IS34MW01G084/164

IS35MW01G084/164
1Gb SLC-4b ECC
1.8V X8/X16 NAND FLASH MEMORY STANDARD NAND
INTERFACE
 IS34/35MW01G084/164
1Gb (x8/x16) 1.8V NAND FLASH MEMORY with 4b ECC

FEATURES
 Flexible & Efficient Memory  Efficient Read and Program modes
Architecture - Command/Address/Data Multiplexed I/O
- Memory Cell: 1bit/Memory Cell Interface
- Organization: 128Mb x8 /64Mb x16 - Command Register Operation
- X8: - Automatic Page 0 Read at Power-Up
- Memory Cell Array: (128M + 4M) x 8bit Option;
- Data Register: (2K + 64) x 8bit - Boot from NAND support
- Page Size: (2K + 64) Byte - Automatic Memory Download
- Block Erase: (128K + 4K) Byte - NOP: 4 cycles
- X16: - Cache Program/Read Operation
- - Memory Cell Array: (64M + 2M) x 16bit - Copy-Back Operation
- - Data Register: (1K + 32) x 16bit - EDO mode
- - Page Size: (1K + 32) Byte - OTP operation
- - Block Erase: (64K + 2K) Byte - Bad-Block-Protect

 Highest performance  Advanced Security Protection

- Hardware Data Protection:
- Read Performance:
- Program/Erase Lockout during Power
- Random Read: 25us (Max.)
Transitions
- Serial Access: 45ns (Max.)
- Write Performance:
- Program time: 300us - typical
- Block Erase time: 3ms – typical  Industry Standard Pin-out & Packages
- T =48-pin TSOP 1 (Call Factory)
- B =63-ball VFBGA
 Low Power with Wide Temp. Ranges
- Single 1.8V (1.7V to 1.95V) Voltage
Supply
- 15 mA Active Read Current
- 10 µA Standby Current
- Temp Grades:
- Industrial: -40°C to +85°C
- Extended: -40°C to +105°C
- Automotive, A1: -40°C to +85°C
- Automotive, A2: -40°C to +105°C

 Reliable CMOS Floating Gate

Technology
- ECC Requirement: X8 - 4bit/512Byte
X16 - 4bit/256Word
- Endurance: 100K Program/Erase cycles
- Data Retention: 10 years

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GENERAL DESCRIPTION
The IS34/35MW1G084/164 are 128Mx8/64Mx16 bit with spare 4Mx8/2Mx16 bit capacity. The devices
are offered in 1.8V Vcc Power Supply. Its NAND cell provides the most cost-effective solution for the
solid state mass storage market. The memory is divided into blocks that can be erased independently
so it is possible to preserve valid data while old data is erased.
The device contains 1,024 blocks, composed by 64 pages consisting in two NAND structures of 32
series connected Flash cells. A program operation allows to write the 2,112-Byte page in typical 300us
and an erase operation can be performed in typical 3ms on a 128K-Byte for X8 device block (or 64K-
Word for x16 device block).

Data in the page mode can be read out at 45ns cycle time per Word. The I/O pins serve as the ports for
address and command inputs as well as data input/output.

The copy back function allows the optimization of defective blocks management: when a page program
operation fails, the data can be directly programmed in another page inside the same array section
without the time consuming serial data insertion phase.
The cache program feature allows the data insertion in the cache register while the data register is
copied into the Flash array.
This pipelined program operation improves the program throughput when long files are written inside
the memory. A cache read feature is also implemented. This feature allows to dramatically improving
the read throughput when consecutive pages have to be streamed out. This device includes extra
feature: Automatic Read at Power Up.

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TABLE OF CONTENTS

FEATURES ............................................................................................................................................................ 2
GENERAL DESCRIPTION .................................................................................................................................... 3
TABLE OF CONTENTS ......................................................................................................................................... 4
1. PIN CONFIGURATION ................................................................................................................................... 6
2. PIN DESCRIPTIONS ...................................................................................................................................... 9
3. BLOCK DIAGRAM ........................................................................................................................................ 10
4. OPERATION DESCRIPTION ....................................................................................................................... 14
5. ELECTRICAL CHARACTERISTICS............................................................................................................. 16
5.1 ABSOLUTE MAXIMUM RATINGS (1) ..................................................................................................... 16
5.2 Recommended Operating Conditions .................................................................................................... 16
5.3 DC CHARACTERISTICs ........................................................................................................................ 17
5.4 Valid Block .............................................................................................................................................. 17
5.5 AC Measurement Condition .................................................................................................................... 18
5.6 AC PIN CAPACITANCE (TA = 25°C, VCC=1.8V, 1MHz) ...................................................................... 18
5.7 Mode Selection ....................................................................................................................................... 18
5.8 ROGRAM/ERASE PERFORMANCne .................................................................................................... 19
5.9 AC CHARACTERISTICS for address/ command/data input .................................................................. 19
5.10 AC CHARACTERISTICS for Operation ................................................................................................ 20
6. TIMING DIAGRAMS ..................................................................................................................................... 21
6.1 Command Latch Cycle ........................................................................................................................... 21
6.2 Address Latch Cycle ............................................................................................................................... 21
6.3 Input Data Latch Cycle ........................................................................................................................... 22
6.4 Serial Access Cycle after Read (CLE=L, WE#=H, ALE=L) .................................................................... 22
6.5 Serial Access Cycle after Read (EDO Type CLE=L, WE#=H, ALE=L) .................................................. 23
6.6 Status Read Cycle .................................................................................................................................. 23
6.7 Read Operation (One PAGE) ................................................................................................................. 24
6.8 Read Operation (Intercepted by CE#) .................................................................................................... 24
6.9 Random Data Output In a Page ............................................................................................................. 25
6.10 Page program Operation ...................................................................................................................... 25
6.11 Page Program Operation with Random Data Input .............................................................................. 26
6.12 Copy-Back Operation with Random Data InpuT .................................................................................. 27
6.13 Cache Program Operation .................................................................................................................... 28
6.14 Block Erase Operation .......................................................................................................................... 28
6.15 Cache Read Operation ......................................................................................................................... 29
7. ID Definition Table ........................................................................................................................................ 30
8. DEVICE OPERATION .................................................................................................................................. 32
8.1 Page READ OPERATION ...................................................................................................................... 32
8.2 Page Program ......................................................................................................................................... 34

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8.3 Cache Program ....................................................................................................................................... 35

