Omniscan X3: Phased Array Flaw Detector

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The key takeaways are that the OmniScan X3 flaw detector builds on the reliability and ease of use of previous OmniScan models and adds new capabilities like total focusing method (TFM) imaging.

The main features of the OmniScan X3 include two UT channels, drop testing and IP65 certification, 8 beam sets, compatibility with existing Olympus scanners and probes, and compliance with industry standards.

The OmniScan X3 provides total focusing method (TFM) imaging collected through full matrix capture with support for up to 64-element apertures. It also offers features like a 16-bit A-scan and interpolation/smoothing to improve imaging quality.

OmniScan® X3

Phased Array Flaw Detector

Confidence You Can See


OmniScan® Redefined

The workhorse of your phased array inspection fleet is


now even better. Building on the reliability, image quality,
and ease of use that have helped make OmniScan flaw
detectors the global standard in portable phased array,
we’ve added powerful new tools, such as total focusing
method (TFM) images, to help you do your job even more
confidently.

If you’ve used an OmniScan instrument before, the X3 flaw


detector will feel very familiar—a highly portable tool with
a robust, industrial housing and a cleaner, more modern
user interface. If you’ve never used one, you’ll quickly
see why they are the standard, trusted by inspectors all
over the world.

All the Essentials


• TOFD onboard
• Two UT channels
• Drop tested and IP65 certified
• 8 beam sets
• Compatible with existing Olympus scanners and probes
• 16:128PR or 32:128PR configurations
• ISO 18563‑1:2015 and EN12668‑1:2010 compliant

Innovations that Enable Efficiency


• Total focusing method (TFM) images collected through full
matrix capture (FMC), including 64‑element aperture support
• Large, 4 GB file size with 64 GB internal memory
• Thoughtfully designed software minimizes button presses
• Create your whole scan plan in a single workflow
• Fast, “single swipe” calibration envelope collection
• 1024 focal laws

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From Start to Finish, More Efficient Inspections
Get Right to Work
Right out of the box, the comprehensive onboard scan plan tool helps you visualize your inspection before you begin.
If you’ve missed anything in your plan, the visualization tools enable you to spot it in advance, reducing the risk of errors.
You can create your entire plan, including the TFM zone, in one simple workflow. Improved calibration and setup verification
tools enable you to rapidly complete your inspection setup and get to work fast.

Faster Setups
• Configure multiple probes/
beam sets at once
• Onboard dual linear, matrix, and dual
matrix array creation
• Automatic wedge verification
• Single swipe calibration
• Simultaneous multipoint time‑corrected
gain (TCG) collection
• Simplified calibration verification process
for saved setups

Better Images for Confident Decision Making


Better phased array images help you be more confident in All Your Tools Onboard
your decisions. With TFM, you can obtain better images
• Access the features you need quickly, even in the middle of
throughout the volume of a part and produce images that
an inspection
are geometrically correct, enabling you to validate flaw
characterizations made using conventional phased array • Efficient menu structure means minimal button presses to
complete your inspection
techniques. Utilize up to 64 active elements in full matrix
capture to maximize your TFM coverage and resolution. • Balanced power and functionality—use advanced mode to
access expert‑level features as needed
Additional features improve the quality of phased array • Wirelessly send data or share your screen with an offsite
imaging, including a 16‑bit A‑scan, interpolation, and colleague using the Olympus Scientific Cloud (OSC)
smoothing, to make flaw scanning more efficient. • Supports dual linear/dual matrix array probes, dynamic depth
focusing, auto cursor placement, and more
• 4 GB onboard memory helps you scan large parts without the
need to segment scans or offload data
• Track the position of your inspection results with a built‑in GPS

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Faster Analysis, Faster Results
Analyzing phased array data can take longer than the inspection. The OmniScan® X3 flaw detector offers flexible tools for
faster analysis, whether onboard the instrument or on your PC. And communicating your comprehensive inspection results,
from the scan plan to flaw sizing, is simple with an improved indication table and more export options, including an SD™ card,
USB memory stick, and the Cloud.

Data Interpretation Tools


• Weld gate reduces the impact of irrelevant geometry echoes
• Volumetric top and side views merge and geometrically correct
data to emphasize flaws
• Auto cursor placement identifies the -6 dB drop points from
peak indication amplitudes for less time positioning cursors
• Third‑party programs can connect to the OSC, so you can
access your data with your favorite analysis programs

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The Workhorse of Your Inspection Fleet
The OmniScan® X3 flaw detector has the power and flexibility to handle your phased array inspection challenges. Whether
you’re inspecting welds, pipes, pressure vessels, or composites, the X3 instrument has tools to help complete your work
efficiently and interpret flaws with confidence.

