Lect1 2
Lect1 2
Lect1 2
290
History
Outline, Part I
Magnitude of Challenges
z Inventory Management:
z Inventory uncertainty:
z 65 % of 370,000 records inaccurate (HBS study of one major retailer)
z Transportation uncertainty: Perfect delivery is dismal
z Stock-outs:
z Brand Management:
z Counterfeit:
z $500B pharmaceuticals business, $50B counterfeit
z Diversion:
z Market size difficult to estimate
The problems are everywhere
OOS Averages by Category
Overall OOS Extent (Averages)
World Avg (18 categories ) 8.3
25%
Percent
8%
Manufacturer Manufacturer’s DC Retailer’s DC Retailer
World
11 weeks inventory Wide
6 weeks inventory
Consider stock-outs
RFID System
RFID
Low cost rfid
Silicon: 4c/mm2
20
handling cost
15
10
time
reduce functionality
(Networking & software)
100
90
80
70
60
Noise
50
Gaussian Fit 0.8
40 912 100
30 2 Meters, 4 KHz,
20 SQW, 1 dBm
10
0
905 910 915 920
Frequency (MHz)
the hypothesis or bet
context-aware
context-aware router
context-aware
1-2¢ 1¢ 1¢ 1¢
Challenges of IC minimalism
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Testing
z Economics today:
z $500 - $1000 per wafer
z But minimal functionality means
z High reliability
z Don’t test on wafer
z Test wirelessly at conversion
Slicing and Dicing
z
Standard saw-dicing wasteful
z Instead, use separation
by thinning
C. Landesberger, S. Scherbaum, G. Schwinn, H. Spöhrle: “New Process Scheme for Wafer Thinning and Stress-free Separation of Ultra Thin
IC’s,” Proceedings of Microsystems Technologies 2001, Mesago, Stuttgart, pp. 431-436, 2001.
Low cost RFID challenges
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Antenna
z Screen printing
z Etching
z Forming
Low cost RFID challenges
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Assembly
Chip
Assembly
Chip Wafer Antenna Label / Tag End User
Design Treatment Manufacturing Manufacturing
Silicon Inlet Label
Manufacturing Assembly Converting
Low cost RFID challenges
20¢ 5¢ 5¢ 20¢
1-2¢ 1¢ 1¢ 1¢
Conversion
software
hardware paper
Outline, Part I
Architecture: Local
Data
Reader Reader
Processing
01.203D2A.916E8B.8719BAE03C
Local database
Tag
Architecture: Global
<PML> 18.72.100.100
Internet <TIME=2000.4.28:10:05.05HRS>
<EPC= 01.203D2A.916E8B.8719BAE03C >
<TEMPERATURE=15 DEG C>
</EPC>
</TIME>
XQL PML
</PML>
Local system
18.72.100.100
Middleware <PML>
01.203D2A.916E8B.8719BAE03C
Local network …
???? …
Data ...
Reader Reader Processing <MaximumTempearture>
40 DEG C
</MaximumTempearture>
01.203D2A.916E8B.8719BAE03C <MinimumTemperature>
Local database 5 DEG C
</MinimumTempearture>
Quality
</PML>
control specialist
Inference
Temperature OK
ONS PML Server
<PML> 18.72.100.100
Internet <TIME=2000.4.28:10:05.05HRS>
<EPC= 01.203D2A.916E8B.8719BAE03C >
<TEMPERATURE=15 DEG C>
</EPC>
</TIME>
XQL PML
</PML>
Local system
18.72.100.100
Middleware <PML>
01.203D2A.916E8B.8719BAE03C
Local network …
???? …
Data ...
Reader Reader Processing <MaximumTempearture>
40 DEG C
</MaximumTempearture>
23AB.36C2.AB21.6733
01.203D2A.916E8B.8719BAE03C <MinimumTemperature>
Local database 5 DEG C
Tag Quality control specialist
</MinimumTempearture>
</PML>
Three Layers of an EPC
Architecture
Existing Systems / EAI ONS
TradingPart
Trading Partners
ners
Trading Partners
EPC
Enterprise •EPC Enterprise data store
Business IDs
+ •Data migration from Edge
•Standard API
•Enterprise systems
•Trading partners
Enterprise
Edge
•RF Abstraction layer
Edge 3 •Device mgmt
EPC Edge Edge 2 •Event mgmt
object Edge 1
•EPC Edge data store
time
loc •Standard API
•Data migration to Enterprise
Software
Hardware
Readers
•Physical data capture
Tags
Outline, Part I
Field Trial
JOHNSON & JOHNSON KRAFT FOODS UNILIVER DIST. CENTER GILLETTE DIST. CENTER P & G DC
OLIVE BRANCH, TN FORTH WORTH, TX BALTIMORE, MD CHICAGO IL IOWA CITY, IO
z Tesco
z Wal-Mart
z Metro Group
z Target
z Albertsons
z Best Buy
z 3 protocols
z Class 0 UHF
z Class I UHF
z Class I HF
z Tens of manufacturers
z Tags: Alien, Matrics, Philips, ST Micro, Rafsec, ….
z Readers: Alien, Matrics, AWID, ThingMagic, Tyco, Symbol,
Samsys,…
z New versions being designed
z Gen 2 taking off
z Intermec patent still issue
Key philosophy #1:
interoperability
Sensors
Open tag
Agile reader
Software
Internet
Key philosophy #2: Layers
Class V tags
Readers. Can power other Class I, II and III tags;
Communicate with Classes IV and V.
