74HC4040 74HCT4040: 1. General Description
74HC4040 74HCT4040: 1. General Description
1. General description
The 74HC4040; 74HCT4040 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4040B series. They are specied in compliance with JEDEC standard no. 7A. The 74HC4040; 74HCT4040 are 12-stage binary ripple counters with a clock input (CP), an overriding asynchronous master reset input (MR) and twelve parallel outputs (Q0 to Q11). The counter advances on the HIGH-to-LOW transition of CP. A HIGH on MR clears all counter stages and forces all outputs LOW, independent of the state of CP. Each counter stage is a static toggle ip-op.
2. Features
s Multiple package options s Complies with JEDEC standard no. 7A s ESD protection: x HBM JESD22-A114-C exceeds 2000 V x MM JESD22-A115-A exceeds 200 V s Specied from 40 C to +85 C and from 40 C to +125 C
3. Applications
s Frequency dividing circuits s Time delay circuits s Control counters
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 1: Quick reference data continued GND = 0 V; Tamb = 25 C; tr = tf = 6 ns. Symbol fmax Ci CPD Parameter maximum operating frequency input capacitance power dissipation capacitance propagation delay CP to Q0 Qn to Qn+1 fmax Ci CPD maximum operating frequency input capacitance power dissipation capacitance VI = GND to VCC 1.5 V CL = 15 pF; VCC = 5 V CL = 15 pF; VCC = 5 V CL = 15 pF; VCC = 5 V 16 8 79 3.5 20 ns ns MHz pF pF VI = GND to VCC Conditions CL = 15 pF; VCC = 5 V Min Typ 90 3.5 20 Max Unit MHz pF pF
[1]
CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL VCC2 fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.
5. Ordering information
Table 2: Ordering information Package Temperature range 74HC4040N 74HC4040D 74HC4040DB 74HC4040PW 74HC4040BQ 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C Name DIP16 SO16 SSOP16 TSSOP16 Description plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 3.9 mm Version SOT38-1 SOT109-1 Type number
plastic shrink small outline package; 16 leads; body SOT338-1 width 5.3 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
DHVQFN16 plastic dual in-line compatible thermal enhanced SOT763-1 very thin quad at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm DIP16 SO16 plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 3.9 mm SOT38-1 SOT109-1
74HCT4040N 74HCT4040D
40 C to +125 C 40 C to +125 C
74HC_HCT4040_3
2 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 2:
Ordering information continued Package Temperature range Name SSOP16 TSSOP16 Description Version plastic shrink small outline package; 16 leads; body SOT338-1 width 5.3 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1
Type number
DHVQFN16 plastic dual in-line compatible thermal enhanced SOT763-1 very thin quad at package; no leads; 16 terminals; body 2.5 3.5 0.85 mm
6. Functional diagram
CP MR
10 11
T 12-STAGE COUNTER CD 9 7 6 5 3 2 4 13 12 14 15 1
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 Q9 Q10 Q11
001aad589
10
CP
CT
11
MR
11
001aad585
001aad586
74HC_HCT4040_3
3 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
CP
FF T 1
FF T 2
FF T 3
FF T 4
FF T 5
FF T 6
Q RD MR RD
Q RD
Q RD
Q RD
Q RD
Q0
Q1
Q2
Q3
Q4
Q5
FF T 7
FF T 8
FF T 9
FF T 10
FF T 11
FF T 12
Q RD RD
Q RD
Q RD
Q RD
Q RD
Q6
Q7
Q8
Q9
Q10
Q11
001aad588
7. Pinning information
7.1 Pinning
terminal 1 index area Q11 Q5 Q4 Q6 Q3 Q2 Q1 GND 1 2 3 4 5 6 7 8
001aad583
16 VCC 15 Q10 14 Q9 13 Q7 12 Q8 11 MR 10 CP 9 Q0
Q5 Q4 Q6 Q3 Q2 Q1
2 3 4 5 6 7 8 GND Q0 9
16 VCC 15 Q10 14 Q9 13 Q7 12 Q8 11 MR 10 CP
4040
GND(1)
Q11
4040
001aad584
(1) The substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input
74HC_HCT4040_3
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Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
8. Functional description
8.1 Function table
Table 4: Input CP X
[1]
H = HIGH voltage level; L = LOW voltage level; X = dont care; = LOW-to-HIGH clock transition; = HIGH-to-LOW clock transition.
