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Reflow Soldering Profile, Per J-STD-020D, Table 5-2, Pb-Free Devices

This document provides a reflow soldering profile for lead-free devices according to J-STD-020D. It specifies temperature and time requirements for preheat, soak, ramp up, peak, ramp down, and cooling. It also lists reliability test ratings for the product including shock, solderability, strength, leakage, and environmental tests.

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flyinzesky
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59 views2 pages

Reflow Soldering Profile, Per J-STD-020D, Table 5-2, Pb-Free Devices

This document provides a reflow soldering profile for lead-free devices according to J-STD-020D. It specifies temperature and time requirements for preheat, soak, ramp up, peak, ramp down, and cooling. It also lists reliability test ratings for the product including shock, solderability, strength, leakage, and environmental tests.

Uploaded by

flyinzesky
Copyright
© © All Rights Reserved
Available Formats
Download as PDF, TXT or read online on Scribd
Download as pdf or txt
Download as pdf or txt
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A product Line of

Diodes Incorporated

Reflow Soldering Profile, Per J-STD-020D, Table 5-2, Pb-Free Devices

-
Supplier Tp > Tc
-
User Tp < Tc

Tc

Tc -5°C
Supplier tp User tp

Tp Tc -5°C
Max. Ramp Up Rate = 3°C/s
tp
Max. Ramp Down Rate = 6°C/s
Te m p e r a t u r e

TL
tL
Tsmax Preheat Area

Tsmin

ts

25
Time 25°C to Peak
Time IPC-020d-5-1

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly


Preheat/Soak
Temperature Min (Tsmin) 100°C 150°C
Temperature Max (Tsmax) 150°C 200°C
Time (ts) from (Tsmin to Tsmax) 60-120 seconds 60-120 seconds
Ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Liquidous temperature (TL) 183°C 217°C
Time (tL) maintained above TL 60-150 seconds 60-150 seconds
Time (t p)* within 5°C of the specified
classification temperature (Tc)**, see 20* seconds 30* seconds
Reflow Soldering Profile above.
Ramp-down rate (Tp to TL) 6°C/second max. 6°C/second max.
Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

© Diodes Incorporated • US: +1-408-232-9100 TW: +886-3-4518888   •   www.diodes.com


February 2019
REFLOW
© Diodes Incorporporated
All specifications are subject to change without notice.
A product Line of
Diodes Incorporated

Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If
parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2°C of the live-bug Tp and still
meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures
refer to JEP140 for recommended thermocouple use.
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly
profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 5-2.
For example, if Tc is 260°C and time tp is 30 seconds, this means the following for the supplier and the user.
For a supplier: The peak temperature must be at least 260°C. The time above 255°C must be at least 30 seconds.
For a user: The peak temperature must not exceed 260°C. The time above 255°C must not exceed 30 seconds.
Note 3: All components in the test load shall meet the classification profile requirements.
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a
higher peak classification temperature is desired. (Source Reference: J-STD-020-D1)

Reliability Test Ratings

This product is rated to meet the following test conditions:


Type Parameter Test Condition
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Mechanical Solderability JESD22-B102-D Method 2 (Preconditioning E)
Mechanical Terminal strength MIL-STD-883, Method 2004, Condition D
Mechanical Gross leak MIL-STD-883, Method 1014, Condition C
Mechanical Fine leak MIL-STD-883, Method 1014, Condition A2 (R1 = 2x10 -8 atm cc/s)
Mechanical Solvent resistance MIL-STD-202, Method 215
Environmental Thermal shock MIL-STD-883, Method 1011, Condition A
Environmental Moisture resistance MIL-STD-883, Method 1004
Environmental Vibration MIL-STD-883, Method 2007, Condition A
Environmental Resistance to soldering heat J-STD-020D Table 5-2 Pb-free devices (2 cycles max)

© Diodes Incorporated • US: +1-408-232-9100 TW: +886-3-4518888   •   www.diodes.com


February 2019
REFLOW
© Diodes Incorporporated
All specifications are subject to change without notice.

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