8.4 Copy-Back Program................................................................................................................................ 36
8.5 Block Erase ............................................................................................................................................. 37
8.6 Read Status ............................................................................................................................................ 37
8.7 Read ID ................................................................................................................................................... 39
8.8 Reset ....................................................................................................................................................... 40
8.9 Cache Read ............................................................................................................................................ 41
8.10 Ready/Busy#......................................................................................................................................... 42
8.11 Data Protection and Power Up Sequence ............................................................................................ 43
8.12 Write Protect Operation ........................................................................................................................ 44
8.13 Read Parameter Page Operation ......................................................................................................... 46
8.14 Read Unique ID Operation ................................................................................................................... 50
8.15 One-Time Programmable (OTP) Operations ........................................................................................ 51
9. INVALID BLOCK AND ERROR MANAGEMENT ......................................................................................... 53
9.1 Mask Out Initial Invalid Block(s)........................................................................................................... 53
9.2 Identifying Initial Invalid Block(s) and Block Replacement Management ............................................... 53
9.3 ERRor in Read or Write operation .......................................................................................................... 55
9.4 Addressing for PROGRAM operation ..................................................................................................... 60
9.5 System Interface Using CE# NOT Care operation ................................................................................. 61
10. PACKAGE TYPE INFORMATION ........................................................................................................... 62
10.1 48-Pin TSOP (TYPE I) Package (T) ..................................................................................................... 62
10.2 63-BALL VFBGA Package (B) .............................................................................................................. 63
11. ORDERING INFORMATION – Valid Part Numbers ................................................................................ 64

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1. PIN CONFIGURATION

48-pin TSOP (Type I)

(1)
NC 1 48 VSS
NC NC
NC NC
NC NC
NC I/O7
NC I/O6
R/B# I/O5
RE# I/O4
CE# NC
(1)
NC VCC
NC NC
VCC 12 37 VCC
VSS 13 36 VSS
NC NC
(1)
NC VCC
CLE NC
ALE I/O3
WE# I/O2
WP# I/O1
NC I/O0
NC NC
NC NC
NC NC
(1)
NC 24 25 VSS

Note:
1. These pins might not be bonded in the package; however it is recommended to connect these pins to the designated
external sources for ONFI compatibility.

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63-ball VFBGA (x8)

Balls Down, Top View

A
A1 A2 A9
10
NC NC NC NC

B
B1 B9
10
NC NC NC

C3 C4 C5 C6 C7 C8

WP# ALE VSS CE# WE# R/B#

D3 D4 D5 D6 D7 D8

NC RE# CLE NC NC NC

E3 E4 E5 E6 E7 E8

NC NC NC NC NC NC

F3 F4 F5 F6 F7 F8
(1)
NC NC NC NC VSS NC

G3 G4 G5 G6 G7 G8
(1)
NC VCC NC NC NC NC

H3 H4 H5 H6 H7 H8

NC I/O0 NC NC NC VCC

J3 J4 J5 J6 J7 J8

NC I/O1 NC VCC I/O5 I/O7

K3 K4 K5 K6 K7 K8

VSS I/O2 I/O3 I/O4 I/O6 VSS

L
L1 L2 L9
10
NC NC NC NC

M
M1 M2 M9
10
NC NC NC NC

Note:
1. These pins might not be bonded in the package; however it is recommended to connect these pins to the designated
external sources for ONFI compatibility.

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63-ball VFBGA (x16)

Balls Down, Top View

A
A1 A2 A9
10
NC NC NC NC

B
B1 B9
10
NC NC NC

C3 C4 C5 C6 C7 C8

WP# ALE VSS CE# WE# R/B#

D3 D4 D5 D6 D7 D8

VCC RE# CLE NC NC NC

E3 E4 E5 E6 E7 E8

NC NC NC NC NC NC

F3 F4 F5 F6 F7 F8

NC NC NC NC VSS NC

G3 G4 G5 G6 G7 G8

NC VCC NC I/O13 I/O15 NC

H3 H4 H5 H6 H7 H8

I/O8 I/O0 I/O10 I/O12 I/O14 VCC

J3 J4 J5 J6 J7 J8

I/O9 I/O1 I/O11 VCC I/O5 I/O7

K3 K4 K5 K6 K7 K8

VSS I/O2 I/O3 I/O4 I/O6 VSS

L
L1 L2 L9
10
NC NC NC NC

M
M1 M2 M9
10
NC NC NC NC

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2. PIN DESCRIPTIONS

Pin Name Pin Function

I/O0 ~ I/O7 (X8) DATA INPUTS/OUTPUTS
I/O0 ~ I/O15 (X16) The I/O pins are used to input command, address and data, and to output data
during read operations. The I/O pins float to high-z when the chip is deselected or
when the outputs are disabled.

CLE COMMAND LATCH ENABLE

The CLE input controls the activating path for commands sent to the internal
command registers. Commands are latched into the command register through the
I/O ports on the rising edge of the WE# signal with CLE high.

ALE ADDRESS LATCH ENABLE

The ALE input controls the activating path for addresses sent to the internal
address registers. Addresses are latched into the address register through the I/O
ports on the rising edge of WE# with ALE high.
CE# CHIP ENABLE
The CE# input is the device selection control. When the device is in the Busy state,
CE# high is ignored, and the device does not return to standby mode in program or
erase operation. Regarding CE# control during read operation, refer to ’Page read’
section of Device operation.

RE# READ ENABLE

The RE# input is the serial data-out control, and when it is active low, it drives the
data onto the I/O bus. Data is valid tREA after the falling edge of RE# which also
increments the internal column address counter by one.
WE# WRITE ENABLE
The WE# input controls writes to the I/O ports. Commands, address and data are
latched on the rising edge of the WE# pulse.

WP# WRITE PROTECT

The WP# pin provides inadvertent write/erase protection during power transitions.
The internal high voltage generator is reset when the WP# pin is active low.

R/B# READY/BUSY OUTPUT

The R/B# output indicates the status of the device operation. When low, it indicates
that a program, erase or random read operation is in progress and returns to high
state upon completion. It is an open drain output and does not float to high-z
condition when the chip is deselected or when outputs are disabled.

VCC POWER
VCC is the power supply for device.
VSS GROUND
N.C. NO CONNECTION
Lead is not internally connected.

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3. BLOCK DIAGRAM

High Voltage

X-Decoder
CE#
Circuit Memory Array
CLE
( One Plane for 1Gb)
ALE
Control
WE#
Logic
IO Port

WP# A12-A27 Page Buffer

RE# Address
Y-Decoder
R/B# Counter A0-A11

IO[7:0] Data Buffer

Figure 3.1 Functional Block Diagram(x8)

Figure 3.2 Array Organization(x8)

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Table 3.1 ARRAY Address (x8)

I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 Address

1st cycle A0 A1 A2 A3 A4 A5 A6 A7 Column Address
2nd cycle A8 A9 A10 A11 *L *L *L *L Column Address
3rd cycle A12 A13 A14 A15 A16 A17 A18 A19 Row Address
4th cycle A20 A21 A22 A23 A24 A25 A26 A27 Row Address

Notes:
1. Column Address: Starting Address of the Register.
2. *L must be set to “Low”.
3. The device ignores any additional input of address cycles than required.
4. A18 is for Plane Address setting.

