB[3:0]. Unless the alternate function
masks out the interrupt, any change on the pin mentioned before will cause an interrupt.
The corresponding interrupt of Pin Change Interrupt Request is executed from program
memory address $002. See also “Pin Change Interrupt” on page 62.
• Bits 3..0 – Res: Reserved Bits
These bits are reserved bits in the ATtiny26(L) and always read as zero.
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Read/Write R R/W R/W R R R/W R/W R
Initial Value 0 0 0 0 0 0 0 0
60 ATtiny26(L)
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ATtiny26(L)
ware when executing the corresponding interrupt handling vector. Alternatively, OCF1B
is cleared, after synchronization clock cycle, by writing a logic one to the flag. When the
I-bit in SREG, OCIE1B, and OCF1B are set (one), the Timer/Counter1 B Compare
Match interrupt is executed.
• Bits 4..3 – Res: Reserved Bits
These bits are reserved bits in the ATtiny26(L) and always read as zero.
• Bit 2 – TOV1: Timer/Counter1 Overflow Flag
The bit TOV1 is set (one) when an overflow occurs in Timer/Counter1. TOV1 is cleared
by hardware when executing the corresponding interrupt handling vector. Alternatively,
TOV1 is cleared, after synchronization clock cycle, by writing a logical one to the flag.
When the SREG I-bit, and TOIE1 (Timer/Counter1 Overflow Interrupt Enable), and
TOV1 are set (one), the Timer/Counter1 Overflow interrupt is executed.
• Bit 1 – TOV0: Timer/Counter0 Overflow Flag
The bit TOV0 is set (one) when an overflow occurs in Timer/Counter0. TOV0 is cleared
by hardware when executing the corresponding interrupt handling vector. Alternatively,
TOV0 is cleared by writing a logical one to the flag. When the SREG I-bit, and TOIE0
(Timer/Counter0 Overflow Interrupt Enable), and TOV0 are set (one), the
Timer/Counter0 Overflow interrupt is executed.
• Bit 0 – Res: Reserved Bit
This bit is a reserved bit in the ATtiny26(L) and always reads as zero.
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External Interrupt The External Interrupt is triggered by the INT0 pin. Observe that, if enabled, the interrupt
will trigger even if the INT0 pin is configured as an output. This feature provides a way of
generating a software interrupt. The External Interrupt can be triggered by a falling or
rising edge, a pin change, or a low level. This is set up as indicated in the specification
for the MCU Control Register – MCUCR. When the External Interrupt is enabled and is
configured as level triggered, the interrupt will trigger as long as the pin is held low.
The changed level is sampled twice by the Watchdog Oscillator clock, and if both these
samples have the required level, the MCU will wake up. The period of the Watchdog
Oscillator is 1.0 µs (nominal) at 3.0V and 25°C. The frequency of the Watchdog Oscilla-
tor is voltage dependent as shown in “Electrical Characteristics” on page 126.
Pin Change Interrupt The pin change interrupt is triggered by any change on any I/O pin of Port B and pins
PA3, PA6, and PA7, if the interrupt is enabled and alternate function of the pin does not
mask out the interrupt. The bit PCIE1 in GIMSK enables interrupt from pins PB[7:4],
PA[7:6], and PA[3]. PCIE0 enables interrupt on digital pins PB[3:0].
The pin change interrupt is different from other interrupts in two ways. First, pin change
interrupt enable bits PCIE1 and PCIE0 also mask the flag if they are not set. The normal
operation on most interrupts is that the flag is always active and only the execution of
the interrupt is masked by the interrupt enable.
Secondly, please note that pin change interrupt is disabled for any pin that is configured
as an alternate function. For example, no pin change interrupt is generated from pins
that are configured as AREF, AIN0 or AIN1, OC1A, OC1A, OC1B, OC1B, XTAL1, or
XTAL2 in a fuse selected clock option, Timer0 clocking, or RESET function. See Table
30 for alternate functions which mask the pin change interrupt and how the function is
enabled. For example pin change interrupt on the PB0 is disabled when USI Two-wire
mode or USI Three-wire mode or Timer/Counter1 inverted output compare is enabled.
If the interrupt is enabled, the interrupt will trigger even if the changing pin is configured
as an output. This feature provides a way of generating a software interrupt. Also
observe that the pin change interrupt will trigger even if the pin activity triggers another
interrupt, for example the external interrupt. This implies that one external event might
cause several interrupts.
The value of the programmed fuse is “0” and unprogrammed is “1”. Each of the lines
enables the alternate function so “or” function of the lines enables the function.
62 ATtiny26(L)
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ATtiny26(L)
Notes: 1. Each line represents a bit or fuse combination which enables the function.
A fuse value of “0” is programmed, “1” is unprogrammed.
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Timer/Counters The ATtiny26(L) provides two general purpose 8-bit Timer/Counters. The
Timer/Counters have separate prescaling selection from the separate prescaler. The
Timer/Counter0 clock (CK) as the clock timebase. The Timer/Counter1 has two clocking
modes, a synchronous mode and an asynchronous mode. The synchronous mode uses
the system clock (CK) as the clock timebase and asynchronous mode uses the fast
peripheral clock (PCK) as the clock time base.
CK/64
CK/8
CK/256
CK/1024
PSR0
T0(PB6)
0
CS00
CS01
CS02
The four prescaled selections are: CK/8, CK/64, CK/256, and CK/1024 where CK is the
oscillator clock. CK, external source, and stop, can also be selected as clock sources.
64 ATtiny26(L)
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ATtiny26(L)
Timer/Counter1 Figure 37 shows the Timer/Counter1 prescaler. For Timer/Counter1 the clock selections
Prescaler are between PCK to PCK/16384 and stop in asynchronous mode and CK to CK/16384
and stop in synchronous. The clock options are described in Table 34 on page 72 and
the Timer/Counter1 Control Register, TCCR1B. Setting the PSR1 bit in TCCR1B Regis-
ter resets the prescaler. The PCKE bit in the PLLCSR Register enables the
asynchronous mode.
CK
S T1CK 14-BIT
PCK A T/C PRESCALER
(64 MHz)
T1CK/16384
T1CK/1024
T1CK/2048
T1CK/4096
T1CK/8192
T1CK/128
T1CK/256
T1CK/512
T1CK/16
T1CK/32
T1CK/64
T1CK/2
T1CK/4
T1CK/8
T1CK
0
CS10
CS11
CS12
CS13
65
1477G–AVR–03/05
Figure 38. Timer/Counter0 Block Diagram
Timer/Counter0 Control
Bit 7 6 5 4 3 2 1 0
Register – TCCR0
$33 ($53) – – – – PSR0 CS02 CS01 CS00 TCCR0
Read/Write R R R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
66 ATtiny26(L)
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ATtiny26(L)
The Stop condition provides a Timer Enable/Disable function. The CK down divided
modes are scaled directly from the CK oscillator clock. If the external pin modes are
used, the corresponding setup must be performed in the actual Data Direction Control
Register (cleared to zero gives an input pin).
Timer/Counter0 – TCNT0
Bit 7 6 5 4 3 2 1 0
$32 ($52) MSB LSB TCNT0
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
The Timer/Counter0 is implemented as an up-counter with read and write access. If the
Timer/Counter0 is written and a clock source is present, the Timer/Counter0 continues
counting in the timer clock cycle following the write operation.
8-bit Timer/Counter1 The Timer/Counter1 has two clocking modes: a synchronous mode and an asynchro-
nous mode. The synchronous mode uses the system clock (CK) as the clock timebase
and asynchronous mode uses the fast peripheral clock (PCK) as the clock time base.
The PCKE bit from the PLLCSR Register enables the asynchronous mode when it is set
(“1”). The Timer/Counter1 general operation is described in the asynchronous mode and
the operation in the synchronous mode is mentioned only if there is differences between
these two modes. Figure 39 shows Timer/Counter1 synchronization register block dia-
gram and synchronization delays in between registers. Note that all clock gating details
are not shown in the figure. The Timer/Counter1 Register values go through the internal
synchronization registers, which cause the input synchronization delay, before affecting
the counter operation. The registers TCCR1A, TCCR1B, OCR1A, OCR1B, and OCR1C
can be read back right after writing the register. The read back values are delayed for
the Timer/Counter1 (TCNT1) Register and flags (OCF1A, OCF1B, and TOV1), because
of the input and output synchronization.
This module features a high resolution and a high accuracy usage with the lower pres-
caling opportunities. Timer/Counter1 can also support two accurate, high speed, 8-bit
Pulse Width Modulators using clock speeds up to 64 MHz. In this mode, Timer/Counter1
and the Output Compare Registers serve as dual stand-alone PWMs with non-overlap-
ping non-inverted and inverted outputs. Refer to page 74 for a detailed description on
this function. Similarly, the high prescaling opportunities make this unit useful for lower
speed functions or exact timing functions with infrequent actions.
67
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Figure 39. Timer/Counter1 Synchronization Register Block Diagram
8-B IT D A TA B U S
IO -registers Inpu t sy ncroniza tio n T im er/C ounte r1 O utput O utput
re gis te rs s yncro n iz atio n m ultiplex ers
registers TCNT1
O C R 1A O C R 1A _S I S
O C R 1B O C R 1B _S I T C N T _S O A
O C R 1C O C R 1C _S I
TCCR1A T C C R 1A _S I S O C F 1A
TCCR1B T C C R 1B _S I O C F 1A _S O A
TCNT1
S O C F 1B
TCNT1 T C N T 1_S I
O C F 1B _S O A
O C F 1A O C F 1A _S I
O C F 1B O C F 1B _S I S TOV1
TOV1 T O V 1_S I T O V 1_S O A
PCKE
CK
S
A
S
PCK A
Timer/Counter1 and the prescaler allow running the CPU from any clock source while
the prescaler is operating on the fast 64 MHz PCK clock in the asynchronous mode.
Note that the system clock frequency must be lower than one half of the PCK frequency.
Only when the system clock is generated from PCK dividing that by two, the ratio of the
PCK/system clock can be exactly two. The synchronization mechanism of the asynchro-
nous Timer/Counter1 needs at least two edges of the PCK when the system clock is
high. If the frequency of the system clock is too high, it is a risk that data or control val-
ues are lost.
The following Figure 40 shows the block diagram for Timer/Counter1.
68 ATtiny26(L)
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ATtiny26(L)
OCIE1A
OCIE1B
OCF1B
OCF1A
TOIE1
TOIE0
TOV1
TOV0
TIMER INT. MASK TIMER INT. FLAG T/C CONTROL T/C CONTROL
REGISTER (TIMSK) REGISTER (TIFR) REGISTER 1 (TCCR1A) REGISTER 1 (TCCR1B)
CS12
CS11
CS10
PWM1A
PWM1B
CTC1
PSR1
COM1A1
COM1A0
COM1B1
COM1B0
FOC1A
FOC1B
CS13
TOV1
OCF1A
OCF1B
TIMER/COUNTER1
Three status flags (overflow and compare matches) are found in the Timer/Counter
Interrupt Flag Register – TIFR. Control signals are found in the Timer/Counter Control
Registers TCCR1A and TCCR1B. The interrupt enable/disable settings are found in the
Timer/Counter Interrupt Mask Register – TIMSK.
The Timer/Counter1 contains three Output Compare Registers, OCR1A, OCR1B, and
OCR1C, as the data source to be compared with the Timer/Counter1 contents. In nor-
mal mode the Output Compare functions are operational with all three Output Compare
Registers. OCR1A determines action on the OC1A pin (PB1), and it can generate
Timer1 OC1A interrupt in normal mode and in PWM mode. Likewise, OCR1B deter-
mines action on the OC1B pin (PB3) and it can generate Timer1 OC1B interrupt in
normal mode and in PWM mode. OCR1C holds the Timer/Counter maximum value, i.e.,
the clear on compare match value. An overflow interrupt (TOV1) is generated when
Timer/Counter1 counts from $FF to $00 or from OCR1C to $00. This function is the
same for both normal and PWM mode. The inverted PWM outputs OC1A and OC1B are
not connected in normal mode.
In PWM mode, OCR1A and OCR1B provide the data values against which the
Timer/Counter value is compared. Upon compare match the PWM outputs (OC1A,
OC1A, OC1B, OC1B) are generated. In PWM mode, the Timer/Counter counts up to the
value specified in the Output Compare Register OCR1C and starts again from $00. This
feature allows limiting the counter “full” value to a specified value, lower than $FF.
Together with the many prescaler options, flexible PWM frequency selection is provided.
Table 37 lists clock selection and OCR1C values to obtain PWM frequencies from 20
kHz to 250 kHz in 10 kHz steps and from 250 kHz to 500 kHz in 50 kHz steps. Higher
PWM frequencies can be obtained at the expense of resolution.
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Timer/Counter1 Control
Bit 7 6 5 4 3 2 1 0
Register A – TCCR1A
$30 ($50) COM1A1 COM1A0 COM1B1 COM1B0 FOC1A FOC1B PWM1A PWM1B TCCR1A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
In PWM mode, these bits have different functions. Refer to Table 35 on page 75 for a
detailed description.
• Bits 5, 4 – COM1B1, COM1B0: Comparator B Output Mode, Bits 1 and 0
The COM1B1 and COM1B0 control bits determine any output pin action following a
Compare Match with Compare Register B in Timer/Counter1. Output pin actions affect
pin PB3 (OC1B). Since this is an alternative function to an I/O port, the corresponding
direction control bit must be set (one) in order to control an output pin. Note that OC1B is
not connected in normal mode.
In PWM mode, these bits have different functions. Refer to Table 35 on page 75 for a
detailed description.
• Bit 3 – FOC1A: Force Output Compare Match 1A
Writing a logical one to this bit forces a change in the Compare Match output pin PB1
(OC1A) according to the values already set in COM1A1 and COM1A0. If COM1A1 and
COM1A0 written in the same cycle as FOC1A, the new settings will be used. The Force
Output Compare bit can be used to change the output pin value regardless of the timer
value. The automatic action programmed in COM1A1 and COM1A0 takes place as if a
compare match had occurred, but no interrupt is generated. The FOC1A bit always
reads as zero. FOC1A is not in use if PWM1A bit is set.
• Bit 2 – FOC1B: Force Output Compare Match 1B
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ATtiny26(L)
Writing a logical one to this bit forces a change in the Compare Match output pin PB3
(OC1B) according to the values already set in COM1B1 and COM1B0. If COM1B1 and
COM1B0 written in the same cycle as FOC1B, the new settings will be used. The Force
Output Compare bit can be used to change the output pin value regardless of the timer
value. The automatic action programmed in COM1B1 and COM1B0 takes place as if a
compare match had occurred, but no interrupt is generated. The FOC1B bit always
reads as zero. FOC1B is not in use if PWM1B bit is set.
