Atsamw25-Mr210Pb: Ieee 802.11 B/G/N Smartconnect Wi-Fi Module

ATSAMW25-MR210PB
IEEE 802.11 b/g/n SmartConnect Wi-Fi Module
DATASHEET
Description
The Atmel® | SMART SAMW25 module is based on the industry-leading low-

power 2.4GHz IEEE® 802.11 b/g/n Wi-Fi® ATWINC1500 SoC (System on Chip)
combined with the ARM® Cortex®-M0+ based microcontroller technology from
Atmel.
This turnkey system provides an integrated software solution with application and
security protocols such as TLS and integrated network services (TCP/IP stack)
which are all available through Atmel Studio 6 integrated development
environment (IDE). The Atmel SmartConnect modules offer the ideal solutions for
designers seeking to add Wi-Fi connectivity with minimal previous experience in
802.11, IP Stack, or RF. Atmel SmartConnect Wi-Fi opens the door of the
Internet of Things (IoT) to the vast array of battery-powered devices and
applications requiring the integration of WLAN connectivity without compromising
on cost or power consumption. While we compete with other Wi-Fi modules on
size, RF performance, cost, and other characteristics, the Atmel SmartConnect
product family has a distinctive advantage when it comes to power consumption
and power saving modes. The ATSAMW25 device is a standalone end point,
where a complete small application can be executed on the module by itself.
Features
Key features with SAMW25 Wireless connectivity solution:

 Certified Wi-Fi ATWINC1500B-MU-T with SAMD21 MCU
 IEEE 802.11 b/g/n 20MHz (1x1) solution
 Single spatial stream in 2.4GHz ISM band
 Compact footprint: 33.863 x 14.882mm
 Radio:
– Output power - 802.11b /11Mbps: 17dBm ±1dB
– 802.11g /54Mbps: 16dBm ±1dB @ EVM -28dB
– 802.11n /72Mbps: 14dBm ±1dB @ EVM -30dB
 Application processor:
– Atmel SAM D21 ARM Cortex M0+ based microcontroller
– 256KB embedded Flash and 32KB SRAM
– Full-Speed USB Device and embedded Host
Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016
 CryptoAuthentication™ ATECC508 (optional) I/O operating voltage:
2.7 to 3.6V
 Power Amplifier and On-board Switching Regulator operating voltage:
2.7 to 4.3V
 Power states supported:
– Provision (AP/Sniffer) IDLE LISTEN
• IDLE
• SUSPEND
 Extreme low-power, on-chip low-power sleep oscillator
 Serial Host Interface SPI or UART
 Software Upgrade Over-the-Air (OTA)
 FCC, CE, IC, and TELEC Certified; RoHS compliant
 Security protocols; WPA/WPA2 Personal, TLS, and SSL
 Network services; DHCP, DNS, TCP/IP (IPv4), UDP, HTTP, and HTTPS
Target Applications
 IoT applications
 Smart appliances
 Multimedia streaming
 Safety and security
 Home automation
 Consumer electronics
 Industrial automation
2 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

Table of Contents
1 Block Diagram ............................................................................................................... 4

2 Ordering Information and IC Marking ........................................................................... 4
3 Pinout and Package Information .................................................................................. 5
3.1 Pin Description ........................................................................................................................................ 5
3.2 Package Description ............................................................................................................................... 8
4 Electrical Specifications................................................................................................ 9
4.1 Absolute Ratings ..................................................................................................................................... 9
4.2 Recommended Operating Conditions ................................................................................................... 10
4.3 DC Electrical Characteristics ................................................................................................................. 10
5 Application and Core Subsystems ............................................................................. 11

5.1 Host Processor ...................................................................................................................................... 11
5.1.1 Host MCU Description .............................................................................................................. 11
5.1.2 Host MCU Key Features ........................................................................................................... 11
5.2 Wi-Fi Core Processor ............................................................................................................................ 11
5.2.1 Memory Subsystem .................................................................................................................. 12
5.2.2 Non-volatile Memory (eFuse).................................................................................................... 12
6 WLAN Subsystem ........................................................................................................ 13