74HC_HCT4040_3
5 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
16
32
64
128
256
9. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot Parameter supply voltage input diode current output diode current output source or sink current quiescent supply current ground current storage temperature power dissipation DIP16 package SO16, SSOP16, TSSOP16 and DHVQFN16 packages
[1]
Conditions VI < 0.5 V or VI > VCC + 0.5 V VI < 0.5 V or VI > VCC + 0.5 V 0.5 V < VO < VCC + 0.5 V
Min 0.5 65
Unit V mA mA mA mA mA C mW mW
Tamb = 40 C to +125 C
[1]
For DIP16 packages: above 70 C, Ptot derates linearly with 12 mW/K. For SO16, SSOP16, TSSOP16 and DHVQFN16 packages, above 70 C, Ptot derates linearly with 8 mW/K.
74HC_HCT4040_3
6 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
type 74HC4040
74HC_HCT4040_3
7 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 7: Static characteristics for 74HC4040 continued Voltages are referenced to GND (ground = 0 V). Symbol VOL Parameter LOW-level output voltage Conditions VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V ILl ICC CI VIH input leakage current quiescent supply current input capacitance HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V; VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V ILl ICC input leakage current quiescent supply current VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V Tamb = 40 C to +125 C VIH HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 1.5 3.15 4.2 0.5 1.35 1.8 V V V V V V 0.1 0.1 0.1 0.33 0.33 1.0 80.0 V V V V V A A 1.9 4.4 5.9 3.84 5.34 V V V V V VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 1.5 3.15 4.2 3.5 0.5 1.35 1.8 pF V V V V V V Tamb = 40 C to +85 C 0 0 0 0.15 0.16 0.1 0.1 0.1 0.26 0.26 0.1 8.0 V V V V V A A Min Typ Max Unit
74HC_HCT4040_3
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Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 7: Static characteristics for 74HC4040 continued Voltages are referenced to GND (ground = 0 V). Symbol VOH Parameter HIGH-level output voltage Conditions VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V; VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V ILl ICC input leakage current quiescent supply current VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0.1 0.1 0.1 0.4 0.4 1.0 160.0 V V V V V A A 1.9 4.4 5.9 3.7 5.2 V V V V V Min Typ Max Unit
Table 8: Static characteristics for 74HCT4040 Voltages are referenced to GND (ground = 0 V). Symbol Tamb = 25 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V ILl ICC ICC input leakage current quiescent supply current additional quiescent supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V VI = VCC 2.1 V; VCC = 4.5 V to 5.5 V; IO = 0 A CP MR CI VIH VIL input capacitance HIGH-level input voltage LOW-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V Tamb = 40 C to +85 C 2.0 0.8 V V 85 110 3.5 306 396 A A pF 0 0.15 0.1 0.26 0.1 8.0 V V A A 4.4 3.98 4.5 4.32 V V 2.0 1.6 1.2 0.8 V V Parameter Conditions Min Typ Max Unit
74HC_HCT4040_3
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Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 8: Static characteristics for 74HCT4040 continued Voltages are referenced to GND (ground = 0 V). Symbol VOH Parameter HIGH-level output voltage Conditions VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V ILl ICC ICC input leakage current quiescent supply current additional quiescent supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V VI = VCC 2.1 V; VCC = 4.5 V to 5.5 V; IO = 0 A CP MR Tamb = 40 C to +125 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 4.5 V IO = 4.0 mA; VCC = 4.5 V ILl ICC ICC input leakage current quiescent supply current additional quiescent supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V VI = VCC 2.1 V; VCC = 4.5 V to 5.5 V; IO = 0 A CP MR 417 539 A A 0.1 0.4 1.0 160.0 V V A A 4.4 3.7 V V 2.0 0.8 V V 383 495 A A 0.1 0.33 1.0 80.0 V V A A 4.4 3.84 V V Min Typ Max Unit
74HC_HCT4040_3
10 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
74HC_HCT4040_3
11 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 9: Dynamic characteristics for type 74HC4040 continued GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol tPHL, tPLH Parameter propagation delay CP to Q0 Conditions see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF propagation delay Qn to Qn+1 see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF tPHL propagation delay MR to Qn see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF tTHL, tTLH output transition time see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF tW clock pulse width HIGH or LOW see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF master reset pulse width; HIGH see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF trec recovery time MR to CP see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF fmax maximum operating frequency see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF 4.8 24 28 MHz MHz MHz 65 13 11 ns ns ns 100 20 17 ns ns ns 100 20 17 ns ns ns 95 19 16 ns ns ns 230 46 39 ns ns ns 125 25 21 ns ns ns 190 38 33 ns ns ns Min Typ Max Unit Tamb = 40 C to +85 C
74HC_HCT4040_3
12 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 9: Dynamic characteristics for type 74HC4040 continued GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol tPHL, tPLH Parameter propagation delay CP to Q0 Conditions see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF propagation delay Qn to Qn+1 see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF tPHL propagation delay MR to Qn see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF tTHL, tTLH output transition time see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF tW clock pulse width HIGH or LOW see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF master reset pulse width; HIGH see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF trec recovery time MR to CP see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF fmax maximum operating frequency see Figure 8 VCC = 2.0 V; CL = 50 pF VCC = 4.5 V; CL = 50 pF VCC = 6.0 V; CL = 50 pF
[1] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL VCC2 fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.