• Bit 1 – PWM1A: Pulse Width Modulator A Enable
When set (one) this bit enables PWM mode based on comparator OCR1A in
Timer/Counter1 and the counter value is reset to $00 in the CPU clock cycle after a
compare match with OCR1C Register value.
• Bit 0 – PWM1B: Pulse Width Modulator B Enable
When set (one) this bit enables PWM mode based on comparator OCR1B in
Timer/Counter1 and the counter value is reset to $00 in the CPU clock cycle after a
compare match with OCR1C Register value.
Timer/Counter1 Control
Bit 7 6 5 4 3 2 1 0
Register B – TCCR1B
$2F ($4F) CTC1 PSR1 – – CS13 CS12 CS11 CS10 TCCR1B
Read/Write R/W R/W R R R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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• Bits 3..0 – CS13, CS12, CS11, CS10: Clock Select Bits 3, 2, 1, and 0
The Clock Select bits 3, 2, 1, and 0 define the prescaling source of Timer/Counter1.
Timer/Counter1 – TCNT1
Bit 7 6 5 4 3 2 1 0
$2E ($4E) MSB LSB TCNT1
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Timer/Counter1 Output
Bit 7 6 5 4 3 2 1 0
Compare RegisterA – OCR1A
$2D ($4D) MSB LSB OCR1A
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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ATtiny26(L)
ware write that sets TCNT1 and OCR1A to the same value does not generate a
compare match.
A compare match will set the compare interrupt flag OCF1A after a synchronization
delay following the compare event.
Timer/Counter1 Output
Bit 7 6 5 4 3 2 1 0
Compare RegisterB – OCR1B
$2C ($4C) MSB LSB OCR1B
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
Timer/Counter1 Output
Bit 7 6 5 4 3 2 1 0
Compare RegisterC – OCR1C
$2B ($4B) MSB LSB OCR1C
Read/Write R/W R/W R/W R/W R/W R/W R/W R/W
Initial Value 0 0 0 0 0 0 0 0
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When the PLLE is set, the PLL is started and if needed internal RC Oscillator is started
as a PLL reference clock. If PLL is selected as a system clock source the value for this
bit is always 1.
• Bit 0 – PLOCK: PLL Lock Detector
When the PLOCK bit is set, the PLL is locked to the reference clock, and it is safe to
enable PCK for Timer/Counter1. After the PLL is enabled, it takes about 64 µs/100 µs
(typical/worst case) for the PLL to lock.
Timer/Counter1 Initialization To change Timer/Counter1 to the asynchronous mode, first enable PLL, and poll the
for Asynchronous Mode PLOCK bit until it is set, and then set the PCKE bit.
Timer/Counter1 in PWM Mode When the PWM mode is selected, Timer/Counter1 and the Output Compare Register C
– OCR1C form a dual 8-bit, free-running and glitch-free PWM generator with outputs on
the PB1(OC1A) and PB3(OC1B) pins. Also inverted, non-overlapping outputs are avail-
able on pins PB0(OC1A) and PB2(OC1B), respectively. The non-overlapping output
pairs (OC1A - OC1A and OC1B - OC1B) are never both set at the same time. This
allows driving power switches directly. The non-overlap time is one prescaled clock
cycle, and the high time is one cycle shorter than the low time.
The non-overlap time is generated by delaying the rising edge, i.e., the positive edge is
one prescaled and one PCK cycle delayed and the negative edge is one PCK cycle
delayed in the asynchronous mode. In the synchronous mode he positive edge is one
prescaled and one CK cycle delayed and the negative edge is one CK cycle delayed.
The high time is also one prescaled cycle shorter in the both operation modes.
OC1x
OC1x
t non-overlap
x = A or B
When the counter value match the contents of OCR1A and OCR1B, the OC1A and
OC1B outputs are set or cleared according to the COM1A1/COM1A0 or
COM1B1/COM1B0 bits in the Timer/Counter1 Control Register A – TCCR1A, as shown
in Table 35 below.
Timer/Counter1 acts as an up-counter, counting from $00 up to the value specified in
the Output Compare Register (OCR1C), and starting from $00 up again. A compare
match with OC1C will set an Overflow Interrupt Flag (TOV1) after a synchronization
delay following the compare event.
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ATtiny26(L)
Note that in PWM mode, writing to the Output Compare Registers OCR1A or OCR1B,
the data value is first transferred to a temporary location. The value is latched into
OCR1A or OCR1B when the Timer/Counter reaches OCR1C. This prevents the occur-
rence of odd-length PWM pulses (glitches) in the event of an unsynchronized OCR1A or
OCR1B. See Figure 42 for an example.
During the time between the write and the latch operation, a read from OCR1A or
OCR1B will read the contents of the temporary location. This means that the most
recently written value always will read out of OCR1A or OCR1B.
When OCR1A or OCR1B contain $00 or the top value, as specified in OCR1C Register,
the output PB1(OC1A) or PB3(OC1B) is held low or high according to the settings of
COM1A1/COM1A0. This is shown in Table 36.
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Table 36. PWM Outputs OCR1x = $00 or OCR1C, x = A or B
COM1x1 COM1x0 OCR1x Output OC1x Output OC1x
0 1 $00 L H
0 1 OCR1C H L
1 0 $00 L Not connected
1 0 OCR1C H Not connected
1 1 $00 H Not connected
1 1 OCR1C L Not connected
In PWM mode, the Timer Overflow Flag – TOV1, is set as in normal Timer/Counter
mode. Timer Overflow Interrupt1 operates exactly as in normal Timer/Counter mode,
i.e., it is executed when TOV1 is set provided that Timer Overflow Interrupt and global
interrupts are enabled. This also applies to the Timer Output Compare flags and
interrupts.
The frequency of the PWM will be Timer Clock 1 Frequency divided by (OCR1C
value + 1). See the following equation:
f TCK1
f PWM = -----------------------------------
-
( OCR1C + 1 )
Resolution shows how many bit is required to express the value in the OCR1C Register.
It is calculated by following equation
ResolutionPWM = log2(OCR1C + 1)
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ATtiny26(L)
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Watchdog Timer The Watchdog Timer is clocked from a separate On-chip Oscillator which runs at 1
MHz. This is the typical value at VCC = 5V. See characterization data for typical values at
other VCC levels. By controlling the Watchdog Timer prescaler, the Watchdog Reset
interval can be adjusted from 16 to 2048 ms. The WDR – Watchdog Reset – instruction
resets the Watchdog Timer. Eight different clock cycle periods can be selected to deter-
mine the reset period. If the reset period expires without another Watchdog Reset, the
ATtiny26(L) resets and executes from the Reset Vector. For timing details on the Watch-
dog Reset, refer to page 34.
To prevent unintentional disabling of the Watchdog, a special turn-off sequence must be
followed when the Watchdog is disabled. Refer to the description of the Watchdog Timer
Control Register for details.
WATCHDOG
Normally 1 MHz PRESCLALER
WATCHDOG
RESET
WDP0
WDP1
WDP2
WDE
MCU RESET
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ATtiny26(L)
1. In the same operation, write a logical one to WDCE and WDE. A logical one
must be written to WDE even though it is set to one before the disable operation
starts.
2. Within the next four clock cycles, write a logical 0 to WDE. This disables the
Watchdog.
• Bits 2..0 – WDP2, WDP1, WDP0: Watchdog Timer Prescaler 2, 1, and 0
The WDP2, WDP1 and WDP0 bits determine the Watchdog Timer prescaling when the
Watchdog Timer is enabled. The different prescaling values and their corresponding
time-out periods are shown in Table 38.
Note: 1. The frequency of the Watchdog Oscillator is voltage dependent. The WDR – Watch-
dog Reset – instruction should always be executed before the Watchdog Timer is
enabled. This ensures that the reset period will be in accordance with the Watchdog
Timer prescale settings. If the Watchdog Timer is enabled without reset, the Watch-
dog Timer may not start counting from zero.
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Universal Serial The Universal Serial Interface, or USI, provides the basic hardware resources needed
for serial communication. Combined with a minimum of control software, the USI allows
Interface – USI significantly higher transfer rates and uses less code space than solutions based on
software only. Interrupts are included to minimize the processor load. The main features
of the USI are:
• Two-wire Synchronous Data Transfer (Master or Slave, fSCLmax = fCK/16)
• Three-wire Synchronous Data Transfer (Master, fSCKmax = fCK/2, Slave fSCKmax = fCK/4)
• Data Received Interrupt
• Wakeup from Idle Mode
• In Two-wire Mode: Wake-up from All Sleep Modes, Including Power-down Mode
• Two-wire Start Condition Detector with Interrupt Capability
LE
DI/SDA
PB0
(Input/Open Drain)
Bit7
Bit0
3
2
USIDR
1 TIM0 OVF
0
3 0 SCK/SCL
2 PB2
4-bit Counter 1 (Input/Open Drain)
USIOIF
USISIF
USIDC
USIPF
1
0 CLOCK
DATA BUS
HOLD
[1]
Two-wire Clock
USISR Control Unit
2
USIWM1
USIWM0
USICS1
USICS0
USICLK
USIOIE
USISIE
USITC
USICR
The 8-bit Shift Register is directly accessible via the data bus and contains the incoming
and outgoing data. The register has no buffering so the data must be read as quickly as
possible to ensure that no data is lost. The most significant bit is connected to one of two
output pins depending of the wire mode configuration. A transparent latch is inserted
between the serial register output and output pin, which delays the change of data out-
put to the opposite clock edge of the data input sampling. The serial input is always
sampled from the Data Input (DI) pin independent of the configuration.
The 4-bit counter can be both read and written via the data bus, and can generate an
overflow interrupt. Both the serial register and the counter are clocked simultaneously
by the same clock source. This allows the counter to count the number of bits received
or transmitted and generate an interrupt when the transfer is complete. Note that when
an external clock source is selected the counter counts both clock edges. In this case
the counter counts the number of edges, and not the number of bits. The clock can be
selected from three different sources: the SCK pin, Timer 0 overflow, or from software.
The Two-wire clock control unit can generate an interrupt when a start condition is
detected on the Two-wire bus. It can also generate wait states by holding the clock pin
low after a start condition is detected, or after the counter overflows.
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ATtiny26(L)
Register Descriptions
The USI uses no buffering of the serial register, i.e., when accessing the Data Register
(USIDR) the serial register is accessed directly. If a serial clock occurs at the same cycle
the register is written, the register will contain the value written and no shift is performed.
A (left) shift operation is performed depending of the USICS1..0 bits setting. The shift
operation can be controlled by an external clock edge, by a Timer/Counter0 overflow, or
directly by software using the USICLK strobe bit. Note that even when no wire mode is
selected (USIWM1..0 = 0) both the external data input (DI/SDA) and the external clock
input (SCK/SCL) can still be used by the Shift Register.
The output pin in use, DO or SDA depending on the wire mode, is connected via the out-
put latch to the most significant bit (bit 7) of the Data Register. The output latch is open
(transparent) during the first half of a serial clock cycle when an external clock source is
selected (USICS1 = 1), and constantly open when an internal clock source is used
(USICS1 = 0). The output will be changed immediately when a new MSB written as long
as the latch is open. The latch ensures that data input is sampled and data output is
changed on opposite clock edges.
Note that the corresponding Data Direction Register (DDRB2/1) to the pin must be set to
one for enabling data output from the Shift Register.
The Status Register contains interrupt flags, line status flags and the counter value.
Note that doing a Read-Modify-Write operation on USISR Register, i.e., using the SBI or
CBI instructions, will clear pending interrupt flags. It is recommended that register con-
tents is altered by using the OUT instruction only.
• Bit 7 – USISIF: Start Condition Interrupt Flag
When Two-wire mode is selected, the USISIF flag is set (to one) when a start condition
is detected. When output disable mode or Three-wire mode is selected and (USICSx =
0b11 & USICLK = 0) or (USICS = 0b10 & USICLK = 0), any edge on the SCK pin sets
the flag.
An interrupt will be generated when the flag is set while the USISIE bit in USICR and the
Global Interrupt Enable Flag are set. The flag will only be cleared by writing a logical one
to the USISIF bit. Clearing this bit will release the start detection hold of SCL in Two-wire
mode.
A start condition interrupt will wakeup the processor from all four sleep modes.
• Bit 6 – USIOIF: Counter Overflow Interrupt Flag
This flag is set (one) when the 4-bit counter overflows (i.e., at the transition from 15 to
0). An interrupt will be generated when the flag is set while the USIOIE bit in USICR and
the Global Interrupt Enable Flag are set. The flag will only be cleared if a one is written
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to the USIOIF bit. Clearing this bit will release the counter overflow hold of SCL in Two-
wire mode.
A counter overflow interrupt will wakeup the processor from Idle sleep mode.
• Bit 5 – USIPF: Stop Condition Flag
When Two-wire mode is selected, the USIPF flag is set (one) when a stop condition is
detected. The flag is cleared by writing a one to this bit. Note that this is not an interrupt
flag. This signal is useful when implementing Two-wire bus master arbitration.
• Bit 4 – USIDC: Data Output Collision
This bit is logical one when bit 7 in the Shift Register differs from the physical pin value.
The flag is only valid when Two-wire mode is used. This signal is useful when imple-
menting Two-wire bus master arbitration.
• Bits 3..0 – USICNT3..0: Counter Value
These bits reflect the current 4-bit counter value. The 4-bit counter value can directly be
read or written by the CPU.
The 4-bit counter increments by one for each clock generated either by the external
clock edge detector, by a Timer/Counter0 overflow, or by software using USICLK or
USITC strobe bits. The clock source depends of the setting of the USICS1..0 bits. For
external clock operation a special feature is added that allows the clock to be generated
by writing to the USITC strobe bit. This feature is enabled by write a one to the USICLK
bit while setting an external clock source (USICS1 = 1).
Note that even when no wire mode is selected (USIWM1..0 = 0) the external clock input
(SCK/SCL) are can still be used by the counter.
The Control Register includes interrupt enable control, wire mode setting, clock select
setting, and clock strobe.
• Bit 7 – USISIE: Start Condition Interrupt Enable
Setting this bit to one enables the Start Condition detector interrupt. If there is a pending
interrupt when the USISIE and the Global Interrupt Enable Flag is set to one, this will
immediately be executed. Refer to the description of “Bit 7 – USISIF: Start Condition
Interrupt Flag” on page 81 for further details.
When Two-wire mode is selected, the USISIF flag is set (to one) when a start condition
is detected. When output disable mode or Three-wire mode is selected and (USICSx =
0b11 & USICLK = 0) or (USICS = 0b10 & USICLK = 0), any edge on the SCK pin sets
the flag.
• Bit 6 – USIOIE: Counter Overflow Interrupt Enable
Setting this bit to one enables the Counter Overflow interrupt. If there is a pending inter-
rupt when the USIOIE and the Global Interrupt Enable Flag is set to one, this will
immediately be executed. Refer to the description of “Bit 6 – USIOIF: Counter Overflow
Interrupt Flag” on page 81 for further details.