6.1 MAC ................................................................................................................................................. 13
6.1.1 Features ................................................................................................................................... 13
6.1.2 Description................................................................................................................................ 13
6.2 PHY ................................................................................................................................................. 14
6.2.1 Features ................................................................................................................................... 14
6.2.2 Description................................................................................................................................ 14
6.3 Radio ................................................................................................................................................. 14
6.3.1 Receiver Performance .............................................................................................................. 14
6.3.2 Transmitter Performance .......................................................................................................... 16
7 Recommended Reflow Profile .................................................................................... 17

8 Module Schematic ....................................................................................................... 18
9 Bill of Materials (BOM)................................................................................................. 20
10 Application Schematic ................................................................................................ 21
11 Design Guidelines ....................................................................................................... 22
12 Reference Documentation and Support ..................................................................... 23
12.1 Reference Documents ........................................................................................................................... 23
12.2 Related Documents ............................................................................................................................... 23
13 Revision History .......................................................................................................... 24
ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 3

1 Block Diagram
Figure 1-1. ATSAMW25 Block Diagram
2 Ordering Information and IC Marking

Table 2-1. Ordering Details
Atmel ordering code Package
ATSAMW25-MR210PB ATWINC1500 + SAM D21 module. Tray Packing.

ATSAMW25-MR510PA ATWINC1500 + SAM D21 + ATECC508 module. Tray Packing.
ATSAMW25-XPRO Xplained board evaluation kit

3 Pinout and Package Information
3.1 Pin Description
Figure 3-1. Pin Assignment

Table 3-1. Pin Description
Pin # Pin description I/O type Function (default) Programmable

pull-up/-down
resistor
1 GND N/A Common ground

2 UART_TxD ATWINC1500 output Currently used only for Atmel de- Yes – pull-up
bug. Not for customer use. Leave
unconnected.
3 UART_RxD ATWINC1500 input Currently used only for Atmel de- Yes – pull-up
unconnected.
4 Wi-Fi Chip_En ATWINC1500 input Currently used only for Atmel de- No
unconnected.
5 Wi-Fi GPIO_1/RTC ATWINC1500 I/O ATWINC1500 General purpose I/O. Yes – pull-up
Can also be used to input a
32.768KHz Real Time Clock for ac-
curate timing of Wi-Fi sleep intervals
6 Wi-Fi GPIO_3 - ATWINC1500 General purpose I/O Yes – pull-up
7 VBAT Power Supply for Wi-Fi RF Power Amplifier
and Internal 1.3V Switching Regula-
tor
8 PA16 See SAM D21G datasheet See SAM D21G datasheet Yes
10 GND Power Ground
17 GND Power Ground
18 PA24/USB_DM See SAM D21G datasheet Host Interface USB Data minus pin Yes
19 PA25/USB_DP See SAM D21G datasheet Host Interface USB Data Plus pin Yes
20 GND Power Ground
21 VCC Power Power supply for I/O
22 PB22 See SAM D21G datasheet See SAM D21G datasheet Yes
24 RESET_N Input see SAM D21G System Reset. Low level on this pin Yes
datasheet resets the entire module.
25 PA30/SWCLK See SAM D21G datasheet Cortex Serial Wire Debug Interface Yes
CLK

Pin # Pin description I/O type Function (default) Programmable
pull-up/-down
resistor
26 PA31/SWDIO See SAM D21G datasheet Cortex Serial Wire Debug Interface Yes
Data I/O
29 PA00/GPIO/XIN32 See SAM D21G datasheet See SAM D21G datasheet Yes
30 PA01/GPIO/XOUT32 See SAM D21G datasheet See SAM D21G datasheet Yes
31 PA02 I/O See SAM D21G datasheet Yes
32 GND Power Ground Yes
42 GND Power Ground
45 Wi-Fi GPIO_4 ATWINC1500 I/O ATWINC1500 General purpose I/O Yes – pull-up
48 Wi-Fi I2C_SCL ATWINC1500 I/O Currently used only for Atmel de- Yes – pull-up
unconnected.
49 Wi-Fi I2C_SDA ATWINC1500 I/O Currently used only for Atmel de- Yes – pull-up
unconnected.
50 Wi-Fi Reset_n ATWINC1500 Input Currently used only for Atmel de- No
unconnected.
51 GND Power Ground