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High Voltage

X-Decoder
CE#
Circuit Memory Array
CLE
( One Plane for 1Gb)
ALE
Control
WE#
Logic
IO Port

WP# A11-A26 Page Buffer

RE# Address
Y-Decoder
R/B# Counter A0-A10

IO[15:0] Data Buffer

Figure 3.3 Functional Block Diagram(x16)

Figure 3.4 Array Organization(x8)

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Table 3.2 ARRAY Address (x16)

I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 Address

1st cycle A0 A1 A2 A3 A4 A5 A6 A7 Column Address
2nd cycle A8 A9 A10 *L *L *L *L *L Column Address
3rd cycle A11 A12 A13 A14 A15 A16 A17 A18 Row Address
4th cycle A19 A20 A21 A22 A23 A24 A25 A26 Row Address

Notes:
1. Column Address: Starting Address of the Register.
2. *L must be set to “Low”.
3. The device ignores any additional input of address cycles than required.
4. A17 is for Plane Address setting.

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4. OPERATION DESCRIPTION
The IS34/35MW01G084/164 are 1Gbit memory organized as 64K rows (pages) by 2,112x8 columns.
Spare 64x8 columns are located from column address of 2,048~2,111. A 2,112-byte data register is
connected to memory cell arrays accommodating data transfer between the I/O buffers and memory
during page read and page program operations. The program and read operations are executed on a
page basis, while the erase operation is executed on a block basis. The memory array consists of 1,024
separately erasable 128K-byte blocks. It indicates that the bit-by-bit erase operation is prohibited on the
device.
The device has addresses multiplexed into 8 or 16 I/Os. This scheme dramatically reduces pin counts
and allows system upgrades to future densities by maintaining consistency in system board design.
Command, address and data are all written through I/O's by bringing WE# to low while CE# is low. Those
are latched on the rising edge of WE#. Command Latch Enable (CLE) and Address Latch Enable (ALE)
are used to multiplex command and address respectively, via the I/O pins. Some commands require one
bus cycle. For example, Reset Command, Status Read Command, etc require just one cycle bus. Some
other commands, like page read and block erase and page program, require two cycles: one cycle for
setup and the other cycle for execution.

In addition to the enhanced architecture and interface, the device incorporates copy-back program
feature from one page to another page without need for transporting the data to and from the external
buffer memory.

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Table 4.1 Command Set

Function 1st Cycle 2nd Cycle Acceptable Command during

Busy

Read 00h 30h

Read for Copy-Back 00h 35h
Read ID 90h -
Reset FFh - O
Page Program 80h 10h
Copy-Back Program 85h 10h
Block Erase 60h D0h
Random Data Input (1) 85h -
Random Data Output (1) 05h E0h
Read Status 70h - O
Cache Program 80h 15h
Cache Read 31h -
Read Start For Last Page Cache Read 3Fh -

Notes:
1. Random Data Input/Output can be executed in a page.

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5. ELECTRICAL CHARACTERISTICS
5.1 ABSOLUTE MAXIMUM RATINGS (1)

Storage Temperature -65°C to +150°C

Standard Package 240°C 3 Seconds
Surface Mount Lead Soldering Temperature
Lead-free Package 260°C 3 Seconds
Input Voltage with Respect to Ground on All Pins -0.6V to +2.45V
All I/O Voltage with Respect to Ground -0.6V to VCC + 0.3V( < 2.45V)
VCC -0.6V to +2.45V
Short Circuit Current 5mA
Electrostatic Discharge Voltage (Human Body Model)(2) -2000V to +2000V

Notes:
1. Applied conditions greater than those listed in “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
2. ANSI/ESDA/JEDEC JS-001

5.2 RECOMMENDED OPERATING CONDITIONS

Part Number IS34/35MW01G084/164

Operating Temperature (Industrial Grade) -40°C to 85°C
Operating Temperature (Extended Grade) -40°C to 105°C
Operating Temperature (Automotive Grade A1) -40°C to 85°C
Operating Temperature (Automotive Grade A2) -40°C to 105°C
VCC Power Supply 1.7V (VMIN) – 1.95V (VMAX); 1.8V (Typ)

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5.3 DC CHARACTERISTICS
(Under operating range)
Parameter Symbol Test Conditions Min Typ. Max Unit

Page Read tRC=tRCMin,

ICC1 - 15
with Serial Access CE#=VIL, IOUT=0mA
Operating
Current Program ICC2 - - 15 20 mA
Erase ICC3 - - 15
Stand-by Current (TTL) ISB1 CE#=VIH, WP#=0V/VCC - - 1
CE#=VCC-0.2,
Stand-by Current (CMOS) ISB2 - 10 50
WP#=0V/VCC
Input Leakage Current ILI VIN=0 to Vcc (max) - - +/-10 uA

Output Leakage Current ILO VOUT=0 to Vcc (max) - - +/-10

Input High Voltage VIH (1) 0.8xVCC - Vcc+0.3
Input Low Voltage, All inputs VIL (1) -0.3 - 0.2xVCC
V
Output High Voltage Level VOH IOH=-100 uA VCC-0.1 - -
Output Low Voltage Level VOL IOL=+100 uA - - 0.1
IOL
Output Low Current (R/B#) VOL=0.2V 3 4 - mA
(R/B#)
Notes:
1. VIL can undershoot to -2V and VIH can overshoot to VCC + 2V for durations of 20 ns or less.
2. Typical value are measured at Vcc=1.8V, TA=25℃. Not 100% tested.

5.4 VALID BLOCK

Parameter Symbol Min Typ. Max Unit

IS34/35MW01G084/164 NVB 1,004 - 1,024 Block

Notes:
1. The device may include initial invalid blocks when first shipped. Additional invalid blocks may develop while being used.
The number of valid blocks is presented with both cases of invalid blocks considered. Invalid blocks are defined as blocks
that contain one or more bad bits which cause status failure during program and erase operation. Do not erase or program
factory-marked bad blocks.
2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block at the time of shipment.

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5.5 AC MEASUREMENT CONDITION

Symbol Parameter Min Max Units
CL Output Load 1 TTL GATE and CL = 30pF pF
TR,TF Input Rise and Fall Times 5 ns
VIN Input Pulse Voltages 0V to VCC V
VREFI Input Timing Reference Voltages 0.5VCC V
VREFO Output Timing Reference Voltages 0.5VCC V

5.6 AC PIN CAPACITANCE (TA = 25°C, VCC=1.8V, 1MHZ)

Symbol Parameter Test Condition Min Typ Max Units

CIN Input Capacitance VIN = 0V - - 10 pF

CI/O Input /Output Capacitance VI/O = 0V - - 10 pF

Note:
1. These parameters are characterized and not 100% tested.

