Features Description: LT3045 20V, 500ma, Ultralow Noise, Ultrahigh PSRR Linear Regulator
Features Description: LT3045 20V, 500ma, Ultralow Noise, Ultrahigh PSRR Linear Regulator
Features Description: LT3045 20V, 500ma, Ultralow Noise, Ultrahigh PSRR Linear Regulator
+ VOUT 80
PSRR (dB)
200k OUT 3V 70
PG IOUT(MAX)
OUTS 500mA 60
SET GND ILIM PGFB 10µF 50 VIN = 5V
402k RSET = 30.1k
40 CSET = 4.7µF
30 COUT = 10µF
249Ω IL = 500mA
4.7µF 30.1k 49.9k
*OPTIONAL, SEE 20
APPLICATIONS 10 100 1k 10k 100k 1M 10M
3045 TA01a
INFORMATION FREQUENCY (Hz)
3045 TA01b
Rev. C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
IN 1 10 OUT IN 1 12 OUT
IN 2 9 OUTS IN 2 11 OUT
11 IN 3 13 10 OUTS
EN/UV 3 GND 8 GND GND
EN/UV 4 9 GND
PG 4 7 SET PG 5 8 SET
ILIM 5 6 PGFB ILIM 6 7 PGFB
MSE PACKAGE
DD PACKAGE
12-LEAD PLASTIC MSOP
10-LEAD (3mm × 3mm) PLASTIC DFN
TJMAX = 150°C, θJA = 33°C/W, θJC = 8°C/W
TJMAX = 150°C, θJA = 34°C/W, θJC = 5.5°C/W
EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT3045EDD#PBF LT3045EDD#TRPBF LGYP 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT3045IDD#PBF LT3045IDD#TRPBF LGYP 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT3045HDD#PBF LT3045HDD#TRPBF LGYP 10-Lead (3mm × 3mm) Plastic DFN –40°C to 150°C
LT3045MPDD#PBF LT3045MPDD#TRPBF LYGP 10-Lead (3mm × 3mm) Plastic DFN –55°C to 150°C
LT3045EMSE#PBF LT3045EMSE#TRPBF 3045 12-Lead Plastic MSOP –40°C to 125°C
LT3045IMSE#PBF LT3045IMSE#TRPBF 3045 12-Lead Plastic MSOP –40°C to 125°C
LT3045HMSE#PBF LT3045HMSE#TRPBF 3045 12-Lead Plastic MSOP –40°C to 150°C
AUTOMOTIVE PRODUCTS**
LT3045EMSE#WPBF LT3045EMSE#WTRPBF 3045 12-Lead Plastic MSOP –40°C to 125°C
LT3045IMSE#WPBF LT3045IMSE#WTRPBF 3045 12-Lead Plastic MSOP –40°C to 125°C
LT3045HMSE#WPBF LT3045HMSE#WTRPBF 3045 12-Lead Plastic MSOP –40°C to 150°C
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
**Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These
models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your
local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for
these models.
Rev. C
Rev. C
Note 1: Stresses beyond those listed under Absolute Maximum Ratings guarantee maximum dropout voltage specifications at high currents
may cause permanent damage to the device. Exposure to any Absolute due to production test limitations with Kelvin-sensing the package
Maximum Rating condition for extended periods may affect device pins. Please consult the Typical Performance Characteristics for curves
reliability and lifetime. of dropout voltage as a function of output load current and temperature
Note 2: The EN/UV pin threshold must be met to ensure device operation. measured in a typical application circuit.
Note 3: Maximum junction temperature limits operating conditions. The Note 6: GND pin current is tested with VIN = VOUT(NOMINAL) and a current
regulated output voltage specification does not apply for all possible source load. Therefore, the device is tested while operating in dropout. This
combinations of input voltage and output current, especially due to the is the worst-case GND pin current. GND pin current decreases at higher
internal current limit foldback which starts to decrease current limit at input voltages. Note that GND pin current does not include SET pin or ILIM
VIN – VOUT > 12V. If operating at maximum output current, limit the input pin current but Quiescent current does include them.
voltage range. If operating at the maximum input voltage, limit the output Note 7: SET and OUTS pins are clamped using diodes and two 25Ω series
current range. resistors. For less than 5ms transients, this clamp circuitry can carry
Note 4: OUTS ties directly to OUT. more than the rated current. Refer to Applications Information for more
Note 5: Dropout voltage is the minimum input-to-output differential information.
voltage needed to maintain regulation at a specified output current. The Note 8: Adding a capacitor across the SET pin resistor decreases output
dropout voltage is measured when output is 1% out of regulation. This voltage noise. Adding this capacitor bypasses the SET pin resistor’s
definition results in a higher dropout voltage compared to hard dropout thermal noise as well as the reference current’s noise. The output noise
— which is measured when VIN = VOUT(NOMINAL). For lower output then equals the error amplifier noise. Use of a SET pin bypass capacitor
voltages, below 1.5V, dropout voltage is limited by the minimum input also increases start-up time.