Weld
• Check that welds are properly covered with multiple beam set
visualization
• Extended 800% high amplitude range lets you characterize
saturated indications, such as lack of fusion, without rescanning
the component
• Supports multiprobe configurations and different firing patterns,
providing better coverage in each weld zone
• Weld gate highlights the zone of interest

Corrosion
• Fast acquisition speed makes it easier to inspect large
pipes or vessels
• 4 GB individual file size allows for more data collection with
fewer interruptions
• Compatible with all Olympus corrosion scanners
• Supports Dual Linear Array™ probes for improved
near‑surface resolution

Composites
• High‑amplitude range (800%) and 16‑bit digitizer enable a wider
dynamic inspection range in attenuating materials
• TCG dynamic range of up to 65 dB with improved TCG table
view for manual point editing
• 12 kHz scan speeds enable fast data collection over
large scan areas
• Wide pulse width control for optimal use of
low‑frequency probes

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Reliability You Trust
When you’re inspecting assets
outdoors, tools can get wet, hot, or
even dropped. That’s why we put
the OmniScan® X3 flaw detector
through rigorous durability testing.
IP65 certified dust proof and water
resistant and built to pass a 4-foot
drop test, it’s ready to work when you
are. A large 10.6‑inch WXGA display
provides clarity and visibility in any
lighting condition while enabling crisp
touch screen operation, even when
using gloves, couplant, or in difficult
conditions. In hot environments, the
easily replaceable cooling fan keeps
you working in temperatures ranging
from -10 °C to 45 °C (14 °F to 113 °F)
without compromising the IP65
certification.

Leverage the Power of the Cloud

Wireless connectivity to the Olympus


Scientific Cloud enables more efficient
collaboration and seamless phased
array data management.
• Share your instrument’s screen
with colleagues for guidance or a
second opinion
• Data can be uploaded to the Cloud, so
it’s accessible from anywhere
• Save inspection setup files in the Cloud
to access as necessary or deploy to
jobs through the OSC Hub
• Access your calibration certificates
from the Cloud
• Wireless firmware update helps
ensure you’ve got the latest software
and features

