System Z GC28-6914-01f

zEnterprise EC12
Installation Manual for Physical Planning
2827
All Models
GC28-6914-01
Level 01f

zEnterprise EC12
Installation Manual for Physical Planning
2827
All Models
GC28-6914-01
Level 01f
Level 01f
Note:
Before using this information and the product it supports, read the information in “Safety” on
page v, Appendix G, “Notices,” on page 147, and IBM Systems Environmental Notices and User
Guide, Z125–5823.
This edition, GC28-6914-01, applies to the IBM zEnterprise EC12 (zEC12). This edition replaces GC28-6914-00.
There may be a newer version of this document in a PDF file available on Resource Link. Go to
http://www.ibm.com/servers/resourcelink and click Library on the navigation bar. A newer version is indicated by a
lowercase, alphabetic letter following the form number suffix (for example: 00a, 00b, 01a, 01b).
© Copyright IBM Corporation 2012, 2014.
US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract
with IBM Corp.
Level 01f
Contents
Safety . . . . . . . . . . . . . . . v Chapter 4. Guide for raised floor
Safety notices . . . . . . . . . . . . . . v preparation . . . . . . . . . . . . . 59
Danger notices . . . . . . . . . . . . v Casters . . . . . . . . . . . . . . . . 60
World trade safety information . . . . . . . v Procedure for cutting and placement of floor panels 61
Laser safety information . . . . . . . . . . v Raised floor with 610 mm (24 in) or 600 mm
Laser compliance . . . . . . . . . . . . v (23.5 in) floor panels . . . . . . . . . . 62
About this publication . . . . . . . . vii Chapter 5. Power requirements . . . . 65

Revisions . . . . . . . . . . . . . . . vii Power installation considerations . . . . . . . 66
Related publications . . . . . . . . . . . vii I/O units . . . . . . . . . . . . . . . 67
Licensed Machine Code . . . . . . . . . . viii Line cord/bulk power regulator (BPR) specifications 68
Accessibility . . . . . . . . . . . . . . viii Power specifications . . . . . . . . . . . 70
Accessibility features . . . . . . . . . . viii Power estimation tool . . . . . . . . . . . 72
Keyboard navigation . . . . . . . . . . viii Power capping . . . . . . . . . . . . . 72
IBM and accessibility . . . . . . . . . . viii Customer circuit breakers (CBs) . . . . . . . 73
How to send your comments . . . . . . . . ix Internal battery feature (FC 3213) . . . . . . . 74
Unit emergency power off (UEPO) . . . . . 75
Summary of changes . . . . . . . . . xi Computer room emergency power off (EPO) . . 76
Power plugs and receptacles. . . . . . . . . 77
Chapter 1. Introduction . . . . . . . . 1 Grounding specifications . . . . . . . . . . 80
System planning . . . . . . . . . . . . . 1 Top exit power cords . . . . . . . . . . . 81
Planning for a new computer room . . . . . . . 1 Line cord wire specifications. . . . . . . . . 83
Planning checklist . . . . . . . . . . . . 2 Wire colors for cut-end three-phase alternating
Customized planning aid . . . . . . . . . . 6 current cords . . . . . . . . . . . . . 85
ASHRAE declarations - radiator-cooled . . . . . 7 Wire colors for cut-end direct current cords. . . 85
ASHRAE declarations - water-cooled . . . . . . 9 Line physical protection . . . . . . . . . 85
Service outlet (customer-supplied) . . . . . . . 85
Chapter 2. Environmental
Chapter 6. Hardware Management
specifications . . . . . . . . . . . . 11
Conductive contamination . . . . . . . . . 15
Console and Support Element
communications . . . . . . . . . . 87
Chapter 3. Models and physical Support Element. . . . . . . . . . . . . 87
Hardware Management Console . . . . . . . 87
specifications . . . . . . . . . . . . 17 Ethernet LAN switch support . . . . . . . . 88
Physical dimensions . . . . . . . . . . . 19 Ethernet network connection requirements . . . . 88
Shipping specifications . . . . . . . . . 20 Hardware Management Console and Support
zEnterprise zEC12 models . . . . . . . . 22 Element wiring options . . . . . . . . . . 90
I/O cages, I/O drawers, and PCIe I/O drawers 28 Trusted Key Entry (TKE) . . . . . . . . . . 90
System upgrades . . . . . . . . . . . 29 LAN connections . . . . . . . . . . . 91
Differences between IBM servers . . . . . . . 30 Planning for an ensemble. . . . . . . . . . 92
Plan views. . . . . . . . . . . . . . . 31
Weight distribution . . . . . . . . . . . . 33
System weight examples . . . . . . . . . 37
Chapter 7. Remote Support Facility
Weight distribution and multiple systems . . . 38 (RSF) installation planning . . . . . . 93
Machine and service clearance areas . . . . . . 40 Choosing a communications method for remote
Cooling recommendations for the room . . . . . 42 support. . . . . . . . . . . . . . . . 93
Special cooling recommendations for water-cooled Using the internet for remote support . . . . 93
machine . . . . . . . . . . . . . . . 48 Server address lists and host names . . . . . 94
Water supply . . . . . . . . . . . . . 48
Supply hoses . . . . . . . . . . . . . 48 Chapter 8. I/O cabling and connectivity 95
Materials used in the water cooling units . . . 53 Top exit I/O cabling . . . . . . . . . . . 95
Water specifications. . . . . . . . . . . 54 IBM Site and Facilities Services . . . . . . . . 97
Considerations for multiple system installations . . 57 Customer fiber optic cabling responsibilities . . . 98
FICON channel features . . . . . . . . . . 99
Configuration information . . . . . . . . 99
© Copyright IBM Corp. 2012, 2014 iii

Level 01f
FICON references . . . . . . . . . . . 101 Relevant international standards . . . . . . . 131

ISC-3 link feature . . . . . . . . . . . . 102
Configuration information . . . . . . . . 102 Appendix D. 3-phase dual power
OSA-Express features. . . . . . . . . . . 104 installation . . . . . . . . . . . . 133
Configuration information . . . . . . . . 104
OSA-Express references . . . . . . . . . 108
| I/O interconnect links . . . . . . . . . . 108 Appendix E. Balancing power panel
InfiniBand fiber optic link features . . . . . . 109 loads . . . . . . . . . . . . . . . 139
Flash Express (FC 0402) . . . . . . . . . . 110
| Native PCIe adapters . . . . . . . . . . . 110 Appendix F. Frame tie-down . . . . . 141
| 10GbE RoCE Express (FC 0411) . . . . . . 111 Raised floor frame tie-down . . . . . . . . 142
| zEnterprise Data Compression (zEDC) Express Installing the eyebolts . . . . . . . . . 142
| (FC 0420) . . . . . . . . . . . . . . 111 Nonraised floor frame tie-down . . . . . . . 145
Time synchronization . . . . . . . . . . . 113
Server Time Protocol (STP) . . . . . . . . 113 Appendix G. Notices . . . . . . . . 147
Pulse per second . . . . . . . . . . . 113
Trademarks . . . . . . . . . . . . . . 148
Connectivity information . . . . . . . . 113
Class A Notices. . . . . . . . . . . . . 148
PPS/FSP location . . . . . . . . . . . 113
Ordering PPS cables . . . . . . . . . . 114
Fiber Quick Connect (FQC) for FICON cabling . . 115
Preparing configuration definitions . . . . . 119
Chapter 9. Parallel sysplex planning 121
Appendix A. IBM standard symbols 125
Appendix B. Hardware Management

Console physical specifications . . . 127
Appendix C. Acoustics . . . . . . . 131

Acoustical noise emission levels . . . . . . . 131
iv zEC12 IMPP
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Safety
Safety notices
Safety notices may be printed throughout this guide. DANGER notices warn you of conditions or
procedures that can result in death or severe personal injury. CAUTION notices warn you of conditions
or procedures that can cause personal injury that is neither lethal nor extremely hazardous. Attention
notices warn you of conditions or procedures that can cause damage to machines, equipment, or
programs.
Danger notices
DANGER: Heavy equipment — personal injury or equipment damage might result if mishandled.
(D006)
World trade safety information

Several countries require the safety information contained in product publications to be presented in their
translation. If this requirement applies to your country, a safety information booklet is included in the
publications package shipped with the product. The booklet contains the translated safety information
with references to the US English source. Before using a US English publication to install, operate, or
service this IBM® product, you must first become familiar with the related safety information in the
Systems Safety Notices, G229-9054. You should also refer to the booklet any time you do not clearly
understand any safety information in the US English publications.
Laser safety information

All System z® models can use I/O cards such as FICON®, Open Systems Adapter (OSA), InterSystem
Channel-3 (ISC-3), or other I/O features which are fiber optic based and utilize lasers (short wavelength
or long wavelength lasers).
Laser compliance
All lasers are certified in the US to conform to the requirements of DHHS 21 CFR Subchapter J for Class
1 or Class 1M laser products. Outside the US, they are certified to be in compliance with IEC 60825 as a
Class 1 or Class 1M laser product. Consult the label on each part for laser certification numbers and
approval information.
CAUTION: Data processing environments can contain equipment transmitting on system links with
laser modules that operate at greater than Class 1 power levels. For this reason, never look into the
end of an optical fiber cable or open receptacle. (C027)
CAUTION: This product contains a Class 1M laser. Do not view directly with optical instruments.
(C028)
© Copyright IBM Corp. 2012, 2014 v

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vi zEC12 IMPP
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About this publication

This publication contains information necessary for planning the physical installation of the IBM
zEnterprise® EC12 (zEC12).
Figures included in this document illustrate concepts and are not necessarily accurate in content,
appearance, or specific behavior.
v Chapter 1, “Introduction,” on page 1 provides an introduction to planning for your system and a
planning checklist.
v Chapter 2, “Environmental specifications,” on page 11 contains important computer room
environmental information.
v Chapter 3, “Models and physical specifications,” on page 17 gives plan views, service clearances,
weight distribution, and cooling information for the system.
v Chapter 4, “Guide for raised floor preparation,” on page 59 contains information on preparation of the
raised floor.
v Chapter 5, “Power requirements,” on page 65 provides power and internal battery feature information.
v Chapter 6, “Hardware Management Console and Support Element communications,” on page 87
includes information on hardware management console and support element communications.
v Chapter 7, “Remote Support Facility (RSF) installation planning,” on page 93 contains Remote Support
Facility installation planning.
v Chapter 8, “I/O cabling and connectivity,” on page 95 discusses cable connectivity information.
v Chapter 9, “Parallel sysplex planning,” on page 121 provides information to build a Parallel Sysplex®.
v The Appendices provide IBM standard symbols, environmental specifications, acoustics, power
installation and power loads, a sample cabling schematic and upgrade paths.
Revisions
A technical change to the text is indicated by a vertical line to the left of the change.
Related publications
IBM publications that you will find helpful and that you should use along with this publication are in the
following list. You can access these books from Resource Link® at http://www.ibm.com/servers/resourcelink,
and click Library from the navigation bar on the left. Then select the server product.
v Systems Safety Notices, G229-9054
v IBM Systems Environmental Notices and User Guide, Z125-5823
v zEnterprise EC12 Installation Manual, GC28-6913
v System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links, and Open System Adapters),
GA23-1406
v System z FICON Channel-to-Channel Reference, SB10-7157
v Open System Adapter-Express Integrated Console Controller User’s Guide , SA22-7990
v zEnterprise, System z10, System z9 and zSeries Open Systems Adapter-Express Customer's Guide and
Reference, SA22-7935
In addition to these references, there is also general computer room planning information on IBM's
Resource Link (http://www.ibm.com/servers/resourcelink).
© Copyright IBM Corp. 2012, 2014 vii

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Licensed Machine Code

Licensed Machine Code is provided in accordance with the terms and conditions of the applicable IBM
Customer Agreement or other applicable written agreement between the customer and IBM.
Licensed Machine Code (LMC) is a fundamental component of the zEC12 and is copyrighted and
licensed by IBM. Each zEC12 is delivered with Licensed Machine Code that is customized to the specific
machine ordered. The Licensed Machine Code enables the server to operate in accordance with its Official
Published Specifications.
Model upgrades, feature additions, and system engineering changes may require updated Licensed
Machine Code for the system. Updated Licensed Machine Code replaces the existing Licensed Machine
Code.
Relocation of a zEC12 requires that the Licensed Machine Code be reinstalled in the server at the new
location. Refer to the “Discontinuing the System” section of the zEnterprise EC12 Installation Manual for
the procedure for relocating a zEC12.
Accessibility
IBM strives to provide products with usable access for everyone, regardless of age or ability.
Accessible publications for this product are offered in HTML format and can be downloaded from
Resource Link at http://www.ibm.com/servers/resourcelink.
If you experience any difficulty with the accessibility of any System z information, go to Resource Link at
http://www.ibm.com/servers/resourcelink and click Feedback from the navigation bar on the left. In the
Comments input area, state your question or comment, the publication title and number, choose General
comment as the category and click Submit. You can also send an email to [email protected] providing
the same information.
When you send information to IBM, you grant IBM a nonexclusive right to use or distribute the
information in any way it believes appropriate without incurring any obligation to you.
Accessibility features
The following list includes the major accessibility features in System z documentation:
v Keyboard-only operation
v Interfaces that are commonly used by screen readers
v Customizable display attributes such as color, contrast, and font size
v Communication of information independent of color
v Interfaces commonly used by screen magnifiers
v Interfaces that are free of flashing lights that could induce seizures due to photosensitivity
Keyboard navigation
This product uses standard Microsoft Windows navigation keys.
IBM and accessibility

See the IBM Human Ability and Accessibility Center for more information about the commitment that
IBM has to accessibility.
viii zEC12 IMPP

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How to send your comments

Your feedback is important in helping to provide the most accurate and high-quality information. Send
your comments by using Resource Link at http://www.ibm.com/servers/resourcelink. Click Feedback
on the navigation bar on the left. You can also send an email to [email protected]. Be sure to include
the name of the book, the form number of the book, the version of the book, if applicable, and the
specific location of the text you are commenting on (for example, a page number, table number, or a
heading).
About this publication ix

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x zEC12 IMPP
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Summary of changes
Summary of changes for the zEnterprise EC12 Installation Manual for Physical Planning, GC28-6914.
Table 1. Summary of changes
Release Level Date Changes in Level
01f 10/2014 This revision contains editorial changes and the following technical changes:
v Updated the weight values on pages 7-10, 20, 30, 33, and 37.
01e 06/2014 This revision contains editorial changes and the following technical changes:
v Updated the height of the top exit I/O cable towers to include the optional
cable management brackets
v Updated the weight of the top exit I/O cable towers
v Updated the location of the installed Fiber Quick Connection mounting
brackets.
01d 04/2014 This revision contains editorial changes and the following technical changes:
v Added a note to “Procedure for cutting and placement of floor panels” on
page 61.
01c 01/2014 This revision contains editorial changes and the following technical changes:
v Corrected the host name URL. See“Host names” on page 94.
01b 01/2014 This revision contains editorial changes and the following technical changes:
v Updated the watertight receptacle information for the 415 VAC power cords.
See Table 32 on page 78 in “Power plugs and receptacles” on page 77.
01a 10/2013 This revision contains editorial changes and the following technical changes:
v In Chapter 5, “Power requirements,” on page 65, added information about
not allowing a mix of AC and DC power and reorganized information.
01 07/2013 This revision contains editorial changes and the following technical changes:
v Updated environmental specifications information
v Added information about the 9" minimum requirement for a raised floor for
the zEC12 water-cooled models
v Added IFP (Integrated Firmware Processor) information
v Added HMC 7382 (FC 0092) information
v Added TKE 7.3 (FC 0842) information
v Added OSA-Express5S information
v Updated the Remote Support Facility (RSF) information
v Added Flash Express (FC 0402), 10GbE RoCE Express (FC 0411), and zEDC
Express (FC 0420) information
v Updated Appendix D, “3-phase dual power installation,” on page 133.
00e 03/2013 This revision contains editorial changes and the following technical changes:
v Added information about customer cabling responsibilities. See “Customer
fiber optic cabling responsibilities” on page 98
00d 01/2013 This revision contains editorial changes and the following technical changes:
v Corrected information about the frame tie-down feature codes. See
Appendix F, “Frame tie-down,” on page 141.
00c 12/2012 This revision contains editorial changes and the following technical changes:
v Added information about Ethernet switch 1 Gb speed in sections “Hardware
Management Console” on page 87 and “Ethernet LAN switch support” on
page 88.
© Copyright IBM Corp. 2012, 2014 xi

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Table 1. Summary of changes (continued)

Release Level Date Changes in Level
00b 10/2012 This revision contains editorial changes and the following technical changes:
v Changed the order number for the System z Planning for Fiber Optic Links
(FICON/FCP, Coupling Links, and Open System Adapters) document from
GA23-1353 to GA23-1406.
v Added relative humidity information to Table 2 on page 12.
v Updated the BTA information in “Water specifications” on page 54.
v Removed feature codes 4022, 4024, 4025, and 4026 from the Table 19 on page
67.
00a 09/2012 This revision contains editorial changes and the following technical changes:
v In the “Weight distribution” on page 33 section:
– Updated the weight values in Table 7 on page 33 and Table 8 on page 33.
– Updated the floor loading data in four tables.
v In the “System weight examples” on page 37 section, updated the values in
Table 9 on page 37.
v In the “Customer circuit breakers (CBs)” on page 73 section, corrected the
circuit breaker value for 380-415 VAC.
v In the “Power plugs and receptacles” on page 77 section, added supported
power cord feature codes to the table.
xii zEC12 IMPP

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Chapter 1. Introduction
This chapter is intended to help you prepare your physical site for the installation of a zEC12. Marketing
and installation planning representatives are also available to help you with installation planning. Proper
planning for your new system will facilitate a smooth installation and fast system startup.
The use of the terms, “server”, “processor”, “system” and “all models” in this publication refer to the
IBM zEC12.
System planning
As part of your system planning activity, you will make decisions about where to locate your equipment,
who will operate the system, and so on. A good plan ensures that the equipment and materials are ready
to use when the zEC12 arrives.
The type of software (operating system and application programs) that you intend to use must support
the features and devices on the system. You should already be familiar with your software requirements,
but may want to contact your IBM marketing representative for information on planning for the software.
Planning for a new computer room

A detailed step-by-step procedure for physically planning a computer room installation is located on the
General Information for Planning a Physical Site page on Resource Link (http://www.ibm.com/
servers/resourcelink). On the left navigation pane, click Planning, Physical Planning, and General
information for planning a physical site (located under zSeries & S/390®).
© Copyright IBM Corp. 2012, 2014 1

Level 01f
Planning checklist
The following checklist identifies installation tasks and responsibilities sequentially, and is designed for
new installations. If you have to renovate your site, you may need a longer planning cycle.
Site Preparation Checklist
Task/Consideration Task Assigned Target Date Completed

( )
CHECKPOINT 1
Designate a person in your organization with the responsibility

for all phases of site preparation for this system installation
Review all site planning information with the designated person
Determine who will actually perform each site preparation task
and who will control the marking of this checklist
Identify communication needs, including Remote Support Facility,
cables, switches, telephones, connection panels, etc
In the Chapter titled, “I/O cabling and connectivity” (in this document),
read the information about planning now for future cabling needs.
In the same chapter, also read “IBM Site and Facilities Services”
Identify channel needs including:
cables, directors, switches, patch panels, etc
Identify other machine/device needs including:
changes to any existing equipment
Determine the schedule with your IBM marketing representative
and fill in the target dates on this checklist
CHECKPOINT 2
Lay out the floor plan. Include stationary obstacles, walls, all computer
equipment, locations for power, lighting, heating and cooling, water and
fire detection and extinguishing equipment
If the level of acoustical noise is a concern, consider arranging the floor layout to
avoid areas of excessive noise exposure to employees, and possibly utilize noise
control screens or other treatments to reduce noise levels. Some IBM servers
have available acoustic doors to reduce noise. Check with your marketing
representative to see if your server has such options.
If this is a new computer room, see the course, General information
for planning the physical site under “Planning / Physical Planning / zSeries”
on Resource Link (http://www.ibm.com/servers/resourcelink)
Order communication equipment cables, modems, switches,
telephones, connection panels, etc
Order channel equipment cables, directors, switches, patch panels, etc.
In the Chapter titled, “I/O cabling and Connectivity” (in this document),
read the information about “IBM Site and Facilities Services”
and “Customer fiber optic cabling responsibilities” to
determine your cabling requirements and responsibilities. Your IBM
marketing representative can assist you with this task. Other parts
of this chapter include fiber optic channel and adapter descriptions
and information about the Fiber Quick Connect feature for FICON
channels.
If you are planning for a system that will use FICON channels,
InfiniBand, coupling links, or Open System Adapters (OSA),
contact your IBM marketing representative to obtain the document,
System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links,
and Open System Adapters), GA23-1406
Order other machines/devices, including changes to any existing
equipment
2 zEC12 IMPP
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( )
CHECKPOINT 3
The computer room is prepared for computer equipment service clearance

and floor loading, physical placement based on logical priority, cabling
restrictions, and shock and vibration considerations, and electromagnetic
compatibility/interference
Emergency and backup operations planning includes provisions for
fire detection, prevention, extinguishing, and control equipment, and
storm protection and damage recovery procedures
There is workspace around equipment, including passageways for
movement of people and machines, and includes consideration for
lighting and possible areas of high acoustic noise
Office equipment and space, including furniture, vending, meeting, and
entrance/exit areas have adequate lighting, heating/cooling, and
acoustics
Material and data storage provisions have been satisfied
Schedule and make changes to existing programs as required
Schedule and make changes to existing machines/devices as required
Arrange for installation of cables between work stations, controllers,
modems, switches, etc
Arrange for installation of new power receptacles and wiring
Define a training program for employees
CHECKPOINT 4
Computer room power should be completed.

electrically clean, dedicated circuits for all computer equipment
sufficient power provided to avoid outages caused by power transients
protection from lightning damage
Backup power batteries or generators, if required
Branch circuits, grounding, conduits, phase rotation, emergency controls,
to local electrical code and equipment guidelines
An adequate number of computer equipment and convenience outlets have
been provided in the locations where they are to be used
Computer room personnel are adequately trained in power procedures,
including emergency situations
Review the progress of the communications, channel, and adapter
cabling. Identify and resolve problems and schedule conflicts
Review the system configuration to make sure there are no physical
problems and that the configuration meets your needs.
Chapter 1. Introduction 3
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( )
CHECKPOINT 5
Air conditioning installation is complete

capacity and controls provided for automatic temperature and humidity levels
filtration system is adequate and maintenance plan established
regular monitoring and testing
Training for computer room personnel
If you have elected to do your own I/O cabling, as cables begin to
arrive, start installing and labeling them. Label power receptacles
as they are installed
Complete the Systems Assurance Product Review with your IBM
marketing representative or Business Partner and the system installers
Carefully measure the delivery path from the shipper drop-off point
to the raised floor install location. Accurate measurements now may
prevent installation delays later
CHECKPOINT 6
Complete communication equipment installation,

cables, modems, switches, telephones, connection panels, etc
Complete the Remote Support Facility installation
LAN and communication cables, switches, patch panels, etc
Prepare IOCP input statements or HCD definitions
Use the CHPID Mapping Tool on Resource Link to help assign
PCHIDs to CHPIDs
If you have elected to do your own I/O cabling, complete the checkout
of system cables as much as possible. Verify that the cables are
properly routed, protective end caps are in place, that the processor
ends of the cables are safely out of the way for system installation,
and that cable safety procedures are followed
Complete the checkout of the power cables. Test for continuity and
polarity, proper grounding, correct phase wiring, and general power
safety considerations
Complete the required changes to the existing programs and data
processing units
Install communication facilities, such as telephone lines
4 zEC12 IMPP
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( )
CHECKPOINT 7
Are there any new applications that must be installed/ tested before the
new system arrives?
Do you need to conduct training with computer room personnel:
- Safety?
- Security?
- Operations?
- Other?
Are there any outstanding hardware changes that need to be made
to existing:
- Computer equipment?
- Communications equipment?
- Site facilities?
Is the system configuration ready for installation:
- IOCP input?
- CHPIDs?
Do you have a comprehensive channel cabling plan in place:
- Are all cables either ordered or on hand?
- Do you have a reliable installer ready to go?
- Are plans in place for cable connection at remote devices?
- Is there a system test plan?
- Are you prepared to provide cable labels or labeling information?
- Are protective end cap devices in place on all cable connectors?
- Are cables routed and coiled out of the way for installation?
Is the path for moving the new equipment:
- Wide enough?
- High enough?
- Free of obstructions?
- Ramps ready, if necessary?
Are floor panels ready?
Is all furniture and miscellaneous equipment in place or out of the
way for installation?
Is your setup team trained and ready for the arrival of the new equipment?
Complete the site preparation
ARRIVAL OF NEW EQUIPMENT
Move unit(s) to installation location.