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ATtiny26(L)
Note: 1. The DI and SCK pins are renamed to Serial Data (SDA) and Serial Clock (SCL)
respectively to avoid confusion between the modes of operation.
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• Bit 3..2 – USICS1..0: Clock Source Select
These bits set the clock source for the Shift Register and counter. The data output latch
ensures that the output is changed at the opposite edge of the sampling of the data
input (DI/SDA) when using external clock source (SCK/SCL). When software strobe or
Timer0 overflow clock option is selected the output latch is transparent and therefore the
output is changed immediately. Clearing the USICS1..0 bits enables software strobe
option. When using this option, writing a one to the USICLK bit clocks both the Shift
Register and the counter. For external clock source (USICS1 = 1), the USICLK bit is no
longer used as a strobe, but selects between external clocking, and software clocking by
the USITC strobe bit.
Table 40 shows the relationship between the USICS1..0 and USICLK setting and clock
source used for the Shift Register and the 4-bit counter.
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ATtiny26(L)
Functional Descriptions
Three-wire Mode The USI Three-wire mode is compliant to the Serial Peripheral Interface (SPI) mode 0
and 1, but does not have the slave select (SS) pin functionality. However, this feature
can be implemented in software if necessary. Pin names used by this mode are: DI, DO,
and SCK.
DO
PBx
DI
PBy
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCK
PBz
SLAVE
DO
PBx
DI
PBy
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCK
PBz
PORTBz
MASTER
Figure 45 shows two USI units operating in Three-wire mode, one as master and one as
slave. The two shift Registers are interconnected in such way that after eight SCK
clocks, the data in each register are interchanged. The same clock also increments the
USI’s 4-bit counter. The Counter Overflow (interrupt) flag, or USIOIF, can therefore be
used to determine when a transfer is completed. The clock is generated by the master
device software by toggling the PB2 pin via the PORTB Register or by writing a one to
the USITC bit in USICR.
SCK
SCK
DO MSB 6 5 4 3 2 1 LSB
DI MSB 6 5 4 3 2 1 LSB
A B C D E
The Three-wire mode timing is shown in Figure 46. At the top of the figure is a SCK
cycle reference. One bit is shifted into the USI Shift Register (USIDR) for each of these
cycles. The SCK timing is shown for both external clock modes. In external clock mode
0 (USICS0 = 0), DI is sampled at positive edges, and DO is changed (Data Register is
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shifted by one) at negative edges. External clock mode 1 (USICS0 = 1) uses the oppo-
site edges versus mode 0, i.e., samples data at negative and changes the output at
positive edges. The USI clock modes corresponds to the SPI data mode 0 and 1.
Referring to the timing diagram (Figure 46.), a bus transfer involves the following steps:
1. The slave device and master device sets up its data output and, depending on
the protocol used, enables its output driver (mark A and B). The output is set up
by writing the data to be transmitted to the serial Data Register. Enabling of the
output is done by setting the corresponding bit in the port data direction register
(DDRB2). Note that point A and B does not have any specific order, but both
must be at least one half SCK cycle before point C where the data is sampled.
This must be done to ensure that the data setup requirement is satisfied. The 4-
bit counter is reset to zero.
2. The master generates a clock pulse by software toggling the SCK line twice (C
and D). The bit value on the slave and master’s data input (DI) pin is sampled by
the USI on the first edge (C), and the data output is changed on the opposite
edge (D). The 4-bit counter will count both edges.
3. Step 2. is repeated eight times for a comlpete register (byte) transfer.
4. After eight clock pulses (i.e., 16 clock edges) the counter will overflow and indi-
cate that the transfer is completed. The data bytes transferred must now be
processed before a new transfer can be initiated. The overflow interrupt will wake
up the processor if it is set to Idle mode. Depending of the protocol used the
slave device can now set its output to high impedance.
SPI Master Operation The following code demonstrates how to use the USI module as a SPI master:
Example SPITransfer:
out USIDR,r16
ldi r16,(1<<USIOIF)
out USISR,r16
ldi r16,(1<<USIWM0)+(1<<USICS1)+(1<<USICLK)+(1<<USITC)
SPITransfer_loop:
out USICR,r16
sbis USISR,USIOIF
rjmp SPITransfer_loop
in r16,USIDR
ret
The code is size optimized using only 8 instructions (+ ret). The code example assumes
that the DO and SCK pins are enabled as output in the DDRB Register. The value
stored in register r16 prior to the function is called is transferred to the slave device, and
when the transfer is completed the data received from the slave is stored back into the
r16 register.
The second and third instructions clears the USI Counter Overflow Flag and the USI
counter value. The fourth and fifth instruction set Three-wire mode, positive edge Shift
Register clock, count at USITC strobe, and toggle SCK (PORTB2). The loop is repeated
16 times.
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ATtiny26(L)
The following code demonstrates how to use the USI module as a SPI Master with max-
imum speed (fsck = fck/2):
SPITransfer_Fast:
out USIDR,r16
ldi r16,(1<<USIWM0)+(0<<USICS0)+(1<<USITC)
ldi r17,(1<<USIWM0)+(0<<USICS0)+(1<<USITC)+(1<<USICLK)
in r16,USIDR
ret
SPI Slave Operation Example The following code demonstrates how to use the USI module as a SPI slave:
init:
ldi r16,(1<<USIWM0)+(1<<USICS1)
out USICR,r16
...
SlaveSPITransfer:
out USIDR,r16
ldi r16,(1<<USIOIF)
out USISR,r16
SlaveSPITransfer_loop:
sbis USISR,USIOIF
rjmp SlaveSPITransfer_loop
in r16,USIDR
ret
The code is size optimized using only 8 instructions (+ ret). The code example assumes
that the DO is configured as output and SCK pin is configured as input in the DDRB
Register. The value stored in register r16 prior to the function is called is transferred to
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the master device, and when the transfer is completed the data received from the mas-
ter is stored back into the r16 register.
Note that the first two instructions is for initialization only and needs only to be executed
once.These instructions sets Three-wire mode and positive edge Shift Register clock.
The loop is repeated until the USI Counter Overflow Flag is set.
Two-wire Mode The USI Two-wire mode is compliant to the Inter IC (TWI) bus protocol, but without slew
rate limiting on outputs and input noise filtering. Pin names used by this mode are SCL
and SDA.
SDA
PBy
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCL
PBz
HOLD
SCL
Two-wire Clock
Control Unit
SLAVE
SDA
PBy
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
SCL
PBz
PORTBz
MASTER
Figure 47 shows two USI units operating in Two-wire mode, one as master and one as
slave. It is only the physical layer that is shown since the system operation is highly
dependent of the communication scheme used. The main differences between the mas-
ter and slave operation at this level, is the serial clock generation which is always done
by the master, and only the slave uses the clock control unit. Clock generation must be
implemented in software, but the shift operation is done automatically by both devices.
Note that only clocking on negative edge for shifting data is of practical use in this mode.
The slave can insert wait states at start or end of transfer by forcing the SCL clock low.
This means that the master must always check if the SCL line was actually released
after it has generated a positive edge.
Since the clock also increments the counter, a counter overflow can be used to indicate
that the transfer is completed. The clock is generated by the master by toggling the PB2
pin via the PORTB Register.
The data direction is not given by the physical layer. A protocol, like the one used by the
TWI-bus, must be implemented to control the data flow.
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ATtiny26(L)
SDA
A B C D E F
Referring to the timing diagram (Figure 48.), a bus transfer involves the following steps:
1. The a start condition is generated by the master by forcing the SDA low line while
the SCL line is high (A). SDA can be forced low either by writing a zero to bit 7 of
the Shift Register, or by setting the PORTB0 bit to zero. Note that DDRB0 must
be set to one for the output to be enabled. The slave device’s start detector logic
(Figure 49.) detects the start condition and sets the USISIF flag. The flag can
generate an interrupt if necessary.
2. In addition, the start detector will hold the SCL line low after the master has
forced an negative edge on this line (B). This allows the slave to wake up from
sleep or complete its other tasks, before setting up the Shift Register to receive
the address by clearing the start condition flag and reset the counter.
3. The master set the first bit to be transferred and releases the SCL line (C). The
slave samples the data and shift it into the serial register at the positive edge of
the SCL clock.
4. After eight bits are transferred containing slave address and data direction (read
or write), the slave counter overflows and the SCL line is forced low (D). If the
slave is not the one the master has addressed it releases the SCL line and waits
for a new start condition.
5. If the slave is addressed it holds the SDA line low during the acknowledgment
cycle before holding the SCL line low again (i.e., the Counter Register must be
set to 14 before releasing SCL at (D)). Depending of the R/W bit the master or
slave enables its output. If the bit is set, a master read operation is in progress
(i.e., the slave drives the SDA line) The slave can hold the SCL line low after the
acknowledge (E).
6. Multiple bytes can now be transmitted, all in same direction, until a stop condition
is given by the master (F). Or a new start condition is given.
If the slave is not able to receive more data it does not acknowledge the data byte it has
last received. When the master does a read operation it must terminate the operation by
force the acknowledge bit low after the last byte transmitted.
CLOCK
D Q D Q
HOLD
SDA
CLR CLR
SCL
Write( USISIF)
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Start Condition Detector The start condition detector is shown in Figure 49. The SDA line is delayed (in the range
of 50 to 300 ns) to ensure valid sampling of the SCL line. The start condition detector is
only enabled in Two-wire mode.
When Two-wire mode is selected, the USISIF flag is set (to one) when a start condition
is detected. When output disable mode or Three-wire mode is selected and (USICSx =
0b11 & USICLK = 0) or (USICS = 0b10 & USICLK = 0), any edge on the SCK pin sets
the flag.
The start condition detector is working asynchronously and can therefore wake up the
processor from the Power-down sleep mode. However, the protocol used might have
restrictions on the SCL hold time. Therefore, when using this feature in this case the
oscillator start-up time set by the CKSEL Fuses (see “Clock Systems and their Distribu-
tion” on page 22) must also be taken into the consideration. Refer to the description of
“Bit 7 – USISIF: Start Condition Interrupt Flag” on page 81 for further details.
Alternative USI Usage When the USI unit is not used for serial communication, it can be set up to do alternative
tasks due to its flexible design.
Half-duplex Asynchronous By utilizing the Shift Register in Three-wire mode, it is possible to implement a more
Data Transfer compact and higher performance UART than by software only.
4-bit Counter The 4-bit counter can be used as a stand-alone counter with overflow interrupt. Note
that if the counter is clocked externally, both clock edges will generate an increment.
12-bit Timer/Counter Combining the USI 4-bit counter and Timer/Counter0 allows them to be used as a 12-bit
counter.
Edge Triggered External By setting the counter to maximum value (F) it can function as an additional external
Interrupt interrupt. The overflow flag and interrupt enable bit are then used for the external inter-
rupt. This feature is selected by the USICS1 bit.
Software Interrupt The counter overflow interrupt can be used as a software interrupt triggered by a clock
strobe.
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ATtiny26(L)
Analog Comparator The Analog Comparator compares the input values on the positive pin PA6 (AIN0) and
negative pin PA7 (AIN1). When the voltage on the positive pin PA6 (AIN0) is higher than
the voltage on the negative pin PA7 (AIN1), the Analog Comparator Output, ACO is set
(one). The comparator’s output can trigger a separate interrupt, exclusive to the Analog
Comparator. The user can select Interrupt triggering on comparator output rise, fall or
toggle. A block diagram of the comparator and its surrounding logic is shown in the Fig-
ure 50.
ACBG
PA6
(AIN0)
MUX
PA7
(AIN1) MUX
ACME
ADC
MULTIPLEXER OUTPUT
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• Bit 4 – ACI: Analog Comparator Interrupt Flag
This bit is set (one) when a comparator output event triggers the interrupt mode defined
by ACI1 and ACI0. The Analog Comparator Interrupt routine is executed if the ACIE bit
is set (one) and the I-bit in SREG is set (one). ACI is cleared by hardware when execut-
ing the corresponding interrupt handling vector. Alternatively, ACI is cleared by writing a
logic one to the flag.
• Bit 3 – ACIE: Analog Comparator Interrupt Enable
When the ACIE bit is set (one) and the I-bit in the Status Register is set (one), the Ana-
log Comparator interrupt is activated. When cleared (zero), the interrupt is disabled.
• Bit 2 – ACME: Analog Comparator Multiplexer Enable
When the ACME bit is set (one) and the ADC is switched off (ADEN in ADCSR is zero),
MUX3...0 in ADMUX select the input pin to replace the negative input to the Analog
Comparator, as shown in Table 42 on page 93. If ACME is cleared (zero) or ADEN is set
(one), PA7(AIN1) is applied to the negative input to the Analog Comparator.
• Bits 1, 0 – ACIS1, ACIS0: Analog Comparator Interrupt Mode Select
These bits determine which comparator events that trigger the Analog Comparator inter-
rupt. The different settings are shown in Table 41.
Note: 1. When changing the ACIS1/ACIS0 bits, the Analog Comparator Interrupt must be dis-
abled by clearing its Interrupt Enable bit in the ACSR Register. Otherwise an interrupt
can occur when the bits are changed.
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Analog to Digital
Converter
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ATtiny26(L)
ADIE
ADIF
15 0
ADC MULTIPLEXER ADC CTRL. & STATUS ADC DATA REGISTER
SELECT (ADMUX) REGISTER (ADCSR) (ADCH/ADCL)
REFS1
REFS0
ADLAR
MUX4
MUX3
MUX2
MUX1
MUX0
ADPS2
ADPS1
ADPS0
ADEN
ADSC
ADFR
ADIF
ADC[9:0]
PRESCALER
MUX DECODER
CHANNEL SELECTION
GAIN SELECTION
CONVERSION LOGIC
VCC
AREF
SAMPLE & HOLD
COMPARATOR
INTERNAL
2.56 V 10-BIT DAC -
REFERENCE
+
GND
INTERNAL 1.18 V
REFERENCE
ADC10
ADC9
ADC8
ADC3 GAIN
AMPLIFIER
+
ADC2
-
ADC1
ADC0
NEG.
INPUT
MUX
Operation The ADC converts an analog input voltage to a 10-bit digital value through successive
approximation. The minimum value represents GND and the maximum value represents
the voltage on the AREF pin minus 1 LSB. Optionally, AVCC or and internal 2.56V refer-
ence voltage may be connected to the AREF pin by writing to the REFS bits in ADMUX.
The internal voltage reference may thus be decoupled by an external capacitor at the
AREF pin to improve noise immunity.
The analog input channel and differential gain are selected by writing to the MUX bits in
ADMUX. Any of the 11 ADC input pins ADC10..0, as well as GND and a fixed bandgap
voltage reference of nominally 1.18V (VBG), can be selected as single ended inputs to
the ADC. A selection of ADC input pins can be selected as positive and negative inputs
to the differential gain amplifier.