voltage specification. For DFN package: Linear Technology is unable to
Rev. C
SET Pin Current SET Pin Current Offset Voltage (VOUT – VSET)
101.0 2.0
VIN = 2V N = 3250 VIN = 2V
100.8 IL = 1mA IL = 1mA
1.5
VOUT = 1.3V VOUT = 1.3V
100.6
1.0
SET PIN CURRENT (µA)
100.0 0
99.8
–0.5
99.6
–1.0
99.4
99.2 –1.5
99.0 –2.0
–75 –50 –25 0 25 50 75 100 125 150 98 99 100 101 102 –75 –50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C) ISET DISTRIBUTION (µA) TEMPERATURE (°C)
3045 G01 3045 G02 3045 G03
100.4
0.5
100.2
100.0 0
99.8 –0.5
99.6
–1.0
99.4
–1.5
99.2
99.0 –2.0
–2 –1 0 1 2 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
VOS DISTRIBUTION (mV) INPUT VOLTAGE (V) INPUT VOLTAGE (V)
3045 G04 3045 G05 3045 G06
Rev. C
∆ VOS (mV)
∆ISET (nA)
100.0 0 10 0.10
VOS
99.8 –0.5 8 0.08
99.6 6 0.06
–1.0
99.4 4 ISET 0.04
99.2 –1.5
2 0.02
99.0 –2.0 0 0
0 1.5 3 4.5 6 7.5 9 10.5 12 13.5 15 0 1.5 3 4.5 6 7.5 9 10.5 12 13.5 15 –75 –50 –25 0 25 50 75 100 125 150
OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) TEMPERATURE (°C)
3045 G07 3045 G08 3045 G09
3.0
35
2.0
2.5 30
2.0 25 VIN = 20V 1.5
20
1.5
VIN = 2V 1.0
15
1.0
10
0.5
0.5 5
0 0 0
–75 –50 –25 0 25 50 75 100 125 150 –75 –50 –25 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 20
TEMPERATURE (°C) TEMPERATURE (°C) INPUT VOLTAGE (V)
3045 G10 3045 G11 3045 G12
3.0 IL = 400mA
DROPOUT VOLTAGE (mV)
350 350
2.5
300 300 IL = 500mA
2.0 250 250
IL = 1mA
1.5 200 200
150 150
1.0 150°C 150°C
125°C 100 125°C 100
0.5 25°C 25°C
50 50
–55°C –55°C
0 0 0
0 2 4 6 8 10 12 14 16 0 50 100 150 200 250 300 350 400 450 500 –75 –50 –25 0 25 50 75 100 125 150
OUTPUT VOLTAGE (V) OUTPUT CURRENT (mA) TEMPERATURE (°C)
3045 G13 3045 G14 3045 G15
Rev. C
1.50
1.28 155
1.25 140 VIN = 10V
1.26
1.00 125
1.24 110
VIN = 2V
0.75 VIN = 2V
1.22 95
0.50 VIN = 10V
80
0.25 RISING UVLO 1.20
65
FALLING UVLO
0 1.18 50
–75 –50 –25 0 25 50 75 100 125 150 –75 –50 –25 0 25 50 75 100 125 150 –75 –50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
3045 G19 3045 G20 3045 G21
EN/UV Pin Current EN/UV Pin Current Negative Enable Pin Current
5.5 10 0
VIN = 20V VIN = 2V
5.0 9 VIN = 2V –10
4.5 8 –20
EN/UV PIN CURRENT (µA)
4.0 7 –30
3.5
6 –40
3.0
5 VIN = 20V –50
2.5
4 –60
2.0
3 –70
1.5 150°C
150°C
1.0 2 –80 125°C
125°C
25°C 1 –90 25°C
0.5 –55°C
–55°C
0 0 –100
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20 –20 –18 –16 –14 –12 –10 –8 –6 –4 –2 0
ENABLE PIN VOLTAGE (V) ENABLE PIN VOLTAGE (V) ENABLE PIN VOLTAGE (V)
3045 G22 3045 G23 3045 G24
Rev. C
800 306
6
PGFB HYSTERESIS (mV)
ILIM PIN CURRENT (uA)
700 304
5
600 302
500 300 4
400 298 3
300 296
2
200 2.5VIN 294
5VIN 1
100 292
10VIN
0 290 0
0 50 100 150 200 250 300 350 400 450 500 –75 –50 –25 0 25 50 75 100 125 150 –75 –50 –25 0 25 50 75 100 125 150
OUTPUT CURRENT (mA) TEMPERATURE (°C) TEMPERATURE (°C)
3045 G31 3045 G32 3045 G33
Rev. C
35 70
2.0
30 60
ISET (mA)
VPG (mV)
IPG (nA)
25 50 1.5
20 40
1.0
15 30
10 20
0.5
5 10
0 0 0
–75 –50 –25 0 25 50 75 100 125 150 –75 –50 –25 0 25 50 75 100 125 150 –75 –50 –25 0 25 50 75 100 125 150
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
3045 G34 3045 G35 3045 G36
ISET During Start-Up with Fast Output Overshoot Recovery Output Overshoot Recovery
Start-Up Enabled Current Sink Current Sink
3.5 12 7
VPGFB = 290mV VIN = 5V 150°C VIN = 5V