Place the units according to machine clearance dimensions provided in
“Machine and service clearance areas” (in this document).
Unpack unit(s) according to instructions.
Call your service provider to install the unit(s).
Level 01f
Customized planning aid

A customized planning aid will be available for your system one day after receipt of your order in
manufacturing. You may obtain access to this aid by registering on Resource Link. This planning aid will
include unique physical planning requirements based on your system’s specific configuration.
It is important to note here that the planning aid is not intended to replace this manual. You should be
familiar with the contents of this document before you attempt to use the planning aid.
6 zEC12 IMPP
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ASHRAE declarations - radiator-cooled
ASHRAE Declarations (Metric) for 2827 (Radiator-cooled)

Typical Airflow Airflow Weight Overall System Maximum Maximum Maximum
ASHRAE Class 1 Heat Nominal Maximum Maximum Dimensions Elevation Dry Bulb Dew Point
Release Temperature
(1) (1) (2, 5, 6, 7) (8) (4, 10) (3, 10) (10)
Description 0 0
kBTU m3/hr m3/hr kg W X D X H (cm) m C C
Minimum Configuration
Model H20 19.5 1801.8 2552.5 1357 156.8 X 186.9 X 201.5 3048 32 17
FC 1095
Maximum Configuration
Model HA1 92.6 4504.4 5839.1 2522 156.8 X 186.9 X 201.5 3048 32 17
FC 1106
ASHRAE Declarations (English) for 2827 (Radiator-cooled)

Release Temperature
(1) (1) (2, 5, 6, 7) (8) (4, 10) (3, 10) (10)
Description 0 0
kBTU cfm cfm lbs W X D X H (in) ft F F
Model H20 19.5 1080 1530 2993 61.7 X 73.6 X 79.3 10,000 89 62.6
FC 1095
Model HA1 92.6 2700 3500 5559 61.7 X 73.6 X 79.3 10,000 89 62.6
FC 1106
Airflow Diagram Cooling Scheme

Front to Rear
er
S erv
f the
nt o
Fro
Figure 1. ASHRAE declarations - radiator-cooled
Notes:
1. Airflow is designed to increase as the local ambient room temperature increases. Nominal airflow
assumes 25o C (77o F) ambient. Maximum airflow is based on an ambient of 32o C (89o F) for all
models.
2. Weights provided assume the optional Integrated Battery Features are installed.
3. For ambient temperatures exceeding 25o C (77o F), the acoustical noise levels of the system may
increase significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,”
on page 131 for the declared acoustical noise emission levels for the system under nominal
temperature conditions of 23o C plus or minus 2o C (73.4o F plus or minus 3.6o F).
4. Maximum ambient reduces 1o C (1.8o F) for every 300 m (984 ft) over 900 m (2953 ft).
5. Weights are approximately maximum for populated frames except where indicated below.
Level 01f
| 6. Weights do not include covers which add approximately 74.4 kg (164 lbs) to each frame.
| 7. The top exit I/O cable towers will add approximately 27.2 kg (60 lbs) to each frame.
| 8. The top exit I/O cable towers will add 305 mm (12 inches) to the width. If the optional cable
| management brackets are used, the overall system height will increase. See “Top exit I/O cabling”
| on page 95 for details.
9. At inlet air temp 28o C (82.4o F), air cooling is 100%.
10. See the elevation label ( ) or tropical climate label ( ) in the Systems Safety Notices document to
determine if there are any elevation limitations or tropical climate limitations for your country.
8 zEC12 IMPP
Level 01f
ASHRAE declarations - water-cooled
ASHRAE Declarations (Metric) for 2827 (Water-cooled)

Release (2, 5, 6, Temperature
(10) (1) (1) 7, 9) (8) (4, 11) (3, 11) (11)
Description 0 0
kBTU m3/hr m3/hr kg W X D X H (cm) m C C
Model H20 18.5 1384.7 1968.6 1407 156.8 X 197.1 X 201.5 3048 32 17
FC 1099
Model HA1 89.3 3570.2 4554.5 2572 156.8 X 197.1 X 201.5 3048 32 17
FC 1145
ASHRAE Declarations (English) for 2827 (Water-cooled)

Release (2, 5, 6, Temperature
(10) (1) (1) 7, 9) (8) (4, 11) (3, 11) (3, 11)
Description 0 0
kBTU cfm cfm lbs W X D X H (in) ft F F
Model H20 18.5 830 1180 3103 61.7 X 77.7 X 79.3 10,000 89 62.6
FCs 1099
Model HA1 89.3 2140 2730 5669 61.7 X 77.7 X 79.3 10,000 89 62.6
FCs 1145
Airflow Diagram Cooling Scheme

Front to Rear
ver
Ser
he
nt of t
Fro
Figure 2. ASHRAE declarations - water-cooled
Notes:
1. Airflow is designed to increase as the local ambient room temperature increases. Nominal airflow
assumes 25o C (77o F) ambient. Maximum airflow is based on an ambient of 32o C (89o F) for all
models.
2. Weights provided assume the optional Integrated Battery Features are installed.
3. For ambient temperatures exceeding 25o C (77o F), the acoustical noise levels of the system may
increase significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,”
on page 131 for the declared acoustical noise emission levels for the system under nominal
temperature conditions of 23o C plus or minus 2o C (73.4o F plus or minus 3.6o F).
4. Maximum ambient reduces 1o C (1.8o F) for every 300 m (984 ft) over 900 m (2953 ft).
5. Weights are approximately maximum for populated frames except where indicated below.
Level 01f
| 6. Weights do not include covers which add approximately 74.4 kg (164 lbs) to each frame.
| 7. The top exit I/O cable towers will add approximately 27.2 kg (60 lbs) to each frame.
| 8. The top exit I/O cable towers will add 305 mm (12 inches) to the width. If the optional cable
| management brackets are used, the overall system height will increase. See “Top exit I/O cabling”
| on page 95 for details.
9. Weights for the water cooled option are dry weights. When filled, water will add 22.7 kg (50 lbs) to
the total.
10. At inlet air temp 28o C (82.4o F) – water cooling for the H20 is 55% to 60%, water cooling for the
HA1 is 60% to 65%.
11. See the elevation label ( ) or tropical climate label ( ) in the Systems Safety Notices document to
determine if there are any elevation limitations or tropical climate limitations for your country.
10 zEC12 IMPP
Level 01f
Chapter 2. Environmental specifications

The System z family of IBM servers is among the most powerful group of mainframe processors ever
built. Technology improvements have placed these servers in the top levels of Reliability, Availability, and
Serviceability. But it takes more than premium computer equipment to achieve these goals. The data
center environment must be able to support the demands that zEC12 capability requires. On the
following pages, environmental specifications are presented in tabular and graphic forms to emphasize
how important it is that you provide the conditions necessary to utilize all of the power the zEC12 offers.
Environmental specifications are presented in two categories: Required and Recommended. Obviously,
meeting the required specifications is prerequisite to using the zEC12. IBM strongly suggests you strive
| for more than the minimum requirements. The powerful computing zEC12 provides generates heat that
| must be removed from the server. Operating your data center most of the time within the recommended
| specification ranges instead of the required range will enhance its reliability and efficiency.
Unless otherwise noted on individual specification pages, the following environmental specifications,
based on an altitude from sea level to 900 meters (2953 feet), apply:

Level 01f
Table 2. Environmental specifications - table format

Environment, operating: 1, 5
High ambient Long-term recommended Maximum ambient allowed
temperature 27°C (80.6°F) 4 32°C (89.6°F) 4
Low ambient Long-term recommended Minimum ambient allowed
temperature 18° (64.4°F) 15° (59°F)
Low end humidity Long-term recommended Minimum relative humidity allowed
5.5°C (41.9°F) dew point 20% relative humidity
High end humidity Long-term recommended Maximum relative humidity allowed
60% relative humidity and 15°C (59°F) 80% relative humidity and 17°C (62.6°F) dew
dew point point
2
Gasious contamination Class G1 as per ANSI/ISA S71.04–1985
Particulate 1. Room air must be filtered continuously using appropriate filters.
contamination
2. The deliquescent relative humidity of the particulate contamination shall be more than
80% . 3
5
Environment, nonoperating:
Temperature 5°C (45°F) to 41°C (113°F)
Relative humidity 8% - 80% R/H
Maximum dew point Less than 27°C (80.6°F)
2
Gaseous contamination Class G1 as per ANSI/ISA S71.04–1985
Environment, shippings:
Temperature -40°C (-40°F) to 60°C (140°F)
Relative humidity 5% - 100% R/H (no condensation)
Web bulb Less than 29°C (84.2°F)
Shipping package IBM-approved vapor barrier bag with desiccant
Environment, storage:
Temperature 1°C (33.8°F) to 60°C (140°F)
Relative humidity 5% -80% R/H (no condensation)
Web bulb Less than 29°C (84.2°F)
Shipping package IBM-approved vapor barrier bag with desiccant
Notes:
1. Maximum ambient temperature reduces 1°C (1.8°F) for every 300 m (984 ft) over 900 m (2953 ft).
2. ANSI/ISA-S71.04. 1985. "Environmental conditions for process measurement and control systems: Airborne
contaminants." Instrument Society of America, Research Triangle Park, NC, 1985.
3. The deliquescent relative humidity of particulate contamination is the relative humidity at which dust absorbs
enough water to become wet and promote ionic conduction.
4. For ambient temperatures exceeding 25°C (77°F), the acoustical noise levels of the system may increase
significantly as the speeds of the air moving devices increase. See Appendix C, “Acoustics,” on page 131 for the
declared acoustical noise emission levels for the system under nominal temperature conditions of 23°C plus or
minus 2°C (73.4°F plus or minus 3.6°F).
5. The machine should be in an environment that satisfies the operating environment specifications for at least one
day before it is powered on.
12 zEC12 IMPP
Level 01f
The following illustrations reiterate the environmental specifications in graphic form.
Psychrometric Chart
? SI (metric) units
? Barometric pressure 101.325 kPa (sea level)
? Curved lines represent % of Relative Humidity (RH)
? Vertical lines represent Dry Bulb temperature in degrees Celeius ( C )
? Points on saturation line (100% RH) represent Dew Point temperature in degrees Celcius ( C )
28.5 25.0
90%
80%
26.8 22.5
Dew Point Temperature, degree C 70%
60% 20.0
24.9
50%
Moisture Content, g/kg dry air

22.7 17.5
40%
20.3 15.0
30%
17.4 12.5
17.0
20%
15.0 10.0
14.0
9.7 7.5
10%
5.5
3.9 5.0
2.5
0.0
0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0
Dry Bulb Temperature, degree C
Figure 3. Environmental specifications - graph format
Chapter 2. Environmental specifications 13

Level 01f
Meets the ASHRAE recommended guidelines

Meets the ASHRAE allowable guidelines
Exceeds the ASHRAE environmental limits
Data center temperature in degrees Celsius (C) 150 C minimum, 320 C maximum
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
8
10
12
14
16
20% minimum, 80% maximum
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
Data center % Relative Humidity
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
Figure 4. Environmental specifications - bar graph format
It is very important the environmental specifications be met immediately in front of both frames of
the zEC12. Ideally, it would be best if the temperature and humidity controls are good enough to
surround the service area of the zEC12. If you are able to exceed the required conditions, focus your
efforts to provide the best quality air at the bottom front of the server.
14 zEC12 IMPP
Level 01f
Conductive contamination
Semiconductors and sensitive electronics used in current Information Technology equipment have
allowed for the manufacture of very high density electronic circuitry. While new technology allows for
significant increases or capacity in a smaller physical space, it is susceptible to contamination, especially
contamination particles that will conduct electricity. Since the early 1990s, it has been determined that
data center environments may contain sources of conductive contamination. Contaminants include;
carbon fibers, metallic debris such as aluminum, copper and steel filings from construction, and zinc
whiskers from zinc-electroplated materials used in raised floor structures.
Although very small, and at times not easily seen without the visual aide of magnifying lenses, this type
of contamination can have disastrous impact on equipment availability and reliability. Errors, component
damage and equipment outages caused by conductive contamination can be difficult to diagnose. Failures
may be at first attributed to other more common factors such as lightning events or electrical power
quality or even just presumed to be defective parts.
The most common conductive contamination in raised-floor data centers is what is known as zinc
whiskers. It is the most common because it is frequently found on the underside of certain types of access
floor tiles. Typically, the wood core style floor tile has a flat steel bottom. The steel may be coated with
zinc either by a hot dip galvanize process or by zinc electroplate. The zinc electroplate steel exhibits a
phenomena which appears as whisker-like growths on the surface. These small particles of approximately
1-2 mm (.04-.08 in.) in length, can break away from the surface and get pulled into the cooling air stream.
Eventually they my be ingested by the equipment air, settle on a circuit board and create a problem. If
you suspect that you may have this type of problem, contact your IBM service representative.
Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or temperature might pose a risk to the
zEC12 that is described in this document. Risks that are posed by the presence of excessive particulate
levels or concentrations of harmful gases include damage that might cause the zEC12 to malfunction or
cease functioning altogether. This specification sets forth limits for particulates and gases that are
intended to avoid such damage. The limits must not be viewed or used as definitive limits because
numerous other factors, such as temperature or moisture content of the air, can influence the impact of
particulates or environmental corrosives and gaseous contaminant transfer. In the absence of specific
limits that are set forth in this document, you must implement practices that maintain particulate or gas
levels that are consistent with the protection of human health and safety. If IBM determines that the
levels of particulates or gases in your environment have caused damage to the zEC12, IBM may condition
provision of repair or replacement of zEC12 or parts on implementation of appropriate remedial
measures to mitigate such environmental contamination. Implementation of such remedial measures is a
customer responsibility.
Table 3. Contaminant descriptions
Contaminant Description
Gaseous contamination Severity level G1 as per ANSI/ISA 71.04-19851 which states that the reactivity rate
of copper coupons shall be less than 300 Angstroms per month (Å/month, ≈ 0.0039
µg/cm2-hour weight gain).2 In addition, the reactivity rate of silver coupons shall
be less than 300 Å/month (≈ 0.0035 µg/cm2-hour weight gain).3 The reactive
monitoring of gaseous corrosivity should be conducted approximately 2 inches (5
cm) in front of the rack on the air inlet side at one-quarter and three-quarter frame
height off the floor or where the air velocity is much higher.
Chapter 2. Environmental specifications 15

Level 01f
Table 3. Contaminant descriptions (continued)

Contaminant Description
Particulate contamination Data centers must meet the cleanliness level of ISO 14644-1 class 8. For data
centers without airside economizer, the ISO 14644-1 class 8 cleanliness may be met
simply by the choice of the following filtration:
v The room air may be continuously filtered with MERV 8 filters. Air entering a
data center may be filtered with MERV 11 or preferably MERV 13 filters.
v For data centers with airside economizers, the choice of filters to achieve ISO
class 8 cleanliness depends on the specific conditions present at that data center.
The deliquescent relative humidity of the particulate contamination should be

more than 60% RH.4
Data centers must be free of zinc whiskers.5
Note:
1. ANSI/ISA-71.04.1985. “Environmental conditions for process measurement and control systems:
Airborne contaminants.” Instrument Society of America, Research Triangle Park, NC, 1985.
2. The derivation of the equivalence between the rate of copper corrosion product thickness growth in
Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal proportions.
3. The derivation of the equivalence between the rate of silver corrosion product thickness growth in
Å/month and the rate of weight gain assumes that Ag2S is the only corrosion product.
4. The deliquescent relative humidity of particulate contamination is the relative humidity at which the
dust absorbs enough water to become wet and promote corrosion and/or ion migration.
5. Surface debris is randomly collected from 10 areas of the data center on a 1.5-cm diameter disk of
sticky electrically conductive tape on a metal stub. If examination of the sticky tape in a scanning
electron microscope reveals no zinc whiskers, the data center is considered free of zinc whiskers.
6. If there is any question about potential corrosive gases or level of particulates, contact your IBM
representative for assistance in monitoring the environment.
Beyond the specific information provided in this document, IBM recommends that the customer's facility
meet the general guidelines published in the American Society of Heating, Refrigeration, and Air Conditioning
Engineers (ASHRAE) Handbook.
16 zEC12 IMPP
Level 01f
Chapter 3. Models and physical specifications

This chapter provides the following detailed information for the zEC12.
v Model and frame descriptions
v Shipping specifications
v Plan view and specifications
v Weight distribution data
v Machine and service clearance areas
v Cooling recommendations.
Facts you should know about the zEC12:

v zEC12 is always a two-frame system
v zEC12 may have either two or four line cords, depending on the model you select. If you choose a
server that requires only two power cords, but want to be prepared for future growth, you may order
the Plan Ahead for Line Cord feature, FC 2000, which ships all four line cords regardless of the model.
v zEC12 can be powered from either an AC or DC source.
v The zEC12 can be either radiator cooled or water cooled.

Level 01f
| The zEC12 water-cooled models can only be installed on a raised floor. To accommodate the bend
| radius of the water hoses, the height of the raised floor (subfloor to top surface of floor tile) must be a
| minimum of 228.6 mm (9 inches).
| The zEC12 radiator-cooled models can be installed on a raised floor or a nonraised floor.
v The zEC12 can be installed on a nonraised floor. In a nonraised floor environment, where cables are
exposed, refer to local and national electric and safety codes for more information.
Note: If zEC12 is installed on a nonraised floor, the top exit I/O cable option (FC 7942) and the top
exit power cable option (FC 7901) must be used.
v zEC12 provides an top exit I/O cable option (FC 7942). This consists of I/O cable towers installed at all
four corners of the server (two each on the A and Z frames). If selected, these towers and the side
covers that go with them are shipped in separate containers.
zEC12 provides an top exit power cable option (FC 7901).
Note: If nonraised floor feature is selected, both the top exit I/O cable option (FC 7942) and the top
exit power cable option (FC 7901) must be selected.
v The frames are shipped as separate units, fastened together at install time.
Important:
zEC12, fully configured, can weigh in excess of 2494 kg (5500 lb). Be certain that the raised floor on
which you are going to install the server is capable of supporting this weight.
(D006)
v Feature codes 8000 and 8001 provide tie-down hardware for various height raised floors. Feature code
8002 provides tie-down hardware for nonraised floors. See Appendix F, “Frame tie-down,” on page 141
for more information.
v There are separate shipping containers for the covers for each frame.
v If you are planning an installation on a raised floor in Canada, the installation must be in accordance
with Section 12-020 of the CPC. In any country, refer to your national electric code if you have
questions about routing data processing cables in exposed areas.
18 zEC12 IMPP
Level 01f
Physical dimensions
Note: For all combinations, if the top exit I/O cabling towers (FC 7942) are installed, each frame is 153
mm (6 in) wider. See “Plan views” on page 31 for a visual reference.
Width Depth Height

A and Z frame/cover combination mm (in) mm (in) mm (in) 1
Frames w/covers (radiator-cooled) 1565.8 (61.7) 1869.2 (73.6) 2015 (79.4)
| Frames w/covers (radiator-cooled) 1871.8 (73.7) 1869.2 (73.6) 2015 (79.4)
with top exit I/O cable towers
Frames w/covers (water-cooled) 1565.8 (61.7) 1971.2 (77.6) 2015 (79.4)
| Frames w/covers (water-cooled) 1871.8 (73.7) 1971.2 (77.6) 2015 (79.4)
with top exit I/O cable towers
Note:
1. If the top exit I/O cable towers are installed and the optional cable management brackets are used, the overall
system height will increase. See “Top exit I/O cabling” on page 95 for details.
Chapter 3. Models and physical specifications 19

Level 01f
Shipping specifications
zEC12 are shipped two ways:
v Packaged systems are protected with an antistatic poly bag and heavy cardboard and roll on their own
casters. This packaging is used only in the 48 contiguous United States.
v Crated systems are protected with wooden shipping boxes and are mounted on pallets requiring
commercial lift transportation. This packaging is used for all servers shipped anywhere except the 48
contiguous United States.
Height reduction - FC 9975
If you have doorways with openings less than 2032 mm (80.0 in) high, you should order feature code
9975. This feature reduces the frame height to 1809 mm (71.2 in). The top portion of the frames are
shipped in a separate carton, as are the frame side covers.
Internal battery - FC 3213
If you ordered feature code 3213, the internal batteries are shipped in their own packaging. The batteries
must always be installed along with the server.
Dimensions
Note: The weight does not include the weight of any internal batteries.
Packaged frames Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)
Packaged frame A (radiator-cooled) 825 (32.5) 1435 (56.5) 2032 (80.0) 1023 (2256)
Packaged frame A (radiator-cooled) 825 (32.5) 1435 (56.5) 1803 (71.0) 991 (2185)
with height-reduced (FC 9975)
Packaged frame A (water-cooled) 825 (32.5) 1600 (63.0) 2032 (80.0) 1080 (2381)
Packaged frame A (water-cooled) 825 (32.5) 1600 (63.0) 1803 (71.0) 1048 (2311)
Packaged frame Z (radiator-cooled) 813 (32.1) 1397 (55.0) 2032 (80.0) 887 (1956)
Packaged frame Z (radiator-cooled) 813 (32.1) 1397 (55.0) 1803 (71.0) 855 (1885)
Packaged frame Z (water-cooled) 813 (32.1) 1499 (60.0) 2032 (80.0) 944 (2082)
Packaged frame Z (water-cooled) 813 (32.1) 1499 (60.0) 1803 (71.0) 912 (2011)
with height-educed (FC 9975)
Crated frames Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)
Crated frame A (radiator-cooled) 937 (36.5) 1618 (63.4) 2302 (87.6) 1341 (2957)
Crated frame A (water-cooled) 937 (36.5) 1727 (68.0) 2302 (87.6) 1398 (3083)
Crated frame Z (radiator-cooled) 937 (36.5) 1618 (63.4) 2302 (87.6) 1183 (2609)
Crated frame Z (water-cooled) 937 (36.5) 1727 (68.0) 2302 (87.6) 1239 (2732)
Cover set (front and rear doors) Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)
| Frame A 997.0 (39.3) 610.0 (24.1) 2248.0 (88.6) 51.7 (114)
| Frame Z 1092.2 (43.0) 1066.8 (42.0) 2171.7 (85.5) 51.7 (114)
20 zEC12 IMPP
Level 01f
Top exit I/O cable towers (FC 7942) Width mm (in) Depth mm (in) Height mm (in) Weight kg (lb)
| Frame A (two top exit I/O cable towers 762.0 (30.0) 431.8 (17.0) 2184.4 (86.0) 67.7 (149.0)
per pack)
| Frame Z (two top exit I/O cable towers 762.0 (30.0) 431.8 (17.0) 2184.4 (86.0) 67.7 (149.0)
per pack)
Important:
The zEC12 is comprised of some of the most sophisticated and complex electronic equipment ever integrated into
one computer. As such, this hardware needs to be protected from negative environmental impacts to ensure the
utmost reliability. One of the key factors affecting this reliability is moving the system from the loading dock into
the controlled environment of your computer room on the day it is delivered.
To ensure that optimum environmental conditions are maintained, work with your marketing representative to
schedule the delivery at a time when you can transport the system components from the point of delivery to the
computer room destination without unnecessary delay. Prompt handling upon arrival will prevent any possibility
of a problem caused by exposure to temperature extremes, severe weather, or high humidity.

Level 01f
zEnterprise zEC12 models

There are five models zEC12 (machine type 2827) models: H20, H43, H66, H89 and HA1. Each model
contains user-definable Processor Units (PUs), System Assist Processors (SAPs), and spare PUs (used to
provide uninterrupted computing if there should be a problem with a working PU).
The following table lists the feature codes for each model. You will use the feature codes to place your
zEC12 order.
Table 4. Processor descriptions
Feature code Description
1095 Model H20, radiator-cooled, 1 processor book
1096 Model H43, radiator-cooled, 2 processor books
1106 Model HA1, radiator-cooled, 4 processor books
1099 Model H20, water-cooled, 1 processor book
1100 Model H43, water-cooled, 2 processor books
1145 Model HA1, water-cooled, 4 processor books
The server models are shown in the following illustration with InfiniBand copper and InfiniBand optical
ports installed. The actual number of ports for any model is dependent on total system configuration as
ordered. Model specifications are described in Table 5 on page 24.
Notes:
1. InfiniBand copper cables are used only to connect the I/O cages and I/O drawers to the processor.
2. PCIe copper cables are used to connect PCIe I/O drawers to the processor.
22 zEC12 IMPP
Level 01f
H20 H43
Slot 1 Slot 6 Slot 10 Slot 15 Slot 1 Slot 6 Slot 10 Slot 15
D1 D1
D2 D2
D3 D3
D4 D4
D5 D5
D6 D6
D7 D7
D8 D8
D9 D9
DA DA
H66 H89/HA1
Slot 1 Slot 6 Slot 10 Slot 15 Slot 1 Slot 6 Slot 10 Slot 15
D1 D1
D2 D2
D3 D3
D4 D4
D5 D5
D6 D6
D7 D7
D8 D8
D9 D9
DA DA
Copper fanouts InfiniBand optical fanouts

JR1
JR2
JT2
JT1
J4
J3
J2
J1
RX
RX
TX
TX
HCA3-O LR
HCA2-O LR HCA3-O
HCA2-C
PCIe HCA2-O

Level 01f
Table 5. Model feature codes and options

Feature code Description - number of processor books I/O connectors
Model H20 v 1 book 16 total connector positions available
FC 1095 (radiator-cooled) v 0 - 20 CPs v 0 - 16 InfiniBand Optical
FC 1099 (water-cooled) v 0 - 20 IFLs
v 0 - 19 uIFLs
v 0 - 20 ICFs
v 0 - 10 zAAPs
v 0 - 10 zIIPs
| v 1 - IFP
v 4 - base SAPs, 0 - 4 optional SAPs,
v 2 - spares
Model H43 v 2 books 32 total connector positions available
v 0 - 42 uIFLs
v 0 - 43 ICFs
v 0 - 21 zAAPs
v 0 - 21 zIIPs
| v 1 - IFP
v 8- base SAPs, 0 - 8 optional SAPs,
v 2 - spares
v 0 - 65 uIFLs
v 0 - 66 ICFs
v 0 - 33 zAAPs
v 0 - 33 zIIPs
| v 1 - IFP
v 2 - spares
v 0 - 88 uIFLs
v 0 - 89 ICFs
v 0 - 44 zAAPs
v 0 - 44 zIIPs
| v 1 - IFP
v 2 - spares
Model HA1 v 4 books 48 total connector positions available
v 0 - 100 uIFLs
v 0 - 101 ICFs
v 0 - 50 zAAPs
v 0 - 50 zIIPs
| v 1 - IFP
v 2 - spares
FC 3213 v Internal Battery Feature
v Available in all models
v Up to three pairs of batteries are
provided, depending on system power
configuration.
24 zEC12 IMPP
Level 01f
Table 5. Model feature codes and options (continued)

Feature code Description - number of processor books I/O connectors
Note:
1. CP - Central Processor
2. IFL - Integrated Facility for Linux
3. ICF - Integrated Coupling Facility
4. SAP - System Assist Processor
5. zAAP - IBM System z Application Assist Processor
6. zIIP - IBM System z Integrated Information Processor
| 7. IFP - Integrated Firmware Processor
Additionally, as shown in Figure 5 on page 26 and Figure 6 on page 27:

v Internal batteries (for emergency backup power) are placed in the topmost positions in both frames. (In
the front ONLY on the A frame.)
v The system processor is located in the cage below the battery position in the A frame.
v For radiator-cooled models, the processor cooling components are located below the processor in the
front of the A frame, and from the top of the frame to the top of the I/O cage in the rear of the A
frame.
For water-cooled models, the processor cooling components are located at the bottom of the A frame
below the I/O cage, and from the top of the frame to the top of the I/O cage in the rear of the A
frame.
v The system power supply is contained in the top of the Z frame, below the battery positions.
v Input/Output features are installed in Input/Output (I/O) cage, I/O drawers, and PCIe I/O drawers.
For radiator-cooled models:
– An I/O cage or an I/O drawer and PCIe I/O drawers are installed in the empty space at the bottom
of the A frame, and
– I/O drawers and PCIe I/O drawers are installed in the area below the bulk power supply in the Z
frame.
For water-cooled models:
– An I/O cage or an I/O drawer and PCIe I/O drawers are installed in the empty space above the
water-cooling equipment in the A frame, and
– I/O drawers and PCIe I/O drawers are installed in the area below the bulk power supply in the Z
frame.