If differential channels are selected, the differential gain stage amplifies the voltage dif-
ference between the selected input channel pair by the selected gain factor. Note that
the voltage on the positive input terminal must be higher than on the negative input ter-
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minal, otherwise the gain stage will saturate at 0V (GND). This amplified value then
becomes the analog input to the ADC. If single ended channels are used, the gain
amplifier is bypassed altogether.
The ADC can operate in two modes – Single Conversion and Free Running mode. In
Single Conversion mode, each conversion will have to be initiated by the user. In Free
Running mode, the ADC is constantly sampling and updating the ADC Data Register.
The ADFR bit in ADCSR selects between the two available modes.
The ADC is enabled by setting the ADC Enable bit, ADEN in ADCSR. Voltage reference
and input channel selections will not go into effect until ADEN is set. The ADC does not
consume power when ADEN is cleared, so it is recommended to switch off the ADC
before entering power saving sleep modes.
A conversion is started by writing a logical one to the ADC Start Conversion bit, ADSC.
This bit stays high as long as the conversion is in progress and will be set to zero by
hardware when the conversion is completed. If a different data channel is selected while
a conversion is in progress, the ADC will finish the current conversion before performing
the channel change.
The ADC generates a 10-bit result, which is presented in the ADC Data Registers,
ADCH and ADCL. By default, the result is presented right adjusted, but can optionally
be presented left adjusted by setting the ADLAR bit in ADMUX.
If the result is left adjusted and no more than 8-bit precision is required, it is sufficient to
read ADCH. Otherwise, ADCL must be read first, then ADCH, to ensure that the content
of the data registers belongs to the same conversion. Once ADCL is read, ADC access
to data registers is blocked. This means that if ADCL has been read, and a conversion
completes before ADCH is read, neither register is updated and the result from the con-
version is lost. When ADCH is read, ADC access to the ADCH and ADCL Registers is
re-enabled.
The ADC has its own interrupt which can be triggered when a conversion completes.
When ADC access to the Data Registers is prohibited between reading of ADCH and
ADCL, the interrupt will trigger even if the result is lost.
ADPS0
ADPS1
ADPS2
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ATtiny26(L)
Figure 53. ADC Timing Diagram, Extended Conversion (Single Conversion Mode)
Next
Extended Conversion Conversion
Cycle Number 1 2 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 3
ADC Clock
ADEN
ADSC
ADIF
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Figure 54. ADC Timing Diagram, Single Conversion
One Conversion Next Conversion
Cycle Number 1 2 3 4 5 6 7 8 9 10 11 12 13 1 2 3
ADC Clock
ADSC
ADIF
11 12 13 1 2 3 4
Cycle Number
ADC Clock
ADSC
ADIF
Changing Channel or The MUXn and REFS1:0 bits in the ADMUX Register are single buffered through a tem-
Reference Selection porary register to which the CPU has random access. This ensures that the channels
and reference selection only takes place at a safe point during the conversion. The
channel and reference selection is continuously updated until a conversion is started.
Once the conversion starts, the channel and reference selection is locked to ensure a
sufficient sampling time for the ADC. Continuous updating resumes in the last ADC
clock cycle before the conversion completes (ADIF in ADCSR is set). Note that the con-
version starts on the following rising ADC clock edge after ADSC is written. The user is
thus advised not to write new channel or reference selection values to ADMUX until one
ADC clock cycle after ADSC is written.
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ATtiny26(L)
Special care should be taken when changing differential channels. Once a differential
channel has been selected, the gain stage may take as much as 125 µs to stabilize to
the new value. Thus conversions should not be started within the first 125 µs after
selecting a new differential channel. Alternatively, conversion results obtained within this
period should be discarded.
The same settling time should be observed for the first differential conversion after
changing ADC reference (by changing the REFS1:0 bits in ADMUX).
ADC Noise Canceler The ADC features a noise canceler that enables conversion during ADC Noise Reduc-
Function tion mode (see “Power Management and Sleep Modes” on page 36) to reduce noise
induced from the CPU core and other I/O peripherals. If other I/O peripherals must be
active during conversion, this mode works equivalently for Idle mode. To make use of
this feature, the following procedure should be used:
1. Make sure that the ADC is enabled and is not busy converting. Single Conver-
sion mode must be selected and the ADC conversion complete interrupt must be
enabled.
ADEN = 1
ADSC = 0
ADFR = 0
ADIE = 1
2. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conver-
sion once the CPU has been halted.
3. If no other interrupts occur before the ADC conversion completes, the ADC inter-
rupt will wake up the CPU and execute the ADC Conversion Complete interrupt
routine.
ADC Conversion Result After the conversion is complete (ADIF is high), the conversion result can be found in
the ADC Result Registers (ADCL, ADCH).
For single ended conversion, the result is
V IN ⋅ 1024
ADC = --------------------------
V REF
where VIN is the voltage on the selected input pin and VREF the selected voltage refer-
ence (see Table 45 on page 101 and Table 46 on page 102). 0x000 represents analog
ground, and 0x3FF represents the selected reference voltage minus one LSB.
If differential channels are used, the result is
where VPOS is the voltage on the positive input pin, VNEG the voltage on the negative
input pin, GAIN the selected gain factor, and VREF the selected voltage reference. Keep
in mind that VPOS must be higher than VNEG, otherwise, the ADC value will saturate at
0x000. Figure 56 shows the decoding of the differential input range.
Table 44 shows the resulting output codes if the differential input channel pair (ADCn -
ADCm) is selected with a gain of GAIN and a reference voltage of VREF.
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Figure 56. Differential Measurement Range
Output Code
0x3FF
0x000
Example:
ADMUX = 0xEB (ADC0 - ADC1, 20x gain, 2.56V reference, left adjusted result)
Voltage on ADC0 is 400 mV, voltage on ADC1 is 300 mV.
ADCR = 1024 * 20 * (400 - 300) / 2560 = 800 = 0x320
ADCL will thus read 0x00, and ADCH will read 0xC8. Writing zero to ADLAR right
adjusts the result: ADCL = 0x20, ADCH = 0x03.
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ATtiny26(L)
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Table 46. Input Channel and Gain Selections
Single Ended Positive Differential Negative Differential
MUX4..0 Input Input Input Gain
00000 ADC0
00001 ADC1
00010 ADC2
00011 ADC3
00100 ADC4
00101 ADC5 N/A
00110 ADC6
00111 ADC7
01000 ADC8
01001 ADC9
01010 ADC10
01011 ADC0 ADC1 20x
01100 ADC0 ADC1 1x
(1)
01101 N/A ADC1 ADC1 20x
01110 ADC2 ADC1 20x
01111 ADC2 ADC1 1x
10000 ADC2 ADC3 1x
(1)
10001 ADC3 ADC3 20x
N/A
10010 ADC4 ADC3 20x
10011 ADC4 ADC3 1x
10100 ADC4 ADC5 20x
10101 ADC4 ADC5 1x
10110(1) N/A ADC5 ADC5 20x
10111 ADC6 ADC5 20x
11000 ADC6 ADC5 1x
11001 ADC8 ADC9 20x
11010 ADC8 ADC9 1x
(1)
11011 N/A ADC9 ADC9 20x
11100 ADC10 ADC9 20x
11101 ADC10 ADC9 1x
11110 1.18V (VBG)
N/A
11111 0V (GND)
Note: 1. For offset measurements only. See “Offset Compensation Schemes” on page 105.
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ATtiny26(L)
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• Bits 2..0 – ADPS2..0: ADC Prescaler Select Bits
These bits determine the division factor between the CK frequency and the input clock
to the ADC.
Table 47. ADC Prescaler Selections
ADPS2 ADPS1 ADPS0 Division Factor
0 0 0 2
0 0 1 2
0 1 0 4
0 1 1 8
1 0 0 16
1 0 1 32
1 1 0 64
1 1 1 128
ADLAR = 0
Bit 15 14 13 12 11 10 9 8
$05 ($25) – – – – – – ADC9 ADC8 ADCH
$04 ($24) ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 ADCL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R
R R R R R R R R
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
ADLAR = 1
Bit 15 14 13 12 11 10 9 8
$05 ($25) ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADCH
$04 ($24) ADC1 ADC0 – – – – – – ADCL
7 6 5 4 3 2 1 0
Read/Write R R R R R R R R
R R R R R R R R
Initial Value 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0
When an ADC conversion is complete, the result is found in these two registers. The
ADLAR bit in ADMUX affect the way the result is read from the registers. If ADLAR is
set, the result is left adjusted. If ADLAR is cleared (default), the result is right adjusted. If
the result is left adjusted and no more than 8-bit precision is required, it is sufficient to
read ADCH. Otherwise, ADCL must be read first, then ADCH.
• ADC9..0: ADC Conversion Result
These bits represent the result from the conversion. For differential channels, this is the
absolute value after gain adjustment, as indicated in Table 46 on page 102. For single
ended channels, $000 represents analog ground, and $3FF represents the selected ref-
erence voltage minus one LSB.
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ATtiny26(L)
Scanning Multiple Since change of analog channel always is delayed until a conversion is finished, the
Channels Free Running mode can be used to scan multiple channels without interrupting the con-
verter. Typically, the ADC Conversion Complete interrupt will be used to perform the
channel shift. However, the user should take the following fact into consideration:
The interrupt triggers once the result is ready to be read. In Free Running mode, the
next conversioin will start immediately when the interrupt triggers. If ADMUX is
changed after the interrupt triggers, the next conversion has already started, and the
old setting is used.
ADC Noise Canceling Digital circuitry inside and outside the ATtiny26(L) generates EMI which might affect the
Techniques accuracy of analog measurements. If conversion accuracy is critical, the noise level can
be reduced by applying the following techniques:
1. The analog part of the ATtiny26(L) and all analog components in the application
should have a separate analog ground plane on the PCB. This ground plane is
connected to the digital ground plane via a single point on the PCB.
2. Keep analog signal paths as short as possible. Make sure analog tracks run over
the analog ground plane, and keep them well away from high-speed switching
digital tracks.
3. The AVCC pin on the ATtiny26(L) should be connected to the digital VCC supply
voltage via an LC network as shown in Figure 57.
4. Use the ADC noise canceler function to reduce induced noise from the CPU.
5. If some pins are used as digital outputs, it is essential that these do not switch
while a conversion is in progress in that port.
Offset Compensation The gain stage has a built-in offset cancellation circuitry that nulls the offset of differen-
Schemes tial measurements as much as possible. The remaining offset in the analog path can be
measured directly by selecting the same channel for both differential inputs. This offset
residue can be then subtracted in software from the measurement results. Using this
kind of software based offset correction, offset on any channel can be reduced below
one LSB.
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Figure 57. ADC Power Connections
10µΗ
VCC GND
5 16
ATtiny26/L AVCC
GND 6 15
100nF
(ADC7/XTAL1) PB4 7 14 PA4 (ADC3)
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ATtiny26(L)
Memory
Programming
Program and Data The ATtiny26 provides two Lock bits which can be left unprogrammed (“1”) or can be
Memory Lock Bits programmed (“0”) to obtain the additional features listed in Table 49. The Lock bits can
only be erased to “1” with the Chip Erase command.
Notes: 1. Program the Fuse bits before programming the Lock bits.
2. “1” means unprogrammed, “0” means programmed
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Fuse Bits The ATtiny26 has two Fuse bytes. Table 50 and Table 51 describe briefly the functional-
ity of all the fuses and how they are mapped into the fuse bytes. Note that the fuses are
read as logical zero, “0”, if they are programmed.
Notes: 1. The default value of SUT1..0 results in maximum start-up time. See Table 12 on page
28 for details.
2. The default setting of CKSEL3..0 results in internal RC Oscillator at 1 MHz. See
Table 3 on page 24 for details.
3. The CKOPT Fuse functionality depends on the setting of the CKSEL bits. See “Sys-
tem Clock and Clock Options” on page 22 for details.
The status of the Fuse bits is not affected by Chip Erase. Note that the Fuse bits are
locked if Lock bit1 (LB1) is programmed. Program the Fuse bits before programming the
Lock bits.
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ATtiny26(L)
Latching of Fuses The fuse values are latched when the device enters programming mode and changes of
the fuse values will have no effect until the part leaves programming mode. This does
not apply to the EESAVE Fuse which will take effect once it is programmed. The fuses
are also latched on Power-up in normal mode.
Signature Bytes All Atmel microcontrollers have a three-byte signature code which identifies the device.
This code can be read in both serial and parallel mode, also when the device is locked.
The three bytes reside in a separate address space.
For the ATtiny26 the signature bytes are:
1. $000: $1E (indicates manufactured by Atmel).
2. $001: $91 (indicates 2KB Flash memory).
3. $002: $09 (indicates ATtiny26 device when $001 is $91).
Calibration Byte The ATtiny26 stores four different calibration values for the internal RC Oscillator. These
bytes resides in the signature row high byte of the addresses 0x0000, 0x0001, 0x0002,
and 0x0003 for 1, 2, 4, and 8 MHz respectively. During Reset, the 1 MHz value is auto-
matically loaded into the OSCCAL Register. If other frequencies are used, the
calibration value has to be loaded manually, see “Oscillator Calibration Register – OSC-
CAL” on page 28 for details.
Page Size
Table 52. No. of Words in a Page and no. of Pages in the Flash
Flash Size Page Size PCWORD No. of Pages PCPAGE PCMSB
1K words (2K bytes) 16 words PC[3:0] 64 PC[9:4] 9
Table 53. No. of Words in a Page and no. of Pages in the EEPROM
EEPROM Size Page Size PCWORD No. of Pages PCPAGE EEAMSB
128 bytes 4 bytes EEA[1:0] 32 EEA[7:0] 7
Parallel Programming This section describes how to parallel program and verify Flash Program memory,
Parameters, Pin EEPROM Data memory, Memory Lock bits, and Fuse bits in the ATtiny26. Pulses are
Mapping, and assumed to be at least 250 ns unless otherwise noted.
Commands
Signal Names In this section, some pins of the ATtiny26 are referenced by signal names describing
their functionality during parallel programming, see Figure 58 and Table 54. Pins not
described in the following table are referenced by pin names.
The XA1/XA0 pins determine the action executed when the XTAL1 pin is given a posi-
tive pulse. The bit coding is shown in Table 56.
When pulsing WR or OE, the command loaded determines the action executed. The dif-
ferent Commands are shown in Table 57.
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Figure 58. Parallel Programming
+5V
WR PB0
VCC
XA0 PB1
+5V
XA1/BS2 PB2
AVCC
PAGEL/BS1 PB3
+12 V RESET
XTAL1/PB4
GND
Note: 1. The pin is used for two different control signals. In the description below, normally
only one of the signals is referred. E.g., “give BS1 a positive pulse” equals “give
PAGEL/BS1 a positive pulse”.