5.7 MODE SELECTION

CLE ALE CE# WE# RE# WP# Mode
H L L H X Command Input
Read Mode
L H L H X Address Input (4 clock)
H L L H H Command Input
Write Mode
L H L H H Address Input (4 clock)
L L L H H Data Input
L L L H X Data Output
X X X X H X During Read (Busy)
X X X X X H During Program (Busy)
X X X X X H During Erase (Busy)
X X(1) X X X L Write Protect
X X H X X 0V/VCC(2) Stand-by

Notes :
1. X can be VIL or VIH.
2. WP# should be biased to CMOS high or CMOS low for standby.

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5.8 ROGRAM/ERASE PERFORMANCNE

(Industriall: TA=-40 to 85℃,Automotive, A1: TA=-40 to 85℃, Vcc=1.7V ~ 1.95V)

Parameter Symbol Min Typ Max Unit
Average Program Time tPROG - 300 750 us

Dummy Busy Time for Cache Operation tCBSY - 3 750 us

Number of Partial Program Cycles in the Same Page Nop - - 4 cycle

Block Erase Time tBERS - 3 10 ms

Notes:
1. Typical program time is defined as the time within which more than 50% of the whole pages are programmed at 1.8V Vcc
and 25℃ temperature.
2. tPROG is the average program time of all pages. Users should be noted that the program time variation from
page to page is possible.
3. tCBSY max.time depends on timing between internal program completion and data-in.

5.9 AC CHARACTERISTICS FOR ADDRESS/ COMMAND/DATA INPUT

Parameter Symbol Min Max Unit
CLE Setup Time tCLS(1) 25 - ns
CLE Hold Time tCLH 10 - ns
CE# Setup Time tCS(1) 35 - ns
CE# Hold Time tCH 10 - ns
WE# Pulse Width tWP 25 - ns
ALE Setup Time tALS(1) 25 - ns
ALE Hold Time tALH 10 - ns
Data Setup Time tDS(1) 20 - ns
Data Hold Time tDH 10 - ns
Write Cycle Time tWC 45 - ns
WE# High Hold Time tWH 15 - ns
Address to Data Loading Time tADL(2) 100(2) - ns
Notes:
1. The transition of the corresponding control pins must occur only once while WE# is held low.
2. tADL is the time from the WE rising edge of final address cycle to the WE# rising edge of first data cycle.

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5.10 AC CHARACTERISTICS FOR OPERATION

Parameter Symbol Min Max Unit
Data Transfer from Cell to Register tR - 25 us
ALE to RE# Delay tAR 10 - ns
CLE to RE# Delay tCLR 10 - ns
Ready to RE# Low tRR 20 - ns
RE# Pulse Width tRP 25 - ns
WE# High to Busy tWB - 100 ns
WP# Low to WE# Low (disable mode)
tWW 100 - ns
WP# High to WE# Low (enable mode)
Read Cycle Time tRC 45 - ns
RE# Access Time tREA - 30 ns
CE# Access Time tCEA - 45 ns
RE# High to Output Hi-Z tRHZ - 100 ns
CE# High to Output Hi-Z tCHZ - 30 ns
CE# High to ALE or CLE Don’t care tCSD 0 ns
RE# High to Output Hold tRHOH 15 - ns
RE# Low to Output Hold tRLOH 5 ns
CE# High to Output Hold tCOH 15 - ns
RE# High Hold Time tREH 15 - ns
Output Hi-Z to RE# Low tIR 0 - ns
RE# High to WE# Low tRHW 100 - ns
WE# High to RE# Low tWHR 60 - ns
Device Read - 5 us
Resetting Program - 10 us
tRST
Time Erase - 500 us
during… Ready - 5 (1) us
Cache Busy in Read Cache
tDCBSYR - 30 us
(following 31h and 3Fh)

Note: If reset command (FFh) is written at Ready state, the device goes into Busy for maximum 5us.

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6. TIMING DIAGRAMS
6.1 COMMAND LATCH CYCLE

Figure 6.1 Command Latch Cycle

6.2 ADDRESS LATCH CYCLE

Figure 6.2 Address Latch Cycle

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6.3 INPUT DATA LATCH CYCLE

Figure 6.3 Input Data Latch Cycle

6.4 SERIAL ACCESS CYCLE AFTER READ (CLE=L, WE#=H, ALE=L)

Note:
1. Dout transition is measured at ±200mV from steady state voltage at I/O with load.
2. tRHOH starts to be valid when frequency is lower than 33MHz.

Figure 6.4 Serial Access Cycle after Read

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6.5 SERIAL ACCESS CYCLE AFTER READ (EDO TYPE CLE=L, WE#=H, ALE=L)

Notes:
1. Transition is measured at +/-200mV from steady state voltage with load.
This parameter is sample and not 100% tested. (tCHZ, tRHZ)
2. tRLOH is valid when frequency is higher than 33MHZ.
tRHOH starts to be valid

Figure 6.5 Serial Access Cycle after Read (EDO Type CLE=L, WE#=H, ALE=L)

6.6 STATUS READ CYCLE

Figure 6.6 Status Read Cycle

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6.7 READ OPERATION (ONE PAGE)

Figure 6.7 Read Operation (One Page)

6.8 READ OPERATION (INTERCEPTED BY CE#)

Figure 6.8 Read Operation (Intercepted by CE#)

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6.9 RANDOM DATA OUTPUT IN A PAGE

Figure 6.9 Random Data Output in a Page

6.10 PAGE PROGRAM OPERATION

Figure 6.10 Page Program Operation

Note:
1. tADL is the time from WE# rising edge of final address cycle to the WE# rising edge of the first data cycle.
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6.11 PAGE PROGRAM OPERATION WITH RANDOM DATA INPUT

Note: tADL is the time from the WE# rising edge of final address cycle to the WE# rising edge of the first data cycle.