Level 01f
Front view - radiator-cooled

J1 J1
BATTERY ENBLD
(CB Must be on)
Pb
BATTERY ENBLD
(CB Must be on)
Pb
Integrated BATTERY ENBLD

(CB Must be on)
J1
Pb
BATTERY ENBLD
(CB Must be on)
J1
Pb Integrated
Batteries IBM
AC/DC
Converter
IBF PWR
J01
/0
unlock/off
/I
lock/on BPR enbld Batteries
IBM
AC/DC
Converter
IBF PWR /0 /I
J01 unlock/off lock/on BPR enbld
IBM
AC/DC
Converter
IBF PWR /0 /I
IBM
AC/DC
Converter
IBF PWR /0 /I
System IBM
AC/DC
Converter
IBF PWR
J01
/0
unlock/off
/I
lock/on BPR enbld
Power IBM
AC/DC
Converter
IBF PWR
J01
/0
unlock/off
/I
lock/on BPR enbld
Supply
J01 J02 J03 J04 N
O
R
UEPO
B
Y
P
PWR SE
P
J05 J06 J07 J08 J09
J10
.. .. .. .. ..
J11
.. .. .. .. ..
Central
NS
.. .. .. .. .. .. .. .. .. ..
W
M A R B
A S P
L S C
CMPLT STBY GOOD
J09 J10
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. ..
B
P
C
GOOD
J09 J10
Processor
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. ..
B
P
C
GOOD
Complex
I/O Drawer or PCIe I/O Drawer (CPC)
Support
Elements
I/O Drawer or PCIe I/O Drawer

Radiator
Air Cooling
Equipment
PCIe I/O Drawer

I/O Cage or PCIe I/O Drawer
PCIe I/O Drawer
Z Frame A Frame
Front view - water-cooled

J1 J1
BATTERY ENBLD
(CB Must be on)
Pb BATTERY ENBLD
(CB Must be on)
Pb
Integrated BATTERY ENBLD

(CB Must be on)
J1
Pb
BATTERY ENBLD
(CB Must be on)
J1
Pb Integrated
Batteries IBM
AC/DC
Converter
IBF PWR
J01
/0
unlock/off
/I
lock/on BPR enbld
Batteries
J01
J02
J03
J04
IBM
AC/DC
J05
J06
Converter
IBF PWR /0 /I
J07
J08

J09
J10
J12
J11
IBM
AC/DC
Converter
J14
J13
IBF PWR /0 /I
J15
J16
J17
J18
IBM
AC/DC
J19
J20
System
Converter
IBF PWR /0 /I
J21
J22

J23
J24
J25
J26
IBM
AC/DC
Converter
J27
J28
IBF PWR
Power
/0 /I
J29
J30
J31
J32
GOOD
IBM
AC/DC
Converter
IBF PWR /0 /I
Supply J01 J02 J03 J04 N

O
R
UEPO
B
Y
P
PWR SE
P
J05 J06 J07 J08 J09 J10
.. .. .. .. ..
J11
.. .. .. .. ..
Central
NS
.. .. .. .. .. .. .. .. .. ..
W
M A R B
A S P
L S C
CMPLT STBY GOOD
J09 J10
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. ..
B
P
C
GOOD
J09 J10
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. ..
B
P
Processor
C
GOOD
Complex
PCIe I/O Drawer or I/O Drawer (CPC)
Support
Elements
PCIe I/O Drawer or I/O Drawer
I/O Cage
PCIe I/O Drawer
Chilled Water
Cooling
PCIe I/O Drawer Equipment
Z Frame A Frame
Figure 5. zEC12 - front view
26 zEC12 IMPP
Level 01f
Rear view - radiator-cooled

J1
BATTERY ENBLD
(CB Must be on)
Pb
BATTERY ENBLD
(CB Must be on)
J1
Pb
Integrated
IBM
AC/DC
Converter
IBF PWR
J01
/0
unlock/off
/I
Backup Blowers
J01
J02
AC/DC
J03
J04
IBM Converter
IBF PWR /0 /I
J05
J06
J07
J08
and MDAs
J09
J10
AC/DC
IBM
J12
Converter
J11
IBF PWR /0 /I
J14
J13
J15
J16
J17
J18
AC/DC
IBM Converter
IBF PWR
J19
J20
/0 /I
J21
J22
J23
J24
AC/DC
IBM
Primary Blowers
J25
J26
Converter
IBF PWR /0 /I
J27
J28
System
J29
J30
J31
J32
AC/DC
IBM
GOOD
Converter
IBF PWR
U
/0 /I
U U U
and MDAs
J01 J02 J03 J04 N

O
R
UEPO
B
Y
P
PWR SE
P
J05 J06 J07 J08 J09 J10
.. .. .. .. ..
.. .. .. .. ..
J11
.. .. .. .. ..
.. .. .. .. ..
Power
NS
W
M A R B
A S P
L S C
CMPLT STBY GOOD
J09 J10
J01 J02 J03 J04 J05 J06 J07 J08 .. .. .. .. .. .. .. .. .. ..
.. .. .. .. .. .. .. .. .. ..
B
P
C
GOOD
J09 J10
Supply
... ... ... ... ... ... ... ... ... ...
J01 J02 J03 J04 J05 J06 J07 J08
B
..... ..... P
C
GOOD
CPC DCAs

Radiator
Pump
Unit
PCIe I/O Drawer
I/O Cage or PCIe I/O Drawer PCIe I/O Drawer
A Frame Z Frame
Rear view - water-cooled

J1
BATTERY ENBLD
(CB Must be on)
Pb
BATTERY ENBLD
(CB Must be on)
J1
Pb
Integrated
IBM
AC/DC
Converter
IBF PWR
J01
/0
unlock/off
/I
J01
J02
AC/DC
J03
J04
IBM Converter
IBF PWR /0 /I
J05
J06

J07
J08
J09
J10
AC/DC
IBM Converter
J12
J11
IBF PWR /0 /I
J14
J13
J15
J16
J17
J18
AC/DC
IBM Converter
IBF PWR
J19
J20
/0 /I
J21
J22
J23
J24
AC/DC
IBM
Primary Blowers
J25
J26
Converter
IBF PWR /0 /I
J27
J28
System
J29
J30
J31
J32
AC/DC
IBM
GOOD
Converter
IBF PWR /0 /I
U U U U
and MDAs
J01 J02 J03 J04

N
O
R
UEPO
B
Y
P
PWR SE
P
J05 J06 J07 J08 J09
J10
.. .. .. .. ..
.. .. .. .. ..
J11
.. .. .. .. ..
.. .. .. .. ..
Power
NS
W
M A R B
A S P
L S C
CMPLT STBY GOOD
J09 J10
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. .. B
P
C
GOOD
J09 J10
Supply
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. .. B
P
C
GOOD
CPC DCAs

I/O Cage
PCIe I/O Drawer

Water Cooling Unit
PCIe I/O Drawer
A Frame Z Frame
Figure 6. zEC12 - rear view

Level 01f
I/O cages, I/O drawers, and PCIe I/O drawers

The zEC12 provides I/O adapters in three different packages.
v I/O cage - legacy packaging for I/O -14 EIA units tall - provides 28 adapters, with up to four ports per
adapter.
v I/O drawer - 5 EIA units tall - provides 8 adapters, with up to four ports per adapter.
v PCIe I/O drawer - 7 EIA units tall - provides 32 adapters, with two ports per adapter.
I/O cage front view I/O cage rear view
PCIe I/O drawer front view PCIe I/O drawer rear view
D109 D209
I/O drawer front view I/O drawer rear view
You can have a maximum of 44 legacy I/O cards in a zEC12. You cannot have more than one I/O cage
and two I/O drawers.
28 zEC12 IMPP
Level 01f
System upgrades
You can carry out the following upgrades:
v 2097 (System z10® EC) model to a zEC12 radiator-cooled or water-cooled model
v 2817 (z196) air-cooled model to a zEC12 radiator-cooled or water-cooled model
v 2817 (z196) water-cooled model to a zEC12 water-cooled model.
Conversions from a 2817 (z196) or 2827 (zEC12) water-cooled model to a zEC12 radiator-cooled model is
not supported.
An upgrade includes all frames, cages, drawers, support cards, and new I/O features.

Level 01f
Differences between IBM servers

Although you cannot upgrade to a zEC12 from any previous IBM server except the z196 or z10™ EC,
minimum comparison information is provided here for those who may be placing a zEC12 on a raised
floor with G5/G6, z900, z990, z9® EC, or z10 EC, or z196 servers.
Table 6. Differences between single-frame System z servers
System family Depth (with covers) Height (with covers) Weight (Maximum)
Generation 5/6 (9672) 1143 mm (45 in) 1785 mm (70.3 in) 1502 kg (3312 lbs)
or or
1447 mm (57 in) 2026 mm (79.75 in)
z900 (2064) 1666 mm (65.6 in) 2026 mm (79.8 in) 1866 kg (4114 lbs)
z990 (2084) 1577 mm (62.1 in) 1941 mm (76.4 in) 2008 kg (4427 lbs)
z9 EC (2094) 1577 mm (62.1 in) 1941 mm (76.4 in) 2003 kg (4415 lbs)
z10 EC (2097) 1806 mm (71.1 in) 2027 mm (79.8 in) 2318 kg (5110 lbs)
z196 (2817) 1806 mm (71.1 in) 2027 mm (79.8 in) 2621 kg (5791 lbs)
(air-cooled)
z196 (2817) 1908 mm (75.1 in) 2027 mm (79.8 in) 2654 kg (5853 lbs)
(water-cooled)
| zEC12 (2827) 1869 mm (73.6 in) 2015 mm (79.3 in) 2704 kg (5963 lbs)
(radiator-cooled)
| zEC12 (2827) 1971 mm (77.6 in) 2015 mm (79.3 in) 2754 kg (6073 lbs)
(water-cooled)
Note:
1. All server frames are the same width, approximately 784 mm (30.9 in) with the side covers installed.
2. The zEC12 frames, with the optional I/O cabling top exit feature (FC 7942), are 937 mm (36.9 in) wide.
3. The zEC12, z196, z10 EC, z9 EC, and z990 always consist of two frames. G5/G6 and z900 servers may be either
one or two frames, depending on configuration. z900 servers may also have a third frame for Internal Battery
Features.
4. Major differences in power and processor packaging, cooling, and I/O cages exist between zEC12, z196, z10 EC,
z9 EC, z990, z900, and G5/G6 servers.
If you are replacing an existing IBM server, carefully read the Installation Manual for Physical Planning
(available on the Resource Link web site) to determine actual differences between your installed IBM
server and the zEC12. Plan views, physical dimensions, service clearances, aisle spacing, and power and
cooling requirements may be substantially different.
30 zEC12 IMPP
Level 01f
Plan views
Note: In the following plan views, the top exit I/O cable towers (FC 7942) are shown as gray boxes at
the outer corners of the A and Z frames in the bottom drawing. This is an optional feature.
Note: For installations planning to use top exit power cords, the frame openings for these cords are on
the top of the left front and right rear corners of the Z frame.
Radiator cooling
750 mm 750 mm
17 mm (29.5 in) (29.5 in) 17 mm
(0.7 in) (0.7 in)
266.8 mm 260.9 mm
(10.5 in) (10.3 in)
+
+
1273.2 mm 1869.2 mm 1273.2 mm 1863.2 mm

(50.1 in) Z (73.6 in) (50.1 in) A (73.4 in)
+
+
329.1 mm 329.1 mm
(13.0 in) (13.0 in)
FRONT FRONT
153 mm 34 mm
(6.0 in) (1.3 in)
254 mm
+
(10.0 in) +
762 mm Z A 1869.2 mm
(30.0 in) (73.6 in)
+ Cutout dimensions
+ Frame for raised floor
Entry/Exit
(mm) (in)
1568 mm
Front 94 x 655 3.7 x 25.8
(61.7 in)
Rear 94 x 655 3.7 x 25.8
1846 mm
(72.7 in)
FRONT

Level 01f
Chilled water cooling

750 mm 750 mm
17 mm (29.5 in) (29.5 in) 17 mm
(0.7 in) (0.7 in)
266.8 mm 260.9 mm
(10.5 in) (10.3 in)
102 mm 102 mm
(4.0 in) (4.0 in)
+
+
1375.2 mm 1375.2 mm
(54.2 in) Z (54.2 in) A
+
+
329.1 mm 329.1 mm
(13.0 in) (13.0 in)
FRONT FRONT
34 mm 153 mm
(1.3 in) (6.0 in)
+
254 mm
+
(10.0 in)
1971.2 mm 762 mm
(77.7 in) Z A (30.0 in)
+
+ Cutout dimensions
Frame for raised floor
Entry/Exit
(mm) (in)
1568 mm
(61.7 in) Front 94 x 655 3.7 x 25.8
1846 mm Rear 94 x 655 3.7 x 25.8
(72.7 in)
FRONT
32 zEC12 IMPP
Level 01f
Weight distribution
The following table shows weights and dimensions used to calculate floor loading for the zEC12. All
floor loading calculations are intended for a raised floor environment. If you are using a nonraised floor
environment, these floor loading calculations do not apply.
Table 7. Maximum weights with the Internal Battery Feature (IBF)
Maximum A and Z frames with Internal Battery Feature (3213) - Model HA1
Radiator-cooled
1,2,4
| Weight kg (lbs) 2649 (5843)
3
Width mm (in) 1566 (61.7)
Depth mm (in) 1273 (50.2)
Water-cooled
1,2,4
| Weight kg (lbs) 2770 (5953)
3
Width mm (in) 1566 (61.7)
Depth mm (in) 1377 (54.2)
Table 8. Maximum weights without the Internal Battery Feature (IBF)

Maximum A and Z frames without Internal Battery Feature (3213) - Model HA1
Radiator-cooled
1,2,4
| Weight kg (lbs) 2346 (5173)
3
Width mm (in) 1566 (61.7)
Depth mm (in) 1273 (50.2)
Water-cooled
1,2,4
| Weight kg (lbs) 2396 (5283)
3
Width mm (in) 1566 (61.7)
Depth mm (in) 1377 (54.2)
Notes:
1. Weight includes covers. Width and depth are indicated without covers.
2. For two-frame systems, weight is based on maximum system configuration, not the addition of the
maximum weight of each frame.
3. Width increases to 1846 mm (72.7 in) if the top exit I/O feature (FC 7942) is installed.
| 4. Weight increases by 54.4 kg (120 lbs) if the top exit I/O feature is installed.

Level 01f
The following figure and tables show sample floor loading values for the zEC12, with and without the
Internal Battery Feature (3213), and without the top exit I/O feature (7942).
Floor loading for radiator-cooled servers without Internal Battery Feature
Floor load kg/m2

Example # 'a' (sides) mm (in) 'b' (front) mm (in) 'c' (rear) mm (in) (lbs/ft2)
1 25 (1.0) 254 (10.0) 254 (10.0) 892.69 (182.84)
2 25 (1.0) 508 (20.0) 508 (20.0) 722.32 (147.94)
3 25 (1.0) 762 (30.0) 762 (30.0) 613.83 (125.72)
4 254 (10.0) 254 (10.0) 254 (10.0) 723.16 (148.12)
5 254 (10.0) 508 (20.0) 508 (20.0) 590.41 (120.93)
6 254 (10.0) 762 (30.0) 762 (30.0) 505.88 (103.61)
7 508 (20.0) 254 (10.0) 254 (10.0) 605.48 (124.01)
8 508 (20.0) 508 (20.0) 508 (20.0) 498.84 (102.17)
9 508 (20.0) 762 (30.0) 762 (30.0) 430.94 (88.26)
10 762 (30.0) 254 (10.0) 254 (10.0) 526.48 (107.83)
11 762 (30.0) 508 (20.0) 508 (20.0) 437.38 (89.58)
12 762 (30.0) 762 (30.0) 762 (30.0) 380.65 (77.96)
Floor loading for radiator-cooled servers with Internal Battery Feature
Floor load kg/m2

1 25 (1.0) 254 (10.0) 254 (10.0) 979.21 (200.56)
2 25 (1.0) 508 (20.0) 508 (20.0) 789.63 (161.73)
3 25 (1.0) 762 (30.0) 762 (30.0) 668.92 (137.01)
4 254 (10.0) 254 (10.0) 254 (10.0) 790.57 (161.92)
5 254 (10.0) 508 (20.0) 508 (20.0) 642.86 (131.67)
6 254 (10.0) 762 (30.0) 762 (30.0) 548.81 (112.40)
7 508 (20.0) 254 (10.0) 254 (10.0) 659.62 (135.10)
8 508 (20.0) 508 (20.0) 508 (20.0) 540.97 (110.80)
34 zEC12 IMPP
Level 01f
Floor load kg/m2

9 508 (20.0) 762 (30.0) 762 (30.0) 465.42 (95.33)
10 762 (30.0) 254 (10.0) 254 (10.0) 571.73 (117.10)
11 762 (30.0) 508 (20.0) 508 (20.0) 472.59 (96.79)
12 762 (30.0) 762 (30.0) 762 (30.0) 409.46 (83.86)
Floor loading for water-cooled servers without Internal Battery Feature
Floor load kg/m2

1 25 (1.0) 254 (10.0) 254 (10.0) 915.27 (187.46)
2 25 (1.0) 508 (20.0) 508 (20.0) 739.89 (151.54)
3 25 (1.0) 762 (30.0) 762 (30.0) 628.21 (128.67)
4 254 (10.0) 254 (10.0) 254 (10.0) 740.76 (151.72)
5 254 (10.0) 508 (20.0) 508 (20.0) 604.10 (123.73)
6 254 (10.0) 762 (30.0) 762 (30.0) 517.09 (105.91)
7 508 (20.0) 254 (10.0) 254 (10.0) 619.61 (126.91)
8 508 (20.0) 508 (20.0) 508 (20.0) 509.84 (104.42)
9 508 (20.0) 762 (30.0) 762 (30.0) 439.94 (90.11)
10 762 (30.0) 254 (10.0) 254 (10.0) 538.30 (110.25)
11 762 (30.0) 508 (20.0) 508 (20.0) 446.57 (91.47)
12 762 (30.0) 762 (30.0) 762 (30.0) 388.17 (79.50)
Floor loading for water-cooled servers with Internal Battery Feature
Floor load kg/m2

1 25 (1.0) 254 (10.0) 254 (10.0) 1001.79 (205.18)
2 25 (1.0) 508 (20.0) 508 (20.0) 807.20 (165.33)
3 25 (1.0) 762 (30.0) 762 (30.0) 683.30 (139.95)
4 254 (10.0) 254 (10.0) 254 (10.0) 808.17 (165.53)
5 254 (10.0) 508 (20.0) 508 (20.0) 656.55 (134.47)
6 254 (10.0) 762 (30.0) 762 (30.0) 560.01 (114.70)
7 508 (20.0) 254 (10.0) 254 (10.0) 673.76 (138.00)
8 508 (20.0) 508 (20.0) 508 (20.0) 551.97 (113.05)
9 508 (20.0) 762 (30.0) 762 (30.0) 474.42 (97.17)
10 762 (30.0) 254 (10.0) 254 (10.0) 583.54 (119.52)
11 762 (30.0) 508 (20.0) 508 (20.0) 481.78 (98.68)
12 762 (30.0) 762 (30.0) 762 (30.0) 416.98 (85.40)
All measurements are taken from the outside edge of the machine frame, without covers, unless
specifically described otherwise.

Level 01f
Minimum weight distribution is shown in the shaded area of Figure 7 on page 39.
v “a” = side dimension
v “b” = front dimension
v “c” = rear dimension
36 zEC12 IMPP
Level 01f
System weight examples

Following is a table that provides weight estimates for minimum, typical, and maximum configurations
on all four models of the zEC12. The Power Estimator tool has been modified to include weight data and
now has the capability to provide a more accurate weight for your particular configuration. See “Power
estimation tool” on page 72.
Table 9. Weights for minimum, typical, and maximum server configurations
Weight (in lbs) for an radiator-cooled server Additional weights for features
Water
Minimum Typical Maximum Top exit I/O Battery Balanced
Model weight
weight weight weight weight weight power
addition
| H20 2551 3000 3907 110 120 670 188
| H43 2813 3400 4684 110 120 670 112
| H66 3056 3600 4944 110 120 670 56
| H89/HA1 3293 4300 5117 110 120 670 56
Note:
1. Minimum weights include no listed features and no I/O.
2. Maximum weight includes five PCIe I/O drawers (FC 4009) and one I/O drawer (FC 4008) and no listed
features. All slots in the PCIe I/O drawers and I/O drawers contain an adapter.
3. Typical weights contain I/O considered typical in a balanced system for the respective model. Actual weight will
vary and can only be determined by an exact specification of content.
Example: a typical radiator-cooled H43 with batteries and balanced power = 3400 + 670 + 112 = 4182 lbs

Level 01f
Weight distribution and multiple systems

Under typical conditions, service clearances of adjacent products may be overlapped but weight
distribution areas should not be overlapped. If weight distribution clearances are overlapped, the
customer should obtain the services of a qualified consultant or structural engineer to determine floor
loading. Regardless of floor loading, minimum service and aisle clearances must be observed:
v Rear dimension “d” is 991 mm (39 in.)
v Front dimension “e” is 1168 mm (46 in.)
v Both “d” and “e” are measured from the frame edge (without covers) to the nearest obstacle
v Cover opening dimensions are also shown.
Note: Aisle clearances are not the same between rows of front-facing and rear-facing covers. Front-facing
rows require 1168 mm (46 in.) of clearance while rear-facing rows need a minimum of 991 mm (39 in.).
For physical planning purposes, you must verify system placement considering:
v Weight distribution
v Power availability
v Power access
v Machine and service clearance area
v Air conditioning delivery
v Chilled water delivery
v Thermal interaction
v Cable locations
v Floor tile cutouts.
38 zEC12 IMPP
Level 01f
Rear of Servers
Front of Servers
329.1 mm 329.1 mm
(13.0 in) (13.0 in)
Aisle Width
e (1168 mm 46 in)
c
Front of Servers
a a
b
Rear of Servers
d Aisle Width
(991 mm 39 in)
Rear of Servers
Front of Servers
Aisle Width
(1143 mm 45 in)
Wall
= Load Shedding Area = Service Clearance Area
Figure 7. Aisle and service clearances

Level 01f
Machine and service clearance areas

Machine area is the actual floor space covered by the system. Service clearance area includes the machine
area, plus additional space required to open the covers for service access to the system.
A and Z frames Machine area M2 / (ft2) Service clearance area M2 / (ft2)

Radiator-cooled 2.93 (31.6) 7.64 / (82.3)
Radiator-cooled plus top exit I/O 3.45 (37.2) 7.64 / (82.3)3
cable towers
Water-cooled 3.09 (33.3) 7.87 / (84.8)
Water-cooled plus top exit I/O 3.64 (39.2) 7.87 / (84.8)3
cable towers
Notes:
1. Machine area includes installed covers.
2. Service clearance area must be free of all obstacles. Units must be placed in a way that all service areas are
accessible. The weight distribution clearance area extending beyond the service clearance area, such as the area
at the outside corners of the units, may contain support walls and columns.
3. The top exit I/O cable towers (FC 7942) are an optional feature. Service clearance not shown for these towers.
4. Front-to-front aisle spacing of at least 1168 mm (46.0 in) is required for water-cooled servers to provide
enough space in the front of the machine for fill and drain procedures.
Rear
Minimum Service Clearances
d = 1168 mm (46 in) - front
e = 991 mm (39 in) - rear
g = 2226.2 mm (87.7 in) - side to side
329.1 mm (13.0 in) 329.1 mm (13.0 in)

Front
Figure 8. Minimum service clearances
The front and rear doors access all of the serviceable area in the zEC12 server. The system requires
specific service clearances to ensure the fastest possible repair in the unlikely event that a part may need
to be replaced. Failure to provide enough clearance to open the front and rear covers will result in
extended service time.
The following describes some service clearance conditions that must be followed (See Figure 9 on page
41.)
40 zEC12 IMPP
Level 01f
v The side cover of either an A or Z frame cannot be placed adjacent to a wall (Example A), but can be
positioned next to obstacles such as poles or columns (Example B).
v The front cover on frame A and both covers on frame Z open 329.1 mm (13.0 in) wider than the width
of the frame plus side cover (Example C).
v Service clearances cannot be achieved with a zEC12 server installed side-cover-to-side-cover.
Dimensions are given for zEC12 next to a zEC12. To calculate side-to-side clearance, add 329.1 mm
(13.0 in) to the clearance required from the adjacent equipment (Example D).
Wall or
other obstacle
Column
OK
Pole
Example A Example B
OK OK
Wall
329.1 mm (13.0 in) 329.1 mm (13.0 in)

frame Z to wall OK frame A to wall
Example C
OK OK
OK OK
Example D
468 mm
(18.4 in)
OK OK OK OK
Figure 9. Detailed service clearances

Level 01f
Cooling recommendations for the room

The following illustration does not represent any particular server machine type, and is intended only to
show hot and cold airflow and the arrangement of server aisles on the raised floor.
A typical zEC12 uses chilled air, provided from under the raised floor, to cool the system. As shown
below, rows of servers must face front-to front. Chilled air is usually provided through perforated floor
panels placed in rows between the fronts of servers (the cold aisles shown in the figure). Perforated tiles
generally are not placed in the hot aisles. (If your particular computer room causes the temperature in the
hot aisles to exceed limits of comfort for activities like system service, you may add as many perforated
tiles as necessary to create a satisfactory comfort level.) Heated exhaust air exits the computer room
above the computing equipment.
42 zEC12 IMPP
Level 01f
Wall
Figure 10. System airflow

Level 01f
The following table and chart illustrate how to determine the amount of chilled air your computer room
must provide to meet the environmental requirement for your zEC12.
Table 10. Cooling airflow graph codes - H20
Cooling Total power Power to water Power to air Use cooling
Model method (in kw) (in kw) (in kw) curve
H20 typical Radiator-cooled 5.4 - 5.4 B
H20 maximum Radiator-cooled 13.4 - 13.4 D
H20 typical Water-cooled 5.1 3.8 1.3 A
H20 maximum Water-cooled 13.1 9.8 3.3 A

H43 typical Radiator-cooled 10.0 - 10.0 D
H43 maximum Radiator-cooled 19.8 - 19.8 G
H43 maximum Water-cooled 19.1 14.3 4.8 B

H66 typical Radiator-cooled 14.2 - 14.2 F
H66 maximum Radiator-cooled 23.3 - 23.3 H
H66 maximum Water-cooled 22.5 16.9 5.6 B

H89 typical Radiator-cooled 19.4 - 19.4 H
H89 maximum Radiator-cooled 26.9 - 26.9 I
H89 typical Water-cooled 18.4 13.8 4.6 B
H89 maximum Water-cooled 25.9 19.5 6.4 C
Table 14. Cooling airflow graph codes - HA1

HA1 typical Radiator-cooled 19.4 - 19.4 H
HA1 maximum Radiator-cooled 27.6 - 27.6 I
HA1 typical Water-cooled 18.4 13.8 4.6 B
HA1 maximum Water-cooled 26.6 20.0 6.6 C
44 zEC12 IMPP
Level 01f
The values in the previous chart are for a typical computer room environment:
v Room inlet air = 240C
| v Customer water inlet = 140C or cooler
v Altitude = up to 457 meters (1500 feet) above sea level.