VSET = 1.3V RSET = 33.2k 125°C RSET = 33.2k
3.0 10 6
25°C VOUT – VSET > 5mV
–55°C
2.5 5
8
2.0 4
ISET (mA)
6
1.5 3
4
1.0 2
0.5 2 1
0 0 0
0 2 4 6 8 10 12 14 16 18 20 0 5 10 15 20 –75 –50 –25 0 25 50 75 100 125 150
VIN-TO-VSET DIFFERENTIAL (V) VOUT – VSET (mV) TEMPERATURE (°C)
3045 G37 3045 G38 3045 G39
VOUT Forced Above VOUT(NOMINAL) Power Supply Ripple Rejection Power Supply Ripple Rejection
8 120 120
VIN = 5V IIN when VEN = 0V COUT = 10µF
CSET = 4.7µF
RSET = 33.2k IOUT when VEN = 0V 110 110 COUT = 22µF
CSET = 0.47µF
IIN when VEN = VIN
100 100
6 IOUT when VEN = VIN
90 90
CURRENT (mA)
80 80
PSRR (dB)
PSRR (dB)
4 70 70
60 60
50 50
2 VIN = 5V VIN = 5V
40 RSET = 30.1k 40
RSET = 30.1k
30 COUT = 10µF 30 CSET = 0.47µF
IL = 500mA IL = 500mA
0 20 20
4 5 6 7 8 9 10 11 12 13 14 15 10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M
OUTPUT VOLTAGE (V) FREQUENCY (Hz) FREQUENCY (Hz)
3045 G40 3045 G41 3045 G42
Rev. C
PSRR (dB)
PSRR (dB)
80 70 50
60 40
60
IL = 500mA 50 30
IL = 300mA VIN = 5V 100kHz IL = 500mA
40 VOUT ≥ 1.3V 20 RSET = 30.1k
40 IL = 100mA RSET = 30.1k 500kHz
IL = 50mA COUT = 10µF 30 0.6V < VOUT < 1.3V 10 1MHz COUT = 10µF
IL = 1mA CSET = 0.47µF VOUT ≤ 0.6V 2MHz CSET = 0.47µF
20 20 0
10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M 0 1 2 3 4 5
FREQUENCY (Hz) FREQUENCY (Hz) INPUT–TO–OUTPUT DIFFERENTIAL (V)
3045 G43 3045 G44 3045 G45
Integrated RMS Output Noise Integrated RMS Output Noise Integrated RMS Output Noise
(10Hz to 100kHz) (10Hz to 100kHz) (10Hz to 100kHz)
2.0 9 2.0
VIN = 5V VIN = 5V VIN = VOUT + 2V
1.8 8 1.8
RSET = 33.2k COUT = 10µF COUT = 10µF
1.6 COUT = 10µF RSET = 33.2k 1.6 CSET = 4.7µF
CSET = 4.7µF 7
ILOAD = 500mA ILOAD = 500mA
1.4 1.4
6
1.2 1.2
5
1.0 1.0
4
0.8 0.8
3
0.6 0.6
0.4 2 0.4
0.2 1 0.2
0 0 0
0 50 100 150 200 250 300 350 400 450 500 0.01 0.1 1 10 100 0 1.5 3 4.5 6 7.5 9 10.5 12 13.5 15
LOAD CURRENT (mA) SET PIN CAPACITANCE (µF) OUTPUT VOLTAGE (V)
3045 G46 3045 G47 3045 G48
10 10 COUT = 10µF 10
1 V = 5V 1 V = 5V 1 V = 5V
IN IN IN
RSET = 33.2k RSET = 33.2k COUT = 22µF RSET = 33.2k
COUT = 10µF CSET = 4.7µF CSET = 4.7µF
ILOAD = 500mA ILOAD = 500mA COUT = 10µF
0.1 0.1 0.1
10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M 10 100 1k 10k 100k 1M 10M
FREQUENCY (Hz) FREQUENCY (Hz) FREQUENCY (Hz)
3045 G49 3045 G50 3045 G51
Rev. C
CURRENT
5µV/DIV 500mA/DIV
10 VIN = 5V
RSET = 33.2k OUTPUT
COUT = 10µF VOLTAGE
CSET = 4.7µF 20mV/DIV
1 V =V IL = 500mA
IN OUT + 2V 3042 G53 3042 G54
IL = 500mA 1ms/DIV 20µs/DIV
COUT = 10µF VIN = 5V
CSET = 4.7µF RSET = 33.2k
0.1 COUT = 10µF
10 100 1k 10k 100k 1M 10M
CSET = 0.47µF
FREQUENCY (Hz) LOAD STEP = 10mA TO 500mA
3045 G52
Rev. C
IN (Pins 1, 2/Pins 1, 2, 3): Input. These pins supply power therefore, it also serves as a current monitoring pin with
to the regulator. The LT3045 requires a bypass capacitor a 0V to 300mV range. If the programmable current limit
at the IN pin. In general, a battery’s output impedance functionality is not needed, tie ILIM to GND. A parasitic
rises with frequency, so include a bypass capacitor in substrate diode exists between ILIM and GND pins of the
battery-powered applications. While a 4.7µF input bypass LT3045; do not drive ILIM more than 0.3V below GND
capacitor generally suffices, applications with large load during normal operation or during a fault condition.
