2018 FC Ani IJAMT pg717-719
2018 FC Ani IJAMT pg717-719
2018 FC Ani IJAMT pg717-719
https://doi.org/10.1007/s00170-018-1583-z
ORIGINAL ARTICLE
Received: 14 August 2017 / Accepted: 8 January 2018 / Published online: 29 January 2018
# Springer-Verlag London Ltd., part of Springer Nature 2018
Abstract
This paper presents the influence of Fe O nanoparticles on the microstructure and fillet height for the ultra-fine electronics
assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of
Fe O nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-
free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the
reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system
equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with
energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness,
and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01,
0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe O to 0.05 wt%
also improved the fillet height. The mechanism of the agglomeration of Fe O in the bulk solder is discussed in this study.
Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe
the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide
profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.
the HRTEM image analysis. The average particle size of the 2.2 Nano-reinforced lead-free solder joint
obtained nanoparticles was measured using an FEI Tecnai characterisations
G2 F20 high-resolution transmission electron microscope
(HRTEM). Figure 2 shows the HRTEM image of the The X-ray inspection system (Nikon XT V 160) was used to
Fe O nanoparticles having an average particle size of examine void formation in the ultra-fine solder joint. The study
10 nm which was near to the particle size specified by the of the Fe O nanoparticle-reinforced lead-free solder in the ultra-
supplier (< 30 nm). 96.5Sn –3.0Ag–0.5Cu solder paste has fine solder joint was conducted using an FEI Tecnai G2 F20
an average size of a particle of 15–25 μm (type 5, − 500/+ high-resolution transmission electron microscope (HRTEM)
635 mesh with the designation as per ASTM B214). The with an energy-dispersive x-ray spectroscopy (EDS). The gen-
01005 ultra-fine package was mounted on a 2.0 mm-thick eral mechanical technique used with the diamond blade on the
printed circuit board (PCB organic solderable preservative ultra-fine solder joint has the disadvantage of potentially dam-
surface finish) using the Fe O nanoparticles-reinforced aging the ultra-fine joint sample. Therefore, to avoid any such
lead-free solders (Fig. 3). By using an automated DEK damage from occurring, an advanced technique called the FEI
Horizon print machine, the Fe O nanoparticle-reinforced Helos NanoLab™ 650 Dual Beam system was used to prepare
lead-free solders were printed with a thickness of 0.127 mm the ultra-fine joint lamella for the HRTEM. Figure 6 illustrates
using a nano coat with 1:1 aperture—0.2 × 0.2 mm laser cut the cross-sectioning area. The system uses an ion beam to cut the
stainless steel stencil, spread with a steel squeegee. Next, sample to create thereby an HRTEM lamella sample consisting
using the automated Fuji NXT equipment with a customised of a high-resolution finely focussed electron (ion) beam (FIB).
nozzle, the 01005 ultra-fine package was mounted onto the The HRTEM lamella was then extracted from the bulk sample
Fe O nanoparticle-reinforced lead-free solder on the PCB. and molybdenum (Mo) grid finger used to attach the HRTEM
A full convection reflow oven (Vitronics Soltec XPM ) was lamella sample using the in situ lift-out technique employing an
used to execute the soldering process with a Pb-free reflow Omni-probe needle. The thickness of the sample was then re-
profile under a nitrogen-filled environment. Following the duced to attain electron transparency, being less than 100 nm.
reflow process, the PCBs were washed using aqueous The inspection of the solder fillet height in the ultra-fine
cleaning equipment (Electrovert® Aquastorm 200) to re- solder joint can affect the merging dependability of the ultra-
move any flux residue. Figure 4 illustrates the general pro- fine package (01005 capacitor). A scanning electron micros-
cess flow of an ultra-fine package assembly which is used in copy (SEM) was used to quantify the solder fillet height. The
a reflow oven to heat the mounted boards to a suitable tem- minimum fillet height should be more than the solder thick-
perature for a specified period to achieve the desired heating ness with 25% termination height [9]. The dimension of the
temperature (Fig. 5 and Tables 1 and 2). fillet height for the ultra-fine package (01005 capacitor)
Seconds