Level 01f
Air Flow
CM/M (CF/M)
198.22 (7000)
O
169.90 (6000)
N
141.58 (5000) L
J
113.27 (4000)
I
H
P G
84.95 (3000) O
N
F
M
L
E
K
56.63 (2000) J
I D
H
G C
F
28.32 (1000) E B
D
C A
B
A
0
O O
Under floor C 10 12 14 16 18 20 22 24 C
temperature O O
F 50.0 53.6 57.2 60.8 64.4 68.0 71.6 75.2 F
O O
Return air C 33.3 33.3 33.3 33.3 33.3 33.9 34.4 35.0 C
temperature - O O
air-cooled F 92 92 92 92 92 93 94 95 F
server
Figure 11. Cooling airflow graph
If water-cooled, return air temperature is typically between 230 C and 280 C depending on room ambient,
room dewpoint and actual heatload.
The proportion of server heatload removed to water is affected by the local ambient and dewpoint. For
servers operating in 220 C to 270 C ambient and under 110 C dewpoint, water typically removes between
| 75% and 90% of input power. When the ambient is below 180 C, the small temperature difference
between exhaust air and cooling water temperature lessens rear heat exchangers’ effectiveness. Servers
with ambient above 270 C are not recommended because blower speedup and warmer circuits increase
server power consumption and acoustic noise.
To maintain required cooling, it may be necessary to adjust the amount of open floor tile area to achieve
adequate air flow. “Cooling recommendations for the room” on page 42 shows that, for each zEC12, the
perforated tiles that cool that system are placed directly in front of the frame or frames, and occupy half
of the aisle between system rows. Wider aisles between system rows, allowing more perforated tile area,
may be necessary if your chilled air system cannot meet the air flow rate required to cool the system
when the aisles are too narrow.
46 zEC12 IMPP
Level 01f
Beyond the specific information provided in this document, IBM recommends that the customer's facility
meet the general guidelines published in the American Society of Heating, Refrigeration, and Air Conditioning
Engineers (ASHRAE) Handbook.

Level 01f
Special cooling recommendations for water-cooled machine

zEC12 will require four connections to the facility water, two feeds and two returns. These connections
are made using hoses that are fixed to the facility plumbing and are routed up through the rear tailgate
of the machine and terminate using quick connect couplings. Hoses and a means to fasten them to the
facility plumbing are provided with the server.
zEC12 operates from two fully redundant water control units (WCUs). These water control units each
have their own facility feed and return water connections. If water is interrupted to one of the water
control units, the other water control unit will pick up the entire load and the server will continue to
operate without interruption. Therefore each water connection to the facility plumbing must be able to
support the entire flow requirement for the system. In the event of water being lost to both water control
units, the system will attempt to reject heat using the inner door heat exchangers in each frame and
increasing system blower speeds. The server may also run in a degraded mode during this event.
Water supply
Following are some general conditions that your facility must meet prior to installation of zEC12:
v Total Hardness must not exceed 200 mg/L as calcium carbonate.
v pH must be between 7 and 9.
v Turbidity must be less than 10 NTU (Nephelometric Turbidity Unit).
v Bacteria must be less than 1000 CFUs (Colony Forming Unit)/ml.
v Water to be as free of particulate matter as feasible.
v Allowable system inlet water temperature range is 6o - 20o C (43o - 68o F) using standard building
chilled water (BCW). A special water system for 2827 is typically not required.
v Required flow rate to the frame is 3.7 - 79.4 lpm (1 -21 gpm), depending on inlet water temperature
and the number of nodes populated in the server. Colder inlet water temperatures require less flow
then warmer water temperatures. Fewer nodes require less flow then maximum populated processors.
v Minimum water pressure required across the IBM hose ends is 0.34 - 2.32BAR (5 - 33.7 psi), depending
on the minimum flow required.
v Maximum water pressure supplied at the IBM hose connections to the customer water supply should
not exceed 6.89 BAR (100 psi).
v Table 17 on page 54 contains reference information to help you determine the facility water supply
conditions for your particular server.
Supply hoses
Important:
Water hoses, hose barbs and hose clamps are shipped with the zEC12 in a kit, P/N 41U9918. Installation
of these parts is the responsibility of the customer or their designated plumbing installer and
additional materials such as plumbing fittings, valves, insulation and pipe sealant will be required. The
water hoses must be connected to the building water facility BEFORE installation of the server.
Although IBM does not make recommendations or suggestions on how to terminate the facilities side of
the hose, we do provide parts that we have used successfully in our installations. If you have other
preferred parts or termination methods, discard the parts provided with the server.
The server installer will connect the machine end of the hoses to the server. The customer or facility end
of the hose is left open to allow you or your designated plumbing installer to adjust the length and
terminate it to the appropriate fitting on the facility plumbing. For zEC12 under-floor water supply, IBM
provides:
v 2 - each 4.2 m (14 ft) hoses, (P/N 41U9739 and 2 - hoses P/N 41U9738).
48 zEC12 IMPP
Level 01f
41U9739 - Hose, water supply, BLACK band

41U9738 - Hose, water return, WHITE band
44V6056 - Stainless steel hose barb

with 25.4 mm (1 in) male NPT
v 4 - Stainless steel hose barbs, P/N 44V6056.

v 1 - Locating fixture, P/N 74Y1090.
Server side Side away from the server
v 4 - spare O-rings, for Aeroquip quick connect couplings, P/N 45D3158.

v 6 - Oetiker hose clamps (2 are spares) P/N 15R8650.
v 1 - Oetiker crimping tool P/N P/N 74Y0585 (Oetiker part number 14100082)
For zEC12, we strongly suggest, but do not require, shutoff valves in front of the hoses, in case there is a
need to remove the hoses for a service procedure or relocation.
Although IBM does not make recommendations or suggestions on how to terminate the facilities side of
the hose, IBM does have a released, stainless steel fitting, P/N 44V6056. This fitting is barbed on one side
and has a 25.4 mm (1 in) male NPT on the other end which can be used to connect to your facilities. For
the threaded NPT connection, IBM recommends using a thread-lock sealant (Loctite 554 creates a very
reliable connection). Since the system end of the hose assembly has a 90 degree elbow, which has to be in
a specified orientation, the locating fixture, P/N 74Y1090, provided with the system, should be used while

Level 01f
installing the hoses . This will position the quick connects in the proper orientation, with the faces of the
quick connects parallel to the rear of the frame and the correct height off the floor. If the hose barb P/N
44V6056 is being used, a clamp such as an Oetiker P/N 15R8650 should be used. Six of these are
provided, four to be used for installation, and two are spares. The clamp should be slid over the hose
loosely and then the hose should be slid onto the barb until the end of the hose touches the hex flange on
the hose barb fitting.
Hose clamp
44V6056 - Stainless steel hose barb
with 25.4 mm (1 in) male NPT
Hose clamp End of the hose should touch

the hex flange on the fitting
The clamp is then to be positioned 2 to 4 mm (.08 in to .16 in) from the edge of the hose, prior to
clamping. Oetiker clamping tool P/N 74Y0585 (their part number 14100082) must be used to crimp the
clamp (the clamp is fully crimped when the gap at the base of the crimp is 3 mm (.12 in) wide,
maximum). After installation of the hoses any exposed hose or plumbing fittings should be wrapped in
insulation to avoid condensation forming.
The organizer is removed after the hoses are connected to the facility water supply. Save the organizer for
future use in case this server should be relocated.
Water-cooled server hose connections, for the customer water supply, are located at the bottom rear of the
A frame.
50 zEC12 IMPP
Level 01f
Rear view
A frame Z frame
J1
BATTERY ENBLD
(CB Must be on)
Pb
J1
BATTERY ENBLD
(CB Must be on)
Pb
IBM
AC/DC
Converter
IBF PWR /0 /I
J01
J02
IBM
AC/DC
J03
J04
Converter
IBF PWR /0 /I
J05
J06
J07
J08
J09
J10
IBM
AC/DC
J12
Converter
J11
IBF PWR /0 /I
J14
J13
J15
J16
J17
J18
IBM
AC/DC
Converter
IBF PWR
J19
J20
/0 /I
J21
J22
J23
J24
IBM
AC/DC
J25
J26
Converter
IBF PWR /0 /I
J27
J28
J29
J30
J31
J32
IBM
AC/DC
GOOD
Converter
IBF PWR /0 /I
U U U U J01 unlock/off lock/on BPR enbld
J01 J02 J03 J04 J10 J11

UEPO PWR SE
N J05 J06 J07 J08 J09
O
B
Y ..... .....
... ... ... ... ... ... ... ... ... ...
P
R P
NS
W
M A R B
A S P
L S C
CMPLT STBY GOOD
J09 J10
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. ..
B
P
C
GOOD
J09 J10
.. .. .. .. .. .. .. .. .. ..
J01 J02 J03 J04 J05 J06 J07 J08
.. .. .. .. .. .. .. .. .. ..
B
P
C
GOOD
Customer water hose connectors
1 2 3 4
S R S R
U E U E
P T P T
P U P U
L R L R
Y N Y N
B W B W
L H L H
A I A I
C T C T
K E K E
The water hoses are installed through the I/O cable tailgate at the rear of the A frame. This significantly
reduces the space available for I/O cable exit from the A frame. One option to alleviate this situation is to
consider routing some of the I/O cables from the rear of the A frame to the front of the frame. Another
possibility is top exit I/O towers. If your facility has or is considering overhead cabling, the use of top
exit I/O helps to solve the crowding of too many cables exiting the bottom of the frames.
The following illustration shows two water facilities: the upper diagram represents a typical chilled water
installation where the supply and return runs are connected to a single chilled water source. To assure
maximum, uninterrupted cooling, you may want to consider a high availability approach to the water
supply. This would mean running a pair of supply and return lines from each of two different chilled
water sources, as shown in the lower diagram. This would insure that, if one source should become
unavailable, the other would continue to cool the server, with no degradation.

Level 01f
Typical customer water facility
Facility chilled water supply
Facility chilled water return
Color of the band on the coupler
Hose Number 1 = black

Hose Number 2 = white
Hose Number 3 = black 4 3 2 1
Hose Number 4 = white WCU connectors
High availability customer water facility
Facility chilled water supply #1
Facility chilled water supply #2
Facility chilled water return #1
Facility chilled water return#2
Color of the band on the coupler
Hose Number 1 = black

Hose Number 2 = white
Hose Number 3 = black 4 2 3 1
Hose Number 4 = white WCU connectors
52 zEC12 IMPP
Level 01f
Materials used in the water cooling units

The customer side of the zEC12 WCU is comprised of the following material set. Any chemicals that are
added to the customer's chilled water must be compatible with the following materials.
Table 15. WCU materials
Description Material
Heat exchanger - plates Stainless steel
Heat exchanger - braze material Copper
Heat exchanger - hose barbs Stainless steel
Pipes and fittings - inlet and outlet pipes Stainless steel (alternate - copper)
Pipes and fittings - threaded fittings Copper
Pipes and fittings - jog Aluminum bronze alloy (being qualified by IBM materials
dept.)
Quick Connects - body castings Stainless steel
Quick Connects - external O-ring ERP (Ethylene Propylene Rubber)
Quick Connects - internal gaskets ERP (Ethylene Propylene Rubber)
Control valve - stem Stainless steel
Control valve - disc gasket Teflon
Control valve - body (tee) Red brass
Control valve - seat Bronze
Thread sealant - adhesive Loctite 554 (red)
Table 16. Water hose materials

Description Material
Aeroquip quick-connect - C-ring ERP (Ethylene Propylene Rubber)
Aeroquip quick-connect - body Stainless steel
Aeroquip quick-connect - ball Stainless steel
Aeroquip quick-connect - fitting O-ring Teflon
Aeroquip quick-connect - face seal ERP (Ethylene Propylene Rubber)
Aeroquip quick-connect - plastic face seal Polycarbonate (does not touch water)
Pig tail casting Aluminum bronze C61400
Pig tail hose - cover Carboxylated nitrile
Pig tail hose - reinforcement Synthetic, high tensile textile cord
Pig tail hose - tube Nitrile

Level 01f
Water specifications
The following tables provide the requirements for the chilled water at the server connection.
Table 17. Required building chilled water conditions - (60C - 130C)
Chilled water per Water
Building chilled water in 0 C
Number Max kw Conditioning Unit
of nodes to water (Water-cooled) 60 70 80 90 100 110 120 130
Flow (LPM) 6.0 6.3 6.6 7.0 8.0 9.0 10.0 11.5
1 7 Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34
0
Outlet temp C 23 23 23 23 23 22 22 22
Flow (LPM) 8.5 9.5 10 11 12 13.5 15 17
0
Outlet temp C 23 22 22 22 22 22 22 21
Flow (LPM) 12.5 13.5 15 16.5 18 20 22 25
0
Outlet temp C 22 22 21 21 21 21 21 21
Flow (LPM) 17 18 20 22 24 27 30 35
0
Outlet temp C 21 21 21 21 21 21 21 20
Notes:
1. Units are liters/minute, bars, and 0C. These conditions must be available to each of the water conditioning units.
2. Temperature of water out of WCU that cools the server is dependent on measured dew point as well as building
water temperature. MCM performance is unaffected as long as dew point does not exceed 170C and building
water does not exceed 200C. However, the amount of heat removed by rear of frame heat exchangers is reduced
in more humid environments or in cases with warm building chilled water. If building chilled water exceeds
200C or room dew point exceeds 170C, the water to server temperature will continue to rise and at some point
may lower processor frequency.
54 zEC12 IMPP
Level 01f
Table 18. Required building chilled water conditions - (140C - 200C)

Chilled water per Water
Building chilled water in 0 C
Number Max kw to Conditioning Unit
of nodes water (Water-cooled) 140 150 160 170 180 190 200
Flow (LPM) 13.5 16 20 20 20 25 25
1 7 Pressure Drop (Bar) 0.34 0.34 0.34 0.34 0.34 0.34 0.34
0
Outlet temp C 21 21 21 21 22 23 24
Flow (LPM) 20 24 27 30 30 35 35
0
Outlet temp C 21 21 21 22 23 23 24
Flow (LPM) 30 33 35 40 40 42 45
0
Outlet temp C 21 21 22 22 23 24 24
Flow (LPM) 40 45 50 50 50 50 55
0
Outlet temp C 20 21 21 22 23 24 24
Notes:
1. Units are liters/minute, bars, and 0C. These conditions must be available to each of the water conditioning units.
2. Temperature of water out of WCU that cools the server is dependent on measured dew point as well as building
water temperature. MCM performance is unaffected as long as dew point does not exceed 170C and building
water does not exceed 200C. However, the amount of heat removed by rear of frame heat exchangers is reduced
in more humid environments or in cases with warm building chilled water. If building chilled water exceeds
200C or room dew point exceeds 170C, the water to server temperature will continue to rise and at some point
may lower processor frequency.
Attention:
IBM will supply and use a deionized (DI) water solution that is mixed with benzotriazole (BTA), a
corrosion inhibitor, for use within the system side cooling loop of water cooled products. BTA is
mixed with the deionized water to a concentration of 1000 parts per million by weight. The customer
must dispose of the water solution in accordance with applicable laws and regulations and product
characteristics at the time of disposal.
The Service Support Representative (SSR) will fill or drain the system of this solution as required for an
install, uninstall, or some maintenance procedures, such as a book replace. The Fill and Drain kit and
water container should be stored where the SSR can readily access it as needed, and it should be stored
in a climate controlled environment with the other system service tools and equipments needed to install,
service, relocate, or discontinue a system. The Fill and Drain kit is used for a water-cooled system or a
radiator-cooled system. The water container holds 15.5 – 16.0 liters (4 gallons) of deionized water mixed
with a concentration of 0.1% (900-1000 ppm) of Benzotriazole (BTA) by weight.
For detection and location reporting of potential fluid leaks, there are leak detection systems you can use
beneath a raised floor. These systems are generally used to detect leaks from glycol, condenser water, and
chilled water cooling piping, humidification feed water piping. If desired, these sensor detection systems
can be used to monitor for potential product leaks, such as the BTA water solution, which is 99.9%
deionized water.
Glycol will lower the thermal efficiency of heat exchangers. Its effect will vary by concentration and
possibly heatload. Tables provided in this documentation show how much building chilled water to
supply versus configuration for chilled water without glycol. Customers should be aware that glycol has
a diluting effect on heat transfer properties versus pure water. That means if used in a rear door heat

Level 01f
exchanger, less heat will be removed from the exit air and, when used to cool the zEC12 WCU, the flow
rate must be increased when glycol is added. For example, adding 20% ethylene glycol to the building
water supply will require a 10% increase in the flow rate to maintain the same cooling level as a 0%
ethylene glycol water supply. Adding 40% ethylene glycol to the building water supply will require a
30% increase in the flow rate to maintain the same cooling level as a 0% ethylene glycol water supply.
Contact your IBM marketing specialist or installation planner if you need specific information regarding
the use of glycol in your facility.
56 zEC12 IMPP
Level 01f
Considerations for multiple system installations

When integrating a zEC12 into an existing multiple-system environment, or when adding additional
systems to an installed zEC12, consider the following factors:
v Thermal interactions
Although computer room floor space is valuable, for optimal cooling, it is recommended that zEC12
servers have a 1168 mm (46 in) aisle between rows of systems to reduce surrounding air temperature.
See “Cooling recommendations for the room” on page 42.
v Floor placement
zEC12 must be precisely placed for the cable openings to match the floor cutouts. There is zero
tolerance for variance from the frame positioning in relation to the floor tiles.
v Floor loading
When trying to optimize floor space utilization, floor loading weight distribution rules may be
inadvertently violated by overlapping weight distribution areas of adjacent machines. Obtain the
services of a qualified structural engineer if you are uncertain of the floor load assessment for your
computer room.

Level 01f
58 zEC12 IMPP
Level 01f
Chapter 4. Guide for raised floor preparation

This chapter provides recommendations and requirements for making the necessary openings in the
raised floor for installation.
The drawings on the following pages are intended only to show relative positions and accurate
dimensions of floor cutouts. They are not machine templates and are not drawn to scale.
Raised floor cutouts should be protected by electrically non conductive molding, appropriately sized,
with edges treated to prevent cable damage and to prevent casters from rolling into the floor cutouts.
| Note: For a water-cooled model on a raised floor, the height of the raised floor (subfloor to top surface of
| floor tile) must be a minimum of 228.6 mm 9 inches) to accommodate the bend radius of the water hoses.

Level 01f
Casters
The following illustration shows the physical dimensions around the casters. When planning for both the
movement and positioning of the system, be aware that each caster swivels in a circle slightly larger than
130 mm (5.1 in) in diameter. Exercise caution when working around floor cutouts.
Front Front
49.6 mm (1.96 in) 15.5 mm (0.6 in)
157.5 mm (6.2 in)

222.3 mm (8.75 in)
Swivel diameter
130.2 mm (5.17 in)
Caster - frame
dimensions
Radiator-cooled models Water-cooled models
127.0 mm (5.00 in) 100.2 mm (4.00 in) 100.2 mm (4.00 in)
100.2 mm (4.00 in)

47.6 mm (1.87 in) 28.7 mm (1.13)
Leveling foot - frame
dimensions Increased frame dimension
on water-cooled models
( 100.2 mm (4 in) )
60 zEC12 IMPP
Level 01f
Procedure for cutting and placement of floor panels
Important:
zEC12, fully configured, can weigh in excess of 2494 kg (5500 lb). You must be certain that the raised floor on
which you are going to install the server is capable of supporting this weight. Contact your floor tile
manufacturer and a structural engineer to verify that your raised floor is safe to support the zEC12.
Depending on the floor panel type, additional panel supports (pedestals) may be necessary to maintain the
structural integrity of an uncut panel, or to restore the integrity of a cut floor panel. Consult the panel
| manufacturer and the structural engineer to ensure that the panel can sustain the concentrated loads.
Ensure adequate floor space is available to place the frames over the floor panels exactly as shown on the
drawing.
| Note: Frame template P/N 41T8506 can be ordered by your IBM service representative to assist in the system
| layout on your raised floor.
(D006)
__ 1. Identify the panels needed, and list the total quantity of each panel required for the installation.
__ 2. Cut the required quantity of panels. Panels A1, A4, C1, and C4 are optional. If you have existing
equipment already installed over these panels, you do not have to cut them.
__ 3. Additional panel supports (pedestals) are recommended to restore the structural integrity of the
cut floor tile panels.
__ 4. When cutting the panels, you must adjust the size of the cut for the thickness of the edge molding
you are using. The dimensions shown are finished dimensions.
__ 5. For ease of installation, number each panel as it is cut as shown on the panel specification pages.
__ 6. Use the raised floor diagram to install the panels in the proper positions.
__ 7. You will need as many as eight uncut floor tiles to temporarily replace A1 through A4 and C1
through C4 during the physical placement of the frames. After frame placement, the uncut tiles can
be removed and the cut tiles for A1 through A4 replaced in the floor.
Chapter 4. Guide for raised floor preparation 61

Level 01f
Raised floor with 610 mm (24 in) or 600 mm (23.5 in) floor panels
Cable exit cutouts

1 2 3 4
Rear
A
D
Front
545 mm 545 mm 110 mm 110 mm
(21.5 in) (21.5 in) (4.3 in) (4.3 in)
Cutout dimensions
Frame for raised floor
Entry/Exit
(mm) (in)
94 mm 94 mm
(3.7 in) (3.7 in) Front 94 x 655 3.7 x 25.8
Rear 94 x 655 3.7 x 25.8
(Panels (Panels (Panels (Panels
A2, C2) A3, C3) A4, C4) A1, C1)
Figure 12. Raised floor with floor panels
62 zEC12 IMPP
Level 01f
Important:
Extra pedestals may be placed as shown in Figure 13:

1. Pedestals Bp1, Bp2, Bp3, Bp4, Cp1, Cp3, Cp4, and Cp6 may be placed approximately under each caster
position to prevent floor tile panels from sagging.
2. Pedestals Cp2 and Cp5 may be used to support the cut corners of floor tiles C2 and C3.
3. Pedestals Ap1, Ap2, Ap3, Ap4, Ap5, and Ap6 may be used to support the cut corners of floor tiles A1, A2, A3
and A4. Although these four tiles are not load-bearing, equipment, moving in the row where these floor
panels sit, may place high loads momentarily on the tiles.
4. If you are using either the frame tie-down features (FC 8000 or FC 8001), you may want to place additional
pedestals under the bars that rest on the floor tile panels after the features have been installed.
All of these extra pedestals are recommendations. You must decide which, if any, of these recommendations to
use.
Extra Pedestal Placement

1 2 3 4
Rear
A
Ap1 Ap2 Ap3 Ap4 Ap5 Ap6
Bp1 Bp2 Bp3 Bp4
B
Z A
C Cp1 Cp3 Cp4 Cp6

Cp2 Cp5
D
Front
Figure 13. Extra pedestal placement
All pedestals should be adjusted to just contact the underside of each floor panel before the frames are
rolled into place. Depending on your floor panel type, additional supports (pedestals) may be necessary
to restore the structural integrity of cut panels.
Chapter 4. Guide for raised floor preparation 63

Level 01f
64 zEC12 IMPP
Level 01f
Chapter 5. Power requirements

The zEC12 requires the following:
v System frame
– 50/60 Hz AC or high voltage DC
– Voltage ranges:
- AC: 200V to 480V AC, three-phase wiring
- DC: 380V to 520V DC
The system requires either:
– For configurations using a total of six or less Bulk Power Regulators (BPRs) - Two power feeds, of
the types previously described, each with the same nominal voltage. One is connected to the front of
the Z frame, and one is connected to the rear of the Z frame.
or
– For all other configurations - Four power feeds, of the types previously described, each with the
same nominal voltage. Two are connected to the front of the Z frame, and two are ocnnected to the
rear of the Z frame.
There are no power feeds to the A frame.
| You cannot use a mix of DC power and AC power. The input power for the zEC12 must be
| exclusively AC or exclusively DC.
Refer to the Appendix D, “3-phase dual power installation,” on page 133 for the correct wiring method
for your particular power distribution equipment.
Read the following information about Plan Ahead feature codes.
– If you choose a server that requires only two power cords, but want to be prepared for future
growth, you may order the Line Cord Plan Ahead feature (FC 2000), which ships all four line cords
regardless of the number of BPRs.
– If you expect that your server may eventually be adding additional processors or PCIe I/O drawers,
I/O drawers or I/O cages, you may want to consider the Balanced Power Plan Ahead feature (FC
3003), which adds the maximum number of Bulk Power Regulators (BPRs) to your server's power
supplies. A fully-configured server uses twelve BPRs. So, for example, if your server configuration
would only require six BPRs, the Balanced Power feature would add six more BPRs to maximize
available power. If not already included in your order, the Line Cord Plan Ahead feature would also
automatically be added along with Balanced Power. Finally, if your server is going to use the
Internal Battery Feature (IBF) (FC 3213), Balanced Power Plan Ahead will automatically supply the
maximum number of batteries, six IBFs, with your server.
– Balanced Power Plan Ahead (FC 3003) does not apply to servers using the DC power cord option.
– The Balanced Power and Line Cord Plan Ahead features give you the chance to eliminate future
service downtime when upgrading your server.
v Hardware Management Console
A single-phase feed from a customer-supplied service outlet. The outlet must provide 100V to 130V or
200V to 240V 50/60Hz single-phase AC power.