transients may require higher input capacitance to prevent
PGFB (Pin 6/Pin 7): Power Good Feedback. The PG pin
input supply droop. Consult the Applications Information
pulls high if PGFB increases beyond 300mV on its rising
section on the proper use of an input capacitor and its effect
edge, with 7mV hysteresis on its falling edge. Connect-
on circuit performance, in particular PSRR. The LT3045
ing an external resistor divider between OUT, PGFB and
withstands reverse voltages on IN with respect to GND,
GND sets the programmable power good threshold with
OUTS and OUT. In the case of a reversed input, which oc-
curs if a battery is plugged-in backwards, the LT3045 acts the following transfer function: 0.3V • (1 + RPG2/RPG1).
as if a diode is in series with its input. Hence, no reverse As discussed in the Applications Information section,
current flows into the LT3045 and no negative voltage PGFB also activates the fast start-up circuitry. Tie PGFB
appears at the load. The device protects itself and the load. to IN if power good and fast start-up functionalities are
not needed, and if reverse input protection is additionally
EN/UV (Pin 3/Pin 4): Enable/UVLO. Pulling the LT3045’s required, tie the anode of a 1N4148 diode to IN and its
EN/UV pin low places the part in shutdown. Quiescent cathode to PGFB. See the Typical Applications section for
current in shutdown drops to less than 1µA and the out- details. A parasitic substrate diode exists between PGFB
put voltage turns off. Alternatively, the EN/UV pin can set and GND pins of the LT3045; do not drive PGFB more
an input supply undervoltage lockout (UVLO) threshold than 0.3V below GND during normal operation or during
using a resistor divider between IN, EN/UV and GND. The
a fault condition.
LT3045 typically turns on when the EN/UV voltage exceeds
1.24V on its rising edge, with a 130mV hysteresis on its SET (Pin 7/Pin 8): SET. This pin is the inverting input of
falling edge. The EN/UV pin can be driven above the input the error amplifier and the regulation set-point for the
voltage and maintain proper functionality. If unused, tie LT3045. SET sources a precision 100µA current that
EN/UV to IN. Do not float the EN/UV pin. flows through an external resistor connected between SET
and GND. The LT3045’s output voltage is determined by
PG (Pin 4/Pin 5): Power Good. PG is an open-collector
VSET = ISET • RSET. Output voltage range is from zero to
flag that indicates output voltage regulation. PG pulls low
15V. Adding a capacitor from SET to GND improves noise,
if PGFB is below 300mV. If the power good functional-
PSRR and transient response at the expense of increased
ity is not needed, float the PG pin. A parasitic substrate
start-up time. For optimum load regulation, Kelvin connect
diode exists between PG and GND pins of the LT3045; do
the ground side of the SET pin resistor directly to the load.
not drive PG more than 0.3V below GND during normal
A parasitic substrate diode exists between SET and GND
operation or during a fault condition.
pins of the LT3045; do not drive SET more than 0.3V below
ILIM (Pin 5/Pin 6): Current Limit Programming Pin. GND during normal operation or during a fault condition.
Connecting a resistor between ILIM and GND programs
GND (Pin 8, Exposed Pad Pin 11/Pin 9, Exposed Pad
the current limit. For best accuracy, Kelvin connect this
Pin 13): Ground. The exposed backside is an electrical
resistor directly to the LT3045’s GND pin. The program-
connection to GND. To ensure proper electrical and ther-
ming scale factor is nominally 150mA•kΩ. The ILIM pin
mal performance, solder the exposed backside to the PCB
sources current proportional (1:500) to output current;
ground and tie it directly to the GND pin.