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ATtiny26(L)
Note: 1. [XA1, XA0] = 0b11 is “No Action, Idle”. As long as XTAL1 is not pulsed, the Com-
mand, Address, and Data Registers remain unchanged. Therefore, there are no
problems using BS2 as described below even though BS2 is multiplexed with XA1.
BS2 is only asserted when reading the fuses (OE is low) and XTAL1 is not pulsed.
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Parallel Programming
Enter Programming Mode The following algorithm puts the device in parallel programming mode:
1. Apply 4.5 - 5.5 V between VCC and GND, and wait for at least 100 µs.
2. Set RESET to “0” and toggle XTAL1 at least 6 times.
3. Set the Prog_enable pins listed in Table 55 on page 110 to “0000” and wait at
least 100 ns.
4. Apply 11.5 - 12.5V to RESET. Any activity on Prog_enable pins within 100 ns
after +12V has been applied to RESET, will cause the device to fail entering pro-
gramming mode.
Note: If the RESET pin is disabled by programming the RSTDISBL Fuse, it may not be possible
to follow the proposed algorithm above. The same may apply when External Crystal or
External RC configuration is selected because it is not possible to apply qualified XTAL1
pulses. In such cases, the following algorithm should be followed:
1. Set Prog_enable pins listed in Table 55 on page 110 to “0000”.
2. Apply 4.5 - 5.5V between VCC and GND simultanously as 11.5 - 12.5V is applied
to RESET.
3. Wait 100 ns.
4. Re-program the fuses to ensure that External Clock is selected as clock source
(CKSEL3:0 = 0b0000) and RESET pin is activated (RSTDISBL unprogrammed).
If Lock bits are programmed, a Chip Erase command must be executed before
changing the fuses.
5. Exit Programming mode by power the device down or by bringing RESET pin to
0b0.
6. Entering Programming mode with the original algorithm, as described above.
Considerations for Efficient The loaded command and address are retained in the device during programming. For
Programming efficient programming, the following should be considered.
• The command needs only be loaded once when writing or reading multiple memory
locations.
• Skip writing the data value $FF, that is the contents of the entire EEPROM (unless
the EESAVE Fuse is programmed) and Flash after a Chip Erase.
• Address high byte needs only be loaded before programming or reading a new 256-
word window in Flash or 256-byte EEPROM. This consideration also applies to
Signature bytes reading.
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ATtiny26(L)
Chip Erase The Chip Erase will erase the Flash and EEPROM(1) memories plus Lock bits. The Lock
bits are not reset until the program memory has been completely erased. The Fuse bits
are not changed. A Chip Erase must be performed before the Flash and/or EEPROM
are reprogrammed.
Note: 1. The EEPROM memory is preserved during Chip Erase if the EESAVE Fuse is
programmed.
Load Command “Chip Erase”
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “1000 0000”. This is the command for Chip Erase.
4. Give XTAL1 a positive pulse. This loads the command.
5. Give WR a negative pulse. This starts the Chip Erase. RDY/BSY goes low.
6. Wait until RDY/BSY goes high before loading a new command.
Programming the Flash The Flash is organized in pages, see Table 52 on page 109. When programming the
Flash, the program data is latched into a page buffer. This allows one page of program
data to be programmed simultaneously. The following procedure describes how to pro-
gram the entire Flash memory:
A. Load Command "Write Flash"
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “0001 0000”. This is the command for Write Flash.
4. Give XTAL1 a positive pulse. This loads the command.
B. Load Address Low byte
1. Set XA1, XA0 to “00”. This enables address loading.
2. Set BS1 to “0”. This selects low address.
3. Set DATA = Address low byte ($00 - $FF).
4. Give XTAL1 a positive pulse. This loads the address low byte.
C. Load Data Low Byte
1. Set XA1, XA0 to “01”. This enables data loading.
2. Set DATA = Data low byte ($00 - $FF).
3. Give XTAL1 a positive pulse. This loads the data byte.
D. Load Data High Byte
1. Set BS1 to “1”. This selects high data byte.
2. Set XA1, XA0 to “01”. This enables data loading.
3. Set DATA = Data high byte ($00 - $FF).
4. Give XTAL1 a positive pulse. This loads the data byte.
E. Repeat B through D until the entire buffer is filled or until all data within the page is
loaded.
While the lower bits in the address are mapped to words within the page, the higher bits
address the pages within the FLASH. This is illustrated in Figure 59 on page 114. Note
that if less than 8 bits are required to address words in the page (pagesize < 256), the
most significant bit(s) in the address low byte are used to address the page when per-
forming a page write.
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F. Load Address High byte
1. Set XA1, XA0 to “00”. This enables address loading.
2. Set BS1 to “1”. This selects high address.
3. Set DATA = Address high byte ($00 - $03).
4. Give XTAL1 a positive pulse. This loads the address high byte.
G. Program Page
1. Set BS1 to “0”.
2. Give WR a negative pulse. This starts programming of the entire page of data.
RDY/BSYgoes low.
3. Wait until RDY/BSY goes high. (See Figure 60 for signal waveforms.)
H. Repeat B through G until the entire Flash is programmed or until all data has been
programmed.
I. End Page Programming
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set DATA to “0000 0000”. This is the command for No Operation.
3. Give XTAL1 a positive pulse. This loads the command, and the internal write sig-
nals are reset.
01
02
PAGEEND
114 ATtiny26(L)
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ATtiny26(L)
A B C D B C D F G
$10 ADDR. LOW DATA LOW DATA HIGH ADDR. LOW DATA LOW DATA HIGH ADDR. HIGH XX
DATA
XA1/BS2
XA0
PAGEL/BS1
XTAL1
WR
RDY/BSY
RESET +12V
OE
Note: 1. “XX” is don’t care. The letters refer to the programming description above.
Programming the EEPROM The EEPROM is organized in pages, see Table 53 on page 109. When programming
the EEPROM, the program data is latched into a page buffer. This allows one page of
data to be programmed simultaneously. The programming algorithm for the EEPROM
data memory is as follows (refer to “Programming the Flash” on page 113 for details on
Command, Address and Data loading):
1. A: Load Command “0001 0001”.
2. B: Load Address Low Byte ($00 - $FF).
3. C: Load Data ($00 - $FF).
J: Repeat 2 and 3 until the entire buffer is filled
K: Program EEPROM page
1. Set BS1 to “0”.
2. Give WR a negative pulse. This starts programming of the EEPROM page.
RDY/BSY goes low.
3. Wait until to RDY/BSY goes high before programming the next page.
(See Figure 61 for signal waveforms.)
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Figure 61. Programming the EEPROM Waveforms
J
A B C B C K
$11 ADDR. LOW DATA ADDR. LOW DATA XX
DATA
XA1/BS2
XA0
PAGEL/BS1
XTAL1
WR
RDY/BSY
RESET +12V
OE
Reading the Flash The algorithm for reading the Flash memory is as follows (refer to “Programming the
Flash” on page 113 for details on Command and Address loading):
1. A: Load Command “0000 0010”.
2. F: Load Address High Byte ($00 - $03).
3. B: Load Address Low Byte ($00 - $FF).
4. Set OE to “0”, and BS1 to “0”. The Flash word low byte can now be read at DATA.
5. Set BS1 to “1”. The Flash word high byte can now be read at DATA.
6. Set OE to “1”.
Reading the EEPROM The algorithm for reading the EEPROM memory is as follows (refer to “Programming the
Flash” on page 113 for details on Command and Address loading):
1. A: Load Command “0000 0011”.
2. B: Load Address Low Byte ($00 - $FF).
3. Set OE to “0”, and BS1 to “0”. The EEPROM Data byte can now be read at
DATA.
4. Set OE to “1”.
Programming the Fuse Low The algorithm for programming the Fuse Low bits is as follows (refer to “Programming
Bits the Flash” on page 113 for details on Command and Data loading):
1. A: Load Command “0100 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. Set BS1 and BS2 to “0”.
4. Give WR a negative pulse and wait for RDY/BSY to go high.
116 ATtiny26(L)
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ATtiny26(L)
Programming the Fuse High The algorithm for programming the Fuse high bits is as follows (refer to “Programming
Bits the Flash” on page 113 for details on Command and Data loading):
1. A: Load Command “0100 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs and bit n = “1” erases the Fuse bit.
3. Set BS1 to “1” and BS2 to “0”. This selects high data byte.
4. Give WR a negative pulse and wait for RDY/BSY to go high.
5. Set BS1 to “0”. This selects low data byte.
A C A C
$40 DATA XX $40 DATA XX
DATA
XA1/BS2
XA0
PAGEL/BS1
XTAL1
WR
RDY/BSY
RESET +12V
OE
Programming the Lock Bits The algorithm for programming the Lock bits is as follows (refer to “Programming the
Flash” on page 113 for details on Command and Data loading):
1. A: Load Command “0010 0000”.
2. C: Load Data Low Byte. Bit n = “0” programs the Lock bit.
3. Give WR a negative pulse and wait for RDY/BSY to go high.
The Lock bits can only be cleared by executing Chip Erase.
Reading the Fuse and Lock The algorithm for reading the Fuse and Lock bits is as follows (refer to “Programming
Bits the Flash” on page 113 for details on Command loading):
1. A: Load Command “0000 0100”.
2. Set OE to “0”, BS2 to “0”, and BS1 to “0”. The status of the Fuse Low bits can
now be read at DATA (“0” means programmed).
3. Set OE to “0”, BS2 to “1”, and BS1 to “1”. The status of the Fuse High bits can
now be read at DATA (“0” means programmed).
4. Set OE to “0”, BS2 to “0”, and BS1 to “1”. The status of the Lock bits can now be
read at DATA (“0” means programmed).
5. Set OE to “1”.
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Figure 63. Mapping Between BS1, BS2 and the Fuse- and Lock-bits During Read
Lock Bits 0
1
BS1
Fuse High Byte 1
BS2
Reading the Signature Bytes The algorithm for reading the Signature bytes is as follows (refer to Programming the
Flash for details on Command and Address loading):
1. A: Load Command “0000 1000”.
2. B: Load Address Low Byte ($00 - $02).
3. Set OE to “0” and BS1 to “0”. The selected Signature byte can now be read at
DATA.
4. Set OE to “1”.
Reading the Calibration Byte The algorithm for reading the Calibration byte is as follows (refer to Programming the
Flash for details on Command and Address loading):
1. A: Load Command “0000 1000”.
2. B: Load Address Low Byte.
3. Set OE to “0” and BS1 to “1”. The Calibration byte can now be read at DATA.
4. Set OE to “1”.
Parallel Programming Figure 64. Parallel Programming Timing, Including some General Timing
Characteristics Requirements
tXLWL
tXHXL
XTAL1
tDVXH tXLDX
Data & Contol
(DATA, XA0, XA1/BS2
PAGEL/BS1) t BVWL
tWLWH tWLBX
WR
WLRL
RDY/BSY
tWLRH
118 ATtiny26(L)
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ATtiny26(L)
PAGEL/BS1
DATA ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte)
XA0
XA1/BS2
Note: 1. The timing requirements shown in Figure 64 (i.e., tDVXH, tXHXL, and tXLDX) also apply
to loading operation.
Figure 66. Parallel Programming Timing, Reading Sequence (Within the Same Page)
with Timing Requirements()
LOAD ADDRESS READ DATA READ DATA LOAD ADDRESS
(LOW BYTE) (LOW BYTE) (HIGH BYTE) (LOW BYTE)
tXLOL
XTAL1
tBHDV
PAGEL/BS1
tOLDV
OE
tOHDZ
DATA ADDR0 (Low Byte) DATA (Low Byte) DATA (High Byte) ADDR1 (Low Byte)
XA0
XA1/BS2
Note: 1. The timing requirements shown in Figure 64 (i.e. tDVXH, tXHXL, and tXLDX) also apply
to reading operation.
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Table 58. Parallel Programming Characteristics, VCC = 5V ± 10%
Symbol Parameter Min Typ Max Units
VPP Programming Enable Voltage 11.5 12.5 V
IPP Programming Enable Current 250 µA
tDVXH Data and Control Valid before XTAL1 High 67 ns
tXLXH XTAL1 Low to XTAL1 High 200 ns
tXHXL XTAL1 Pulse Width High 150 ns
tXLDX Data and Control Hold after XTAL1 Low 67 ns
tXLWL XTAL1 Low to WR Low 0 ns
tWLBX BS2/1 Hold after WR Low 67 ns
tBVWL BS1 Valid to WR Low 67 ns
tWLWH WR Pulse Width Low 150 ns
tWLRL WR Low to RDY/BSY Low 0 1 µs
(1)
tWLRH WR Low to RDY/BSY High 3.7 4.5 ms
(2)
tWLRH_CE WR Low to RDY/BSY High for Chip Erase 7.5 9 ms
tXLOL XTAL1 Low to OE Low 0 ns
tBVDV BS1 Valid to DATA valid 0 250 ns
tOLDV OE Low to DATA Valid 250 ns
tOHDZ OE High to DATA Tri-stated 250 ns
Notes: 1. tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse bits and Write Lock
bits commands.
2. tWLRH_CE is valid for the Chip Erase command.
120 ATtiny26(L)
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ATtiny26(L)
Serial Downloading Both the Flash and EEPROM memory arrays can be programmed using the serial SPI
bus while RESET is pulled to GND. The serial interface consists of pins SCK, MOSI
(input) and MISO (output). After RESET is set low, the Programming Enable instruction
needs to be executed first before program/erase operations can be executed. NOTE, in
Table 59 on page 121, the pin mapping for SPI programming is listed. Not all parts use
the SPI pins dedicated for the internal SPI interface. Note that throughout the descrip-
tion about Serial downloading, MOSI and MISO are used to describe the serial data in
and serial data out respectively.
VCC
2.7 - 5.5V(2)
MOSI PB0
AVCC
MISO PB1
SCK PB2
XTAL1
RESET
GND
Notes: 1. If the device is clocked by the internal oscillator, there is no need to connect a clock
source to the XTAL1 pin.
2. VCC -0.3V < AVCC < VCC +0.3V, however, AVCC should always be within 2.7 - 5.5V.
When programming the EEPROM, an auto-erase cycle is built into the self-timed pro-
gramming operation (in the serial mode ONLY) and there is no need to first execute the
Chip Erase instruction. The Chip Erase operation turns the content of every memory
location in both the Program and EEPROM arrays into $FF.
Depending on CKSEL Fuses, a valid clock must be present. The minimum low and high
periods for the serial clock (SCK) input are defined as follows:
Low: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck ≥ 12 MHz
High: > 2 CPU clock cycles for fck < 12 MHz, 3 CPU clock cycles for fck ≥ 12 MHz
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SPI Serial Programming When writing serial data to the ATtiny26, data is clocked on the rising edge of SCK.