3.2 Package Description
The ATSAMW25-MR210PB package information.
Figure 3-2. SAMW25 MR210PB Package
TOP VIEW
SHIELD
SIDE VIEW
SHIELD
NOTE: GND PADS MUST BE

SOLDERED TO GND.
P1
P51
NOTE: GND PADS MUST
BE SOLDERED TO
SYSTEM GND.
GND GND GND GND
GND GND
GND GND
P1
SOLDER PADS FOOTPRINT - TOP VIEW

Untoleranced
Dimensions
BOTTOM VIEW ATSAMW25-MR210

4 Electrical Specifications
4.1 Absolute Ratings

All typical values are measured at T = 25°C unless otherwise specified. All minimum and maximum values are
valid across operating temperature and voltage unless otherwise specified.
Table 4-1. Absolute Maximum Ratings
Parameters Minimum Maximum Unit
VBAT power supply voltage 0 5.0

VCC power supply voltage 0 3.63 V
Pin voltage with respect to GND and VCC GND-0.3 VCC+0.3
Storage temperature range -40 +125 °C
Table 4-2. General Operating Ratings
Parameters Minimum Typical Maximum Unit
VBATT 3.0 3.6 4.3

VCC 2.7 3.30 3.6 °C
Operating temperature range -40 25 85
Table 4-3. Physical Characteristics
Parameters Value Comments
Size 33.863 x 14.882mm -

Connector pins pitch See module footprint -
Table 4-4. I/O Pins Characteristics
Characteristic Minimum Typical Maximum Unit
Input Low Voltage VIL -0.30 0.65

Input High Voltage VIH VCC-0.60 VCC+0.30
V
Output Low Voltage VOL 0.45
Output High Voltage VOH VCC-0.50
Output Loading 20
pF
Digital Input Load 6
Pull-up Resistor 76K 90K 104K Ω
I/O pin characteristics for pins 5, 45, 46, and 47 (for all other I/O, see the SAM D21G datasheet).

4.2 Recommended Operating Conditions
Table 4-5. Recommended Operating Conditions
Characteristic Symbol Minimum Typical Maximum Unit
I/O supply voltage VCC 2.7 3.3 3.6

V
Battery supply voltage VBATT 3.0 3.6 4.3
Operating temperature -40 85 ºC
Notes: 1. I/O supply voltage is applied to the following pins: VDDIO_A and VDDIO.
2. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, and VBATT_BUCK.
4.3 DC Electrical Characteristics

Table 4-6 provides the DC characteristics for the ATSAMW25 digital pads.
Table 4-6. DC Electrical Characteristics
Characteristic Minimum Maximum Unit
Input Low Voltage VIL -0.30 0.65

Input High Voltage VIH VCC-0.60 VCC+0.30
V
Output Low Voltage VOL 0.45
Output High Voltage VOH VCC-0.50
Output Loading 20
pF
Digital Input Load 6
Pad Drive Strength (regular pads1) 8 13.5
mA
Pad Drive Strength (high-drive pads1) 16 27
Note: 1. The following are high-drive pads: I2C_SCL, I2C_SDA; all other pads are regular.