Level 01f
Power installation considerations

zEC12 operates from two fully-redundant power supplies. These redundant power supplies each have
their own line cords, or pair of line cords, allowing the system to survive the loss of customer power to
either line cord or line cord pair. If power is interrupted to one of the power supplies, the other power
supply will pick up the entire load and the system will continue to operate without interruption.
Therefore, the line cord(s) for each power supply must be wired to support the entire power load of the
system.
Note: The power cord set(s) provided are for use only with this product.
For the most reliable availability, the line cords in the front (A) and the rear (B) of the Z frame should be
powered from different PDUs. The A line cord or cords exit the front of the Z frame and should be
connected to one PDU. The B line cord or cords exit the rear of the Z frame and should be connected to a
different PDU than the A cord or cords.
See Appendix D, “3-phase dual power installation,” on page 133 for examples of typical redundant
wiring facilities.
The power supplies at the front end of the system use active resistive load synthesis. Harmonic distortion
of the current waveform is small enough that it need not be considered in planning the installation. The
power factor is typically 0.95 or higher.
The utility current distribution across the phase conductors (phase current balance) depends on the
system configuration. Each front end power supply is provided with phase switching redundancy. The
loss of an input phase is detected and the total input current is switched to the remaining phase pair
without any power interruption. Depending on the configuration input power draw, the system can run
from several minutes to indefinitely in this condition. Since most single phase losses are transients which
recover in seconds, this redundancy provides protection against virtually all single phase outages.
Supply type Nominal voltage range (V) Voltage tolerance (V) Frequency range (Hz)
Two or four redundant
200-480 180-509 47-63
3-phase line cords
Two or four redundant
380-520 350-550 N/A
DC line cords
Source type Frequency Input voltage range (V) Rated input current (A)
Three-phase (60A plug) 50/60 Hz 200 - 240V 48A
Three-phase (all except 60A plug) 50/60 Hz 380 - 415V 25A
Three-phase (all except 60A plug) 50/60 Hz 480V 20A
DC N/A 380 - 520V 44A
66 zEC12 IMPP
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I/O units
Table 19. I/O unit descriptions and values
Feature code I/O unit description I/O unit value
4008 I/O drawer - 5 EIA units tall. Holds 8 I/O adapters installed horizontally. 1
4007 I/O cage - 14 EIA units tall. Holds 28 I/O adapters installed vertically. 2
4009 PCIe I/O drawer - 7 EIA units tall. Holds 32 I/O adapters installed vertically. 1
Chapter 5. Power requirements 67

Level 01f
Line cord/bulk power regulator (BPR) specifications

The following tables provide number of line cords and number of BPRs required based on the number of
processor books and number of I/O units in the server configurations.
Table 20. Number of line cords required per side
1
Number of I/O units
0 1 2 3 4 5 6
H20 (1 processor book) 1 1 1 1 1 1 1
H43 (2 processor books) 1 1 1 1 1 2 2
HA1 (4 processor books) 2 2 2 2 2 2 2
Note:
1. See “I/O units” on page 67 for I/O descriptions and values.
Table 21. Number of BPRs installed per side

3, 4
Number of I/O units
0 1 2 3 4 5 6
1 1 1 1 1 1 1
H20 (1 processor book) 1 1 2 2 3 3 3
1 1 1 1 1 2 2
1 1 2 2 2 2 2
2 2 2 2 2 2 2
2 2 2 2 2 2 2
HA1 (4 processor books) 4 4 4 4 5 5 5
Note:
1. Single-line power cord pair.
2. Two-line power cord pair.
3. See “I/O units” on page 67 for I/O descriptions and values.
4. Current balance on the phases is determined by the BPR count in this table. The balance (or imbalance) is
defined in Table 22 on page 69.
68 zEC12 IMPP
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Table 22. Current balance per line cord

1st cord set 2nd cord set
1
1 BPR/side unbalanced A —
2
2 BPRs/side unbalanced B —
3
3 BPRs/side balanced —
4 BPRs/side balanced unbalanced A
5 BPRs/side balanced unbalanced B
4
6 BPRs/side balanced balanced
Note:
1. Unbalanced A - only two phases carry equal current. The third phase carries zero.
2. Unbalanced B - two phases carry equal current. The third phase carries 1.73 times the current carried by the
other two.
3. Balanced - all phases carry the same current.
4. Only available with FC 3003 (balance power).
Table 23. Current balance Example

Example 1 - Model H20 with 1 I/O unit
From Table 21 on page 68, the number of BPRs per side = 1
From Table 22, the phase currents are unbalanced A on the first line cord set (there is no second line cord set.)

Example 1 - Model H43 with 4 I/O units
From Table 22, the phase currents are balanced on the first line cord set (there is no second line cord set.)

From Table 22, the phase currents are balanced on the first line cord set. The phase currents are unbalanced A on the
second line cord set.

From Table 22, the phase currents are balanced on the first line cord set. The phase currents are unbalanced B on the

Example 1 - Model HA1 with 5 I/O units
From Table 22, the phase currents are balanced on the first line cord set. The phase currents are unbalanced B on the

Level 01f
Power specifications
The following tables provide system power consumption/heat load based on the number of processor
books and number of I/O units in the server configurations. The data is shown for servers at sea level.
Real customer configurations will come out lower in the power estimator than the numbers in the table
because the table numbers represent the maximum possible configuration which is unrealistic for an
actual system. In addition, a warm room is assumed, which results in higher fan power, hopefully not the
normal situation for most installations. Finally, the numbers below assume that batteries are present and
charging.
Note: Power will be somewhat lower for DC input voltage.
As an example, a typical 4 book system in a typical data center would compute to about 17.6 kW for
radiator-cooled and 16.7 kW for water-cooled in the estimator with data from the customer's eConfig
output vs the absolute maximum of 27.6 kW for radiator-cooled and 26.6 kW for water-cooled in the
table below.
Table 28. System power consumption - Radiator-cooled
1
Number of I/O units
0 1 2 3 4 5 6
Utility power - 1 processor book 5.8 7.7 9.7 11.3 13.2 13.4 13.4
Utility power - 2 processor books 9.7 11.6 13.4 15.2 17.1 19.0 19.8
Note:
1. See “I/O units” on page 67 for I/O descriptions and values
2. Assumes maximum supported configuration (maximum I/O adapters installed)
3. The power factor is approximately unity.
4. Input power (kVA) equals heat output (kW).
5. For heat output expressed in kBTU per hour, multiply table entries by 3.41.
6. See Appendix D, “3-phase dual power installation,” on page 133 for recommendations on utility connections
which better balance the current for installations where multiple systems are connected to the same power panel.
70 zEC12 IMPP
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Table 29. System power consumption - Water-cooled

1
Number of I/O units
0 1 2 3 4 5 6
Utility power - 1 processor book 5.5 7.4 9.4 11.0 12.9 13.1 13.4
Note:
1. See “I/O units” on page 67 for I/O descriptions and values
2. Assumes maximum supported configuration (maximum I/O adapters installed)
3. The power factor is approximately unity.
4. Input power (kVA) equals heat output (kW).
5. For heat output expressed in kBTU per hour, multiply table entries by 3.4.
6. See Appendix D, “3-phase dual power installation,” on page 133 for recommendations on utility connections
which better balance the current for installations where multiple systems are connected to the same power panel.
7. The power advantage from using water cooling increases with the size of the system.

Level 01f
Power estimation tool

The power estimator tool for the zEC12 allows you to enter your precise server configuration to produce
an estimate of power consumption. In addition, the tool now can produce an estimate of the weight of
your server.
Log on to Resource Link at http://www.ibm.com/servers/resourcelink. Navigate to Tools, then to Power and

weight estimation. Specify the quantity for the features that are installed in your machine. This tool
estimates the power consumption for the specified configuration. The tool does not verify that the
specified configuration can be physically built.
Note: The exact power consumption for your machine will vary. The object of the tool is produce an
estimation of the power requirements to aid you in planning for your machine installation.
Actual power consumption after installation can be confirmed using the HMC Monitors Dashboard task.
Power capping
zEC12 supports power capping, which gives the customer the ability to limit the maximum power
consumption and reduce cooling requirements (especially with zBX). To use power capping, Automate
Firmware Suite (FC 0020) must be ordered. This feature is used to enable the Automate suite of
functionality associated with the IBM zEnterprise Unified Resource Manager. The Automate suite
includes representation of resources in a workload context, goal-oriented monitoring and management of
resources, and energy management. The Automate suite is included in the base zCPC at no charge for
CPs, zIIPs, and zAAPs.
72 zEC12 IMPP
Level 01f
Customer circuit breakers (CBs)

The following table shows the maximum circuit breaker ratings based on input voltage.
Input voltage range (V) System rated current (A) Circuit breaker
208 - 240 VAC 48A 60A/63A W/T
380 - 415 VAC 25A 32A W/T
480 VAC 20A 30A
380 - 520 VDC 44A 60A DC/63A DC W/T
It is recommended, for simplicity and ease of upgrades, that the circuit breaker ratings in this table be
used on all power cords for all installations. The actual power drawn (heat load) by any configuration
will not be affected.
Note: System z server design incorporates Electromagnetic Interference filter capacitors required to block
electrical noise from penetrating the power grid. A characteristic of filter capacitors, during normal
operation, is high leakage currents. Depending on the server configuration, this leakage current can reach
350mA (350 milliamps). For most reliable operation, Ground Fault Circuit Interrupter (GFCI), Earth
Leakage Circuit Breaker (ELCB) or Residual Current Circuit Breaker (RCCB) type circuit breakers are
not recommended for use with System z servers. By internal design and grounding, System z servers
are fully certified for safe operation (compliance with IEC, EN, UL, CSA 60950-1).
However, if leakage detection circuit breakers are required by local electrical practice, the breakers
should be sized for a leakage current rating not less than 500mA in order to reduce the risk of server
outage caused by erroneous and spurious tripping.

Level 01f
Internal battery feature (FC 3213)

The Internal Battery Feature (IBF) (FC 3213) is optional on the zEC12. In the event of input power
interruption to the system, the internal battery feature will provide sustained system operation for the
times listed in the following table.
Table 30. IBF holdup times
Number of I/O units
0 1 2 3 4 5 6
1 1 1 1 1 1 1
1 processor node 7.7 min 5.0 min 4.0 min 7.9 min 11.9 min 11.0 min 11.0 min
1 1 1 1 1 2 2
2 processor nodes 9.7 min 13.6 min 11.0 min 9.1 min 7.9 min 7.0 min 6.7 min
1 1 2 2 2 2 2
2 2 2 2 2 2 2
Note:
1. Single-line power cord pair.
2. Two-line power cord pair.
3. The holdup times in this table are valid for batteries 3 years old or less that have seen normal service life (2 or
less complete discharges per year) with the system input power at N+1 operation.
4. Batteries are only connected to the Bulk Power Regulators associated with the section 1 power cords.
5. These holdup times are estimates. Your particular battery holdup time for any given circumstance may be
different.
6. Holdup times vary depending on the number of BPRs installed. As the number of BPRs increases, the holdup
time also increases until the maximum number of BPRs is reached. Once six BPRs (three per side) are installed
no additional batteries are added so the time decreases from that point.
74 zEC12 IMPP
Level 01f
Unit emergency power off (UEPO)

There is a unit emergency power off (UEPO) switch on the front of the primary frame (A frame) of each
system. When tripped, the UEPO switch will immediately disconnect utility and battery power from the
machine functional unit. Utility power is confined to the machine power compartment. All volatile data
will be lost.
Front View Rear View

Unit EPO Panel Unit EPO Panel
Unit EPO Panel

Mounting Screw
A Side
BPI
Cable
J01
B Side
Unit EPO BPI
Switch Cable
J02
Customer
Supplied
Unit EPO Panel
Cable
Mounting Screw
J03
BYPASS ACTIVE ACTIVE BYPASS
Room Disconnecting Means/ Room Disconnecting Means/

Emergency Power Off Actuator Emergency Power Off Actuator
Figure 14. UEPO panels
Figure 14 illustrates both the front and the rear of the machine UEPO panel. The rear view shows where
the room electrical power disconnecting means, or room Emergency Power Off, EPO, cable plugs into the
machine. Notice the switch actuator. Once moved to make the cable connection possible, the room
disconnecting means / EPO cable must be installed for the machine to power on.

Level 01f
Computer room emergency power off (EPO)

When the internal battery backup feature is installed and the room disconnecting means / EPO is
tripped, the batteries will engage and the computer will continue to run. It is possible to attach the
computer room disconnecting means / EPO system to the machine UEPO switch. When this is done,
tripping the room disconnecting means / EPO will disconnect all power from the line cords and the
internal battery backup unit. In this event all volatile data will be lost.
To incorporate the IBF into the room disconnecting means / Emergency Power Off (EPO) systems, a cable
must be made to connect to the back of the system UEPO panel. The following diagram illustrates how
this connection is made.
4 3 2 1 AMP Part Number -- 770019-1
Contact Number
2 Pole Normally-closed Pushbutton
Room UEPO Switch Schematic
Figure 15. UEPO switch schematic
In Figure 15, an AMP connector 770019-1 is needed to connect to the system UEPO panel. For room
disconnecting means / EPO cables using wire sizes #20 AWG to #24 AWG use AMP pins part number
770010-4. The permissible resistance of the customer connection is 5 Ohms Maximum (~200' of #24 AWG).
76 zEC12 IMPP
Level 01f
Power plugs and receptacles

Plugs are shipped with the machine line cords in USA and Canada. The line cord length is 4250 mm (14
ft). Power plugs in the following table are approved for use with specified models and meet the relevant
test laboratory or country/test-house standards. The power plug must be connected to a correctly wired
and grounded receptacle. The customer is responsible for receptacle wiring.
For countries that require other types of plugs or receptacles, the system is shipped without plugs on the
line cords, and you are responsible for supplying and installing both plugs and receptacles.
Important:
In a typical three-phase power cord, there are five wires inside the cut cord cable. There are the three
phase wires, one ground wire and there is a fifth, small diameter wire, connected to the cable shield, that
acts as a drain. This drain wire must be connected to the cable ground, NOT neutral.
DC power cord
The DC power cord is illustrated below.
Vdc2
Earth C
GND GND
Vdc1 plus B
Earth minus A
Customer
DC source DC Line cord Machine plug
The DC feed is on the B line. The C and A lines are the DC return. The crimp between the C line and A
line is internal on cords with a customer plug. For cut end cords, the C and A lines must both be tied to
the negative side of the source because all four wires exit the cord body separately. Reference the
following table for DC voltage information.
Table 31. Input voltage range
Parameter Absolute maximum Absolute minimum
Vdc1 + Vdc2 550V 330V
Vdc1 550V 0V
Vdc2 420V 0V

Level 01f
Table 32. Supported power cords

Supported power cord
System location feature codes 3 Watertight plug Watertight receptacle
8952 60A IEC-309 460R9W
USA, Canada, Japan 60A IEC-309
8955 (not provided)
(200-240 VAC) (provided as part of the cord)
8993
USA, High Voltage 8950 30A IEC-309 30A IEC-309 430R7W
(480 VAC) 8983 (provided as part of the cord) (not provided)
| USA, Canada 8976 30A IEC-309 4 30A HBL430R6V02
(380-415 VAC) 8977 provided as part of the cord) (not provided)
No plug provided.
8949
World Trade Cut end cord.
8982 (not specified)
(208-240 VAC) Plug is provided by the customer
8996
and is electrician-installed.
No plug provided.
8951
World Trade Cut end cord.
8988 (not specified)
(380-415 VAC) Plug is provided by the customer
8998
8947
USA, Canada, Japan 60A 360R8WDC
8953
(380-520 VDC) (provided as part of the cord) (not provided)
8963
No plug provided.
World Trade 8948 Cut end cord.
(not specified)
(380-520 VDC) 8965 Plug is provided by the customer
Notes:
1. IBM continues to strongly recommend the use of a metal backbox (example shown below) with our
line cords using IEC-309 plugs. Although in-line connectors and nonmetallic backboxes are available
and compatible, they are not recommended. These recommendations are based on the metal backbox
providing:
v An added level of protection against a mis-wired phase and ground reversal
v In some cases, a metal backbox may be better for EMI mitigation
You may choose not to use a metal backbox. In this case, please check your local code for specific
requirements.
2. The customer must obtain the appropriate plugs and receptacles, based on existing electrical codes,
where those plugs and receptacles are not provided with the system.
3. See “Line cord wire specifications” on page 83 for descriptions of the power cord feature codes.
78 zEC12 IMPP
Level 01f
| 4. This plug is dual listed at 30A and 32A.

Level 01f
Grounding specifications
Every three-phase circuit must contain three-phase conductors and an insulated equipment-grounding
conductor. Every single-phase 120 volt branch circuit (used for the Hardware Management Console and
service outlets) must contain one phase conductor, a neutral conductor, and an insulated
equipment-grounding conductor.
For 208 VAC through 240 VAC installations worldwide, the equipment-grounding conductor must match
local electrical codes and must be green with or without one or more yellow stripes on the insulation.
IBM recommends that the ground wire be the same size as the phase conductor wires.
Conduit must not be used as the only grounding means. However, any conduit or cable shield must be
connected at both ends in such a way that it is included in the grounding path in parallel with the
grounding conductor it contains. Most electrical codes require that branch circuit wiring be located in
metallic conduit, or be made from shielded cable, if located under a raised floor. Even when not required
by local regulations, some form of shield around the branch circuit wiring is strongly recommended as a
means of reducing coupling of high-frequency electrical noise into signal and control cables.
For information about additional recommendations and requirements for equipment grounding, go to
Resource Link (http://www.ibm.com/servers/resourcelink). See General Information for Planning a
Physical Site.
80 zEC12 IMPP
Level 01f
Top exit power cords

zEC12 has the option of top exit power cord cabling. There are several power cord options specifically
made for top exit, and you must chose one of these if you want to have the power cords exit through the
top of the server. The top exit power cords are manufactured with additional hardware that mounts the
cord to the frame of the machine and provides an EMC seal at the same time.
For power cord top exit, choose from the following power cord feature codes: 8947, 8948, 8949, 8950,
8951, 8952, 8953, 8955, and 8977.
For feature codes 8947, 8952, 8953, and 8955, these 60 amp IBM cords end directly at the top of the frame.
Therefore, your cords must be long enough to reach the frame. See Figure 16.
plugged 60 amp connections
cut cords or 30 amp cords
A frame
A frame
Z frame
Z frame
Figure 16. Top exit power cords - plugged 60 amps connection, cut cord or 30 amp cord connection
For feature codes 8948, 8949, 8950, 8951, and 8977, your receptacle must drop to within 305 mm (1 ft) of
the top of the frame and be no further than 305 mm (1 ft) from the front door or side cover of the frame.
(See Figure 17 on page 82 and Figure 16.

Level 01f
305 mm (1 ft)
305 mm (1 ft)
Front view Top view
305 mm (1 ft)
Figure 17. Receptacles for top exit power cords
82 zEC12 IMPP
Level 01f
Line cord wire specifications

Bulk outside
Number of Connector
Line cord usage location Feature code AWG # / type diameter mm
shields supplied
(in)
USA, Canada, Japan
(380-520 VDC) 60A #6 AWG 1 (overall gross
8947 Yes 28.5 (1.12)
top exit cord Type PPE shield)
ends at top of rack
World Trade
(380-520 VDC) #6 AWG 1 (overall gross
8948 No 28.5 (1.12)
cut top exit cord Type PPE shield)
14 ft
World Trade, low voltage
#6 AWG 1 (overall gross
cut top exit cord 8949 No 28.5 (1.12)
Type PPE shield)
14 ft
USA
(480 VAC) 30A #10 AWG 1 (overall gross
8950 Yes 18.54 (0.73)
top exit cord Type ST shield)
6 ft
World Trade, high voltage
cut top exit cord 8951 No 18.54 (0.73)
Type ST shield)
14 ft
USA, Canada, Japan
8952 Yes 28.5 (1.12)
ends at top of rack
USA, Canada, Japan
8953 Yes 28.5 (1.12)
ends at top of rack
USA, Canada, Japan
8955 Yes 28.5 (1.12)
ends at top of rack
USA, Canada, Japan
8963 Yes 28.5 (1.12)
bottom exit cord Type PPE shield)
14 ft
World Trade
(380-520 VDC) #6 AWG 1 (overall gross
8965 No 28.5 (1.12)
14 ft
USA, Canada
(380-415 VAC) 30A #10 AWG 1 (overall gross
8976 Yes 18.54 (0.73)
bottom exit cord Type ST shield)
14 ft
USA, Canada
8977 Yes 18.54 (0.73)
top exit cord Type ST shield)
6 ft

Level 01f
Bulk outside
Number of Connector
Line cord usage location Feature code AWG # / type diameter mm
shields supplied
(in)
(200-240 VAC) #6 AWG 1 (overall gross
8982 No 28.5 (1.12)
bottom exit cord Type DP-1 shield)
14 ft
USA, high voltage
8983 Yes 14.48 (0.57)
14 ft
(380-415 VAC) #10 AWG 1 (overall gross
8988 No 14.48 (0.57)
14 ft
USA, Canada, Japan
8993 Yes 28.5 (1.12)
14 ft
(200-240 VAC)
bottom exit cord 8996 No 25.91 (1.02)
Type LSZH shield)
14 ft
low smoke, halogen-free
(380-415 VAC)
bottom exit cord 8998 No 15.00 (0.59)
Type LSZH shield)
14 ft
low smoke, halogen-free
Note:
1. Where plugs are provided, Hubbell is the plug supplier.
2. If you choose to use a Hubbell receptacle, do NOT use the Hubbell C-Series Light Industrial
3. The customer must obtain the appropriate plugs and receptacles, based on existing electrical codes, where those
plugs and receptacles are not provided with the system.
4. The power cord set(s) provided are for use only with this product.
5. FCs 8952 and 8955 are for top exit connections to a 200 to 240 VAC source in the US, Canada and Japan. They
have IEC-309 60A AC plugs hard connected to the top of the frame. They are coordinated as follows:
v For systems requiring 2 cords, order FC 8952.
v For systems requiring 4 cords (or plan ahead to 4 cords), order both 8952 and 8955.
v For an upgrade from a system with 2 cords to a system requiring 4 cords, order 8955.
6. FCs 8947 and 8953 are for top exit connections to a 380 to 520 VDC source in the US, Canada and Japan. They
have IEC-309 60A DC plugs hard connected to the top of the rack. They are coordinated as follows:
v For systems requiring 2 cords, order FC 8947.
v For systems requiring 4 cords (or plan ahead to 4 cords), order both 8947 and 8953.
v For an upgrade from a system with 2 cords to a system requiring 4 cords, order 8953.
84 zEC12 IMPP
Level 01f
Wire colors for cut-end three-phase alternating current cords

Wire Number Color Description
Line 1 Brown Phase 1 (labeled "PH-1" on the wire insulation
Line 2 Black Phase 2 (labeled "PH-2" on the wire insulation
Line 3 Gray Phase 3 (labeled "PH-3" on the wire insulation
Ground Green/Yellow Ground (labeled "GND" on the wire insulation
Drain clear or uninsulated Cable shield - must be connected to GROUND
Wire colors for cut-end direct current cords

Wire Number Color Description
Line 1 Black (labeled "-" on the wire insulation
Line 2 Red (labeled "+" on the wire insulation
Line 3 Black (labeled "-" on the wire insulation
Ground Green/Yellow Ground (labeled "GND" on the wire insulation
Drain clear or uninsulated Cable shield - must be connected to GROUND
Line physical protection

In US installations, the line cord must meet National Electric Code (NEC) requirements. When line cords
are run on the surface of the floor, they must be protected against physical damage. (See NEC 645-5.) For
other countries, local codes apply.
Service outlet (customer-supplied)

A duplex service tool outlet should be installed within 1.5 m (5 ft) of the system frame. The power
requirement is 110V/120V for USA and Canada (other power requirements are country dependent). The
service tool outlets should be fed from the same power source as the system. The service tool outlet
should be placed on a separate circuit breaker so it can be used when the processor frame circuit breaker
is off.

