PROBLEM 1.

55
KNOWN: Hot plate-type wafer thermal processing tool based upon heat transfer modes by
conduction through gas within the gap and by radiation exchange across gap.
FIND: (a) Radiative and conduction heat fluxes across gap for specified hot plate and wafer
temperatures and gap separation; initial time rate of change in wafer temperature for each mode, and
(b) heat fluxes and initial temperature-time change for gap separations of 0.2, 0.5 and 1.0 mm for hot
plate temperatures 300 < Th < 1300°C. Comment on the relative importance of the modes and the
influence of the gap distance. Under what conditions could a wafer be heated to 900°C in less than 10
seconds?
SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions for flux calculations, (2) Diameter of hot plate and
wafer much larger than gap spacing, approximating plane, infinite planes, (3) One-dimensional
conduction through gas, (4) Hot plate and wafer are blackbodies, (5) Negligible heat losses from wafer
backside, and (6) Wafer temperature is uniform at the onset of heating.
3
PROPERTIES: Wafer: ρ = 2700 kg/m , c = 875 J/kg⋅K; Gas in gap: k = 0.0436 W/m⋅K.

ANALYSIS: (a) The radiative heat flux between the hot plate and wafer for Th = 600°C and Tw =
20° C follows from the rate equation,

(
q′′rad = σ Th4 − Tw
4
)
= 5.67 × 10−8 W / m 2 ⋅ K 4 (( 600 + 273) 4
− ( 20 + 273)
4
)K 4
= 32.5 kW / m 2 <
The conduction heat flux through the gas in the gap with L = 0.2 mm follows from Fourier’s law,
T − Tw
q′′cond = k h = 0.0436 W / m ⋅ K
( 600 − 20 ) K = 126 kW / m2 <
L 0.0002 m
The initial time rate of change of the wafer can be determined from an energy balance on the wafer at
the instant of time the heating process begins,
⎛ dT ⎞
E& ′′in − E& ′′out = E& ′′st E& ′′st = ρ c d ⎜ w ⎟
⎝ dt ⎠i
where E& ′′out = 0 and E& ′′in = q ′′rad or q ′′cond . Substituting numerical values, find

dTw ⎞ q′′rad 32.5 × 103 W / m 2

dTw ⎞ q′′
⎟ = cond = 68.6 K / s <
dt ⎠i,cond ρ cd

Continued …..
 PROBLEM 1.55 (Cont.)

(b) Using the foregoing equations, the heat fluxes and initial rate of temperature change for each mode
can be calculated for selected gap separations L and range of hot plate temperatures Th with Tw =
20°C.

400 200

Initial rate of change, dTw/dt (K.s^-1)

200 100

50
100

0
0
300 500 700 900 1100 1300
300 500 700 900 1100 1300
Hot plate temperature, Th (C)
Hot plate temperature, Th (C)
q''rad
q''rad q''cond, L = 1.0 mm
q''cond, L = 1.0 mm q''cond, L = 0.5 mm
q''cond, L = 0.5 mm q''cond, L = 0.2 mm
q''cond, L = 0.2 mm

In the left-hand graph, the conduction heat flux increases linearly with Th and inversely with L as
expected. The radiative heat flux is independent of L and highly non-linear with Th, but does not
approach that for the highest conduction heat rate until Th approaches 1200°C.

The general trends for the initial temperature-time change, (dTw/dt)i, follow those for the heat fluxes.
To reach 900°C in 10 s requires an average temperature-time change rate of 90 K/s. Recognizing that
(dTw/dt) will decrease with increasing Tw, this rate could be met only with a very high Th and the
smallest L.