Min
Typ
Max
Unit
Tamb = 40 C to +125 C 120 24 20 120 24 20 75 15 13 4.0 20 24 225 45 38 150 30 26 280 56 48 110 22 19 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz MHz MHz
74HC_HCT4040_3
13 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 10: Dynamic characteristics for type 74HCT4040 GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol Tamb = 25 C tPHL, tPLH propagation delay CP to Q0 see Figure 8 VCC = 4.5 V; CL = 50 pF VCC = 5.0 V; CL = 15 pF propagation delay Qn to Qn+1 see Figure 8 VCC = 4.5 V; CL = 50 pF VCC = 5.0 V; CL = 15 pF tPHL tTHL, tTLH tW propagation delay MR to Qn output transition time clock pulse width HIGH or LOW master reset pulse width; HIGH trec fmax recovery time MR to CP maximum operating frequency VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; see Figure 8 VCC = 4.5 V; CL = 50 pF VCC = 5.0 V; CL = 15 pF CPD power dissipation capacitance per package propagation delay CP to Q0 propagation delay Qn to Qn+1 tPHL tTHL, tTLH tW propagation delay MR to Qn output transition time clock pulse width HIGH or LOW master reset pulse width; HIGH trec fmax recovery time MR to CP maximum operating frequency VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8; VCC = 4.5 V; CL = 50 pF; see Figure 8
[1]
Parameter
Conditions
Min
Typ
Max
Unit
16 16 10
19 16 10 8 23 7 7 6 2
40 20 45 15 -
ns ns ns ns ns ns ns ns ns
30 -
72 79 20
MHz MHz pF
74HC_HCT4040_3
14 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
Table 10: Dynamic characteristics for type 74HCT4040 continued GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol tPHL tTHL, tTLH tW Parameter propagation delay MR to Qn output transition time clock pulse width HIGH or LOW master reset pulse width; HIGH trec fmax recovery time MR to CP maximum operating frequency Conditions VCC = 4.5 V; CL = 50 pF; see Figure 8 VCC = 4.5 V; CL = 50 pF; see Figure 8 VCC = 4.5 V; CL = 50 pF; see Figure 8 VCC = 4.5 V; CL = 50 pF; see Figure 8 VCC = 4.5 V; CL = 50 pF; see Figure 8 VCC = 4.5 V; CL = 50 pF; see Figure 8 Min 24 24 15 20 Typ Max 68 22 Unit ns ns ns ns ns MHz
[1]
CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL VCC2 fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.
13. Waveforms
VI MR input VM tW trem VI CP input tW VM 1/fmax
tPHL Q0 or Qn output
tPLH
tPHL VM
tTLH
tTHL
001aad590
Fig 8. Clock (CP) to output (Qn) propagation delays, clock pulse width, output transition times, maximum clock pulse frequency, master reset (MR) pulse width, master reset to output (Qn) propagation delays and master reset to clock (CP) removal time.
74HC_HCT4040_3
15 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
VO
Denitions for test circuit: CL = load capacitance including jig and probe capacitance (See Section 12 for the value). RT = termination resistance should be equal to output impedance ZO of the pulse generator.
74HC_HCT4040_3
16 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
D seating plane
ME
A2
A1
c Z e b1 b 16 9 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.02 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001 JEITA SC-503-16 EUROPEAN PROJECTION
17 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
SOT109-1
A X
c y HE v M A
Z 16 9
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
8 o 0
18 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A X
c y HE v M A
Z 16 9
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 o 0
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
19 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
c y HE v M A
16
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
20 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm
A A1 E c
detail X
e1 b 7 v M C A B w M C y1 C
C y
1 Eh 16
8 e 9
15 Dh
10 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 3.6 3.4 Dh 2.15 1.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 2.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT763-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
21 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors Reference to family specications is replaced by the actual information: Section 5 Ordering information, Section 7 Pinning information, Section 9 Limiting values, Section 10 Recommended operating conditions, Section 11 Static characteristics, Figure 9 Test circuit Section 14 Package outline (DHVQFN16) added Product specication -
74HC_HCT4040_CNV_2 19901231
74HC_HCT4040_3
22 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
III
Product data
Production
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.
19. Trademarks
Notice All referenced brands, product names, service names and trademarks are the property of their respective owners.
18. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
74HC_HCT4040_3
23 of 24
Philips Semiconductors
74HC4040; 74HCT4040
12-stage binary ripple counter
21. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 14 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 5 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions. . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Contact information . . . . . . . . . . . . . . . . . . . . 23