Rev. C
Rev. C
VIN
EN/UV CIN
IN
CURRENT
100µA ERROR
2mA REFERENCE
– AMPLIFIER
QC QP
+ DRIVER QPWR
ENABLE
COMPARATOR
OUTPUT OVERSHOOT
+ RECOVERY
BIAS +
– THERMAL
+ FAST START-UP
SHDN –
V 1.24V OUT
VOUT
+
– INPUT
V 1.5V RL
UVLO
PROGRAMMABLE – COUT
POWER GOOD INTERNAL CURRENT
LIMIT
+
+ +
V 300mV – – 215Ω
– +
INPUT UVLO V 300mV
FAST START-UP CURRENT LIMIT –
DISABLE LOGIC THERMAL SHDN
DROPOUT PROGRAMMABLE
CURRENT LIMIT
SET-TO-OUTS
+
PROTECTION –
CLAMP
+
V 300mV
–
GND
PGFB PG SET OUTS ILIM
RPG RILIM
RPG2
RSET CSET
RPG1
3045 BD
Rev. C
PG
OUTS
1 10
SET GND ILIM COUT
2 9 OUT
3 11 8
4 7 SET
5 6 RSET CSET
3045 F02
3045 F03
Figure 2. DFN Guard Ring Layout Figure 3. COUT and CSET Connections for Best Performance
Since the SET pin is a high impedance node, unwanted the GND side of CSET directly to the GND side of COUT,
signals may couple into the SET pin and cause erratic as well as keep the GND sides of CIN and COUT reason-
behavior. This is most noticeable when operating with a ably close. Refer to the LT3045 demo board manual for
minimum output capacitor at heavy load currents. By- more information on the recommended layout that meets
passing the SET pin with a small capacitance to ground these requirements. While the LT3045 is robust enough
resolves this issue — 10nF is sufficient. not to oscillate if the recommended layout is not followed,
For applications requiring higher accuracy or an adjust- depending on the actual layout, phase/gain margin, noise
able output voltage, the SET pin may be actively driven and PSRR performance may degrade.
by an external voltage source capable of sinking 100µA.
Stability and Output Capacitance
Connecting a precision voltage reference to the SET pin
eliminates any errors present in the output voltage due The LT3045 requires an output capacitor for stability.
to the reference current and SET pin resistor tolerances. Given its high bandwidth, LTC recommends low ESR and
ESL ceramic capacitors. A minimum 10µF output capaci-
Output Sensing and Stability tance with an ESR below 20mΩ and an ESL below 2nH is
required for stability.
The LT3045’s OUTS pin provides a Kelvin sense connection
to the output. The SET pin resistor’s GND side provides a Given the high PSRR and low noise performance attained
Kelvin sense connection to the load’s GND side. using a single 10µF ceramic output capacitor, larger values
of output capacitor only marginally improves the perfor-
Additionally, for ultrahigh PSRR, the LT3045 bandwidth
mance because the regulator bandwidth decreases with
is made quite high (~1MHz), making it very close to a
increasing output capacitance — hence, there is little to
typical 10µF (1206 case size) ceramic output capacitor’s
be gained by using larger than the minimum 10µF output
self-resonance frequency (~1.6MHz). Therefore, it is very
capacitor. Nonetheless, larger values of output capacitance
important to avoid adding extra impedance (ESR and
do decrease peak output deviations during a load transient.
ESL) outside the feedback loop. To that end, as shown in
Figure 3, minimize the effects of PCB trace and solder Note that bypass capacitors used to decouple individual
inductance by tying the OUTS pin directly to COUT and components powered by the LT3045 increase the effective
output capacitance.