5 Application and Core Subsystems
5.1 Host Processor

The Atmel | SMART SAM D ARM Cortex-M0+ based microcontroller (MCU) series builds on decades of
innovation and experience in embedded Flash microcontroller technology. It not only sets a new benchmark for
flexibility and ease-of-use but also combines the performance and energy efficiency of an ARM Cortex-M0+
based MCU with an optimized architecture and peripheral set. The Atmel | SMART SAM D gives you a truly
differentiated general-purpose microcontroller that is ideal for many low-power, cost-sensitive industrial, and
consumer applications.
5.1.1 Host MCU Description

A rich set of peripherals, flexibility, and ease-of-use combined with low power consumption make the Atmel
SAM D21 ideal for a wide range of home automation, consumer, metering, and industrial applications.
 ARM Cortex-M0+ based MCU running up to 48MHz
 256KB embedded Flash and 32KB SRAM
 DMA and Event system
 Six flexible serial communication modules (SERCOM)
 Full-speed USB device and embedded Host
 12-bit ADC (SAM D21G: 14 channels); 10-bit DAC
 Hardware touch support
5.1.2 Host MCU Key Features

 Low power consumption, down to 70µA/MHz
 Enhanced Analog Performance
– ADC with offset and gain correction
– Averaging, oversampling, and decimation
– Flexible DAC
– New low-power internal oscillators
– ±2% accuracy over operating range
 Digital Innovations
– Programmable Event System
– Enhanced TC for Control Applications
– Programmable SERCOM module
– I2C / SPI / USART / LIN2 / IrDA
– Full Speed USB Device and Host
– No external components needed
– 6-12 channel DMA with CRC module
– PTC Hardware touch module
– I2S module with PDM support
5.2 Wi-Fi Core Processor

ATWINC1500B has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions,
including but not limited to association, authentication, power management, security key management, and
MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of
operation, such as STA and AP modes.

5.2.1 Memory Subsystem
The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data
RAM. ATWINC1500B also has 8Mb of flash memory, which can be used for system software. In addition, the
device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to
perform various data management tasks on the TX and RX data packets.
5.2.2 Non-volatile Memory (eFuse)

ATWINC1500B has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset.
This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters,
such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and
other software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank
has the same bit map, which is shown in Figure 5-1. The purpose of the first 80 bits in each bank is fixed, and
the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each
bank can be programmed independently, this allows for several updates of the device parameters following the
initial programming, e.g. updating MAC address. Refer to ATWINC1500B Programming Guide for the eFuse
programming instructions.
Figure 5-1. eFuse Bit Map
1 1 3 4 1
1 7 1 15
MAC ADDR
Reserved
Version
Invalid
Used
Used
TX Gain
Correcti
Offset
Freq.
Used
Used
on
Flags
8 48 8 16
Bank 0 F MAC Addr G FO
Bank 1
Bank 2
Bank 3
Bank 4
Bank 5
128 Bits

6 WLAN Subsystem
The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The
following two subsections describe the MAC and PHY in detail.
6.1 MAC
6.1.1 Features
The ATWINC1500B IEEE802.11 MAC supports the following functions:
 IEEE 802.11b/g/n
 IEEE 802.11e WMM® QoS EDCA/PCF multiple access categories traffic scheduling
 Advanced IEEE 802.11n features:
– Transmission and reception of aggregated MPDUs (A-MPDU)
– Transmission and reception of aggregated MSDUs (A-MSDU)
– Immediate Block Acknowledgement
– Reduced Interframe Spacing (RIFS)
 Support for IEEE802.11i and WFA security with key management
– WEP 64/128
– WPA-TKIP
– 128-bit WPA2 CCMP (AES)
 Support for WAPI security
 Advanced power management
– Standard 802.11 Power Save Mode
– Wi-Fi Alliance WMM-PS (U-APSD)
 RTS-CTS and CTS-self support
 Supports either STA or AP mode in the infrastructure basic service set mode
 Supports independent basic service set (IBSS)
6.1.2 Description
The ATWINC1500B MAC is designed to operate at low power while providing high data throughput. The IEEE
802.11 MAC functions are implemented with a combination of dedicated data path engines, hardwired control
logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a
programmable processor provides optimal power efficiency and real-time response while providing the
flexibility to accommodate evolving standards and future feature enhancements. Dedicated data path engines
are used to implement data path functions with heavy computational. For example, an FCS engine checks the
CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and
decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control
functions, which have real-time requirements, are implemented using hardwired control logic modules. These
logic modules offer real-time response while maintaining configurability via the processor. Examples of
hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX
control, inter-frame spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off
timing, timing synchronization function, and slot management), MPDU handling module, aggregation/de-
aggregation module, block ACK controller (implements the protocol requirements for burst block
communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher
engine, and the DMA interface to the TX/RX FIFOs).ø
The MAC functions implemented solely in software on the microprocessor have the following characteristics:
 Functions with high memory requirements or complex data structures. Examples are association table
management and power save queuing.

