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    FTI 207 M T: Ii. A S M

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    The document discusses atomic structures of materials. It covers topics like the periodic table of elements, electronegativity of elements, atomic structures of metals, electron configurations of elements from H to Kr, atomic interactions, primary bonds including ionic, covalent and metallic bonding, and secondary bonds including van der Waals and hydrogen bonding. The properties of different bonding types are also summarized.

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    FTI 207 M T: Ii. A S M

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    31 views17 pages
    The document discusses atomic structures of materials. It covers topics like the periodic table of elements, electronegativity of elements, atomic structures of metals, electron configurations of elements from H to Kr, atomic interactions, primary bonds including ionic, covalent and metallic bonding, and secondary bonds including van der Waals and hydrogen bonding. The properties of different bonding types are also summarized.

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    02-AtomicStructuresOfMaterials

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    The document discusses atomic structures of materials. It covers topics like the periodic table of elements, electronegativity of elements, atomic structures of metals, electron configurations of elements from H to Kr, atomic interactions, primary bonds including ionic, covalent and metallic bonding, and secondary bonds including van der Waals and hydrogen bonding. The properties of different bonding types are also summarized.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    31 views17 pages

    FTI 207 M T: Ii. A S M

    Uploaded by

    Y C
    The document discusses atomic structures of materials. It covers topics like the periodic table of elements, electronegativity of elements, atomic structures of metals, electron configurations of elements from H to Kr, atomic interactions, primary bonds including ionic, covalent and metallic bonding, and secondary bonds including van der Waals and hydrogen bonding. The properties of different bonding types are also summarized.

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    of 17

    FTI 207 MATERIAL TEKNIK

    II. ATOMIC STRUCTURES OF MATERIALS

    Widodo Widjaja Basuki


    5 October 2020
    Kampus BSD

    Faculty of Engineering, Atma Jaya Catholic University of Indonesia

    1 Atma Jaya – Catholic


    5 October Widodo
    2020 University Widjaja Basuki – Atomic Structures of Materials
    of Indonesia Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    www.atmajaya.ac.id
    Periodic Table of Elements

    2 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Electronegativity of Elements

    3 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Atomic Structure of metals

    Primary quantum orbits: 1, 2, 3, 4, …


    or K, L, M, N, …

    Secondary quantum orbits; s, p, d, f

    Every atoms attempt to bring the outer


    electron shell (valence shell) in a
    stable energy state (noble gas
    configuration)

    Noble gas (He, Ne, Ar, Kr, Xe, Rn)

    → This is the reason for chemical


    bonding

    4 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Electron Configuration (H – Ar)

    5 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Electron Configuration (K – Kr)

    6 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Atomic Interaction

    𝐹 = 𝐾𝐴 + 𝐾𝑅
    ∞
    𝐸 = න 𝐾 𝑑𝑎
    𝑎
    ∞ ∞
    = න 𝐾𝐴 𝑑𝑎 + න 𝐾𝑅 𝑑𝑎
    𝑎 𝑎
    = 𝐸𝐴 + 𝐸𝑅
    𝑑𝐸
    𝐸𝑚𝑖𝑛 → ≡𝐹=0
    𝑑𝑎
    at 𝑎 = 𝑎0

    7 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Types of atomic bonding

    Primary (or Intramolecular) bonds:

    • Ionic or heteropolar bonding

    • Covalent or homopolar bonding

    • Metallic bonding

    Secondary (Intermolecular) bonds:

    • Van-der-Waals bonding

    8 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Primary Bonds: Ionic or Heteropolar Bonding

    Usually anorganic substances


    Non metal + metal → Ionic bond, usually poor electrical conductors, ionic conductor

    11Na +
    Na Cl Cation with 10 Cl −
    17
    electrons = Ne Anion with 18
    𝐸𝐿, 𝑁𝑎𝐶𝑙 = 8.2 𝑒𝑉 electrons = Ar
    𝐸𝐿, 𝑀𝑔𝑂 = 39.9 𝑒𝑉
    → High melting and boiling points, very high strength, brittle