Rev. C
X5R and X7R dielectrics result in more stable character- Figure 4. Ceramic Capacitor DC Bias Characteristics
istics and are thus more suitable for LT3045. The X7R
dielectric has better stability across temperature, while 40
BOTH CAPACITORS ARE 16V,
the X5R is less expensive and is available in higher values. 20
1210 CASE SIZE, 10µF
Nonetheless, care must still be exercised when using CHANGE IN VALUE (%) 0 X5R
X5R and X7R capacitors. The X5R and X7R codes only
specify operating temperature range and the maximum –20
recommended. Due to its good voltage coefficient in small Figure 5. Ceramic Capacitor Temperature Characteristics
case sizes, LTC recommends using Murata’s GJ8 series
ceramic capacitors. 20
0
High Vibration Environments
CHANGE IN VALUE (%)
–20
Voltage and temperature coefficients are not the only
sources of problems. Some ceramic capacitors have a –40
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress upon –60
three distinct piezoelectric noise generators: ceramic GRM SERIES, 0805, 1.45mm THICK
output, input, and SET pin capacitors. However, due to GRM SERIES, 1206, 1.8mm THICK
GRM SERIES, 1210, 2.2mm THICK
LT3045’s very low output impedance over a wide fre- GJ8 SERIES, 1206, 1.9mm THICK
quency range, negligible output noise is generated using Figure 6. Capacitor Voltage Coefficient for Different Case Sizes
Rev. C
The LT3045 offers many advantages with respect to noise Using a SET pin bypass capacitor also soft-starts the output
performance. Traditional linear regulators have several and limits inrush current. The RC time constant, formed
sources of noise. The most critical noise sources for a by the SET pin resistor and capacitor, controls soft-start
traditional regulator are its voltage reference, error amplifier, time. Ramp-up rate from 0 to 90% of nominal VOUT is:
noise from the resistor divider network used for setting tSS ≈ 2.3 • RSET • CSET (Fast Start-Up Disabled)
output voltage and the noise gain created by this resistor
divider. Many low noise regulators pin out their voltage Fast Start-Up
reference to allow for noise reduction by bypassing the For ultralow noise applications that require low 1/f noise
reference voltage. (i.e. at frequencies below 100Hz), a larger value SET pin
Unlike most linear regulators, the LT3045 does not use a capacitor is required, up to 22µF. While this would normally
voltage reference; instead, it uses a 100µA current refer- significantly increase the regulator’s start-up time, the
ence. The current reference operates with typical noise LT3045 incorporates fast start-up circuitry that increases
current level of 20pA/√Hz (6nARMS over a 10Hz to 100kHz the SET pin current to about 2mA during start-up.
bandwidth). The resultant voltage noise equals the current As shown in the Block Diagram, the 2mA current source
noise multiplied by the resistor value, which in turn is RMS remains engaged while PGFB is below 300mV, unless the
summed with the error amplifier’s noise and the resistor’s
Rev. C
If the PGFB pin increases above 300mV, the open-collector Output Overshoot Recovery
PG pin de-asserts and becomes high impedance. The
During a load step from full load to no load (or light
power good comparator has 7mV hysteresis and 5µs of
load), the output voltage overshoots before the regulator
deglitching. The PGFB pin current (IPGFB) from the Electrical
responds to turn the power transistor OFF. Given that there
Characteristics table must be considered when determining
is no load (or very light load) present at the output, it takes
the resistor divider network. The PGFB pin current (IPGFB)
a long time to discharge the output capacitor.
can be ignored if RPG1 is less than 30k. If power good
functionality is not used, float the PG pin. Please note that As illustrated in the Block Diagram, the LT3045 incorporates
programmable power good and fast start-up capabilities an overshoot recovery circuitry that turns on a current
are disabled for output voltages below 300mV. sink to discharge the output capacitor in the event OUTS
is higher than SET. This current is typically about 4mA.
The power good functionality is disabled in shutdown,
No load recovery is disabled for input voltages less than
i.e. when EN/UV is set to 0V. If power good functionality
2.5V or output voltages less than 1.5V.
Rev. C
2 27.1 13.6
16.5k 0.47µF Trace resistance is measured in mΩ/in.
The small worst-case offset of 2mV for each paralleled
Figure 7. Parallel Devices LT3045 minimizes the required ballast resistor value.
Figure 7 illustrates that two LT3045s, each using a 20mΩ
PCB trace ballast resistor, provide better than 20% accurate
output current sharing at full load. The two 20mΩ external
resistors only add 10mV of output regulation drop with a
1A maximum current. With a 3.3V output, this only adds
0.3% to the regulation accuracy. As has been discussed
previously, tie the OUTS pin directly to the output capacitor.
More than two LT3045s can also be paralleled for even
higher output current and lower output noise. Paralleling
multiple LT3045s is also useful for distributing heat on the
PCB. For applications with high input-to-output voltage
differential, an input series resistor or resistor in parallel
with the LT3045 can also be used to spread heat.
Rev. C
for E- and I-grades and 150°C for H- and MP-Grades). It 100mm2 2500mm2 2500mm2 36°C/W
is important to consider all sources of thermal resistance *Device is mounted on topside
from junction to ambient. This includes junction-to-case, Table 4. Measured Thermal Resistance for MSOP Package
case-to-heat sink interface, heat sink resistance or circuit COPPER AREA THERMAL
board-to-ambient as the application dictates. Additionally, TOP SIDE* BOTTOM SIDE BOARD AREA RESISTANCE
consider all heat sources in close proximity to the LT3045. 2500mm2 2500mm2 2500mm2 33°C/W
1000mm2 2500mm2 2500mm2 33°C/W
The undersides of the DFN and MSOP packages have
225mm2 2500mm2 2500mm2 34°C/W
exposed metal from the lead frame to the die attachment.