Level 01f
86 zEC12 IMPP
Level 01f
Chapter 6. Hardware Management Console and Support

Element communications
Support Element
zEC12 is supplied with a pair of integrated ThinkPad Support Elements. One is always active while the
other is strictly an alternate. Power for the Support Elements is supplied by the server power supply, and
there are no additional power requirements.
Unlike many previous servers, the internal LAN for the Support Elements on zEC12 connects to the Bulk
Power Hub in the Z frame. There is an additional connection from the hub to the Hardware Management
Console utilizing the VLAN capability of the server.
Hardware Management Console

| A Hardware Management Console (FC 0091 or FC 0092) is required to operate zEC12. FC 0092 is the
| HMC that will ship on new orders. A single console can support multiple System z servers and can be
located remotely to the physical sites.
| If you plan to use the ensemble capabilities of zEC12, you will need to order FC 0025, Unified Resource
| Manager and provide two HMCs – one to serve as the primary HMC for the ensemble, and one to serve
| as the alternate HMC.
| Note: In addition to performing ensemble-related tasks for any CPC in the ensemble, the primary HMC
| can perform all non-ensemble tasks on a CPC, whether it is a member of an ensemble or not a member of
| an ensemble.
| The machine type and model number of the primary HMC and alternate HMC must be identical. Both
| must be either FC 0091 or FC 0092. Verify this information by viewing the label on top of the HMC
| hardware tower. (i.e. For FC 0091, MTM: 7327-PAA. For FC 0092, MTM: 7382-PBC.)
The Hardware Management Console consists of:

v A processor or system unit, including two Ethernet LAN adapters, capable of operating at 10, 100, or
1000 Mbps and will use removable UFDs to install Licensed Machine Code (LMC)
v A flat panel display (described below)
v A keyboard and
v A mouse.
The console requires a customer-supplied table to hold the following:

v The keyboard and mouse
| v A flat panel display (FC 6096)
| – L2251x - 22-inch flat panel display
| or
| – LT2323p - 23-inch flat panel display
| The Hardware Management Console requires two 110/120V outlets for USA and Canada. (Other power
requirements are country dependent.)
| An Ethernet switch will not be offered as a configurable feature on zEC12. If an Ethernet switch is
| needed to manage the Ethernet connection between the Support Elements and HMCs, you must supply

Level 01f
| your own. It is recommended that the Ethernet switch support a speed of 1 Gb. However, if you are
| upgrading to a zEC12 and Ethernet switch, FC 0070, is found on the base machine, it will be carried
| forward.
The Ethernet switch requires a single 110/120V outlet for USA and Canada. (Other power requirements
are country dependent.)
Physical specifications for the Hardware Management Console components are located in Appendix B,
“Hardware Management Console physical specifications,” on page 127.
Ethernet LAN switch support

The following is general information relevant to many Ethernet switches. Refer to the manufacturer’s
User’s Guide that came with your switch for installation instructions.
There must be an Ethernet switch/hub available to connect the Hardware Management Consoles to your
LAN. The Ethernet switch/hub is a standalone unit located outside the frame and which operates on
building AC power. An Ethernet switch will not be offered as a configurable feature on zEC12. You must
supply your own Ethernet switch unless you are upgrading to a zEC12. If you are upgrading to a zEC12
and Ethernet switch, FC 0070, is found on the base machine, it will be carried forward. It is
recommended that the Ethernet switch support a speed of 1 Gb.
Typical Ethernet switch/hub characteristics:

v 16 auto-negotiation ports
v 10/100/1000 Mbps data rate
v Full or half duplex operation
v Auto-MDIX on all ports
v Port Status LEDs
v 100 to 240 VAC, 50 or 60 Hz power
Ethernet switches supporting auto-MDIX on all ports use a straight-through cable between any two ports.
To provide redundancy for the HMCs, two switches/hubs should be used.
Switch Example
SMC
R
EZ Switch 10/100/1000 1 2 3 4 5 6 7 8
Link/Act
1 2 3 4 5 6 7 8
SMCGS16 1000/100M
Link/Act
9 10 11 12 13 14 15 16
1000/100M
Power
9 10 11 12 13 14 15 16
Ethernet network connection requirements
MUST READ:
This product is not intended to be connected directly or indirectly by any means whatsoever to interfaces of
public telecommunications networks. (See the illustration below).
The preceding statement does NOT exclude using the network for private communications, such as connection to
the Remote Support Facility.
88 zEC12 IMPP
Level 01f
On the zEC12, the install team must connect the Ethernet adapters for any HMC(s) into an Ethernet
switch. This switch can then be connected to J01 and J02 on the Bulk Power Hubs. (See Figure 18.)
28xx Support Element Consoles

“A” Side BPH
J01
J02
Switch
J03
J04
1X 2X 3X 4X 5X 6X 7X 8X
J05
J06
J07
J08
9X 10X 11X 12X 13X 14X 15X 16X

J09
J10
28xx Hardware Management Consoles

J12
J11
“B” Side BPH

J14
J13
J16
J15
J17
J18
J01
J02
J19
J20
Switch
J03
J04
J21
J22
J05
J06
1X 2X 3X 4X 5X 6X 7X 8X
J23
J24
J07
J08
9X 10X 11X 12X 13X 14X 15X 16X
J25
J26
J09
J10
J27
J28
J12
J11
J29
J30
J14
J13
J31
J32
J16
J15
GOOD
J17
J18
J19
J20
J21
J22
J23
J24
Additional Customer Other server Support Elements

LAN Network
J25
J26
J27
J28
J29
J30
J31
J32
GOOD
Switch
~~ ~ Switch ~
1X 2X 3X 4X 5X 6X 7X 8X 1X 2X 3X 4X 5X 6X 7X 8X
9X 10X 11X 12X 13X 14X 15X 16X 9X 10X 11X 12X 13X 14X 15X 16X
~~ ~ ~ ~~ ~~
Figure 18. Two-switch configuration
This configuration is required because the Support Elements have no external connection to the
HMCs, and the Support Elements communicate only through the Bulk Power Hubs.
Notes:
1. Only Ethernet switches can connect to the customer ports J01 and J02 on the Bulk Power Hubs.
2. Never connect an HMC directly to J01 and J02 on the Bulk Power Hubs.
3. Never connect customer LANs to any ports other than J01 and J02 on the Bulk Power Hubs.
4. Customer LAN 1 should be plugged into J02 on the Bulk Power Hubs. Customer LAN 2 should be
plugged into J01 on the Bulk Power Hubs.
Chapter 6. Hardware Management Console and Support Element communications 89

Level 01f
Figure 19 provides general zEC12 Ethernet cabling information and is not intended to illustrate
connection to a particular network.
HMC HMC
Optional
External Ethernet switch External Ethernet switch
Customer Customer
Network 1 Network 2
B
P J02
H J01
System z A
CPC B
P
H J02
J01
B
System z and
z Series servers
Figure 19. Ethernet cabling
Hardware Management Console and Support Element wiring options

A local Hardware Management Console must be connected to its Support Elements using Local Area
Network (LAN) wiring. The Hardware Management Console and the Support Elements both come with
Dual Ethernet LAN adapters.
The communication protocol (TCP/IP) used in Support Element to Hardware Management Console
communication is defined for both adapters in the Support Elements.
Notes on wiring with multiple adapters:

1. The Hardware Management Console supports dual Ethernet paths to Support Elements. This allows
automatic redundant network paths so that the failure of a single network has no affect on Hardware
Management Console to Support Element communication.
2. When configuring multiple adapters the address must be defined in different subnets.
| Because HMCs FC 0091 and FC 0092 only come with dual Ethernet features, no additional explanation of
wiring scenarios is offered here.
Trusted Key Entry (TKE)

zEC12 may have a Crypto Express3 or Crypto Express4S feature for applications where extensive data
security is required. For these systems, there is a separate console available for authorized access to the
Crypto Express3 or Crypto Express4S feature. This console is named the Trusted Key Entry (TKE)
workstation.
90 zEC12 IMPP
Level 01f
| The TKE workstation, FC 0841 and FC 0842, includes a system unit, flat panel display, mouse, keyboard,
and line cord. The built-in Ethernet adapter supports a link data rate of 10, 100, or 1000 Mbps. A UFD
drive is available for installation of Licensed Machine Code.
| Note: FC 0841 can only be carried forward.
The TKE workstation attaches to the customer LAN, providing a security-rich, flexible method of
providing master key and operational key entry to locally and remotely managed Cryptographic
Coprocessor features.
TKE with optional Smart Card Reader, FC 0885, allows access to and use of confidential data on the
Smart Card, protected by a user defined personal identification number (PIN) code providing secure
storage, access, transport and entry of master and operational key parts into the TKE workstation. The
following characteristics pertain to the Smart Card Reader:
v The Smart Card Reader is an optional security device that attaches to the TKE.
v The Smart Card Reader provides swipe card function thus further restricting access to the TKE.
v FC 0885, contains two Smart Card Readers, two serial port “Y” adapters, two serial cables, and 20
blank Smart Cards. The cables provide both power source for the SCR and the communication path
between the SCR and the TKE workstation.
| v A TKE workstation and the TKE 7.2 or later level code are corequisites for ordering the Smart Card
reader.
| v Any existing TKE workstation with a code level lower than 7.2 will have to be replaced with a FC 0842
workstation to work with your zEC12 server.
v FC 0884 provides the ability to order additional blank Smart Cards. The Smart Card Reader is a
corequisite for ordering additional Smart Cards.
| To use the TKE function on zEC12, the Crypto Express3 or Crypto Express4S feature, TKE 7.3 (FC 0872)
or TKE 7.2 code (FC 0850), and CP Assist for Cryptographic Function (FC 3863) must be installed.
The TKE workstation requires two 110/120 volt outlets in the U.S. and Canada. Power requirements vary
in other countries.
LAN connections
LAN cabling is a customer responsibility. To connect the TKE workstation with Ethernet to a LAN, a
Category 5 Unshielded Twisted Pair (UTP) cable terminated with an RJ-45 connector is required.
Chapter 6. Hardware Management Console and Support Element communications 91

Level 01f
Planning for an ensemble

If you are planing to use this zEC12 in an ensemble, you must order FC 0025, which supplies the
ensemble management code, and you must supply two HMCs (FC 0091 or FC 0092), which manage the
ensemble. One of these HMCs is configured as the primary for the ensemble, one as the alternate. This
applies to an ensemble with or without a zEnterprise BladeCenter® Extension (zBX).
Note: It is important to note that these two HMCs, if ordered, must be installed on the same Ethernet
subnet, to insure redundancy.
If FC 0025, Unified Resource Manager, is to be used on a single 2827 without a zBX, and if LPAR to
LPAR communications is required in a Unified Resource Manager defined VLAN, you must supply an
LC Duplex directly-connected cables (not wrap cables, as was previously recommended). Those LC
Duplex directly-connected cables plug into the two OSA-Express3 10 GbE features, two OSA-Express4S
| 10 GbE features, or two OSA-Express5S 10 GbE features (CHPID type OSX).
Note:
1. When a zEC12 and FC 0025 (Unified Resource Manager) are ordered without a zBX, eConfig does not
| force you to order two OSA-Express3 10 GbE features, two OSA-Express4S 10 GbE features, or two
| OSA-Express5S 10 GbE features; however, those OSA features (OSA-Express3 10 GbE Long Reach (FC
3370), OSA-Express3 10 GbE Short Reach (FC 3371), OSA-Express4S 10 GbE Long Reach (FC 0406),
| OSA-Express4S 10 GbE Short Reach (FC 0407), OSA-Express5S 10 GbE Long Reach (FC 0415),
| OSA-Express5S 10 GbE Short Reach (FC 0416)) are required if you plan to use them for LPAR to
LPAR communication.
2. The IODF must be shared among participating z/OS® LPARs.
Ensemble network configurations for a zEC12 are as follows:

v Customer-managed management network (with or without zBX)
– A pair of HMCs (FC 0091 or 0092) with Unified Resource Manager (FC 0025) to control and manage
the ensemble. One HMC is configured as the primary, the other as the alternate if the primary HMC
fails.
– Only one pair of HMCs running Unified Resource Manager per ensemble.
v Intranode management (INMN) network (OSM CHPID) (with or without zBX)
– Two ports from two different OSA-Express3 1000BASE-T Ethernet adapters (FC 3367),
| OSA-Express4S 1000BASE-T Ethernet adapters (FC 0408), or OSA-Express5S 1000BASE-T Ethernet
| adapters (FC 0417) (for redundancy) to provide management capability for a single node through
the Unified Resource Manager.
v Intraensemble data (IEDN) network (OSX CHPID) (with or without zBX. If without, only if planning
for LPAR to LPAR communications)
| – A pair of OSA-Express3 10 GbE adapters, OSA-Express4S 10 GbE adapters, or OSA-Express5S 10
| GbE adapters (for redundancy).
– A pair of 10 Gb loop back cables (customer-supplied) to allow the System z applications to share
data on the IEDN between operating system images.
v Customer network connections (OSD CHPID) (with or without zBX)
– For existing network connectivity from System z applications to networks other than the IEDN.
92 zEC12 IMPP
Level 01f
Chapter 7. Remote Support Facility (RSF) installation planning

The Remote Support Facility (RSF) provides communication to a centralized IBM support network for
problem reporting and service (IBM Service Support System), as well as providing a means for remote
operation of the Hardware Management Console. Communication with the IBM Remote Support Facility
is provided using an Internet connection.
| IBM Remote Support Facility is migrating to a new infrastructure. Problem Management (except Viewable
| Problems), Vital Product Data, and System Availability Data transmissions are now supported using the
| enhanced IBM Service Support System. Access to the traditional IBM Service Support System is still
| required.
| Transmission to the enhanced IBM Support System requires a Domain Name Server (DNS) to be
| available. It must be configured on the call-home server HMC Console or proxy server connecting to the
| internet.
Choosing a communications method for remote support

You must choose method for connecting your server to IBM’s Service Support System through the
Remote Support Facility (RSF):
v A direct connection from the Hardware Management Console to the Internet. This method is fast,
reliable and uses the external customer firewall to control the connection.
v An indirect connection from the Hardware Management Console to the Internet using a proxy server.
This method has the advantages of the direct connection plus it allows your enterprise the added
control of the proxy. Potential additional advantages include the possibilities of logging and audit
facilities using the proxy server.
The benefits of either a direct or indirect connection to the Internet will facilitate more rapid problem
resolution for your enterprise.
An Internet-based Remote Support Facility (RSF) connection is recommended unless your enterprise
security policies prohibit HMC communication with the Internet. The following information is designed
to provide your networking team with the information they need to enable the Hardware Management
Console to connect securely to the Internet.
Security characteristics of Remote Support Facility communications include:

v RSF requests are always initiated from the HMC to IBM. No inbound connections are ever initiated
from IBM’s Service Support System.
v All transferred data is encrypted in a high-grade Secure Sockets Layer (SSL) method.
v When the HMC initiates a connection to RSF, it validates the trusted host by its digital signature issued
for the IBM Service Support System.
v Data sent to IBM consists solely of hardware problem information and configuration data. No
application or customer data is transmitted.
Using the internet for remote support

The HMC can be enabled to connect directly to the Internet or to connect indirectly, through a proxy
server that you provide. The decision to use either a direct or indirect Internet connection for Remote
Support depends on the security and networking requirements of your enterprise.
Hardware Management Console Direct Internet SSL Connection
If your Hardware Management Console can be connected to the Internet, and the external

Level 01f
firewall can be set to allow established TCP packets to flow outbound to the IP addresses
described in “Server address lists and host names,” you can use a direct connection between the
HMC and the Internet. The use of Source Network Address Translation (SNAT) and
masquerading rules to mask the HMC’s source IP address are both acceptable.
Hardware Management Console Indirect Connection with Proxy Server
For the Hardware Management Console to communicate successfully, your proxy server must
allow connections to port 443.
| When using an indirect connection, you can choose whether the proxy is to be directed to connect
| to the IBM Service Support System using an IP address or using a host name. You can control the
| set of targets for that proxy using either a host name or IP address, depending upon the security
| policies of your installation. See “Server address lists and host names” for the list of host names
| and IP addresses.
| If your installation requires host name addressing, your SSL Proxy must be configured with a
| Domain Name Server.
Server address lists and host names

The internet-facing HMC or SSL Proxy requires outbound TCP/IP connections to be allowed to port 443
using the IP addresses that correspond the internet protocol used.
IPv4 addresses (LMC 2.12.1 and later)

Internet connectivity using IPv4 requires outbound connectivity to the following IP addresses:
v 129.42.26.224
v 129.42.34.224
v 129.42.42.224
| v 129.42.56.189
| v 129.42.58.189
| v 129.42.60.189
IPv6 addresses (LMC 2.12.1 and later)

Internet Protocol version 6 (IPv6) vastly extends the range of available IP addresses. Although IPv6 is not
required for remote support facility connection, IBM now offers the capability to migrate to IPv6.
The customer requires that the alternate HMC and the primary HMC are not to be connected to the same
switch, then the alternate HMC and the primary HMC must be defined on the same subnet and IPV6
multicast must flow both ways between the two HMCs.
Internet connectivity using IPv6 requires outbound connectivity to the following IP addresses:
v 2620:0:6c0:1::1000
v 2620:0:6c1:1::1000
v 2620:0:6c2:1::1000
| v 2620:0:6c0:200:129.42.56.189
| v 2620:0:6c1:200:129.42.58.189
| v 2620:0:6c2:200:129.42.60.189
| Host names
| If an SSL Proxy is used to connect to the Internet and your installation requires host names to be used for
| connections, your proxy must accept connections to the following host names:
| v www-945.ibm.com
| v esupport.ibm.com
94 zEC12 IMPP
Level 01f
Chapter 8. I/O cabling and connectivity

Before you place your cable order, consider your future growth needs. You may wish to order cables
longer than you need right now to avoid expansion problems in the future.
As processor packaging evolves, internal locations for various cable connections may shift, necessitating
longer cables, even though the floor locations of connected devices have not changed.
This chapter includes:

v A description of the top exit I/O cabling option.
v A description of the IBM Site and Facilities Services.
v A list of customer fiber optic cabling responsibilities if the services are not elected.
v A description of the zEC12 channel feature connections.
v A description of the Fiber Quick Connect fiber harness feature for FICON cables.
Top exit I/O cabling

The zEC12 has an optional feature for top exit I/O cable towers (FC 7942). These frame towers for top
exit I/O cables will add the following approximate measurements:
Table 33. Top exit I/O cable towers approximate measurements
Weight Width Height
1
| 54.4 kg (120 lbs) – (four top exit 305 mm (12 inches) 142 mm (5.6 in)
I/O cable towers)
| Note:
| 1. The height includes installed cable management brackets.
| The top of the top exit I/O cable towers are level with the top of the Z frame and A frame. Installing the cable
| management brackets adds 142 mm (5.6 in) inches to the overall height of the system. The overall height of the
| system, with the cable management brackets installed, is 2156 mm (84.8 in) from the floor. See Figure 20 on page
| 96.
All I/O cables can be routed through the top exit I/O cable towers, including those designated for the
Fiber Quick Connect feature.
| Two top exit I/O cable towers are installed on the left side of the Z frame (one at the side front and one
| at the side rear). Two top exit I/O cable towers are installed on the right side of the A frame (one at the
| side front and one at the side rear). A shorter cover is located between the two towers on the left side of
| the Z frame and between the two towers on the right side of the A frame. See Figure 20 on page 96.

Level 01f
cable cable
management management
brackets brackets
Figure 20. Top exit towers - with and without cable management brackets
96 zEC12 IMPP
Level 01f
IBM Site and Facilities Services

IBM Site and Facilities Services has a comprehensive set of scalable solutions to address IBM cabling
requirements, from product-level to enterprise-level for small, medium, and large enterprises. These
services fall into two major categories:
v IBM Facilities Cabling Services - fiber transport system
v IBM IT Facilities Assessment, Design, and Construction Services - optimized airflow assessment for
cabling.
Planning and installation services for individual fiber optic cable connections are available. An assessment
and planning for IBM Fiber Transport System (FTS) trunking components can also be performed.
These services are designed to be right-sized for your products or the end-to-end enterprise, and to take
into consideration the requirements for all of the protocols and media types supported on zEC12, zBC12,
z196, z114, System z10, System z9, and zSeries (for example, FICON, coupling links, OSA-Express)
whether the focus is the data center, the Storage Area Network (SAN), the Local Area Network (LAN), or
the end-to-end enterprise.
IBM Site and Facilities Services are designed to deliver convenient, packaged services to help reduce the
complexity of planning, ordering, and installing fiber optic cables. The appropriate fiber cabling is
selected based upon the product requirements and the installed fiber plant.
The services are packaged as follows:

v Under IBM Facilities Cabling Services there is the option to provide IBM Fiber Transport System (FTS)
trunking commodities (fiber optic trunk cables, fiber harnesses, panel-mount boxes) for connecting to
the zEC12, zBC12, z196, z114, z10 EC, z10 BC, z9 EC, z9 BC, z990, and z890. IBM can reduce the cable
clutter and cable bulk under the floor. An analysis of the channel configuration and any existing fiber
optic cabling is performed to determine the required FTS trunking commodities. IBM can also help
organize the entire enterprise. This option includes enterprise planning, new cables, fiber optic
trunking commodities, installation, and documentation.
v Under IBM IT Facilities Assessment, Design, and Construction Services there is the Optimized Airflow
Assessment for Cabling option to provide you with a comprehensive review of your existing data
center cabling infrastructure. This service provides an expert analysis of the overall cabling design
required to help improve data center airflow for optimized cooling, and to facilitate operational
efficiency through simplified change management.
Refer to the Services section of Resource Link for further details.
Chapter 8. I/O cabling and connectivity 97

Level 01f
Customer fiber optic cabling responsibilities

If you choose to plan and install your own I/O cabling, these are the specific tasks you must complete
prior to system installation:
1. All cable planning and support
2. All purchasing of correct qualified cables
3. All installation of any required fiber optic or OSA-Express copper cables
4. All routing of cables to correct front/back floor cutouts for proper installation to the machine
5. If using the top exit I/O feature, you must install toroids on each copper Ethernet cable
6. All labeling of cables with PCHID numbers for proper installation to the machine.
Failure to accomplish these cabling tasks properly could lead to additional service charges during the
machine installation in order to correct any problems incurred.
All jumper cables, cable components, and connector options are available through IBM Global Services.
Contact your IBM installation planning representative, IBM product specialist, or IBM Connectivity
Services specialist for details.
Note: Customer cabling preparation does not include plugging cables into the zEC12.
CAUTION: Servicing of this product or unit is to be performed by trained service personnel only.
(C032)
98 zEC12 IMPP
Level 01f
FICON channel features

The FICON Express8S feature and the FICON Express8 feature deliver up to 8 Gbps link data rate to
servers, switches, control units and storage devices. The FICON Express4 feature delivers up to 4 Gbps
link data rate to servers, switches, control units and storage devices. FICON channels offer fast, efficient
data transfer while allowing reuse of currently installed single mode and multimode fiber optic cables.
Configuration information
Table 34 lists the FICON features. These features support two modes of operation:
v FC - native FICON
v FCP - Fibre Channel Protocol - attachment to SCSI disks in Linux on System z and z/VM®
environments.
Table 34. FICON feature codes
Feature code Description Fiber type
FC 3321 FICON Express4 LX single mode 9 micron
(4 ports) (Long Wavelength) (unrepeated distance - 10 km / 6.2 miles)
FC 3322 FICON Express4 SX multimode 50 and 62.5 micron
(4 ports) (Short Wavelength) (variable - maximum 860 m / 2822 ft))
FC 3325 FICON Express8 LX single mode 9 micron
FC 3326 FICON Express8 SX multimode 50 and 62.5 micron
FC 0409 (PCIe) FICON Express8S LX single mode 9 micron
FC 0410 (PCIe) FICON Express8S SX multimode 50 and 62.5 micron
v All FICON Express feature codes use LC Duplex connectors.

v Each feature code represents a FICON base adapter with pluggable optic modules.
v Short wavelength and long wavelength optic modules cannot be mixed on the same FICON base
adapter.
v Short wavelength and long wavelength features (FICON adapters) can coexist in the same I/O cage.
See “FICON references” on page 101 for information about link distances and light loss budget.
The following illustrations shows the FICON features, the ports on the feature, and the type of connector
used.

Level 01f
FCs 3321/3322
FICON Express4 LX/SX
LC Duplex Connector
Channel Port A1
D1
B1
C1
LC Duplex Connector
Channel Port A2
D2
B2
C2
A3
D3
B3
Channel Port C3
LC Duplex Connector
A4
D4
B4
Channel Port C4
LC Duplex Connector
Figure 21. FICON Express4 features
100 zEC12 IMPP

Level 01f
FCs 3325/3326
FICON Express8 LX/SX
FRU
LC Duplex Connector
Channel Port D1
B1
C1
LC Duplex Connector
Channel Port D2
B2
C2
D3
B3
Channel Port C3
LC Duplex Connector
D4
B4
Channel Port C4
LC Duplex Connector
Figure 22. FICON Express8 features
FCs 0409/0410
FICON Express8S LX/SX
LC Duplex Connector
Channel Port
Channel Port
LC Duplex Connector
Figure 23. FICON Express8S features
FICON references
For additional information on planning for FICON channels see:
v System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links, and Open System Adapters)
v System z FICON Channel-to-Channel Reference

Level 01f
ISC-3 link feature

ISC-3 links provide Parallel Sysplex connectivity between a coupling facility and production systems
using z/OS operating systems. ISC-3 links operate at 2 Gbps in peer mode (connection between zEC12,
zBC12, z196, z114, z10 EC, z10 BC, z9 EC, z9 BC, z990, or z890 systems) at unrepeated distances up to 10
kilometers (6.2 miles).
Table 35 describes the ISC-3 feature.
Table 35. ISC-3 feature code
Feature code Description Fiber type Connector type
0218 2-port ISC-3 9 micron single mode LC Duplex
v ISC-3 links are comprised of:

– FC 0218 - A “daughter” adapter card with two ISC-3 ports per card.
– FC 0217 - A “mother” card into which can be plugged two “daughter” cards.
– FC 0219 - LMC that activates the ports on a “daughter” card. Each port on a “daughter” card is
activated individually.
– The “mother” card, two “daughter” cards, and the individual port LIC can combine to provide up
to four ports per ISC-3 adapter.
Note: On an initial system order, any request for more than two ISC-3 ports automatically generates
a minimum of two FCs 0217. This ensures maximum ISC-3 availability and efficiency.
v The system configuration tool places the ISC-3 feature port LMC across an appropriate number of
cards for high availability.
v See System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links, and Open System Adapters) for
information about link distances and light loss budget.
Figure 24 on page 103 shows the ISC-3 feature, the links on the daughter cards, and the type of fiber
optic connector that plugs into the transceivers.
102 zEC12 IMPP

Level 01f
FC 0218
ISC-3
ISC-3 Links
LC Duplex Connectors
ISC-3 Links
Figure 24. ISC-3

Level 01f
OSA-Express features
Open Systems Adapter-Express (OSA-Express) features enable connectivity to industry-standard local area
networks (LANs).
Table 36 lists the OSA-Express features:
Table 36. OSA-Express feature codes.
This table lists the feature description, the cable description, and the connector type for the supported OSA-Express
feature codes.
Feature code Feature description Cable description Connector type
FC 3362 OSA-Express3 GbE LX 9 micron single mode LC Duplex
(4 ports)
FC 3363 OSA-Express3 GbE SX 50 and 62.5 micron multimode LC Duplex
(4 ports)
FC 3367 OSA-Express3 1000BASE-T Category 5 or Category 6 UTP RJ-45
(4 ports) Ethernet copper wire
FC 3370 OSA-Express3 10 GbE LR 9 micron single mode LC Duplex
(2 ports)
FC 3371 OSA-Express3 10 GbE SR 50 or 62.5 micron multimode LC Duplex
(2 ports)
FC 0404 (PCIe) OSA-Express4S GbE LX 9 micron single mode LC Duplex
(2 ports)
FC 0405 (PCIe) OSA-Express4S GbE SX 50 and 62.5 micron multimode LC Duplex
(2 ports)
FC 0406 (PCIe) OSA-Express4S 10 GbE LR 9 micron single mode LC Duplex
(1 port)
FC 0407 (PCIe) OSA-Express4S 10 GbE SR 50 and 62.5 micron multimode LC Duplex
(1 port)
FC 0408 (PCIe) OSA-Express4S 1000BASE-T Category 5 or Category 6 UTP RJ-45
(2 ports) copper wire
| FC 0413 (PCIe) OSA-Express5S GbE LX 9 micron single mode LC Duplex
| (2 port)
| FC 0414 (PCIe) OSA-Express5S GbE SX 50 and 62.5 micron multimode LC Duplex
| (2 port)
| FC 0415 (PCIe) OSA-Express5S 10 GbE LR 9 micron single mode LC Duplex
| (1 port)
| FC 0416 (PCIe) OSA-Express5S 10 GbE SR 50 and 62.5 micron multimode LC Duplex
| (1 port)
| FC 0417 (PCIe) OSA-Express5S 1000BASE-T Category 5 UTP copper wire RJ-45
| (2 port)
104 zEC12 IMPP

Level 01f
FCs 3362/3363
OSA-Express3
Gigabit Ethernet LX/SX
LAN port A0 P0
J00
LAN port J01

A1 P1
J00
J01
FRU
J02
J03
LAN port P1 A1
J02 LC Duplex Connectors
LAN port J03

P0 A0
FC 3367
OSA Express3
1000Base-T Ethernet
RJ-45 Connector
LAN port P0
J00
A0
B0
A1
B1
LAN port J01

P1
RJ-45 Connector
J00
J01
FRU
J02
J03
RJ-45 Connector
LAN port P1
J02
A1
B1
A0
B0
LAN port J03

P0
RJ-45 Connector
Figure 25. OSA-Express3 features (1 of 2)

Level 01f
FC 3370/3371
OSA-Express3
10 Gigabit Ethernet LR/SR
J00
LAN port
ACTLINK
P0
J00
FRU
J01
P0
ACTLINK
LAN port
J01
Figure 26. OSA-Express3 features (2 of 2)
106 zEC12 IMPP

Level 01f
FCs 0404/0405
OSA Express4S
Gigabit Ethernet LX/SX
LAN port 0 LC Duplex Connector

P0
J00
LAN port 1 A
0
B
0
A
1
B
1
J01
P1
P0
LC Duplex Connector
P1
F
R
U
FCs 0406/0407
OSA Express4S
10 Gigabit Ethernet LR/SR
LAN port 0
A0
J00
P0
F
R
U
LC Duplex Connector
FC 0408
OSA Express4S
1000Base-T Ethernet
RJ-45 Connector
P0
J00
LAN port 0 A0
B0
A1
LAN port 1 B1
J01
P1
F
P0
P1
RJ-45 Connector
R
U 57E9
Figure 27. OSA-Express4S features