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Specifications
Type Multibeam sets, multimode ultrasonic flaw detector Data Specifications
Power Supply 18 V, 3.9 A Processing Maximum Number Up to 16,384
Size (W × H × D) 330 mm × 215 mm × 142 mm (13 in. × 8.5 in. × 5.6 in.) of A-Scan Data
Points
Weight 5.7 kg (with 1 battery) (12.6 lbs)
Real-Time Averaging PA: 2, 4, 8, 16
Hard Drive Capacity 8 GB DDR (RAM); 64 GB SSD UT: 2, 4, 8, 16, 32, 64
Storage Devices SDHC™ and SDXC™ cards or most standard USB storage devices Rectification RF, full wave, half wave+, half wave-
Max Onboard File Size 4 GB Filtering PA channel: 3 low-pass, 6 band-pass, and 4 high-pass
GPS Yes (unless specified otherwise for some regions) filters
Alarms 3 UT channel: 3 low-pass, 6 band-pass, and 4 high-pass
filters (3 low-pass filters when configured in TOFD)
Wireless Connection Yes (USB dongle sold separately as an accessory)
Video Filtering Smoothing (adjusted to the probe frequency range)
PA Connectors 1 connector
Programmable TCG Number of Points 32: One TCG (time-corrected gain) curve per focal law
Number of Beam Sets 8 beam sets, 1,024 focal laws
Range PA (standard): 40 dB per step of 0.1 dB
UT Connectors 4 (2 channels P/R) PA (extended): 65 dB per step of 0.1 dB
Certifications ISO 18563-1:2015 UT: 100 dB per step of 0.1 dB
EN12668-1:2010 Maximum Slope PA (standard): 40 dB/10 ns
Display PA (extended): 0.1 dB/10 ns
UT: 40 dB/10 ns
Technology Resistive touch screen
Acoustic Specifications
Size 269 mm (10.6 in.)
PA Channel UT Channels
Resolution 1280 × 768 pixels
Pulser Voltage 40 V, 80 V, and 115 V 95 V, 175 V, and 340 V
Number of Colors 16 million
Pulse Width Adjustable from 30 ns Adjustable from 30 ns to
Type TFT LCD
to 500 ns; resolution of 1,000 ns; resolution of 2.5 ns
Viewing Angles Horizontal: −85° to 85° 2.5 ns
Vertical: −85° to 85°
Fall Time < 10 ns < 10 ns
I/O Ports
Pulse Shape Negative square pulse Negative square pulse
USB 2.0 2 ports (one hidden behind the battery)
Output Impedance 35 Ω in pulse-echo < 30 Ω
USB 3.0 1 port 30 Ω in pitch-catch
Video Output Video out (HDMI) Receiver Gain Range 0 dB to 80 dB maximum 0 dB to 120 dB maximum
Memory Card SDHC port input signal; 550 mVp-p input signal; 34.5 Vp-p (full-
(full-screen height) screen height)
Communication Ethernet
Input Impedance 57 Ω ± 10% at 9 MHz in 60 Ω in pulse-echo mode
I/O Lines pulse-echo 50 Ω in pulse-receive mode
Encoder 2-axis encoder line (quadrature or clock/direction) Input Impedance 100 Ω ± 10% at 9 MHz in
Digital Input 6 digital inputs, TTL pitch-catch
Digital Output 5 digital outputs, TTL System Bandwidth .5 MHz to 18 MHz 0.25 MHz to 28 MHz
Acquisition ON/OFF Through the configuration of a digital input Beam Formation Scan Type Single, linear, sectorial, -
Switch compound, and TFM
Power Output Line 5 V nominal, 1 A (short-circuit protected), and 12 V output at 1 A Aperture OMNIX3-PA16128PR = -
16 elements
External DC Supply OMNIX3-PA32128PR =
DC-IN Voltage 15 VDC to 18 VDC (min. 50 W) 32 elements
Connector Circular, 2.5 mm pin diameter, center-positive Number of OMNIX3-PA16128PR = -
Elements 16 elements
Battery
OMNIX3-PA32128PR =
Type Lithium-ion battery 32 elements
Capacity 93 Wh Number of Focal 1024 -
Number of Batteries 2 Laws
Life 5 hours using 2 batteries (hot-swap capable) Delay Range 0 µs to 10 µs in 2.5 ns -
Transmission increments
PA/UT Configuration
Delay Range 0 µs to 6.4 µs in 2.5 ns -
Frequency Digitizing Frequency 100 MHz Reception increments
Max PRF 12 kHz TFM/FMC
Display Refresh Rate A-scan: 60 Hz; S-scan: 20 Hz to 30 Hz Supported Modes LL, LLL, LLLL,
Envelope (Echo Yes: Volume-corrected S-scan (30 Hz) TT, TTT, TTTT,
Dynamic Mode) LTT, TLT, TLL
A-Scan Height Up to 800% Parallel Multimode TFM Yes
Synchronization On Internal Clock 1 Hz to 10 kHz Number of Beam Sets 2 beam sets
External Pace Yes Maximum Aperture 64 elements extended aperture
On Encoder On 2 axes: from 1 to 65,536 steps Image Resolution Up to 1024 × 1024 (1 MM points)
Operating Environment
Ingress Protection IP65 certified (completely protected against dust and water jets from all directions
Rating (6.3 mm nozzle)).
Shockproof Rating Drop tested according to MIL-STD-810G
Intended Use Indoor and outdoor use
Altitude Up to 2,000 m
Operating Temperature -10 °C to 45 °C (14 °F to 113 °F)
Storage Temperature −20 °C to 60 °C (−4 °F to 140 °F) (with battery inside)
−20 °C to 70 °C (−4 °F to 158 °F) (with no battery inside)
Maximum Relative Max. 70% RH at 45 °C (113 °F) noncondensing
Humidity (RH)
Pollution Degree 2
Installation/Overvoltage II
Category
E0440132EN

is certified to ISO 9001, ISO 14001, and OHSAS 18001.


*All specifications are subject to change without notice.
All brands are trademarks or registered trademarks of their respective owners and third party entities.
Olympus and OmniScan are registered trademarks, and Dual Linear Array is a trademark of Olympus

www.olympus-ims.com
Corporation. SD, SDHC, and SDXC are trademarks of SD-3C, LLC.
Copyright © 2018 by Olympus.

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For inquiries - contact 1109 78 Ave, Edmonton (Alberta) T6P 1L8
www.olympus-ims.com/contact-us
OmniScan_X3_EN_201811 • Printed in the USA • P/N: 920-XXX-EN Rev. A

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