Figure 6.11 Page Program Operation with Random Data Input

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6.12 COPY-BACK OPERATION WITH RANDOM DATA INPUT

Figure 6.12 Copy-Back Operation with Random Data Input

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6.13 CACHE PROGRAM OPERATION

Figure 6.13 Cache Program Operation

6.14 BLOCK ERASE OPERATION

Figure 6.14. Block Erase Operation

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6.15 CACHE READ OPERATION

Figure 6.15.Cache Read Operation

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7. ID Definition Table
The device contains ID codes that identify the device type and the manufacturer.
1st Cycle 2nd Cycle
Part No. 3rd Cycle 4th Cycle 5th Cycle 6th ~ 8th Cycle
(Maker Code) (Device Code)
IS34/35MW01G084 (X16) C8h 91h 80h 55h 40h 7Fh
IS34/35MW01G084 (X8) C8h 81h 80h 15h 40h 7Fh

Description
1st Byte Maker Code
2nd Byte Device Code
3rd Byte Internal Chip Number, Cell Type, etc
4th Byte Page Size, Block Size, etc
5th Byte Plane Number, Plane Size, ECC Level
6th Byte JEDEC Maker Code Continuation Code, 7Fh
7th Byte JEDEC Maker Code Continuation Code, 7Fh
8th Byte JEDEC Maker Code Continuation Code, 7Fh
9th Byte JEDEC Maker Code Continuation Code, 7Fh

3rd ID Data
Item Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Internal Chip Number 1 0 0
2 0 1
4 1 0
8 1 1
Cell Type 2 Level Cell 0 0
4 Level Cell 0 1
8 Level Cell 1 0
16 Level Cell 1 1
Number of 1 0 0
Simultaneously 2 0 1
Programmed Pages 4 1 0
8 1 1
Interleave Program Not Support 0
Between Multiple Chips Support 1
Cache Program Not Support 0
Support 1

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4th ID Data
Item Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
Page Size 1KB 0 0
(w/o redundant area) 2KB 0 1
4KB 1 0
8KB 1 1
Redundant Area Size 8 0
(Byte/512Byte) 16 1
Block Size 64KB 0 0
(w/o redundant area) 128KB 0 1
256KB 1 0
512KB 1 1
Organization X8 0
X16 1
45ns 0 0
Reserved 0 1
Serial Access Time
25ns 1 0
Reserved 1 1

5th ID Data
Item Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
ECC Level 4bit/512B 0 0
2bit/512B 0 1
1bit/512B 1 0
Reserved 1 1
Plane Number 1 0 0
2 0 1
4 1 0
8 1 1
Plane Size(without Redundant 64Kb 0 0 0
Area) 128Kb 0 0 1
256Kb 0 1 0
512Kb 0 1 1
1Gb 1 0 0
2Gb 1 0 1
4Gb 1 1 0
8Gb 1 1 1
Reserved Reserved 0

6th ~ 9th ID Data

Item Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
JEDEC Maker Code Continuation
7F 0 1 1 1 1 1 1 1
Code

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8. DEVICE OPERATION
8.1 PAGE READ OPERATION
Upon initial device power up, the device defaults to Read mode. This operation is also initiated by writing 00h
command, four-cycle address, and 30h command. After initial power up, the 00h command can be skipped because
it has been latched in the command register. The 2,112Byte of data on a page are transferred to cache registers
via data registers within 25us (tR). Host controller can detect the completion of this data transfer by checking the
R/B# output. Once data in the selected page have been loaded into cache registers, each Byte can be read out in
45ns cycle time by continuously pulsing RE#. The repetitive high-to-low transitions of RE# clock signal make the
device output data starting from the designated column address to the last column address.
The device can output data at a random column address instead of sequential column address by using the
Random Data Output command. Random Data Output command can be executed multiple times in a page.
After power up, device is in read mode so 00h command cycle is not necessary to start a read operation.
A page read sequence is illustrated in Figure below, where column address, page address are placed in between
commands 00h and 30h. After tR read time, the R/B# de-asserts to ready state. Read Status command (70h) can
be issued right after 30h. Host controller can toggle RE# to access data starting with the designated column address
and their successive bytes.

Read Operation

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RE#

R/B# tR

00h Address 4 cycles 30h Data Output( Serial Access)

I/Ox
Col. Add. 1,2 & Row Add. 1,2 1

Data Field

Spare Field

RE#

R/B#

05h Col.1 Col.2 E0h Data Output( Serial Access)

I/Ox

1 Col. Add. 1,2

Data Field

Spare Field

Random Data Output In a Page

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8.2 PAGE PROGRAM

The device is programmed based on the unit of a page, and consecutive partial page programming on one page
without intervening erase operation is strictly prohibited. Addressing of page program operations within a block
should be in sequential order. A complete page program cycle consists of a serial data input cycle in which up to
2,112byteof data can be loaded into data register via cache register, followed by a programming period during
which the loaded data are programmed into the designated memory cells.
The serial data input cycle begins with the Serial Data Input command (80h), followed by a four-cycle address
input and then serial data loading. The bytes not to be programmed on the page do not need to be loaded. The
column address for the next data can be changed to the address follows Random Data Input command (85h).
Random Data Input command may be repeated multiple times in a page. The Page Program Confirm command
(10h) starts the programming process. Writing 10h alone without entering data will not initiate the programming
process. The internal write engine automatically executes the corresponding algorithm and controls timing for
programming and verification, thereby freeing the host controller for other tasks. Once the program process starts,
the host controller can detect the completion of a program cycle by monitoring the R/B# output or reading the Status
bit (I/O6) using the Read Status command. Only Read Status and Reset commands are valid during programming.
When the Page Program operation is completed, the host controller can check the Status bit (I/O0) to see if the
Page Program operation is successfully done. The command register remains the Read Status mode unless
another valid command is written to it.
A page program sequence is illustrated in Figure below, where column address, page address, and data input
are placed in between 80h and 10h. After tPROG program time, the R/B# de-asserts to ready state. Read Status
command (70h) can be issued right after 10h.

R/B# tPROG

“0”
I/Ox 80h Address & Data Input 10h 70h I/O0
Pass
Col. Add. 1,2 & Row Add. 1,2 “1”
Data
Fail

Program and Read Status Operation

R/B# tPROG
“0”
Address & Address &
I/Ox 80h 85h 10h 70h I/O0
Data Input Data Input
“1” Pass
Col. Add. 1,2 & Row Add. 1,2 Col. Add. 1,2
Data Data

Fail

Random Data Input In a Page

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8.3 CACHE PROGRAM

The Cache Program is an extension of Page Program, which is executed with 2,112 byte(x8) or 1,056 words(x16)
data registers, and is available only within a block. Since the device has 1 page of cache memory, serial data input
may be executed while data stored in data register are programmed into memory cell.
After writing the first set of data up to 2,112 bytes(x8) or 1,056 words(x16) into the selected cache registers,
Cache Program command (15h) instead of actual Page Program (10h) is inputted to make cache registers free and
to start internal program operation. To transfer data from cache registers to data registers, the device remains in
Busy state for a short period of time (tCBSY) and has its cache registers ready for the next data-input while the
internal programming gets started with the data loaded into data registers. Read Status command (70h) may be
issued to find out when cache registers become ready by polling the Cache-Busy status bit (I/O6). Pass/fail status
of only the previous page is available upon the return to Ready state. When the next set of data is inputted with the
Cache Program command, tCBSY is affected by the progress of pending internal programming. The programming
of the cache registers is initiated only when the pending program cycle is finished and the data registers are
available for the transfer of data from cache registers. The status bit (I/O5) for internal Ready/Busy may be polled
to identity the completion of internal programming. If the system monitors the progress of programming only with
R/B#, the last page of the target programming sequence must be programmed with actual Page Program command
(10h).