100mm2 2500mm2 2500mm2 35°C/W
Both packages allow heat to directly transfer from the die
*Device is mounted on topside
junction to the PCB metal to limit maximum operating
junction temperature. The dual-in-line pin arrangement Calculating Junction Temperature
allows metal to extend beyond the ends of the package
on the topside (component side) of the PCB. Example: Given an output voltage of 3.3V and input voltage
of 5V ± 5%, output current range from 1mA to 500mA,
For surface mount devices, heat sinking is accomplished and a maximum ambient temperature of 85°C, what is the
by using the heat spreading capabilities of the PCB and its maximum junction temperature?
copper traces. Copper board stiffeners and plated through-
holes can also be used to spread the heat generated by The LT3045’s power dissipation is:
the regulator. IOUT(MAX) • (VIN(MAX) – VOUT) + IGND • VIN(MAX)
Table 3 and Table 4 list thermal resistance as a function where:
of copper area on a fixed board size. All measurements
were taken in still air on a 4 layer FR-4 board with 1oz IOUT(MAX) = 500mA
solid internal planes and 2oz top/bottom planes with a total VIN(MAX) = 5.25V
board thickness of 1.6mm. The four layers were electrically
IGND (at IOUT = 500mA and VIN = 5.25V) = 12.5mA
isolated with no thermal vias present. PCB layers, copper
weight, board layout and thermal vias affect the resultant thus:
thermal resistance. For more information on thermal PDISS = 0.5A • (5.25V – 3.3V) + 12.5mA • 5.25V = 1W
resistance and high thermal conductivity test boards,
refer to JEDEC standard JESD51, notably JESD51-7 and Using a DFN package, the thermal resistance is in the
JESD51-12. Achieving low thermal resistance necessitates range of 34°C/W to 36°C/W depending on the copper area.
attention to detail and careful PCB layout. Therefore, the junction temperature rise above ambient
approximately equals:
1W • 35°C/W = 35°C
The maximum junction temperature equals the maxi-
mum ambient temperature plus the maximum junction
temperature rise above ambient:
TJMAX = 85°C + 35°C = 120°C
Rev. C
Rev. C
LT3045
VIN IN
12V ±5%
4.7µF 100µA
EN/UV –
200k + VOUT
OUT 3.3V
PG IOUT
OUTS 200mA
10µF
SET GND ILIM PGFB
453k
750Ω
4.7µF 33.2k 49.9k
3045 TA02
Low Noise CC/CV Lab Power Supply Ultralow Noise Current Source for RF Biasing Applications
IN LT3045 LT3045
VIN IN
VIN
1.8V to 20V
4.7µF 100µA 100µA
4.7µF ROUT = R1 + RLOAD
EN/UV
–
EN/UV
+ R1
VOUT(MAX): 15V
PGFB I : 200mA
OUT 1Ω OUT
OUT PGFB
VOUT
PG OUTS
OUTS
PG 10µF
SET GND ILIM 10µF SET GND ILIM
RLOAD
RIOUT 4.7µF
0.47µF RSET
3045 TA03 RSET
2k
3045 TA04
Rev. C
VIN IN LT3045
4V Turn-ON
3.4V Turn-OFF
4.7µF 100µA
PGFB –
REN2 PG +
110k VOUT
⎛ 110k ⎞ OUT 3.3V
VIN(UVLO)RISING =1.24V • ⎜1+ ⎟ IOUT(MAX)
⎝ 49.9k ⎠
EN/UV OUTS 500mA
REN1
49.9k SET GND ILIM 10µF
3045 TA05
0.47µF 33.2k
Ratiometric Tracking
IN LT3045
100µA
EN/UV
–
+
PGFB
OUT
VOUT
IN LT3045 PG 5V
VIN OUTS
5.5V TO 20V 10µF
SET GND ILIM
100µA
10µF
EN/UV 3045 TA06
0.1µF 16.9k
PGFB
OUT
VOUT
PG OUTS 3.3V
10µF MIN LOAD 200µA
SET GND ILIM
0.1µF 33.2k
Rev. C
VIN IN LT3045
6V ±5%
4.7µF 100µA
EN/UV
–
+
PGFB VOUT = 5V
OUT
IOUT(MAX)
1,2 6,7 PG 500mA
OUTS
LTC6655-5 SET GND ILIM 10µF
3,4,5
1k
3045 TA07
Paralleling Multiple Devices Using ILIM (Current Monitor) to Cancel Ballast Resistor Drop
EN/UV
– VOUT = 3.3V – EN/UV
IOUT(MAX) = 1A
+ +
PGFB PGFB
OUT OUT
PG 20mΩ 20mΩ PG