 Functions with low computational load or without critical real-time requirements. Examples are
authentication and association.
 Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS
scheduling.
6.2 PHY
6.2.1 Features
The ATWINC1500B IEEE802.11 PHY supports the following functions:
 Single antenna 1x1 stream in 20MHz channels
 Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, and 11Mbps
 Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, and 54Mbps
 Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0,
14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, and 72.2Mbps
 IEEE 802.11n mixed mode operation
 Per packet TX power control
 Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and
frame detection
6.2.2 Description
The ATWINC1500B WLAN PHY is designed to achieve reliable and power-efficient physical layer
communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced
algorithms have been employed to achieve maximum throughput in a real world communication environment
with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC
(Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier
sensing, and clear channel assessment, as well as the automatic gain control.
6.3 Radio
6.3.1 Receiver Performance

Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins
Table 6-1. Receiver Performance
Parameter Description Minimum Typical Maximum Unit
Frequency 2,412 2,484 MHz

1Mbps DSS -98 dBm
Sensitivity 2Mbps DSS -94 dBm

802.11b 5.5Mbps DSS -92 dBm
11Mbps DSS -88 dBm

6Mbps OFDM -90 dBm
9Mbps OFDM -89 dBm
12Mbps OFDM -88 dBm
Sensitivity 18Mbps OFDM -85 dBm

802.11g 24Mbps OFDM -83 dBm
36Mbps OFDM -80 dBm
48Mbps OFDM -76 dBm
54Mbps OFDM -74 dBm
MCS 0 -89 dBm
MCS 1 -87 dBm
MCS 2 -85 dBm
Sensitivity MCS 3 -82 dBm
802.11n
MCS 4 -77 dBm
(BW=20MHz)
MCS 5 -74 dBm
MCS 6 -72 dBm
MCS 7 -70.5 dBm
1-11Mbps DSS 0 dBm
Maximum Receive
6-54Mbps OFDM 0 dBm
Signal Level
MCS 0 – 7 0 dBm
1Mbps DSS (30MHz offset) 50 dB
11Mbps DSS (25MHz offset) 43 dB
Adjacent Channel 6Mbps OFDM (25MHz offset) 40 dB

Rejection 54Mbps OFDM (25MHz offset) 25 dB
MCS 0 – 20MHz BW (25MHz offset) 40 dB
MCS 7 – 20MHz BW (25MHz offset) 20 dB
776-794MHz CDMA -14 dBm
824-849MHz GSM -10 dBm
880-915MHz GSM -10 dBm
Cellular Blocker
1710-1785MHz GSM -15 dBm
Immunity
1850-1910MHz GSM -15 dBm
1850-1910MHz WCDMA -24 dBm
1920-1980MHz WCDMA -24 dBm
Measured at RF pin assuming 50Ω differential; RF performance guaranteed for temperature range -30 to 85ºC. 1dB
derating in performance at -40ºC.

6.3.2 Transmitter Performance
Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins
Table 6-2. Transmitter Performance
Frequency 2,412 2,484 MHz

802.11b 1Mbps 18.5 dBm
802.11b 11Mbps 19.5 dBm
Output Power1, 802.11g 6Mbps 18.5 dBm

ON_Transmit_High_Power Mode 802.11g 54Mbps 16.5 dBm
802.11n MCS 0 17.0 dBm
802.11n MCS 7 14.5 dBm
802.11b 1Mbps 17.0 dBm
802.11b 11Mbps 17.5 dBm
Output Power1, 802.11g 6-18Mbps 16.0 dBm