Level 01f
FCs 0413/0414 FCs 0415/0416

OSA Express5S OSA Express5S
Gigabit Ethernet LX/SX 10 Gigabit Ethernet LR/SR
LAN port 0 LC Duplex Connector LAN port 0 LC Duplex Connector
LAN port 1
LC Duplex Connector
FC 0417
OSA Express5S
1000Base-T Ethernet
FRU
RJ-45 Connector
D1
LAN port 0
A1 B1
D2
LAN port 1 A2 B2
RJ-45 Connector
Figure 28. OSA-Express5S features
OSA-Express references
For additional information on planning for OSA features see:
v Open System Adapter-Express Integrated Console Controller User’s Guide
v zEnterprise, System z10, System z9 and zSeries Open Systems Adapter-Express Customer's Guide and Reference
v System z Planning for Fiber Optic Links (FICON/FCP, Coupling Links, and Open System Adapters)
| I/O interconnect links

| An HCA2-C fanout card (FC 0162) supports two copper cable 12x InfiniBand DDR 6 GBps interconnects.
| These connect to the two IFB-MP cards in an I/O drawer or I/O cage. A single IFB-MP card controls an
| I/O domain that contains four channel cards.
| A PCIe fanout card (FC 0169) supports two copper cable PCIe 8 GBps interconnects. These connect to the
| two PCI-IN cards in a PCIe I/O drawer. A single PCI-IN card controls an I/O domain that contains eight
| channel cards.
108 zEC12 IMPP
Level 01f
InfiniBand fiber optic link features

The HCA3-O feature (FC 0171) and HCA2-O feature (FC 0163) support 12x InfiniBand for coupling
communication between systems. If you are planning to install 12x InfiniBand links, you will have to
place connected servers no further than 150 meters (492 feet) from each other.
12x InfiniBand provides up to a 6.0 GBps fiber optic connection between zEC12, z196, and z114 servers,
and up to a 3.0 GBps connection to z10 and z9 servers. A 12x InfiniBand fiber optic cable (50 micron
multimode OM3) connects directly to a port on the HCA3-O or HCA2-O fanout card.
The following cables are all duplex 24-fiber cable assemblies, SX laser 50 micron, using MPO connectors
on both ends.
Table 37. InfiniBand cable part numbers for FCs 0163 and 0171
Length
Part number meters (feet)
41V2466 10.0 (32.8)
15R8844 13.0 (42.7)
15R8845 15.0 (49.2)
41V2467 20.0 (65.6)
41V2468 40.0 (131.2)
41V2469 80.0 (262.4)
41V2470 120.0 (393.7)
41V2471 150.0 (492.1)
42V2083 Custom (Custom)
The HCA3-O LR feature (FC 0170) and the HCA2-O LR feature (FC 0168) support 1x Long Reach (LR)
InfiniBand for coupling communication between systems. 1x IFB coupling links support a maximum
unrepeated distance of 10 kilometers (6.2 miles) and the maximum repeated distance is 100 kilometers (62
miles) when attached to a qualified DWDM.
1x Long Reach (LR) InfiniBand provides up to a 5.0 Gbps fiber optic connection.
A 1x LR InfiniBand fiber optic cable (9 micron single mode) connects directly to a port on the HCA2-O
LR or HCA3-O LR fanout card.
Notes:
1. InfiniBand will not connect to z990 or z890.
2. You must supply InfiniBand cables as you do with other fiber optic systems (FICON, OSA).
Table 38. InfiniBand feature codes
Feature code Description Fiber type Connector type
FC 0171 HCA3-O SX laser 50 micron MPO
FC 0163 HCA2–O SX laser 50 micron MPO
FC 0170 HCA3-O LR 9 micron single mode LC Duplex
FC 0168 HCA2-O-LR 9 micron single mode LC Duplex

Level 01f
Flash Express (FC 0402)

Flash Express (FC 0402) provides a special programming interface to move data between the Flash
Express and host DRAM. It enables z/OS to access blocks of flash storage as storage locations in a logical
partition. The Flash Express card is designed to help improve availability and performance.
You can order Flash Express in increments of two, up to a maximum of eight 8 features.
Each pair of Flash Express features requires interconnect cabling and specific plugging rules to manage
the pairing.
Flash Express (FC 0402) can only be installed in a PCIe I/O drawers
FC 0402
Flash Express
FRU
P1
J01
P1
J02
P2
P2
58C1
| Native PCIe adapters

| The 10GbE RoCE Express and zEDC Express features utilize industry standard PCIe adapters (called
| native PCIe adapters). The adaptation layer and the associated ASIC (both of which are part of the
| FICON, OSA, OSC, Crypto, and Flash features) are no longer needed with 10GbE RoCE Express or zEDC
| Express. With the elimination of the adaptation layer, the 10GbE RoCE Express and zEDC Express
| features are designed to offer significant performance. They physically plug into a mother card that
| provides Vital Product Data (VPD) and hot-plug capability. The features then plug into the PCIe I/O
| drawer.
| Table 39 lists the current supported native PCIe adapters.

| Table 39. Native PCIe adapter feature codes
| Feature code Description
| FC 0411 10GbE RoCE Express
| FC 0420 zEDC Express
|
| These native cards do not have CHPID assignments. They have Virtual Functions (VFs) that are defined
| in IOCP/HCD. PCHIDs are still applicable with native cards. These cards can only be plugged into a
| PCIe I/O drawer.
110 zEC12 IMPP

Level 01f
| 10GbE RoCE Express (FC 0411)

| RoCE stands for RDMA (Remote Direct Memory Access) over Converged Ethernet. Using 10GbE RoCE
| Express (FC 0411), RDMA technology is available on Ethernet. RDMA technology provides the capability
| to allow hosts to logically share memory. 10GbE RoCE Express, in conjunction with an OSA card, enables
| shared memory communications between two CPCs using a shared switch, which is customer supplied.
| 10GbE RoCE Express does not use a CHPID number and does not require a CHPID type.
| You can use 10GbE RoCE Express to help reduce network latency with memory-to-memory transfers
| utilizing Shared Memory Communications- Remote Direct Memory Access (SMC-R) in z/OS V2.1. It is
| transparent to applications and can be used for LPAR-to-LPAR communication on a single z/OS system
| or server-to-server communication in a multiple CPC environment.
| 10GbE RoCE Express uses existing Ethernet fabric (switches with Global Pause enabled), and requires a
| standard 10 GbE switch (CEE enabled switch is not required).
| You can order 10GbE RoCE Express in increments of two ports, up to a maximum of 32 ports (16
| features). There are two ports per feature. Only one of the two ports is supported by z/OS.
|
|
FC 0411
10 Gigabit Ethernet RoCE Express
LAN port 1
LC Duplex Connector
D1
D1 D2
D2
F
R
U
D1
D2
58A7
|
| Figure 29. 10GbE RoCE Express feature
|
| zEnterprise Data Compression (zEDC) Express (FC 0420)
| The zEDC Express feature and the IBM zEnterprise Data Compression (zEDC) acceleration capability in
| z/OS are designed to help improve cross-platform data exchange, reduce CPU consumption, and save
| disk space. zEDC Express is designed to allow higher write rates for SMF data when hardware
| compression is enabled. zEDC Express can be shared by up to 15 LPARs.
| You can order zEDC Express in increments of one feature, up to a maximum of 8 features. Pairing is not
| required, but highly suggested for reliability and availability purposes.
|

Level 01f
|
FC 0420
zEDC Express
F
R
U
59AB
|
| Figure 30. zEDC Express feature
|
112 zEC12 IMPP

Level 01f
Time synchronization
Synchronized time is possible with a zEC12 in a Sysplex environment using Server Time Protocol (STP).
STP supports Coordinated Timing Networks (CTNs) where the zEC12s in the network are configured to
be in STP timing mode.
Server Time Protocol (STP)

Server Time Protocol (FC 1021) requires no special cables to create timing links with other servers.
Depending on the distance between servers in a timing network, you may use ISC-3 or InfiniBand fiber
optic cables to create the Sysplex. STP can be installed on zEC12, zBC12, z196, z114, z10 EC, z10 BC, z9
EC, z9 BC, z990, z890, and Coupling Facility servers. z9 EC, z9 BC, z990, z890, z900 and z800 servers
cannot participate in a Sysplex or the same Coordinated Timing Network (CTN) with zEC12.
Pulse per second

An STP CTN has the capability of configuring as its time source a Network Time Protocol (NTP) time
server that has a pulse per second (PPS) output signal. This type of external time device is available
worldwide from several vendors that provide network timing solutions. Typically, the NTP output of the
time server is connected to the Support Element (SE) LAN because the NTP client runs on the Support
Element. The PPS output of the NTP time server is connected to the PPS input coaxial connector
provided on the PPS/FSP card of the zEC12.
Note that pulse per second is only available for zEC12, zBC12, z196, z114, System z10, or System z9.
Connectivity information
The cable for pulse per second is coaxial. You are responsible for supplying these cables.
PPS/FSP location
The following illustration shows the location of the PPS/FSP cards in the zEC12.

Level 01f
PPS/FSP card PPS/FSP card
Figure 31. PPS/FSP card location
Ordering PPS cables

If you are planning to place this server in an STP-only Coordinated Timing Network using NTP with
pulse per second as the external time source, you must supply the coaxial cables that connect the zEC12
to the NTP server providing the PPS signal.
114 zEC12 IMPP

Level 01f
Fiber Quick Connect (FQC) for FICON cabling

Fiber Quick Connect harness cabling, harness brackets and mounting hardware are ordered with the
zEC12 as feature codes. The feature codes are:
Table 40. Fiber Quick Connect feature codes
Fiber Quick Connect (FQC) feature codes - Radiator-cooled
7922 FQC first bracket and mounting hardware base clamp and bracket
(Radiator-cooled)
7927 LC Duplex 6.6 ft. harness (FICON) (Radiator-cooled) from cage at A01
from I/O drawer at Z15, Z22
from PCIe I/O drawer at all locations
Fiber Quick Connect (FQC) feature codes - Water-cooled
7922 FQC first bracket and mounting hardware (Water-cooled) base clamp and bracket
7927 LC Duplex 6.6 ft. harness (FICON) (Water-cooled) from cage at A08
from I/O drawer at Z15, Z22
from PCIe I/O drawer at all locations
The Fiber Quick Connect feature enables trunk cables to connect to FICON channels using
under-the-cover attachment harnesses. These harnesses are installed when your system is built, and your
zEC12 arrives ready to connect the trunk cables at your site.
Figure 32 shows the Fiber Quick Connect feature hardware.
LC Duplex (FICON) harness
MTP connectors
Harness bracket
LC Duplex (FICON) harness
Figure 32. Fiber Quick Connect feature hardware
The harness brackets use an MTP connector, and the FICON connectors are routed to the feature cards in
each frame.
The following list shows where the FQC brackets are used, and the order in which they are installed.
v A-frame front - A00L (1), A00K (2), A00J (3), A00G (4)
v A-frame rear - A00N (1), A00P (2), A00Q (3)
– For a water cooled machine, due to space limitations, the quantity of rear brackets is limited to two,
A00N and A00P.

Level 01f
– For a water cooled machine if the amount of I/O in the order would require more than two A frame
rear brackets then the configuration will not be allowed and a message will be generated to inform
you that the order cannot be completed as configured.
v Z-frame front - Z00B (1), Z00C (2), Z00E (3), Z00F (4), Z00G (5)
v Z-frame rear - Z00Y (1), Z00X (2), Z00W (3), Z00U (4)
116 zEC12 IMPP

Level 01f
Z frame - front side frame

horizontal
units
fiber cables into system
A B C D E F G H J K L M
bracket
Z00B Z00C Z00E Z00F Z00G
fiber cables under floor single high fiber trunk

1 2 3 4 5 6 7 8 9 bracket positions
along tailgate
A B C E F G J K L (top view)
bracket (top view) frame

(12 sockets per bracket) Z frame - rear side horizontal
units
N P Q R S T U V W X Y Z
Z00U Z00W Z00X Z00Y
single high fiber trunk

along tailgate
N P Q S T U W X Y (top view)
A frame - front side frame

horizontal
units
fiber cables into system
A B C D E F G H J K L M
bracket
A00G A00J A00K A00L
fiber cables under floor single high fiber trunk

along tailgate
A B C E F G J K L (top view)
bracket (top view) frame

(12 sockets per bracket) A frame - rear side horizontal
units
N P Q R S T U V W X Y Z
A00N A00P A00Q

Note: On a water cooled machine,
an FQC bracket cannot be
used at location A00Q. single high fiber trunk
along tailgate
N P Q S T U W X Y (top view)

Level 01f
| Fiber Quick Connect mounting brackets can also be installed at EIA positions 02, 10, and 19 in the top
exit I/O cable towers. (The harness bracket is installed on the Fiber Quick Connect mounting bracket.)
EIA 19
EIA 10
EIA 02
Figure 33. Fiber Quick Connect mounting brackets
If you are planning to use the Fiber Quick Connect feature for FICON channels, contact IBM Site and
Facilities Services for assistance. Site and Facilities Services will help you plan for the trunking cabling
solution that meets your individual system requirements. Your IBM installation planning representative,
IBM product specialist, or IBM service representative will provide you with the information necessary to
contact Site and Facilities Services.
118 zEC12 IMPP

Level 01f
Preparing configuration definitions

The customer is responsible for preparing a definition of the I/O configuration for the new processor.
You should use the PCHID report from the order process configurator as a guide for planning and
defining the new configuration. Depending on the current operating environment there may be several
methods for accomplishing this.
z/VM
If you use HCM and HCD, develop the configuration using HCM and HCD. Otherwise, develop the
IOCP statements necessary to define your configuration and use the level of the ICP IOCP program that
supports the new processor to verify the input statements. You do not need to initially assign PCHID
values to the channel paths in your configuration. You can use the CHPID Mapping Tool, available from
Resource Link, to aid you in assigning PCHIDs to CHPIDs. HCM and HCD users must build an IOCP
input data set from a validated work IODF and use this as input to the CHPID Mapping Tool. The
CHPID Mapping Tool updates the IOCP input and assigns PCHIDs to the CHPIDs.
Note: An IOCP input file that was created by HCM and HCD without PCHIDs must be migrated back
into HCM and HCD after PCHID numbers have been added to the file by the CHPID Mapping Tool. An
IOCDS can then be written from a production IODF or IOCP statements can be built for the install
diskette.
If you are installing a new processor, transfer the IOCP statements for your configuration to a diskette. If
necessary, the IOCP input file can be compressed using a zip-compatible program. When the new system
arrives, give the diskette containing the IOCP input statements to the install team.
If you are installing a new processor, instead of using a diskette you can remotely write the IOCDS from
an HCD that is running on an installed CPC in the same HMC cluster. Inform the install team that plans
are in place to use the "Build and manage S/390 microprocessor IOCDSs" option in HCD to write the
IOCDS.
z/VSE®
Develop the IOCP statements necessary to define your configuration and use the level of the ICP IOCP
program that supports the new processor to verify the input statements. You do not need to initially
assign PCHID values to the channel paths in your configuration. You can use the CHPID Mapping Tool,
available from Resource Link, to aid you in assigning PCHIDs to CHPIDs. The CHPID Mapping Tool
updates the IOCP input and assigns PCHIDs to the CHPIDs.
If you are installing a new processor, transfer the IOCP statements for your configuration to a diskette. If
necessary, the IOCP input file can be compressed using a zip-compatible program. When the new system
arrives, give the diskette containing the IOCP input statements to the install team.
z/OS HCD
Develop the configuration using HCD. You do not need to initially assign PCHID values to the channel
paths in your configuration. You can use the CHPID Mapping Tool, available from Resource Link, to aid
you in assigning PCHIDs to CHPIDs. Build an IOCP input data set from a validated work IODF and use
this as input to the CHPID Mapping Tool. The CHPID Mapping Tool updates the IOCP input and assigns
PCHIDs to the CHPIDs. Migrate the modified IOCP input file back into HCD after PCHID numbers have
been added to the file by the CHPID Mapping Tool. An IOCDS can then be written in preparation for an
upgrade using a production IODF.
Note: An IOCP input file that was created by HCD without PCHIDs must be migrated back into HCD
after PCHID numbers have been added to the file by the CHPID Mapping Tool. An IOCDS can then be
written from a production IODF or IOCP statements can be built for the install diskette.
If you are installing a new processor, build an IOCP input data set for your configuration from a
production IODF and transfer the IOCP statements to a diskette. In the unlikely event that the IOCP

Level 01f
input file exceeds the capacity of the diskette, the IOCP input file can be compressed using a
zip-compatible program. When the new system arrives, give the diskette containing the IOCP input
statements to the install team.
If you are installing a new processor, instead of using a diskette you can remotely write the IOCDS from
an HCD that is running on an installed CPC in the same HMC cluster. Inform the install team that plans
are in place to use the "Build and manage S/390 microprocessor IOCDSs" option in HCD to write the
IOCDS.
120 zEC12 IMPP

Level 01f
Chapter 9. Parallel sysplex planning

This chapter is intended to provide guidance to those customers who operate in a Parallel Sysplex
environment. A Parallel Sysplex typically involves multiple processors and coupling facilities, shared I/O
devices, and a host of interconnection possibilities. Detailed planning for a Parallel Sysplex is essential to
meet technical objectives, such as performance and high availability, within the constraints of a specific
raised floor configuration. Consider using IBM Site and Facilities Services to plan your sysplex
environment. A list of tasks the Service can perform is provided under “IBM Site and Facilities Services”
on page 97. Different technologies for servers, links and coupling facilities affect your ability to configure
a productive sysplex.
The basic premise for a successful Parallel Sysplex installation is to centralize the physical location of the
| coupling facilities, and then position the sysplex servers around that center. Servers can be placed
| side-to-side. In addition to bringing the servers closer to the coupling facility, placing your server
| side-to-side provides for better management of hot and cold air flow.
| Following are some guidelines to help you better plan for multiple system interconnection. These are
| example configurations that would minimize the distance to the coupling facility.
1. Position the coupling facilities (or servers with internal coupling facilities) in the center of an open
area of raised floor large enough to accommodate all of the servers and other coupling facilities to
which you want to connect.
Coupling
Central
Facility
ICF
= 610 mm (24 in) floor tiles

= Cool aisle, 1.22 meters
= Perforated floor tile
= Exhaust (heated air from
v Use physical planning information for each type of server/coupling facility you intend to add to
the Parallel Sysplex to help determine how much floor space you will need.
v Remember to consider weight distribution, service clearances, power, and cooling for each piece of
equipment you want to include.
2. Arrange the sysplex in two rows, with the fronts of servers and coupling facilities facing each other
(see the illustration under “Weight distribution and multiple systems” on page 38). Allow a 1168 mm

Level 01f
(46 inch) aisle width between the rows. Although this may be a larger aisle than you have used
before, your Parallel Sysplex will benefit from the improvement in cooling that a wider aisle provides.
(See Figure 10 on page 43.)
Note: Figure 10 on page 43 shows a minimum aisle width of 941 mm (37 in). Although this width is
adequate for a congested computer room floor, it is the minimum you should use. An aisle 1168 mm
(46 inch) wide will better serve the cooling and cabling needs of a Parallel Sysplex configuration.
Coupling
Central
Facility
ICF

3. Sysplex connections can be made using ISC-3 and InfiniBand fiber optic link cabling. The Sysplex
itself may be comprised of servers connected to a Sysplex Timer, servers connected to each other
through the Server Time Protocol feature (STP), or a mixture of both types of connections.
Notes:
a. zEC12 has no External Time Reference (ETR) capability.
b. z9 EC, z9 BC, z990, z890, z900, and z800 cannot participate in a Parallel Sysplex with zEC12.
zEC12 can only communicate directly with zEC12, zBC12, z196, z114, z10 EC, and z10 BC.
4. As the Parallel Sysplex grows, add new servers evenly on either side of the central coupling facilities.
122 zEC12 IMPP

Level 01f
Coupling
Central
Facility
ICF

5. As the Parallel Sysplex evolves, it is possible to add rows using ISC links or InfiniBand links, which
provide connectivity over greater distances than previous links. With the equipment in these new
rows centered on the original central coupling facilities, the Parallel Sysplex now assumes the shape
of a diamond.
Chapter 9. Parallel sysplex planning 123

Level 01f
Coupling
Central
Facility
ICF

By following these guidelines, you will be able to configure a Parallel Sysplex, using the minimum
amount of floor space, that meets your performance and availability objectives. The use of technology
combinations - zEC12, zBC12, z196, z114, and System z10 servers and coupling facilities may complicate
your physical planning, but the basic strategies outlined here will result in a successful Parallel Sysplex
environment.
124 zEC12 IMPP

Level 01f
Appendix A. IBM standard symbols
In Plan Views:
Cable Entry and Exit Area in the Service Area Boundary
base of the machine. Locating (Service clearances are measured
(Without
dimensions are measured from feature)
from the machine with covers closed)
the edge of the frame, not the
cover. This does not indicate the Casters
floor cutout. Locating dimensions are measured
from the edge of the frame, not the cover.
Cable Exit Area, recommended
Leveling pads or glides
(90 mm [3 1/2 in] typical diameter)
Power Cord exit, 50/60 Hz Locating dimensions are measured
from the edge of the frame, not the cover.
Power Cord exit, 400 Hz Legs
Power cords are supplied in 4.2 m (14 ft) lengths

unless otherwise noted on the specification page. Non-raised floor cable exit
The length is measured from the symbol or .
Meter location
Swinging Gate
Unit Emergency Switch
Standard equipment outline
(shows the machine with covers closed) Hinged Covers
Optional equipment outline
Single
Customer Engineer
Indicator Panel
In Cabling Schematics: Bifold
801
Indicates a cable group
coming from a machine Offset Bifold
800
503
Indicates a cable group
going to a machine
504

Level 01f
126 zEC12 IMPP

Level 01f
Appendix B. Hardware Management Console physical

specifications
This section contains information for the Hardware Management Console components applicable at the
time of publication (determined by the edition notice at the front of this document). Specifications for
your Hardware Management Console may differ from those presented below.
Note: When planning the work area for the Hardware Management Console, remember to allow a
suitable space for a full-size keyboard and mouse.
|| FC 0092 - Hardware Management Console system unit specifications
|
| Dimensions
| Height 425 mm (16.74 in.)
| Width 176 mm (6.93 in.)
| Depth 635 mm (25.00 in.)
| Weight minimum configuration as shipped 20.0 kg (44.10 lbs.)
| Weight maximum configuration 29.7 kg (65.48 lbs.)
| Input Power1
| Low range input voltage 100 VAC - 127 VAC
| High range input voltage 200 VAC - 240 VAC
| Input frequency range 50 - 60 Hz
| Input kilovolt-amperes (kVA) (approximate)
| Minimum configuration as shipped 0.12 kVA
| Maximum configuration 0.90 kVA
| Output Power1
| Heat output in British thermal units (Btu) (approximate)
| Minimum configuration 392 Btu/hr (115 watts)
| Maximum configuration 2900 Btu/hr (850 watts)
| Environmentals
| Server On
| Temperature with altitude: 0 to 950 m (3117 ft) 5° to 40° C (41° to 104° F)
| Temperature with altitude: greater than 950 m (3117 ft) derated 1°C (33.8° F) per 175 m (575 ft)
| Temperature at maximum altitude 3050 m (10,007 ft) 5° to 28° C (41° to 82.4° F)
| Humidity, non-condensing:
| Dew point 12° C (10.4° F)
| Relative humidity 8% - 85%
| Maximum dew point 24° C (75.2° F)
| Server Off
| Temperature 5° to 45° C (41° to 113° F)

Level 01f
| FC 0092 - Hardware Management Console system unit specifications

| Storage (non-operating)
| Temperature 1° to 60° C (33.8° to 140° F)
| Altitude 3050 m (10,007 ft)
| Shipping (non-operating)
| Temperature -40° to 60° C (-40° to 140° F)
| Altitude 10,700 m (35,105 ft)
| 1. Power consumption and heat output vary with the number and type of optional features installed and the
| power-management optional features in use.
|
128 zEC12 IMPP

Level 01f
FC 0091 - Hardware Management Console system unit specifications
Dimensions
Height 438 mm (17.3 in.)
Width 216 mm (8.5 in.)
Depth 540 mm (21.3 in.)
Weight minimum configuration as shipped 16.3 kg (36 lbs.)
Weight maximum configuration 25.2 kg (56 lbs.)
Input Power1
Voltage switch setting 115 VAC
Low range input voltage 100 VAC - 127 VAC
Input frequency range 47 - 53 Hz
Voltage switch setting 230 VAC
High range input voltage 200 VAC - 240 VAC
Input frequency range 57 - 63 Hz
Input kilovolt-amperes (kVA) (approximate)
Minimum configuration as shipped 0.20 kVA
Maximum configuration 0.55 kVA
Output Power1
Heat output in British thermal units (Btu) (approximate)
Minimum configuration 188 Btu/hr (55 watts)
Maximum configuration 1784 Btu/hr (523 watts)
Environmentals
Server On - 0 to 914 m (2998 ft) 10° to 35° C (50° to 95° F)
Server On - 914 m (2998 ft) to 2133.6 m (7000 ft) 10° to 32° C (50° to 89.6° F)
Server Off - to 2133 m (7000 ft) 10° to 43° C (50° to 109.4° F)
Shipping -40° to 60° C (-40° to 140° F)
Humidity Range (operating and storage) 8% - 80%
1. Power consumption and heat output vary with the number and type of optional features installed and the
power-management optional features in use.
Appendix B. Hardware Management Console physical specifications 129

Level 01f
FC 6096 - Flat panel display specifications
L2251x - Flat panel display LT2323p - Flat panel display

558.7 mm (22.0 inch) 584.2 mm (23.0 inch)
Dimensions
Height 406.0 mm (15.98 in) 403.9 mm (15.90 in)
Width 514.4 mm (20.25 in) 547.8 mm (21.57 in)
Depth 239.8 mm (9.44 in) 186.0 mm (7.32 in)
Weight with stand 6.2 kg (20.5 lbs) 5.74 kg (12.65 lbs)
Input Power
Input voltage 100 VAC - 240 VAC (+/- 10%) 100 VAC - 240 VAC (+/- 10%)
Input frequency range 50/60 Hz + or - 3 Hz 50/60 Hz + or - 3 Hz
Rated Current 1.5 amps 1.5 amps
Power Consumption
Normal operation < 45 watts < 20 watts
Standby/Suspend < 2 watts (analog or digital) < 0.5 watts (analog or digital)
Active off < 1 watt (at 100 VAC and 240 VAC) < 0.5 watt (at 100 VAC and 240 VAC)
Environmentals - Temperature
Operating 10° to 45° C (50° to 113° F) 0° to 40° C (32° to 104° F)
Storage -20° to 60° C (-4° to 140° F) -20° to 60° C (-4° to 140° F)
Shipping -20° to 60° C (-4° to 140° F) -20° to 60° C (-4° to 140° F)
Environmentals - Humidity
Operating 10% to 80% 10% to 80%
Storage 5% to 90% 5% to 95%
Shipping 5% to 90% 5% to 95%
130 zEC12 IMPP

