AN8090, AN8090S

Overvoltage Protective Circuits Built-in

Switching Power Supply AN8090 Unit : mm

1.22±0.25
0.5±0.1
■ Overview 1 16
2 15
The AN8090 and the AN8090S enables high-speed control
3 14
up to 500 kHz and have various protective functions for over-

19.2±0.3
4 13

2.54
current, overvoltage, and thermal protection in order to

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5 12
improve reliability of the power supply. 6 11
7 10
8 9
■ Features 6.2±0.3 1.1±0.25
• 500 kHz PWM control frequency and miniaturized

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5.2±0.25 3.05±0.25

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• Capable of directly driving the large-capacity MOS FET

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• Provided with 2-channel overcurrent protective function for + 0.1 5

dt
0.0
positive side and negative side, and intermittent operating 0.3 –

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3 to 15˚ 7.62±0.25

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function as protection when an over-current state advanced

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further

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• Provided with over-voltage protective and over-heat protec- 16-pin DIL Plastic Package (16-DIP (B)) (DIP016-P-0300D)

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tive functions

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AN8090S Unit : mm
• Provided with the ON/OFF function to start/stop operating

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(0.4)
the power supply with external signals and the error amlifier 1 20

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required for secondarry control 2 19
3 18

0.4±0.25
• 16-DIP package for the AN8090 and SONF-20D for the
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on rod
4 17

12.63±0.3
AN8090S 5 16

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6 15

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7 14

1.27
8 13
Di ain

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9 12

0.9±0.25
pla wi
10 11

0.1±0.1
e, ollo

2.05±0.2
typ s f
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0.9±0.25
0.05
0.2 +– 0.1
5.5±0.3
an clu

(0.4)
7.6±0.3
en in
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int ed

20-pin PANAFLAT Plastic Package (SONF-20D) (SOP020-P-0300A)

■ Block Diagram
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20 VCC 9
16 8 7
typ isc

10
7
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5 Remote I/V –
Start Int. Amp.
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8 + 2.5V
Ref Convert.
6 Latch Stop Output 1
en an

Cut OFF 1
int ten

Thermal DC CTL. Signal

2
Protection Triangular PWM
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Wave Osc. 2
12
Clock
10
M

+CLM 3
11 Clock Timer Latch 3
9 OSC VF Output Cut OFF
ed

– CLM
5 6 15 16 11 Duty Control Latch
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13 Meets to VF
4 19 18 17
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12 4 15 14 13
Fin 14 GND The number in square shape
is pin number of AN8090S
 ■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Rating Unit
Supply voltage VCC 35 V
Peak output current IO (peak) ±2 A
Maximum continuous output current IO (max.) ±0.15 A
Power dissipation PD 1.5 * W
Operationg ambient temperature Topr –30 to + 85 ˚C
AN8090 –55 to +150
Storage temperature Tstg ˚C
AN8090S –40 to +125

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= 25˚C when mounting onto the glass epoxy substrate (substrate size=5cm × 5cm × 0.45cm)
* For the AN8090S, Ta <

■ Recommended Operating Range (Ta=25˚C)

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Parameter Symbol Range

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Operating supply voltage range VCC Stop voltage to 34V

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■ Electrical Characteristics (Ta=25˚C)

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Parameter Symbol Condition min typ max Unit

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Operating voltage renge VCC 34 V

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Start voltage VCC (start) 15.2 16 17.2 V

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Stop voltage VCC (stop) 9 10 10.9 V

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Start/stop voltage difference DVCC DVCC=VCC (start) –VCC (stop) 5 6 7 V

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VCC=14.5V
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µA

on rod
50 80 120
Ta=25˚C
Prestart circuit current ICCL

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VCC=14.5V
AN8090
–30˚C < 40 80 160 µA
= Ta <
= 85˚C

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Circuit current ICCO VCC=30V 10 15 21 mA
Di ain

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ON/OFF pin H threshold voltage VTH ON/OFF 2.1 2.6 3.1 V

pla wi
ON/OFF pin L threshold voltage VTL ON/OFF 1.9 2.4 2.9 V
ON/OFF pin hysteresis voltage
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DVT ON/OFF 0.1 0.2 0.3 V
typ s f
R1=17kΩ, R2=22kΩ,
ce de

Oscillation frequency fosc 180 200 220 kHz

CF=220pF
an clu

R1=17kΩ, R2=22kΩ,
Duty ratio GDUTY 45 48 51 %
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M

CF=220pF
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Oscillation waveform upper limit voltage VOSCH 4 4.4 4.8 V

ma inu

Oscillation waveform lower limit voltage VOSCL 1.8 2 2.2 V

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Oscilation waveform upper/lower limit voltage difference DVOSC 2.1 2.4 2.7 V
typ isc

VOL1 VCC=18V, IO=10mA 0.05 0.4 V

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VOL2 VCC=18V, IO=100mA 0.7 1.4 V

Output low voltage
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VOL3 VCC=5V, IO=10mA 0.69 1 V

en an

VOL4 VCC=5V, IO=100mA 1.3 2 V

int ten

VOH1 VCC=18V, IO=–10mA 16 16.5 V

Output high voltage
ma ain

VOH2 VCC=18V, IO=–100mA 15.5 16 V

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Overheat protection operating temperature TTS 120 140 160 ˚C

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 ■ Pin Descriptions
Pin No.
Symbol Description
DIL SO
1 1 VC Pin to apply the supply voltage to the output transistor
2 2 VOUT IC output pin. Drives the MOS-FET or bipolar transistor.
3 3 VOUT-COM Output transistor ground pin
4 4 VF Detects the mean level of output pulses and provides output duty control and timer control.
5 7 ON/OFF Pin to turn on/off the IC. The IC stops at “H” (output= “L”) and starts at “L”.
6 8 OVP Detects an over-voltage and stops the IC ; the stop state is held.