ON_Transmit_Low_Power Mode 802.11g >18Mbps N/A dBm
802.11n MCS 0-3 14.5 dBm
802.11n >MCS 3 N/A dBm
TX Power Accuracy ±1.52 dB
Carrier Suppression 30.0 dBc
76-108 -125 dBm/Hz
776-794 -125 dBm/Hz
869-960 -125 dBm/Hz
925-960 -125 dBm/Hz
Out of Band Transmit Power
1570-1580 -125 dBm/Hz
1805-1880 -125 dBm/Hz
1930-1990 -125 dBm/Hz
2110-2170 -125 dBm/Hz
2nd -41 dBm/MHz
Harmonic Output Power
3rd -41 dBm/MHz
Notes: 1. Measured at 802.11 spec compliant EVM/Spectral Mask.
2. Measured after RF matching network. See reference design.

7 Recommended Reflow Profile

8 Module Schematic
The ATSAMW25-MR210PB/MR510PB Module schematic is shown in Figure 8-1.
Figure 8-1. ATSAMW25-MR210PB/MR510 Module Schematic

9 Bill of Materials (BOM)

10 Application Schematic
Figure 10-1. Connections for the ATSAMW25
The basic power supply connections for the ATSAMW25 module are shown in Figure 10-1. The test points
shown (TP1 – TP6) should be added in case Atmel is required to debug the design.
The Wi-Fi chip can use its own internal oscillator for a Real Time Clock (RTC) or it can use an external
32.768KHz clock provided on the RTC pin. Using an external clock derived from a crystal oscillator can be
used as a more accurate sleep timer for the Wi-Fi chip than its own internal oscillator. This in turn can reduce
sleep current. If power consumption during sleep is a priority then a 32.768KHz crystal can be added to the
SAM D21 module as shown in the reference design. The design shown above displays a connection from pin
15 (PA22) to pin 5 (GPIO_1).
GPIO_1 is the input pin for the Wi-Fi’s Real Time Clock. PA22 can be configured to output a 32.768KHz RTC
clock – derived from the 32.768KHz crystal - to be used as the source for the Wi-Fi’s RTC. If cost is a priority
versus power consumption, then the 32.768KHz crystal can be left off of the design and the PA22 – GPIO_1
connection can be deleted.

11 Design Guidelines
It is critical to follow the recommendations listed below to achieve the best RF performance:
 When the module is placed on the motherboard, a provision for the antenna must be made. There
should be nothing under the portion of the module which contains the antenna. This means the antenna
should not be placed directly on top of the motherboard PCB. This can be accomplished by, for example,
placing the module at the edge of the board such that the module edge with the antenna extends beyond
the main board edge by 6.5mm. Alternatively, a cutout in the motherboard can be provided under the
antenna. The cutout should be at least 22 x 6.5mm. Ground vias spaced 2.5mm apart should be placed
all around the perimeter of the cutout. No large components should be placed near the antenna.
 Keep away from antenna, as far as possible, large metal objects to avoid electromagnetic field blocking
 Do not enclose the antenna within a metal shield
 Keep any components which may radiate noise or signals within the 2.4 – 2.5GHz frequency band far
away from the antenna, or better yet, shield those components. Any noise radiated from the main board
in this frequency band will degrade the sensitivity of the module.
 The main board should have a solid ground plane. Each ground pin of the module (including each of the
center ground pads) should have a via placed either in the pad or right next to the pad going down to the
ground plane.
 Place a 10µF decoupling capacitor from VBAT to ground right next to pin 7. Place another 10µF
capacitor from VCC to ground right next to pin 21.
 Contact Atmel for assistance if any other placement is required

12 Reference Documentation and Support
12.1 Reference Documents

Atmel offers a set of collateral documentation to ease integration and device ramp.
The following list of documents available on Atmel web or integrated into development tools.
Table 12-1. Reference Documents
Title Content
Datasheet This document