tCBSY tCBSY

R/B#

I/Ox 80h Address & Data Input 15h 80h Address & Data Input 15h

Col. Add. 1,2 & Row Add. 1,2 Col. Add. 1,2 & Row Add. 1,2
Data Data
1
Max. 63 times repeatable

R/B# tPROG

I/Ox 80h Address & Data Input 10h 70h I/O0

'0'
Col. Add. 1,2 & Row Add. 1,2 '1' Pass
Data Fail
1
Last Page Input and Program

NOTE:
1. Since programming the last page does not employ caching, the program time has to be that of Page Program. However,
if the previous program cycle with the cache data has not finished, the actual program cycle of the last page is initiated
only after completion of the previous cycle, which can be expressed as the following formula.
2. tPROG = Program time for the last page + Program time for the (last-1)th page – (Program command cycle time + Last page
data loading time)

Fast Cache Program (Available only within a Block)

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8.4 COPY-BACK PROGRAM

Copy-Back Program is designed to efficiently copy data stored in memory cells without time-consuming data
reloading when there is no bit error detected in the stored data. The benefit is particularly obvious when a portion
of a block is updated and the rest of the block needs to be copied to a newly assigned empty block. Copy-Back
operation is a sequential execution of Read for Copy-Back and of Copy-Back Program with Destination address. A
Read for Copy-Back operation with “35h” command and the Source address moves the whole 2,112byte data into
the internal buffer. The host controller can detect bit errors by sequentially reading the data output. Copy-Back
Program is initiated by issuing Page-Copy Data-Input command (85h) with Destination address. If data modification
is necessary to correct bit errors and to avoid error propagation, data can be reloaded after the Destination address.
Data modification can be repeated multiple times as shown in Figure below. Actual programming operation begins
when Program Confirm command (10h) is issued. Once the program process starts, the Read Status command
(70h) may be entered to read the status register. The host controller can detect the completion of a program cycle
by monitoring the R/B# output, or the Status bit (I/O6) of the Status Register. When the Copy-Back Program is
complete, the Status Bit (I/O0) may be checked. The command register remains Read Status mode until another
valid command is written to it.

R/B# tR tPROG

Address 4 Address
I/Ox 00h 35h Data output 85h 10h 70h I/O0
Cycles 5Cycles
'0'
Col. Add. 1,2 & Row Add. 1,2 Col. Add. 1,2 & Row Add. 1,2 Pass
Source Address Destination Address '1'
Fail

Page Copy-Back Program Operation

Page Copy-Back Program Operation with Random Data Input

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8.5 BLOCK ERASE

The block-based Erase operation is initiated by an Erase Setup command (60h), followed by a three-cycle row
address, in which only Plane address and Block address are valid while Page address is ignored. The Erase
Confirm command (D0h) following the row address starts the internal erasing process. The two-step command
sequence is designed to prevent memory content from being inadvertently changed by external noise.
At the rising edge of WE# after the Erase Confirm command input, the internal control logic handles erase and
erase-verify. When the erase operation is completed, the host controller can check Status bit (I/O0) to see if the
erase operation is successfully done. Figure below illustrates a block erase sequence, and the address input (the
first page address of the selected block) is placed in between commands 60h and D0h. After tBERS erase time,
the R/B# de-asserts to ready state. Read Status command (70h) can be issued right after D0h to check the
execution status of erase operation.

R/B# tBERS

I/Ox 60h Address Input D0h 70h I/O0

'0'
Row Add. 1,2 '1' Pass
Fail

Block Erase Operation

8.6 READ STATUS

A status register on the device is used to check whether program or erase operation is completed and whether
the operation is completed successfully. After writing 70h/F1h command to the command register, a read cycle
outputs the content of the status register to I/O pins on the falling edge of CE# or RE#, whichever occurs last.
These two commands allow the system to poll the progress of each device in multiple memory connections even
when R/B# pins are common-wired. RE# or CE# does not need to toggle for status change.
The command register remains in Read Status mode unless other commands are issued to it. Therefore, if the
status register is read during a random read cycle, a read command (00h) is needed to start read cycles.

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Table 8.1 Status Register Definition for 70h Command

I/O Page Program Block Erase Cache Read Cache Read Definition
Program
Pass : 0
I/O 0 Pass/Fail Pass/Fail Pass/Fail(N) NA NA
Fail : 1
I/O 1 NA NA Pass/ Fail (N-1) NA NA Don’t cared
NA
I/O 2 NA NA NA NA Don’t cared
(Pass/Fail,OTP)
I/O 3 NA NA NA NA NA Don’t cared
I/O 4 NA NA NA NA NA Don’t cared
True True Busy : 0
I/O 5 NA NA NA
Ready/Busy Ready/Busy Ready : 1
Busy : 0
I/O 6 Ready/Busy Ready/Busy Ready/Busy Ready/Busy Ready/Busy
Ready : 1
Protected :0
I/O 7 Write Protect Write Protect Write Protect Write Protect Write Protect
Not Protected : 1
Note:
1. I/Os defined NA are recommended to be masked out when Read Status is being executed.
2. N = current page, N-1 = previous page.

Table 8.2 Status Register Definition for F1h Command

I/O Page Program Block Erase Cache Program Read Cache Read
Definition
Pass : 0
I/O 0 Chip Pass/Fail Chip Pass/Fail Chip Pass/Fail(N) NA NA
Fail : 1
Plane0 Plane0 Pass : 0
I/O 1 Plane0 Pass/Fail(N) NA NA
Pass/Fail Pass/Fail Fail : 1
Plane1 Plane1 Pass : 0
I/O 2 Plane1 Pass/Fail(N) NA NA
Pass/Fail Pass/Fail Fail : 1
Pass : 0
I/O 3 NA NA Plane0 Pass/Fail(N-1) NA NA
Fail : 1
Pass : 0
I/O 4 NA NA Plane1 Pass/Fail(N-1) NA NA
Fail : 1
True Busy : 0
I/O 5 NA NA True Ready/Busy NA
Ready/Busy Ready : 1
Busy : 0
I/O 6 Ready/Busy Ready/Busy Ready/Busy Ready/Busy Ready/Busy
Ready : 1
Write Protected : 0
I/O 7 Write Protect Write Protect Write Protect Write Protect
Protect Not Protected : 1

Note:
3. I/Os defined NA are recommended to be masked out when Read Status is being executed.
4. N = current page, N-1 = previous page.

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8.7 READ ID
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an
address input of 00h. Five read cycles sequentially output the manufacturer code (C8h), and the device code and
3rd, 4th, 5th cycle ID respectively. The command register remains in Read ID mode until further commands are
issued to it.