Class IV tags:
Upward compatibility
Downward failsafe
broad-band peer-to-peer communication
Class III tags:
semi-passive RFID tags
Class II tags:
passive tags with additional
functionality
Class 0/Class I:
read-only passive tags
Vendors
Target, Wegmans, ….
Research Issues
z Tag anti-collision
z Reader anti-collision
z Security and privacy
z Advanced sensor networks
z Data routing and handling
z IC Design
z IC manufacturing
z Silicon processing
z Chip assembly
z Polymers
z Controls/automation
z Manufacturing systems
z System Synthesis
z Supply chain issues
Outline, Part I
Outline, Part II
z Signaling
z Anti-collision
z Functions
reader to tag: modulation
Reader to Tag Modulation
UHF
Envelope
Low Time
10% 45%
100%
45%
16
us
62.5 Khz
1 Bit Cell
••Bit
BitCell
CellTime:
Time:~8
~8µsµsTag
Tag
0 to
toReader
Reader(128
(128kbs)
kbs)
••22Transitions
Transitions==00
••44Transitions
Transitions==11
••Always
AlwaysTransitions
Transitions
1 Within
WithinaaBit
Bit
Anti-collision
z Write address
z Lock address
z Preload address mask
z Read ID (anti-collision)
z Read payload
z Write payload
z Sleep
z Wake
z Destroy
Outline, Part II
z or
z Surveillance
Issues
Manufacturer 24 bits
Public policy
www.epcglobalinc.org/public_policy/
public_policy_guidelines.html
Outline, Part II
z Introduction
z Kinematics
z In-plane surface motion
z Out-of-plane motion
z Adhesion and fluid effects
z Experiments
z Conclusions
Introduction
Motivation
z Introduction
z Kinematics
z In-plane surface motion
z Out-of-plane motion
z Adhesion and fluid effects
z Conclusions
Vibration Kinematics
asymmetric
x
Surface
accelerating
Gravity
faster than
friction cone
friction can
sustain
Out-of-plane vibrations
Part in flight
z Introduction
z Kinematics
z In-plane surface motion
z Out-of-plane motion
z Adhesion and fluid effects
z Conclusions
Adhesion
Sticky
collision
adhesion
friction cone
z Sticking due to
fluids
z Alleviation
z use surfaces that
are “leaky”
z Make chip
surface bumpy
z Run in vacuum
velocity loss due to film
damping
Si disk
Frequency 400 µm dia.
effect on 200 µm thick
damping
Starting
gap effect
on
damping
Outline
z Introduction
z Kinematics
z In-plane surface motion
z Out-of-plane motion
z Adhesion and fluid effects
z Conclusions
Conclusions
z Basic physics
z Ongoing work:
z Measurements
z Effects of geometries
z Test methods
z Design:
z Chip delivery methods and roll to roll packaging
Outline, Part II
Gita Swamy
Sanjay Sarma
Outline
z Manufacture
zSemiconductor
zTag
z Results
z Worldwide Fab Capacity
Results
z IC Cost: 1.151¢
z Antenna
z Mixed-Mode IC
z Packaging
Inputs to model
Process Steps
Equipment Benchmark
z Throughput
z Labor
z Yield
Overhead
Maintenance
Depreciation
Semiconductor Processing
Process modeling
z Sematech
developed
benchmark
z 250_A1_82
Process
Benchmark
z 0.25 micron
z 282 Step
z 19 Mask
z 3 Metal
z 2 Poly
Driving Variables
z Flip Chip
z Vibratory Assembly
z Tag Test
Flip chip
Assembly Process
z Types of Runs
z Unit Machine
z Line Maximized
Results
z IC Cost: 1.151¢
1.00000000
Thinning Dicing Traditional Tag Test
Assembly
0.10000000 0.032175597 0.036584412
$ Cos t Pe r Die
0.000650941
0.00100000 0.000342826
Assembly Costs
0.00010000
1.00000000
0.00005651
Thinning Dicing Flip Chip Tag Test
0.00001000 0.00002772
Assembly
0.10000000 0.026883013
0.024655643
Line Max imized Unit Machine
$ Cost Pe r Die
0.01000000 0.01959650
0.01857550
$0.00142614
0.00100000 0.000342826
0.00083171
0.00010000
0.00001000 0.00002772
Line Max imized Unit Machine
Worldwide Fab Capacity
z Assume 1 billion
tags a day
z 100,000 dies/wafer
z 20% of world
silicon capacity
z Fabs 15% idle
today
Outline, Part II
The Limits
God
Parameter #2
vendors
Parameter #1