Design Files User Guide, Schematic, PCB layout, Gerber, BOM, and System notes on:
RF/Radio Full Test Report, radiation pattern, design guidelines, temperature perfor-
mance, ESD.
Package How to use package:
Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines.
Platform Getting started Best practices and recommendations to design a board with the product, including:
Guide Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance
matching, using a power amplifier etc.), SPI/UART protocol between Wi-Fi SoC and the
Host MCU.
HW Design Guide Integration guide with clear description of:
High level Arch, overview on how to write a networking application, list all API, parame-
ters and structures.
Features of the device, SPI/handshake protocol between device and host MCU, with
flow/sequence/state diagram, timing.
SW Design Guide Explain in details the flow chart and how to use each API to implement all generic use
cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors manage-
ment, connection/transfer recovery mechanism/state diagram) - usage and sample appli-
cation note.
For a complete listing of development-support tools and documentation, visit http://www.atmel.com/ or contact
the nearest Atmel field representative.
12.2 Related Documents

[1] ATSAM D21 Datasheet:
Web page: http://www.atmel.com/products/microcontrollers/arm/sam-d.aspx?tab=documents.
Document: Atmel SAM D21 Datasheet (.pdf file).
Then select the required device (ATSAMD21E18A) and get the latest datasheet (.pdf file).
[2] ATWINC1500B Datasheet.
[3] ATSAM W25 Network Controller Programming Guide.
[4] ATSAM W25 Starter Kit User Guide.

13 Revision History
Doc Rev. Date Comments
42618B 05/2016 Updated Figure 3-2 with new POD drawing which has PCB footprint and to solder GND
pads.
42618A 11/2015 Initial document release.

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© 2016 Atmel Corporation. / Rev.: Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016.
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Atsamw25-Mr210Pb: Ieee 802.11 B/G/N Smartconnect Wi-Fi Module

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ATSAMW25-MR210PB

IEEE 802.11 b/g/n SmartConnect Wi-Fi Module

The Atmel® | SMART SAMW25 module is based on the industry-leading low-

Key features with SAMW25 Wireless connectivity solution:

2 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

1 Block Diagram ............................................................................................................... 4

5 Application and Core Subsystems ............................................................................. 11

6 WLAN Subsystem ........................................................................................................ 13

7 Recommended Reflow Profile .................................................................................... 17

13 Revision History .......................................................................................................... 24

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 3

2 Ordering Information and IC Marking

Atmel ordering code Package

ATSAMW25-MR210PB ATWINC1500 + SAM D21 module. Tray Packing.

4 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

3.1 Pin Description

Figure 3-1. Pin Assignment

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 5

Pin # Pin description I/O type Function (default) Programmable

1 GND N/A Common ground

6 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 7

Figure 3-2. SAMW25 MR210PB Package

NOTE: GND PADS MUST BE

SOLDER PADS FOOTPRINT - TOP VIEW

8 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

4.1 Absolute Ratings

Table 4-1. Absolute Maximum Ratings

Parameters Minimum Maximum Unit

VBAT power supply voltage 0 5.0

Table 4-2. General Operating Ratings

Parameters Minimum Typical Maximum Unit

VBATT 3.0 3.6 4.3

Table 4-3. Physical Characteristics

Parameters Value Comments

Size 33.863 x 14.882mm -

Table 4-4. I/O Pins Characteristics

Characteristic Minimum Typical Maximum Unit

Input Low Voltage VIL -0.30 0.65

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 9

Table 4-5. Recommended Operating Conditions

Characteristic Symbol Minimum Typical Maximum Unit

I/O supply voltage VCC 2.7 3.3 3.6

4.3 DC Electrical Characteristics

Table 4-6. DC Electrical Characteristics

Characteristic Minimum Maximum Unit

Input Low Voltage VIL -0.30 0.65

10 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

5.1 Host Processor

5.1.1 Host MCU Description

5.1.2 Host MCU Key Features

5.2 Wi-Fi Core Processor

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 11

5.2.2 Non-volatile Memory (eFuse)

Figure 5-1. eFuse Bit Map

12 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET]

ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] 13

6.3.1 Receiver Performance

Table 6-1. Receiver Performance