Algorithm
When reading data from the ATtiny26, data is clocked on the falling edge of SCK. See
Figure 68, Figure 69, and Table 69 for timing details.
To program and verify the ATtiny26 in the serial programming mode, the following
sequence is recommended (See four byte instruction formats in Table 61):
1. Power-up sequence:
Apply power between VCC and GND while RESET and SCK are set to “0”. In
some systems, the programmer can not guarantee that SCK is held low during
Power-up. In this case, RESET must be given a positive pulse of at least two
CPU clock cycles duration after SCK has been set to “0”.
2. Wait for at least 20 ms and enable serial programming by sending the Program-
ming Enable serial instruction to pin MOSI.
3. The serial programming instructions will not work if the communication is out of
synchronization. When in synchronize the second byte ($53), will echo back
when issuing the third byte of the Programming Enable instruction. Whether the
echo is correct or not, all 4 bytes of the instruction must be transmitted. If the $53
did not echo back, give RESET a positive pulse and issue a new Programming
Enable command.
4. The Flash is programmed one page at a time. The page size is found in Table 52
on page 109. The memory page is loaded one byte at a time by supplying the 4
LSB of the address and data together with the Load Program Memory Page
instruction. To ensure correct loading of the page, the data low byte must be
loaded before data high byte is applied for given address. The Program Memory
Page is stored by loading the Write Program Memory Page instruction with the 6
MSB of the address. If polling is not used, the user must wait at least tWD_FLASH
before issuing the next page. (See Table 60). Accessing the serial programming
interface before the Flash write operation completes can result in incorrect
programming.
5. The EEPROM array is programmed one byte at a time by supplying the address
and data together with the appropriate Write instruction. An EEPROM memory
location is first automatically erased before new data is written. If polling is not
used, the user must wait at least tWD_EEPROM before issuing the next byte. (See
Table 60). In a chip erased device, no $FFs in the data file(s) need to be
programmed.
6. Any memory location can be verified by using the Read instruction which returns
the content at the selected address at serial output MISO.
7. At the end of the programming session, RESET can be set high to commence
normal operation.
8. Power-off sequence (if needed):
Set RESET to “1”.
Turn VCC power off.
122 ATtiny26(L)
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ATtiny26(L)
Data Polling Flash When a page is being programmed into the Flash, reading an address location within
the page being programmed will give the value $FF. At the time the device is ready for a
new page, the programmed value will read correctly. This is used to determine when the
next page can be written. Note that the entire page is written simultaneously and any
address within the page can be used for polling. Data polling of the Flash will not work
for the value $FF, so when programming this value, the user will have to wait for at least
tWD_FLASH before programming the next page. As a chip-erased device contains $FF in
all locations, programming of addresses that are meant to contain $FF, can be skipped.
See Table 60 for tWD_FLASH value.
Data Polling EEPROM When a new byte has been written and is being programmed into EEPROM, reading the
address location being programmed will give the value $FF. At the time the device is
ready for a new byte, the programmed value will read correctly. This is used to deter-
mine when the next byte can be written. This will not work for the value $FF, but the user
should have the following in mind: As a chip-erased device contains $FF in all locations,
programming of addresses that are meant to contain $FF, can be skipped. This does
not apply if the EEPROM is re-programmed without chip-erasing the device. In this
case, data polling cannot be used for the value $FF, and the user will have to wait at
least tWD_EEPROM before programming the next byte. See Table 60 for tWD_EEPROM value.
Table 60. Minimum Wait Delay before Writing the Next Flash or EEPROM Location
Symbol Minimum Wait Delay
tWD_FLASH 4.5 ms
tWD_EEPROM 9.0 ms
tWD_ERASE 9.0 ms
tWD_FUSE 4.5 ms
SAMPLE
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Table 61. Serial Programming Instruction Set
Instruction Instruction Format Operation
Byte 1 Byte 2 Byte 3 Byte4
Programming Enable 1010 1100 0101 0011 xxxx xxxx xxxx xxxx Enable Serial Programming after
RESET goes low.
Chip Erase 1010 1100 100x xxxx xxxx xxxx xxxx xxxx Chip Erase EEPROM and Flash.
Read Program Memory 0010 H000 xxxx xxaa bbbb bbbb oooo oooo Read H (high or low) data o from
Program memory at word address a:b.
Load Program Memory Page 0100 H000 xxxx xxxx xxxx bbbb iiii iiii Write H (high or low) data i to Program
Memory page at word address b. Data
low byte must be loaded before data
high byte is applied within the same
address.
Write Program Memory Page 0100 1100 xxxx xxaa bbbb xxxx xxxx xxxx Write Program Memory Page at
address a:b.
Read EEPROM Memory 1010 0000 xxxx xxxx xbbb bbbb oooo oooo Read data o from EEPROM memory at
address b.
Write EEPROM Memory 1100 0000 xxxx xxxx xbbb bbbb iiii iiii Write data i to EEPROM memory at
address b.
Read Lock Bits 0101 1000 0000 0000 xxxx xxxx xxxx xxoo Read Lock bits. “0” = programmed, “1”
= unprogrammed. See Table 48 on
page 107 for details.
Write Lock Bits 1010 1100 111x xxxx xxxx xxxx 1111 11ii Write Lock bits. Set bits = “0” to
program Lock bits. See Table 48 on
page 107 for details.
Read Signature Byte 0011 0000 xxxx xxxx xxxx xxbb oooo oooo Read Signature Byte o at address b.
Write Fuse Bits 1010 1100 1010 0000 xxxx xxxx iiii iiii Set bits = “0” to program, “1” to
unprogram. See Table 51 on page
108 for details.
Write Fuse High Bits 1010 1100 1010 1000 xxxx xxxx xxxi iiii Set bits = “0” to program, “1” to
unprogram. See Table 50 on page
108 for details.
Read Fuse Bits 0101 0000 0000 0000 xxxx xxxx oooo oooo Read Fuse bits. “0” = programmed, “1”
= unprogrammed. See Table 51 on
page 108 for details.
Read Fuse High Bits 0101 1000 0000 1000 xxxx xxxx xxxo oooo Read Fuse high bits.
“0” = programmed,
“1” = unprogrammed. See Table 50
on page 108 for details.
Read Calibration Byte 0011 1000 xxxx xxxx 0000 00bb oooo oooo Read Calibration Byte o.
Note: a = address high bits
b = address low bits
H = 0 – Low byte, 1 – High Byte
o = data out
i = data in
x = don’t care
124 ATtiny26(L)
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ATtiny26(L)
MOSI
t OVSH t SHOX tSLSH
SCK
t SHSL
MISO
t SLIV
Table 62. Serial Programming Characteristics, TA = -40°C to 85°C, VCC = 2.7V - 5.5V
(Unless Otherwise Noted)(1)
Symbol Parameter Min Typ Max Units
1/tCLCL Oscillator Frequency (VCC = 2.7 - 5.5 V) 0 8 MHz
tCLCL Oscillator Period (VCC = 2.7 - 5.5 V) 125 ns
1/tCLCL Oscillator Frequency (VCC = 4.5 - 5.5 V) 0 16 MHz
tCLCL Oscillator Period (VCC = 4.5 - 5.5 V) 62.5 ns
(1)
tSHSL SCK Pulse Width High 2 tCLCL ns
tSLSH SCK Pulse Width Low 2 tCLCL(1) ns
tOVSH MOSI Setup to SCK High tCLCL ns
tSHOX MOSI Hold after SCK High 2 tCLCL ns
tSLIV SCK Low to MISO Valid 20 ns
Note: 1. 2 tCLCL for fck < 12 MHz, 3 tCLCL for fck >= 12 MHz
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Electrical Characteristics
Absolute Maximum Ratings*
Operating Temperature.................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature ..................................... -65°C to +150°C age to the device. This is a stress rating only and
functional operation of the device at these or
Voltage on Any Pin except RESET other conditions beyond those indicated in the
with Respect to Ground .............................-0.5V to VCC + 0.5V operational sections of this specification is not
implied. Exposure to absolute maximum rating
Voltage on RESET with Respect to Ground ....-0.5V to +13.0V conditions for extended periods may affect
device reliability.
Maximum Operating Voltage ............................................ 6.0V
DC Characteristics
TA = -40°C to 85°C, VCC = 2.7V to 5.5V (unless otherwise noted)
Symbol Parameter Condition Min. Typ.(1) Max. Units
Except XTAL1 pin and
VIL Input Low Voltage -0.5 0.2VCC V
RESET pins
Except XTAL1 and
VIH Input High Voltage 0.6VCC(3) VCC +0.5 V
RESET pins
XTAL1 pin, External
VIL1 Input Low Voltage -0.5 0.1VCC V
Clock Selected
XTAL1 pin, External
VIH1 Input High Voltage 0.8VCC(3) VCC +0.5 V
Clock Selected
VIL2 Input Low Voltage RESET pin -0.5 0.2VCC V
VIH2 Input High Voltage RESET pin 0.9VCC(3) VCC +0.5 V
VIL3 Input Low Voltage RESET pin as I/O -0.5 0.2VCC V
VIH3 Input High Voltage RESET pin as I/O 0.6VCC(3) VCC +0.5 V
(4)
Output Low Voltage IOL = 20 mA, VCC = 5V 0.7 V
VOL
(Ports A, B) IOL = 10 mA, VCC = 3V 0.5 V
Output High Voltage(5) IOH = -20 mA, VCC = 5V 4.2 V
VOH
(Ports A, B) IOH = -10 mA, VCC = 3V 2.3 V
Input Leakage VCC = 5.5V, pin low
IIL 1 µA
Current I/O Pin (absolute value)
Input Leakage VCC = 5.5V, pin high
IIH 1 µA
Current I/O Pin (absolute value)
RRST Reset Pull-up Resistor 20 100 kΩ
Rpu I/O Pin Pull-up Resistor 20 100 kΩ
126 ATtiny26(L)
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ATtiny26(L)
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External Clock Drive Figure 70. External Clock Drive Waveforms
Waveforms
V IH1
V IL1
128 ATtiny26(L)
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ATtiny26(L)
ADC Characteristics
Table 65. ADC Characteristics, Single Ended Channels, TA = -40°C to 85°C
Symbol Parameter Condition Min Typ Max Units
Resolution Single Ended Conversion 10 Bits
Single Ended Conversion
VREF = 4V, VCC = 4V 1 LSB
ADC clock = 200 kHz
Single Ended Conversion
VREF = 4V, VCC = 4V 2 LSB
ADC clock = 1 MHz
Absolute Accuracy
Single Ended Conversion
(Including INL, DNL, Quantization Error, Gain
VREF = 4V, VCC = 4V
and Offset Error) 1 LSB
ADC clock = 200 kHz
Noise Reduction mode
Single Ended Conversion
VREF = 4V, VCC = 4V
2 LSB
ADC clock = 1 MHz
Noise Reduction mode
Single Ended Conversion
Integral Non-Linearity (INL) VREF = 4V, VCC = 4V 0.5 LSB
ADC clock = 200 kHz
Single Ended Conversion
Differential Non-Linearity (DNL) VREF = 4V, VCC = 4V 0.5 LSB
ADC clock = 200 kHz
Single Ended Conversion
Gain Error VREF = 4V, VCC = 4V 0.75 LSB
ADC clock = 200 kHz
Single Ended Conversion
Offset error VREF = 4V, VCC = 4V 0.5 LSB
ADC clock = 200 kHz
Clock Frequency 50 1000 kHz
Conversion Time 13 260 µs
(1) (2)
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V
VREF Reference Voltage 2.0 AVCC V
VIN Input Voltage GND VREF V
ADC Conversion Output 0 1023 LSB
Input Bandwidth 38.5 kHz
VINT Internal Voltage Reference 2.4 2.7 2.9 V
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ
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Table 66. ADC Characteristics, Differential Channels, TA = -40°C to 85°C
Symbol Parameter Condition Min Typ Max Units
Gain = 1x 10 Bits
Resolution
Gain = 20x 10 Bits
Gain = 1x
VREF = 4V, VCC = 5V 24 LSB
ADC clock = 50 - 200 kHz
Absolute Accuracy
Gain = 20x
VREF = 4V, VCC = 5V 27 LSB
ADC clock = 50 - 200 kHz
Gain = 1x
VREF = 4V, VCC = 5V 1.5 LSB
Integral Non-Linearity (INL) ADC clock = 50 - 200 kHz
(Accuracy after Calibration for Offset and
Gain Error) Gain = 20x
VREF = 4V, VCC = 5V 2 LSB
ADC clock = 50 - 200 kHz
Gain = 1x 2 %
Gain Error
Gain = 20x 2.5 %
Gain = 1x
VREF = 4V, VCC = 5V 4 LSB
ADC clock = 50 - 200 kHz
Offset Error
Gain = 20x
VREF = 4V, VCC = 5V 6 LSB
ADC clock = 50 - 200 kHz
Clock Frequency 50 200 kHz
Conversion Time 26 65 µs
(1) (2)
AVCC Analog Supply Voltage VCC - 0.3 VCC + 0.3 V
VREF Reference Voltage 2.0 AVCC - 0.5 V
VIN Input Voltage GND VCC V
VDIFF Input Differential Voltage 0 VREF/Gain V
ADC Conversion Output 0 1023 LSB
Input Bandwidth 4 kHz
VINT Internal Voltage Reference 2.4 2.7 2.9 V
RREF Reference Input Resistance 32 kΩ
RAIN Analog Input Resistance 100 MΩ
Notes: 1. Minimum for AVCC is 2.7V.
2. Maximum for AVCC is 5.5V.
130 ATtiny26(L)
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ATtiny26(L)
ATtiny26 Typical The following charts show typical behavior. These figures are not tested during manu-
facturing. All current consumption measurements are performed with all I/O pins
Characteristics configured as inputs and with internal pull-ups enabled. A sine wave generator with rail-
to-rail output is used as clock source.
The power consumption in Power-down mode is independent of clock selection.
The current consumption is a function of several factors such as: operating voltage,
operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and
ambient temperature. The dominating factors are operating voltage and frequency.
The current drawn from capacitive loaded pins may be estimated (for one pin) as
CL*VCC*f where CL = load capacitance, VCC = operating voltage and f = average switch-
ing frequency of I/O pin.
The parts are characterized at frequencies higher than test limits. Parts are not guaran-
teed to function properly at frequencies higher than the ordering code indicates.
The difference between current consumption in Power-down mode with Watchdog
Timer enabled and Power-down mode with Watchdog Timer disabled represents the dif-
ferential current drawn by the Watchdog Timer.