    1 eV = 1.60218 x 10-19 J
    9 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Sifat-sifat dari Kristal Ion

    ❖ Titik lebur yang tinggi dan keras


    Muatan ion, Radius Ion dan energi kisi
    ❖ Kompresibilitas dan thermal expansion
    Simetri yang tinggi dan gaya elektrostatis yang tinggi
    ❖ Kegetasan

    ❖ Resistensi terhadap korosi


    Oxid metal merupakan ikatan yang stabil (ion metal dan O2- ion)
    Tahan terhadap oksidasi pada temp. tinggi
    ❖ Isolator elektris dan panas
    ❖ Transmisi sinar (single crystal Al2O3, NaCl), Gaya elektrostatis yang tinggi

    10 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Primary Bonds: Covalent or Homopolar Bonding

    Organic and anorganic substances


    Non metal + non metal → covalent bond, electrical insulators (beside graphite)

    Diatomic Polymers
    𝐻2 , 𝑁2 , 𝑂2 , PE (𝐶2 𝐻2 )
    𝐹2 𝐶𝑙2 , … PTFE (𝐶2 𝐹2 )
    …
    Diamond, …
    𝐸𝐵, 𝑠𝑖𝑚𝑝𝑙𝑒 𝑏𝑜𝑛𝑑 ≅ 1.5 − 5 𝑒𝑉
    𝐸𝐵, 𝑑𝑜𝑢𝑏𝑏𝑙𝑒 𝑏𝑜𝑛𝑑 ≅ 5 − 8 𝑒𝑉 Graphite, …
    𝐸𝐵 𝑆𝑖𝐶 ≅ 12.75 𝑒𝑉
    → Melting and boiling points usually lower than those of ionic bonds,
    very high strength, brittle
    At a pressure of 1 atm, graphite and diamond do not have metling or boiling points

    11 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Primary Bonds: Metallic Bonding

    Metal + Metal → metallic bond, good electrical conductors


    (free electrons)

    𝐸𝐵 ≅ 0.64 𝑒𝑉 (Hg) ÷ 8.81 𝑒𝑉 (W)


    → Melting and boiling points lower than those of ionic bonds,
    good mechanical properties (high strength, plastically deformable), good
    thermal and electrical conductivity
    12 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Sifat-sifat Metal
    • Kerapatan yang tinggi
    Kebanyakan metal memiliki kerapatan 6 – 9 gr/cm3
    • Titik lebur
    Tergantung pada besarnya ikatannya
    Mulai dari -39 oC Hg hingga 3410 oC Tungsten
    • Konduktifitas listrik tinggi
    Akan tetapi makin tinggi temperature maka kondiktifitas listrik akan turun
    • Konduktifitas panas yang tinggi
    • Kekuatan
    Makin banyak elektron yang dilepas makin besar gaya elektrostatiknya
    (Coulomb)

    13 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Sifat-sifat Metal
    • Plastisitas dan kegetasan

    • Sifat terhadap cahaya


    Tidak dapat mentransmisi sinar

    14 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Secondary Bonds: Van-der-Waals Bondíng

    • Forming of center of charges (electrostatic attraction)


    • Weak bond between each molecules
    • In polymers, responsible for the cohesion of
    H
    macromolecules
    C

    Polyethylen (−𝐶𝐻2 −)
    𝐸𝐵 ≅ 0.1 𝑒𝑉 (typical)

    15 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Secondary Bonds: Hydrogen Bonding

    • A special case of polar molecule bonding


    • Bonding between molecules, in which H is covalently
    bonded to F (as in HF), O (as in H2O) or N (NH3)

    O
    H

    Formation of water

    𝐸𝐵 is usually higher than Van-del-Waals bonding

    16 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia
    Mixed Bond

    Metals: metallic bond with small portion of covalent bond


    Intermetallic: strong increase of ionic bond

    17 5 October 2020 Widodo Widjaja Basuki – Atomic Structures of Materials Faculty of Engineering, Atma Jaya Catholic University of Indonesia

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