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7 9 VIN Pin to feed back the output voltage of the power supply. It has internal gain.
8 10 IIN Pin to feed back the output voltage of the power supply.
9 11 TON Pin to connect the resistor which determines the tilting of the charge period of an internally oscillated triangular wave.
10 12 CF Pin to connect the capacitance which determines the frequency of an internally oscillated triangular wave.

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11 13 TOFF Pin to connect the resistor which determines the tilting of the discharge period of an internally oscillated triangular wave.

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12 14 CT Pin to connect the capacitance which determines a timer control frequency.

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13 17 GND Ground pin for the system.

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14 18 CLM– Overcurrent detection pin on the negative potential side.

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15 19 CLM +
Overcurrent detection pin on the positive potential side.

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16 20 VCC Pin to apply the supply voltage. Detects the start and stop voltage.

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5 FIN (GND) Pin directly connected to the IC chip. Joint use for discharge and GND.

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6 FIN (GND) Pin directly connected to the IC chip. Joint use for discharge and GND.

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15 FIN (GND) Pin directly connected to the IC chip. Joint use for discharge and GND.
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on rod
16 FIN (GND) Pin directly connected to the IC chip. Joint use for discharge and GND.

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■ Application Circuit
Di ain

ne ng
1) AN8090 flyback application

pla wi
e, ollo
typ s f
VIN
ce de

AC
an clu

VOUT
en in
M

1
OVP F/B VCC
int ed

2 16
ma inu

AN8090
e, ont

4 5
typ isc

3 7
ce /D

14 13 15 9 10 11 12 8 6
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 ■ Application Circuit (cont.)
2) AN8090 feed-forward application

AC VOUT1
VIN

A
VCC
2 1 16
VOUT2

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AN8090
4 5

3 7
14 13 15 9 10 11 12 8 6

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OVP

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F/B

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ON/OFF

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A

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■ Supplementary Descriptions

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• Characteristic Charts

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AN8090 PD – Ta AN8090S PD –Ta

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on rod
2000 2000
Mounting onto PCB : Material ··· G
1800 Thermal Resistance : 1800 Material ··· Glass Epoxy Substrate.

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θj–a=83.3˚C/W Size ··· 5 × 5 × 0.45mm,
Thermal Resistance
Power Dissipation PD (mW)

int ed Power Dissipation P (mW)

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1600 1600

1400 1400
Di ain

ne ng
D

1200 1200

pla wi
1000
e, ollo 1000
typ s f
800 800
ce de

600 600
an clu

400 400
en in
M

200 200

0 0
ma inu

0 20 40 60 80 100 120 140 0 20 40 60 80 100 120 140

Ambient Temperature Ta (˚C) Ambient Temperature Ta (˚C)
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typ isc
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int ten
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 ■ Supplementary Descriptions (cont.)
• Timing Charts
In Case of
Normal Operation

4.4V
Feedback Voltage
from VIN or IIN

OSC Oscillation 1.8V

Waveform

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PWM Output
Waveform
0V

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e)
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dt
Internal Clock

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Waveform

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0V

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VOUT Output

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Waveform

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0V

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In Case of Current Limiting
Di ain

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Operation (Note 1)

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Feedback Voltage
e, ollo 4.4V
typ s f
from VIN or IN
ce de
an clu

OSC Oscillation 1.8V

en in
M

Waveform
int ed

+0.2V
ma inu
e, ont

+ CLM Waveform
0V
typ isc
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0V
an ce

– CLM Waveform
en an

– 0.2V
int ten
ma ain

VCC
M

VOUT Output
Waveform
0V
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Note 1) The VF pin voltage should be higher than the TOFF (max.) control start voltage ( <
= 4V).
 ■ Supplementary Descriptions (cont.)
• Timing Charts (cont.)
In Case of TOFF (max.)
Note 2)
Control Operation

4.4V
Feedback Voltage
from VIN or IIN

OSC Oscillation 1.8V

Waveform

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4V

YF Pin Voltage TOFF (max.) Control Start

3V

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Timer Control Start

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Timer Pin Voltage

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0V

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VCC

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VOUT Output waveform

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0V

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In Case of Timer
Note 3)
Control Operation
Di ain

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4.4V

pla wi
OSC Oscillation e, ollo
OSC Start OSC Stop
typ s f
Waveform 1.8V
ce de

0V
an clu

Timer Control Start

en in
M

3V
int ed

YF Pin Voltage
ma inu

0V
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8V
typ isc

Timer Pin Voltage

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an ce
en an

1.5V
int ten

0V
VCC
ma ain

VOUT Output waveform

VOUT Start VOUT Stop
M

0V
ed

> 0.2V and CLM– =

Note 2) In case of current limiting operation (CLM+ = > – 0.2V), TOFF (max.) control and timer control work.
lan

Note 3) Even during timer control operation, the OFF period of OSC (VOUT) is controlled by TOFF (max.) control.
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semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
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Consult our sales staff in advance for information on the following applications:
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Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

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(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

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defect which may arise later in your equipment.

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Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

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mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

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or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

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thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
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Electric Industrial Co., Ltd.

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typ s f
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