Read ID Operation

Table 8.3 ID definition Table

1st Cycle 2nd Cycle

Part No. 3rd Cycle 4th Cycle 5th Cycle
(Maker Code) (Device Code)
IS34MW01G084(X8) C8h 81h 80h 15h 40h
IS34MW01G164(X16) C8h 91h 80h 55h 40h

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8.8 RESET
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy
state during random read, program or erase mode, the reset operation will abort these operations. The contents
of memory cells being altered are no longer valid, as the data will be partially programmed or erased. The
command register is cleared to wait for the next command, and the Status Register is cleared to value C0h when
WP# is high. If the device is already in reset state a new reset command will be accepted by the command
register. The R/B# pin changes to low for tRST after the Reset command is written. Refer to Figure below.

R/B# tRST

I/Ox FFh

Reset Operation

Table 8.4 Device Status Table

After Power-up After Reset

Operation Mode 00h Command is latched Waiting for next command

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8.9 CACHE READ

Cache Read is an extension of Page Read, and is available only within a block. The normal Page Read
command (00h-30h) is always issued before invoking Cache Read. After issuing the Cache Read command
(31h), read data of the designated page (page N) are transferred from data registers to cache registers in a short
time period of tDCBSYR, and then data of the next page (page N+1) is transferred to data registers while the
data in the cache registers are being read out. Host controller can retrieve continuous data and achieve fast read
performance by iterating Cache Read operation. The Read Start for Last Page Cache Read command (3Fh) is
used to complete data transfer from memory cells to data registers.

Read Operation with Cache Read

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8.10 READY/BUSY#
The device has a R/B# output that provides a hardware method of indicating the completion of a page program,
erase and random read completion. The R/B# pin is normally high but transition to low after program or erase
command is written to the command register or random read is started after address loading. It returns to high
when the internal controller has finished the operation. The pin is an open-drain driver thereby allowing two or
more R/B# outputs to be Or-tied. Because pull-up resistor value is related to tr(R/B#) and current drain during
busy (ibusy) , an appropriate value can be obtained with the following reference chart. Its value can be
determined by the following guidance

Ready/Busy# Pin Electrical Specifications

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8.11 DATA PROTECTION AND POWER UP SEQUENCE

The timing sequence shown in the figure below is necessary for the power-on/off sequence.
The device internal initialization starts after the power supply reaches an appropriate level in the power on
sequence. During the initialization the device R/B# signal indicates the Busy state as shown in the figure below.
In this time period, the acceptable commands are 70h.
The WP# signal is useful for protecting against data corruption at power on/off.

AC Waveforms for Power Transition

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8.12 WRITE PROTECT OPERATION

Enabling WP# during erase and program busy is prohibited. The erase and program operations are enabled and
disabled as follows:
Enable Programming

WE#

I/Ox 80h 10h

WP#

R/B#

tWW (Min. 100 ns)

Note: WP# keeps “High” until programming finish

Disable Programming

WE#

I/Ox 80h 10h

WP#

R/B#

tWW (Min. 100 ns)

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Enable Erasing

Note: WP# keeps “High” until erasing finish

Disable Erasing

Enable/Disable Programming and Enable Erasing

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8.13 READ PARAMETER PAGE OPERATION

Read Parameter Page (ECh) command is used to read ONFI parameter page programmed into the target.
This command is accepted by the target only when the die(s) on the target is idle. Writing ECh to the command
register puts the target in read parameter page mode. The target stays in this mode until another valid command
is issued.
When ECh command is followed by one 00h address cycle, the target goes busy for tR. If the Read Stat(70h)
command is used to monitor for command completion, the Read mode (00h) command must be re-enable data
output mode.
A minimum of three copies of the parameter page are stored in the device. Each parameter page is 256 bytes.
Random Data Output (05h-E0h) can be used to change the location of data output.
The upper eight I/Os on a x16 device are not used and a “Don’t care” for x16 devices.

Read Parameter Page Operation

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Table 8.5 Parameter Page Data Structure

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8.14 READ UNIQUE ID OPERATION

Read Unique ID (Edh) command is used to read a unique identifier programmed into the target. This command is
accepted by the target only when the die(s) on the target is idle. Writing Edh to the command register puts the
target in read unique ID mode. The target stays in this mode until another valid command is issued.
When Edh command is followed by one 00h address cycle, the target goes busy for IR. If the Read Status (70h)
command is used to monitor for command completion, the Read mode (00h) command must be used to re-
enable data output mode. After tR completes, the host enables data output mode to read the unique ID.
Sixteen copies of the unique ID data are stored in the device. Each copy is 32 bytes. The first 16 bytes of a 32-
byte copy are unique ID data, and the second 16 bytes are the complement of the first 16 bytes of FFh, then that
copy of the unique ID data is correct. In the event that a non-FFh result is returned, the host can repeat the XOR
operation on a subsequent copy of the unique ID data. Random Data Output (05h-E0h) can be used to change
the location of data output.
The upper eight I/Os on a x16 device are not used and are a “Don’t care” for x16 devices.

Read Unique ID Operation

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8.15 ONE-TIME PROGRAMMABLE (OTP) OPERATIONS

The device offers one-time programmable memory area. Thirty full pages of OTP data are available on the
device, and the entire range is guaranteed to be good. The OTP area is accessible only through the OTP
commands.
The OTP area leaves the factory in an unwritten state. The OTP area cannot be erased, whether it is protected or
not. Protecting the OTP area prevents further programming of that area.
The OTP area is only accessible while in OTP operation mode. To set the device to OTP operation mode, issue
the Set Feature (EFh-90h-01h) command. When the device is in OTP operation mode, subsequent Read and/or
Page Program are applied to the OTP area. When you want to come back to normal operation, you need to
use EFh-90h-00h for OTP mode release. Otherwise, device will stay OTP mode.
To program an OTP page, issue the Serial Data Input (80h) command followed by 4 address cycles.
This first two address cycles are column address that must be set as 00h. For the third cycle, select a page in the
range of 00h through 1Dh. The fourth cycle is fixed at 00h. Next, up to 2,112 bytes of data can be loaded into
data register. The bytes other than those to be programmed do not need to be loaded. Random Data Input (85h)
command in this device is prohibited. The Page Program confirms (10h) command initiates the programming
process. The internal control logic automatically executes the programming algorithm, timing and verification.
Please note that no partial-page program is allowed in the OTP area. In addition, the OTP pages must be
programmed in the ascending order. A programmed OTP page will be automatically protected.

Similarly, to read data from an OTP page, set the device to OTP operation mode and then issue the Read (00h-
30h) command. The first two address cycles are column address that must be set as 00h and Random Data
Output (05h-E0h) command is prohibited as well.
All pages in the OTP area will be protected simultaneously by issuing the Set Feature (EFh-90h-03h) command
to set the device to OTP protection mode. After the OTP area is protected, no page in the area is programmable
and the whole area cannot be unprotected.
The Read Status (70h) command is the only valid command for reading status in OTP operation mode.