Level 01f
Appendix C. Acoustics
This appendix provides information on acoustics for the zEC12 at nominal environmental ambient
temperatures of 23oC plus or minus 2oC (73.4oF plus or minus 3.6oF).
Acoustical noise emission levels

1-3
Table 41. Preliminary acoustical noise emissions (zEC12)
Declared A-weighted sound Declared A-weighted sound
Product configuration power level LWAd (B) pressure level LpAm (dB)
Operating (B) Idling (B) Operating (dB) Idling (dB)
Typical Configuration: MT 2827 Model H43
RCU-system installed with three I/O drawers.
7.84 7.84 59 59
All air-moving devices at nominal speeds; front
and rear acoustical doors.
Maximum Configuration: MT 2827 Model HA1
RCU-system installed with six I/O drawers. All 5
8.1 8.15 62 62
air-moving devices at nominal speeds; front
Typical Configuration: MT 2827 Model H43
WCU-system installed with three I/O drawers.
7.94 7.9 4
60 60
Maximum Configuration: MT 2827 Model HA1
WCU-system installed with six I/O drawers.
8.05 8.05 61 61
Notes:
1. Declared level LWAd is the upper-limit A-weighted sound power level; Declared level LpAm is the mean
A-weighted sound pressure level measured at the 1-meter bystander positions.
2. All measurements made in conformance with ISO 7779 and declared in conformance with ISO 9296.
3. B and dB are the abbreviations for bels and decibels, respectively. 1 B = 10 dB.
4. Meets IT Product Noise Limits for “Generally Attended Data Center”per Statskontoret Technical Standard 26:6.
5. Meets IT Product Noise Limits for “Generally Unattended Data Center” per Statskontoret Technical Standard
26:6.
Relevant international standards

v Measurements: ISO 7779
v Declaration: ISO 9296

Level 01f
132 zEC12 IMPP

Level 01f
Appendix D. 3-phase dual power installation

The zEC12 models are designed with a fully redundant power system. Each computer has two or four
line cords attached to two or four power input ports which, in turn, power a pair of fully redundant
power distribution systems within the computer. To take full advantage of the redundancy/reliability that
is built into the computer system, the server must be powered from two or more distribution panels.
The following shows four examples of redundancy. In these examples, up to four power cords are
identified.
| v P02 - Front BPE and J02 - Front BPE are the labels identifying the ends of one of the power cords. P02
| - Front BPE is the label identifying the end of the power cord that connects to the bottom BPE jack in
| the front of the frame and J02 - Front BPE is the label identifying the end of the same power cord that
| connects to the customer power distribution unit.
| v P02 - Back BPE and J02 - Back BPE are the labels identifying the ends of one of the power cords. P02 -
| Back BPE is the label identifying the end of the power cord that connects to the bottom BPE jack in the
| back of the frame and J02 - Back BPE is the label identifying the end of the same power cord that
| v P01 - Front BPE and J01 - Front BPE are the labels identifying the ends of one of the power cords. P01
| - Front BPE is the label identifying the end of the power cord that connects to the top BPE jack in the
| front of the frame and J01 - Front BPE is the label identifying the end of the same power cord that
| v P01 - Back BPE and J01 - Back BPE are the labels identifying the ends of one of the power cords. P01 -
| Back BPE is the label identifying the end of the power cord that connects to the top BPE jack in the
| back of the frame and J01 - Back BPE is the label identifying the end of the same power cord that

Level 01f
| Example 1 (redundant distribution panel and switch gear)
| In this example, the computer receives power from four separate power distribution panels. The four
| distribution panels receive power from two pieces of building switch gear.
| This type of power distribution will not result in system outage in the event of a power failure at either
| switch gear or one of the distribution panels. IBM recommends this power distribution to achieve highest
| availability.
J01 - Rear BPE

J02 - Rear BPE
Distribution
Panel P01 - Rear BPE
P02 - Rear BPE
Switch Gear
Distribution
Panel
Distribution
Panel J01 - Front BPE
J02 - Front BPE
Switch Gear
P01 - Front BPE
P02 - Front BPE
Distribution
Panel
134 zEC12 IMPP

Level 01f
Example 2 (redundant distribution panel and switch gear)
In this example, the computer receives power from two separate power distribution panels. Each
distribution panel receives power from a separate piece of building switch gear.
| This type of power distribution will not result in system outage in the event of a power failure at either
| switch gear or either distribution panels.
J02 - Rear BPE

P02 - Rear BPE
Distribution
Switch Gear Panel
Switch Gear
P02 - Front BPE

Distribution
Panel
J02 - Front BPE
J01 - Rear BPE

J02 - Rear BPE
P01 - Rear BPE

P02 - Rear BPE
Distribution
Switch Gear Panel
Switch Gear
P01 - Front BPE

P02 - Front BPE
Distribution
Panel
J01 - Front BPE
J02 - Front BPE
Appendix D. 3-phase dual power installation 135

Level 01f
Example 3 (redundant distribution panel)
In this example, the computer receives power from two separate power distribution panels. The two
distribution panels receive power from the same piece of building switch gear. Most facilities should be
able to achieve this level of redundancy. In this case, loss of switch gear (building power) will result in
system outage, but loss of one distribution panel will not.
J02 - Rear BPE

Distribution
Panel P02 - Rear BPE
Switch Gear
Distribution J02 - Front BPE

Panel P02 - Front BPE
J01 - Rear BPE

J02 - Rear BPE
P02 - Rear BPE

Distribution
P01 - Rear BPE
Panel
Switch Gear
Distribution
Panel P01 - Front BPE
P02 - Front BPE
J01 - Front BPE
J02 - Front BPE
136 zEC12 IMPP

Level 01f
Example 4 (single distribution panel)
In this example, the computer receives power from two or four separate circuit breakers in a single
power panel. This does not make use of the redundancy provided by the processor. It is, however,
acceptable if a second power distribution panel is not available.
This type of power distribution will result in system outage in the event of a power failure at either the
switch gear or the distribution panel. This power distribution is least recommended.
J02 - Rear BPE

P02 - Rear BPE
Distribution
Panel
Switch Gear
P02 - Front BPE

J02 - Front BPE
J01 - Rear BPE

J02 - Rear BPE
P02 - Rear BPE

P01 - Rear BPE
Distribution
Panel
Switch Gear
P01 - Front BPE

P02 - Front BPE
J01 - Front BPE

J02 - Front BPE
Appendix D. 3-phase dual power installation 137

Level 01f
138 zEC12 IMPP

Level 01f
Appendix E. Balancing power panel loads

The zEC12 models require three phase power. Depending on the system configuration, the phase currents
can be fully balanced or unbalanced. For each possible cage configuration (processor and I/O
combinations), any given system presents a balanced or unbalanced load. If several unbalanced system
configurations are fed from the same power panel, the load on that panel will be unbalanced. Two phase
currents will be equal and both will be, nominally, 57.8% of the current on the third phase. Figure 34 is an
example of feeding several loads of this type from two power panels in a way that balances the load
among the three phases.
Power Panel 1 Power Panel 2

Phase Phase
A to Pin 1 A to Pin 1
30
30
OFF
OFF
A A
B to Pin 2 To Connector B to Pin 2 To Connector

30
30
OFF
OFF
B B
Machine 1 Machine 1
30
30
C to Pin 3 C to Pin 3
OFF
OFF
C C
B to Pin 1 B to Pin 1
30
30
OFF
OFF
A A
30
30
To Connector To Connector
OFF
OFF
B C to Pin 2 B C to Pin 2
Machine 2 Machine 2
30
30
OFF
OFF
C A to Pin 3 C A to Pin 3
30
30
OFF
OFF
A A
30
30
OFF
OFF
B A to Pin 2 To Connector B A to Pin 2 To Connector

Machine 3 Machine 3
30
30
OFF
OFF
C B to Pin 3 C B to Pin 3
30
30
OFF
OFF
A A
30
30
OFF
OFF
B To Connector B To Connector
Machine4 Machine4
30
30
OFF
OFF
C C
Figure 34. Power load balancing - three-pole breakers
The method in Figure 34 requires that the connection from the three poles of each breaker to the three
phase pins of a connector be varied. Some electricians may prefer to maintain a consistent wiring
sequence from the breakers to the connectors. Figure 35 shows a way to balance the load without
changing the wiring on the output of any breakers. The three-pole breakers are alternated with
single-pole breakers. This way the three-pole breakers don't all begin on Phase A.

Phase Phase
30
30
OFF
OFF
A A

30
30
OFF
OFF
B B
Machine 1 Machine 1
30
C to Pin 3
30
C to Pin 3
OFF
OFF
C C
OFF
30
OFF
30
A A
B to Pin 1
30
B to Pin 1
30
OFF
OFF
B B
30
30
OFF
C C to Pin 2
OFF
To Connector C C to Pin 2 To Connector

Machine 2 Machine 2
30
30
A
OFF
A
OFF
OFF
30
OFF
30
B B
30
30
OFF
OFF
C C
30
30
OFF
OFF
A A to Pin 2 A A to Pin 2
Machine 3 Machine 3
30
30
OFF
OFF
B B to Pin 3 B B to Pin 3
OFF
OFF
30
30
C C
30
30
OFF
OFF
A A
30
To Connector
30
To Connector
OFF
OFF
B B
Machine 4 Machine 4
30
30
OFF
OFF
C C
Figure 35. Power load balancing - alternating three-pole and single-pole breakers

Level 01f
Figure 36 shows another way of distributing the unbalanced load evenly. In this case, the three-pole
breakers are alternated with two-pole breakers.

Phase Phase
30
30
OFF
OFF
A A

30
30
OFF
OFF
B B
Machine 1 Machine 1
30
30
OFF
OFF
C C
OFF
OFF
30
30
A A
B B
OFF
OFF
30
30
30
30
OFF
OFF
C C
30
30
OFF
OFF
A A to Pin 2 To Connector A A to Pin 2 To Connector
Machine 2 Machine 2
30
30
B B
OFF
OFF
OFF
OFF
30
30
C C
OFF
OFF
A A
30
30
30
30
OFF
OFF
B B
30
30
OFF
OFF
C C to Pin 2 C C to Pin 2
Machine 3 Machine 3
30
30
OFF
OFF
A A to Pin 3 A A to Pin 3
OFF
OFF
30
30
B B
C C
OFF
OFF
30
30
30
30
OFF
OFF
A A
30
30
OFF
OFF
B B
Machine 4 Machine 4
30
30
OFF
OFF
C C
Figure 36. Power load balancing - alternating three-pole and double-pole breakers
140 zEC12 IMPP

Level 01f
Appendix F. Frame tie-down

The purpose of this appendix is to describe how to install a frame tie down kit that will provide frame
ruggedizing and the floor tie down hardware for securing an IBM frame. The kit is designed to help
secure the frame and its contents from damage when exposed to vibrations and shocks such as those in a
seismic event.
FC 8000 (for radiator-cooled) and FC 8001 (for water-cooled) is used on a raised floor. FC 8002 is used on
a nonraised floor.
Note: A single FC provides hardware for the two frames.

Level 01f
Raised floor frame tie-down

Frame tie-down for the zEC12 on a raised floor is a system of adjustable turnbuckles intended to fasten
each corner of the server frames to eyebolts installed in the concrete floor beneath your computer room
| raised floor. FC 8000 and FC 8001 supply parts to cover raised floor heights from 152.4 mm (6 inches) to
| 914.4 mm (36 inches).
| Note: For a water-cooled model on a raised floor, the height of the raised floor (subfloor to top surface of
| floor tile) must be a minimum of 228.6 mm (9 inches) to accommodate the bend radius of the water
| hoses.
You are responsible for obtaining the services of a qualified consultant or structural engineer to determine
| what must be done at your particular location to install four eyebolts per frame. These eyebolts should
| be capable of withstanding the appropriate seismic forces for a frame weighing up to 1362 kg (3000 lbs)
| with the center of gravity 1270 mm (50 inches) from the ground and at the center of the frame.
Installing the eyebolts

You are responsible for obtaining and installing the eyebolts that will anchor the frames of your zEC12.
Following are the specifications for the eyebolts:
v 12.7 mm (0.5 in) diameter, 13 threads per inch (length to be determined by the qualified contractor who
will perform the eyebolt installation)
v Inside diameter of the eye not smaller than 30 mm (1 3/16 in)
v Installed so that the center of the eye is not less than 25.4 mm (1 in) nor more than 63.5 mm (2.5 in)
from the surface of the concrete floor.
Length of the eyebolts

to be determined by the
installation contractor
30 mm (1 3/16 in) diameter
Center of the eye

Not < 25.4 mm (1 in)
Not > 63.5 mm (2.5 in) 12.7 mm (0.5 in) diameter
above the concrete surface
Concrete floor
142 zEC12 IMPP

Level 01f
Regardless of which kit you need, the following figures show where to cut the floor panels for the
turnbuckles to pass through to the eyebolts set in the concrete floor beneath.
Figure 37. Frame tie-down hole cutouts 610 mm (24 in) floor tiles
Appendix F. Frame tie-down 143

Level 01f
Figure 38. Frame tie-down hole cutouts 600 mm (23.5 in) floor tiles
Additional floor panel pedestals may be necessary to restore structural integrity to the raised floor after
making the circular cuts for the turnbuckles. Consult your flooring manufacturer for recommendations.
The remainder of the parts involved in any of the tie-down features include:
v New cable bars, fastened where the original cable trays were mounted
v A triangular support bar, hung on two hinges and secured with a vertical stop
v A latch for the triangular support bar
v A pair of stabilizer bars that rest on the raised floor between the corners of each frame
v Four turnbuckle assemblies with fastening hardware that extend through the raised floor and are
secured to the eyebolts
v Heavier cover door latches.
These additional tie-down parts are installed along with the server. The installation instructions are
included as an appendix in the zEnterprise EC12 Installation Manual, which is shipped with the server.
144 zEC12 IMPP

Level 01f
Nonraised floor frame tie-down

The purpose of this installation instruction is to install a frame tie down kit that will provide hardware
for securing an IBM frame to a concrete nonraised floor. This kit (FC 8002) is designed to help secure the
frame and its contents from damage when exposed to vibrations and shocks such as those in a seismic
event.
You are responsible for obtaining the services of a qualified consultant or structural engineer to determine
| what must be done at your particular location to install five anchors per lock down plate and for
| securing the front and rear lock down plate to the concrete floor according to the following illustration.
| Contact your marketing representative well ahead of server delivery to obtain the lock down plate so that
the site will be ready when the server arrives.
Use the following illustration to plan carefully where the anchors that secure the stabilizers must be
installed.
5 bolts required for secure lockdown
1 2
3 4
5
1171.6 mm
46.1 in)
Casters Lockdown plate

1019 mm threaded mounting holes
40.1 in)
76.3 mm
(3.0 in)
47.6 mm 65.5 mm
(1.9 in) (2.6 in)
654.8 mm
(25.8 in)
750 mm
(29.5 in)
178.5 mm
7.0 in)
375 mm
14.7 in)
| The lock down plate to concrete fasteners should be a heavy duty expansion anchor. The contractor you
engage to install the stabilizers will determine the length of the anchors.
Appendix F. Frame tie-down 145

Level 01f
When the server arrives, remove the fasteners from either the front or rear stabilizer. Remove the
stabilizer to position the server frame. Then reinstall the stabilizer and the fasteners before the service
provider begins the installation.
146 zEC12 IMPP

Level 01f
Appendix G. Notices
This information was developed for products and services offered in the USA.
IBM may not offer the products, services, or features discussed in this document in other countries.
Consult your local IBM representative for information on the products and services currently available in
your area. Any reference to an IBM product, program, or service is not intended to state or imply that
only that IBM product, program, or service may be used. Any functionally equivalent product, program,
or service that does not infringe any IBM intellectual property right may be used instead. However, it is
the user's responsibility to evaluate and verify the operation of any non-IBM product, program, or
service.
IBM may have patents or pending patent applications covering subject matter described in this
document. The furnishing of this document does not grant you any license to these patents. You can send
license inquiries, in writing, to:
IBM Director of Licensing

IBM Corporation
North Castle Drive
Armonk, NY 10504-1785 USA
INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION “ AS IS”

WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT
LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR
FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied
warranties in certain transactions, therefore, this statement may not apply to you.
This information could include technical inaccuracies or typographical errors. Changes are periodically
made to the information herein; these changes will be incorporated in new editions of the publication.
IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this
publication at any time without notice.
Any references in this information to non-IBM websites are provided for convenience only and do not in
any manner serve as an endorsement of those websites. The materials at those websites are not part of
the materials for this IBM product and use of those websites is at your own risk.
IBM may use or distribute any of the information you supply in any way it believes appropriate without
incurring any obligation to you.
Any performance data contained herein was determined in a controlled environment. Therefore, the
results obtained in other operating environments may vary significantly. Some measurements may have
been made on development-level systems and there is no guarantee that these measurements will be the
same on generally available systems. Furthermore, some measurements may have been estimated through
extrapolation. Actual results may vary. Users of this document should verify the applicable data for their
specific environment.
Information concerning non-IBM products was obtained from the suppliers of those products, their
published announcements or other publicly available sources. IBM has not tested those products and
cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM
products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of
those products.

Level 01f
All statements regarding IBM's future direction or intent are subject to change or withdrawal without
notice, and represent goals and objectives only.
All IBM prices shown are IBM's suggested retail prices, are current and are subject to change without
notice. Dealer prices may vary.
This information is for planning purposes only. The information herein is subject to change before the
products described become available.
This information contains examples of data and reports used in daily business operations. To illustrate
them as completely as possible, the examples include the names of individuals, companies, brands, and
products. All of these names are fictitious and any similarity to the names and addresses used by an
actual business enterprise is entirely coincidental.
If you are viewing this information softcopy, the photographs and color illustrations may not appear.
Trademarks
IBM, the IBM logo, and ibm.com® are trademarks of International Business Machines Corp., registered in
many jurisdictions worldwide. Other product and service names might be trademarks of IBM or other
companies. A current list of IBM trademarks is available on the web at “Copyright and trademark
information” at http://www.ibm.com/legal/copytrade.shtml.
Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks
of Adobe Systems Incorporated in the United States, and/or other countries.
Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both.
Other product and service names might be trademarks of IBM or other companies.
Class A Notices
The following Class A statements apply to this IBM product. The statement for other IBM products
intended for use with this product will appear in their accompanying manuals.
Federal Communications Commission (FCC) Statement
Note: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instruction manual, may cause harmful interference to radio communications. Operation of this
equipment in a residential area is likely to cause harmful interference, in which case the user will be
required to correct the interference at his own expense.
Properly shielded and grounded cables and connectors must be used in order to meet FCC emission
limits. IBM is not responsible for any radio or television interference caused by using other than
recommended cables and connectors or by unauthorized changes or modifications to this equipment.
Unauthorized changes or modifications could void the user's authority to operate the equipment.
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
148 zEC12 IMPP

Level 01f
Industry Canada Compliance Statement
This Class A digital apparatus complies with Canadian ICES-003.
Avis de conformité à la réglementation d'Industrie Canada
Cet appareil numérique de la classe A est conforme à la norme NMB-003 du Canada.
European Community Compliance Statement
This product is in conformity with the protection requirements of EU Council Directive 2004/108/EC on
the approximation of the laws of the Member States relating to electromagnetic compatibility. IBM cannot
accept responsibility for any failure to satisfy the protection requirements resulting from a
non-recommended modification of the product, including the fitting of non-IBM option cards.
This product has been tested and found to comply with the limits for Class A Information Technology
Equipment according to European Standard EN 55022. The limits for Class A equipment were derived for
commercial and industrial environments to provide reasonable protection against interference with
licensed communication equipment.
European Community contact:

IBM Deutschland GmbH
Technical Regulations, Department M372
IBM-Allee 1, 71139 Ehningen, Germany
Tele: +49 (0) 800 225 5423 or +49 (0) 180 331 3233
email: [email protected]
Warning: This is a Class A product. In a domestic environment, this product may cause radio
interference, in which case the user may be required to take adequate measures.
VCCI Statement - Japan
The following is a summary of the VCCI Japanese statement in the box above:
This is a Class A product based on the standard of the VCCI Council. If this equipment is used in a
domestic environment, radio interference may occur, in which case the user may be required to take
corrective actions.
Japanese Electronics and Information Technology Industries Association (JEITA)

Confirmed Harmonics Guideline (products less than or equal to 20 A per phase)
Appendix G. Notices 149

Level 01f
Japanese Electronics and Information Technology Industries Association (JEITA)

Confirmed Harmonics Guideline with Modifications (products greater than 20 A per
phase)
Electromagnetic Interference (EMI) Statement - People's Republic of China
Declaration: This is a Class A product. In a domestic environment, this product may cause radio
interference, in which case the user may need to perform practical action.
Electromagnetic Interference (EMI) Statement - Taiwan
The following is a summary of the EMI Taiwan statement above.
Warning: This is a Class A product. In a domestic environment, this product may cause radio
interference, in which case the user will be required to take adequate measures.
IBM Taiwan Contact Information:
Electromagnetic Interference (EMI) Statement - Korea
( A)

, !"#
$%&' * + -.
150 zEC12 IMPP

Level 01f
Germany Compliance Statement
Deutschsprachiger EU Hinweis: Hinweis für Geräte der Klasse A EU-Richtlinie zur

Elektromagnetischen Verträglichkeit
Dieses Produkt entspricht den Schutzanforderungen der EU-Richtlinie 2004/108/EG zur Angleichung der
Rechtsvorschriften über die elektromagnetische Verträglichkeit in den EU-Mitgliedsstaaten und hält die
Grenzwerte der EN 55022 Klasse A ein.
Um dieses sicherzustellen, sind die Geräte wie in den Handbüchern beschrieben zu installieren und zu
betreiben. Des Weiteren dürfen auch nur von der IBM empfohlene Kabel angeschlossen werden. IBM
übernimmt keine Verantwortung für die Einhaltung der Schutzanforderungen, wenn das Produkt ohne
Zustimmung von IBM verändert bzw. wenn Erweiterungskomponenten von Fremdherstellern ohne
Empfehlung von IBM gesteckt/eingebaut werden.
EN 55022 Klasse A Geräte müssen mit folgendem Warnhinweis versehen werden:
"Warnung: Dieses ist eine Einrichtung der Klasse A. Diese Einrichtung kann im Wohnbereich
Funk-Störungen verursachen; in diesem Fall kann vom Betreiber verlangt werden, angemessene
Maßnahmen zu ergreifen und dafür aufzukommen."
Deutschland: Einhaltung des Gesetzes über die elektromagnetische Verträglichkeit von Geräten
Dieses Produkt entspricht dem “Gesetz über die elektromagnetische Verträglichkeit von Geräten
(EMVG)“. Dies ist die Umsetzung der EU-Richtlinie 2004/108/EG in der Bundesrepublik Deutschland.
Zulassungsbescheinigung laut dem Deutschen Gesetz über die elektromagnetische Verträglichkeit von
Geräten (EMVG) (bzw. der EMC EG Richtlinie 2004/108/EG) für Geräte der Klasse A
Dieses Gerät ist berechtigt, in Übereinstimmung mit dem Deutschen EMVG das EG-Konformitätszeichen
- CE - zu führen.
Verantwortlich für die Einhaltung der EMV Vorschriften ist der Hersteller:
International Business Machines Corp.
New Orchard Road
Armonk, New York 10504
Tel: 914-499-1900
Der verantwortliche Ansprechpartner des Herstellers in der EU ist:

IBM Deutschland GmbH
Technical Regulations, Abteilung M372
IBM-Allee 1, 71139 Ehningen, Germany
Tel: +49 (0) 800 225 5423 or +49 (0) 180 331 3233
email: [email protected]
Generelle Informationen:
Das Gerät erfüllt die Schutzanforderungen nach EN 55024 und EN 55022 Klasse A.
Electromagnetic Interference (EMI) Statement - Russia
Appendix G. Notices 151

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About this publication . . . . . . . . vii Chapter 5. Power requirements . . . . 65

© Copyright IBM Corp. 2012, 2014 iii

FICON references . . . . . . . . . . . 101 Relevant international standards . . . . . . . 131

Chapter 9. Parallel sysplex planning 121

Appendix A. IBM standard symbols 125

Appendix B. Hardware Management

Appendix C. Acoustics . . . . . . . 131

World trade safety information

Laser safety information

© Copyright IBM Corp. 2012, 2014 v

About this publication

© Copyright IBM Corp. 2012, 2014 vii

Licensed Machine Code

IBM and accessibility

viii zEC12 IMPP

How to send your comments

About this publication ix

© Copyright IBM Corp. 2012, 2014 xi

Table 1. Summary of changes (continued)

xii zEC12 IMPP

Planning for a new computer room

© Copyright IBM Corp. 2012, 2014 1

Site Preparation Checklist

Task/Consideration Task Assigned Target Date Completed

Designate a person in your organization with the responsibility

Site Preparation Checklist

Task/Consideration Task Assigned Target Date Completed

The computer room is prepared for computer equipment service clearance

Computer room power should be completed.

Site Preparation Checklist

Task/Consideration Task Assigned Target Date Completed

Air conditioning installation is complete

Complete communication equipment installation,

Site Preparation Checklist

Task/Consideration Task Assigned Target Date Completed

ARRIVAL OF NEW EQUIPMENT

Move unit(s) to installation location.

Call your service provider to install the unit(s).

Customized planning aid

ASHRAE declarations - radiator-cooled

ASHRAE Declarations (Metric) for 2827 (Radiator-cooled)

ASHRAE Declarations (English) for 2827 (Radiator-cooled)

Airflow Diagram Cooling Scheme

Figure 1. ASHRAE declarations - radiator-cooled

ASHRAE declarations - water-cooled

ASHRAE Declarations (Metric) for 2827 (Water-cooled)

ASHRAE Declarations (English) for 2827 (Water-cooled)

Airflow Diagram Cooling Scheme

Figure 2. ASHRAE declarations - water-cooled

Chapter 2. Environmental specifications

© Copyright IBM Corp. 2012, 2014 11

Table 2. Environmental specifications - table format

The following illustrations reiterate the environmental specifications in graphic form.

Moisture Content, g/kg dry air

Dry Bulb Temperature, degree C

Figure 3. Environmental specifications - graph format

Chapter 2. Environmental specifications 13

Meets the ASHRAE recommended guidelines

Figure 4. Environmental specifications - bar graph format