Active Supply Current Figure 71. Active Supply Current vs. Frequency (0.1 - 1.0 MHz)
1.4
5.5V
1.2
5.0V
1 4.5V
4.0V
ICC (mA)
0.8 3.3V
3.0V
0.6 2.7V
0.4
0.2
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
131
1477G–AVR–03/05
Figure 72. Active Supply Current vs. Frequency (1 - 20 MHz)
5.5V
20
5.0V
4.5V
15
3.3V
5
3.0V
2.7V
0
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
Figure 73. Active Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
-40°C
12
25°C
85°C
10
8
ICC (mA)
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
132 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 74. Active Supply Current vs. VCC (Internal RC Oscillator, 4 MHz)
ICC (mA)
4
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 75. Active Supply Current vs. VCC (Internal RC Oscillator, 2 MHz)
3.5 85°C
25°C
3 -40°C
2.5
ICC (mA)
1.5
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
133
1477G–AVR–03/05
Figure 76. Active Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
1.2
ICC (mA)
1
0.8
0.6
0.4
0.2
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
20
-40°C
25°C
85°C
15
ICC (mA)
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
134 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 78. Active Supply Current vs. VCC (32 kHz External Oscillator)
60 25°C
50
40
ICC (uA) 30
20
10
0
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Idle Supply Current Figure 79. Idle Supply Current vs. Frequency (0.1 - 1.0 MHz)
5.5V
0.5
5.0V
0.4
4.5V
ICC (mA)
0.3 4.0V
0.2 3.3V
3.0V
2.7V
0.1
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
135
1477G–AVR–03/05
Figure 80. Idle Supply Current vs. Frequency (1 - 20 MHz)
5.5V
10
5.0V
8
4.5V
ICC (mA)
6
4.0V
4
3.3V
2
3.0V
2.7V
0
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
Figure 81. Idle Supply Current vs. VCC (Internal RC Oscillator, 8 MHz)
4
ICC (mA)
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
136 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 82. Idle Supply Current vs. VCC (Internal RC Oscillator, 4 MHz)
ICC (mA)
1.5
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 83. Idle Supply Current vs. VCC (Internal RC Oscillator, 2 MHz)
1
ICC (mA)
0.8
0.6
0.4
0.2
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
137
1477G–AVR–03/05
Figure 84. Idle Supply Current vs. VCC (Internal RC Oscillator, 1 MHz)
0.5
ICC (mA)
0.4
0.3
0.2
0.1
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
85°C
8
-40°C
6
ICC (mA)
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
138 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 86. Idle Supply Current vs. VCC (32 kHz External Oscillator)
20
ICC (uA)
15
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Power-down Supply Current Figure 87. Power-down Supply Current vs. VCC (Watchdog Timer Disabled)
1.4
-40°C
1.2
25°C
ICC (uA)
0.8
0.6
0.4
0.2
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
139
1477G–AVR–03/05
Figure 88. Power-down Supply Current vs. VCC (Watchdog Timer Enabled)
14
12
ICC (uA)
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Standby Supply Current Figure 89. Standby Supply Current vs. VCC (455 kHz Resonator, Watchdog Timer
Disabled)
60
50
40
ICC (uA)
30
20
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
140 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 90. Standby Supply Current vs. V CC (1 MHz Resonator, Watchdog Timer
Disabled)
50
40
ICC (uA)
30
20
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 91. Standby Supply Current vs. V CC (2 MHz Resonator, Watchdog Timer
Disabled)
70
60
50
ICC (uA)
40
30
20
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
141
1477G–AVR–03/05
Figure 92. Standby Supply Current vs. VCC (2 MHz XTAL, Watchdog Timer Disabled)
80
70
60
ICC (uA)
50
40
30
20
10
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 93. Standby Supply Current vs. V CC (4 MHz Resonator, Watchdog Timer
Disabled)
100
80
ICC (uA)
60
40
20
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
142 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 94. Standby Supply Current vs. VCC (4 MHz XTAL, Watchdog Timer Disabled)
100
80
ICC (uA)
60
40
20
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 95. Standby Supply Current vs. V CC (6 MHz Resonator, Watchdog Timer
Disabled)
140
120
100
ICC (uA)
80
60
40
20
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
143
1477G–AVR–03/05
Figure 96. Standby Supply Current vs. VCC (6 MHz XTAL, Watchdog Timer Disabled)
160
140
120
ICC (uA)
100
80
60
40
20
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Pin Pull-up Figure 97. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 5V)
80
60
40
20
0
0 1 2 3 4 5 6
VOP (V)
144 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 98. I/O Pin Pull-up Resistor Current vs. Input Voltage (VCC = 2.7V)
-40°C
60
50
IOP (uA)
40
30
20
10
0
0 0.5 1 1.5 2 2.5 3
VOP (V)
Figure 99. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 5V)
-40°C 25°C
100
85°C
80
IRESET (uA)
60
40
20
VRESET (V)
145
1477G–AVR–03/05
Figure 100. Reset Pull-up Resistor Current vs. Reset Pin Voltage (VCC = 2.7V)
IRESET (uA)
30
20
10
0
0 0.5 1 1.5 2 2.5 3
VRESET (V)
Pin Driver Strength Figure 101. I/O Pin Source Current vs. Output Voltage (VCC = 5V)
80
-40°C
70
25°C
60
85°C
IOH (mA)
50
40
30
20
10
0
0 1 2 3 4
VOH (V)
146 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 102. I/O Pin Source Current vs. Output Voltage (VCC = 2.7V)
-40°C
25
25°C
20
85°C
IOH (mA)
15
10
0
0 0.5 1 1.5 2 2.5 3
VOH (V)
Figure 103. I/O Pin Sink Current vs. Output Voltage (VCC = 5V)
70
25°C
60
85°C
IOL (mA)
50
40
30
20
10
0
0 0.5 1 1.5 2 2.5
VOL (V)
147
1477G–AVR–03/05
Figure 104. I/O Pin Sink Current vs. Output Voltage (VCC = 2.7V)
25°C
25
85°C
20
IOL (mA) 15
10
0
0 0.5 1 1.5 2 2.5
VOL (V)
Figure 105. Reset Pin as I/O – Source Current vs. Output Voltage (VCC = 5V)
25°C
1
85°C
Current (mA)
0.8
0.6
0.4
0.2
0
0 1 2 3
VOH (V)
148 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 106. Reset Pin as I/O – Source Current vs. Output Voltage (VCC = 2.7V)
-40°C
2
25°C
Current (mA)
1.5
85°C
0.5
0
0 0.5 1 1.5 2 2.5 3
VOH (V)
Figure 107. Reset Pin as I/O –Sink Current vs. Output Voltage (VCC = 5V)
10
25°C
85°C
Current (mA)
0
0 0.5 1 1.5 2 2.5
VOL (V)
149
1477G–AVR–03/05
Figure 108. Reset Pin as I/O – Sink Current vs. Output Voltage (VCC = 2.7V)
3.5
25°C
3
85°C
Current (mA)
2.5
1.5
0.5
0
0 0.5 1 1.5 2 2.5
VOL (V)
Pin Thresholds and Figure 109. I/O Pin Input Threshold Voltage vs. VCC (VIH, I/O Pin Read as “1”)
Hysteresis
-40°C
2
85°C
25°C
Threshold (V)
1.5
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
150 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 110. I/O Pin Input Threshold Voltage vs. VCC (VIL, I/O Pin Read as “0”)
-40°C
1.5
25°C
85°C
Threshold (V)
1
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
0.7
0.6
85°C
25°C
0.5
-40°C
Threshold (V)
0.4
0.3
0.2
0.1
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
151
1477G–AVR–03/05
Figure 112. Reset Pin as I/O – Input Threshold Voltage vs. VCC
(VIH, Reset Pin Read as “1”)
-40°C
2 85°C
25°C
Threshold (V)
1.5
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 113. Reset Pin as I/O – Input Threshold Voltage vs. VCC
(VIL, Reset Pin Read as “0”)
-40°C
Threshold (V)
1.5
25°C
85°C
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
152 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
0.7
0.6
85°C
-40°C
0.5
25°C
Threshold (V)
0.4
0.3
0.2
0.1
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
Figure 115. Reset Input Threshold Voltage vs. VCC (VIH, Reset Pin Read as “1”)
2
Threshold (V)
1.5
-40°C
25°C
85°C
1
0.5
0
1.5 2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
153
1477G–AVR–03/05
Figure 116. Reset Input Threshold Voltage vs. VCC (VIL, Reset Pin Read as “0”)
Threshold (V)
1.5
85°C
1
25°C
-40°C
0.5
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
0.4
0.35
Threshold (V)
0.3
0.25
25°C
0.2
0.15
0.1
85°C
0.05
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
154 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
BOD Thresholds and Analog Figure 118. BOD Thresholds vs. Temperature (BOD Level is 4.0V)
Comparator Offset
4.2
Rising VCC
Threshold (V)
4.1
4
Falling VCC
3.9
3.8
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (C)
Rising VCC
Threshold (V)
2.9
2.8
Falling VCC
2.7
2.6
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature (C)
155
1477G–AVR–03/05
Figure 120. Bandgap Voltage vs. VCC
1.236
1.234
-40°C
1.232 85°C
1.23 25°C
1.226
1.224
1.222
1.22
1.218
1.216
2.5 3 3.5 4 4.5 5 5.5
Vcc (V)
Figure 121. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC= 5.0V)
0.008
Comparator Offset Voltage (V)
0.007
0.006
0.005
-40°C
0.004
25°C
0.003
85°C
0.002
0.001
0
0 1 2 3 4
Common Mode Voltage (V)
156 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Figure 122. Analog Comparator Offset Voltage vs. Common Mode Voltage (VCC= 2.7V)
0.008
0.006
0.005
0.004
-40°C
0.003 25°C
85°C
0.002
0.001
0
0 0.5 1 1.5 2 2.5 3
Common Mode Voltage (V)
Internal Oscillator Speed Figure 123. Watchdog Oscillator Frequency vs. VCC
1.4
1.35
-40°C
25°C
1.3 85°C
FRC (MHz)
1.25
1.2
1.15
1.1
1.05
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
157
1477G–AVR–03/05
Figure 124. Calibrated 8 MHz RC Oscillator Frequency vs. Temperature
8.9
8.4
7.9
FRC (MHz)
5.0V
7.4
3.5V
6.9
2.7V
6.4
-60 -40 -20 0 20 40 60 80 100
Ta (˚C)
8.5
-40°C
8 25°C
FRC (MHz)
85°C
7.5
6.5
6
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
158 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
17.5
15.5
13.5
FRC (MHz)
11.5
9.5
7.5
5.5
3.5
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240
OSCCAL VALUE
4.3
4.2
4.1
4
FRC (MHz)
3.9
5.0V
3.8
3.5V
3.7
3.6
2.7V
3.5
3.4
-60 -40 -20 0 20 40 60 80 100
Ta (˚C)
159
1477G–AVR–03/05
Figure 128. Calibrated 4 MHz RC Oscillator Frequency vs. VCC
4.4
4.3
4.2
-40°C
4.1
25°C
4
FRC (MHz)
85°C
3.9
3.8
3.7
3.6
3.5
3.4
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
9.6
8.6
7.6
6.6
FRC (MHz)
5.6
4.6
3.6
2.6
1.6
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240
OSCCAL VALUE
160 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
2.15
2.1
2.05
FRC (MHz)
1.95
5.0V
1.9
3.5V
1.85
2.7V
1.8
1.75
-60 -40 -20 0 20 40 60 80 100
Ta (˚C)
2.15
2.1
-40°C
2.05
25°C
2
85°C
FRC (MHz)
1.95
1.9
1.85
1.8
1.75
1.7
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
161
1477G–AVR–03/05
Figure 132. Calibrated 2 MHz RC Oscillator Frequency vs. Osccal Value
4.3
3.8
3.3
FRC (MHz)
2.8
2.3
1.8
1.3
0.8
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240
OSCCAL VALUE
1.04
1.02
1
FRC (MHz)
0.98
5.0V
0.96
3.5V
0.94
0.92 2.7V
0.9
-60 -40 -20 0 20 40 60 80 100
VCC (V)
162 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
1.1
1.05
-40°C
25°C
1
85°C
FRC (MHz)
0.95
0.9
0.85
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
1.8
1.6
1.4
FRC (MHz)
1.2
0.8
0.6
0.4
0 16 32 48 64 80 96 112 128 144 160 176 192 208 224 240
OSCCAL VALUE
163
1477G–AVR–03/05
Current Consumption of Figure 136. Brown-out Detector Current vs. VCC
Peripheral Units
0.035
0.03
0.025
-40°C
0.02
ICC (mA) 25°C
0.015
85°C
0.01
0.005
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
-40°C
200 25°C
85°C
150
ICC (uA)
100
50
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
164 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
250
-40°C
200 25°C
85°C
150
ICC (uA)
100
50
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
120
100 85°C
25°C
80 -40°C
ICC (uA)
60
40
20
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
165
1477G–AVR–03/05
Figure 140. Programming Current vs. VCC
4
-40°C
3 25°C
ICC (mA)
85°C
2
0
2 2.5 3 3.5 4 4.5 5 5.5
VCC (V)
3 5.5V
5.0V
2.5
4.5V
2 4.0V
ICC (mA)
3.3V
1.5
3.0V
2.7V
1
0.5
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Frequency (MHz)
166 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
18
5.5V
16
14 5.0V
12 4.5V
ICC (mA)
10 4.0V
8
3.3V
6 3.0V
2.7V
4
0
0 2 4 6 8 10 12 14 16 18 20
Frequency (MHz)
1200
1000 85°C
25°C
800
Pulsewidth (ns)
-40°C
600
400
200
0
0 1 2 3
VCC (V)
167
1477G–AVR–03/05
Register Summary
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page
$3F ($5F) SREG I T H S V N Z C 9
$3E ($5E) Reserved
$3D ($5D) SP SP7 SP6 SP5 SP4 SP3 SP2 SP1 SP0 10
$3C ($5C) Reserved
$3B ($5B) GIMSK - INT0 PCIE1 PCIE0 - - - - 58
$3A ($5A) GIFR - INTF0 PCIF - - - - - 59
$39 ($59) TIMSK - OCIE1A OCIE1B - - TOIE1 TOIE0 - 59
$38 ($58) TIFR - OCF1A OCF1B - - TOV1 TOV0 - 60
$37 ($57) Reserved
$36 ($56) Reserved
$35 ($55) MCUCR - PUD SE SM1 SM0 - ISC01 ISC00 36
$34 ($54) MCUSR - - - - WDRF BORF EXTRF PORF 35
$33 ($53) TCCR0 - - - - PSR0 CS02 CS01 CS00 66
$32 ($52) TCNT0 Timer/Counter0 (8-Bit) 67
$31 ($51) OSCCAL Oscillator Calibration Register 28
$30 ($50) TCCR1A COM1A1 COM1A0 COM1B1 COM1B0 FOC1A FOC1B PWM1A PWM1B 70
$2F ($4F) TCCR1B CTC1 PSR1 - - CS13 CS12 CS11 CS10 71
$2E ($4E) TCNT1 Timer/Counter1 (8-Bit) 72
$2D ($4D) OCR1A Timer/Counter1 Output Compare Register A (8-Bit) 72
$2C ($4C) OCR1B Timer/Counter1 Output Compare Register B (8-Bit) 73
$2B ($4B) OCR1C Timer/Counter1 Output Compare Register C (8-Bit) 73
$2A ($4A) Reserved
$29 ($49) PLLCSR - - - - - PCKE PLLE PLOCK
$28 ($48) Reserved
$27 ($47) Reserved
$26 ($46) Reserved
$25 ($45) Reserved
$24 ($44) Reserved
$23 ($43) Reserved
$22 ($42) Reserved