Table 8.6 OTP Modes and Commands

Notes:
1. 90h is OTP status register address.
2. 00h, 01h, and 03h are OTP status register data values.

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Table 8.7 OTP Operations

Table 8.8 OTP Area Detail

Note:
1. There is no busy time for OTP setting

One Time Program Operation

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9. INVALID BLOCK AND ERROR MANAGEMENT

9.1 MASK OUT INITIAL INVALID BLOCK(S)

Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is not
guaranteed by ISSI. The information regarding the initial invalid block(s) is called the initial invalid block information.
Devices with initial invalid block(s) have the same quality level as devices with all valid blocks and have the same
AC and DC characteristics. An initial invalid block(s) does not affect the performance of valid block(s) because it is
isolated from the bit line and the common source line by a select transistor. The system design must be able to
mask out the initial invalid block(s) via address mapping.
The 1st block, which is placed on 00h block address, is guaranteed to be a valid block up to 1K program/erase
cycles with 4bit/512Byte ECC.

9.2 IDENTIFYING INITIAL INVALID BLOCK(S) AND BLOCK REPLACEMENT MANAGEMENT

Unpredictable behavior may result from programming or erasing the defective blocks. Figure below illustrates an
algorithm for searching factory-mapped defects, and the algorithm needs to be executed prior to any erase or
program operations.

A host controller has to scan the data at the first byte in the spare area of the first page or second page of each
block from block 0 to the last block using page read command.
Any block where the 1st byte in the spare area of the first or second page does not contain “FFh” is an invalid block.
Do not erase or program factory-marked bad blocks. The host controller must be able to recognize the initial invalid
block information and to create a corresponding table to manage block replacement upon erase or program error
when additional invalid blocks develop with Flash memory usage.

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Check for “FFh” at the first byte in the

spare area of the first page or second
page of each block.

Figure 9.1 Algorithm for Bad Block Scanning

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9.3 ERROR IN READ OR WRITE OPERATION

Within its lifetime, additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report
for the actual data. The following possible failure modes should be considered to implement a highly reliable
system. In the case of status read failure after erase or program, block replacement should be done. Because
program status fail during a page program does not affect the data of the other pages in the same block, block
replacement can be executed with a page-sized buffer by finding an erased empty block and reprogramming the
current target data and copying the rest of the replaced block. In case of Read, ECC must be employed. To improve
the efficiency of memory space, it is recommended that the read or verification failure due to single bit error be
reclaimed by ECC without any block replacement. The additional block failure rate does not include those reclaimed
blocks.

Failure Mode Detection and Countermeasure Sequence

Write Erase failure Read Status after Erase  Block Replacement
Program failure Read Status after Program  Block Replacement
Read Up to 4 bit failure Verify ECC  ECC Correction

Note: Error Correcting Code  RS Code or BCH Code etc.

Example: 4bit / 512 Byte

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Figure 9.2 Program Flow Chart

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Figure 9.3 Erase Flow Chart

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Figure 9.4 Read Flow Chart

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Block A

1st
~
(n-1) th

n th An error occurs.

page 1

Block B Buffer memory of the

controller
1st 2
~
(n-1) th

n th An error occurs.
* Step 1
When an error happens in the nth page of the Block 'A' during erase or program
operation.
page * Step 2
Copy the data in the 1st ~ (n-1)th page to the same location of another free
block. (Block 'B')
* Step 3
Then, copy the nth page data of the Block 'A' in the buffer memory to the nth
page of the Block 'B'
* Step 4
Do not erase or program to Block 'A' by creating an 'invalid block' table or
other appropriate scheme.

Figure 9.5 Blcok Replacement

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9.4 ADDRESSING FOR PROGRAM OPERATION

Figure 9.6 Addressing for Program Operation

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9.5 SYSTEM INTERFACE USING CE# NOT CARE OPERATION

For an easier system interface, CE# may be inactive during the data-loading or serial access as shown below.
The internal 2,112byte (1,056word) data registers are utilized as separate buffers for this operation and the
system design gets more flexible. In addition, for voice or audio applications that use slow cycle time on the order
of μ-seconds, de-activating CE# during the data-loading and serial access would provide significant savings in
power consumption.

Figure 9.7 Program/Read-Operation with CE# Not-Care Operation

Address Information

Data I/O Address

Device
Data In/Out I/Ox Col. Add1 Col. Add2 Row Add1 Row Add2
IS34/35MW01G084 2,112Byte I/O 0~I/O 7 A0 ~ A7 A8 ~ A11 A12 ~ A19 A20 ~ A27
IS34/35MW01G164 1,056Word I/O 0~I/O 15 A0 ~ A7 A8 ~ A10 A12 ~ A18 A20 ~ A26

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10. PACKAGE TYPE INFORMATION

10.1 48-PIN TSOP (TYPE I) PACKAGE (T)

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10.2 63-BALL VFBGA PACKAGE (B)

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11. ORDERING INFORMATION – Valid Part Numbers

IS 34 M W 01G 08 4 - B L I

TEMPERATURE RANGE
I = Industrial (-40°C to +85°C)
E = Industrial (-40°C to +105°C)
A1 = Automotive Grade (-40°C to +85°C)
A2 = Automotive Grade (-40°C to +105°C)

PACKAGING CONTENT
L = RoHS compliant

PACKAGE Type
T = 48-pin TSOP (Type I) (Call Factory)
B = 63-ball VFBGA

Die Revision
Blank = First Gen.

ECC Requirement
4 = 4-bit ECC

Bus Width
08 = x8 NAND
16 = x16 NAND

Density
01G = 1 Gigabit

VDD
W = 1.8V

Technology
M = Standard NAND (SLC)

Product Family
34 = NAND
35 = Automotive NAND

BASE PART NUMBER

IS = Integrated Silicon Solution Inc.

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VDD Density Bus Temp. Grade Order Part Number Package

Industrial IS34MW01G084-BLI 63-ball VFBGA
Extended IS35MW01G084-BLE 63-ball VFBGA
X8
(1)
Automotive (A1) IS35MW01G084-BLA1 63-ball VFBGA
(1)
Automotive (A2) IS35MW01G084-BLA2 63-ball VFBGA
1.8V 1Gb
Industrial IS34MW01G164-BLI 63-ball VFBGA
Extended IS34MW01G164-BLE 63-ball VFBGA
X16
(1)
Automotive (A1) IS35MW01G164-BLA1 63-ball VFBGA
Automotive (A2)(1) IS35MW01G164-BLA2 63-ball VFBGA

Note:
1. Automotive Grade meets AEC-Q100 requirements with PPAP.
Temp Grades: A1= -40 to 85°C, A2= -40 to 105°C

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