OUTS OUTS
SET GND ILIM 10µF 10µF ILIM GND SET
RILIM
287Ω
287Ω
3045 TA08
1µF 16.5k
Rev. C
IN LT3045 LT3045 IN
VIN
5V ±5%
22µF 100µA 100µA
EN/UV
– – EN/UV
+ +
200k PGFB
OUT OUT
PG 20mΩ 20mΩ PG
OUTS OUTS
SET ILIM GND PGFB 10µF 10µF ILIM GND SET
453k
0.8µVRMS
OUTPUT NOISE =
4
= 0.4µVRMS
IN LT3045 LT3045 IN
100µA 100µA
EN/UV
– – EN/UV
+ +
PGFB PGFB
OUT OUT
PG 20mΩ 20mΩ PG
OUTS OUTS
SET GND ILIM 10µF 10µF ILIM GND SET
4.7µF 8.25k
3045 TA09
Rev. C
EN/UV
– 5% 26dB 1000nVRMS 42.5nVRMS
+
200k
OUT VOUT: 3.3V AND IOUT(MAX): 500mA
PG
R1 R3
OUTS
VBRIDGE
SET GND ILIM PGFB 10µF 453k
+ –
R2 R4
4.7µF 33.2k 49.9k
3045 TA10
PGFB Disabled without Reverse Input Protection PGFB Disabled with Reverse Input Protection
IN LT3045 IN LT3045
VIN VIN
EN/UV
– EN/UV
–
+ +
PGFB 1N4148
OUT OUT
VOUT VOUT
PG PGFB
OUTS OUTS
SET GND ILIM 10µF PG SET GND ILIM 10µF
Rev. C
0.70 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
5 1
0.200 REF 0.75 ±0.05 0.25 ±0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Rev. C
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
2.845 ±0.102 (.112 ±.004)
(.112 ±.004) 0.889 ±0.127
(.035 ±.005) 1 6 0.35
REF
0.53 ±0.152
(.021 ±.006)
1 2 3 4 5 6
DETAIL “A” 1.10 0.86
0.18 (.043) (.034)
(.007) MAX REF
SEATING
PLANE 0.22 – 0.38 0.1016 ±0.0508
(.009 – .015) (.004 ±.002)
0.650
TYP MSOP (MSE12) 0213 REV G
NOTE: (.0256)
1. DIMENSIONS IN MILLIMETER/(INCH) BSC
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
Rev. C
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For more by
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 31
LT3045
TYPICAL APPLICATION
Parallel Devices
VIN IN LT3045
5V ±5%
10µF 100µA
EN/UV –
+ 20mΩ
OUT
PGFB
OUTS
VOUT
3.3V
IN LT3045 IOUT(MAX)
1A
100µA
EN/UV –
+ 20mΩ
OUT
PGFB OUTS
3045 TA13
16.5k 0.47µF
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LT1761 100mA, Low Noise LDO 300mV Dropout Voltage, Low Noise: 20µVRMS, VIN = 1.8V to 20V,
TSOT-23 Package
LT1763 500mA, Low Noise LDO 300mV Dropout Voltage, Low Noise: 20μVRMS, VIN = 1.8V to 20V,
4mm × 3mm DFN and SO-8 Packages
LT3042 200mA, Ultralow Noise and Ultrahigh PSRR LDO 0.8μVRMS Noise and 79dB PSRR at 1MHz, VIN = 1.8V to 20V, 350mV
Dropout Voltage, Programmable Current Limit and Power Good,
3mm × 3mm DFN and MSOP Packages
LT3055 500mA LDO with Diagnostics and Precision Current Limit 340mV Dropout Voltage, Low Noise: 25μVRMS, VIN = 1.8V to 45V,
4mm × 3mm DFN and MSOP Packages
LT3065 500mA Low Noise LDO with Soft-Start 300mV Dropout Voltage, Low Noise: 25μVRMS, VIN = 1.8V to 45V,
3mm × 3mm DFN and MSOP Packages
LT3080 1.1A, Parallelable, Low Noise, Low Dropout Linear Regulator 300mV Dropout Voltage (2-Supply Operation), Low Noise: 40μVRMS,
VIN: 1.2V to 36V, VOUT: 0V to 35.7V, Current-Based Reference with
1-Resistor VOUT Set; Directly Parallelable (No Op Amp Required),
Stable with Ceramic Capacitors; TO-220, DD-Pak, SOT-223, MSOP
and 3mm × 3mm DFN-8 Packages; LT3080-1 Version Has Integrated
Internal Ballast Resistor
LT3085 500mA, Parallelable, Low Noise, Low Dropout Linear 275mV Dropout (2-Supply Operation), Low Noise: 40μVRMS, VIN: 1.2V
Regulator to 36V, VOUT: 0V to 35.7V, Current-Based Reference with 1-Resistor
VOUT Set, Directly Parallelable (No Op Amp Required), Stable with
Ceramic Capacitors; MS8E and 2mm × 3mm DFN-6 Packages
Rev. C
32
03/21
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