$21 ($41) WDTCR - - - WDCE WDE WDP2 WDP1 WDP0 78
$20 ($40) Reserved
$1F ($3F) Reserved
$1E ($3E) EEAR - EEAR6 EEAR5 EEAR4 EEAR3 EEAR2 EEAR1 EEAR0 17
$1D ($3D) EEDR EEPROM Data Register (8-Bit) 18
$1C ($3C) EECR - - - - EERIE EEMWE EEWE EERE 18
$1B ($3B) PORTA PORTA7 PORTA6 PORTA5 PORTA4 PORTA3 PORTA2 PORTA1 PORTA0
$1A ($3A) DDRA DDA7 DDA6 DDA5 DDA4 DDA3 DDA2 DDA1 DDA0
$19 ($39) PINA PINA7 PINA6 PINA5 PINA4 PINA3 PINA2 PINA1 PINA0
$18 ($38) PORTB PORTB7 PORTB6 PORTB5 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0
$17 ($37) DDRB DDB7 DDB6 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0
$16 ($36) PINB PINB7 PINB6 PINB5 PINB4 PINB3 PINB2 PINB1 PINB0
$15 ($35) Reserved
$14 ($34) Reserved
$13 ($33) Reserved
$12 ($32) Reserved
$11 ($31) Reserved
$10 ($30) Reserved
$0F ($2F) USIDR Universal Serial Interface Data Register (8-Bit) 81
$0E ($2E) USISR USISIF USIOIF USIPF USIDC USICNT3 USICNT2 USICNT1 USICNT0 81
$0D ($2D) USICR USISIE USIOIE USIWM1 USIWM0 USICS1 USICS0 USICLK USITC 82
$0C ($2C) Reserved
$0B ($2)B Reserved
$0A ($2A) Reserved
$09 ($29) Reserved
$08 ($28) ACSR ACD ACBG ACO ACI ACIE ACME ACIS1 ACIS0 91
$07 ($27) ADMUX REFS1 REFS0 ADLAR MUX4 MUX3 MUX2 MUX1 MUX0 101
$06 ($26) ADCSR ADEN ADSC ADFR ADIF ADIE ADPS2 ADPS1 ADPS0 103
$05 ($25) ADCH ADC Data Register High Byte 104
$04 ($24) ADCL ADC Data Register Low Byte 104
… Reserved
$00 ($20) Reserved
168 ATtiny26(L)
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ATtiny26(L)
169
1477G–AVR–03/05
Instruction Set Summary (Continued)
Mnemonic Operands Description Operation Flags # Clocks
LD Rd, Y Load Indirect Rd ← (Y) None 2
LD Rd, Y+ Load Indirect and Post-inc. Rd ← (Y), Y ← Y + 1 None 2
LD Rd, -Y Load Indirect and Pre-dec. Y ← Y - 1, Rd ← (Y) None 2
LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2
LD Rd, Z Load Indirect Rd ← (Z) None 2
LD Rd, Z+ Load Indirect and Post-inc. Rd ← (Z), Z ← Z + 1 None 2
LD Rd, -Z Load Indirect and Pre-dec. Z ← Z - 1, Rd ← (Z) None 2
LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2
LDS Rd, k Load Direct from SRAM Rd ← (k) None 2
ST X, Rr Store Indirect (X) ← Rr None 2
ST X+, Rr Store Indirect and Post-inc. (X) ← Rr, X ← X + 1 None 2
ST -X, Rr Store Indirect and Pre-dec. X ← X - 1, (X) ← Rr None 2
ST Y, Rr Store Indirect (Y) ← Rr None 2
ST Y+, Rr Store Indirect and Post-inc. (Y) ← Rr, Y ← Y + 1 None 2
ST -Y, Rr Store Indirect and Pre-dec. Y ← Y - 1, (Y) ← Rr None 2
STD Y+q, Rr Store Indirect with Displacement (Y + q) ← Rr None 2
ST Z, Rr Store Indirect (Z) ← Rr None 2
ST Z+, Rr Store Indirect and Post-inc. (Z) ← Rr, Z ← Z + 1 None 2
ST -Z, Rr Store Indirect and Pre-dec. Z ← Z - 1, (Z) ← Rr None 2
STD Z+q, Rr Store Indirect with Displacement (Z + q) ← Rr None 2
STS k, Rr Store Direct to SRAM (k) ← Rr None 2
LPM Load Program Memory R0 ← (Z) None 3
LPM Rd, Z Load Program Memory Rd ← (Z) None 3
IN Rd, P In Port Rd ← P None 1
OUT P, Rr Out Port P ← Rr None 1
PUSH Rr Push Register on Stack STACK ← Rr None 2
POP Rd Pop Register from Stack Rd ← STACK None 2
BIT AND BIT-TEST INSTRUCTIONS
SBI P, b Set Bit in I/O Register I/O(P,b) ← 1 None 2
CBI P, b Clear Bit in I/O Register I/O(P,b) ← 0 None 2
LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1
LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1
ROL Rd Rotate Left through Carry Rd(0) ← C, Rd(n+1) ← Rd(n), C ← Rd(7) Z,C,N,V 1
ROR Rd Rotate Right through Carry Rd(7) ← C, Rd(n) ← Rd(n+1), C ← Rd(0) Z,C,N,V 1
ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n = 0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0) ← Rd(7..4), Rd(7..4) ← Rd(3..0) None 1
BSET s Flag Set SREG(s) ← 1 SREG(s) 1
BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1
BST Rr, b Bit Store from Register to T T ← Rr(b) T 1
BLD Rd, b Bit Load from T to Register Rd(b) ← T None 1
SEC Set Carry C←1 C 1
CLC Clear Carry C←0 C 1
SEN Set Negative Flag N←1 N 1
CLN Clear Negative Flag N←0 N 1
SEZ Set Zero Flag Z←1 Z 1
CLZ Clear Zero Flag Z←0 Z 1
SEI Global Interrupt Enable I←1 I 1
CLI Global Interrupt Disable I←0 I 1
SES Set Signed Test Flag S←1 S 1
CLS Clear Signed Test Flag S←0 S 1
SEV Set Two’s Complement Overflow V←1 V 1
CLV Clear Two’s Complement Overflow V←0 V 1
SET Set T in SREG T←1 T 1
CLT Clear T in SREG T←0 T 1
SEH Set Half-carry Flag in SREG H←1 H 1
CLH Clear Half-carry Flag in SREG H←0 H 1
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep function) None 1
WDR Watchdog Reset (see specific descr. for WDR/timer) None 1
170 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Ordering Information
Speed (MHz) Power Supply Ordering Code Package(1) Operational Range
ATtiny26L-8PC 20P3
Commercial
ATtiny26L-8SC 20S
(0°C to 70°C)
ATtiny26L-8MC 32M1-A
ATtiny26L-8PI 20P3
8 2.7 - 5.5V ATtiny26L-8SI 20S
ATtiny26L-8MI 32M1-A Industrial
ATtiny26L-8PU(2) 20P3 (-40°C to 85°C)
ATtiny26L-8SU(2) 20S
ATtiny26L-8MU(2) 32M1-A
ATtiny26-16PC 20P3 Commercial
ATtiny26-16SC 20S
(0°C to 70°C)
ATtiny26-16MC 32M1-A
ATtiny26-16PI 20P3
16 4.5 - 5.5V ATtiny26-16SI 20S
ATtiny26-16MI 32M1-A Industrial
ATtiny26-16PU(2) 20P3 (-40°C to 85°C)
ATtiny26-16SU(2) 20S
ATtiny26-16MU(2) 32M1-A
Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information
and minimum quantities.
2. Pb-free packaging alternative, complies to the European Directive for Restriction of Hazardous Substances (RoHS direc-
tive). Also Halide free and fully Green.
Package Type
20P3 20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
20S 20-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
32M1-A 32-pad, 5 x 5 x 1.0 body, Lead Pitch 0.50 mm Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF)
171
1477G–AVR–03/05
Packaging Information
20P3
D
PIN
1
E1
SEATING PLANE
A1
L
B
B1
e
COMMON DIMENSIONS
(Unit of Measure = mm)
C
SYMBOL MIN NOM MAX NOTE
eC
eB A – – 5.334
A1 0.381 – –
D 25.493 – 25.984 Note 2
E 7.620 – 8.255
E1 6.096 – 7.112 Note 2
B 0.356 – 0.559
Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD. B1 1.270 – 1.551
2. Dimensions D and E1 do not include mold Flash or Protrusion. L 2.921 – 3.810
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
C 0.203 – 0.356
eB – – 10.922
eC 0.000 – 1.524
e 2.540 TYP
1/12/04
TITLE DRAWING NO. REV.
2325 Orchard Parkway
20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual 20P3 C
R San Jose, CA 95131 Inline Package (PDIP)
172 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
20S
E H
L
N
A1
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D C 0.0091 0.0125
D 0.4961 0.5118 1
E 0.2914 0.2992 2
Side View
H 0.3940 0.4190
L 0.0160 0.050 3
e 0.050 BSC
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-013, Variation AC for additional information.
2. Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006") per side.
3. Dimension "E" does not include inter-lead Flash or protrusion. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010") per side.
4. "L" is the length of the terminal for soldering to a substrate.
5. The lead width "b", as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm
(0.024") per side. 1/9/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 20S2, 20-lead, 0.300" Wide Body, Plastic Gull A
20S2
R San Jose, CA 95131 Wing Small Outline Package (SOIC)
173
1477G–AVR–03/05
32M1-A
D1
1
0
2
3 Pin 1 ID
E1 E SIDE VIEW
TOP VIEW A3
A2
A1
A
K
0.08 C COMMON DIMENSIONS
P (Unit of Measure = mm)
D2
SYMBOL MIN NOM MAX NOTE
A 0.80 0.90 1.00
1 A1 – 0.02 0.05
P
2 A2 – 0.65 1.00
Pin #1 Notch
(0.20 R) 3
A3 0.20 REF
E2
b 0.18 0.23 0.30
K D 5.00 BSC
D1 4.75 BSC
D2 2.95 3.10 3.25
E 5.00 BSC
b e L
E1 4.75BSC
8/19/04
TITLE DRAWING NO. REV.
2325 Orchard Parkway
32M1-A, 32-pad, 5 x 5 x 1.0 mm Body, Lead Pitch 0.50 mm, 32M1-A D
R San Jose, CA 95131 3.10 mm Exposed Pad, Micro Lead Frame Package (MLF)
174 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
Errata
175
1477G–AVR–03/05
Datasheet Revision Please note that the referring page numbers in this section are referred to this docu-
ment. The referring revision in this section are referring to the document revision.
History
Changes from Rev. 1. MLF-package alternative changed to “Quad Flat No-Lead/Micro Lead Frame
1477F-12/04 to Rev. Package QFN/MLF”.
1477G-03/05
2. Updated “Electrical Characteristics” on page 126
Changes from Rev. 1. Updated Table 16 on page 32, Table 9 on page 27, and Table 29 on page 57.
1477E-10/03 to Rev.
1477F-12/04 2. Added Table 20 on page 39.
6. Updated DC Characteristics for VOL, IIL, IIH, ICC Power Down and VACIO in “Elec-
trical Characteristics” on page 126.
7. Updated VINT, INL and Gain Error in “ADC Characteristics” on page 129 and
page 130. Fixed typo in “Absolute Accuracy” on page 130.
8. Added Figure 106 in “Pin Driver Strength” on page 146, Figure 120, Figure 121
and Figure 122 in “BOD Thresholds and Analog Comparator Offset” on page
155. Updated Figure 117 and Figure 118.
9. Removed LPM Rd, Z+ from “Instruction Set Summary” on page 169. This
instruction is not supported in ATtiny26.
3. Added section “EEPROM Write During Power-down Sleep Mode” on page 19.
176 ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
5. Corrected PLL Lock value in the “Bit 0 – PLOCK: PLL Lock Detector” on page
74.
12. Updated “ADC Characteristics” on page 129 and added Table 66, “ADC Char-
acteristics, Differential Channels, TA = -40°C to 85°C,” on page 130.
14. Added LPM Rd, Z and LPM Rd, Z+ in “Instruction Set Summary” on page 169.
Changes from Rev. 1. Changed the Endurance on the Flash to 10,000 Write/Erase Cycles.
1477B-04/02 to Rev.
1477C-09/02
Changes from Rev. 1. Removed all references to Power Save sleep mode in the section “System
1477A-03/02 to Rev. Clock and Clock Options” on page 22.
1477B-04/02
2. Updated the section “Analog to Digital Converter” on page 94 with more
details on how to read the conversion result for both differential and single-
ended conversion.
177
1477G–AVR–03/05
ATtiny26(L)
Pin Configuration................................................................................. 2
Description ........................................................................................... 3
Block Diagram ...................................................................................................... 4
Pin Descriptions.................................................................................................... 5
Memories ............................................................................................ 15
In-System Programmable Flash Program Memory ............................................ 16
SRAM Data Memory........................................................................................... 16
EEPROM Data Memory...................................................................................... 17
I/O Memory ......................................................................................................... 20
i
1477G–AVR–03/05
Power-down Mode.............................................................................................. 37
Standby Mode..................................................................................................... 38
Minimizing Power Consumption ......................................................................... 39
I/O Ports.............................................................................................. 41
Introduction ......................................................................................................... 41
Ports as General Digital I/O ................................................................................ 42
Alternate Port Functions ..................................................................................... 46
Register Description for I/O Ports ....................................................................... 56
Interrupts ............................................................................................ 57
Interrupt Vectors ................................................................................................. 57
Interrupt Handling ............................................................................................... 58
External Interrupt............................................................................... 62
Pin Change Interrupt........................................................................................... 62
Timer/Counters .................................................................................. 64
Timer/Counter0 Prescaler................................................................................... 64
Timer/Counter1 Prescaler................................................................................... 65
8-bit Timer/Counter0........................................................................................... 65
8-bit Timer/Counter1........................................................................................... 67
Watchdog Timer................................................................................. 78
ii ATtiny26(L)
1477G–AVR–03/05
ATtiny26(L)
iii
1477G–AVR–03/05
iv ATtiny26(L)
1477G–AVR–03/05
Atmel Corporation Atmel Operations
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1477G–AVR–03/05